JP2018121544A - High temperature liquid type heating treatment device and method for driving high temperature liquid type heating treatment device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high temperature liquid type heating treatment device, under the suppression of the damage of a treatment tank by the influence of heat in a series of treatments, capable of optimizing heating treatment-cooling treatment to the object to be treated.SOLUTION: Provided is a high temperature liquid type heating treatment device comprising: a treatment tank including a tank body and a leg part; a high temperature liquid feed system feeding a high temperature liquid to the tank body; a low temperature liquid feed system feeding a low temperature liquid to the tank body; a liquid exhaust system exhausting the liquid from the tank body; and a control part controlling the feed and exhaust of the liquid to the tank body. The control part feeds the high temperature liquid from the high temperature liquid feed system to the first liquid level to the tank body, feeds the low temperature liquid at a feed amount smaller than the exhaust amount of the high temperature liquid exhausted from the liquid exhaust system while exhausting the high temperature liquid from the liquid exhaust system, and, when the liquid level of the inside of the tank body reaches the second liquid level lower than the treatment object in the tank body, feeds the low temperature liquid from the low temperature liquid feed system to the first liquid level to the tank body.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a heat treatment apparatus for heat-treating an object to be treated and a method for operating the heat treatment apparatus. More specifically, the present invention relates to a high-temperature liquid heat treatment apparatus and a high-temperature liquid for heat treatment by immersing a treatment object in a high-temperature liquid. The present invention relates to a method for operating a heat treatment apparatus.

  2. Description of the Related Art Conventionally, there has been provided a heat treatment apparatus that heat-treats a processing object in order to perform a predetermined target process on the processing object. There are various types of heat treatment apparatuses, and one of them is a high-temperature liquid heat treatment apparatus that performs heat treatment by immersing a treatment object in a high-temperature liquid. A typical example of this high-temperature liquid heat treatment apparatus is a hot water sterilization apparatus that heat-treats a treatment object for the purpose of sterilization and cooking of the treatment object such as a retort pack (see, for example, Patent Document 1). ).

  This type of high-temperature liquid heat treatment apparatus includes a treatment tank having a tank body capable of accommodating a processing object, a high-temperature liquid supply system for supplying high-temperature liquid (for example, hot water) to the tank body, and a tank body. A low-temperature liquid supply system for supplying a low-temperature liquid (for example, water) and a liquid discharge system for discharging the liquid in the tank body.

  The tank body of the processing tank includes a cylindrical body portion having a center line extending in the lateral direction, the body portion having both lateral ends open, and a pair of closed portions closing both ends of the body portion. . At least one closing part of the pair of closing parts is provided so that one end of the body part can be opened and closed. Thereby, the processing tank (tank main body) can take in and out a process target object from the end of a trunk | drum.

  In addition to the tank body, the treatment tank includes legs that support the tank body. There are a plurality of leg parts, and each leg part is firmly fixed to the lower part of the outer periphery of the trunk part by welding or the like.

  The high temperature liquid supply system includes a pipe, a valve, and the like, and is configured to be able to supply a heated high temperature liquid into the tank body. The cryogenic liquid supply system includes pipes and valves, and is configured to be able to supply cryogenic liquid from a supply source (for example, a water source) into the tank body.

  This type of high-temperature liquid heat treatment apparatus heat-treats a processing object with a high-temperature liquid and then cools the processing object. More specifically, in the high-temperature liquid heat treatment apparatus, the high-temperature liquid is supplied from the high-temperature liquid supply system into the tank body after the object to be processed is accommodated in the tank body of the processing tank. With the supply of the high temperature liquid, when the liquid level in the tank body rises and the object to be processed is completely immersed in the high temperature liquid, the high temperature liquid in the tank body is circulated through the circulation system for a predetermined time. The Thereby, a process target object receives the heat | fever of a high temperature liquid, and is heated.

  When the heat treatment for the object to be processed is completed, the high-temperature liquid in the tank body is discharged from the liquid discharge system. When the high-temperature liquid disappears in the tank body, the low-temperature liquid is supplied from the low-temperature liquid supply system into the tank body. When the liquid level in the tank body rises due to the supply of the cryogenic liquid and the processing object in the tank body is completely immersed in the cryogenic liquid, the cryogenic liquid in the tank body is predetermined via the circulation system. Circulated for hours. As a result, the object to be treated is cooled by being deprived of heat by the low temperature liquid.

  By the way, in this type of high-temperature liquid heat treatment apparatus, when the treatment object is heat-treated, the treatment object is immersed in the high-temperature liquid for a predetermined time, so that the tank body is heated by the influence of the heat of the high-temperature liquid. . For this reason, when the object to be processed is cooled with the low-temperature liquid, there is a possibility that the connection portion (for example, the welded portion) between the tank body and the leg portion may be damaged.

  Specifically, the high-temperature liquid is discharged from the tank body after the heat treatment on the object to be processed, but the tank body is affected by the heat of the stored high-temperature liquid, so that the high-temperature liquid is completely lost. But it's hot. Therefore, when the low-temperature liquid is supplied into the tank body immediately after discharging the high-temperature liquid, the lower part of the tank body is rapidly cooled by the low-temperature liquid supplied into the tank body (stored in the lower part of the tank body). . Along with this, stress concentrates on the connecting portion (fixed portion) between the tank body (body portion) and the leg portion, and there is a possibility that cracking or the like may occur in the portion. That is, since the connection part of a tank main body (body part) and a leg part is included in the area | region rapidly cooled at the time of cooling of the process target object in a tank main body, the connection part of a tank main body (body part) and a leg part becomes rapid cooling. Along with this, there is a risk of damage due to concentrated stress (residual stress).

JP 2014-8235 A

  Therefore, the present invention provides a high-temperature liquid heat treatment apparatus capable of making heat treatment / cooling treatment appropriate for an object to be treated after suppressing damage to the treatment tank due to the influence of heat in a series of treatments. It is another object of the present invention to provide a method for operating a high-temperature liquid heat treatment apparatus.

  A high-temperature liquid heat treatment apparatus according to the present invention is connected to a tank body capable of accommodating a processing object and a leg fixed to a lower part of the tank body, and a tank body of the treatment tank. A high-temperature liquid supply system that supplies high-temperature liquid, a low-temperature liquid supply system that is connected to the tank body of the processing tank and supplies low-temperature liquid to the tank body, and a liquid in the tank body that is connected to the lower part of the tank body of the processing tank A liquid discharge system for discharging the liquid and a control unit for controlling supply and discharge of the liquid to and from the tank body, and the control unit is heated to a first liquid level where the entire processing object in the tank body is immersed. High temperature liquid is supplied into the tank body from the liquid supply system, and after a predetermined time has elapsed since the high temperature liquid reached the first liquid level, the high temperature liquid in the tank body is discharged from the liquid discharge system and discharged from the liquid discharge system. Low supply with less supply of high temperature liquid discharge When the low temperature liquid is supplied into the tank body from the liquid supply system, and the liquid level in the tank body becomes the second liquid level lower than the processing target in the tank body, the discharge of the liquid from the liquid discharge system is stopped, The cryogenic liquid is supplied into the tank body from the cryogenic liquid supply system until the liquid level in the tank body changes from the second liquid level to the first liquid level.

  As one aspect of the present invention, the cryogenic liquid supply system includes a liquid supply system that supplies the cryogenic liquid to an upper region in the tank body of the treatment tank, and the control unit discharges the hot liquid in the tank body from the liquid discharge system. When supplying the cryogenic liquid from the low temperature liquid supply system into the tank body with a supply amount smaller than the discharge amount of the high temperature liquid discharged from the liquid discharge system, the cryogenic liquid is supplied from the liquid supply system into the tank body. You may make it supply.

  As another aspect of the present invention, the control unit allows the cryogenic liquid to be supplied from the cryogenic liquid supply system into the tank body until the liquid level of the tank body changes from the second liquid level to the first liquid level. The liquid in the tank body is discharged from the liquid discharge system until the liquid level is lower than the first liquid level and higher than the second liquid level, and the liquid level in the tank body is the third liquid. The supply of the cryogenic liquid from the cryogenic liquid supply system into the tank body may be repeated a predetermined number of times from the first level to the first liquid level.

  Further, the control unit causes the liquid in the tank body to be discharged from the liquid discharge system until the liquid level in the tank body is lower than the first liquid level and higher than the second liquid level. After the liquid level in the tank body is changed from the third liquid level to the first liquid level, the cryogenic liquid is supplied from the cryogenic liquid supply system into the tank body a predetermined number of times, and then from the liquid discharge system to the tank body. Discharging all of the liquid and supplying the cryogenic liquid from the cryogenic liquid supply system into the tank body at least once until the liquid level in the tank body reaches the first liquid level. Good.

  The operation method of the high-temperature liquid heat treatment apparatus according to the present invention is that the entire object to be treated in the tank body of the treatment tank including the tank body capable of accommodating the object to be treated and the legs fixed to the lower part of the tank body is immersed. The tank is supplied with high-temperature liquid from the high-temperature liquid supply system connected to the tank body until the first liquid level is loaded, and after a predetermined time has elapsed after the high-temperature liquid has reached the first liquid level, Low temperature liquid supply connected to the tank body with a supply amount smaller than the discharge amount of the high temperature liquid discharged from the liquid discharge system while discharging the high temperature liquid in the tank body from the liquid discharge system connected to the lower part of the main body Supplying cryogenic liquid from the system into the tank body and discharging the liquid from the liquid discharge system when the liquid level in the tank body becomes a second liquid level lower than the object to be processed in the tank body. Stop and cool until the liquid level in the tank body changes from the second liquid level to the first liquid level. Characterized in that it comprises and supplying cryogenic liquid from the body supply system into the tank body.

  As one aspect of the present invention, the low-temperature liquid supply system includes a liquid supply system that supplies a low-temperature liquid to an upper region in the tank body of the processing tank, and the liquid discharge system connected to the lower part of the tank body has a liquid supply system in the tank body. When supplying the low-temperature liquid into the tank body from the low-temperature liquid supply system connected to the tank body with a supply amount smaller than the discharge amount of the high-temperature liquid discharged from the liquid discharge system while discharging the high-temperature liquid, the liquid You may make it supply a cryogenic liquid in a tank main body from a supply system.

  As another aspect of the present invention, after supplying the cryogenic liquid from the cryogenic liquid supply system into the tank body until the liquid level of the tank body changes from the second liquid level to the first liquid level, the liquid level in the tank body is first. The liquid in the tank body is discharged from the liquid discharge system until the third liquid level is lower than the liquid level and higher than the second liquid level, and the liquid level in the tank body is changed from the third liquid level to the first liquid. It may include repeating a predetermined number of times to supply the cryogenic liquid from the cryogenic liquid supply system into the tank main body until it reaches the position.

  Also, discharging the liquid in the tank body from the liquid discharge system until the liquid level in the tank body is lower than the first liquid level and higher than the second liquid level, After supplying the cryogenic liquid from the cryogenic liquid supply system into the tank body a predetermined number of times until the liquid level changes from the third liquid level to the first liquid level, all the liquid in the tank body is removed from the liquid discharge system. Discharging and supplying the cryogenic liquid from the cryogenic liquid supply system into the tank body at least once until the liquid level in the tank body reaches the first liquid level may be included.

  According to the present invention, there is an excellent effect that heat treatment / cooling treatment can be made appropriate for an object to be treated after suppressing damage to the treatment tank due to the influence of heat in a series of treatments. obtain.

FIG. 1 is a schematic overall view of a high-temperature liquid heat treatment apparatus according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of the treatment tank of the high-temperature liquid heat treatment apparatus according to the embodiment. FIG. 3 is a schematic configuration diagram of an apparatus main body of the high-temperature liquid heat treatment apparatus according to the embodiment. FIG. 4 is an explanatory diagram for explaining an operation method of the high-temperature liquid heat treatment apparatus according to the embodiment. FIG. 5 is an explanatory diagram for explaining an operation method of the high-temperature liquid heat treatment apparatus according to the embodiment. FIG. 6 is an explanatory diagram for explaining an operation method of the high-temperature liquid heat treatment apparatus according to the embodiment. FIG. 7 is an explanatory diagram for explaining an operation method of the high-temperature liquid heat treatment apparatus according to the embodiment. FIG. 8 is an explanatory diagram for explaining an operation method of the high-temperature liquid heat treatment apparatus according to the embodiment.

  Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. In addition, this embodiment demonstrates the high temperature liquid type heat processing apparatus (hot water type sterilizer) which uses the retort pack which accommodated the foodstuff in the container as a process target object.

  The high-temperature liquid heat treatment apparatus (hereinafter simply referred to as a treatment apparatus) according to the present embodiment performs heat treatment and cooling treatment on a processing object for the purpose of performing sterilization treatment and cooking treatment on the treatment object. As shown in FIG. 1, the apparatus has a device main body 2 that performs a heating process and a cooling process on the object T, and a control panel 3 that operates the apparatus main body 2.

  As shown in FIG. 1, the apparatus main body 2 is connected to a tank main body 200 that accommodates the processing object T... And a processing tank 20 that includes a leg 201 fixed to the tank main body 200, and a tank main body 200 of the processing tank 20. The high-temperature liquid supply system 21 that supplies high-temperature liquid (hot water in this embodiment) to the tank body 200 and the tank body 200 of the treatment tank 20 are connected to the tank body 200, and the low-temperature liquid (water in this embodiment) is connected to the tank body 200. ) And a liquid discharge system 23 that is connected to the lower part of the tank body 200 of the processing tank 20 and discharges the liquid from the tank body 200.

  The tank body 200 of the processing tank 20 is a cylindrical trunk 202 having a center line CL extending in the lateral direction, and a pair of trunks 202 that are open at both ends in the lateral direction, and a pair of blocks closing both ends of the trunk 202. The closing parts 203 and 203 are provided. One closing part 203 of the pair of closing parts 203, 203 is provided so that one end of the body part 202 can be opened and closed. Thereby, the processing tank 20 (tank main body 200) can take in and out the processing object T ... from one end of the trunk | drum 202. FIG. There are a plurality of leg portions 201, and each leg portion 201 is welded to the lower part of the outer periphery of the trunk portion 202 of the tank body 200 as shown in FIGS. 1 and 2. The processing tank 20 includes a liquid level sensor (not shown). This liquid level sensor measures (detects) the position (liquid level) of the liquid level in the tank body 200.

  As shown in FIGS. 1 and 3, the high-temperature liquid supply system 21 includes a tank 210 that stores high-temperature liquid, and a piping system (hereinafter referred to as a first piping system) 211 that connects the tank 210 and the tank body 200.

  The tank 210 is a so-called pressure vessel and stores a high-temperature liquid supplied to the tank body 200. That is, the internal volume of the tank 210 (high temperature liquid storage amount) is set to be equal to or greater than the internal volume of the tank body 200 (high temperature liquid storage amount). In the present embodiment, the tank 210 is disposed above the processing tank 20.

  As shown in FIG. 3, the first piping system 211 includes a supply system 212 for supplying the high temperature liquid in the tank 210 to the processing tank 20 (the tank body 200), and the high temperature liquid between the tank 210 and the processing tank 20. And a circulation system 213 for circulation.

  The supply system 212 constitutes a flow path for high-temperature liquid, and connects the lower part of the tank 210 and the lower part of the tank body 200 (the trunk part 202) to the fluid. In the present embodiment, the supply system 212 includes an electric valve V that opens and closes the flow path of the high-temperature liquid.

  The circulation system 213 includes two systems 213a and 213b that connect the tank 210 and the processing tank 20 (the tank body 200), each of which includes two systems 213a and 213b that constitute a flow path for high-temperature liquid. One system 213b of the systems 213a and 213b includes an electric pump P.

  Specifically, in the present embodiment, the circulation system 213 is a first system 213a that constitutes a flow path for high-temperature liquid, and includes a lower portion of the tank 210 and a middle position of the tank body 200 (body 202). It includes a first system 213a to be connected, and a second system 213b that constitutes a flow path for high-temperature liquid, and a second system 213b that connects the lower part of the tank 210 and the lower position of the tank body 200 (body 202). In addition, in this embodiment, since the tank main body 200 (body part 202) makes a cross-sectional cylindrical shape, the "higher position" is the highest in the vertical direction (vertical direction) in the radial direction of the body part 202. The “lower position” means the apex at the lowest position in the longitudinal direction (vertical direction) in the radial direction of the trunk portion 202. Accordingly, the “middle position” is a side portion (top portion) at a substantially intermediate position between the upper position and the lower position, and the depth direction is orthogonal to the center line CL of the tank body 200 (body section 202). The side part (top part) of the tank main body 200 (body part 202) in the (direction orthogonal to each of the vertical direction and the horizontal direction) or its periphery is meant. In the description of each system, the term “upstream” means upstream in the direction of liquid flow in the system, and the term “downstream” means downstream in the direction of liquid flow in that system. Accordingly, the upstream region means a region upstream of the liquid flow in the system, and the downstream region means a region downstream of the liquid flow in the system.

  The first system 213a includes an electric valve V that opens and closes the flow path of the high-temperature liquid. Although the downstream area (tank body 200 side) of the first system 213a is not shown in FIG. 3, it is divided into two systems. One of the two systems is connected to one side (top) of the tank body 200 (body 202) in the depth direction orthogonal to the center line CL of the tank body 200 (body 202). The other of the two systems is connected to the other side (top) of the tank body 200 (body 202) in the depth direction perpendicular to the center line CL of the tank body 200 (body 202). ing.

  The second system 213b includes an electric valve V that opens and closes the flow path of the high-temperature liquid. The second system 213b includes an electric pump P for sending the high-temperature liquid from the tank body 200 toward the tank 210. In the present embodiment, the second system 213b includes a steam ejector E for heating the flowing liquid. The steam ejector E is installed on the downstream side of the electric pump P. In the present embodiment, the upstream area of the electric pump P of the second system 213b merges with the downstream area of the supply system 212. That is, the upstream area of the second system 213 b is also used as the downstream area of the supply system 212.

  In the present embodiment, the upstream region of the second system 213b includes two systems 214 and 215. Specifically, the second system 213b according to the present embodiment includes a lower connection system 214 connected to the lower position of the tank body 200 and a middle connection system 215 connected to the middle position of the tank body 200.

  The lower connection system 214 and the middle connection system 215 are connected to the electric pump P in a joined state. Each of the lower connection system 214 and the middle connection system 215 includes an electric valve V that opens and closes the flow path. The middle connection system 215 and the lower connection system 214 allow liquid to flow in from the tank body 200 at the same timing or at different timings by opening and closing the flow path by the electric valve V. Although the upstream area of the middle connection system 215 is not shown in FIG. 3, it is divided into two systems. One of the two systems is connected to one side (top) of the tank body 200 (body 202) in the depth direction orthogonal to the center line CL of the tank body 200 (body 202). The other of the two systems is connected to the other side (top) of the tank body 200 (body 202) in the depth direction perpendicular to the center line CL of the tank body 200 (body 202). Yes.

  In this embodiment, the circulation system 213 includes a first system 213a and a second system 213b. However, when the electric valve V of the first system 213a closes the flow path, the circulation system 213 starts from the first system 213a. The high temperature liquid in the tank main body 200 is sent to the tank 210 via the second system 213b without supplying the high temperature liquid to the tank main body 200, and the liquid level in the tank main body 200 is lowered. Therefore, the second system 213b of the circulation system 213 also functions as the liquid discharge system 23 that discharges the liquid from the tank body 200 in a state where the flow path of the first system 213a is closed.

  In addition to the first piping system 211, the high-temperature liquid supply system 21 of the present embodiment further includes a piping system (hereinafter referred to as a second piping system) 216 that connects the boiler that is a heat source and the tank 210. The second piping system 216 is a system that connects the boiler and the tank 210, but in the present embodiment, it is also a system that is connected to the steam ejector E provided in the circulation system 213 (second system 213b).

  Specifically, the second piping system 216 includes a main system 216a that connects the boiler and the tank 210, and a sub-system 216b that connects the boiler and the steam ejector E. In the present embodiment, the upstream area of the sub system 216b joins the upstream area of the main system 216a. That is, the upstream region connected to the boiler of the main system 216a is also used as the upstream region of the sub system 216b. Thereby, in the 2nd piping system 216, the steam from a boiler is supplied in the tank 210 via the main system 216a, and the steam of a boiler is supplied to the steam ejector E via the subsystem 216b.

  Each of the main system 216a and the sub system 216b has an electric valve V that opens and closes the flow path so that the supply and stop of the steam to the downstream side can be switched by opening and closing the flow path by the electric valve V. It has become. Thereby, the vapor | steam which distribute | circulates the main system 216a is supplied in the tank 210, and the vapor | steam supplied in this tank 210 heats the liquid in the tank 210, and makes it a high temperature liquid. Further, steam flowing through the sub system 216b is supplied to the steam ejector E, and the steam supplied to the steam ejector E heats the liquid flowing through the circulation system 213 (second system 213b) to prevent the temperature of the liquid from decreasing. To do.

  The cryogenic liquid supply system 22 connects a cryogenic liquid supply source (in this embodiment, a water source) and the tank body 200. In this embodiment, the cryogenic liquid supply system 22 includes a plurality of systems 220, 221, 222, and 223 that supply cryogenic liquid from a water source to the tank body 200.

  More specifically, the cryogenic liquid supply system 22 is a first cryogenic liquid supply system 220 that connects a supply source and the tank body 200, and supplies the cryogenic liquid to a higher position of the tank body 200. A second cryogenic liquid supply system 221 that connects the system 220, the supply source, and the tank body 200, the second cryogenic liquid supply system 221 that supplies the cryogenic liquid to the upper region in the tank body 200, the supply source, and the tank A third low-temperature liquid supply system 222 that connects the main body 200, the third low-temperature liquid supply system 222 that supplies the low-temperature liquid to the middle position of the tank body 200, and a fourth low-temperature liquid that connects the supply source and the tank body 200. The liquid supply system 223 includes a fourth low-temperature liquid supply system 223 that supplies the low-temperature liquid to a lower position of the tank body 200.

  The first low-temperature liquid supply system 220, the second low-temperature liquid supply system 221, the third low-temperature liquid supply system 222, and the fourth low-temperature liquid supply system 223 each have an electric valve V that opens and closes the flow path of the low-temperature liquid, and a supply And an electric pump P for sending the cryogenic liquid from the source toward the downstream side (tank body 200). As a result, each of the first low-temperature liquid supply system 220, the second low-temperature liquid supply system 221, the third low-temperature liquid supply system 222, and the fourth low-temperature liquid supply system 223 is opened and closed by the electric valve V. The cryogenic liquid is supplied to the tank body 200 at the same timing or at different timings.

  In the present embodiment, the respective upstream areas of the first low-temperature liquid supply system 220, the second low-temperature liquid supply system 221, the third low-temperature liquid supply system 222, and the fourth low-temperature liquid supply system 223 are merged. That is, the upstream region of the first cryogenic liquid supply system 220, the upstream region of the second cryogenic liquid supply system 221, the upstream region of the third cryogenic liquid supply system 222, and the upstream region of the fourth cryogenic liquid supply system 223 are mutually shared. Has been. This combined upstream region (the uppermost stream of the common system) is connected to a supply source (water source) of the cryogenic liquid. Along with this, an electric pump P for sending a cryogenic liquid from the supply source toward the downstream side (tank body 200) is provided in the combined upper region. Thereby, one electric pump P serves as each electric pump P of the first low-temperature liquid supply system 220, the second low-temperature liquid supply system 221, the third low-temperature liquid supply system 222, and the fourth low-temperature liquid supply system 223. It is also used.

  The first low-temperature liquid supply system 220 discharges the low-temperature liquid from the upper position of the tank body 200 toward the lower side (lower position) in the tank body 200. On the other hand, the second low-temperature liquid supply system 221 is configured to discharge the low-temperature liquid to the upper region in the tank body 200. In the present embodiment, the downstream region of the second low-temperature liquid supply system 221 has a pair of discharge portions 221a and 221a arranged in the upper region in the tank body 200, as shown in FIG. The pair of discharge portions 221a and 221a are arranged symmetrically with respect to a virtual surface that extends along the center line CL of the trunk portion 202 and extends in the vertical direction (vertical direction) and the horizontal direction. The discharge direction of the low-temperature liquid in the pair of discharge units 221a and 221a is set to the opposite direction (the direction away from the virtual plane that is the reference for the arrangement of the pair of discharge units 221a and 221a). Each discharge part 221a, 221a discharges a cryogenic liquid in the direction in general along the inner surface of the trunk | drum 202 which defines the upper area | region in the tank main body 200 (refer the arrow of FIG. 3). That is, each discharge part 221a, 221a discharges a low temperature liquid so that a low temperature liquid may adhere to the inner surface of the trunk | drum 202 which demarcates the upper area | region in the tank main body 200. FIG.

  Returning to FIG. 3, the downstream area of the fourth low-temperature liquid supply system 223 is divided into two systems 214 and 215. One of the two systems 214 and 215 is connected to the lower position of the tank body 200, and the other system 215 of the two systems 214 and 215 is connected to the middle position of the tank body 200. Although the other system 215 of the two systems 214 and 215 is not shown in FIG. 3, it is further divided into two systems. In one of the two systems, one of the two systems is connected to one side of the tank body 200 (body 202), and the other of the two systems is the tank body 200 (body). Connected to the other side of the part 202).

  Specifically, in the present embodiment, the downstream area of the fourth low-temperature liquid supply system 223 merges with the upstream area of the second system 213b of the circulation system 213. That is, a part of the upstream area of the second system 213b of the circulation system 213 also serves as the downstream area of the fourth low-temperature liquid supply system 223. Accordingly, the lower connection system 214 in the second system 213b is also used as one of the two systems 214 and 215 in the downstream area of the fourth low temperature liquid supply system 223, and the intermediate connection system in the second system 213b. 215 is also used as the other system 215 of the two systems 214 and 215 in the downstream area of the fourth low-temperature liquid supply system 223.

  The liquid discharge system 23 is connected to the tank body 200 and extends toward the liquid discharge destination. In the present embodiment, the second system 213b of the circulation system 213 functions as the liquid discharge system 23 as described above. That is, the liquid discharge system 23 according to the present embodiment includes a system 230 (hereinafter referred to as a first discharge system) extending toward the tank 210 that is a liquid discharge destination. Further, the liquid discharge system 23 includes a system (hereinafter referred to as a second discharge system) 231 extending toward a liquid discharge destination outside the processing apparatus 1.

  The upstream region of the first discharge system 230 and the upstream region of the second discharge system 231 merge. The upstream region of the first discharge system 230 and the upstream region of the second discharge system 231 are shared with each other. On the other hand, the downstream area of the 1st discharge system 230 and the 2nd discharge system 231 is located in each target position. That is, the upstream area connected to the tank body 200 of the first discharge system 230 and the second discharge system 231 is also used as the other, but the downstream area of the first discharge system 230 extends toward the tank 210, The downstream area of the discharge system 231 extends toward an external discharge destination.

  Each of the upstream region of the first discharge system 230 and the upstream region of the second discharge system 231 is divided into two systems 214 and 215. One of the two systems 214 and 215 is connected to a lower position of the tank body 200, and the other system 215 of the two systems is connected to a middle position of the tank body 200. Although the other system 215 of the two systems 214 and 215 is not shown in FIG. 3, it is further divided into two systems. One of the two systems is such that one of the two systems is connected to one side of the tank body 200 (body 202), and the other of the two systems is the tank. It connects with the other side part of the main body 200 (torso part 202).

  In the present embodiment, as the second system 213b of the circulation system 213 functions as the liquid discharge system 23, the upstream area of the second system 213b of the circulation system 213 is above the first discharge system 230 and the second discharge system 231. It also serves as a basin. Thereby, the lower connection system 214 in the second system 213b is also used as one of the two systems 214 and 215 in the upstream area of the first exhaust system 230 and the second exhaust system 231, and in the second system 213b. The middle connection system 215 is also used as the other system 215 of the two systems 214 and 215 in the upstream region of the first exhaust system 230 and the second exhaust system 231.

  Each of the first discharge system 230 and the second discharge system 231 includes an electric valve V that opens and closes the flow path. Each of the first discharge system 230 and the second discharge system 231 discharges the liquid in the tank body 200 at the same timing or at different timing as the flow path is opened and closed by the electric valve V.

  In the present embodiment, as described above, by joining different systems, a part of the different system also serves as a part of the other system. However, since the electric valve V is installed in each system, By switching the electric valve V, the flow path of the liquid is switched and functions as the original intended system.

  Returning to FIG. 1, the control panel 3 includes various switches 30..., A display unit 31, and the like, and is configured to be able to set operation conditions of the apparatus main body 2. Accordingly, the control panel 3 includes a control unit 32 that controls the supply of the high temperature liquid and the low temperature liquid to the processing tank 20 and controls the discharge of the high temperature liquid and the low temperature liquid to the processing tank 20.

  The control unit 32 controls electric devices (such as the electric valve V and the electric pump P) included in each of the high temperature liquid supply system 21, the low temperature liquid supply system 22, and the liquid discharge system 23. That is, the control unit 32 controls the liquid flow state in each of the high temperature liquid supply system 21, the low temperature liquid supply system 22, and the liquid discharge system 23.

  Specifically, the control unit 32 starts from the high-temperature liquid supply system 21 (in the present embodiment, the supply system 212) until the processing target T in the tank body 200 reaches the first liquid level where the entire process object T is immersed. The high temperature liquid is supplied into the tank body 200, and after a predetermined time has elapsed since the high temperature liquid has reached the first liquid level, the high temperature liquid in the tank body 200 is removed from the liquid discharge system 23 (in this embodiment, the first discharge system). 230) and the supply amount of the low-temperature liquid supply system 22 (in this embodiment, the second low-temperature liquid) with a supply amount smaller than the discharge amount of the high-temperature liquid discharged from the liquid discharge system 23 (first discharge system 230). When the low temperature liquid is supplied from the supply system 221) into the tank body 200 and the liquid level in the tank body 200 becomes a second liquid level lower than the processing target T in the tank body 200, the liquid discharge system 23 (first From one discharge system 230) The liquid discharge is stopped, and the low temperature liquid supply system 22 (in the present embodiment, the first low temperature liquid supply system 220, the second low temperature) until the liquid level in the tank body 200 changes from the second liquid level to the first liquid level. A low-temperature liquid is supplied into the tank body 200 from the liquid supply system 221 and the third low-temperature liquid supply system 222). In addition, the control part 32 has received the detection result of the liquid level sensor of the processing tank 20, and has recognized what position (height) the liquid level in the tank main body 200 exists.

  Furthermore, the control unit 32 supplies the cryogenic liquid from the cryogenic liquid supply system 22 into the tank body 200 until the liquid level of the tank body 200 changes from the second liquid level to the first liquid level. The liquid in the tank body 200 is removed from the liquid discharge system 23 (in the present embodiment, the second discharge system 231) until the liquid level is lower than the first liquid level and higher than the second liquid level. The low-temperature liquid supply system 22 (in this embodiment, the first low-temperature liquid supply system 220, the third low-temperature liquid supply) until the liquid level in the tank body 200 is changed from the third liquid level to the first liquid level. Supplying the cryogenic liquid from the system 222) into the tank body 200 is repeated a predetermined number of times.

  Moreover, the control part 32 is the liquid discharge system 23 (in this embodiment, 2nd liquid level) until the liquid level in the tank main body 200 becomes a 3rd liquid level lower than a 1st liquid level and higher than a 2nd liquid level. The liquid in the tank main body 200 is discharged from the discharge system 231), and the low-temperature liquid is supplied from the low-temperature liquid supply system 22 into the tank main body 200 until the liquid level in the tank main body 200 changes from the third liquid level to the first liquid level. Is repeated a predetermined number of times, and then all the liquid in the tank body 200 is discharged from the liquid discharge system 23 (second discharge system 231 in the present embodiment), Supplying the cryogenic liquid from the cryogenic liquid supply system 22 (fourth cryogenic liquid supply system 223 in the present embodiment) into the tank body 200 at least once until the liquid level reaches the first liquid level. .

  Thereby, the processing apparatus 1 which concerns on this embodiment implement | achieves the following driving | running methods by control with respect to each system | strain of the control part 32, and performs the heat processing and cooling process with respect to the process target T ....

  This will be specifically described. First, as shown in FIG. 4A, the processing object T is accommodated in the tank body 200 of the processing tank 20. In this state, the tank body 200 is sealed. And as shown in FIG.4 (b), the high temperature liquid HW is supplied from the high temperature liquid supply system 21 with respect to the tank main body 200 which accommodated the process target T .... In the present embodiment, the high temperature liquid HW is supplied to the lower position of the tank body 200 from the lower connection system 214 of the supply system 212 (second system 213b) of the high temperature liquid supply system 21. Along with this, the liquid level L in the tank body 200 rises, and as shown in FIG. 4 (c), the liquid level L in the tank body 200 reaches the first liquid level L1 where the entire processing target T ... is immersed. Then, the supply of the high-temperature liquid HW from the high-temperature liquid supply system 21 (supply system 212) is stopped, and the processing object T ... is immersed in the high-temperature liquid HW for a predetermined time. Thereby, the processing object T ... is heat-treated.

  In the present embodiment, the high temperature liquid HW is circulated between the tank body 200 and the tank 210 by the circulation system 213 so that the high temperature liquid HW in the tank body 200 is maintained at a constant or substantially constant temperature. In the present embodiment, as shown in FIG. 5A, the high temperature liquid HW in the tank 210 is supplied into the tank body 200 by the first system 213a of the circulation system 213, and at the same time, the second system 213a. The high temperature liquid HW in the tank body 200 is sent to the tank 210 by the system 213b.

  In the present embodiment, the downstream end of the first system 213a joins (matches) the upstream end of the middle connection system 215 of the second system 213b. Therefore, when discharging the high-temperature liquid HW from the tank body 200, whichever of the two systems in the upstream region of the intermediate connection system 215 that matches one of the two systems in the downstream region of the first system 213a. The high temperature liquid HW of the tank body 200 is discharged from one of the systems, and the high temperature liquid HW of the tank body 200 is discharged from the lower connection system 214, and either one of the two systems in the upstream area of the middle connection system 215 The high-temperature liquid HW is discharged to the tank body 200 from either one of the two systems in the downstream area of the first system 213a that matches this system.

  In addition, the system for discharging the high-temperature liquid HW in the first system 213a and the system for discharging the high-temperature liquid HW in the middle connection system 215 can be switched as appropriate. That is, the high temperature liquid HW is supplied from one side of the body 202 and the high temperature liquid HW is discharged from the other side of the body, and the high temperature liquid HW is supplied from the other side of the body 202. At the same time, the state is switched to a state in which the high-temperature liquid HW is discharged from one side of the trunk. Thereby, the high temperature liquid HW is circulated while being stirred in the tank body 200.

  Then, when a predetermined time elapses after the high temperature liquid HW becomes the first liquid level L1 (in this embodiment, when the high temperature liquid HW is circulated for a necessary time after the first liquid level L1), FIG. As shown in b), the high-temperature liquid HW in the tank body 200 is discharged from the liquid discharge system 23. In the present embodiment, the flow path of the first system 213a of the circulation system 213 is closed, the second system 213b of the circulation system 213 is made the first discharge system 230, and the high-temperature liquid HW in the tank body 200 is returned to the tank 210. It is. At this time, the high-temperature liquid HW in the tank body 200 is discharged from the lower position (lower connection system 214) of the tank body 200.

  The low temperature liquid CW is supplied to the tank body 200 from the low temperature liquid supply system 22 connected to the tank body 200 with a supply amount smaller than the discharge amount of the high temperature liquid HW discharged from the liquid discharge system 23. In the present embodiment, the cryogenic liquid CW is supplied to the tank body 200 from the second cryogenic liquid supply system 221 in the cryogenic liquid supply system 22. At this time, the low-temperature liquid CW discharged from the discharge portions 221a and 221a falls downward (adhering to the inner surface) while adhering to the inner surface of the tank body 200 (the trunk portion 202). As a result, the tank body 200 (body 202) is directly cooled by the low-temperature liquid CW, but at an early stage, the amount of the high-temperature liquid HW in the tank body 200 is larger than the low-temperature liquid CW supplied ( Therefore, the tank body 200 is not rapidly cooled.

  And since the supply amount of the low temperature liquid CW by the 2nd low temperature liquid supply system 221 is smaller than the discharge amount of the high temperature liquid HW discharged | emitted from the liquid discharge system 23, the liquid level L in the tank main body 200 falls gradually. . At this time, the low-temperature liquid CW is mixed with the high-temperature liquid HW while the high-temperature liquid HW in the tank body 200 is being discharged, so the liquid W in the tank body 200 (the low-temperature liquid CW and the high-temperature liquid HW are mixed). The temperature of the liquid W) decreases. Then, as shown in FIG. 5 (c), when the liquid level L in the tank body 200 becomes the second liquid level L2 lower than the processing object T ..., the liquid from the liquid discharge system 23 (first discharge system 230). Stop discharging W.

  Then, as shown in FIG. 6A, the cryogenic liquid CW is supplied from the cryogenic liquid supply system 22 to the tank body 200 until the liquid level L in the tank body 200 reaches the first liquid level L1. In the present embodiment, the supply of the low-temperature liquid CW from the second low-temperature liquid supply system 221 is continued in a state where the discharge of the liquid W from the liquid discharge system 23 (first discharge system 230) is stopped.

  In the present embodiment, when the liquid level L in the tank body 200 rises and reaches a liquid level L in which a part of the processing object T ... is immersed in the liquid W, as shown in FIG. The cryogenic liquid CW is also supplied to the tank body 200 from the cryogenic liquid supply system 220 and the third cryogenic liquid supply system 222. In this embodiment, in order to raise the liquid level L in the tank body 200, the low-temperature liquid supply system 22 (first low-temperature liquid supply system 220, second low-temperature liquid supply system 221 and third low-temperature liquid supply system 222). While supplying the low temperature liquid CW from the tank body 200 to the tank body 200, the supply amount of the low temperature liquid CW from the low temperature liquid supply system 22 (first low temperature liquid supply system 220, second low temperature liquid supply system 221, third low temperature liquid supply system 222 is provided. The liquid W in the tank body 200 is discharged from the liquid discharge system 23 (lower connection system 214) with a discharge amount smaller than the total supply amount). In the present embodiment, the liquid in the tank body 200 is discharged from the first discharge system 230 (second system 213b of the circulation system 213). Along with this, the liquid W in the tank body 200 is sent to the tank 210. Then, as shown in FIG. 6 (c), when the liquid level L in the tank body 200 becomes the first liquid level L1 where the entire processing target T ... is immersed, the supply of the low temperature liquid CW from the low temperature liquid supply system 22 is performed. To stop.

  Then, as shown in FIG. 7A, the liquid in the tank body 200 is maintained until the liquid level L of the tank body 200 is lower than the first liquid level L1 and higher than the second liquid level L2. W is discharged from the liquid discharge system 23. In the present embodiment, the liquid W in the tank body 200 is discharged from the first discharge system 230 (lower connection system 214). Along with this, the liquid W in the tank body 200 is sent to the tank 210.

  7B, when the liquid level L in the tank body 200 becomes the third liquid level L3, the cryogenic liquid CW is supplied from the cryogenic liquid supply system 22 to the tank body 200. In the present embodiment, the cryogenic liquid CW is supplied to the tank body 200 from the first cryogenic liquid supply system 220 and the third cryogenic liquid supply system 222. Then, the liquid W in the tank body 200 is discharged until the liquid level L in the tank body 200 reaches the third liquid level L3 (FIG. 7A), and the first from the third liquid level L3. Supplying the low-temperature liquid CW to the tank body 200 so as to reach the liquid level L1 (FIG. 7B) is repeated a predetermined number of times, and the processing object T is cooled. That is, a part of the high-temperature liquid HW in the tank main body 200 is repeatedly replaced with the low-temperature liquid CW, thereby lowering the temperature of the liquid W in the tank main body 200, thereby performing primary cooling of the processing object T. .

  In the present embodiment, as shown in FIG. 7C, when the liquid level L in the tank body 200 becomes the first liquid level L1, the temperature in the tank body 200 (liquid W (low temperature liquid CW)) is made uniform. For this purpose, the liquid W (cold liquid CW) in the tank body 200 is stirred.

  Specifically, one of the two systems on the downstream side of the third cryogenic liquid supply system 222 (connected to one of the side portions on both sides of the body 202 in the depth direction). The low temperature liquid CW is supplied from one of the two systems in the upstream area of the middle connection system 215 of the first discharge system 230 of the liquid discharge system 23 (the depth of the body 202). Liquid W (cold liquid CW) in the tank body 200 from any one of the side parts on both sides in the direction (system connected to the side opposite to the side to which the cryogenic liquid CW is supplied). ). That is, the cryogenic liquid CW is discharged from any one side of the body 202 of the tank body 200 while supplying the cryogenic liquid CW from any one side of the body 202 of the tank body 200. In the present embodiment, the position where the low temperature liquid CW is discharged and the position where the liquid (low temperature liquid CW) is discharged are appropriately switched (switched) by switching the system. Also in this case, the liquid W (cold liquid CW) in the tank body 200 is sent to the tank 210 via the liquid discharge system 23 (first discharge system 230).

  Then, when the primary cooling of the processing object T is completed, the liquid W in the tank body 200 is completely discharged as shown in FIG. In the present embodiment, the liquid W in the tank body 200 is completely discharged from the second discharge system 231 (lower connection system 214).

  Then, when the liquid W in the tank body 200 is completely removed, as shown in FIG. 8B, the low temperature liquid CW is supplied to the entire tank body 200 where the liquid level L in the tank body 200 becomes the first liquid level L1. The In the present embodiment, the low temperature liquid CW is supplied by the fourth low temperature liquid supply system 223 (the lower connection system 214).

  In this way, the liquid W in the tank body 200 is completely discharged, and the low temperature liquid CW is supplied into the tank body 200 from which the liquid W has been completely discharged so that the liquid level L becomes the first liquid level L1. Is performed at least once, so that the secondary cooling is performed on the processing object T. Then, as shown in FIG. 8C, the liquid W in the tank body 200 is completely discharged from the liquid discharge system 23 (in this embodiment, the lower connection system 214 of the second discharge system 231) after the secondary cooling. Thus, a series of processing is completed.

  As mentioned above, the processing apparatus 1 which concerns on this embodiment is the processing tank 20 containing the tank 201 which can accommodate the process target T ..., and the leg part 201 fixed to the lower part of the tank main body 200, and the processing tank 20 A high temperature liquid supply system 21 connected to the tank body 200 and supplying the high temperature liquid HW to the tank body 200, and a low temperature liquid supply system connected to the tank body 200 of the processing tank 20 and supplying the low temperature liquid CW to the tank body 200. 22, a liquid discharge system 23 that is connected to the lower part of the tank body 200 of the treatment tank 20 and discharges the liquid W in the tank body 200, and supply of the liquid W (high temperature liquid HW, low temperature liquid CW) to the tank body 200 The control unit 32 controls the discharge, and the control unit 32 in the tank main body 200 from the high-temperature liquid supply system 21 until the processing object T in the tank main body 200 reaches the first liquid level L1 to be immersed. High temperature liquid HW The high-temperature liquid HW discharged from the liquid discharge system 23 is discharged while the high-temperature liquid HW in the tank body 200 is discharged from the liquid discharge system 23 after a predetermined time has elapsed since the high-temperature liquid HW became the first liquid level L1. The low-temperature liquid CW is supplied into the tank body 200 from the low-temperature liquid supply system 22 with a supply amount smaller than the discharge amount, and the liquid level L in the tank body 200 is lower than the processing target T in the tank body 200. When the second liquid level L2 is reached, the discharge of the liquid W from the liquid discharge system 23 is stopped, and the low-temperature liquid supply system 22 is maintained until the liquid level L in the tank body 200 changes from the second liquid level L2 to the first liquid level L1. The low temperature liquid CW is supplied into the tank body 200 from the inside.

  In this way, when the predetermined time has elapsed after the high temperature liquid HW has reached the first liquid level L1, the processing object T ... in the tank body 200 is exposed to a high temperature atmosphere for the necessary time, so that the processing object T ... On the other hand, necessary heat treatment is performed. And when high temperature liquid HW becomes the 1st liquid level L1 and predetermined time passes, the tank main body 200 which stores the high temperature liquid HW will also be in a high temperature state, but the control part 32 of the processing apparatus 1 in this embodiment is the state. The high-temperature liquid HW discharged from the liquid discharge system 23 while discharging the high-temperature liquid HW at the first liquid level L1 from the liquid discharge system 23 after a predetermined time has elapsed since the high-temperature liquid HW reached the first liquid level L1. In order to supply the low temperature liquid CW from the low temperature liquid supply system 22 to the tank body 200 with a supply amount smaller than the discharge amount, the low temperature liquid CW to which the high temperature liquid HW of the tank body 200 is supplied is discharged while being deprived of heat. The That is, along with the supply of the low temperature liquid CW, the high temperature liquid HW in the tank body 200 is discharged from the liquid discharge system 23 while lowering the temperature. Thereby, also about the temperature of the tank main body 200, it falls so that the temperature fall of the high temperature liquid HW may be followed.

  Accordingly, when the liquid level L in the tank main body 200 becomes the second liquid level L2 lower than the processing target T in the tank main body 200, the temperature of the tank main body 200 is lowered. Even if the liquid CW is supplied, the tank body 200 is not rapidly cooled, and damage to the processing tank 20 is suppressed. Further, the discharge of the liquid W from the liquid discharge system 23 is stopped, and the low-temperature liquid CW is supplied from the low-temperature liquid supply system 22 to the tank body 200 containing the processing object T ... to the first liquid level L1. The processing object T is sufficiently cooled by the low temperature liquid CW.

  In particular, when the object T to be processed is a retort pack or the like containing food in a container as in the present embodiment, the discharge of the liquid W (hot liquid HW) from the liquid discharge system 23 is stopped and the low temperature liquid supply system is stopped. 22, the temperature of the tank body 200 is lowered in the previous stage in which the low temperature liquid CW is supplied from the second liquid level L2 to the first liquid level L1 with respect to the tank body 200 containing the processing object T. Since the tank body 200 is cooled), uniform processing (sterilization, cooking process) is possible for all the processing objects T ... in the tank body 200.

  More specifically, the discharge of the liquid W from the liquid discharge system 23 is stopped, and the first liquid level from the second liquid level L2 to the tank body 200 containing the processing object T. In the previous stage of supplying the low-temperature liquid CW until L1, the temperature of the tank body 200 is lowered (the tank body 200 is cooled), so that the temperature state in the tank body 200 is balanced (location) The region where the temperature difference is large is eliminated or reduced. As a result, there are no or few objects having a large temperature difference in the entire processing object T... Accommodated in the tank body 200. Thereby, the low temperature liquid CW is supplied from the second liquid level L2 to the first liquid level L1 from the low temperature liquid supply system 22 to the tank main body 200 in which the processing object T is accommodated. The whole processing object T... Accommodated in is cooled in a balanced temperature state. Thereby, a uniform process is performed with respect to the processing object T ... in the tank main body 200. In this regard, the inventors measured the F values (index values such as sterilization efficiency) of the plurality of treatment objects T ... in the tank body 200 after the treatment, and confirmed that these F values do not vary. doing.

  In the present embodiment, the low-temperature liquid supply system 22 includes a liquid supply system (second low-temperature liquid supply system) 221 that supplies the low-temperature liquid CW to the upper region in the tank body 200 of the processing tank 20, and the control unit 32. While the high-temperature liquid HW in the tank body 200 is discharged from the liquid discharge system 23, the supply amount is smaller than the discharge amount of the high-temperature liquid HW discharged from the liquid discharge system 23. When the low temperature liquid CW is supplied into the tank body, the low temperature liquid CW is supplied from the liquid supply system (second low temperature liquid supply system) 221 to the tank body 200, so Is cooled by the low temperature liquid CW. That is, since the tank body 200 and the leg portion 201 are firmly connected, if a sudden temperature change is applied at the connecting portion of these two members, there is a risk that cracking or the like may occur due to the residual stress associated with thermal shrinkage. However, since the connecting portion between the tank body 200 and the leg 201 is at the lower part of the tank body 200, the cryogenic liquid CW is supplied to the upper region of the tank body 200 and the tank body 200 in the vicinity thereof is cooled. The tank body 200 is not damaged. In addition, in the process where the liquid level L is lowered by cooling the upper portion (region including the upper position) of the tank body 200, the heat (temperature) of the upper portion of the tank body 200 affects the lower region. Is suppressed. Accordingly, the tank body 200 is gradually cooled from the upper side toward the lower side, and the tank body 200 is sufficiently cooled. Therefore, even if the cryogenic liquid CW is supplied to the tank body 200, the tank body 200 is sufficiently prevented from being rapidly cooled.

  In the present embodiment, the control unit 32 supplies the cryogenic liquid CW from the cryogenic liquid supply system 22 into the tank body 200 until the liquid level L of the tank body 200 changes from the second liquid level L2 to the first liquid level L1. Then, the liquid W in the tank body 200 is discharged from the liquid discharge system 23 until the liquid level L in the tank body 200 becomes lower than the first liquid level L1 and higher than the second liquid level L2. Discharging the low-temperature liquid CW from the low-temperature liquid supply system 22 into the tank body 200 until the liquid level L in the tank body 200 changes from the third liquid level L3 to the first liquid level L1, In order to repeat the predetermined number of times, a part of the liquid W in the tank body 200 is repeatedly replaced with a new low-temperature liquid CW.

  Thereby, even if it is a case where the temperature of process target object T ... is high, the temperature of the liquid W in the tank main body 200 can be reduced, and process target object T ... is cooled appropriately as a result. That is, when the temperature of the processing object T ... is high, the temperature of the low-temperature liquid CW supplied into the processing tank 20 increases due to the influence of the heat of the processing object T ..., so the cooling effect on the processing object T ... Becomes lower. However, as described above, since a part of the liquid W in the tank body 200 is repeatedly replaced with the new low-temperature liquid CW, the temperature of the liquid W in the tank body 200 decreases, and thus the temperature of the processing object T. Also decreases. Therefore, the cooling process of the processing object T ... is efficiently performed.

  Moreover, the control part 32 is the inside of the tank main body 200 from the liquid discharge system 23 until the liquid level L in the tank main body 200 becomes the 3rd liquid level L3 lower than the 1st liquid level L1 and higher than the 2nd liquid level L2. The liquid W and the liquid level L in the tank main body 200 is supplied from the low temperature liquid supply system 22 into the tank main body 200 until the liquid level L changes from the third liquid level L3 to the first liquid level L1. Are repeated a predetermined number of times, and then all the liquid W in the tank body 200 is discharged from the liquid discharge system 23, and the low-temperature liquid supply system until the liquid level L in the tank body 200 reaches the first liquid level L1. Since the supply of the low temperature liquid CW from the tank 22 to the tank body 200 is performed at least once, all of the processing objects T ... in the tank body 200 are uniformly cooled. That is, according to the said structure, since the whole liquid W in the tank main body 200 is replaced with the novel low temperature liquid CW, all the process target T ... in the tank main body 200 is cooled equally.

  Moreover, the operating method of the processing apparatus 1 is the processing object T in the tank main body 200 of the processing tank 20 containing the tank main body 200 which can accommodate the processing target object T ..., and the leg part 201 fixed to the lower part of the tank main body 200. ... supplying the high temperature liquid HW from the high temperature liquid supply system 21 connected to the tank body 200 into the tank body 200 until the first liquid level L1 is reached, and the high temperature liquid HW is the first liquid level. Discharge of the high temperature liquid HW discharged from the liquid discharge system 23 while discharging the high temperature liquid HW in the tank main body 200 from the liquid discharge system 23 connected to the lower part of the tank main body 200 after a lapse of a predetermined time since becoming L1. The cryogenic liquid CW is supplied into the tank body 200 from the cryogenic liquid supply system 22 connected to the tank body 200 with a supply amount smaller than the amount, and the liquid level L in the tank body 200 is processed in the tank body 200. Than object T ... When the second liquid level L2 is reached, the discharge of the liquid W from the liquid discharge system 23 is stopped, and the liquid level L in the tank body 200 is kept low until the liquid level L in the tank body 200 changes from the second liquid level L2 to the first liquid level L1. Supplying the low temperature liquid CW from the liquid supply system 22 into the tank body 200.

  In this way, when the predetermined time has elapsed after the high temperature liquid HW has reached the first liquid level L1, the processing object T ... in the tank body 200 is exposed to a high temperature atmosphere for the necessary time, so that the processing object T ... On the other hand, necessary heat treatment is performed. And when high temperature liquid HW becomes the 1st liquid level L1 and predetermined time passes, the tank main body 200 which stores the high temperature liquid HW will also be in a high temperature state, but the control part 32 of the processing apparatus 1 in this embodiment is the state. The high-temperature liquid HW discharged from the liquid discharge system 23 while discharging the high-temperature liquid HW at the first liquid level L1 from the liquid discharge system 23 after a predetermined time has elapsed since the high-temperature liquid HW reached the first liquid level L1. In order to supply the low temperature liquid CW from the low temperature liquid supply system 22 to the tank body 200 with a supply amount smaller than the discharge amount, the low temperature liquid CW to which the high temperature liquid HW of the tank body 200 is supplied is discharged while being deprived of heat. The That is, along with the supply of the low temperature liquid CW, the high temperature liquid HW in the tank body 200 is discharged from the liquid discharge system 23 while lowering the temperature. Thereby, also about the temperature of the tank main body 200, it falls so that the temperature fall of the high temperature liquid HW may be followed.

  Therefore, when the liquid level L in the tank main body 200 becomes the second liquid level L2 lower than the processing target T in the tank main body 200, the temperature of the tank main body 200 is sufficiently lowered. Even if the low-temperature liquid CW is supplied to the tank, the tank body 200 is not rapidly cooled, and the treatment tank 20 (particularly, the tank body 200) is prevented from undergoing large thermal contraction. Thereby, since a big stress does not act on the processing tank 20, damage to the processing tank 20 is suppressed.

  Further, the discharge of the liquid W from the liquid discharge system 23 is stopped, and the low-temperature liquid CW is supplied from the low-temperature liquid supply system 22 to the tank body 200 containing the processing object T ... to the first liquid level L1. The processing object T is sufficiently cooled by the low temperature liquid CW.

  In particular, when the processing object T ... is a retort pack containing food in a container as in the present embodiment, the discharge of the liquid W from the liquid discharge system 23 is stopped, and the processing object from the low temperature liquid supply system 22 is stopped. Since the temperature of the tank body 200 is lowered (the tank body 200 is cooled) in the previous stage of supplying the low-temperature liquid CW to the first liquid level L1 with respect to the tank body 200 containing T ... A uniform process (sterilization, cooking process) can be performed on all the processing objects T.

  More specifically, the discharge of the liquid W from the liquid discharge system 23 is stopped, and the low temperature liquid CW is supplied from the low temperature liquid supply system 22 to the first liquid level L1 with respect to the tank body 200 containing the processing object T. In the previous stage of supply, the temperature of the tank body 200 is lowered (the tank body 200 is cooled), so that the temperature state in the tank body 200 is balanced (there is no region with a large temperature difference depending on the location). Or less). Therefore, the discharge of the liquid W from the liquid discharge system 23 is stopped, and the low-temperature liquid CW is supplied from the low-temperature liquid supply system 22 to the tank body 200 containing the processing object T ... to the first liquid level L1. The entire processing object T contained in the tank body 200 is cooled in a balanced temperature state. Thereby, a uniform process is performed with respect to the processing object T ... in the tank main body 200. In this regard, the inventors measured the F values (index values such as sterilization efficiency) of the plurality of treatment objects T ... in the tank body 200 after the treatment, and confirmed that these F values do not vary. doing.

  Further, in the operation method of the processing apparatus 1, the low-temperature liquid supply system 22 includes a liquid supply system (second low-temperature liquid supply system) 221 that supplies the low-temperature liquid CW to the upper region in the tank body 200 of the processing tank 20, While discharging the high temperature liquid HW in the tank main body 200 from the liquid discharge system 23 connected to the lower part of the tank main body 200, the supply amount of the tank main body is smaller than the discharge amount of the high temperature liquid HW discharged from the liquid discharge system 23. In order to supply the cryogenic liquid CW from the liquid supply system (second cryogenic liquid supply system) 221 to the tank body 200 when the cryogenic liquid CW is supplied from the cryogenic liquid supply system 22 connected to the tank 200 to the tank body 200, The upper part (region including the upper position) of the tank body 200 that is not easily affected by the stress is cooled by the low temperature liquid CW. That is, since the tank body 200 and the leg part 201 are firmly connected, if a sudden temperature change is applied at the connection part of the two members, the tank body 200 and the leg part 201 are cracked by the influence of the stress (for example, residual stress) accompanying the thermal contraction. However, since the connecting portion between the tank body 200 and the leg 201 is at the lower part of the tank body 200, the cryogenic liquid CW is supplied to the upper region of the tank body 200, and the tank body 200 in the vicinity thereof. Even if the tank is cooled, the tank body 200 is not damaged. Moreover, in the process where the liquid level L becomes low by cooling the upper part of the tank main body 200, it is suppressed that the heat | fever (temperature) of the upper part of the tank main body 200 affects the area | region on the lower side. Accordingly, the tank body 200 is gradually cooled from the upper side toward the lower side, and the tank body 200 is sufficiently cooled. Therefore, even if the cryogenic liquid CW is supplied to the tank body 200, the tank body 200 is sufficiently prevented from being rapidly cooled.

  In the operation method of the processing apparatus 1 according to the present embodiment, the low temperature liquid CW is supplied from the low temperature liquid supply system 22 into the tank body 200 until the liquid level L of the tank body 200 changes from the second liquid level L2 to the first liquid level L1. After the supply, the liquid W in the tank body 200 from the liquid discharge system 23 until the liquid level L in the tank body 200 reaches a third liquid level L3 that is lower than the first liquid level L1 and higher than the second liquid level L2. And supplying the low-temperature liquid CW from the low-temperature liquid supply system 22 into the tank body 200 until the liquid level L in the tank body 200 changes from the third liquid level L3 to the first liquid level L1. Since this includes repetition of the number of times, a part of the liquid W in the tank body 200 is repeatedly replaced with a new low-temperature liquid CW.

  Thereby, even if it is a case where the temperature of process target object T ... is high, the temperature of the liquid W in the tank main body 200 can be reduced, and process target object T ... is cooled appropriately as a result. That is, when the temperature of the processing object T ... is high, the temperature of the low-temperature liquid CW supplied into the processing tank 20 increases due to the influence of the heat of the processing object T ..., so the cooling effect on the processing object T ... Becomes lower. However, as described above, since a part of the liquid W in the tank body 200 is repeatedly replaced with the new low-temperature liquid CW, the temperature of the liquid W in the tank body 200 decreases, and thus the temperature of the processing object T. Also decreases. Therefore, the cooling process of the processing object T ... is efficiently performed.

  Also, the liquid W in the tank body 200 is discharged from the liquid discharge system 23 until the liquid level L in the tank body 200 becomes lower than the first liquid level L1 and higher than the second liquid level L2. And supplying the low-temperature liquid CW from the low-temperature liquid supply system 22 into the tank main body 200 a predetermined number of times until the liquid level L in the tank main body 200 changes from the third liquid level L3 to the first liquid level L1. After that, all the liquid W in the tank body 200 is discharged from the liquid discharge system 23, and the liquid level L in the tank body 200 is changed from the low temperature liquid supply system 22 to the inside of the tank body 200 until the liquid level L becomes the first liquid level L1. Since the low temperature liquid CW is supplied at least once, all of the processing objects T ... in the tank body 200 are uniformly cooled. That is, according to the said structure, since the whole liquid W in the tank main body 200 is replaced with the novel low temperature liquid CW, all the process target T ... in the tank main body 200 is cooled equally.

  In addition, this invention is not limited to the said embodiment, Of course, it can add suitably in the range which does not deviate from the summary of this invention.

  In the said embodiment, although the retort pack which accommodated the foodstuff in the container was made into the process target object T ..., it is not limited to this. The processing object T ... may be anything that is heat-treated by being immersed in the high-temperature liquid HW. That is, the processing apparatus 1 is not limited to the one intended for sterilization and cooking with respect to the processing object T. Therefore, in the said embodiment, hot water was used as the high temperature liquid HW, and water was used as the low temperature liquid CW, but the kind of the high temperature liquid HW and the low temperature liquid CW depends on the processing of the processing object T. What is necessary is just to select suitably.

  In the above-described embodiment, a plurality of systems of the high-temperature liquid supply system 21 are partially shared, a plurality of systems of the low-temperature liquid supply system 22 are partially used, or the system of the high-temperature liquid supply system 21 and the cryogenic liquid supply system 22 However, the present invention is not limited to this. For example, the plurality of systems constituting the flow path through which the liquid W is circulated may of course be independent systems.

  In the above embodiment, when the processing object T ... is heat-treated, the high-temperature liquid HW is maintained in the tank body 200 and the tank by the circulation system 213 so that the high-temperature liquid HW in the tank body 200 is maintained at a constant or substantially constant temperature. Although it was made to circulate between 210, it is not limited to this. That is, the high-temperature liquid HW in the tank body 200 only needs to be maintained at a temperature or a temperature range necessary for the heat treatment on the processing target T, and the high-temperature liquid HW is a method (means) for maintaining at this temperature or temperature range. A method (means) other than a method (means) for circulating the gas may be employed. For example, a heat source such as a heater is installed in the tank body 200, and the high temperature liquid H in the tank body 200 is maintained at a temperature or temperature range necessary for the heat treatment on the processing object T ... by heating with the heat source. May be. However, in this case as well, it is a matter of course that the processing object T ... is immersed in the high temperature liquid HW for a predetermined time (time required for the heat treatment).

  In the above-described embodiment, the low-temperature liquid CW is supplied from the second low-temperature liquid supply system 221 and the first low-temperature liquid supply system 220 after the low-temperature liquid CW is supplied from the second low-temperature liquid supply system 221, but this is not limitative. For example, the low temperature liquid CW may be continuously supplied only from the second low temperature liquid supply system 221 without supplying the low temperature liquid CW from the first low temperature liquid supply system 220. Further, instead of supplying the low-temperature liquid CW from the second low-temperature liquid supply system 221, the low-temperature liquid CW may be supplied from the first low-temperature liquid supply system 220. However, considering the cooling efficiency of the tank body 200, it is of course preferable to supply the low temperature liquid CW from the second low temperature liquid supply system 221 that supplies the low temperature liquid CW to the upper region of the tank body 200.

  In the above-described embodiment, the liquid W in the tank body 200 is discharged from the liquid discharge system 23 and the object to be processed from the low-temperature liquid supply system 22 until the liquid level L in the tank body 200 reaches the third liquid level L3. Supplying the low-temperature liquid CW to the first liquid level L1 with respect to the tank body 200 containing T ... after discharging a predetermined number of times, and then discharging the liquid W in the tank body 200 from the liquid discharge system 23; The low-temperature liquid CW is supplied from the low-temperature liquid supply system 22 to the tank main body 200 once so that the liquid level L of the tank main body 200 becomes the first liquid level L1 after the liquid W is discharged. Not. For example, until the liquid level L in the main body becomes the third liquid level L3, the liquid W in the tank main body 200 is discharged from the liquid discharge system 23, and the processing object T is accommodated from the low-temperature liquid supply system 22. The process may be completed by repeating supplying the cryogenic liquid CW to the tank body 200 to the first liquid level L1 a predetermined number of times.

  In the above-described embodiment, the liquid W in the tank body 200 is discharged from the liquid discharge system 23 and the object to be processed from the low-temperature liquid supply system 22 until the liquid level L in the tank body 200 reaches the third liquid level L3. The supply of the low-temperature liquid CW to the first liquid level L1 with respect to the tank body 200 containing T ... is not limited to this. For example, the high-temperature liquid HW is supplied from the high-temperature liquid supply system 21 to the first liquid level L1 in which the entire processing target T is immersed in the tank body 200 containing the processing target T ... Less than the discharge amount of the high-temperature liquid HW discharged from the liquid discharge system 23 while discharging the high-temperature liquid HW at the first liquid level L1 from the liquid discharge system 23 after a predetermined time has passed since the liquid level L1 was reached. When the supply amount supplies the low temperature liquid CW from the low temperature liquid supply system 22 to the tank body 200 and the liquid level L in the tank body 200 becomes the second liquid level L2 lower than the processing target T in the tank body 200. Then, the discharge of the liquid W from the liquid discharge system 23 is stopped, and the low-temperature liquid CW is supplied from the low-temperature liquid supply system 22 to the tank body 200 containing the processing object T. May be completed.

  That is, until the liquid level L in the main body reaches the third liquid level L3, the liquid W in the tank main body 200 is discharged from the liquid discharge system 23, and the processing target T ... is stored from the low-temperature liquid supply system 22. Supplying the cryogenic liquid CW to the tank body 200 to the first liquid level L1 is repeated a predetermined number of times (primary cooling), or after repeating the predetermined number of times, the liquid W in the tank body 200 from the liquid discharge system 23. And the supply of the low temperature liquid CW from the low temperature liquid supply system 22 to the tank body 200 so that the liquid level L of the tank body 200 becomes the first liquid level L1 after the liquid W is discharged at least once. What is necessary is just to perform suitably (secondary cooling) according to the process target T ... and its process.

  In the said embodiment, although the control part 32 controlled the flow path in each system | strain and performed the operating method of the processing apparatus 1 automatically, it is not limited to this. The operating method of the processing apparatus 1 may be realized by manually operating the valves of each system, for example.

  DESCRIPTION OF SYMBOLS 1 ... Processing apparatus (high temperature liquid type processing apparatus), 2 ... Apparatus main body, 3 ... Control panel, 20 ... Processing tank, 21 ... High temperature liquid supply system, 22 ... Low temperature liquid supply system, 23 ... Liquid discharge system, 30 ... Switch , 31 ... Display section, 32 ... Control section, 200 ... Tank body, 201 ... Leg section, 202 ... Body section, 203 ... Blocking section, 210 ... Tank, 211 ... First piping system, 212 ... Supply system, 213 ... Circulation System, 213a ... First system, 213b ... Second system, 214 ... Lower connection system, 215 ... Medium connection system, 216 ... Second piping system, 216a ... Main system, 216b ... Sub system, 220 ... First cryogenic liquid Supply system, 221 ... second cryogenic liquid supply system (liquid supply system), 222 ... third cryogenic liquid supply system, 223 ... fourth cryogenic liquid supply system, 230 ... first discharge system, 231 ... second discharge system, E ... Steam ejector L ... Liquid level, L1 ... First liquid level, L2 ... Second liquid level, L3 ... Third liquid level, T ... Process target, P ... Electric pump, V ... Electric valve, HW ... High temperature liquid, CW ... Low temperature Liquid, W ... Liquid

Claims (8)

  A tank body capable of accommodating a processing object and a treatment tank including a leg fixed to the lower part of the tank body, a high-temperature liquid supply system connected to the tank body of the treatment tank, and supplying a high-temperature liquid to the tank body, and processing A cryogenic liquid supply system that is connected to the tank body of the tank and supplies the cryogenic liquid to the tank body, a liquid discharge system that is connected to the lower part of the tank body of the processing tank and discharges the liquid in the tank body, and a liquid for the tank body A control unit that controls supply and discharge of the liquid, and the control unit supplies the high-temperature liquid from the high-temperature liquid supply system into the tank body until reaching the first liquid level where the entire object to be processed in the tank body is immersed. The supply amount is smaller than the discharge amount of the high temperature liquid discharged from the liquid discharge system while discharging the high temperature liquid in the tank body from the liquid discharge system after a predetermined time has passed since the high temperature liquid became the first liquid level. The cryogenic liquid from the cryogenic liquid supply system into the tank body. When the liquid level in the tank body reaches a second liquid level lower than the object to be processed in the tank body, the liquid discharge from the liquid discharge system is stopped and the liquid level in the tank body is set to the second liquid level. A high-temperature liquid heat treatment apparatus, wherein a low-temperature liquid is supplied from the low-temperature liquid supply system into the tank body until the first liquid level is reached.   The cryogenic liquid supply system includes a liquid supply system that supplies the cryogenic liquid to the upper region in the tank body of the treatment tank, and the control unit allows the hot liquid in the tank body to be discharged from the liquid discharge system while The low temperature liquid is supplied from the liquid supply system into the tank body when the low temperature liquid is supplied from the low temperature liquid supply system into the tank body with a supply amount smaller than the discharge amount of the discharged high temperature liquid. High temperature liquid heat treatment equipment.   The control unit supplies the low temperature liquid from the low temperature liquid supply system to the tank body until the liquid level in the tank body changes from the second liquid level to the first liquid level, and then the liquid level in the tank body is changed to the first liquid level. The liquid in the tank body from the liquid discharge system until the third liquid level is lower and higher than the second liquid level, and the liquid level in the tank body is changed from the third liquid level to the first liquid level. The high-temperature liquid heat treatment apparatus according to claim 1 or 2, wherein the supply of the low-temperature liquid from the low-temperature liquid supply system into the tank body is repeated a predetermined number of times.   The control unit discharges the liquid in the tank body from the liquid discharge system until the liquid level in the tank body becomes a third liquid level lower than the first liquid level and higher than the second liquid level. After the liquid level in the tank has changed from the third level to the first level, the cryogenic liquid is supplied from the cryogenic liquid supply system into the tank body a predetermined number of times, and then all of the liquid in the tank body from the liquid discharge system. 4. The liquid according to claim 3, wherein the liquid is discharged and the cryogenic liquid is supplied into the tank body from the cryogenic liquid supply system until the liquid level in the tank body reaches the first liquid level. Heat treatment device.   It is connected to the tank body until it reaches the first liquid level where the entire processing object in the tank body of the processing tank including the tank body that can accommodate the processing object and the legs fixed to the lower part of the tank body is immersed. Supply high temperature liquid into the tank body from the high temperature liquid supply system, and after a predetermined time has elapsed since the high temperature liquid became the first liquid level, from the liquid discharge system connected to the lower part of the tank body, Supplying the cryogenic liquid into the tank body from the cryogenic liquid supply system connected to the tank body with a supply amount smaller than the discharge amount of the hot liquid discharged from the liquid discharge system, while discharging the hot liquid; When the liquid level in the main body becomes a second liquid level lower than the processing target in the tank body, the liquid discharge from the liquid discharge system is stopped, and the liquid level in the tank body starts from the second liquid level. Supply cryogenic liquid from the cryogenic liquid supply system into the tank body until the first liquid level is reached. How the operation of the high-temperature liquid type heat treatment apparatus, which comprises a.   The low-temperature liquid supply system includes a liquid supply system that supplies a low-temperature liquid to an upper region in the tank body of the processing tank, while discharging the high-temperature liquid in the tank body from a liquid discharge system connected to the lower part of the tank body, When supplying cryogenic liquid into the tank body from the cryogenic liquid supply system connected to the tank body with a supply amount smaller than the discharge amount of the hot liquid discharged from the liquid discharge system, the liquid supply system enters the tank body. The operation method of the high temperature liquid type heat treatment apparatus according to claim 5, wherein the low temperature liquid is supplied.   After supplying the cryogenic liquid from the cryogenic liquid supply system into the tank body until the liquid level in the tank body changes from the second liquid level to the first liquid level, the liquid level in the tank body is lower than the first liquid level and Discharge the liquid in the tank body from the liquid discharge system until the third liquid level higher than the second liquid level, and supply the low-temperature liquid until the liquid level in the tank body changes from the third liquid level to the first liquid level. The method for operating a high-temperature liquid heat treatment apparatus according to claim 5 or 6, comprising repeating a predetermined number of times of supplying the low-temperature liquid from the system into the tank body.   Discharging the liquid in the tank body from the liquid discharge system until the liquid level in the tank body is lower than the first liquid level and higher than the second liquid level, and the liquid level in the tank body After supplying the cryogenic liquid from the cryogenic liquid supply system to the tank body a predetermined number of times until the liquid level changes from the third liquid level to the first liquid level, all liquid in the tank body is drained from the liquid discharge system. And supplying the cryogenic liquid into the tank body from the cryogenic liquid supply system at least once until the liquid level in the tank body reaches the first liquid level. Of operating a heat treatment apparatus.