JP2018132194A - Diaphragm valve, fluid control device, semiconductor control apparatus, and semiconductor control method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a diaphragm valve capable of increasing a flow rate without causing a deterioration in durability of the miniaturized diaphragm valve, a fluid control device comprising the diaphragm valve like this, a semiconductor manufacturing apparatus comprising the fluid control device, and a semiconductor manufacturing method using the semiconductor manufacturing apparatus.SOLUTION: A counterbore 15 is provided to include a part opened in a bottom surface 14 of a recess 2c of a fluid outflow passage 2b, in a flat part 14b of the bottom surface 14 of the recess 2c of a body 2.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a diaphragm valve, a fluid control device, a semiconductor manufacturing device, and a semiconductor manufacturing method, and is particularly suitable for use in a gas supply unit of a semiconductor manufacturing device and contributes to downsizing of the entire device while maintaining a necessary flow rate. The present invention relates to a miniaturized diaphragm valve, a fluid control apparatus including such a diaphragm valve, a semiconductor manufacturing apparatus including the fluid control apparatus, and a semiconductor manufacturing method using the semiconductor manufacturing apparatus.

  As a gas supply unit (fluid control device) in a semiconductor manufacturing apparatus (CVD, etching apparatus, etc.), for example, the one shown in FIG. 7 is conventionally known (Patent Document 1).

  In FIG. 7, one line (C) of the fluid control device is composed of a plurality of upper members and a plurality of lower members. The upper members include a check valve (21), a pressure regulator (22), and a pressure sensor (23). An inverted V-shaped passage block (24), a circuit breaker (25), a mass flow controller (26), an on-off valve (27), an inverted V-shaped passage block (28), and a filter (29), As a lower member, in order from the left, an L-shaped passage block joint (32) connected to the check valve (21) and fitted with an inlet joint (31), a check valve (21) and a pressure regulator (22) V-shaped passage block joint (33) that communicates with the pressure regulator, V-shaped passage block joint (33) that communicates the pressure regulator (22) and the pressure sensor (23), and the reverse V-shape with the pressure sensor (23). V-shaped passage block joint (33) communicating with the V-shaped passage block (24) and reverse V-shaped passage block (24) A V-shaped passage block joint (33) communicating with the release device (25), a V-shaped passage block joint (33) communicating with the circuit breaker (25) and the mass flow controller (26), and a mass flow controller ( 26) and a V-shaped passage block joint (33) communicating with the on-off valve (27), and a V-shaped passage block joint (33) communicating between the on-off valve (27) and the inverted V-shaped passage block (28). ), A V-shaped passage block joint (33) communicating the inverted V-shaped passage block (28) and the filter (29), and an L connected to the filter (29) and attached to the outlet joint (34). A character-shaped passage first block joint (32) is arranged.

  Various joint members (31) (32) (33) (34) as lower members are placed on one elongated sub-board (40), and these lower members (31) (32) (33) ( 34) Various fluid control devices (21), (22), (23), (24), (25), (26), (27), (28), and (29) as upper members are attached to one line (C ) Is formed, and a plurality of lines having a configuration similar to this line (C) are arranged in parallel on the main board (20), and the circuit breakers (25) of each line (C) are The fluid control device is formed by connecting by three passage connecting means (50) comprising three I-shaped passage block joints (51) and a tube (52) connecting the I-shaped passage block joints (51). The

  The semiconductor manufacturing process is performed in a clean room in order to prevent pattern defects due to particle intervention. The initial cost and the running cost at the time of construction increase in proportion to the increase in the volume of the clean room. An increase in running cost or the like leads to an increase in manufacturing cost. Therefore, in a semiconductor manufacturing apparatus that is permanently used in a clean room, downsizing of the entire apparatus is an issue, and therefore downsizing is also a major issue in a fluid control device used in a semiconductor manufacturing apparatus. .

  As a miniaturized diaphragm valve, Patent Document 2 discloses a body provided with a fluid inflow passage, a fluid outflow passage, and a recess opening upward, and a seat disposed at the periphery of the fluid inflow passage formed in the body. An elastically deformable spherical shell diaphragm that opens and closes the fluid inflow passage by being pressed and separated from the seat, a holding adapter that holds the outer peripheral edge of the diaphragm between the bottom surface of the recess of the body, and the diaphragm What is provided with the diaphragm pressing which presses the center part of this, and the up-and-down moving means which moves a diaphragm pressing up and down is disclosed.

  In the diaphragm valve, since the diaphragm is greatly deformed each time the opening / closing operation is performed, it is important to improve its durability.

  When the diaphragm valve is miniaturized, the diaphragm is also miniaturized. Accordingly, the space width between the seat and the diaphragm is narrowed, so that the flow rate is reduced. If the space width between the sheet and the diaphragm is increased in order to prevent the flow rate from decreasing, the stroke of the diaphragm increases, resulting in a problem that the durability of the diaphragm decreases.

  Therefore, in the one of Patent Document 2, the pressing adapter has a tapered shape whose entire lower surface has a predetermined inclination angle, and the bottom surface of the recess of the body is connected to the circular flat portion and the outer periphery of the flat portion. The diaphragm has a recessed portion recessed with respect to the flat portion, and the diaphragm is in contact with the tapered lower surface of the holding adapter when the fluid passage is open, And the taper angle of the lower surface of the pressing adapter is set to 15.5 to 16 .5 with respect to the flat portion of the bottom surface of the recessed portion of the body. The durability is improved by setting the radius of curvature of the surface abutting on the diaphragm holding diaphragm to 10.5 to 12.5 mm.

JP 2006-83959 A JP 2014-9765 A

  As described above, in various semiconductor manufacturing apparatuses, downsizing is an issue. Therefore, downsizing of diaphragm valves used in the gas supply unit is also required.

  When the diaphragm valve is downsized, the improvement of durability becomes a problem, and when it is attempted to improve the durability, a problem of improving the flow rate occurs. According to the small diaphragm valve of Patent Document 2, although the durability is improved, there is a problem that the flow rate is greatly reduced and the flow rate is increased.

  An object of the present invention is to provide a diaphragm valve capable of increasing the flow rate without causing a decrease in the durability of a miniaturized diaphragm valve.

  Another object of the present invention is to provide a fluid control device provided with such a diaphragm valve, a semiconductor manufacturing device provided with the fluid control device, and a semiconductor manufacturing method using the semiconductor manufacturing device.

  A diaphragm valve according to the present invention includes a fluid inflow passage, a fluid outflow passage, a body provided with an upwardly opened recess, a seat disposed at the periphery of the fluid inflow passage formed in the body, and a pressing / separation to the seat. Elastically deformable spherical shell diaphragm that opens and closes the fluid inflow passage, a holding adapter that holds the outer peripheral edge of the diaphragm between the bottom surface of the recessed portion of the body, and a diaphragm that presses the center of the diaphragm In the diaphragm valve having a presser and a vertically moving means for moving the diaphragm presser up and down, the flat part of the bottom surface of the body recess includes a groove opening so as to include a portion opened to the bottom surface of the recess of the fluid outflow passage. Is provided.

  The fluid flowing in from the fluid inflow passage flows into a space surrounded by the bottom surface of the recess of the body and the diaphragm, and flows out to the outside through the fluid outflow passage.

  The holding adapter has a tapered shape whose entire lower surface has a predetermined inclination angle, and the bottom surface of the recessed portion of the body is continuous with the circular flat part and the outer periphery of the flat part and is recessed with respect to the flat part. The diaphragm has a recess, and the diaphragm has an upper surface of the outer peripheral edge that is in surface contact with the tapered lower surface of the holding adapter and a lower surface of the outer peripheral edge is the bottom surface of the recess of the body when the fluid passage is open. It is preferable to be in line contact with the outer periphery of the flat portion.

  In this way, in the diaphragm, the upper surface of the outer peripheral edge of the diaphragm is in surface contact with the lower surface of the pressing adapter in a state where the fluid passage is open (usually in a spherical shell shape convex upward). Thus, the deformation from the spherical shell shape, which is a natural state, can be suppressed to be small. And since the lower surface of the outer peripheral edge of the diaphragm is in line contact with the outer periphery of the flat portion of the bottom surface of the recess of the body, the diaphragm is in a natural state even when held by the holding adapter and the body. The state where the deformation from the spherical shell shape is suppressed to be small is maintained. That is, since there is no flat part that cannot be deformed and bends against the spherical shell part at the outer peripheral edge of the spherical shell diaphragm that is elastically deformed, it is avoided that stress is partially concentrated. The deformation of the diaphragm is optimized, and the durability of the diaphragm is improved.

  Here, in order to improve the durability of the diaphragm, it is preferable to suppress the height (stroke) of the diaphragm. However, if the stroke is reduced, the flow rate is reduced, so that the flow rate is not changed without changing the shape of the diaphragm. Is desired to increase.

  Therefore, in the diaphragm valve of the present invention, the flat portion of the bottom surface of the body recess is provided with a groove so as to include a portion opened to the bottom surface of the recess of the fluid outflow passage. Thereby, the inlet area of the fluid outflow passage can be increased, and the flow rate can be increased without changing the shape of the diaphragm.

  The groove is provided so as to leave a flat portion outer periphery for supporting the outer peripheral edge of the diaphragm. The inner circumference of the groove may not cover the sheet (the groove becomes an annular groove) or may include a portion holding the sheet (the groove becomes a so-called “spot”). In the case of an annular groove, the height of the part holding the sheet is the same as the height of the outer periphery of the flat part for supporting the outer peripheral edge of the diaphragm, and in the case of a spot, the part holding the sheet The height is reduced by the amount of counterbore.

  The cross-sectional shape of the fluid outflow passage is usually a circular hole, and the diameter is set according to the diameter of the fluid inflow passage, the space width between the seat and the diaphragm, and the like.

  The cross-sectional shape of the fluid outflow passage may be a long hole instead of a circle. For example, when the cross-sectional area is increased, a cross-sectional area that cannot be obtained with a circular one can be obtained by using a long hole.

  The diaphragm valve may be a manual valve such as an open / close handle as the vertical movement means, or an automatic valve in which the vertical movement means is an appropriate actuator. In the case of the automatic valve, the actuator is a fluid (air) It may be by pressure or by electromagnetic force.

  In this specification, the moving direction of the stem of the diaphragm valve is referred to as the vertical direction, but this direction is convenient, and in actual mounting, the vertical direction is not only the vertical direction. , Sometimes horizontal.

  The fluid control device according to the present invention is a fluid control device including an on-off valve as a fluid control device, and the on-off valve is the above-described diaphragm valve.

  The above diaphragm valve can be downsized while maintaining the required flow rate, and by using this as an on-off valve of the fluid control device, a downsized fluid control device can be obtained.

  Such a fluid control device can contribute to miniaturization of a semiconductor manufacturing apparatus by being used in a semiconductor manufacturing apparatus.

  The semiconductor manufacturing apparatus according to the present invention is characterized in that the fluid control apparatus is provided as a gas supply unit.

  The fluid control device is miniaturized by using the diaphragm valve, and a semiconductor manufacturing apparatus equipped with such a fluid control device as a gas supply unit is miniaturized. .

  The semiconductor manufacturing apparatus may be a CVD apparatus, a sputtering apparatus, or an etching apparatus.

  A semiconductor manufacturing method according to the present invention is characterized in that a semiconductor is manufactured using the semiconductor manufacturing apparatus described above.

  By using a miniaturized semiconductor manufacturing apparatus, the installation area in the clean room is reduced, the running cost (manufacturing cost) of the clean room is reduced, and a semiconductor obtained by a cheaper manufacturing method can be obtained.

  According to the diaphragm valve of the present invention, since the groove is provided in the flat portion of the bottom surface of the body recess so as to include the portion opened to the bottom surface of the recess of the fluid outflow passage, the diaphragm can be downsized. The flow rate can be increased without reducing the durability of the valve.

1A and 1B are diagrams showing a first embodiment of a diaphragm valve according to the present invention, in which FIG. 1A is a longitudinal sectional view of an essential part, and FIG. 1B is a plan view of FIG. 1A with the diaphragm removed. . FIG. 2 is a diagram showing dimensions of each part of the diaphragm valve according to the first embodiment, and corresponds to FIG. 6. FIGS. 3A and 3B are diagrams showing a second embodiment of the diaphragm valve according to the present invention, in which FIG. 3A is a longitudinal sectional view of an essential part, and FIG. 3B is a plan view of FIG. 3A with the diaphragm removed. . FIGS. 4A and 4B are views showing a third embodiment of the diaphragm valve according to the present invention, in which FIG. 4A is a longitudinal sectional view of an essential part, and FIG. 4B is a plan view of FIG. 4A with the diaphragm removed. . FIG. 5 is a longitudinal sectional view showing the overall configuration of each embodiment of the diaphragm valve according to the present invention. FIG. 6 is a diagram showing dimensions of each part of a conventional diaphragm valve. FIG. 7 is a side view showing an example of a fluid control device for a semiconductor manufacturing apparatus in which the diaphragm valve of the present invention is used.

  Embodiments of the present invention will be described below with reference to the drawings. In the following description, the top and bottom and the left and right refer to the top and bottom and the left and right in FIG.

  FIG. 5 shows the basic shape of the diaphragm valve (1) according to the present invention. The diaphragm valve (1) has a fluid inflow passage (2a), a fluid outflow passage (2b), and a recess ( 2c), a block-shaped body (2), a cylindrical bonnet (3) whose lower end is screwed onto the upper part of the recess (2c) of the body (2), and a fluid inflow passage (2a) An annular sheet (4) provided on the periphery of the diaphragm, a diaphragm (5) that opens or closes the fluid inflow passage (2a) by being pressed or separated by the sheet (4), and a diaphragm holder that presses the center of the diaphragm (5) (6), a stem (7) which is inserted into the bonnet (3) so as to be movable up and down and presses and separates the diaphragm (5) against the seat (4) via the diaphragm presser (6), and the bonnet (3) The outer peripheral edge of the diaphragm (5) is placed between the lower end surface and the bottom of the recess (2c) of the body (2), and the bottom of the recess (2c) of the body (2) Holding adapter (8) that holds between, casing (9) having a top wall (9a) and screwed to the bonnet (3), piston (10) integrated to the stem (7), A compression coil spring (biasing member) (11) for urging the piston (10) downward, an operation air introduction chamber (12) provided on the lower surface of the piston (10), and an operation air introduction chamber (12) An operation air introduction passage (13) for introducing operation air is provided.

  In the open state shown in FIG. 1, the fluid flowing in from the fluid inflow passage (2a) flows into the space surrounded by the bottom surface of the recess (2c) of the body (2) and the diaphragm (5). Then, it flows out through the fluid outflow passage (2b).

  The diaphragm (5) has a spherical shell shape, and an upwardly convex arc shape is in a natural state. The diaphragm (5) is made of, for example, a nickel alloy thin plate, and is formed in a spherical shell shape that is cut out in a circular shape and has a central portion bulged upward. The diaphragm (5) may be made of a stainless steel sheet or a laminate of a stainless steel sheet and a nickel / cobalt alloy sheet.

  FIG. 6 shows a main part of a small diaphragm valve in which the diaphragm valve according to the present invention is a prior art. In FIG. 6, the holding adapter (8) has a tapered shape in which the entire lower surface (8a) has a predetermined inclination angle. The bottom surface (14) of the recess (2c) of the body (2) has a circular flat portion (14a) and an annular shape that is continuous with the outer periphery of the flat portion (14a) and is recessed with respect to the flat portion (14a). And a recess (14b).

  The holding adapter (8) is fixed in a state in which the bonnet (3) is screwed onto the body (2) and is in contact with the outer peripheral edge of the diaphragm (5) from above. At this time, the entire bottom surface (8a) of the holding adapter (8) is tapered, so that the diaphragm (5) is not deformed from the spherical shell shape (upwardly convex arc shape) and the outer surface of the diaphragm adapter (8) is almost completely deformed. With the upper surface of the peripheral edge in surface contact with the tapered lower surface (8a) of the retainer adapter (8) (in a wide range), the bottom surface of the recess (2c) in the retainer adapter (8) and the body (2) (14 ). Further, since the recess (14b) is provided on the outer peripheral edge of the bottom surface (14) of the recess (2c) of the body (2), the outer peripheral edge of the diaphragm (5) is placed in the recess (14b). Be contained. Therefore, the outer peripheral edge of the diaphragm (5) is not deformed along the bottom surface (14) of the recess (2c) of the body (2), and the bottom surface thereof is the bottom surface (14) of the recess (2c). ) Is in line contact with the outer periphery (diaphragm support portion) (14c) of the flat portion (14a).

  As specific numerical values of each member, as shown in FIG. 6A, the diameter (L) of the diaphragm (5) is φ8, and the height (H) of the diaphragm (5) is 0.65 mm. The curvature radius (SR1) is SR13.5. Then, as shown in FIG. 6B, the taper angle (θ) of the lower surface (8a) of the holding adapter (8) is the flat portion (14a) of the bottom surface (14) of the recess (2c) of the body (2). ) To 16 °. The curvature radius (SR2) of the surface (6a) of the diaphragm presser (6) that is in contact with the diaphragm (5) is SR12. The height (D) of the sheet (4) from the flat part (reference surface) (14a) of the bottom surface (14) of the recess (2c) is D = 0.2 mm.

  1 and 2 show the main part of a first embodiment of a diaphragm valve (1) according to the present invention.

  In this embodiment, as shown in FIG. 1, as a configuration different from the conventional one, the flat portion (reference surface) (14a) of the bottom surface (14) of the recess (2c) of the body (2) is provided. In addition, a counterbore (15) is provided so as to include a portion opened in the bottom surface (14) of the recess (2c) of the fluid outflow passage (2b).

  The counterbore (15) is provided so as to leave the outer periphery (14c) of the flat portion (14a) for supporting the outer peripheral edge of the diaphragm (5). By providing the counterbore (15), the inlet area of the fluid outflow passage (2b) formed in the bottom surface (14) of the recess (2c) of the body (2) is increased. Further, the height of the portion holding the sheet (4) in the bottom surface (14) of the recess (2c) of the fluid outflow passage (2b) is lowered by the counterbore (15).

  In this embodiment, as shown in FIG. 2 (a), the height (H) of the diaphragm (5) is 0.4 mm, and the curvature thereof is different from the conventional one. The radius (SR1) is SR23. The diameter (L) of the diaphragm (5) is φ8, which is the same as the conventional one. As shown in FIG. 2 (b), the curvature radius (SR2) of the surface (6a) of the diaphragm presser (6) that is in contact with the diaphragm (5) is SR42, and the presser adapter (8) The lower surface (8a) has a taper angle (θ) of 9 °. Further, when the valve is opened, the outer periphery of the flat portion (14a) of the bottom surface (14) of the recess (2c) (the diaphragm support portion in pressure contact with the outer peripheral edge of the diaphragm (5)) (14c) to the diaphragm (5 The distance C to the apex of) is 0.35 mm.

  That is, by increasing the curvature radius (SR2) of the surface (6a) of the diaphragm holder (6) that is in contact with the diaphragm (5), the contact area between the diaphragm holder (6) and the diaphragm (5) is increased. As a result, the load at the center of the diaphragm (5) is reduced. In addition, the taper angle (θ) of the lower surface (8a) of the holding adapter (8) is set to an angle along the diaphragm (5), and in order to prevent interference with the diaphragm holding (6), the holding adapter (8 ) Has a large inner diameter.

  The height of the sheet (4) is D = 0.2 mm in the prior art, whereas in the first embodiment, this D is 0.05 mm (0 in the drawing). This is adjusted according to the shape of the diaphragm (5). Accordingly, the lift amount of the diaphragm (5) is 0.27 mm, which is 0.1 mm smaller than the conventional 0.37 mm. .

  The diaphragm (5) is a laminate of two diaphragms having a thickness of 0.05 mm. This is the same between the prior art and the embodiment.

  The vertex of the diaphragm (5) is defined as the vertex of the upper surface of the lowermost diaphragm (wetted side). In the above definition, in consideration of durability, a spot is applied to one diaphragm layer, and the fixed portion of the diaphragm (fulcrum = diaphragm support portion (14c) of the body (2)) and the pressing portion (force point = diaphragm retainer (6 ) = Contact portion of the diaphragm = diaphragm (5) apex of the ball lid) is based on the evaluation result that it is a major factor determining the durability.

  When there is only one diaphragm, the vertex of the diaphragm (5) is the vertex of the upper surface of the diaphragm (5), and the vertex when there are multiple diaphragms is the lowest layer (wetted side) as defined. It becomes the apex of the upper surface of the diaphragm.

  Tables 1 and 2 show the results of comparison between the first embodiment (small diaphragm valve) shown in FIGS. 1 and 2 and the conventional small diaphragm valve shown in FIG.

  Table 1 shows the differences between the first embodiment and the conventional small diaphragm valve shown in FIG. 6, and Table 2 shows a comparison with existing diaphragm valves of standard size (standard products). The specifications and performance are shown.

  From Table 2, the embodiment has extremely excellent durability, which is the same as that of the standard size, while being small, and more durable than the same small conventional product. It can be seen that not only the Cv value is increased. The Cv value is a capacity coefficient of the valve, and represents a flow rate when the fluid flows through the valve at a certain differential pressure.

  Regarding the durability between the small products, the fact that the durability of the embodiment is greatly improved is that the shape (SR) of the diaphragm retainer (6) is SR42 and the retainer adapter (8 ) Is set to 9 °. When the index of durability is set to “4 million times”, which is equivalent to that of the conventional product, the diaphragm holder (6) diaphragm is considered considering that the durability is 4 million times or more and there is a margin in durability. The curvature radius (SR) of the surface in contact with (5) is 30 mm or more, and the taper angle (θ) of the lower surface of the holding adapter (8) is the bottom surface of the recess (2c) of the body (2) ( It is reasonable to set a condition for ensuring about 4 million times that the flat portion (14a) of 14) is 10 ° or less.

  Further, when the valve is opened, the outer periphery of the flat portion (14a) of the bottom surface (14) of the recess (2c) (the diaphragm support portion in pressure contact with the outer peripheral edge of the diaphragm (5)) (14c) to the diaphragm (5 ) Is 0.35 mm, the following can be said. Diaphragm (5) from diaphragm support (14c) of bottom surface (14) of recess (2c) of body (2) which is in pressure contact with diaphragm (5) when valve is opened It is preferable that the ratio of the distance C to the top is 18: 1 to 30: 1.

  In the above, since L is φ8, a preferable range of C when L is φ8 is 0.27 mm to 0.44 mm (about 0.25 mm to 0.45 mm).

  The ratio of the diameter of the diaphragm (5) and the distance from the recess (2c) bottom surface (14) of the body (2) in pressure contact with the diaphragm (5) to the top of the diaphragm (the height of the top of the diaphragm (5)) When it is less than 18: 1 (C exceeds 0.45 mm), the durability is remarkably reduced, and when it exceeds 30: 1 (C is less than 0.25 mm), the flow rate is remarkably insufficient. By setting the above ratio to 18: 1 to 30: 1, it is possible to obtain a diaphragm valve that is excellent in durability and that is excellent in securing a flow rate.

  In addition, in comparison between small products, the Cv value of the embodiment is twice that of the conventional one. The bottom surface (14) of the recess (2c) of the body (2) is flat. The point (14a) is provided with a counterbore (15) so as to include a portion opened to the bottom surface (14) of the recess (2c) of the fluid outflow passage (2b). That is, by providing the counterbore (15) and increasing the inlet area of the fluid outflow passage (2b), the Cv value is doubled compared to the conventional case.

  Normally, when the radius of curvature of the diaphragm (5) is increased from SR13.5 to SR23, the Cv value decreases. That is, according to this embodiment, not only the decrease in the flow rate accompanying the shape change of the diaphragm (5) can be compensated, but also the flow rate can be greatly increased.

  Thus, in this embodiment, the Cv value, which is a contradictory performance, and the durability of the diaphragm are compatible at a high level.

  In order to increase the Cv value, instead of the counterbore (15) (scraping almost the entire flat portion (14a) of the bottom surface (14) of the recess (2c)), as shown in FIG. An annular groove (16) including a portion opened to the bottom surface (14) of the recess (2c) of 2b) may be provided.

  The depth of the annular groove (16) is larger than the depth of the counterbore (15). In the case of the annular groove (16), the portion holding the sheet (4) has the same shape as the conventional one.

  In the case of the annular groove (16), the sheet (4) can be caulked from both the outer diameter side and the inner diameter side of the sheet (4), and the sheet (4) is strongly fixed.

  In the case of the counterbore (15), the sheet (4) is caulked only from the inner diameter side of the sheet (4). By using the counterbore (15), the inlet area of the fluid outflow passage (2b) can be made larger than that of the annular groove (16), and the Cv value becomes larger.

  In order to further increase the Cv value, a counterbore (15) is provided as shown in FIG. 4, and the cross-sectional shape of the fluid outflow passage (2b) is a long hole (17). Good.

  As shown in the figure, the cross-sectional shape of the elongated hole (17) may be a semi-circular portion added to both ends of the rectangular portion, may be elliptical, or may be a crescent shape along the counterbore (15). Good.

  The long hole (17) can be combined with the annular groove (16) shown in FIG. That is, the cross-sectional shape of the fluid outflow passage (2b) that is circular in FIG. 3 may be the long hole (17) shown in FIG.

  In the above diaphragm valve, the stem (7), piston (10), compression coil spring (biasing member) (11), operation air introduction chamber (12), operation air introduction passage (13), etc. Although the vertical movement means for moving up and down (6) is configured, the configuration of the vertical movement means is not limited to that shown in FIG.

  The diaphragm valve can be used as an on-off valve in the fluid control device shown in FIG. 7, for example. And since the said diaphragm valve is reduced in size and is excellent also in durability, the fluid control apparatus using this is used as a gas supply part in the semiconductor manufacturing apparatus in which size reduction is an issue. Suitable for

  Examples of semiconductor manufacturing apparatuses include CVD apparatuses, sputtering apparatuses, and etching apparatuses.

  The CVD apparatus includes an energy supply unit, a vacuum chamber, a gas supply unit (fluid control device), and an exhaust unit, and forms a passive film (oxide film) on a wafer.

  An etching apparatus (dry etching apparatus) is an apparatus that includes an energy supply unit, a processing chamber, a gas supply unit (fluid control unit), and an exhaust unit, and processes a material surface and the like by a corrosive action by a reactive gas.

  The sputtering apparatus is an apparatus for forming a film on a material surface, which includes a target, an energy supply means, a vacuum chamber, a gas supply means (fluid control device), and an exhaust means.

  In any semiconductor manufacturing apparatus such as a CVD apparatus, a sputtering apparatus, and an etching apparatus, the gas supply means (fluid control apparatus) is an indispensable configuration, and the semiconductor manufacturing apparatus can be downsized by reducing the size thereof. it can.

  The fluid control device is not limited to the one shown in FIG. 7, and the semiconductor manufacturing device is not limited at all.

(1): Diaphragm valve, (2): Body, (2a): Fluid inflow passage, (2b): Fluid outflow passage, (2c): Recess, (4): Seat, (5): Diaphragm, (6 ): Diaphragm presser, (7): Stem, (8): Presser adapter, (14): Bottom, (14a): Flat part, (14b): Recessed part, (14c): Outer periphery, (15): Counterbore (groove) ), (16): annular groove, (17): long hole

(1): Diaphragm valve, (2): Body, (2a): Fluid inflow passage, (2b): Fluid outflow passage, (2c): Recess, (4): Seat, (5): Diaphragm, (6 ): Diaphragm presser, (7): Stem, (8): Presser adapter, (14): Bottom, (14a): Flat part, (14b): Recessed part, (14c): Outer periphery, 14 (d): Outer seat Side flat part, 14 (e): Flat surface on the periphery of the fluid inflow passage, (15): Counterbore (groove), (16): Circular groove, (17): Long hole

Claims (10)

A body provided with a fluid inflow passage, a fluid outflow passage, and a recess opened upward, an annular sheet disposed at the periphery of the fluid inflow passage formed in the body, and a fluid by being pressed and separated by the sheet An elastically deformable spherical shell-shaped diaphragm that opens and closes the inflow passage, a holding adapter that holds the outer peripheral edge of the diaphragm between the bottom surface of the body recess, and a diaphragm presser that presses the center of the diaphragm And a diaphragm valve comprising a vertically moving means for vertically moving the diaphragm presser,
A diaphragm valve, wherein a counterbore portion is provided in a flat portion of the bottom surface of the body recess so as to include a portion opened to the bottom surface of the recess of the fluid outflow passage.   The bottom surface of the spot facing portion is flat from the outer peripheral surface of the seat to the inner edge of the portion supporting the outer peripheral edge of the diaphragm, and the seat is fixed to the body only by caulking from the inside. Diaphragm valve.   When the valve is opened, the ratio of the vertical distance from the diaphragm support portion of the recess that is in pressure contact with the diaphragm to the apex of the diaphragm is 18: 1 to 30: 1 with respect to the diameter of the diaphragm, and the apex The diaphragm valve according to claim 1 or 2, wherein is a vertex of the upper surface of the lowermost layer on the liquid contact side.   The diaphragm valve according to any one of claims 1 to 3, wherein the height of the upper end surface of the seat is higher than the height of the flat portion of the bottom surface of the body recess.   The diaphragm valve according to any one of claims 1 to 4, wherein a cross-sectional shape of the fluid outflow passage is a long hole.   A fluid control device comprising an on-off valve as the fluid control device, wherein the on-off valve is the diaphragm valve according to any one of claims 1 to 5.   The fluid control apparatus according to claim 6, wherein the fluid control apparatus is used in a semiconductor manufacturing apparatus.   A semiconductor manufacturing apparatus comprising the fluid control device according to claim 6 as a gas supply unit.   The semiconductor manufacturing apparatus according to claim 8, wherein the semiconductor manufacturing apparatus is a CVD apparatus, a sputtering apparatus, or an etching apparatus. A semiconductor manufacturing method, wherein a semiconductor is manufactured using the semiconductor manufacturing apparatus according to claim 9.

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