JP2018148768A - Linear material processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a linear material processing device that is able to improve a linear material processing speed.SOLUTION: A coat peeling device 1 that is able to peel a coat of a coated linear material 8 comprises: a linear material feeding unit 10 that is able to feed a coated linear material 8 in a direction along a center axis C8, which is a lengthwise direction of the coated linear material 8; a peeling cutter 50 that is able to peel the coat of the coated linear material 8; and a driving unit 30 that is able to move the peeling cutter 50 relative to the coated linear material 8. The peeling cutter 50 moves in a ground direction, which is a direction orthogonal to the center axis C8 of the coated linear material 8, and peels the coat of a predetermined part of the coated linear material 8. Thereafter, an end face 501 moves away from the coated linear material 8 while moving in the ground direction. By virtue of this, right after peeling the coat of the predetermined part of the coated linear material 8, the peeling cutter 50 separates from the linear material from which the coat has been peeled. Accordingly, the linear material from which the coat has been peeled can be quickly fed to the subsequent process.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a wire rod processing apparatus capable of processing a wire rod.

  2. Description of the Related Art Conventionally, there has been known a film peeling apparatus that peels a film at a predetermined location from a coated wire in which an insulating film is provided around a conductive metal wire. For example, Patent Document 1 describes a coating film peeling apparatus including a punch that can reciprocate along two side surfaces parallel to the longitudinal direction of a coated wire having a rectangular cross section.

JP 2011-182597 A

  In the coating film peeling apparatus described in Patent Document 1, the two coating films are moved by moving a punch having a blade capable of simultaneously peeling the coating films on the two side surfaces along the two side surfaces of the clamped coated wire rod. Remove at the same time. At this time, since the wire from which the coating has been peeled remains between the two blades of the punch that has moved in one direction in order to peel the coating, the punch is moved in the other direction and from between the two blades. The wire cannot be moved without removing the wire. For this reason, the time required for the peeling process of the film with respect to one wire becomes long.

  This invention is made | formed in view of the above-mentioned point, The objective is to provide the wire processing apparatus which can raise the processing speed of a wire.

The present invention is a wire material processing apparatus capable of processing a wire material (8), and includes a wire material feeding unit (10), processing tools (50, 52, 54), and a drive unit (30).
The wire rod feeding unit can feed the wire along the longitudinal direction of the wire.
The processing tool can process a predetermined portion of the wire.
The drive unit can move the processing tool relative to the wire.
In the wire rod processing apparatus of the present invention, the processing tool moves toward one of the first directions intersecting with the longitudinal direction of the wire rod, and after processing a predetermined portion of the wire rod, the processing tool is in a direction different from the first direction and from the wire rod Move away.

  In the wire rod processing apparatus of the present invention, the processing tool moves to one of the first directions intersecting the longitudinal direction of the wire rod in order to process a predetermined portion of the wire rod, and then is away from the wire rod in a direction different from the first direction. Move in the direction. Thereby, when the wire is processed, the processed wire and the processing tool are separated from each other, so that the processed wire can be quickly sent to the next step. Therefore, since the processing speed of the wire can be increased, the number of processed wires per unit time can be increased.

It is a schematic diagram of the wire processing apparatus by 1st embodiment. It is the II-II sectional view taken on the line of FIG. It is the III section enlarged view of FIG. It is a schematic diagram of the wire with a film processed by the wire processing apparatus by a first embodiment. It is a conceptual diagram explaining the effect | action of the wire processing apparatus by 1st embodiment. It is a conceptual diagram explaining the effect | action of the wire processing apparatus by 1st embodiment, Comprising: It is a conceptual diagram explaining the effect | action following FIG. It is a conceptual diagram explaining the effect | action of the wire processing apparatus by 1st embodiment, Comprising: It is a conceptual diagram explaining the effect | action following FIG. It is a conceptual diagram explaining the effect | action of the wire processing apparatus by 1st embodiment, Comprising: It is a conceptual diagram explaining the effect | action following FIG. It is a conceptual diagram explaining the effect | action of the wire processing apparatus by 1st embodiment, Comprising: It is a conceptual diagram explaining the effect | action following FIG. It is the elements on larger scale of the wire processing apparatus explaining the effect | action of the wire processing apparatus by 1st embodiment. It is the elements on larger scale of the wire processing apparatus explaining the effect | action of the wire processing apparatus by 1st embodiment, Comprising: It is a conceptual diagram explaining the effect | action following FIG. It is the elements on larger scale of the wire processing apparatus explaining the effect | action of the wire processing apparatus by 1st embodiment, Comprising: It is a conceptual diagram explaining the effect | action following FIG. It is the elements on larger scale of the wire processing apparatus explaining the effect | action of the wire processing apparatus by 1st embodiment, Comprising: It is a conceptual diagram explaining the effect | action following FIG. It is a schematic diagram explaining the effect of the wire processing apparatus by 1st embodiment. It is a schematic diagram of the wire processing apparatus by 2nd embodiment. It is a schematic diagram of the wire processing apparatus by 3rd embodiment.

Hereinafter, a plurality of embodiments will be described with reference to the drawings. Note that, in a plurality of embodiments, substantially the same components are denoted by the same reference numerals, and description thereof is omitted.
(First embodiment)
The coating film peeling apparatus 1 as the “wire material processing apparatus” according to the first embodiment can peel the coating film at a predetermined location of the coated wire 8 as the “wire material”.

First, the shape of the coated wire 8 from which the film is peeled off by the film peeling apparatus 1 and the names of the respective parts will be described with reference to FIG.
The coated wire 8 has a conductive portion 81 and a coating 82. In the present embodiment, the coated wire 8 is linear as shown in FIG. 4 when sent to the film peeling apparatus 1. Here, for convenience, the central axis parallel to the longitudinal direction of the coated wire 8 is defined as a central axis C8.

The conductive portion 81 is made of a conductive metal material, and the cross-sectional shape perpendicular to the central axis C8 is rectangular as shown in FIG. This is because, in the welding of the coated wire 8 from which the coating 82 has been peeled (hereinafter referred to as “peeled wire”), it is assumed that the welding is performed between planes that can ensure a relatively large welding area. It is.
The coating 82 is provided so as to cover the four side surfaces 811, 812, 813, and 814 that are substantially parallel to the central axis C <b> 8 of the conductive portion 81. The film 82 is made of an insulating material. The film peeling apparatus 1 is an apparatus that peels the film 82 from the conductive portion 81.

  Next, the structure of the film peeling apparatus 1 is demonstrated based on FIGS. FIG. 1 is a top view of the film peeling apparatus 1. FIG. 2 is a cross-sectional view taken along the line II-II in FIG. 1 and is also a side view of the film peeling apparatus 1. In FIG. 2, the top direction of the gravity direction as the “first direction” is shown as the top direction, and the ground side direction of the gravity direction is shown as the ground direction as “one of the first directions”. The film peeling apparatus 1 includes a wire rod feeding unit 10, a wire rod holding unit 20, a driving unit 30, a peeling cutter 50, and a control unit 55.

  The wire feeder 10 can feed the coated wire 8 supplied from the outside (not shown) in the longitudinal direction of the coated wire 8, that is, in the direction along the central axis C <b> 8 of the coated wire 8 (FIG. 1). (See white arrow Fs1). The wire feeding unit 10 sends the coated wire 8 to the wire holding unit 20 in accordance with an instruction from the control unit 55 that is electrically connected.

  The wire holding unit 20 includes a holding base 21, a clamp 22 as a “pressing unit”, and a clamp driving unit 23.

  The holding stand 21 is formed in a substantially rectangular parallelepiped shape. The holding table 21 is fixed to the base 100 that is a base of the film peeling apparatus 1 so as not to be relatively movable. A holding groove 212 as an “accommodating groove” into which the coated wire 8 fed by the wire feeding unit 10 can be inserted is formed in the holding surface 211 that is the top end surface of the holding base 21. As shown in FIG. 3, the width of the holding groove 212 is wider than the width in the direction perpendicular to the central axis C <b> 8 of the coated wire 8.

  The holding table 21 has a space 213 at an end portion on the drive unit 30 side described later. The space 213 is formed so as to open in the holding surface 211 and the side surface 214 on the drive unit 30 side. The space 213 is formed to be orthogonal to the holding groove 212, and communicates with the holding groove 212 at the approximate center of the holding groove 212. The space 213 is formed in a size that allows a part of the peeling cutter 50 to move.

  The holding table 21 has clamping grooves 215 and 216 on the holding surface 211. The clamping groove 215 is an edge portion of the opening on the holding surface 211 side of the space 213 and is formed on the wire feeding portion 10 side. The clamping groove 216 is an edge portion of the opening on the holding surface 211 side of the space 213 and is formed on the opposite side to the wire feeding portion 10. The clamping grooves 215 and 216 communicate with the holding groove 212 from the side opposite to the drive unit 30 with respect to the coated wire 8 inserted into the holding groove 212. The clamping grooves 215 and 216 communicate with the space 213 at the edge of the opening on the holding surface 211 side. The grooves for clamping 215 and 216 accommodate a part of the clamp 22 so as to be movable.

The clamp 22 is provided to be movable in the vertical direction and the horizontal direction. As shown in FIG. 3, the clamp 22 has two contact surfaces 221 and 222 that can contact the coated wire 8 at the end opposite to the side connected to the clamp drive unit 23. The abutting surface 221 can abut on a side surface 801 opposite to the drive unit 30 of the coated wire 8 inserted into the holding groove 212. Further, the contact surface 222 can contact the upper surface 802 of the coated wire 8 inserted into the holding groove 212.
The clamp driving unit 23 is connected to the clamp 22. The clamp driving unit 23 generates a driving force that can move the clamp 22 in the vertical direction and the horizontal direction in accordance with an instruction from the control unit 55 that is electrically connected.

  The drive unit 30 includes a first slide member 31 as a “first direction support portion”, a first direction power source 35, a second slide member 41 as a “second direction support portion”, and a swing as a “connecting portion”. A lever 42, a first rotation shaft 43, a second rotation shaft 44, a second direction power source 45, and a third rotation shaft 40 are included. The drive unit 30 can move relative to the coated wire rod 8 inserted into the holding groove 212 through a peeling cutter 50 described later.

  The first slide member 31 is provided on the top side of the drive unit 30. The first slide member 31 is provided so as to be movable in the vertical direction on a slide rail 310 that is fixed to the base 100 so as not to move relative to the base 100 (open arrow F31 in FIG. 2).

  The first direction power source 35 is supported by a support member 350 fixed on the base 100, and is positioned in the top direction of the first slide member 31. The first direction power source 35 is electrically connected to the control unit 55. The first direction power source 35 has a cam 351 and a cam shaft 352. The cam 351 is in contact with the top end surface 311 of the first slide member 31. The cam 351 rotates with the rotation of the cam shaft 352 of the white arrow F35 shown in FIG. As a result, the first slide member 31 moves in the vertical direction according to the cam profile of the cam 351.

  The second slide member 41 is provided on the ground side of the drive unit 30. The second slide member 41 is provided so as to be movable in the horizontal direction as the “second direction” on the slide rail 410 fixed to the base 100 so as not to move relative to the base 100 (white in FIG. 2). Extraction arrow F41).

  The swing lever 42 is provided at one end of the second slide member 41 so as to be rotatable with respect to the second slide member 41. In the present embodiment, the one end 421 on the second slide member 41 side of the swing lever 42 and the second slide member 41 are connected to each other by a first rotation shaft 43 so as to be relatively rotatable (the white arrow F421 in FIG. 2). ).

  The second rotating shaft 44 is provided at the other end 422 of the swing lever 42 opposite to the second slide member 41. The second rotating shaft 44 connects the swing lever 42 and the peeling cutter 50 so as to be relatively rotatable (a white arrow F422 in FIG. 2).

  The second direction power source 45 is located on the opposite side of the swing lever 42 of the second slide member 41. The second direction power source 45 is supported by a support member 450 fixed on the base 100. The second direction power source 45 has a cam 451 and a cam shaft 452. The cam 451 is in contact with the end surface 411 on the opposite side of the swing lever 42 of the second slide member 41. The cam 451 rotates in accordance with the rotation of the cam shaft 452 indicated by the white arrow F45 shown in FIG. As a result, the second slide member 41 moves in the horizontal direction according to the cam profile of the cam 451.

  The third rotary shaft 40 is connected to the blade 51 as a “processing portion” capable of peeling the coating 82 of the peeling cutter 50 and the swing lever 42 of the peeling cutter 50 “part connected to the connecting portion of the processing tool”. Between the end portion 500 and the end portion 500. The third rotary shaft 40 connects the peeling cutter 50 and the first slide member 31 so as to be relatively rotatable between the blade 51 and the end portion 500 (a white arrow F40 in FIG. 2).

  The peeling cutter 50 has a blade 51 on the ground side. The blade 51 is formed up to the end surface 501 of the peeling cutter 50 on the wire holding part 20 side. An end surface 501 on the wire holding unit 20 side of the peeling cutter 50 is formed to extend in the vertical direction.

  The control unit 55 is electrically connected to the wire rod feeding unit 10, the clamp driving unit 23, the first direction power source 35, and the second direction power source 45. The control unit 55 is configured to feed the coated wire 8 by the wire feeding unit 10, move the clamp 22 by the clamp driving unit 23, rotate the cam shaft 352 of the first direction power source 35, and second direction power. The rotation of the cam shaft 452 of the source 45 is controlled. At this time, the controller 55 peels off the coating 82 of the coated wire 8 by synchronizing the feeding of the coated wire 8, the movement of the clamp 22, the rotation of the cam shaft 352, and the rotation of the cam shaft 452. I do.

  The film peeling apparatus 1 according to the first embodiment is characterized by the movement of the peeling cutter 50 supported by the drive unit 30. Therefore, based on FIGS. 5 to 9, the movement of the peeling cutter 50 when peeling the coating 82 of the coated wire 8 will be described based on the movements of the three rotary shafts.

  5 to 9 conceptually show the positional relationship between the first rotary shaft 43, the second rotary shaft 44, and the third rotary shaft 40 based on the side view of the film peeling apparatus 1 shown in FIG. Is. In FIGS. 5 to 9, for convenience of explanation, the wire holding part 20 is seen from the top direction which is the top direction of the gravity direction in FIG. 2, the ground direction which is the ground side direction of the gravity direction, and the third rotating shaft 40. A front direction, which is a direction in which the wire rod is positioned, and a rear direction, which is the direction opposite to the direction in which the wire rod holding unit 20 is positioned as viewed from the third rotary shaft 40, are shown.

  FIG. 5 shows the positional relationship of the three rotating shafts immediately before the peeling cutter 50 peels the coating 82. The position of the peeling cutter 50 in the state of FIG. FIG. 6 shows the positional relationship between the three rotating shafts when the peeling cutter 50 peels the coating 82. FIG. 7 shows the positional relationship of the three rotating shafts when the peeling cutter 50 moves away from the coated wire 8 after peeling the coating 82. FIG. 8 shows the positional relationship of the three rotary shafts in the middle of the peeling cutter 50 returning to the original position from the state shown in FIG. FIG. 9 shows a positional relationship when the peeling cutter 50 returns to the original position from the state shown in FIG. 5 to 9, the rotation centers of the three rotation shafts are indicated by rotation centers C43, C44, and C40, respectively.

5-9, the virtual line equivalent to the central axis of the 1st slide member 31 is shown as the continuous line L31. The solid line L31 is located on the virtual line D31 on the virtual plane of FIGS. On the solid line L31, a contact point P311 corresponding to the rotation center C40 of the third rotation shaft 40 and the end surface 311 that contacts the cam 351 of the first slide member 31 is located. That is, the rotation center C40 and the contact point P311 can move on the virtual line D31 while maintaining a predetermined distance.
5 to 9, a virtual line corresponding to the central axis of the second slide member 41 is indicated by a solid line L41. The solid line L41 is located on the virtual line D41 orthogonal to the virtual line D31 on the virtual plane of FIGS. On the solid line L41, a contact point P411 corresponding to the rotation center C43 of the first rotation shaft 43 and the end surface 411 that contacts the cam 451 of the second slide member 41 is located. That is, the rotation center C43 and the contact point P411 can move on the virtual line D41 while maintaining a predetermined distance.

5 to 9, a virtual line corresponding to the central axis of the swing lever 42 is indicated by a solid line L42. A solid line L42 is a solid line connecting the rotation center C43 of the first rotation shaft 43 and the rotation center C44 of the second rotation shaft 44, and the length thereof is constant.
5 to 9, a line extending from the rotation center C44 of the second rotation shaft 44 to the starting end of the cutting arrow A501 via the rotation center C40 of the third rotation shaft 40 is a solid line L50 as a solid line indicating the peeling cutter 50. It shows with. The cutting arrow A501 indicates the position and direction of the end face 501 on the wire holding unit 20 side in the peeling cutter 50. The solid line L50 can be rotated around the rotation center C40, for example, while the angle α1 formed by the solid line connecting the rotation center C44 and the rotation center C40 and the solid line connecting the rotation center C40 and the starting end of the cutting arrow A501 remains constant. is there. Further, the angle β1 formed by the solid line connecting the rotation center C40 and the start end of the cutting arrow A501 and the direction indicated by the cutting arrow A501 remains constant.

  Moreover, in FIGS. 5-9, the peeling line L811 which shows the position of the side surface 811 of the electroconductive part 81 of the wire 8 with a film | membrane shown in FIG. 3 is shown. In the state of FIG. 5, the peeling line L811 and the cutting arrow A501 overlap.

  Also, in FIGS. 5 to 9, one of the virtual circles indicating positions equidistant from the first rotary shaft 43 is indicated by a virtual circle VC43 in order to facilitate understanding of the movements of the three rotary shafts. The radius of the virtual circle VC43 is a distance from the first rotary shaft 43 to the second rotary shaft 44. In addition, one of the virtual circles indicating positions equidistant from the third rotation shaft 40 is indicated by a virtual circle VC40. The radius of the virtual circle VC40 is the distance from the third rotary shaft 40 to the second rotary shaft 44. That is, in FIGS. 5 to 9, the second rotary shaft 44 is located at the intersection of the virtual circle VC43 and the virtual circle VC40.

  When the first slide member 31 moves in the ground direction as indicated by the white arrow F11 in FIG. 6 due to the rotation of the cam 351 from the state shown in FIG. 5, the third rotary shaft 40 moves in the ground direction. At this time, when the second slide member 41 is moved appropriately in the forward direction in accordance with the movement of the third rotary shaft 40 as shown by the white arrow F21 in FIG. Oscillates in the ground direction around the rotation center C43. Thereby, the 2nd rotating shaft 44 moves to a ground direction in parallel with the virtual line D31. Therefore, the cutting arrow A501 moves linearly in the ground direction along the peeling line L811 (open arrow F51 in FIG. 6). At this time, the cutting arrow A501 and the peeling line L811 remain overlapped.

  When the first slide member 31 further moves in the ground direction as indicated by the white arrow F12 in FIG. 7 by the rotation of the cam 351 from the state shown in FIG. 6, the third rotary shaft 40 further moves in the ground direction. To do. At this time, when the second slide member 41 is moved in the forward direction by the rotation of the cam 451 as shown by the white arrow F22 in FIG. 7, the swing lever 42 swings in the ground direction around the rotation center C43. The second rotating shaft 44 moves in the forward direction while maintaining the state. As a result, the peeling cutter 50 rotates about the rotation center C40 of the third rotary shaft 40, so that the cutting arrow A501 is in the backward direction away from the peeling line L811, as shown by the white arrow F52 in FIG. Move in a curvilinear direction.

  From the state shown in FIG. 7, when the first slide member 31 moves in the top direction as indicated by the white arrow F <b> 13 in FIG. 8 due to the rotation of the cam 351, the third rotation shaft 40 moves in the top direction. At this time, when the second slide member 41 moves backward as indicated by the white arrow F23 in FIG. 8 by the rotation of the cam 451, the swing lever 42 swings upward about the rotation center C43. Move. Accordingly, the peeling cutter 50 moves in the upward direction as indicated by the white arrow F53 in FIG. 8 while rotating around the rotation center C40 of the third rotary shaft 40.

When the first slide member 31 moves in the ground direction and returns to the original position as shown by the white arrow F14 in FIG. 9 by the rotation of the cam 351 from the state shown in FIG. Move in the ground direction and return to the original position. At this time, when the second slide member 41 moves rearward and returns to the original position as shown by a white arrow F24 in FIG. 9 by the rotation of the cam 451, the swing lever 42 is centered on the rotation center C43. And the solid line L42 overlaps the virtual line D41. Thereby, as shown by the white arrow F54, the peeling cutter 50 moves forward while rotating about the rotation center C40 of the third rotary shaft 40, and returns to the original position.
Thus, the peeling cutter 50 provided in the coating film peeling apparatus 1 moves in the order of the white arrows F51, F52, F53, and F54. In the film peeling apparatus 1, the film 82 is peeled from the conductive portion 81 by repeating the movement of the peeling cutter 50.

  Next, the effect | action of the film peeling apparatus 1 is demonstrated based on FIGS. 10 to 13 are partial enlarged views of the periphery of the holding groove 212 of the film peeling apparatus 1. 10 to 13 show the celestial direction, the ground direction, the front direction, and the rear direction shown in FIGS.

  First, the wire feeding unit 10 inserts the coated wire 8 into the holding groove 212 of the wire holding unit 20. Here, as shown in FIG. 10, the coating 82 covering the side surface 812 of the conductive portion 81 of the coated wire 8 is inserted so as to contact the bottom wall 217 of the holding groove 212. Thereby, the film peeling apparatus 1 will be in the state shown in FIG. In the state of FIG. 10, the peeling cutter 50 is in the original position, and the clamp 22 is in a position where it does not contact the coated wire 8 inserted into the holding groove 212.

  When the clamp 22 moves backward while being moved backward by the clamp driving unit 23 from the state shown in FIG. 10, the contact surface 221 of the clamp 22 contacts the side surface 801 of the coated wire 8 and the contact of the clamp 22. The surface 222 contacts the upper surface 802 of the coated wire 8. When the clamp 22 further moves in the backward direction, the coated wire 8 is pushed backward in the holding groove 212 by the clamp 22 and the side surface 803 moves in the holding groove 212 "after the processing tool has processed a predetermined portion of the wire. It abuts against the inner wall 218 as “one inner wall” on the drive unit 30 side as the “direction side” (see FIG. 11). Thereby, the coated wire 8 is fixed to the holding table 21.

  When the first slide member 31 moves in the ground direction and the second slide member 41 moves in the forward direction from the state shown in FIG. 5 and FIG. 6, the peeling cutter 50 moves in the ground direction. It moves linearly (see white arrow F51 in FIG. 6). As a result, as shown in FIG. 12, the peeling cutter 50 moves along the side surface 811 of the conductive portion 81 of the coated wire 8, and the coating 820 covering the side surface 811 is peeled from the conductive portion 81.

  When the first slide member 31 further moves in the ground direction and the second slide member 41 moves in the forward direction from the state shown in FIGS. 6 and 7, the peeling cutter 50 is moved to the ground direction. (See the white arrow F52 in FIG. 7). As a result, as shown in FIG. 13, the end surface 501 of the peeling cutter 50 is separated from the side surface 811 of the conductive portion 81 of the coated wire 8. At this time, the end surface 501 is inclined with respect to the vertical direction.

  When the end surface 501 of the peeling cutter 50 is separated from the side surface 811 of the conductive portion 81 of the coated wire 8, the clamp driving unit 23 moves in the upward direction while moving the clamp 22 in the forward direction. Thereby, since fixation of the peeled wire to the holding base 21 by the clamp 22 is released, the peeled wire is sent to the next step. Further, when the peeled wire is sent to the next step, the wire feeding unit 10 sends the next coated wire 8 to the wire holding unit 20. The next coated wire 8 inserted into the holding groove 212 is fixed to the holding table 21 by the clamp 22.

  On the other hand, the peeling cutter 50 separated from the side surface 811 of the conductive portion 81 of the coated wire 8 moves in the upward direction as described in FIGS. 7 and 8 (see the white arrow F53 in FIG. 8). Further, the peeling cutter 50 moves in the forward direction while rotating around the rotation center C40 of the third rotating shaft 40 (see the white arrow F54 in FIG. 9), and returns to the original position.

The effect of the film peeling apparatus 1 by this embodiment is demonstrated based on FIG. FIG. 14 shows a time flow of the process of peeling the coating 82 of the coated wire 8.
The step of peeling the coating 82 of the coated wire 8 includes a step of sending the coated wire 8 to the wire holding unit 20 (open arrow F1a in FIG. 14), and a step of fixing the coated wire 8 to the wire holding unit 20 (FIG. 14, the step of peeling the coating 82 at a predetermined location of the coated wire 8 with the peeling cutter 50 (open arrow F 1 c in FIG. 14), fixing the coated wire 8 to the wire holding unit 20. Step of releasing (open arrow F1d in FIG. 14), step of feeding the peeled wire next (open arrow F1e in FIG. 14), and step of returning the peeling cutter 50 from which the coating 82 has been peeled back to the original position (FIG. 14) 14 white arrows F1f).

FIG. 14 shows, as a comparative example, a time flow of a process of peeling a film in a film peeling apparatus that peels a film of a wire with a film by linearly reciprocating a peeling cutter from its original position.
In the film peeling apparatus of the comparative example, since the peeling cutter after peeling the film is in contact with the peeled wire, the peeled wire cannot be fixed until the peeling cutter returns to the original position. For this reason, in the film peeling apparatus of the comparative example, as shown in FIG. 14, from the process of feeding the coated wire to the wire holding part (open arrow F1a) to the process of sending the peeled wire next (open arrow F1e). Is the time Sp0 between time ts10 and time t0 shown in FIG.

  On the other hand, in the film peeling apparatus 1 according to the present embodiment, the peeling cutter 50 after peeling the film 82 moves away from the peeled wire after peeling the film 82. That is, in the film peeling apparatus 1, as shown in FIG. 14, while the peeling cutter 50 from which the film 82 has been peeled returns to the original position, the peeled wire rod is released and sent to the next process and the next film attached. The wire 8 can be fixed to the wire holding part 20. Thereby, in the film peeling apparatus 1, the time from the process of sending the coated wire 8 to the wire holding part (open arrow F1a) to the process of sending the peeled wire next (open arrow F1e) is shown in FIG. Time Sp1 from time ts10 to time t1, which is shorter than time Sp0. Therefore, since the speed at which the coating 82 of the single coated wire 8 is peeled can be increased, the number of processed stripped wires per unit time can be increased.

  The drive unit 30 of the present embodiment drives the peeling cutter 50 so that it moves linearly in the ground direction in order to peel the coating 82, and then moves in a backward curve while moving in the ground direction. Thereby, since the peeling cutter 50 is separated from the peeled wire without forcibly stopping the movement in the ground direction when the coating 82 is peeled, the peeling cutter 50 can be separated from the peeled wire in a shorter time. it can. Therefore, the number of processed stripped wires per unit time can be further increased.

  The drive unit 30 drives the peeling cutter 50 by the rotation of the two cams 351 and 451. As a result, the peeling cutter 50 can be moved in the order of the white arrows F51, F52, F53, and F54 shown in FIG. 9 in a shorter time than driving by a servo motor or the like. Therefore, the number of processed stripped wires per unit time can be further increased.

  In the wire holding part 20 of the present embodiment, the coated wire 8 accommodated in the holding groove 212 is brought into contact with the inner wall 218 of the holding groove 212 by the clamp 22. The peeling cutter 50 peels off the coating 82 that is in contact with the inner wall 218. Thereby, since the peeling cutter 50 that moves relative to the base 100 to which the holding base 21 is fixed always passes through the same position, the thickness of the coating 82 to be peeled from the coated wire 8 is made constant. Can do.

  Further, the inner wall 218 is positioned on the drive unit 30 side in the wire holding unit 20 and on the side in which the peeling cutter 50 moves after peeling the coating 82 of the coated wire 8. Thus, after the peeling cutter 50 peels off the coating 82 that is in contact with the inner wall 218, the peeling cutter 50 can be quickly released toward the drive unit 30, so that the moving distance of the peeling cutter 50 is relatively long. Can be shortened. Therefore, the number of processed stripped wires per unit time can be further increased.

(Second embodiment)
The wire rod processing apparatus according to the second embodiment will be described with reference to FIG. In the second embodiment, the content of processing on the wire is different from that of the first embodiment.

  A scoring device 2 as a “wire material processing apparatus” according to the second embodiment includes a wire material feeding unit 10, a wire material holding unit 20, a driving unit 30, and a scoring cutter 52 as a “processing tool”.

  The creasing cutter 52 is provided at the other end 422 of the swing lever 42. The scoring cutter 52 has scoring blades 521 and 522 as two “processing parts” capable of scoring the coating 82 at the end on the wire holding part 20 side. The scoring blades 521 and 522 are formed so as to be able to come into contact with the surface of the coating 82 of the coated wire 8 housed in the holding groove 212. The distance in the direction along the central axis C8 between the scoring blade 521 and the scoring blade 522 is equal to the length in the direction along the central axis C8 of the coating 82 to be peeled.

  In the scoring device 2, the scoring cutter 52 is moved by the driving unit 30, and before scoring the coating 82, the scoring blades 521 and 522 provide scoring on both sides of the coating 82 to be stripped. Thereby, for example, the occurrence of peeling failure is prevented by peeling the coating 82 at a predetermined location by the coating peeling apparatus 1 of the first embodiment.

  In the scoring device 2 according to the second embodiment, the scoring cutter 52 moves away from the streaked wire immediately after scoring the coating 82. As a result, the coated wire rod with the stripes is sent until the creasing cutter 52 returns to the original position after the coating 82 has been creased to hold the next coated wire rod 8 to be creased. 21 can be fixed. Therefore, since the second embodiment can increase the speed at which the coating 82 of the coated wire 8 is streaked, the same effect as the first embodiment can be obtained, and the occurrence of defective peeling of the coating 82 can be prevented. it can.

(Third embodiment)
A wire rod processing apparatus according to the third embodiment will be described with reference to FIG. In 3rd embodiment, the content of the process with respect to a wire differs from 1st embodiment.

  The wire rod cutting device 3 as a “wire rod processing device” according to the third embodiment includes a wire rod feeding unit 10, a wire rod holding unit 20, a drive unit 30, and a cutting cutter 54 as a “processing tool”.

The cutting cutter 54 is provided at the other end 422 of the swing lever 42. The cutting cutter 54 has a blade 541 as a “processed portion” capable of cutting the conductive portion 81 at the end on the wire holding portion 20 side. The blade 541 is formed so as to be able to cross the coated wire 8 accommodated in the holding groove 212 in a direction perpendicular to the central axis C8.
In the wire rod cutting device 3, the cutting cutter 54 is moved by the drive unit 30 to cut a desired portion of the coated wire rod 8.

  In the wire cutting apparatus 3 according to the third embodiment, the cutting cutter 54 is cut immediately after cutting the coated wire 8 and moves away from the coated wire. As a result, the coated wire rod cut until the cutting cutter 54 after cutting the coated wire rod 8 returns to its original position, and the next coated wire rod 8 to be cut next is fixed to the holding table 21. be able to. Therefore, since 3rd embodiment can raise the speed which cut | disconnects the wire 8 with a film, there exists the same effect as 1st embodiment.

(Other embodiments)
In the above-described embodiment, the “wire material processing device” is a film peeling device, a creasing device, and a wire material cutting device. However, the “wire material processing apparatus” is not limited to this. Any device that processes a wire may be used.

  In the above-described embodiment, the “wire material” is formed of a conductive part and a film covering four side surfaces substantially parallel to the central axis of the conductive part. However, the “wire” is not limited to this. The film may not be formed and may not be formed from a conductive metal material, and the material is not limited to metal or resin. Any wire-like member may be used.

  In the above-described embodiment, the drive unit includes the first slide member, the first direction power source, the second slide member, the swing lever, the first rotation shaft, the second rotation shaft, the second direction power source, and the third. It has a rotating shaft. However, the configuration of the drive unit is not limited to this. When the coated wire is processed, the processing tool may be moved in the vertical direction with respect to the longitudinal direction of the wire, and after the wire is processed, it may be moved in a direction different from the vertical direction and away from the coated wire.

  In the above-described embodiment, each of the first direction power source and the second direction power source has a cam, and the processing tool is moved by the cam profile of the cam. However, the movement of the processing tool by the first direction power source and the second direction power source may not be by the cam.

  In the above-described embodiment, the clamp pushes the coated wire of the holding groove so as to contact the inner wall. However, the method of holding the “wire” is not limited to this. It is only necessary that the wire can be fixed to the moving processing tool.

  In the embodiment described above, there are two clamps and clamp grooves. There may be one.

  The present invention is not limited to the embodiments described above, and can be implemented in various forms without departing from the spirit of the invention.

1 ... Film peeling device (wire material processing device)
2 ... creasing device (wire material processing device)
3. Wire rod cutting device (wire rod processing device)
8 ... Wire with coating (wire)
DESCRIPTION OF SYMBOLS 10 ... Wire rod feeding part 30 ... Drive part 50 ... Cutter for peeling (processing tool)
52 ... Cutter for creasing (processing tool)
54 ... Cutting cutter (processing tool)

Claims (9)

A wire rod processing apparatus capable of processing the wire rod (8),
A wire feeder (10) capable of feeding the wire along the longitudinal direction of the wire;
A processing tool (50, 52, 54) capable of processing a predetermined portion of the wire,
A drive unit (30) capable of moving the processing tool relative to the wire;
With
The processing tool moves toward one of the first directions intersecting with the longitudinal direction of the wire and processes the predetermined portion of the wire, and then is a direction different from the first direction and away from the wire Wire processing equipment that moves to. The drive unit is
A first direction support portion (31) movably provided in the first direction;
A first direction power source (35) capable of reciprocating the first direction support portion in the first direction;
A second direction support portion (41) movably provided in a second direction perpendicular to the first direction;
A connection portion (42) provided to be rotatable relative to the second direction support portion and the processing tool;
A first rotating shaft (43) for connecting the second direction support portion and one end (421) of the connecting portion so as to be relatively rotatable;
A second rotating shaft (44) for connecting the processing tool and the other end (422) of the connecting portion in a relatively rotatable manner;
A second direction power source (45) capable of reciprocating the second direction support portion in the second direction;
The first direction support portion and the processing tool between a processing portion (51, 521, 522, 541) capable of processing a predetermined portion of the wire rod of the processing tool and a portion (500) connected to the connection portion. A third rotating shaft (46) for connecting the two together so as to be relatively rotatable,
The wire processing apparatus according to claim 1, comprising:   The processing tool moves linearly toward one of the first directions to process the predetermined portion of the wire, and then is curved in a direction different from the first direction and away from the wire. The wire rod processing apparatus according to claim 2, which moves to the position. At least one of the first direction power source and the second direction power source is:
A cam (351, 351) that is rotatable while abutting on a side opposite to a side connected to the processing tool of the first direction support part or a side opposite to a side connected to the connection part of the second direction support part. 451). The wire rod processing apparatus according to claim 2 or 3. A wire rod holding portion (20) capable of holding the wire rod fed by the wire rod feeding portion at a predetermined position;
The wire holding part has a holding base (21) having an accommodation groove (212) capable of accommodating the wire, and an inner wall (218) that forms the accommodation groove with the wire accommodated in the accommodation groove The wire rod processing apparatus according to any one of claims 1 to 4, further comprising a pressing portion (22) for pressing so as to abut against the wire.   The wire processing apparatus according to claim 5, wherein the one inner wall is positioned on a side in a direction in which the processing tool moves after processing the predetermined portion of the wire in the wire holding portion. The wire has a conductive part (81) having conductivity, and a coating (82) covering the conductive part,
The wire processing apparatus according to any one of claims 1 to 6, wherein the processing tool is a peeling cutter (50) for peeling the coating film from the conductive portion.   The wire rod processing according to claim 7, wherein the processing tool is a creasing cutter (52) that performs creasing for peeling the coating film at the predetermined location before the coating film is peeled off by the peeling cutter. apparatus.   The wire processing apparatus according to any one of claims 1 to 6, wherein the processing tool is a cutting cutter (54) capable of cutting the wire.

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