JP2018149710A - Liquid discharge head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid discharge head capable of efficiently radiating heat from an element substrate to suppress overheat and capable of suppressing degradation of reliability in a joint of a support member and the element substrate.SOLUTION: In a liquid discharge head including a support member 1 and an element substrate 2 to be mutually joined to each other, a supply flow channel 9 opening on a composition surface 1a with the element substrate 2 for a liquid to be supplied to the substrate 2 is formed to the support member 1. Besides in the inside of the supply flow channel 9, a beam 10 extending from one internal surface of the flow channel 9 toward the other internal surface thereof is provided in a direction getting across the flow channel 9. The connection part 10a of the beam 10 with the internal surface of the flow channel 9 is located apart from the composition surface 1a of the support member 1 with the substrate 2 in a depth direction of the flow channel 9.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a liquid discharge head.

  An example of a liquid discharge head that discharges liquid for image recording or the like is disclosed in Patent Document 1. In this liquid discharge head, an element substrate is bonded onto a support member (first plate). The element substrate includes a discharge port forming member (discharge port plate), and the discharge port forming member is formed so that the discharge ports are arranged in a plurality of rows. In the element substrate, a plurality of foaming chambers (supply ports) communicating with the respective discharge ports are formed. An electrothermal conversion element is disposed in each foaming chamber. The support member is formed with a groove-like supply channel for supplying a liquid to each foaming chamber. When the liquid is supplied into the foam chamber of the element substrate through the supply channel of the support member and the electrothermal conversion element is driven to generate heat, the liquid in the foam chamber is heated and foamed, and is discharged as droplets by the foaming pressure. Discharge from the outlet to the outside.

  In such a liquid discharge head that uses thermal energy, if the liquid is continuously discharged at a high speed and a high frequency, the element substrate may become hot. Therefore, in the liquid ejection head described in Patent Document 1, a beam in a direction crossing the supply flow path (along the short side direction of the supply flow path) is provided in the supply flow path of the support member, and the heat of the element substrate is increased. The heat is transmitted to the beam, and further, heat is transmitted from the beam to the entire support member to dissipate to the outside. By radiating heat using the beams as described above, it is possible to continuously perform liquid discharge by thermal energy at a high speed and a high frequency while suppressing the temperature of the element substrate from exceeding the usable temperature. As a result, high density recording by liquid ejection is also possible.

JP 2011-79246

  As described above, according to the liquid discharge head described in Patent Document 1, it is possible to efficiently dissipate heat from the element substrate by providing the beam. However, there is a possibility that the reliability of bonding between the support member and the element substrate is lowered. In particular, when high-speed liquid discharge or continuous discharge is required, the amount of heat generated from the element substrate often increases, and it is necessary to improve the heat dissipation from the element substrate. In the configuration of Patent Document 1, when the number of beams is increased to further improve the heat dissipation effect, the amount of the adhesive that contributes to the bonding between the support member and the element substrate becomes insufficient at the time of manufacturing the liquid discharge head, Bonding reliability may be reduced.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a liquid discharge head that can efficiently dissipate heat from an element substrate to suppress overheating, and can suppress a decrease in reliability of bonding between a support member and the element substrate. is there.

  The present invention relates to a liquid discharge head including an element substrate and a support member that are bonded to each other, and the support member has a supply flow path for liquid supplied to the element substrate that is open at a bonding surface with the element substrate. A beam extending from one inner wall surface of the supply channel toward the other inner wall surface in a direction crossing the supply channel is provided inside the supply channel. The connecting portion with the inner wall surface of the path is located away from the joint surface of the support member with the element substrate in the depth direction of the supply flow path.

  According to the liquid discharge head of the present invention, it is possible to efficiently dissipate heat from the element substrate and suppress overheating, and it is possible to suppress a decrease in the reliability of bonding between the support member and the element substrate.

1 is a perspective view of a liquid discharge head according to a first embodiment of the present invention. FIG. 2 is an exploded perspective view of the liquid discharge head shown in FIG. 1. FIG. 2 is a cross-sectional view of the liquid discharge head shown in FIG. FIG. 2 is a plan view, a main part enlarged perspective view, and a cross-sectional view showing a first support member of the liquid discharge head shown in FIG. 1. FIG. 6 is an exploded perspective view of a liquid discharge head of a comparative example. FIG. 6 is a plan view and a main part enlarged perspective view showing a first support member of the liquid ejection head shown in FIG. 5. It is a top view which shows the favorable adhesive agent transfer process of the 1st supporting member shown in FIG. It is sectional drawing which shows the favorable adhesive agent transfer process of the 1st supporting member shown in FIG. It is a top view which shows the bad adhesive agent transfer process of the 1st supporting member shown in FIG. FIG. 7 is a cross-sectional view showing a defective adhesive transfer process of the first support member shown in FIG. 6. It is sectional drawing which shows the adhesive agent transfer process of the 1st supporting member shown in FIG. FIG. 10 is a plan view and a cross-sectional view illustrating a first support member of a liquid ejection head according to a second embodiment of the present invention.

DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the drawings.
[Basic configuration of liquid discharge head]
1-3 are a perspective view, an exploded perspective view, and a cross-sectional view of the liquid discharge head of the present invention. In this liquid ejection head, the element substrate 2 is bonded onto the support member (first support member 1), and another support member (second support member) is disposed outside the portion where the element substrate 2 is bonded. A support member 3) is affixed. An electric wiring member 4 is disposed on the second support member 3. As shown in FIG. 3, the element substrate 2 includes a substrate 5 bonded to the first support member 1 and a discharge port forming member 6 positioned on the opposite side of the bonding surface with the first support member 1. It is a laminated structure including. In the discharge port forming member 6, discharge ports 7 as through holes are formed side by side so as to form a plurality of rows. The substrate 5 is formed with a plurality of foaming chambers 8 communicating with the respective discharge ports 7. Each foaming chamber 8 constitutes a plurality of foaming chamber rows respectively corresponding to a plurality of discharge port rows. Each foaming chamber 8 is provided with an energy generating element (not shown) such as an electrothermal conversion element. The first support member 1 supports and fixes the element substrate 2 and the second support member 3, and has a groove-like supply channel 9 for liquid supplied to each foaming chamber 8 of the substrate 5. ing. On the first support member 1, the upper surface of the second support member 3 is substantially at the same height as the upper surface of the element substrate 2, and the electric wiring member 4 disposed on the second support member 3 is It is electrically connected to the element substrate 2. The element substrate 2 and the electrical wiring member 4 are insulated and protected by a sealing material (not shown), and this sealing material is held inside a sealing material reservoir formed by the opening of the second support member 3. Due to such a configuration, the liquid supplied from a tank or the like (not shown) is guided into the foaming chamber 8 of the element substrate 2 through the supply flow path 9 of the first support member 1. When a discharge signal from a control unit (not shown) is transmitted from the electric wiring member 4 to the element substrate 2 and the energy generating element is driven, energy such as heat is applied to the liquid in the foaming chamber 8 and droplets are formed. The ink is discharged from the discharge port 7 to the outside.

[First Embodiment]
The supply flow path 9 of the first support member 1 according to the first embodiment of the present invention is shown in FIGS. 4 (a) is a plan view of the first support member 1, FIG. 4 (b) is an enlarged perspective view of a portion B in FIG. 4 (a), and FIG. 4 (c) is AA in FIG. 4 (a). It is line sectional drawing. In the supply flow path 9 of the first support member 1, a horizontal beam 10 (first beam) that is a beam in a direction crossing the supply flow path 9 (along the short side direction of the supply flow path 9), and a supply flow A vertical beam 11 (second beam) which is a beam along the longitudinal direction of the path 9 (along the liquid flow direction) is provided. Cross beams 10 that cross the supply flow path 9 are formed at a plurality of positions (three positions in the example shown in FIG. 4A) in one supply flow path 9. A longitudinal beam 11 extending over the entire length of the supply channel 9 is provided along the center line of the short side of the supply channel 9.

4 (b) and 4 (c), the shape of the cross beam 10 along the direction crossing the supply flow path 9 (the short side direction of the supply flow path 9) is the same as that of the beam portion of Patent Document 1. It is substantially w-shaped. That is, both end portions 10a, which are connecting portions of the horizontal beam 10, to the inner wall surface of the supply flow path, and an intermediate portion 10b, which is a connection portion between one surface and the other surface of the vertical beam 11, are connected to the supply flow path 9. It is in a high position in the depth direction. When the height of the cross beam 10 is viewed along the direction crossing the supply flow path 9, it approaches again from one side end portion 10 a further away from the upper surface 1 a of the support member 1 in the depth direction of the supply flow path 9. To the intermediate portion (connecting portion with one surface of the vertical beam 11) 10b. Next, after further separating from the upper surface 1a of the support member 1 in the depth direction from the intermediate portion (connecting portion with the other surface of the vertical beam 11) 10b, it approaches again to the other side end portion (the other inner end portion). To the wall surface) 10a. In terms of the positional relationship shown in FIGS. 3 and 4 (c), the upper end of the lateral beam portion 10 once descends from the one side end portion 10a in the depth direction of the supply flow path 9 and then rises again to the intermediate portion 10b. After reaching the depth direction from the intermediate part 10b, it rises again and reaches the other side end. The horizontal beam 10 has a line-symmetric shape centered on the center line of the short side of the supply flow path 9. The descending and rising in the depth direction are not linear, and form a curved concave portion 10c as shown in FIGS. 4 (b) and 4 (c). One of the features of the cross beam 10 according to the present embodiment is that the side end portion 10a, that is, the connection portion with the inner wall surface of the supply flow path has an upper surface of the first support member 1 in the depth direction of the supply flow path 9. That is, it is in a position that is lowered (for example, by a distance Z1) from the joint surface 1a with the element substrate 2. The intermediate portion 10b, that is, the connection portion with the longitudinal beam 11 also descends from the upper surface of the first support member, that is, the joint surface 1a with the element substrate (for example, by a distance Z1) in the depth direction of the supply flow path 9. In the position. On the other hand, the shape along the longitudinal direction (liquid flow direction) of the supply flow path 9 at the upper part of the horizontal beam 10 is the substantially triangular shape in which the center is the highest and descends toward both sides, like the beam part of Patent Document 1. It is.
The cross beam 10 of the present embodiment is the first in the central portion in the longitudinal direction of the supply flow path 9 and both end portions 10a and the intermediate portion 10b in the short side direction, that is, the highest portion in the depth direction of the supply flow path 9. It is in a position away from the upper surface of the support member 1 (bonding surface 1a with the element substrate 2). In the positional relationship shown in FIGS. 3 and 4 (c), the highest portion in the depth direction of the supply flow path 9 is below the upper surface of the first support member 1 (the bonding surface 1a with the element substrate 2). To position.

  As shown in FIGS. 2 to 4, the longitudinal beam 11 of the present embodiment passes through the center of the short side of the supply channel 9 and extends along the longitudinal direction of the supply channel 9 over the entire length thereof. As shown in FIG. 4C, the upper surface of the vertical beam 11 is positioned at the same height as the upper surface of the first support member, that is, the joint surface 1a with the element substrate, and the lower surface of the vertical beam 11 is the supply channel 9. It is located near the center of the depth direction. That is, the vertical beam 11 is provided in a state of floating above the supply flow path 9 and is integrally supported with the horizontal beam 10 at the connection portion 10b (three locations in the illustrated example) with the horizontal beam 10. .

  The 1st supporting member 1 which has such a horizontal beam 10 and the vertical beam 11 is joined to the element substrate 2 shown in FIGS. Specifically, an adhesive is applied to the upper surface 1a of the first support member 1 and the upper surface 11a of the vertical beam 11 at the position where the element substrate 2 is placed, and the element substrate 2 is placed thereon. Fixed with adhesive. According to the present embodiment, the reliability of bonding between the first support member 1 and the element substrate 2 using such an adhesive is high. This will be described below.

[Comparison with comparative example]
In describing the technical significance of the first support member 1 and the element substrate 2 of the present embodiment, a comparative example will be described first.
FIG. 5 shows an exploded perspective view of a liquid discharge head of a comparative example for comparison with the present invention, FIG. 6A shows a plan view of the first support member 22, and FIG. 6B shows its C The enlarged perspective view of the part is shown. The first support member 22 has substantially the same configuration as the support member of Patent Document 1. In the first support member 22 of the present comparative example, the supply flow path 9 is traversed at a plurality of locations (two locations in the example shown in FIG. 6A) within one supply flow path 9 (shortness of the supply flow path 9). A transverse beam 20 (along the side direction) is formed. The cross beam 20 is similar to the cross beam 10 of the first embodiment of the present invention described above, and the shape along the direction crossing the supply flow path 9 is substantially w-shaped. When the height of the cross beam 20 is viewed along the direction crossing the supply flow path 9, it is once lowered in the depth direction of the supply flow path 9 from one side end 20a and then rises again to reach the intermediate portion 20b. It is a line-symmetrical shape that once descends from the portion 20b and then rises again to reach the other side end portion 20a. However, unlike the first embodiment, the side end in the short side direction (connecting portion 20a with the inner wall surface of the supply channel 9) and the intermediate portion (connecting portion 20b with the vertical beam) are provided in the supply channel 9. In the depth direction, the first support member 22 is located at the same height as the upper surface (joining surface 22a with the element substrate). Moreover, the center part of the short side direction of the supply flow path 9 of the horizontal beam 20 functions as the vertical beam 21 extended in a long side direction. However, this vertical beam 21 does not extend over the entire length of the supply channel 9 as in the vertical beam 11 of the first embodiment of the present invention, but instead of the horizontal beam 20 in the short side direction of the supply channel 9. It is the same length as the length, and each is an independent island.

  In the liquid discharge head of this comparative example, when an electrothermal conversion element (not shown) is driven to generate heat, it is transmitted from the vertical beam 21 in contact with the element substrate 22 to the horizontal beam 20. This heat is further transferred from the cross beam 20 to the entire first support member 22 having a large surface area and dissipated. As a result, even if liquid discharge by thermal energy is continuously performed at high speed and high frequency, the temperature of the element substrate can be prevented from exceeding the usable temperature, and high density recording by liquid discharge is possible. However, in this configuration, there is a possibility that the reliability of bonding between the first support member 22 and the element substrate 2 is lowered. The reason will be described. When the element substrate 2 is bonded onto the first support member 22, an adhesive is applied to the upper surface of the first support member 22 and the upper surface of the vertical beam 21 at the position where the element substrate is placed. The element substrate is placed thereon and fixed by the adhesive 12. In FIG. 7, the position where the adhesive 12 is applied is indicated by hatching. In the example shown in FIGS. 8A to 8C, the transfer pin 25 having the adhesive 12 applied to the tip is pressed against the upper surface of the first support member 22 including the vertical beam 21, whereby the adhesive is used. 12 is transferred from the transfer pin 25 to the upper surface 22 a of the first support member 22 including the vertical beam 21. If the positional relationship between the transfer pin 25 and the first support member 22 in the short side direction of the supply flow path 9 is appropriate, as shown in FIG. 8C, the upper surface of the first support member 22 as intended. The adhesive 12 is transferred to 22a.

However, as shown in FIGS. 9 and 10, when a relative positional shift (for example, a shift amount Y1) in the short side direction of the supply flow path 9 occurs between the transfer pin 25 and the first support member 22, the transfer is performed. A part of the tip of the pin 25 is detached from the vertical beam 21 and the upper surface 22 a of the first support member 22. A portion of the tip of the transfer pin 25 that is out of the vertical beam 21 or the upper surface 22a of the first support member 22 is a curved concave shape between the side end 20a and the intermediate portion 20b of the horizontal beam 20. It faces the portion 20c. This state is schematically shown in FIGS. 9 and 10 (a) to 10 (b). In FIG. 9, the planar position of the adhesive 12 attached to the tip of the transfer pin 25 is indicated by hatching. In this way, a part of the adhesive 12 adhering to the tip of the transfer pin 25 is not transferred because it does not contact the upper surface of the vertical beam 21 or the first support member 22, and the curved concave shape of the horizontal beam 20. It is located on the part 20c. At that time, a meniscus of the adhesive 12 is generated between the tip of the transfer pin 25 and the concave portion 20c of the cross beam 20, and the adhesive 12 is caused to move into the concave portion 20c of the cross beam 20 by the action (surface tension) of the meniscus. There is a risk of being drawn into. In FIG.10 (c), the state in which the adhesive agent 12 is drawn in in a recessed part is typically shown with the arrow. As a result, the amount of the adhesive 12 transferred to the upper surfaces of the vertical beam 21 and the first support member 22 is insufficient, and an amount of the adhesive 12 necessary for bonding the element substrate and the first support member 22 is obtained. There is a risk that the reliability of the bonding is lowered.
In particular, in order to increase the heat dissipation effect, the length of the vertical beam 21 is increased so as to increase the contact area of the vertical beam 21 with the element substrate, or the number of the vertical beam 21 and the horizontal beam 20 is increased. For example, when three or more vertical beams 21 and horizontal beams 20 are provided in one flow path, it becomes remarkable. This is because the amount of the adhesive 12 drawn into the concave portion 20c of the cross beam 20 increases as the meniscus generation location of the adhesive 12 expands or increases.

  On the other hand, in the first embodiment of the present invention, the connecting portions 10a and 10b of the horizontal beam 10 to the inner wall surface of the supply flow path 9 and the vertical beam 11 are joined surfaces 1a to the element substrate 2, that is, an adhesive. 12 is located at a position away from the surface on which 12 is transferred in the depth direction (for example, by a distance Z1). The tip of the transfer pin 25 that is in contact with the vertical beam 11 or the upper surface 1 a of the first support member 1 is not adjacent to the concave portion 10 c of the horizontal beam 10. Accordingly, it is difficult for the adhesive 12 attached to the tip of the transfer pin 25 to form a meniscus that reaches the concave portion 10 c of the cross beam 10. As a result, as shown in FIGS. 11A to 11C, even if the transfer pin 25 is located at a position away from the vertical beam 11 or the upper surface 1 a of the first support member 1, the adhesive 12 is applied to the horizontal beam 10. It is not drawn into the concave portion 10c. Although some of the adhesive 12 hangs down due to gravity, it is not drawn into the concave portion 10c by the action (surface tension) of the meniscus. Therefore, as shown in FIG. 11C, the vertical beam 11 and the first support member 1 are used. Is held in the vicinity of the upper surface 1a. Most of the adhesive 12 is held in the vicinity of the joint between the first support member 1 and the element substrate 2 and contributes to the joint. For example, one of the inner wall surface of the supply channel 9 and the longitudinal beam 11 And it is located between the other side surface and the bonding surface of the element substrate 2 and functions to fix them together. In the first embodiment of the present invention, the connecting surfaces 10a and 10b of the horizontal beam 10 to the inner wall surface of the supply flow path 9 and the vertical beam 11 are bonded to the element substrate 2, that is, the adhesive 12 is transferred. By being at a position away from the surface downward, it is possible to suppress a decrease in bonding reliability.

  Thus, in this embodiment, since the fall of the reliability of joining with the 1st support member 1 and the element substrate 2 can be suppressed, as shown to FIG. The heat dissipation effect can be improved by increasing the length (for example, by forming the entire length of the supply channel 9). In this way, by improving the heat dissipation effect, it is possible to perform high-speed and high-frequency continuous liquid discharge and high-density recording by liquid discharge, and to reduce the reliability of bonding between the first support member 1 and the element substrate 2. It is possible to suppress both. Further, the number of the horizontal beams 10 is increased, and each horizontal beam 10 is connected to the inner wall surface of the supply flow path 9 and the connecting portions 10a and 10b with the vertical beam 11 in the depth direction from the joint surface with the element substrate 2 as described above. If the configuration is located away from each other, it is possible to more reliably suppress a decrease in bonding reliability. This point will be described in detail. When further speeding up of liquid discharge and high density recording are required, if the length of the vertical beam 11 is short and the number of the horizontal beams 10 is small, heat dissipation is required in time. There is a possibility that the quality of liquid discharge (for example, recording quality) cannot be satisfied. Therefore, the heat radiation can be improved by extending the vertical beam 11 in the longitudinal direction to increase the contact area with the element substrate 2 and increasing the number of the horizontal beams 10 or increasing the thickness of the horizontal beams 10. In this case, there is a concern that the amount of the adhesive 12 for fixing the element substrate 2 to the first support member 1 is insufficient, and the bonding reliability is lowered. If the number of the transverse beams 10 is small (for example, 2), a displacement occurs when transferring the adhesive 12 for bonding and fixing the element substrate 2, and adhesion to the side of the longitudinal beam 11, the concave portion 10 c of the transverse beam 10, etc. Even if the agent 12 drips down, there is not much influence. However, when the length of the vertical beam 11 is increased, the number of the horizontal beams 10 is increased, or the width is increased in order to improve heat dissipation, the region does not contribute to joining by flowing out to the side of the vertical beam 11 or the concave portion 10c of the horizontal beam 10. There is a concern that the amount of the adhesive 12 to reach an increase causes inconvenience. In the present embodiment, the inner wall surface of the supply flow path 9 of the horizontal beam 10 and the connecting portions 10a and 10b with the vertical beam 11 are not the same surface as the surface 1a onto which the adhesive 12 is transferred, but are positioned below and below. Yes. Accordingly, it is difficult to form a meniscus that reaches the concave portion, and the possibility that the adhesive 12 is drawn into the concave portion 10c of the cross beam 10 is reduced, and a sufficient amount of the adhesive 12 is added to the first support member 1 and the element substrate 2. There is a high possibility that it will remain in the region that contributes to bonding. Therefore, without worrying about a decrease in the reliability of bonding between the first support member 1 and the element substrate 2, the length of the vertical beams 11 is increased, the number of the horizontal beams 10 is increased, and the thickness is increased, thereby improving heat dissipation. Can be achieved.

The applicant of the present invention maximizes the amount of the adhesive 12 to be transferred and maximizes the deviation in the positional relationship in the short side direction of the supply channel 9 between the transfer pin 25 and the first support member 1. In this case, an experiment was conducted to observe the state in which the adhesive 12 was drawn into the concave portion 10c of the cross beam 10. According to this, in the first support member 1 having a thickness of 3.0 mm or more, the inner wall surface of the supply flow path 9 of the horizontal beam 10 and the connection portions 10a and 10b with the vertical beam 11 are joined surfaces with the element substrate 2. The distance Z1 away from 1a is preferably in the range of 0.5 mm to 1.0 mm. In that case, the adhesive 12 was not drawn much into the inside of the concave portion 10 c of the cross beam 10, and good bonding between the first support member 1 and the element substrate 2 was realized.
An example of the material of the first support member 1 is ceramic, but is not limited thereto, and various other materials can be used.

[Second Embodiment]
FIG. 12 shows a second embodiment of the present invention, FIG. 12 (a) is a plan view of the first support member 22 of the liquid ejection head of the second embodiment, and FIG. 12 (b) is FIG. It is the EE sectional view taken on the line of (a). In this embodiment, the connecting portion 10b of the horizontal beam 10 with the vertical beam 11 is not the same height as the surface 1a to which the adhesive 12 is transferred, but is separated by a distance Z2 below the supply channel 9 in the depth direction. In position. However, the connection part 10a with the inner wall surface of the supply flow path 9 of the horizontal beam 10 is the same height as the surface 1a on which the adhesive 12 is transferred. The technical meaning will be described. When the pitch of the supply flow path 9 can be widened, even if a part of the adhesive 12 at the position that becomes the inner wall surface of the supply flow path 9 flows out, the first support member 1. Therefore, the reliability of bonding between the element substrate 2 and the element substrate 2 is not significantly reduced. Therefore, even if the connecting portion 10 a of the lateral beam 10 to the inner wall surface of the supply flow path 9 is the same height as the upper surface 1 a of the first support member 1, it is between the transfer pin 25 and the first support member 1. Can be tolerated to some extent. And in this structure, since the surface area of a cross beam is large, heat dissipation is improved. However, when a sufficient amount of adhesive 12 is required on the upper surface of the vertical beam 11, the connecting portion 10b of the horizontal beam 10 to the vertical beam 11 is the same as that of the first embodiment. It is preferable to make it a low position away from the upper surface 1a.

  Even if a part of the adhesive 12 on the upper surface of the vertical beam 11 flows out, for example, because the width of the vertical beam 11 can be increased, the reliability of the bonding between the first support member 1 and the element substrate 2 is improved. In some cases, it does not decrease so much. In such a case, the connecting portion 10b of the horizontal beam 10 with the vertical beam 11 may be the same height as the upper surface 1a of the first support member 1. On the other hand, when the pitch of the supply flow path 9 is narrow, it is preferable that the connection portion 10a of the cross beam 10 with the inner wall surface of the supply flow path 9 is separated from the upper surface 1a of the first support member 1 and is in a low position. .

  As shown in FIG. 12, the connecting portion 10a of the horizontal beam 10 with the inner wall surface of the supply flow path 9 is the same height as the upper surface 1a of the first support member 1, and the connecting portion 10b with the vertical beam 11 is the first. The structure which exists in the position away below the upper surface 1a of the supporting member 1 of this is included in the scope of the present invention. Although not shown, the connecting portion 10b of the horizontal beam 10 to the vertical beam 11 is the same height as the upper surface 1a of the first support member 1, and the connecting portion 10a to the inner wall surface of the supply flow path 9 is the first support. Similarly, a configuration located at a position below the upper surface 1a of the member 1 is also included in the scope of the present invention. The cross beam 10 illustrated here has a connection portion 10 a with one inner wall surface and the other inner wall surface of the supply flow path 9, and a connection portion 10 b with one surface and the other surface of the vertical beam 11. . Even in the configuration in which both of the connection portions 10a and 10b are located away from the upper surface 1a of the first support member 1 as in the first embodiment, either the second embodiment or its modification is used. A configuration in which only one connecting portion is located away from the upper surface 1a of the first support member 1 may be employed. Which configuration is selected may be appropriately set according to the width of the vertical beam 11, the pitch of the supply flow path 9, and the like.

  Thus, according to the present invention, the heat radiation effect can be improved by increasing the shape or increasing the number of the vertical beams 11 and the horizontal beams 10. In addition, even if the transfer position of the adhesive 12 is slightly shifted due to a positional shift between the transfer pin 25 and the first support member 1, a region that does not contribute to the bonding between the first support member 1 and the element substrate 2. It is possible to suppress the adhesive 12 from being pulled into the surface. As a result, adhesive transfer stability is obtained, and a decrease in the reliability of bonding between the support member 1 and the element substrate 2 is suppressed.

1 Support member (first support member)
2 Element board | substrate 9 Supply flow path 10 Cross beam 10a Connection part (side edge part) with the inner wall face of a supply flow path
10b Connection with vertical beam (intermediate part)
10c Concave part 11 Vertical beam

Claims (8)

A liquid discharge head including an element substrate and a support member bonded to each other,
The support member is formed with a supply flow path for the liquid to be supplied to the element substrate, which is open at the joint surface with the element substrate.
A beam extending from one inner wall surface of the supply channel toward the other inner wall surface in a direction crossing the supply channel is provided inside the supply channel,
The liquid ejection head, wherein a connection portion of the beam with the inner wall surface of the supply channel is located away from a joint surface of the support member with the element substrate in a depth direction of the supply channel.   The thickness of the support member is 3.0 mm or more, and the connection portion of the beam with the inner wall surface of the supply flow path is within a range of 0.5 mm to 1.0 mm from the joint surface of the support member. The liquid discharge head according to claim 1, wherein the liquid discharge head is located at a position separated in the depth direction by a distance of. A liquid discharge head including an element substrate and a support member bonded to each other,
The support member is formed with a groove-like supply channel for the liquid to be supplied to the element substrate, which is open at the joint surface with the element substrate.
A first beam extending from one inner wall surface of the supply flow channel toward the other inner wall surface in a direction crossing the supply flow channel is connected to the first beam. A second beam extending in the longitudinal direction of the supply flow path,
The first beam extends from a connection portion with one inner wall surface to a connection portion with one surface of the second beam in a direction crossing the supply flow path, and further, the other of the second beams. From the connecting portion with the other surface to the connecting portion with the other inner wall surface,
One or both of the connection portion of the first beam with the inner wall surface of the supply flow path and the connection portion with the second beam is from a joint surface of the support member with the element substrate. A liquid discharge head at a position separated in the depth direction of the supply flow path.   The thickness of the support member is 3.0 mm or more, and the support member is selected from the connection portion of the first beam with the inner wall surface of the supply channel and the connection portion with the second beam. The connection portion at a position away from the joining surface in the depth direction is located at a position away from the joining surface in the depth direction by a distance within a range of 0.5 mm to 1.0 mm. 4. A liquid discharge head according to 3.   5. The liquid ejection head according to claim 3, wherein the second beam extends over the entire length in the longitudinal direction of the supply flow path.   The first beam, when viewed in the direction crossing the supply flow path, approaches again from the connecting portion with one of the inner wall surfaces, after further moving away from the joint surface in the depth direction, and the second beam. A connecting portion with one surface of the beam, and a further approach from the connecting portion with the other surface of the second beam after further separation from the joint surface in the depth direction, and the other inner wall surface 6. The liquid discharge head according to claim 3, wherein the liquid discharge head has a shape that reaches a connecting portion.   7. The liquid ejection head according to claim 3, wherein the first beam is located away from the joint surface, and the second beam forms a part of the joint surface.   8. The liquid ejection head according to claim 1, wherein the element substrate is provided with a plurality of foaming chambers that receive supply of the liquid from the supply flow path.

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