JP2018155572A - Physical amount detection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a physical amount detection device capable of easily changing electrical arrangement of input/output terminals in production stage.SOLUTION: Disclosed physical amount detection device has an internal circuit including a detecting element driving circuit. The physical amount detection device is configured to have an electrical missing part 6d formed between a lead frame 6 and a drive circuit element 2. In the production stage, an intermediate member mold component 13 in which input/output arrangement can be changed is appropriately selected for each arrangement specification of the input/output terminal to connect the lead frame 6 and the electrical missing part 6d. With this, a desired input/output arrangement is obtained between the lead frame 6 or the drive circuit element 2 without changing the component.SELECTED DRAWING: Figure 1b

Description

  The present invention relates to a physical quantity detection device.

The physical quantity detection device enables measurement by electrically connecting functions such as power supply, provision of detection information, and reading / writing to the internal memory from the internal circuit to the input / output terminal. The components of the internal circuit are mounted on a metal lead frame, and the internal circuit and the lead frame are circuit packaged by sealing the entire periphery with a thermosetting resin. By adopting a circuit package mounting configuration without individually mounting, the structure of the physical quantity detection device can be simplified.
Such a technique is disclosed in Patent Document 1, for example.

JP 2013-120103 A

  When changing a part of the configuration in which the input / output terminals and the internal circuit are electrically connected to change the electrical arrangement of the input / output terminals of the physical quantity detection device, the drive circuit (integrated circuit) and the lead part Although the electrical connection configuration may be changed, when the electrical connection is crossed, the thickness when molding is increased by increasing the height of the electrical connection configuration, and the mold volume is increased. These problems may increase the size of the circuit package.

  In order to solve the above-described problems, the physical quantity detection device according to the present invention is electrically connected by an intermediate member mold component obtained by pre-molding a plurality of intermediate members in a circuit package.

  According to the present invention, in the circuit package production process of the physical quantity detection device, the input / output arrangement can be easily changed by selecting the intermediate member mold part. Further features related to the present invention will become apparent from the description of the present specification and the accompanying drawings. Further, problems, configurations, and effects other than those described above will be clarified by the following description of embodiments.

Configuration before mounting intermediate member mold component of circuit package according to embodiment 1 Circuit package according to embodiment 1 Sectional drawing of the circuit package based on Example 1 Intermediate member molded component according to Example 1 Completion state of intermediate member mold part according to embodiment 1 Intermediate member molded component according to Example 1 Completion state of intermediate member mold part according to embodiment 1 Circuit package according to embodiment 1 Circuit package according to embodiment 1 Diagram showing the configuration of a circuit package that has no intermediate part mold parts and the input / output arrangement has been changed Diagram showing the configuration of a circuit package that has no intermediate part mold parts and the input / output arrangement has been changed Cross-sectional view of the circuit package configuration with no intermediate part mold parts and a modified input / output arrangement Diagram showing the configuration of a circuit package that has no intermediate part mold parts and the input / output arrangement has been changed Diagram showing the configuration of a circuit package that has no intermediate part mold parts and the input / output arrangement has been changed Diagram showing the configuration of a circuit package that has no intermediate part mold parts and the input / output arrangement has been changed Diagram showing the configuration of a circuit package that has no intermediate part mold parts and the input / output arrangement has been changed Production process flow of circuit package of embodiment 1 Intermediate member molded component according to Example 2 Intermediate member molded component according to Example 2 Sectional drawing of the intermediate member mold component which concerns on Example 2. FIG. Intermediate member molded part according to Example 3 Intermediate member molded part according to Example 3 Intermediate member molded component according to Example 6 Intermediate member molded component according to Example 6 Circuit package according to embodiment 7 Enlarged view of the circuit package according to the seventh embodiment.

  Before describing this embodiment, problems in a configuration in which a semiconductor type sensor element is resin-sealed will be described with reference to FIGS. The drive circuit element 2 and the lead frame 6 are electrically connected to each other by a gold wire 8. The lead sealed by the input / output part 6 a of the physical quantity detection device, that is, the lead frame exposed part and the mold 9. Since each of the sealing parts of the frame 6 is continuous, the electrical arrangement is the same. When the arrangement of the input / output parts of the physical quantity detection device is changed in the production process, the drive circuit element 2 and the input / output parts A structure for changing the electrical arrangement between them is required.

  FIG. 5 is a diagram showing a configuration example of a circuit package without an intermediate member mold part, and FIG. 6A is a diagram showing an example in which the input / output arrangement specifications are changed by crossing the wires between the drive circuit element 2 and the leads, FIG. 6b shows a cross-sectional view thereof.

  In the case of the configuration in which the lead frames are continuous as shown in FIG. 5, it is necessary to change the configuration other than the lead frame in order to change the electrical arrangement. 6A, the gold wire 8 between the drive circuit element 2 and the lead frame 6 is electrically connected between the drive circuit element 2 and the input / output unit by crossing the electrical connection structure. The target array can be changed. However, in this case, when the electrical connection structures come into contact with each other, the circuit is short-circuited and loses its function. Therefore, as shown in FIG. 6B, it is necessary to provide a gap at the intersection 8A. As a result, the height of the object covered by the substrate increases, and the volume of the circuit package 1 increases.

  7 is a diagram showing a configuration in which a wire installation portion 6b is provided in the lead frame 6, FIG. 8 is a diagram showing a configuration in which an electrical missing portion 6c is provided in the lead frame 6, and FIG. 9 is a change in the electrode arrangement of the drive circuit FIG. 10 is a diagram showing a configuration in which the input / output arrangement specifications are changed, and FIG. 10 is a diagram showing a configuration in which the input / output arrangement specifications are changed by changing the lead frame.

  In order to change the electrical arrangement without intersecting the electrical connection structure, when the lead frame sides 6y and 6x are set to two orthogonal axes as shown in FIG. Thus, it is necessary to overlap at least two lead frames 6 on the 6x axis. However, in this case, the area of the entire lead frame 6 increases due to the structure in which the lead frame 6 overlaps on the 6x axis, and the target area covered by the thermosetting resin 9 increases, thereby increasing the volume of the circuit package 1. Resulting in. This is not between the drive circuit and the lead frame, but as shown in FIG. 8, an electrical missing portion 6c is provided in the lead frame 6, and the electrical connection structure between the leads by the wire 8b so that the electrical arrangement can be changed. Even if it is changed, the area of the circuit package 1 is increased because a lead support like the wire installation portion 6b is required. Further, when the drive circuit element 2 itself is changed as shown in FIG. 9 and a change part of the drive circuit is prepared like the drive circuit element 2a in which the electrical arrangement of the electrodes 3 is changed, the increase in size of the circuit package 1 is suppressed. However, a drive circuit is required for each input / output arrangement specification, which increases the production cost of the circuit package. As shown in FIG. 10, even when the electrical arrangement is changed by the intersection 6x, the type of the lead frame is required for each input / output arrangement specification, and the production cost of the circuit package increases.

  The mode for carrying out the invention described below (hereinafter referred to as examples) solves various problems that are desired as actual products, and various problems that the following examples solve. One of them is the contents described in the column of the problem to be solved by the invention described above, and one of the various effects produced by the following embodiments is the effect described in the column of the effect of the invention. . Various problems solved by the following embodiments, and various effects produced by the following embodiments will be described in the description of the following embodiments. Therefore, the problems and effects solved by the embodiments described in the following embodiments are also described in the contents other than the contents of the problem column to be solved by the invention and the effect column of the invention.

  In the following embodiments, the same reference numerals indicate the same configuration even when the figure numbers are different, and the same effects are achieved. For configurations that have already been described, only the reference numerals are attached to the drawings, and the description may be omitted.

[Example 1]
FIG. 1a is a diagram showing the configuration of a circuit package before mounting the intermediate member mold part 13 in the physical quantity detection device, and FIGS. 1b and 1c show the configuration of the circuit package in the physical quantity detection device according to the first embodiment of the present invention. FIG.

  As illustrated in FIGS. 1 a to 1 c, the circuit package 1 includes a lead frame 6 that is a metal substrate and a drive circuit element 2 mounted on the lead frame 6. The drive circuit element 2 and the lead frame 6 are electrically connected by a gold wire 8 respectively. The drive circuit element 2 is a semiconductor element and has a role of driving a sensor circuit that measures a physical quantity. The sensor circuit may be formed on the same semiconductor element as the drive circuit element 2 or may be formed on a separate semiconductor element. The circuit package 1 is configured by sealing the drive circuit element 2 and the lead frame 6 with a thermosetting resin 9 by molding. The circuit package 1 can employ a configuration in which the sensor element is also integrally sealed with resin so that the physical quantity detection unit of the sensor element is exposed.

  The lead frame 8 includes lead connecting portions 6C-1, 6C-2, 6C-3, and 6C-4 in the production process, connects the leads to each other, and has strength against deformation and vibration. These lead connecting portions are divided at step A-3 in the circuit package production process shown in FIG. Moreover, although the case where input / output is configured with four poles in the present embodiment is shown, it may be four poles or more, or two poles or three poles.

  As shown in the sectional view of FIG. 1 c, the drive circuit element 2 is bonded and fixed to the lead frame 6 with an adhesive 7. In the present embodiment, the sensor element for measuring the physical quantity is formed on the drive circuit, but may not be formed on the drive circuit. Further, the electronic components to be mounted may be mounted not only with the drive circuit but also with a resistor, a capacitor, or the like.

  An electrode 3 is formed on the drive circuit element 2. The electrode 3 is for power supply, GND, and output, and the electrode 3 and the lead frame 6 are connected by a gold wire 8. The drive circuit element 2 converts the signal detected by the control of the sensor element and the sensor element into a signal converted into a physical quantity. These physical quantity signals are taken in and taken out from the lead frame exposed portion 12 which is an input / output terminal protruding from the mold portion 9 from the drive circuit element 2 through the gold wire 8.

  In the present embodiment, the lead frame 6 is provided with an electrical missing portion 6d where the lead frame is not formed between the drive circuit element 2 and the lead frame exposed portion 6a. Then, by providing the missing member 6d with the intermediate member mold part 13 shown in FIGS. 2 and 3, the lead circuit exposed portion 6a is electrically connected to the drive circuit 2. Since the intermediate member mold part 13 is configured so that the electrical arrangement can be changed, the circuit package 1 can be arranged in an input / output unit by arbitrarily arranging the intermediate member mold part 13 mounted between the missing parts 6d. The array of can be changed.

  FIG. 2a is a diagram showing a configuration in which the electrical connection is not crossed in the intermediate member mold part, FIG. 2b is a diagram showing the completed state, and FIG. 3a is a diagram showing a configuration in which the electrical connection is crossed in the intermediate member mold part. FIG. 3b shows the completed state.

  As shown in FIGS. 2 a and 3 a, the intermediate member mold part 13 includes an intermediate lead frame 11, an electrical connection part 10, and a mold part 12. The intermediate lead frame has connection portions 11x-1, 11x-2, and 11x-3. The intermediate lead frame 11 includes an input / output terminal 6a side and a drive circuit element 2 side in terms of electrical circuits. In this embodiment, the input / output terminal 6a side and the drive circuit element 2 side are all divided, and the divided portions are connected by an electrical connection portion 10b (in this case, a wire).

  This connection itself is made the final required arrangement by crossing the wires so as to match the input / output terminal arrangement required for the circuit package 1. Note that even if not all are divided, the required arrangement pattern is limited, and if there are always terminals with the same arrangement position, the leads corresponding to the fixed terminals need not be divided. Also good.

  The part to be cut and the electrical connection part 10b are sealed by forming the mold part 12. The electrical connection portion 10b is made of, for example, a gold (Au) wire and is formed by a wire bonding process. The mold 12 is formed by, for example, a resin molding process. After the mold 12 is formed, the intermediate member mold part 13 is completed as shown in FIGS. 2b and 3b by separating the intermediate lead frame connecting portions 11x-1, 11x-2, and 11x-3.

  The arrangement specification on the input / output terminal side can be changed by changing the connection configuration of the electrical connection portion 10b, and the electrical connection portion 10A that does not cross each other as shown in FIG. 2a may be used, and at least one place as shown in FIG. The crossed electrical connection 10b may be used.

  A specified cross section of the circuit package of FIG. 8b is shown in FIG. 8c. In this embodiment, the intermediate member mold part 13 is fixed to the lead frame 6 with the conductive adhesive 7 and is electrically connected. However, if it can be fixed while being electrically connected, it may be connected by welding, But it may be press fit.

  As shown in FIG. 1a, the intermediate member mold part 13 is provided with an electrical missing portion 6d in the lead frame 6, and when there is no need to change in the production process, the intermediate member mold shown in FIG. When the component 13a is connected and needs to be changed, for example, the intermediate member mold component 13b intersecting the electrical connection portion shown in FIG. 7b may be selected and connected.

  FIG. 1 b shows a state in which the electrical missing portions 6 d of the lead frame 6 are connected by the intermediate member mold part 13. In this embodiment, the connection is made by the conductive adhesive 7A. The conductive adhesive may be, for example, silver paste, nickel paste, gold paste, palladium paste, or carbon paste.

  In the lead frame 6 in the vicinity of the electrical missing part 6d, the number of installation parts of the intermediate member mold parts shall be three or more in total composed of one or more places on the drive circuit element 2 side and one or more places on the lead exposed part side. Thus, the intermediate member mold part can be stably installed.

  In other words, it is not necessary to provide an installation location by the lead frame 6 in all the intermediate leads 11, and an uninstalled portion of the lead frame 6 is provided like the intermediate leads 11-B1, 11-C1, and 11-D1 in the intermediate member mold component 13. The intermediate lead 11-B1, 11-C1, 11-D1 is connected to the electrode 3 of the drive circuit element 2 by the wire 8 instead of the lead frame 6, so that the lead frame as shown in FIG. A part or all of the lead support portion 6b, which is required when the electrical missing portion 6d is provided in the inside 6, can be omitted, the increase in the area of the lead frame 6 is suppressed, and the drive circuit and the lead Since the electrical connection between the frames is not crossed, an increase in the target height covered by the thermosetting resin 9 can be suppressed. That is, it is possible to suppress an increase in the size of the circuit package accompanying the change in the electrical arrangement.

  In this embodiment, the circuit package 1 includes an intermediate member mold component 13 that is an intermediate member formed by sealing a part of a plurality of metal members with a resin. An intermediate member mold component 13 is provided between the input / output terminals of the circuit package 1 and the electrical path of the drive circuit, and the intermediate member mold component 13 is arranged so that the output on the drive circuit side is in an arbitrary arrangement. In this configuration, the order of the electrical signals can be changed at the location where the resin is sealed. That is, when the requirements of the pad arrangement of the driving circuit and the electric arrangement of the input / output terminals are different, the order of the electric signals can be easily changed by providing the intersecting portions. Moreover, after sealing the location where the electrical arrangement is changed with resin in advance, the location where the electrical arrangement is changed is protected when the circuit package is formed by sealing with a resin forming the circuit package. It becomes possible.

  As shown in FIG. 6a, when the drive circuit element 2 and the wire 8b electrically connecting the lead frame 6 are crossed, the wire loop height for crossing is added in addition to the thickness of the drive circuit element 2. For this reason, the thickness of the circuit package 1 increases.

  On the other hand, in the present embodiment, since the intermediate member mold part 13 is provided so as to bridge the electrical missing portion 6d of the lead frame 8, only the wire loop height and the thickness of the intermediate lead frame are sufficient. This is less than or approximately the same as the thickness of the drive circuit detection element 2 and the height of the normal wire loop, so even if the electrical arrangement is changed by crossing the wires, the thickness of the entire circuit package The influence on can be reduced.

  Therefore, according to the present embodiment, it is possible to freely arrange the input / output terminals while suppressing an increase in the size of the circuit package.

  The production process of the circuit package 1 is shown using FIG.

  The circuit package production process flow itself is composed of A-1 to A-4, and the intermediate member mold part is composed of B-1 to B-3.

  Step B-1 shows a process of producing the intermediate lead frame 11 shown in FIGS. 2a and 3a. The intermediate lead frame 11 is made by, for example, pressing.

  Step B-2 shows a production process for electrically connecting the missing portions of the intermediate lead frame 11 shown in FIGS. 2a and 3a. This electrical connection is constituted by, for example, gold wire bonding. By changing only the electrical connection in Step B-2, it is possible to manufacture the intermediate member mold part 13 having different electrical arrangement specifications without changing the intermediate lead frame 11.

  Step B-3 shows a production process in which the electrical connection portion of the intermediate lead frame shown in FIGS. The mold 12 is made of, for example, a thermosetting resin. In step b-3, the connected leads 11x-1, 11x-2, 11x-3 are separated from the frame 11, respectively, thereby completing the intermediate member mold part 13 as shown in FIGS. 2b and 3b.

  In step B-4, an appearance inspection and energization inspection of the completed intermediate member mold part are performed. In the resin molding step of step b-3, since a high temperature resin is injected into the mold at a high pressure, it is desirable to inspect whether there is an abnormality in the electrical connection portion.

  Step A-1 shows the process of producing the frame 6f shown in FIG. 1a. This frame 6f is made, for example, by pressing.

  In step A-2, the drive circuit element 2 is mounted on the frame 6f formed in step A-1. In step A-2, electrical wiring is performed between circuit parts, between circuit parts and leads, and between leads. In addition, the arrangement of the input / output terminals can be changed by mounting the intermediate member mold part selected in accordance with the arrangement specifications of the input / output terminals created in step b-3.

  Next, in step A-3, the resin is molded with a thermosetting resin by a resin molding process. This state is shown in FIG. 4a. In step A-3, the connected leads 6C-2, 6C-3, 6C-4 are separated from the frame frame 6f, respectively, and further, the leads 6C-1 are also separated, thereby completing the circuit package 13 shown in FIG. 4b. To do. A drive circuit element 2 on which a physical quantity detection element is mounted is mounted on the circuit package 13.

  In step A-4, the appearance inspection and operation inspection of the completed circuit package 12 are performed. In the resin molding process of Step A-3, the electric circuit made in Step A-2 is fixed in the mold and high temperature resin is injected into the mold at a high pressure. It is desirable to check for the occurrence.

  By fixing the mold location of the electrical connection portion 10b intersecting in the production process to the intermediate member mold part, it is possible to produce in another process, and the influence when the wire 8b is short-circuited by the resin flow is the intermediate lead premold part Only the defective product of the intermediate member mold part 13 can be discarded without discarding the drive circuit unit 3, the lead frame unit 6 and the like.

  Further, the input / output arrangement specification is changed by selecting the wire connection configuration of the intermediate member mold part, so that a new part can be added without changing any of the lead frame 6, the intermediate lead frame 11, and the drive circuit element 2. Production costs can be reduced.

[Example 2]
A second embodiment of the present invention will be described.

  What is characteristic in the present embodiment is that the electrical connection portion 10 is configured by wire bonding in the configuration of the intermediate member mold part 13. The same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  When the electrical connection portion 10 shown in FIGS. 2a and 3a is formed by wire bonding, the material may be gold (Au) wire, aluminum wire, or copper wire. The method may be wedge bonding or ball bonding. In the wire bonding process, a combination to be connected can be selected, and the input / output arrangement specifications of the circuit package can be easily changed.

  In this embodiment, the intermediate member is formed by connecting the metal members 11A2 to 11D2 on the drive circuit side and the metal members A1 to 11D2 on the input / output side by wire bonding 10a, and a part of the metal member on the drive circuit side, This is a configuration in which a part of the metal member on the entry output side and wire bonding are sealed and integrated with resin.

  In this embodiment, the electrical arrangement of the input / output terminals can be changed to the required electrical string by crossing the wire bonding.

[Example 3]
Next, Embodiment 3 of the present invention will be described with reference to FIGS. The description of the same configuration as in the first and second embodiments is omitted.

  What is characteristic in the present embodiment is that in the configuration of the intermediate member mold part 13, an electrical connection portion is configured by an intermediate lead frame.

  In the example shown in FIG. 12, the intermediate member mold part 13c is configured in the case where the lead frame is not provided with the electrical missing portion and the electrical arrangement specification is not changed. The intermediate lead part 14a, 14-B, 14-C, 14-D and an intermediate member mold part 13c having a pre-molded part 12 for fixing the intermediate leads to each other. Since it is the same as the component 13a and does not have an electrical connection structure for connecting the intermediate leads, the production process can be simplified.

  In the example shown in FIG. 13, an intermediate member mold part 13 d having intermediate leads 15 a and 15 -B having an electrical arrangement changing structure and including a mold 12 for fixing including other intermediate leads, FIG. 14 shows an intermediate lead 15-B having the electrical arrangement changing structure and a side view 15-B-1. The intermediate lead 15-B is deformed in the height direction due to the intersection, and the electrical arrangement can be changed without short-circuiting with respect to the adjacent intermediate lead. Similar to the intermediate member mold part 13c, since there is no electrical connection structure for connecting the intermediate leads, the production process can be simplified. In addition, compared with the structure 6x where the lead frame itself in the circuit package intersects and the case where the electrode of the drive circuit is changed, the scale of the changed parts can be limited to the electrical arrangement change target of the intermediate leads. It is possible to reduce the cost of the changed parts that occur every time the arrangement specification is changed. In this embodiment, there are two electrical arrangement changing structures, but any number of structures may be provided as long as there are two or more.

[Example 4]
Next, a fourth embodiment of the present invention will be described with reference to FIGS. 15a and 15b. The description of the same configuration as that of the above-described embodiment is omitted.

  What is characteristic in the present embodiment is that in the configuration of the intermediate member mold part 13, an electrical connection portion is partially configured by an intermediate lead frame, while an electrical missing portion is provided between the intermediate lead frames, The electrical arrangement can be partially selected by the connection structure.

  In the example shown in FIGS. 15a and 15b, intermediate leads 16a-1, 16a-2, 16B-1, and 16B-2 provided with an electrical missing portion, and intermediate leads 14-C that do not have an electrical missing portion, An intermediate mold member 13e including 14-D, an electrical connection structure 17 that electrically connects intermediate leads having an electrical missing portion, and a mold 12 that seals part or all of them is shown. In FIG. 15a, it is comprised with the electrical connection structure 17a when not changing an electrical arrangement | sequence specification, and it is comprised with the electrical connection structure 17b when changing an electrical arrangement | sequence specification in FIG. 15b. In this embodiment, it is not possible to cope with the electrical arrangement specifications in all combinations, but the electrical arrangement specifications can be changed with the minimum necessary combinations without providing unnecessary electrical missing portions. That is, by partially selecting and providing the electrical missing portion of the intermediate lead, it is possible to omit a part of the electrical connection portion in the electrical connection process. In this embodiment, there are two electrical missing portions. However, any number of electrical missing portions may be provided at two or more locations and not all the intermediate leads.

[Example 5]
Next, a fifth embodiment of the present invention will be described. The description of the same configuration as that of the above-described embodiment is omitted.

  FIG. 1c is a diagram for explaining a specific example of a structure for electrically connecting the intermediate member molded component according to the first embodiment to a lead frame. What is characteristic in this embodiment is that the adhesive 7A, which is a structure for connecting the intermediate member mold part 13 shown in FIG. The same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted. By using solder as a connecting means between the intermediate member mold component 13 and the lead frame 6, for example, when the lead frame or the intermediate lead has an Sn electrode, conduction is further stabilized. In addition, production costs can be reduced for conductive adhesives such as silver paste.

[Example 6]
Next, a fifth embodiment of the present invention will be described with reference to FIGS. 1c and 16a. The description of the same configuration as that of the above-described embodiment is omitted.

  What is characteristic in this embodiment is that the intermediate member mold part 13 shown in FIG. 1c is configured by the welded portion 18 as shown in FIG. It is. By fixing the intermediate lead part and the lead frame part of the intermediate member molded part by welding, they can be electrically connected. Further, unlike the component mounting process, three or more installation parts are not required, and for example, as shown in FIG. 16b, the connection part from two points on one side can be fixed, and the degree of freedom of connection can be increased.

[Example 7]
Next, a seventh embodiment of the present invention will be described. The description of the same configuration as that of the above-described embodiment is omitted.

  FIGS. 17a and 17b are diagrams illustrating a specific example in which the electrical connection structure 20 is configured so as not to intersect with the lead frame structure instead of the intermediate member mold component according to the first embodiment. The electrical connection structure 20 is configured by, for example, gold wire bonding. What is characteristic in this embodiment is that the electrical arrangement specification can be changed without providing an intermediate lead. In the lead frame component 6 shown in FIG. 17a, by configuring a plurality of lead frames 6g in the same direction as the arrangement direction of the input / output terminals, for example, once electrically connected from the drive circuit element 2 to the lead frame 6g, It can be connected to the input / output terminal side of the lead frame from another part of the continuous lead frame 6g. FIG. 17b is an enlarged view of the periphery 19 of the lead frame 6g, and shows a state in which the electrical arrangement is changed without crossing the electrical connection structure 20. FIG. In this embodiment, after the electrical connection structure 20 is configured, the connecting portions 6c-5 and 6c-6 of the lead frame 6g are cut in the same manner as the other connecting portions.

  The present invention can be applied to the measurement apparatus for measuring the physical quantity described above.

1 ... Circuit package (in production process)
DESCRIPTION OF SYMBOLS 2 ... Drive circuit element 3 ... Electrode on a drive circuit 6 ... Lead frame 6a ... Lead frame exposed part 6c-1 ... Lead frame cutting part 6c-2 ... Lead frame cutting part 6c-3 ... Lead frame cutting part 6c-4 ... Lead frame cutting portion 6d ... Electrical missing portion 6f ... Frame frame 6g ... Lead frame portion in the same direction as the input / output terminal arrangement direction 6x ... Lead frame side 6y ... Lead frame side 7 ... Adhesive 7A ... Conductive adhesive 8 ... Wire 9 ... Mold part 10 ... Wire 11 ... Intermediate lead frame 11a1 ... Intermediate lead with electrical missing part 11-B1 ... Intermediate lead with electrical missing part 11-C1 ... Intermediate lead with electrical missing part 11-D1 ... Intermediate lead 11a2 having an electrical missing portion 11a2 ... Intermediate lead having an electrical missing portion 11-B2 ... Intermediate lead having an electrical missing portion 1-C2: Intermediate lead with electrical missing part 11-D2: Intermediate lead with electrically missing part 11x-1 ... Intermediate lead frame cutting part 11x-2 ... Intermediate lead frame cutting part 11x-3 ... Intermediate lead frame cutting Part 12: Pre-molded part 13: Intermediate member molded part 13a: Intermediate member molded part without changing electrical arrangement 13b: Intermediate member molded part with changed electrical arrangement 13c: Intermediate member molded part without electrical connection structure 13d ... Intermediate member mold part 14a with no electrical connection structure and electrical arrangement changed 14a ... Intermediate lead 14B with no electrical missing part 14-B ... Intermediate lead 14C with no electrical missing part Intermediate lead 14-D... Intermediate lead 15a having no electrical missing portion 15a. Intermediate lead 1 having no electrical missing portion 1 5-B: Intermediate lead without electrical missing part 15-B-1: Side view of intermediate lead without electrical missing part 16A-1: Intermediate lead with electrical missing part 16B-1: Electrical missing Intermediate lead 16A-2 with intermediate portion 16B-2 with intermediate portion 17B-2 with intermediate portion 17a Electric connection structure that does not change the electrical arrangement 17b Electricity that changes the electric arrangement Connection structure 18 ... welded part 19 ... around the lead frame 6g part 20 ... electrical connection structure for changing the electrical arrangement without having a crossing part

Claims (7)

A drive circuit for driving a detection element for detecting a physical quantity of the fluid;
A lead frame on which the drive circuit is mounted, and a circuit package formed by sealing with a mold resin,
The lead frame includes input / output terminals partially exposed from the mold resin,
The circuit package includes an intermediate member formed by sealing a part of a plurality of metal members with a resin between the input / output terminals and the electrical path between the driving circuit and a resin.
The intermediate quantity member is a physical quantity detection device sealed with the mold resin.   The intermediate member connects the metal member on the drive circuit side and the metal member on the input / output side by wire bonding, and part of the metal member on the drive circuit side and one of the metal members on the input / output side. The physical quantity detection device according to claim 1, wherein the unit and the wire bonding are integrated by sealing with a resin.   The wire bonding connects the metal member on the drive circuit side and the metal member on the input / output side so that an arbitrary output arrangement in which the level of the input / output terminal is required is connected. Physical quantity detection device.   The physical quantity detection device according to claim 2, wherein the intermediate member also includes a metal member that is not divided by the input / output side and the drive circuit.   The intermediate member is changed by three-dimensionally crossing the metal members so that the level of the input / output terminals is required, and the three-dimensional crossing portion is sealed with the resin. The physical quantity detection device according to claim 1.   The physical quantity detection device according to claim 1, wherein the intermediate member is electrically connected to the lead frame by any one of solder, welding, and conductive adhesive. Forming an intermediate member that changes the electrical arrangement of the drive circuit side and the input / output terminal side so that the input / output terminals are in an arbitrary arrangement;
A manufacturing method of a physical quantity detection device comprising: a circuit package generation step of mounting the intermediate member and a drive circuit on a lead frame and sealing with a resin.

Images