JP2018136114A - Air conditioner - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an air conditioner that has an improved degree of freedom in selecting an installation site of it.SOLUTION: An air conditioner has an air circulation path 12, a cooler 14 that is disposed in the air circulation path 12 and cools the air introduced into the air circulation path 12 to condense the steam in the air, a wastewater storage part 40 that can store the water discharged from the cooler 14, and a pump P that discharges the water stored in the wastewater storage part 40.SELECTED DRAWING: Figure 4

Description

  The present invention relates to an air conditioner.

  2. Description of the Related Art Conventionally, an air conditioner has been used to precisely control the temperature and humidity of an atmosphere in a semiconductor element manufacturing process or the like. For example, Patent Document 1 discloses a cooling unit that cools and dehumidifies air introduced into an air conditioner, a heating unit that heats air that has passed through the cooling unit to a predetermined temperature, and humidifies air that has passed through the heating unit. An air conditioner including a humidifier (humidifier) is disclosed.

  In the air conditioner of Patent Document 1, when the air introduced into the air conditioner is cooled in the cooling unit, water vapor contained in the air is condensed and becomes water droplets and adheres to the cooling unit. Thereby, the air introduced into the air conditioner is cooled and dehumidified. The water droplets adhering to the cooling unit usually fall into a drain pan provided below the cooling unit, and are discharged out of the air conditioner through a drain pipe connected to the drain pan.

Japanese Patent No. 5886463

  Conventionally, in semiconductor element manufacturing facilities, etc., the wastewater from the air conditioner is discharged toward the drain pipe installed below the air conditioner, and flows downward in the drain pipe using gravity. It was discharged outside the semiconductor device manufacturing facility.

  In a semiconductor device manufacturing facility or the like having a plurality of floors, it is ideal that drainage means such as drain pipes are installed on all floors so that drainage from all floors can be discharged outside the facility. However, depending on circumstances such as securing the installation space for the drainage means and installation costs, the drainage means may be installed only on a specific floor among a plurality of floors of the semiconductor element manufacturing facility or the like. That is, the drainage means may not be installed on a certain floor among the plurality of floors.

  By the way, in a semiconductor element manufacturing facility, etc., from the viewpoint of suppressing the enlargement of the facility as a whole and improving the efficiency of the semiconductor element manufacturing process, the semiconductor element manufacturing apparatus is installed on the floor and the air conditioner is installed on the floor. May be considered. However, there are cases where the drainage means is not installed in the downstairs where the air conditioner is to be installed. In such a case, the degree of freedom in selecting the installation location (floor) of the air conditioner can be greatly restricted.

  The present invention has been made in consideration of such points, and an object of the present invention is to provide an air conditioner that can improve the degree of freedom in selecting an installation location.

The air conditioner of the present invention is
An air passage,
A cooler that is disposed in the air passage and cools the air introduced into the air passage and condenses water vapor contained in the air;
A drainage reservoir capable of storing water discharged from the cooler; and
And a pump for discharging water stored in the drainage storage unit.

  In the air conditioner of the present invention, the drainage storage unit may be a drain pan provided below the cooler.

  In the air conditioner of the present invention, the bottom wall of the drainage reservoir may be inclined with respect to a horizontal plane.

  The air conditioning apparatus of the present invention may further include a water level detector that detects the water level in the drainage storage section.

  In the air conditioning apparatus of the present invention, the pump may be a diaphragm pump.

  The air conditioning apparatus of the present invention may further include a humidifier that humidifies the air, and the drainage storage unit may be able to store water discharged from the humidifier.

  ADVANTAGE OF THE INVENTION According to this invention, the air conditioning apparatus which can improve the freedom degree of selection of an installation place can be provided.

FIG. 1 is a diagram for explaining an embodiment according to the present invention, and is a diagram schematically showing an example of a semiconductor element manufacturing facility in which an air conditioner is installed. FIG. 2 is a diagram schematically illustrating an example of an air conditioner. FIG. 3 is a diagram illustrating a humidifier of the air conditioner. FIG. 4 is a diagram illustrating a cooler, a humidifier, and a drainage storage unit of the air conditioner. FIG. 5 is a diagram for explaining the operation timing of the pump for discharging the water stored in the drainage storage unit. FIG. 6 is a view taken along the arrow VI in FIG. 4 and is a cross-sectional view showing an enlarged drainage storage portion. FIG. 7 is a diagram illustrating a cooler, a humidifier, and a drainage storage unit of an air conditioner according to a modification of the present invention.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the drawings attached to the present specification, for the sake of illustration and ease of understanding, the scale, the vertical / horizontal dimension ratio, and the like are appropriately changed and exaggerated from those of the actual ones.

  In addition, as used in the present specification, the shape and geometric conditions and the degree thereof are specified. For example, terms such as “parallel”, “orthogonal”, “identical”, and values of length and angle are strict. Without being bound by meaning, it should be interpreted including the extent to which similar functions can be expected.

  1 to 4 are diagrams for explaining an embodiment according to the present invention. Among these, FIG. 1 is a diagram schematically showing an example of a semiconductor element manufacturing facility in which an air conditioner is installed, FIG. 2 is a diagram schematically showing an example of an air conditioner, and FIG. It is a figure which shows the humidifier of an air conditioning apparatus, and FIG. 4 is a figure which shows the cooler, humidifier, and drainage storage part of an air conditioning apparatus.

  A semiconductor element manufacturing facility 1 shown in FIG. 1 has an upper floor 2 and a lower floor 3. A semiconductor element manufacturing apparatus 7 is installed in the upper part 2 of the semiconductor element manufacturing facility 1, and air for adjusting the temperature and humidity of air and sending it to the semiconductor element manufacturing apparatus 7 in the lower part 3. A harmony device 10 is installed. Here, the upper floor 2 refers to a portion of the upper floor relative to the lower floor 3 and is not only located directly above the lower floor 3 but also shifted in the horizontal direction with respect to the lower floor 3. This includes cases where Further, another space (floor) may be disposed between the upper floor 2 and the lower floor 3. Here, in FIG. 1, drainage means such as a drain pipe leading to the outside of the semiconductor element manufacturing facility 1 is installed in the upper part 2, but drainage means leading to the outside of the semiconductor element manufacturing facility 1 is provided in the lower part 3. A non-installed example is shown. In particular, in the example shown in FIG. 1, the drainage means that leads to the outside of the semiconductor element manufacturing facility 1 is not installed on the floor (not shown) located below the lower floor 3.

  The semiconductor element manufacturing apparatus 7 is an apparatus that performs at least one of the processes for manufacturing a semiconductor element. As an example, the semiconductor element manufacturing apparatus 7 can be configured as an apparatus for performing a semiconductor element pattern forming process. In the pattern formation process of the semiconductor element, first, a photoresist material is applied onto a semiconductor substrate, and then the resist material is exposed through a photomask (reticle) or the like. Here, when the photoresist material is a positive type material, an area to be removed is exposed in the next development step. Further, when the photoresist material is a negative type material, an area to be left in the developing process is exposed. Next, the exposed region or the unexposed region in the resist material is removed with a solvent or the like. Thereby, a resist pattern having a pattern corresponding to the exposure pattern is formed on the semiconductor substrate. Thereafter, the semiconductor substrate is etched by plasma etching or the like using this resist pattern as a mask. Thereby, a semiconductor element having a pattern corresponding to the resist pattern is manufactured.

  In the semiconductor element manufacturing process in the semiconductor element manufacturing apparatus 7, it is required that the temperature and humidity of the atmosphere be precisely controlled. For this reason, the air conditioning apparatus 10 is installed in the semiconductor element manufacturing facility 1, and the air whose temperature and humidity are precisely controlled by the air conditioning apparatus 10 is sent to the semiconductor element manufacturing apparatus 7. In the example shown in FIG. 1, the waste water from the semiconductor element manufacturing apparatus 7 is discharged out of the semiconductor element manufacturing facility 1 through the upper floor drain pipe 4 disposed in the upper floor 2. Here, in the illustrated example, as described above, the drainage means that leads to the outside of the semiconductor element manufacturing facility 1 is not installed in the lower floor 3. Accordingly, the semiconductor element manufacturing facility 1 is provided with a lower floor drain pipe 5 extending from the lower floor 3 to the upper floor 2 and connected to the upper floor drain pipe 4 in the upper floor 2. And the waste_water | drain from the air conditioning apparatus 10 is discharged | emitted out of the semiconductor element manufacturing facility 1 through the lower floor drain pipe 5 and the upper floor drain pipe 4. FIG.

  In the example shown in FIG. 2, the air conditioner 10 includes an air passage 12 that allows air to flow, a cooler 14, a heater 16, and a humidifier 20 that are sequentially provided in the air passage 12. And an air blower 18 for applying a driving force for allowing air to flow in the air passage 12. The air passage 12 has an upstream opening 12 a and a downstream opening 12 b, and the downstream opening 12 b communicates with the blower 18. The blower 18 has a fan (not shown). When the fan is rotated by a drive source such as a motor (not shown), the air in the air passage 12 sucked through the downstream opening 12b is discharged. It discharges toward the blower pipe 19 from the outlet 18a. The air duct 19 extends from the air conditioner 10 to the semiconductor element manufacturing apparatus 7, and the air discharged from the discharge port 18 a of the air conditioner 10 is sent to the semiconductor element manufacturing apparatus 7 through the air duct 19. . The air in the air passage 12 is sucked by the blower 18 through the downstream opening 12b, so that external air is introduced into the air passage 12 through the upstream opening 12a. That is, the upstream opening 12 a functions as an air inlet for introducing external air into the air flow path 12. The upstream opening 12a may be provided with a filter device for removing dust and the like contained in the outside air. Further, in this specification, the “upstream side” refers to the upstream side of the air flow generated in the air passage 12 by the operation of the blower 18, and the “downstream side” refers to the air flow by the operation of the blower 18. It refers to the downstream side of the air flow generated in the passage 12. In FIG. 2, the direction of air flow in the air conditioner 10 is indicated by arrows.

  The cooler 14 is disposed in the air passage 12 and has a function of cooling the air introduced into the air passage 12 and condensing water vapor contained in the air. The cooler 14 of the present embodiment has a variable refrigeration capacity, and as an example, the compressor, the condenser, the expansion valve, and the evaporator are connected by piping in the order so that the heat medium is circulated. It can be an evaporator in the cooling circuit. Note that the cooler 14 does not necessarily have variable refrigeration capacity. The air introduced into the air flow path 12 through the upstream opening 12 a is cooled by contacting the cooler 14 and travels toward the heater 16 located on the downstream side of the cooler 14. When the air introduced into the air passage 12 is cooled by the cooler 14, the water vapor contained in the air is condensed and adheres to the cooler 14 as water droplets. In the present embodiment, water droplets adhering to the cooler 14 fall into a drain pan 41 provided below the cooler 14.

  The heater 16 has a variable heating capacity and has a function of heating the air cooled and dehumidified by the cooler 14. The heater 16 does not necessarily have a variable heating capacity. The heater 16 is provided on the downstream side of the cooler 14 in the air passage 12. The heater 16 can use an electric heater as an example. The heater 16 is not limited to this, and the heater 16 may use at least a part of the heat of the heat medium having a high temperature in the above-described cooling circuit. The air that has passed through the cooler 14 comes into contact with the heater 16 and is heated. At this time, since the saturated water vapor amount of the air heated by the heater 16 increases, the humidity which is the ratio of the water vapor amount actually contained to the saturated water vapor amount decreases.

  Next, the humidifier 20 will be described with reference to FIGS. 2 and 3. The humidifier 20 is provided in order to humidify the air that has been heated by the heater 16 and has decreased humidity. For this reason, the humidifier 20 is disposed on the downstream side of the heater 16. In particular, in the example shown in FIG. 2, the humidifier 20 is disposed so as to be positioned between the heater 16 and the downstream opening 12b. In the example shown in FIG. 3, the humidifier 20 is opened in the air flow path 12 upward and is stored in the storage tank 22 and the storage tank 22. A heater 24 for heating water and a water level detector 26 for detecting the height of the water level in the storage tank 22 are provided.

  The storage tank 22 is a container that stores water used for humidifying air. The storage tank 22 has a box-like shape with an open upper surface, and is formed of a plate material such as stainless steel. In the example shown in FIG. 2, a part of the storage tank 22 is configured to protrude to the outside of the air flow path 12. It may be housed inside.

  The heater 24 is, for example, an electric heater, and is used to generate water vapor by heating water in the storage tank 22. The heater 24 is configured such that the amount of heating thereof can be adjusted, and the amount of water vapor generated from the water stored in the storage tank 22 can be adjusted. Thereby, the humidity of the air flowing through the air passage 12 can be adjusted to a desired humidity.

  A supply pipe 32 for supplying water into the storage tank 22 is connected to the storage tank 22. A supply valve 33 is provided in the middle of the supply pipe 32. The supply pipe 32 is connected to a water supply source (not shown) at an end opposite to the end connected to the storage tank 22, and is opened from the supply source via the supply pipe 32 by opening the supply valve 33. By supplying water into the storage tank 22 and closing the supply valve 33, the supply of water from the supply source into the storage tank 22 can be stopped. As the supply valve 33, an electromagnetic valve can be used as an example.

  The water surface detector 26 is a float switch, for example, and is used to detect the height of the water surface in the storage tank 22. When the water level detector 26 detects that the water level in the storage tank 22 is lower than a certain height, the supply valve 33 is opened by a control device (not shown), and the supply source 33 enters the storage tank 22. The supply of water is started. Thereby, the height of the water surface in the storage tank 22 rises. When the water level detector 26 detects that the water level in the storage tank 22 has reached a predetermined height, the control valve closes the supply valve 33 and the water from the supply source to the storage tank 22 is detected. Is stopped. Thereby, the height of the water surface in the storage tank 22 can always be maintained within a predetermined range.

  A drainage pipe 34 for discharging the water in the storage tank 22 is connected to the storage tank 22. A drain valve 35 is provided in the middle of the drain pipe 34. The drain pipe 34 is connected to a drain pipe 46 described later at an end opposite to the end connected to the storage tank 22, and the drain pipe 34 and the first drain pipe 46 are opened by opening the drain valve 35. By discharging water from the storage tank 22 to the drainage storage section 40 via the portion 461 and closing the drainage valve 35, the discharge of water from the storage tank 22 to the drainage storage section 40 can be stopped. As the drain valve 35, for example, a manual switching valve or an electromagnetic valve can be used. In order to perform maintenance of the humidifier 20, to prevent the water in the storage tank 22 from deteriorating when the operation is stopped for a long time, or for other reasons, the drain valve 35 is used. By opening the water, water can be discharged from the storage tank 22 to the drainage storage part 40 via the drainage pipe 34 and the first portion 461.

  Further, in the example shown in FIGS. 3 and 4, an overflow pipe 38 is connected to the storage tank 22. The overflow pipe 38 opens at one end above the water level detector 26 in the storage tank 22 and is connected to the middle of the drain pipe 34 at the other end. In particular, in the illustrated example, the overflow pipe 38 is connected at the other end to the downstream side of the drain valve 35 of the drain pipe 34, that is, to the side opposite to the storage tank 22 with respect to the drain valve 35. In this case, the water flowing into the overflow pipe 38 from the storage tank 22 goes to the drainage storage unit 40 without passing through the drainage valve 35.

  In the humidifier 20, when the supply of water into the storage tank 22 is not stopped due to a failure of the supply valve 33 or the water level detector 26, the water overflows from the storage tank 22 and this water enters the surrounding apparatus. As a result, there is a risk of causing a malfunction of the apparatus. In order to prevent such a problem, in the humidifier of the present embodiment, an overflow pipe 38 serving as an overflow channel is connected to the storage tank 22, and a failure of the supply valve 33 and the water surface detector 26, etc. When the height of the liquid level in the storage tank 22 becomes higher than a predetermined range, the storage tank 22 passes through the overflow pipe 38, the drain pipe 34, and a first portion 461 of the drain pipe 46 described later. The water inside is discharged to the drainage storage section 40 described later. As a result, even when the supply of water into the storage tank 22 is not stopped due to a failure of the supply valve 33 or the water level detector 26, the water overflows from the storage tank 22, and this water flows into the surrounding apparatus. It is possible to prevent intrusion into the apparatus and cause problems of the apparatus, and to impart operational stability to the air conditioner 10.

  Next, the drainage storage unit 40 will be described. The drainage storage unit 40 is provided to store the water discharged from the cooler 14. In particular, in the example shown in FIG. 4, the drainage storage unit 40 is configured to store not only the water discharged from the cooler 14 but also the water discharged from the humidifier 20. In other words, the illustrated drainage storage unit 40 is provided so as to store water discharged from the cooler 14 and water discharged from the humidifier 20. In the illustrated example, the drainage reservoir 40 is configured as a drain pan 41 provided below the cooler 14. A drainage pipe 46 for discharging water stored in the drainage storage unit 40 is connected to the drainage storage unit 40 (drain pan 41). In the illustrated example, the air conditioner 10 has a pump P for discharging the water stored in the drainage storage unit 40, and the drainage pipe 46 includes an end connected to the drainage storage unit 40, and The opposite end is connected to the pump P. In the illustrated example, a drain pipe 34 for discharging water in the storage tank 22 of the humidifier 20 is connected to the drain pipe 46 at a connection portion 48 located in the middle part of the drain pipe 46. Accordingly, the drain pipe 46 has a first portion 461 extending from the drainage reservoir 40 to the connecting portion 48 and a second portion 462 extending from the connecting portion 48 to the pump P. As described above, the water droplets adhering to the cooler 14 fall into the drainage reservoir 40 provided below the cooler 14 and are stored in the drainage reservoir 40. In addition, the water discharged from the storage tank 22 of the humidifier 20 passes through the drain pipe 34 and the drain pipe 46 (first part 461) or the overflow pipe 38, the drain pipe 34 and the drain pipe 46 (first part). 461) flows into the drainage storage section 40 and is stored.

  The pump P is used to discharge the water stored in the drainage storage unit 40 to the outside of the air conditioner 10. As the pump P, for example, a diaphragm pump or a motor pump can be used. Among these, as the motor-type pump, for example, a pump having a mechanical seal or a magnet pump can be used. In the example shown in FIG. 1, the pump P has an output capable of pumping the water stored in the drainage storage unit 40 from the lower floor 3 where the air conditioner 10 is installed to the upper floor 2. Preferably it is. Since the air conditioner 10 has such a pump P, a drainage means leading to the outside of the semiconductor element manufacturing facility 1 is installed in the upper floor 2, and the lower floor 3 in which the air conditioner 10 is installed. Even if this drainage means is not installed, the water stored in the drainage storage unit 40 is pumped up to the upper floor 2 where the drainage means is installed, and the drainage means installed in the upper floor 2 is used to pump up the water. It can be discharged out of the semiconductor device manufacturing facility 1. Therefore, it becomes possible to install the air conditioner 10 on the floor in the semiconductor element manufacturing facility 1 where the drainage means leading to the outside of the semiconductor element manufacturing facility 1 is not installed. Thereby, the freedom degree of selection of the installation place of the air conditioning apparatus 10 can be improved.

  In the example shown in FIG. 4, water level detectors 44 and 45 that detect the water level in the drainage storage unit 40 are provided in the drainage storage unit 40. In particular, in the illustrated example, a low water level detector 44 provided relatively below and a high water level detector 45 provided relatively above are provided in the drainage reservoir 40. For example, float switches can be used as the water surface detectors 44 and 45.

  In the illustrated example, the drain pipe 46 (second portion 462) and the lower floor drain pipe 5 are connected by a pump P. Then, by operating the pump P, the water in the drainage reservoir 40 is sent out toward the lower floor drainage pipe 5. In the present embodiment, the pump P is operated based on the detection of the water surface by each of the water surface detectors 44 and 45, whereby the water in the drainage storage unit 40 is discharged.

  The high water level detector 45 is provided below the lower end of the upstream side opening 12 a of the air passage 12, that is, at a lower position. In this case, by operating the pump P based on the detection of the water level by the high water level detector 45 and discharging the water in the drainage reservoir 40, the drainage reservoir from the upstream opening 12a of the air passage 12 is obtained. It is possible to prevent the water in 40 from overflowing. Moreover, it is preferable that the low water level detector 44 is provided so that the water level can be detected at a position as low as possible in the drainage reservoir 40.

  The operation of the pump P based on the detection of the water level by the water level detectors 44 and 45 will be described in detail with reference to FIG. When water is not stored in the drainage storage unit 40, the water level detectors 44 and 45 do not detect the water level, and the pump P does not operate. When the water level discharged from the cooler 14 and / or the water discharged from the humidifier 20 flows into the drainage storage unit 40 and the water level in the drainage storage unit 40 rises, the water level is first detected by the low water level detector 44. Is detected (time A). When the water level in the drainage reservoir 40 further rises, the high water level detector 45 then detects the water level (time B). When a control unit (not shown) receives a signal indicating that the water surface has been detected from the high water level detector 45, the control unit operates the pump P and passes the water in the drainage storage unit 40 to the lower floor drainage pipe 5 via the drainage pipe 46. Discharge towards. When the water level in the drainage reservoir 40 is lowered by the operation of the pump P, the high water level detector 45 does not detect the water level (time C). Here, the control unit continues the operation of the pump P even if the high water level detector 45 does not detect the water level. When the water level in the drainage storage unit 40 further falls, the low water level detector 44 does not detect the water level. When the control unit receives a signal indicating that the water level is no longer detected from the low water level detector 44 or when the signal indicating that the water level is detected from the low level water detector 44 is interrupted, the control unit stops the pump P ( Time D). Thereby, in the air conditioning apparatus 10 of this Embodiment, when the water surface in the waste_water | drain storage part 40 reaches predetermined | prescribed high level, drainage from the waste water storage part 40 is started, and the water surface in the waste-water storage part 40 is The drainage of the water stored in the drainage storage unit 40 is controlled so that drainage from the drainage storage unit 40 is stopped when a predetermined low level is reached. Here, the predetermined low level refers to a position relatively lower than the predetermined high level.

  FIG. 6 is a view taken along the arrow VI in FIG. 4 and is a cross-sectional view showing the drainage reservoir 40 in an enlarged manner. In FIG. 6, the area | region corresponding to the upstream opening 12a of the air flow path 12 is shown with the broken line.

In the example shown in FIG. 6, the drainage reservoir 40 (drain pan 41) includes a bottom wall 42 and a side wall 43 that rises from the periphery of the bottom wall 42. In the illustrated example, the bottom wall 42 is inclined with respect to the horizontal plane so that one side (the right side in FIG. 6) in the width direction (the left-right direction in FIG. 6) is low. The drain pipe 46 (first portion 461) is open toward the drainage storage section 40 in the vicinity of one end of the bottom wall 42 in the width direction. Here, the vicinity of one end in the width direction of the bottom wall 42 is only 1/10 of the width W ₄₂ of the bottom wall 42 along the width direction from the end on the one side in the width direction of the bottom wall 42. Refers to the area up to the inside. Since the bottom wall 42 is inclined with respect to the horizontal plane, the water stored in the drainage storage part 40 flows toward one side in the width direction, that is, toward the drainage pipe 46 opened in the bottom wall 42. Thus, drainage from the drainage reservoir 40 can be performed quickly.

Height H ₄₂ from the lowest part to the highest part in the bottom wall 42 (in the example shown in FIG. 6, the end part on one side in the width direction of the bottom wall 42 to the other part (left side in FIG. 6)) The ratio (H ₄₂ / W ₄₂ ) of the height H ₄₂ ) to the width W ₄₂ of the bottom wall 42 can be, for example, 1/200 or more and 1/20 or less. When H ₄₂ / W ₄₂ is 1/200 or more, an appropriate inclination can be imparted to the bottom wall 42, so that drainage from the drainage reservoir 40 can be performed more quickly. Further, when the H _{42 /} W ₄₂ is 1/20 or less, it is possible to suppress the height of the drain reservoir 40, waste water reservoir 40 can be effectively prevented from upsizing.

  In the example shown in FIG. 6, both the water surface detectors 44 and 45 are provided above the vicinity of one end of the bottom wall 42 in the width direction. As the bottom wall 42 is inclined with respect to the horizontal plane so that one side in the width direction is lowered, the depth from the water surface of the water stored in the drainage storage section 40 to the bottom wall 42 is the width direction. It becomes deeper as it goes to one side of the. In the illustrated example, the water level detectors 44 and 45 are provided in a region where the depth of water stored in the drainage storage unit 40 is relatively deep. Since the water surface in the drainage storage section 40 is waved by vibrations generated in the air conditioner 10, the detection of the water surface by the water surface detectors 44 and 45 may become unstable due to this wave, so the influence of the wave is small. By providing the water surface detectors 44 and 45 in the deep water region, the water surface detectors 44 and 45 can detect the water surface while minimizing the influence of the waves. Therefore, the water level detection by the water level detectors 44 and 45 can be performed stably. Further, the lower water level detector 44 is provided above the vicinity of one end of the bottom wall 42 in the width direction, that is, the depth of water stored in the drainage storage unit 40 is relatively deep. By providing in the area, the amount of water remaining in the drainage reservoir 40 can be reduced when drainage by the pump P is completed (time D in FIG. 5). Thereby, the quantity of the water which can be discharged | emitted at once by the pump P increases, and the frequency | count of operation of the pump P can be decreased. Therefore, the amount of energy consumed by the pump P can be effectively reduced.

In the illustrated example, a gap is formed between the end of the cooler 14 in the width direction and the side wall 13 of the air passage 12. The width of the gap, i.e. the distance W _a along the width direction between the side wall 13 in the width direction of the end portion and the air flow path 12 of the cooler 14, as an example, be a 100mm or 200mm or less it can.

The width W _{42 of the} bottom wall 42 is preferably the same as the width W ₁₄ of the cooler 14 along the width direction or larger than the width W ₁₄ of the cooler 14. If the bottom wall 42 has such a width, water drops falling from the cooler 14 can be collected more reliably.

  The air conditioner 10 according to the present embodiment is disposed in the air flow path 12 and the air flow path 12, and cools the air introduced into the air flow path 12 and is contained in the air. A cooler 14 that condenses the water, a drainage storage unit 40 that can store water discharged from the cooler 14, and a pump P that discharges the water stored in the drainage storage unit 40.

  According to such an air conditioner 10, drainage means that leads to the outside of the semiconductor element manufacturing facility 1 is installed in the upper floor 2, and this drainage means is installed in the lower floor 3 where the air conditioner 10 is installed. Even if not, the water stored in the drainage storage unit 40 is pumped up to the upper floor 2 where the drainage means is installed, and the drainage means installed in the upper floor 2 passes through the drainage means installed outside the semiconductor element manufacturing facility 1. Can be discharged. Therefore, it becomes possible to install the air conditioner 10 on the floor in the semiconductor element manufacturing facility 1 where the drainage means leading to the outside of the semiconductor element manufacturing facility 1 is not installed. Thereby, the freedom degree of selection of the installation place of the air conditioning apparatus 10 can be improved.

  In the air conditioner 10 of the present embodiment, the drainage storage unit 40 is a drain pan 41 provided below the cooler 14.

  According to such an air conditioner 10, since the drain pan 41 can be used as the drainage storage part 40, the increase in the number of parts which comprise the air conditioner 10, and the enlargement of the air conditioner 10 are suppressed. Can do.

  In the air conditioner 10 according to the present embodiment, the bottom wall 42 of the drainage reservoir 40 is inclined with respect to the horizontal plane.

  According to such an air conditioner 10, the water stored in the drainage storage unit 40 flows along the slope of the bottom wall 42, so that the drainage from the drainage storage unit 40 can be performed quickly.

  The air conditioning apparatus 10 according to the present embodiment further includes water surface detectors 44 and 45 that detect the water surface in the drainage reservoir 40.

  According to such an air conditioner 10, the water in the drainage reservoir 40 can be discharged based on the detection of the water surface by the water surface detectors 44 and 45. Therefore, the drainage from the drainage storage unit 40 can be automated.

  The air conditioner 10 of the present embodiment further includes a humidifier 20 that humidifies the air, and the drainage storage unit 40 can store water discharged from the humidifier 20.

  According to such an air conditioner 10, the drainage storage unit 40 can store not only the water discharged from the cooler 14 but also the water discharged from the humidifier 20. The discharged water can be discharged out of the air conditioner 10 together with the water discharged from the cooler 14 without depending on the manual work of the worker. That is, it becomes possible to automate the drainage operation of the water discharged from the humidifier 20, and the labor of the worker can be reduced. Moreover, compared with the case where the exclusive discharge means for discharging the water discharged | emitted from the humidifier 20 out of the air conditioning apparatus 10 is provided, the increase in the number of parts which comprise the air conditioning apparatus 10, and the air conditioning apparatus 10 An increase in size can be suppressed.

  Note that various modifications can be made to the above-described embodiment. Hereinafter, modified examples will be described with reference to the drawings as appropriate. In the following description and the drawings used in the following description, the same reference numerals as those used for the corresponding parts in the above embodiment are used for the parts that can be configured in the same manner as in the above embodiment. A duplicate description is omitted.

  A modification of the air conditioner 10 will be described with reference to FIG. FIG. 7 is a diagram showing the cooler 14, the humidifier 20, and the drainage storage unit 40 of the air conditioner 10 according to this modification.

  In the above-described embodiment, the drain pan 41 is used as the drainage reservoir 40. However, in this modification, the drainage reservoir 40 separate from the drain pan 41 is provided. In the illustrated example, the drainage storage unit 40 is configured as a storage tank 51 provided below the drain pan 41. The location where the storage tank 51 is disposed is not limited to the position below the drain pan 41. The drain pan 41 is connected to a drain pipe 47 for discharging water droplets falling into the drain pan 41 to the storage tank 51. The drain pipe 47 is connected to the storage tank 51 at the end opposite to the end connected to the drain pan 41. In the illustrated example, a drain pipe 34 for discharging water in the storage tank 22 of the humidifier 20 is connected to the drain pipe 47 at a connection portion 49 located at an intermediate portion of the drain pipe 47. Accordingly, the drain pipe 47 has a first portion 471 extending from the drain pan 41 to the connection portion 49 and a second portion 472 extending from the connection portion 49 to the storage tank 51. Water droplets adhering to the cooler 14 fall into the drain pan 41 provided below the cooler 14, and flow into the storage tank 51 through the drain pipe 47 and are stored. In addition, the water discharged from the storage tank 22 of the humidifier 20 passes through the drain pipe 34 and the drain pipe 47 (second part 472) or the overflow pipe 38, the drain pipe 34 and the drain pipe 47 (second part). 472) flows into the storage tank 51 and is stored.

  A drainage pipe 52 for discharging water stored in the storage tank 51 toward the pump P is connected to the storage tank 51. The drain pipe 52 is connected to the pump P at the end opposite to the end connected to the storage tank 51. Since the operation of the pump P is the same as that of the above-described embodiment, the description thereof is omitted.

  In the air conditioner 10 of the present modification, the drainage storage unit 40 includes a storage tank 51 that can store the water discharged from the cooler 14 and the water discharged from the humidifier 20.

  According to such an air conditioner 10, the storage tank 51 of the drainage storage unit 40 can be arranged without being limited to the lower side of the cooler 14, so that the degree of freedom in designing the air conditioner 10 is effectively improved. be able to.

  As another modification, when the pump P is a diaphragm pump, the following advantages are obtained. Diaphragm pumps have a known discharge amount for each model for each discharge. Further, when the water surface is detected by the high water level detector 45, the amount of water stored in the drainage storage unit 40 is substantially constant. Therefore, in the above-described embodiment, after the water level is detected by the high water level detector 45, the amount of water estimated that the pump P is stored in the drainage storage unit 40 is directed to the lower floor drainage pipe 5. By setting the operation time or the number of operations of the pump P so as to stop after discharging, the low water level detector 44 can be omitted.

  In the air conditioner 10 of this modification, the pump P is a diaphragm type pump.

  According to such an air conditioner 10, it is possible to omit the installation of the low water level detector 44, so that the number of parts constituting the air conditioner 10 is reduced and the cost of the air conditioner 10 is reduced. be able to.

  As yet another modification, the above-described embodiment has described the example in which the bottom wall 42 is inclined with respect to the horizontal plane so that one side in the width direction of the air passage 12 is lowered. However, the bottom wall 42 may be inclined with respect to the horizontal plane so that one side in the depth direction of the air passage 12 (direction perpendicular to the paper surface of FIG. 6) is lowered. The bottom wall 42 may be inclined with respect to the horizontal plane in both the width direction and the depth direction of the air passage 12.

  In addition, although the some modification with respect to embodiment mentioned above was demonstrated above, naturally, it is also possible to apply combining several modifications suitably.

DESCRIPTION OF SYMBOLS 1 Semiconductor element manufacturing facility 7 Semiconductor element manufacturing apparatus 10 Air conditioning apparatus 12 Air flow path 14 Cooler 16 Heater 18 Blower 20 Humidifier 22 Reservoir 24 Heater 26 Water surface detector 34 Drain pipe 38 Overflow pipe 40 Drain storage part 41 Drain pan 42 Bottom wall 43 Side wall 44 Low water level detector 45 High water level detector 46 Drain pipe 47 Drain pipe 51 Storage tank P Pump

Claims (6)

An air passage,
A cooler that is disposed in the air passage and cools the air introduced into the air passage and condenses water vapor contained in the air;
A drainage reservoir capable of storing water discharged from the cooler; and
An air conditioner comprising: a pump that discharges water stored in the drainage storage unit.   The air conditioning apparatus according to claim 1, wherein the drainage storage unit is a drain pan provided below the cooler.   The air conditioning apparatus according to claim 1 or 2, wherein a bottom wall of the drainage storage unit is inclined with respect to a horizontal plane.   The air conditioning apparatus according to any one of claims 1 to 3, further comprising a water surface detector that detects a water surface in the drainage storage unit.   The air conditioner according to claim 4, wherein the pump is a diaphragm type pump. A humidifier for humidifying the air;
The air conditioning apparatus according to any one of claims 1 to 5, wherein the drainage storage unit is capable of storing water discharged from the humidifier.

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