JP2018135539A5 - Thermal conductive adhesive tape - Google Patents
Thermal conductive adhesive tape Download PDFInfo
- Publication number
- JP2018135539A5 JP2018135539A5 JP2018108819A JP2018108819A JP2018135539A5 JP 2018135539 A5 JP2018135539 A5 JP 2018135539A5 JP 2018108819 A JP2018108819 A JP 2018108819A JP 2018108819 A JP2018108819 A JP 2018108819A JP 2018135539 A5 JP2018135539 A5 JP 2018135539A5
- Authority
- JP
- Japan
- Prior art keywords
- adhesive tape
- conductive adhesive
- heat conductive
- adhesive layer
- tape according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002390 adhesive tape Substances 0.000 title claims 6
- 239000000853 adhesive Substances 0.000 claims 3
- 230000001070 adhesive Effects 0.000 claims 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims 2
- 239000011231 conductive filler Substances 0.000 claims 2
- 229920000058 polyacrylate Polymers 0.000 claims 2
- 238000010526 radical polymerization reaction Methods 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000003431 cross linking reagent Substances 0.000 claims 1
- 125000000524 functional group Chemical group 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
Claims (5)
前記粘着剤層の厚みが1〜20μmである
ことを特徴とする熱伝導性粘着テープ。 It possesses living radical polymerization resulting molecular weight distribution and (Mw / Mn) 1.05~2.5 acrylic polymer, a pressure-sensitive adhesive layer containing a heat conductive filler,
The thickness of the said adhesive layer is 1-20 micrometers, The heat conductive adhesive tape characterized by the above-mentioned .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018108819A JP6564499B2 (en) | 2018-06-06 | 2018-06-06 | Thermal conductive adhesive tape |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018108819A JP6564499B2 (en) | 2018-06-06 | 2018-06-06 | Thermal conductive adhesive tape |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014239053A Division JP6352159B2 (en) | 2014-11-26 | 2014-11-26 | Thermally conductive adhesive tape and thermally conductive adhesive composition |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2018135539A JP2018135539A (en) | 2018-08-30 |
JP2018135539A5 true JP2018135539A5 (en) | 2019-04-18 |
JP6564499B2 JP6564499B2 (en) | 2019-08-21 |
Family
ID=63365389
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018108819A Active JP6564499B2 (en) | 2018-06-06 | 2018-06-06 | Thermal conductive adhesive tape |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6564499B2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109468087B (en) * | 2018-10-26 | 2021-02-05 | 遵义春华新材料科技有限公司 | Heat-conducting adhesive and preparation method thereof |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011162586A (en) * | 2010-02-04 | 2011-08-25 | Sekisui Chem Co Ltd | Double-sided adhesive sheet |
JP2012172128A (en) * | 2011-02-24 | 2012-09-10 | Kuraray Co Ltd | Anisotropic conductive adhesive film |
-
2018
- 2018-06-06 JP JP2018108819A patent/JP6564499B2/en active Active
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