JP2018158583A - Method for manufacturing emblem made of thermoplastic synthetic resin incorporated with ic chip - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing apparatus capable of manufacturing an emblem made of a thermoplastic synthetic resin incorporated with an IC chip by use of high-frequency dielectric heating without damaging the IC chip.SOLUTION: An apparatus, according to the present invention, for manufacturing an emblem made of a thermoplastic synthetic resin incorporated with an IC chip by use of high frequency induction heating includes: an upper mold 11 having at least a melt-cutting blade; and a metal plate disposed below the upper mold. A material of the emblem formed by disposing an IC chip between an upper layer material and lower layer materials 9a, 9b and 9c is disposed between the upper mold and the metal plate. The upper mold and the metal plate are approached together and the upper layer material and the lower layer materials are welded by use of high frequency induction heating. The upper surface of the metal plate has a flat surface and a recess formed into a size for allowing the IC chip to come into contact. The recess is disposed with a cushion material.SELECTED DRAWING: Figure 12

Description

  The present invention is an emblem with an IC chip incorporated in uniforms of military, police, fire and other public offices, and uniforms of private companies. The present invention relates to an emblem manufacturing apparatus and method.

A method for producing decorative pieces such as emblems, appliques, stickers and the like using thermoplastic synthetic resin film as a raw material and high-frequency dielectric heating, and decorative pieces produced by the method include, for example, the following Patent Documents 1 and 2 3 is known.
For example, according to Patent Document 1, the decorative piece includes a lower layer (vinyl chloride film 11) and an upper layer made of a thermoplastic synthetic resin (polyester sheet 1). Examples of the upper layer material include a thermoplastic synthetic resin film or sheet. As the lower layer, any material such as woven fabric, knitted fabric, synthetic resin (vinyl chloride film 11 in Patent Document 1), synthetic leather, and the like can be used. An adhesive film can also be used as the lower layer.

Thus, in order to manufacture a decorative piece made of an upper layer and a lower layer made of a thermoplastic synthetic resin, it can be manufactured by high-frequency dielectric heating.
When a decorative piece is manufactured by high-frequency dielectric heating, a mold base (lower electrode 16 ′ in Patent Document 1) that is one electrode for high-frequency dielectric heating and a metal mold that is the other electrode for high-frequency dielectric heating (Patent Document 1). Then, the upper electrode 16) is used.
The engraving die has a fusing blade (blade portion 17 in Patent Document 1) and a pressing blade (projection portion 14 ′ in Patent Document 1). The fusing blade has a sharp edge along the outer contour line of the pattern to be molded, and cuts the thermoplastic synthetic resin film that is the material of the pattern piece. On the other hand, the blade edge of the pressing blade is located on a surface above the horizontal plane where the sharp blade edge exists, and is not as sharp as the sharp blade edge of the fusing blade, and forms a three-dimensional pattern on the thermoplastic synthetic resin film.

In production, if necessary, first, a pattern is printed on a thermoplastic synthetic resin film as an upper layer material. Then, a lower layer material is placed on the mold table, and a thermoplastic synthetic resin film as an upper layer material is placed thereon. Then, the thermoplastic synthetic resin film and the lower layer material are pressed from above the film as the upper layer material with a metal mold, and high frequency dielectric heating is performed. The upper layer material is melted, and a three-dimensional pattern is formed on the thermoplastic synthetic resin film by the engraving shape of the engraving die and the pressing blade. Further, the thermoplastic synthetic resin film is melted by the fusing blade, and the outer contour line of the pattern piece is formed.
Further, since the thermoplastic synthetic resin film is melted by performing high frequency dielectric heating, a decorative piece in which the upper layer and the lower layer are integrated is formed. Then, an unnecessary part is removed and a decoration piece is completed.
In addition, when the decorative piece to be manufactured is a thermal adhesive film type decorative piece (the lower layer is made of a material having thermal adhesiveness and can be thermally bonded to an object such as clothes by an iron) A release paper may be disposed on the lower surface of the molded lower layer, and a transparent carrier film may be disposed on the upper surface of the pattern piece. Further, when the lower layer material is a fabric or the like, the lower layer material may be cut by other known means instead of fusing by high frequency dielectric heating.
As described above, the thermoplastic synthetic resin emblem is manufactured in large quantities at a low cost by pressing from above and high frequency dielectric heating.

Japanese Examined Patent Publication No. 61-016608 Japanese Patent Publication No. 06-033040 Japanese Patent No. 2542551

As described above, the thermoplastic synthetic resin emblem can be mass-produced at a low cost, and if a soft resin film is used, a soft and lightweight product can be produced. Therefore, even if it is worn on the shirt pocket of a shirt or uniform, it does not hang down due to its weight, and when worn on the sleeve, it can respond to the movement of the arm due to its softness, and there is no sense of incongruity.
However, because of mass production, the shape, pattern, and color of the emblem are the same, and individual identification is not possible. In recent years, it has been demanded to make it possible to identify individuals by using decorative pieces such as these emblems.
For this reason, it is required to incorporate an IC chip into an emblem made of a thermoplastic synthetic resin and to input individual information into the IC chip to identify each individual person. Specifically, it is required to incorporate an IC chip between the upper layer (and the intermediate layer) and the lower layer.

  However, if an IC chip is to be assembled between the upper layer (and the intermediate layer) and the lower layer in the above-described method, there arises a problem that the IC chip is damaged by pressing the engraving die from above.

  Accordingly, an object of the present invention is to provide a manufacturing apparatus and a manufacturing method capable of manufacturing a thermoplastic synthetic resin emblem in which an IC chip is incorporated by high-frequency dielectric heating without damaging the IC chip. .

According to the present invention, an apparatus for producing an emblem made of a thermoplastic synthetic resin film, in which an IC chip is incorporated, by high-frequency dielectric heating,
An upper mold having at least a cutting blade;
Table,
A support frame disposed on the peripheral edge and upper surface of the table;
A slide board arranged on the upper surface of the table and slidable in the axial direction;
It consists of a metal plate arranged on the upper surface of the slide board,
A solid lubricant is disposed on the upper surface of the table,
The support frame comprises a long side support frame disposed along the long side of the table, and a short side support frame disposed along the short side of the table,
A step is formed on the lower surface of the long side support frame, on the center side in the width direction,
A step portion is formed on the upper surface and the end portion in the width direction of the slide plate, and the slide plate can slide in the axial direction with respect to the table by the step portion and the step portion of the long side support frame. And
On the upper surface of the metal plate, there is provided a flat surface and a recess formed in a size with which the IC chip is brought into contact, and a cushion material is disposed in the recess,
When shaping the upper layer material by high frequency dielectric heating the upper layer material, place the upper layer material on the flat surface of the metal plate,
When the lower layer material and the IC chip disposed on the upper surface of the lower layer material and the upper layer material are subjected to high-frequency dielectric heating to weld the upper layer material and the lower layer material, the IC chip is disposed at the upper position of the recess. The sliding board is slid in the axial direction, placed under the upper mold and subjected to high frequency dielectric heating, and the IC chip is not subjected to pressing force by the recess and the cushion material.
An apparatus for manufacturing a thermoplastic synthetic resin emblem incorporating an IC chip by high frequency dielectric heating is provided.

Further, according to the present invention, the release paper and the upper layer material are arranged on the upper surface of the release paper on the flat surface which is the upper surface of the cathode table,
From above, press the upper layer material with the upper mold, perform high-frequency dielectric heating, shape the upper layer material to make an intermediate,
Temporarily fix the intermediate body to the upper mold, pull up the upper mold, and also lift the intermediate body,
Move the slide plate arranged on the table in the axial direction, move the recess provided on the upper surface of the metal plate arranged on the slide plate to just below the upper mold,
A release paper, a lower layer material, and an IC chip are placed on the recess,
The upper die is lowered, the intermediate body, the IC chip, and the lower layer material are pressed, high frequency dielectric heating is performed, the intermediate body and the lower layer material are welded, and the IC chip is incorporated. A method of manufacturing an emblem is provided.
Preferably, a release paper is disposed on the lower surface of the upper layer material. Preferably, a carrier film is disposed on the upper surface of the upper layer material, and a polypropylene film is disposed on the upper surface of the carrier film.

  According to the apparatus of the present invention, when the upper layer material and the lower layer material are welded, the IC chip is present in the recess, so that it is not subjected to the pressing force by the upper mold, Since the pressing force is absorbed, the IC chip can be prevented from being damaged by the pressing force.

According to the apparatus of the present invention, the upper layer material (and the intermediate layer) can be shaped only by moving the slide disk in the axial direction, and the upper layer material can be formed without damaging the IC chip due to the pressing force. The lower layer material can be welded.
According to the apparatus of the present invention, it is not necessary to use two types of tables, and an apparatus having a simple structure as described above is provided.

  According to the method of the present invention, when the upper layer material and the lower layer material are welded by high frequency dielectric heating, the IC chip is not subjected to the pressing force by the upper mold, and therefore the IC chip is not damaged.

It is a front view of the emblem manufactured with the manufacturing apparatus of this invention. FIG. 2 is an enlarged cross-sectional view of the emblem shown in FIG. 1 taken along the line A-A ′. It is a bottom view of the upper metal mold | die of the manufacturing apparatus of this invention. It is a top view of the jig | tool of the manufacturing apparatus of this invention, Comprising: The state in a 2nd process is shown. FIG. 5 is a side view of the jig shown in FIG. 4 in a state where each member is disassembled. FIG. 5 is a cross-sectional view taken along line B-B ′ in FIG. 4. It is a top view of a table. It is a top view of a slide board. It is a top view of a metal plate. It is a top view of the jig | tool of the manufacturing apparatus of this invention, Comprising: The state in a 1st process is shown. It is a longitudinal cross-sectional view in a 1st process. It is a longitudinal cross-sectional view in a 2nd process.

<Emblem>
The emblem 1 manufactured by the apparatus and the manufacturing method of the present invention includes an upper layer 2 and a lower layer 3 made of a thermoplastic synthetic resin, as shown in FIG. In the illustrated embodiment, a release paper 9 is attached to the lower surface of the lower layer 3.
As will be described later, the upper layer 2 is made of a surface layer material 4a and an intermediate layer material 5a, and the surface layer material 4a and the intermediate layer material 5a are welded to each other by high frequency dielectric heating to be integrated.
In the emblem 1 of the present invention, an IC chip 6 is provided between the upper layer 2 and the lower layer 3.

<Surface layer material>
As described above, the upper layer 2 is made of the surface layer material 4a and the intermediate layer material 5a.
The surface layer material 4a has a three-dimensional shape. Further, printing is performed on the upper surface as necessary.
As the surface layer material 4a, a thermoplastic synthetic resin film can be used, and a known material can be used as a synthetic resin decorative piece. For example, a polyvinyl chloride film, a polyurethane film, a polyester film, a polyolefin film, or the like can be used. The thermoplastic synthetic resin film may be a laminated film.
It is also possible to deposit a metal on a thermoplastic synthetic resin film by a known technique to form a metallic decorative piece, for example, a metal-deposited polyvinyl chloride film, a metal-deposited polyurethane film, a metal-deposited polyester film, A metal-deposited polyolefin film or the like can be used. As the metal, known materials can be used, and examples thereof include aluminum, chromium, silver, and tin.

A carrier film 7 may be further disposed on the upper surface of the surface layer 4, and a polypropylene film 8 may be further disposed on the upper surface of the carrier film 7.
The lower surface of the carrier film 7 has an adhesive function. Therefore, even when a plurality of pattern pieces arranged apart from each other form one pattern, the relative positions of the pattern pieces do not change.
As the carrier film 7, those known in this field can be used. The carrier film 7 is required to be transparent so that the pattern printed on the surface layer 4 can be seen. The thickness of the carrier film includes 30 to 60 microns, but the present invention is not limited to such thickness.
As the polypropylene film 8, any film known in this field can be used as long as it is a translucent or transparent film.
Even after the emblem is completed, the carrier film 7 and the polypropylene film 8 are basically attached until they are transferred to the clothes. When a plurality of figures and characters are processed with the carrier film 7 alone, the holding power is weak, and therefore, a positional shift or a part of the transfer may occur during transfer. Therefore, it is preferable to use the polypropylene film 8 as reinforcement of the carrier film 7. Further, since the polypropylene film 8 is not melted, the polypropylene film 8 is wound on the side surface of the emblem, and the polypropylene film 8 as the surface material reaches the lower layer, so that the side surface is finished cleanly. Further, when the carrier film 7 is used alone, the cutting blade portion is often cut off, so the polypropylene film 8 is used. Thereby, the cutting | disconnection of the material of a cutting blade part becomes good.

<Intermediate layer>
The intermediate layer material 5a is used to increase the thickness of the emblem, to prevent the formation of cavities in the emblem, and to prevent the emblem from being recessed. As the intermediate layer material 5a, a thermoplastic synthetic resin can be used, and examples thereof include a polyvinyl chloride sheet, a polyurethane sheet, and a polyolefin sheet. As described above, this is used when the emblem needs to be thick, and is not essential.
Such an intermediate layer 5 and the surface layer 4 are welded and integrated by high-frequency dielectric heating to form the “upper layer 2”.

<Lower layer>
The lower layer 3 is a layer for mounting the upper layer 2 on an object to be worn.
In the case of an emblem of a type that is attached to clothing by heating with an iron or the like, the lower layer 3 has an adhesive or adhesive function, but the lower layer 3 of the present invention has an adhesive or adhesive function. It is not limited.
The lower layer 3 is made of the lower layer material 3a. As the lower layer material 3a, a material known in this field can be used. In the following illustrated embodiment, a hot melt film 9a having an adhesive ability by heating and a thermoplastic synthetic resin film 9b disposed on the upper surface of the hot melt film 9a are used. Of course, only 9a is sufficient. It is also possible to use a fabric or the like as a lower layer material. Further, as shown in the illustrated embodiment, a release paper 9c may be disposed on the lower surface of the hot melt film 9a. Thus, the lower layer material 3a is appropriately selected depending on the performance required for the emblem to be manufactured.

<IC chip>
An IC chip 6 is disposed between the upper layer 2 and the lower layer 3.
Such an IC chip 6 is preliminarily input with an ID number, and the data is stored in a computer. Since the ID number is read by a reader and connected to a computer for authentication, individual data including photographs can be input to the computer, and counterfeiting can be prevented and management ability can be enhanced.
An example of the IC chip 6 is TFU-TL741B manufactured by Fujitsu Frontech Limited, but the present invention is not limited to this.

<Manufacturing equipment>
Next, an apparatus for manufacturing an emblem 1 made of a thermoplastic synthetic resin material and having an IC chip 6 mounted thereon by high-frequency dielectric heating will be described.
Such an apparatus includes an upper mold 11 that functions as an anode and a jig 21 that functions as a cathode.

The lower surface of the upper mold 11 is provided with a fusing blade and a pressing blade together with the three-dimensional shape of the emblem, and a known technology can be used. In addition, a press blade is provided as needed and is not essential.
In addition, the upper mold 11 is provided with temporary fixing means 13 for temporarily fixing the intermediate body 23 as will be described later. The temporary fixing means 13 may lift the intermediate body 23 formed by the surface layer material 4a and the intermediate layer material 5a together with the upper mold 11, for example, as shown in the illustrated embodiment, the upper mold 11 However, the temporary fixing means 13 of the present invention is not limited to this.
The position of the upper mold 11 is fixed, and a slide board 51 and a metal plate 61 on the table 31 described below are moved relative to the upper mold 11 in the axial direction. The “axial direction” means the long side direction of the table 31, and in FIG. The short side direction of the table 31 is hereinafter referred to as “width direction”.

First, a jig 21 that is movable relative to the upper mold 11 in the axial direction is created. In FIG. 4, “axial direction” means the left-right direction.
The jig 21 includes a table 31 functioning as a cathode, a support frame 41 disposed on the peripheral edge and the upper surface of the table 31, a slide plate 51 disposed on the upper surface of the table 31 and slidable in the axial direction, and a slide. The metal plate 61 is arranged on the upper surface of the board 51 and is slidable together with the slide board 51 and functions as a cathode.

The table 31 is a rectangular plate having a long side and a short side, and the upper surface and the lower surface are flat.
A solid lubricant 33 is disposed on the upper surface of the table 31 so that the slide board 51 can easily slide. The solid lubricant 33 may be disposed on the entire top surface of the table 11 or may be interspersed as in the illustrated embodiment. From the viewpoint of manufacturing cost, it is preferable to make them scattered.
The upper surface of the solid lubricant 33 may be flush with the upper surface of the table 31 as shown in the illustrated embodiment, or may slightly protrude from the upper surface of the table 31.
As the solid lubricant 33, a known one can be used as long as it is solid and has a lubricating function.

In the illustrated embodiment, the support frame 41 is disposed between the long side support frame 43 that covers the entire long side of the table 31 and the short side support frame 45 that covers the short side of the table 31. And more. The support frame 41 is disposed on the outer peripheral portion of the upper surface of the table 31 and is fixed to the upper surface of the table 31. In the illustrated embodiment, the support frame 41 is fixed to the upper surface of the table 31 with screws, but the present invention is not limited to fixing with screws.
On the lower surface of the long side support frame 43, the center side in the width direction is formed with a step portion 47 into which a guide portion of a slide disc described later can be inserted.
The short side support frame 45 is formed with a finger insertion portion 49 so that the slide board 51 can be easily moved in the axial direction as will be described later.

The slide board 51 is a rectangular plate-like body in which the axial length (long side length) is shorter than the axial length (long side length) of the table 31, and has a flat upper surface and a flat surface. The upper surface of the table 31 is slidable in the axial direction.
A step portion 53 protruding in the width direction is formed at the lower portion of the long side surface of the slide board 51. The step 53 is slidable in the axial direction by the step 47 of the long side support frame 43.
As described above, since the solid lubricant 33 is disposed on the upper surface of the table 31, the slide board 51 can easily slide in the axial direction. The slide board 51 is preferably made of metal, but is not limited to metal.
The ratio of the axial length F of the short side support frame inner surface located on the opposite side of the short side support frame inner surface to the axial length G of the slide disc is preferably 3 to 2. When the slide board 51 is moved to one side, the magnet 69 and the magnet 49 are stuck together and fixed. At that time, the center of the flat portion of the upper surface 63 of the metal plate 61 comes directly under the upper mold 11 and reversely. When the slide board 51 is slid, the center of the recess 65 comes directly under the planting mold 11. Therefore, the axial length G of the slide disc is two thirds of the axial length F with respect to the inner surface of the short side support frame located on the opposite side of the inner surface of the short side support frame.

The upper surface of the slide board 51 has the same axial length as the axial length of the slide board 51, and has a width direction length shorter by the width of the step portion 53 than the length of the slide board 51 in the width direction. A metal plate 61 is arranged.
The metal plate 61 has an upper surface 63 and a lower surface. The upper surface 63 of the metal plate is flat. A concave portion 65 is formed at a central portion of the upper surface 63 of the metal plate 61 in the width direction half so that the IC chip is not subjected to pressure, and the IC chip has a size to contact the concave portion 65. ing. That is, an IC chip is disposed on the upper surface of the recess 65. Thereby, the upper surface 63 of the metal plate 61 includes a flat portion (A portion) and a portion provided with a recess (B portion).
A cushion material 67 is disposed in the recess 65 to absorb the pressing force from above and prevent the pressing force from being applied to the IC chip. Further, the presence of the cushion material 67 prevents air from accumulating inside the emblem (between the upper layer and the lower layer).
Examples of the cushion material 67 include sponge or rubber, but the present invention is not limited to this, and any known material can be used as long as it can absorb the pressing force from above. .
A positioning magnet 69 is installed at the center of the metal plate 61 in the width direction. On the other hand, a positioning magnet 49 is arranged at a position of the short side support frame 45 corresponding to the positioning magnet 69. Thus, when the slide board 51 is slid in the axial direction, the position in the width direction is adjusted.

The jig 21 is configured as described above, and the slide plate 51 is slidable in the axial direction with respect to the metal plate 31, and a metal plate disposed on the slide plate 51. In the recess 65 provided on the upper surface of 61, a cushion material 67 exists, and the IC chip is prevented from being damaged without receiving pressure.
An insulating cloth (not shown) is mounted on the metal plate 61.

<Manufacturing method>
When manufacturing an emblem incorporating an IC chip using the manufacturing apparatus described above, first, the release paper 9 is placed on a portion (A block) where the upper surface of the metal plate 61 is flat, and the release paper 9 is released. If necessary, the intermediate layer material 5a is placed on the pattern paper, and the surface layer material 4a is placed on the intermediate layer material 5a. If necessary, the carrier film 7a may be placed on the surface layer material 4a, and the polypropylene film 8a may be placed on the carrier film 7a.
The reason for placing the release paper 9 is the first step (the step of forming the surface layer material 4a and the intermediate layer material 5a by high frequency dielectric heating and welding the surface layer material 4a and the intermediate layer material 5a). ), When the high frequency dielectric heating is performed, the material melted by the high frequency dielectric heating is prevented from sticking to the metal plate 61.
An upper mold 11 is located above these materials.

The upper mold is lowered, the material is pressed, a high frequency is transmitted, and a three-dimensional pattern is formed (first step). Further, when there is an intermediate layer material, the upper layer material and the intermediate layer material are welded to form the intermediate body 23. This three-dimensional pattern forming and welding are performed by a known technique.
In addition, since these materials are mounted on the part where the upper surface of the metal plate 61 is flat, the three-dimensional pattern is accurately shaped.
The formed intermediate body 23 (with the surface phase material and the intermediate layer material welded) is temporarily fixed to the upper mold 11 by the temporary fixing means 13.

Next, the upper mold is raised. As described above, since the upper mold is temporarily fixed by the temporary fixing means, the intermediate body 23 rises together with the upper mold.
Since the release paper is disposed on the lower surface of the intermediate body 23, even if the upper layer material and the intermediate layer material melt, the intermediate body 23 can be raised without adhering to the metal plate 61. .

  Next, the slide plate is slid in the axial direction, and the slide plate is moved so that the concave portion 65 at the center of the B block is directly below the upper mold. At this time, since the positioning magnets 69 and 49 are provided, the position in the left-right direction is not shifted.

Next, a lower layer material is placed on the metal plate 61.
The lower layer material can be selected as necessary. For example, if a heat-bonding emblem is used, first a release paper is placed, a hot melt film is placed thereon, and an IC chip (with an ID number recorded) is placed on the hot melt film. The temporarily fixed synthetic resin film is placed. As the lower layer material, those known in this field can be used. In the illustrated embodiment, first, a release paper 9c is placed on the upper surface of the metal plate 61, a hot melt film 9a is placed on the upper surface of the release paper 9c, and a thermoplastic synthetic resin is placed on the upper surface of the hot melt film 9a. The film 9b is placed.
The IC chip is placed so as to be positioned in the recess 65 of the metal plate 61 on the slide board 51.
For temporarily fixing the IC chip to the synthetic resin film, a known means such as a double-sided tape or an adhesive tape can be used.
Either the slide in the axial direction of the slide board 51 or the placement of the lower layer material on the slide board may be performed first.

  Only the release paper is peeled off from the intermediate body 23 temporarily fixed to the upper mold. FIG. 12 shows a state before the release paper is peeled off.

Next, the upper mold 11 is lowered to press the lower layer material (release paper 9c, hot melt film 9a, thermoplastic synthetic resin film 9b in the case of the illustrated embodiment) and the intermediate body 23, A high frequency is transmitted, the intermediate body 23 and the lower layer material are welded, and these are melted. And an unnecessary part is removed by a well-known technique, and an emblem is completed.
In this case, since the IC chip is located in the recess 45 and the cushion material 47 is disposed on the lower surface of the recess 45, the IC chip is not damaged even when pressed by the upper mold, and the IC chip is not damaged. Therefore, the three-dimensional shape formed on the surface of the emblem is not deformed.

Claims (2)

An upper mold having at least a cutting blade;
A metal plate disposed below the upper mold,
With
An emblem material in which an IC chip is disposed between an upper layer material and a lower layer material is disposed between the upper mold and the metal plate, and the upper mold and the metal plate are brought close to each other so that high frequency dielectric heating is performed. An apparatus for welding the upper layer material and the lower layer material,
On the upper surface of the metal plate, there is a flat surface and a recess formed in a size with which the IC chip comes into contact, and a cushion material is disposed in the recess.
It is characterized by
An apparatus for manufacturing thermoplastic synthetic resin emblems with integrated IC chips by high frequency dielectric heating. The metal plate is slidable in a direction parallel to the flat surface.
An apparatus for producing a thermoplastic synthetic resin emblem incorporating the IC chip according to claim 1 by high frequency dielectric heating.

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