JP2018101742A - Electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide electronic equipment which is easy to perform assembling work and has low mechanical stress due to the assembling work.SOLUTION: A moving object detecting device 100 is provided with a board disposition part 12 on which a circuit board 4 is disposed. The board disposition part 12 is provided with a disposition surface on which the circuit board 4 is disposed and includes a first board guide part 13 and a second board guide part 14 for restricting movement of the circuit board 4 on the disposition surface and a hook part 15 for restricting separation of the circuit board 4 from the disposition surface to facilitate disposition work of the circuit board 4 on the board disposition part 12 and to securely maintain an installation state of the circuit board 4 .SELECTED DRAWING: Figure 2

Description

  The present invention relates to an electronic device including a circuit board.

  Currently, various moving object detection devices have been proposed. For example, Patent Document 1 discloses a moving object detection device incorporating a circuit board on which electronic components are mounted. Although there is no direct disclosure in Patent Document 1, as a method of attaching a circuit board to a moving object detection device, a guide mechanism for guiding the circuit board is provided in the moving object detection device, and the circuit board is mounted on the guide mechanism as a guide A method of mounting on an arrangement portion is known. As this guide mechanism, there is known a guide groove for inserting a circuit board and guiding it to a board disposition position.

JP 2011-7704 A

  When the guide groove is used as the guide mechanism, it is necessary to get used to the operation of inserting the circuit board into the guide groove, and there is a problem that it is difficult to understand the stop position of the circuit board in the guide groove, and the assembly work is difficult. Another problem is that the mechanical stress applied to the circuit board is large due to the assembly work of inserting the circuit board into the guide groove and pushing it in.

  The same problem exists not only in the moving object detection device but also in all electronic devices incorporating a circuit board.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide an electronic device that is easy to assemble and has low mechanical stress due to the assembling work.

  In order to achieve the object of the present invention, an electronic apparatus according to the present invention is an electronic apparatus configured by disposing a circuit board, and has a disposition portion having a disposition surface on which the circuit board is disposed. And a board guide portion that guides the circuit board toward the arrangement surface in a direction perpendicular to the arrangement surface and restricts movement of the circuit board in a direction parallel to the arrangement surface. Prepare.

  For example, when the circuit board is arranged on the arrangement surface, the board guide portion guides the circuit board to the arrangement surface in a direction perpendicular to the arrangement surface and arranges the circuit board. Positioning is performed in a direction parallel to the surface, and movement of the circuit board in a direction parallel to the arrangement surface is restricted in a state where the circuit board is arranged on the arrangement surface.

  For example, the board guide portion regulates movement of the circuit board in two directions parallel to the arrangement surface and orthogonal to each other.

  The substrate guide portion may include a columnar member extending in a direction perpendicular to the arrangement surface.

  The substrate guide portion may include a ridge portion extending on a side surface of the columnar member in a direction orthogonal to the arrangement surface.

  For example, the substrate guide portion may include first and second substrate guide portions that are on a straight line and press the side surface of the circuit board in the opposite direction on the straight line.

  The circuit board has, for example, a first side surface extending in a first direction and a second side surface extending in a second direction orthogonal to the first direction, and the substrate guide portion is The first side surface is pressed in the second direction, and the second side surface is pressed in the first direction.

  For example, the circuit board is formed with at least a pair of stepped portions having two orthogonal sides at opposite positions, and the substrate guide contacts the two sides of each of the stepped portions.

  You may provide the hook part which latches the said circuit board so that separation of the said circuit board from the said arrangement | positioning surface may be controlled.

  For example, the circuit board includes a through hole for inserting a lead terminal, and further includes a lead terminal standing on the arrangement surface and penetrating the through hole for inserting the lead terminal of the circuit board. The height from the surface may be configured to be higher in the order of the lead terminal, the substrate guide portion, and the hook portion.

  According to the present invention, it is possible to provide an electronic apparatus that is easy to assemble and that has low mechanical stress due to the assembling work.

It is a top view which shows the external appearance of the moving object detection apparatus which concerns on embodiment of this invention. It is an enlarged plan view in a state where the housing cover of the moving object detection device according to the embodiment is removed. It is a top view of the circuit board used for the moving object detection apparatus which concerns on embodiment. It is an expansion whole perspective view in the state where a housing cover and a circuit board of a moving object detection device concerning an embodiment were removed. It is the elements on larger scale of the board | substrate arrangement | positioning part of the moving object detection apparatus which concerns on embodiment. It is a partial expansion perspective view of the board | substrate arrangement | positioning part of the moving object detection apparatus which concerns on embodiment of this invention. It is a figure which shows the height relationship of an arrangement | positioning surface, a lead terminal, the 1st and 2nd board | substrate guide part, and a hook part. (A) is a modification of a circuit board, (b) is a top view which shows the other example of the board | substrate guide for circuit boards shown to Fig.8 (a). It is a top view which shows the other example of a circuit board and a board | substrate guide.

Hereinafter, an electronic apparatus including a circuit board according to an embodiment of the present invention will be described with a moving object detection device as an example with reference to FIGS.
The members and arrangements described below do not limit the present invention and can be variously modified within the scope of the gist of the present invention.

  The moving object detection apparatus 100 according to the present embodiment is an apparatus that detects a moving object by a magnetic change. As shown in FIG. 1, the moving object detection device 100 includes a housing part 1 and a connector part 2 having lead terminals 6.

  The housing part 1 incorporates a magnetic detection element 3 and a circuit board 4 described later, and is covered with a housing cover 5.

  As shown in a perspective view in FIG. 4, the connector portion 2 is provided in a form that bends so as to be substantially orthogonal to the housing portion 1. The connector part 2 is composed of a female connector having lead terminals 6. The connector part 2 can be fitted with an external male connector (not shown).

  The lead terminal 6 is erected from the bottom of the connector portion 2 and is used for output of signals to the outside, power supply from the outside, and the like.

  On the other hand, as shown in FIG. 2, a magnetic detection element 3 is disposed at an end portion (lower end portion in the drawing) facing the connector portion 2 of the housing portion 1, and a circuit board 4 is disposed at the center portion thereof. ing.

  The magnetic detection element 3 is composed of a Hall IC (Integrated Circuit) or the like, measures the intensity of the surrounding magnetism, and outputs a measurement signal.

  The circuit board 4 is electrically connected to the magnetic detection element 3 and, for example, an electronic component 41 used for stabilizing a power supply voltage supplied from the outside is mounted on the circuit board 4 to form an electronic circuit.

  As shown in FIGS. 2 and 3, the entire shape of the circuit board 4 is formed in a substantially rectangular shape, and a narrow portion 4a and a wide portion 4b are formed in the longitudinal axis direction (the vertical direction in FIG. 3). Has been. A key-shaped step portion 9 is provided at the connecting portion between the narrow portion 4 a and the wide portion 4 b so as to face each other with the circuit board 4 interposed therebetween.

  Each step portion 9 includes a side along the Y axis, where the longitudinal direction of the circuit board 4 is the Y axis, and the direction orthogonal to the Y axis in the plane including the circuit board 4 (short axis direction) is the X axis. It has two sides along the X axis.

  On both side edges of the wide portion 4b of the circuit board 4, there are formed concave notches 11 into which a main body portion 15a of a hook portion 15 described later is fitted. The concave cutout 11 has a shape cut out in a U shape.

  A through hole 7 into which a later-described lead terminal 16 is inserted is formed at one end in the longitudinal direction of the circuit board 4. A plurality of lead terminal lands 8 to be soldered to the lead terminals 16 are formed around the through holes 7. A plurality of element lands 10 to which the connection terminals of the magnetic detection elements 3 are soldered are formed at the other end in the longitudinal direction of the circuit board 4. Furthermore, printed wiring (not shown) is provided on the circuit board 4 and electronic components such as a regulator and an amplifier circuit are arranged to form an electronic circuit as a whole.

  As shown in FIG. 4, the housing portion 1 is provided with a substrate disposition portion (arrangement portion) 12 for placing the circuit board 4 thereon. The substrate placement portion 12 is formed flat, and includes a placement surface 12a on which the circuit board 4 is placed, and side portions 12b formed on both sides of the placement surface 12a. The side part 12b is provided at a position lower than the arrangement surface 12a.

  The arrangement surface 12 a is formed in a shape whose outer peripheral shape substantially matches the outer peripheral shape of the circuit board 4.

  As shown in FIG. 4 and further enlarged in FIGS. 5 and 6, a first substrate guide portion 13 is suspended from a portion of the side portion 12 b where the step portion 9 of the circuit substrate 4 is located. The first board guide portion 13 guides the circuit board 4 and positions the circuit board 4 when the circuit board 4 is mounted on the board placement section 12, and regulates the movement of the circuit board 4 after the mounting. Fulfills the function.

  The first substrate guide portion 13 has a main body portion 13a formed in a rectangular column shape integrally formed with a resin on the arrangement surface 12a. Further, of the four side surfaces of the main body portion 13a, the first side surface and the second side surface facing the step portion 9 of the circuit board 4 are projected outward (toward the edge of the step portion 9). A portion 13b is formed to protrude.

  The ridge 13b is formed integrally with the main body 13a. The main body portion 13a and the ridge portion 13b extend in a direction substantially perpendicular to the arrangement surface 12a. Each of the first board guide portions 13 is positioned above the circuit board 4 with the top thereof being arranged on the arrangement surface 12a. The tops of the protrusions 13b are in contact with the side surfaces of the step portions 9 of the circuit board 4 to restrict the movement of the circuit board 4 in two orthogonal directions on the mounting surface. Specifically, as shown in FIG. 2, each first board guide portion 13 has two sides (first side and second side) that are connected at right angles to form a corresponding step portion 9 of the circuit board 4. The first side is called by the ridge 13b in a direction parallel to the second side (direction facing the second substrate guide portion 14 facing the second side), and the second side is pushed by the second side. The protrusion 13b is pressed in a direction perpendicular to the side (a direction toward the first substrate guide 13 facing the side). That is, the circuit board 4 is pressed in two orthogonal directions.

  For example, the protrusion 13b is preferably formed so that the shape of the cross section orthogonal to the longitudinal axis direction of the main body 13a is substantially triangular.

  In addition, although the cross-sectional shape of the protrusion part 13b mentioned above does not necessarily need to be limited to a triangle shape, from a viewpoint of restrict | limiting the movement of the circuit board 4 reliably, the protrusion part 13b contact | abutted to the step part 9 is used. It is desirable that the apex angle is an acute angle.

  A lead terminal 16 is suspended from one end of the arrangement surface 12a. The lead terminal 16 is connected to the lead terminal 6 by an internal circuit (not shown). The lead terminal 16 is inserted into the through hole 7 for insertion of the lead terminal when the circuit board 4 is arranged in the board arrangement portion 12.

  In the vicinity of one end portion of the arrangement surface 12a, a pair of second substrate guide portions 14 that abut one end surface of the circuit board 4, that is, the end surface 4c on the part side where the lead terminal land 8 is provided, are provided. ing. Each second board guide portion 14, like the first board guide portion 13, is suspended so that its apex is located above the circuit board 4 in a state where the circuit board 4 is arranged on the arrangement surface 12 a. It is installed.

  Each second substrate guide portion 14 has a main body portion 14a formed in a prismatic shape. On the surface desired for one end surface 4c of the circuit board 4 of each main body portion 14a, a protrusion 14b is formed to project. The main body portion 14a and the protruding portion 14b are formed of a resin or the like integrally with the substrate arrangement portion 12, and extend in a direction perpendicular to the placement surface.

  As shown in FIG. 5, each first substrate guide portion 13 and the corresponding second substrate guide portion 14 are arranged on an imaginary straight line, and the protruding portions 13b and 14b face each other. The interval L1 is equal to or slightly smaller than the length of the wide portion 4b of the circuit board 4. Further, the pair of first substrate guide portions 13 are arranged on an imaginary straight line, and the protruding portions 13b face each other. The interval L2 is equal to or slightly smaller than the width of the narrow portion 4a of the circuit board 4.

  With such a configuration, the first substrate guide portion 13 and the second substrate guide portion 14 guide the circuit board 4 toward the arrangement surface 12a in the direction perpendicular to the arrangement surface 12a and arrange the circuit board 4. The movement of the circuit board 4 in the direction parallel to the installation surface 12a is restricted.

  Further, as shown in FIG. 2, a pair of hook portions 15 are provided in the board placement portion 12 so as to sandwich both side edges of the wide portion 4 b of the circuit board 4. As shown in FIG. 6, each hook portion 15 has a main body portion 15a formed in a columnar shape. The main body 15a has a shape that fits into the concave notch 11 of the circuit board 4 when the circuit board 4 is disposed.

  The top portion of the main body portion 15 a is positioned in the vertical direction with respect to the substrate placement portion 12 and above the circuit board 4. An overhang 15b is formed on the top of the main body 15a. The overhanging portions 15b are formed so as to project toward the corresponding hook portions 15, and a distance L3 (see FIG. 5) between the overhanging portions 15b of the two hook portions 15 is formed in the circuit board 4. It is set smaller than the distance Lp (see FIG. 3) between the concave notches 11 (L3 <Lp). The side surface shape of the hook portion 15, that is, the outer shape of the side surface when the hook portion 15 is viewed from the up and down direction in FIG. 5, for example, is substantially an inverted L shape.

  Further, the main body portion 15a and the overhang portion 15b are formed using elastically deformable members, and the interval between the two overhang portions 15b can be increased.

  In the above configuration, the height of the lead terminal 16, the first and second substrate guide portions 13 and 14, and the hook portion 15 (more precisely, the height of the apex from the arrangement surface 12a) is as shown in FIG. As shown, the lead terminal 16, the first and second substrate guide portions 13 and 14, and the hook portion 15 are arranged in this order.

  Next, a procedure for mounting the circuit board 4 on the board placement portion 12 having the above-described configuration will be described.

  First, a circuit board 4 on which necessary electronic components are mounted by soldering or the like is prepared. Next, as shown in FIGS. 3, 4, and 7, the through hole 7 is formed from above the placement surface 12 a while maintaining the circuit board 4 substantially parallel to the placement surface 12 a of the board placement portion 12. Opposite to the lead terminal 16, the concave cutout portion 11 is opposed to the hook portion 15, and the wide portion 4 b is positioned between the pair of first substrate guide portions 13 and the pair of second substrate guide portions 14, and has a width. The circuit board 4 is pushed down from above to the arrangement surface 12a in a direction perpendicular to the arrangement surface 12a so that the narrow portion 4a is located between the pair of first substrate guide portions 13.

  Then, first, the lead terminal 16 is inserted into the through hole 7 of the circuit board 4. At this stage, no mechanical stress is applied to the circuit board 4. Subsequently, the vicinity of the end surface 4 c of the circuit board 4 and the stepped part 9 are brought into contact with the first and second board guide parts 13 and 14.

  The first board guide part 13 and the second board guide part 14 guide the circuit board 4 in the direction of the arrangement surface 12a while being bent according to stress due to its elasticity. Further, the circuit board 4 is positioned in two orthogonal directions (longitudinal direction and short direction of the circuit board 4) in a plane parallel to the arrangement surface 12a by the protrusions 13b and 14b.

  Subsequently, the concave notch portion 11 of the circuit board 4 is brought into contact with the protruding portion 15 b of the hook portion 15.

  The hook portion 15 bends according to the stress due to its elasticity and allows the circuit board 4 to pass through. When the circuit board 4 passes through the overhanging portion 15b, the hook portion 15 is restored by the elasticity of the main body portion 15a, the main body portion 15a is loosely fitted into the concave cutout portion 11 of the circuit board 4, and the overhanging portion 15b is connected to the circuit. It covers the upper surface of the substrate 4 and locks it.

  When the circuit board 4 is placed on the arrangement surface 12a, the protrusions 13b of the pair of first substrate guides 13 and the protrusions 14b of the pair of second substrate guides 14 are further connected to the circuit. The side edge of the substrate 4 is pressed. Specifically, as shown in FIG. 2, each first board guide portion 13 has two sides (first side and second side) that are connected at right angles to form a corresponding step portion 9 of the circuit board 4. The first side is called by the ridge 13b in a direction parallel to the second side (direction facing the second substrate guide portion 14 facing the second side), and the second side is pushed by the second side. The protrusion 13b is pressed in a direction perpendicular to the side (a direction toward the first substrate guide 13 facing the side). That is, the circuit board 4 is pressed in two orthogonal directions. Each of the second board guide portions 14 presses the end face 4c of the circuit board 4 toward the opposing first board guide portion 13.

  As a result, the movement of the circuit board 4 is restricted in two directions that are parallel and orthogonal to the arrangement surface 12a, that is, two directions that are orthogonal to the longitudinal direction and the short direction, and thereafter the in-plane direction of the circuit board 4 Is prevented from being displaced. Further, since the projecting portion 15b of the hook portion 15 is engaged with the peripheral portion of the concave cutout portion 11 of the circuit board 4, the separation of the circuit board 4 from the arrangement surface 12a is restricted.

  Thereafter, the lead terminals 16 and the lead terminal lands 8 are soldered, and the magnetic detecting element 3 is soldered to the element lands 10, so that the placement work of the circuit board 4 on the board placement portion 12 can be performed. finish.

  According to such a configuration, the first and second board guide portions 13 and 14 guide the circuit board 4 to the arrangement surface 12a in a direction perpendicular to the arrangement surface 12a and parallel to the arrangement surface 12a. Restrict movement in the direction. For this reason, the circuit board 4 can be arranged on the board arrangement part 12 with a simple operation without applying mechanical stress to the circuit board 4, particularly the land part. As described above, according to the present embodiment, in the operation of arranging the circuit board 4, the circuit board 4 is arranged on the arrangement surface 12a along the guides of the board guides (first and second board guide portions 13, 14). Can be easily arranged. That is, according to the present embodiment, it is possible to provide an electronic apparatus in which the circuit board 4 can be easily assembled. Further, after the circuit board 4 is disposed, the movement in the in-plane direction can be restricted by the board guide.

  The position and number of the first substrate guide portion 13 and the second substrate guide portion 14 are not limited to the above-described embodiments. For example, as shown in FIG. 8A, out of the four corners CA to CD of the circuit board 4, the two diagonally opposite corners (CA and CB or CC and CD) are orthogonal to each other. A cutout portion having two sides may be formed, and the first substrate guide portion 13 and the second substrate guide portion 14 may be provided to face each other as shown in FIG. 8B.

  In the above description, the circuit board 4 is fixed by sandwiching the circuit board 4 by the first and second board guide portions 13 and 14, but for example, as illustrated in FIG. The through hole 17 may be formed, and the inner surface of the through hole 17 may be pressed by the substrate guide portion 13.

  Further, the first and second substrate guide portions 13 and 14 may have a columnar shape instead of the quadrangular column shape. Further, if the circuit board 4 can be guided in the vertical direction to the arrangement surface 12a, it is not necessary to have a columnar shape, and a planar portion or a linear portion for guiding the circuit board 4 in the vertical direction to the arrangement surface 12a is provided. It only has to have.

  Moreover, although the example which presses the edge part of the circuit board 4 by the 1st and 2nd board | substrate guide parts 13 and 14 by the protrusion parts 13b and 14b was shown, the press here is the extent which touches, ie, this It may be just enough to touch. Further, the protrusions 13 b and 14 b may be slightly separated from the edge of the circuit board 4.

  Although the example where the substrate guide portions 13 and 14 are erected perpendicularly to the arrangement surface 12a has been shown, the verticality does not need to be strict. For example, in order to facilitate the mounting of the circuit board 4 to the board placement portion 12, for example, the distance between the board guide portions 13 and 14 may be increased as the distance from the placement surface 12a increases.

  As the cross-sectional shape of the protrusions 13b and 14b, a configuration in which the cross-section is triangular is illustrated, but the cross-sectional shape is arbitrary, and may be, for example, a semicircular shape.

  Further, the hook portion 15 may not be provided.

  In the above embodiment, the protrusions 13b and 14b are provided on the main body portions 13a and 14a of the first and second substrate guide portions 13 and 14, but the protrusions 13b and 14b are arranged on the circuit board 4. It may be provided only in the vicinity of the installation position. Therefore, the protruding portion may have a protruding shape.

  Although the example which forms the 1st and 2nd board | substrate guide parts 13 and 14 and the hook part 15 integrally with the board | substrate arrangement | positioning part 12 with resin was shown, these may be separate. The material may be other than resin. However, it is desirable to have elasticity enough to bend by the force received when the circuit board 4 is inserted.

  Although the example of the flat surface was shown as the arrangement | positioning surface 12a, the arrangement | positioning surface 12a does not need to be flat. If the circuit board 4 can be stably disposed, the flatness of the disposition surface is arbitrary. For example, when the circuit board 4 has irregularities, a concave part that accommodates the convex part of the circuit board 4 and a convex part that is inserted into the concave part of the circuit board 4 may be formed. Moreover, the divided mounting surface may be formed by a plurality of pedestals.

  Although an example in which the present invention is applied to a moving body detection apparatus that detects a moving body by detecting a change in magnetism has been shown, the present invention can be applied to various electronic devices on which a circuit board is mounted.

DESCRIPTION OF SYMBOLS 1 ... Housing part 2 ... Connector part 3 ... Magnetic sensing element 4 ... Circuit board 4a ... Narrow part 4b ... Wide part 4c ... End surface 5 ... Housing cover 6 ... Lead terminal 7 ... Through-hole 8 ... Lead terminal land 9 ... Step Part 10: Element land 11 ... Concave notch 12 ... Substrate arrangement part (arrangement part)
12a ... Arrangement surface 12b ... Side 13 ... First substrate guide (substrate guide)
13a ... main body 13b ... ridge 14 ... second substrate guide (substrate guide)
14a ... main body 14b ... ridge 15 ... hook 15a ... main body 15b ... overhang 16 ... lead terminal 17 ... through hole 41 ... electronic component 100 ... moving object detection device CA to CD ... corners L1, L2 ... Interval L3 ... distance Lp ... distance

Claims (10)

An electronic device configured with a circuit board,
An arrangement portion having an arrangement surface on which the circuit board is arranged;
A board guide portion that guides the circuit board in a direction perpendicular to the arrangement surface toward the arrangement surface and restricts movement of the circuit board in a direction parallel to the arrangement surface;
An electronic device comprising: The substrate guide portion is
When arranging the circuit board on the arrangement surface, the circuit board is guided to the arrangement surface in a direction perpendicular to the arrangement surface, and the circuit board is positioned in a direction parallel to the arrangement surface. ,
Restricting movement of the circuit board in a direction parallel to the arrangement surface in a state where the circuit board is arranged on the arrangement surface;
The electronic device according to claim 1. The board guide portion regulates movement of the circuit board in two directions parallel to the arrangement surface and orthogonal to each other;
The electronic device according to claim 1, wherein the electronic device is an electronic device. The substrate guide portion includes a columnar member extending in a direction perpendicular to the arrangement surface.
The electronic device according to claim 1, wherein the electronic device is an electronic device. The substrate guide portion includes a ridge portion extending on a side surface of the columnar member in a direction orthogonal to the arrangement surface.
The electronic device according to claim 4. The board guide portion includes first and second board guide portions that are on a straight line and press the side surface of the circuit board in the opposite direction on the straight line.
The electronic device according to claim 1, wherein the electronic device is an electronic device. The circuit board has a first side surface extending in a first direction and a second side surface extending in a second direction orthogonal to the first direction;
The substrate guide portion presses the first side surface in the second direction and presses the second side surface in the first direction;
The electronic device according to any one of claims 1 to 6, wherein On the circuit board, at least a pair of step portions having two orthogonal sides are formed at opposing positions,
The substrate guide part abuts on the two sides of each stepped part,
The electronic device according to claim 1, wherein the electronic device is an electronic device. A hook portion for locking the circuit board so as to regulate the separation of the circuit board from the arrangement surface;
The electronic device according to claim 1, wherein the electronic device is an electronic device. The circuit board includes a through hole for inserting a lead terminal,
A lead terminal standing on the arrangement surface and penetrating through the lead terminal insertion hole of the circuit board;
The height from the arrangement surface is formed higher in the order of the lead terminal, the substrate guide part, the hook part,
The electronic apparatus according to claim 9.

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