JP2018100901A

JP2018100901A - Radiation imaging device, method for manufacturing the same, and radiation imaging system

Info

Publication number: JP2018100901A
Application number: JP2016247013A
Authority: JP
Inventors: 航太西部; Kota Nishibe; 石井　孝昌; Takamasa Ishii; 孝昌石井
Original assignee: Canon Inc
Current assignee: Canon Inc
Priority date: 2016-12-20
Filing date: 2016-12-20
Publication date: 2018-06-28

Abstract

PROBLEM TO BE SOLVED: To provide a technology that is advantageous for reducing the width of a frame in a radiation imaging device that includes a sensor part formed of a plurality of sensor chips.SOLUTION: A radiation imaging device comprises: a base; a sensor part that is arranged on a surface of the base and generates a signal according to a radiation made incident thereon; a scintillator panel that is arranged on a surface of the sensor part; a wiring board that is bent along the surface of the sensor part and a side face of the base; and a sealing member that is arranged between the base and scintillator panel. The sensor part is formed of a plurality of sensor chips; through-holes are arranged in a first portion between a portion covering the surface of the sensor part and a portion covering the side face of the base of the wiring board; the sealing member includes a first sealing member that is arranged between a side face of the sensor part and first portion.SELECTED DRAWING: Figure 2

Description

本発明は、放射線撮像装置、その製造方法および放射線撮像システムに関する。 The present invention relates to a radiation imaging apparatus, a manufacturing method thereof, and a radiation imaging system.

医療画像診断や非破壊検査に放射線撮像装置が広く利用されている。特許文献１には、撮像領域を大面積化するために基台の表面の上に配された複数のセンサチップによって構成されるセンサ部と、センサ部の上に配されたシンチレータとを有する放射線撮像装置が示されている。また、放射線撮像装置の周囲には、外部から水分などが侵入しシンチレータが劣化することを抑制するための封止部材が配され、撮像素子から信号を出力させるための配線基板が、この封止部材を貫通して配されることが示されている。 Radiation imaging apparatuses are widely used for medical image diagnosis and nondestructive inspection. Patent Document 1 discloses a radiation having a sensor unit including a plurality of sensor chips arranged on a surface of a base in order to enlarge an imaging region, and a scintillator arranged on the sensor unit. An imaging device is shown. In addition, a sealing member is provided around the radiation imaging apparatus to prevent moisture and the like from entering from the outside and the scintillator from deteriorating, and a wiring board for outputting a signal from the imaging element It is shown that it is arranged through the member.

特開２０１６−１１９５８号公報JP 2016-11958 A

放射線撮像装置において、有効画素端から筐体端部までの距離を短くする狭額縁化が求められている。狭額縁化するために、配線基板を複数のセンサチップによって構成されるセンサ部の端部で基台の側面に沿うように曲げる必要がある。放射線撮像装置の周囲に封止部材を配した後に配線基板を曲げる場合、封止部材が基台の側面と配線基板との間に入り込み、狭額縁化できない可能性がある。また、配線基板を曲げた後に封止部材を形成する場合、センサ部の側面が配線基板に覆われるため、センサ部と配線基板との間に封止部材の材料が十分に入り込まない可能性がある。封止部材の充填が不十分な場合、基台および複数のセンサチップの隙間を通り、外部から水分が侵入しシンチレータの防湿性が劣化する可能性がある。 In a radiation imaging apparatus, there is a demand for a narrow frame that shortens the distance from the effective pixel end to the housing end. In order to narrow the frame, it is necessary to bend the wiring board along the side surface of the base at the end portion of the sensor portion constituted by a plurality of sensor chips. When the wiring board is bent after the sealing member is disposed around the radiation imaging apparatus, the sealing member may enter between the side surface of the base and the wiring board, and the frame may not be narrowed. Further, when the sealing member is formed after the wiring substrate is bent, the side surface of the sensor unit is covered with the wiring substrate, so that there is a possibility that the material of the sealing member does not sufficiently enter between the sensor unit and the wiring substrate. is there. If the sealing member is not sufficiently filled, moisture may enter from the outside through the gap between the base and the plurality of sensor chips, and the moisture resistance of the scintillator may deteriorate.

本発明は、複数のセンサチップによって構成されるセンサ部を備える放射線撮像装置において、狭額縁化に有利な技術を提供することを目的とする。 An object of the present invention is to provide a technique advantageous for narrowing a frame in a radiation imaging apparatus including a sensor unit including a plurality of sensor chips.

上記課題に鑑みて、本発明の実施形態に係る放射線撮像装置は、基台と、基台の表面の上に配され入射する放射線に応じた信号を生成するセンサ部と、センサ部の表面の上に配されたシンチレータパネルと、センサ部の表面および基台の側面に沿うように曲がった配線基板と、基台とシンチレータパネルとの間に配された封止部材と、を含む放射線撮像装置であって、センサ部は、複数のセンサチップによって構成され、配線基板におけるセンサ部の表面を覆う部分と基台の側面を覆う部分との間の第１の部分に貫通口が配され、封止部材が、センサ部の側面と第１の部分との間に配された第１の封止部材を含むことを特徴とする。 In view of the above problems, a radiation imaging apparatus according to an embodiment of the present invention includes a base, a sensor unit that is arranged on the surface of the base and generates a signal according to incident radiation, and a surface of the sensor unit. A radiation imaging apparatus comprising: a scintillator panel disposed above; a wiring substrate bent along the surface of the sensor unit and the side surface of the base; and a sealing member disposed between the base and the scintillator panel. The sensor unit is composed of a plurality of sensor chips, and a through-hole is arranged in a first part between a part covering the surface of the sensor part on the wiring board and a part covering the side surface of the base. The stop member includes a first sealing member disposed between the side surface of the sensor unit and the first portion.

上記手段によって、複数のセンサチップによって構成されるセンサ部を備える放射線撮像装置において、狭額縁化に有利な技術を提供する。 By the above means, a technique advantageous in narrowing the frame is provided in a radiation imaging apparatus including a sensor unit constituted by a plurality of sensor chips.

本発明の実施形態に係る放射線撮像装置の構成例を示す平面図および断面図。The top view and sectional drawing which show the structural example of the radiation imaging device which concerns on embodiment of this invention. 図１の放射線撮像装置の配線基板の平面図および放射線撮像装置の製造方法を示す断面図。The top view of the wiring board of the radiation imaging device of FIG. 1, and sectional drawing which shows the manufacturing method of a radiation imaging device. 図１の放射線撮像装置の封止部材の材料の広がる幅の導出方法を示す図。The figure which shows the derivation | leading-out method of the width which the material of the sealing member of the radiation imaging device of FIG. 1 spreads. 図２の配線基板の変形例を示す図。The figure which shows the modification of the wiring board of FIG. 図１の放射線撮像装置の変形例を示す図。The figure which shows the modification of the radiation imaging device of FIG. 比較例の放射線撮像装置の構成例を示す断面図。Sectional drawing which shows the structural example of the radiation imaging device of a comparative example. 図１の放射線撮像装置を用いた放射線撮像システムの構成例を示す図。The figure which shows the structural example of the radiation imaging system using the radiation imaging device of FIG.

以下、本発明に係る放射線撮像装置および放射線撮像システムの具体的な実施形態を、添付図面を参照して説明する。なお、以下の説明及び図面において、複数の図面に渡って共通の構成については共通の符号を付している。そのため、複数の図面を相互に参照して共通する構成を説明し、共通の符号を付した構成については適宜説明を省略する。なお、本発明における放射線には、放射線崩壊によって放出される粒子（光子を含む）の作るビームであるα線、β線、γ線などの他に、同程度以上のエネルギを有するビーム、例えばＸ線や粒子線、宇宙線なども含みうる。 Hereinafter, specific embodiments of a radiation imaging apparatus and a radiation imaging system according to the present invention will be described with reference to the accompanying drawings. Note that, in the following description and drawings, common reference numerals are given to common configurations over a plurality of drawings. Therefore, a common configuration is described with reference to a plurality of drawings, and a description of a configuration with a common reference numeral is omitted as appropriate. The radiation in the present invention includes a beam having energy of the same degree or more, such as X-rays, β-rays, γ-rays, etc., which are beams formed by particles (including photons) emitted by radiation decay, such as X It can also include rays, particle rays, and cosmic rays.

図１〜６を参照して、本発明の実施形態による放射線撮像装置の構成および製造方法について説明する。図１は、本発明の実施形態による放射線撮像装置１００の構成を示す平面図および断面図である。図１（ａ）は、放射線撮像装置１００の構成を示す平面図である。図１（ｂ）、（ｃ）は、それぞれ図１（ａ）に示すＡ−Ａ’間およびＢ−Ｂ’間の断面図である。図１（ｄ）、（ｅ）は、図１（ａ）に示す四角形Ｃに囲まれた部分のそれぞれ異なる高さの断面図である。 With reference to FIGS. 1-6, the structure and manufacturing method of the radiation imaging device by embodiment of this invention are demonstrated. FIG. 1 is a plan view and a cross-sectional view showing a configuration of a radiation imaging apparatus 100 according to an embodiment of the present invention. FIG. 1A is a plan view showing the configuration of the radiation imaging apparatus 100. FIGS. 1B and 1C are cross-sectional views taken along A-A ′ and B-B ′ shown in FIG. FIGS. 1D and 1E are cross-sectional views of different heights of a portion surrounded by a square C shown in FIG.

図１（ａ）〜（ｃ）に示すように、本実施形態の放射線撮像装置１００は、センサパネル１１３とシンチレータパネル１０９とを含む。センサパネル１１３は、基台１０３の表面の上にセンサチップ固定部材１０４によって固定された複数のセンサチップ１０１が配列されたセンサ部１１４を有する。センサ部１１４が複数のセンサチップ１０１によって構成されることで、撮像領域を大面積化することができる。それぞれのセンサチップ１０１は、表面に複数のセンサが２次元アレイ状に配される。センサチップ１０１（センサ部１１４）の表面１１５は、センサチップ１０１（センサ部１１４）の２つの主面のうち放射線を入射させる側の主面といえる。センサチップ１０１（センサ部１１４）の上には、シンチレータパネル１０９が配される。シンチレータパネル１０９は、シンチレータ基台１０８とシンチレータ基台１０８の上に形成された放射線を光に変換するシンチレータ１０７とを含む。シンチレータ１０７とセンサチップ１０１とが向かい合うように、センサパネル１１３とシンチレータパネル１０９とは配される。センサチップ１０１に配されたそれぞれのセンサは、シンチレータ１０７によって放射線から変換された光に応じた電気信号を生成する光電変換素子を備える。それぞれのセンサで生成された電気信号は、それぞれのセンサチップ１０１に電気的に接続された配線基板１０２によって、センサ部１１４から出力される。配線基板１０２は、放射線撮像装置１００を狭額縁化するために、センサチップ１０１の表面１１５および基台１０３の側面１１８にそれぞれ沿うように曲がって配される。配線基板１０２は、センサチップ１０１の表面１１５において、それぞれのセンサチップ１０１と電気的に接続し、センサチップ１０１の表面１１５に固定されている。配線基板１０２は、センサ部１１４の表面に固定されているともいえる。また、配線基板１０２は、基台１０３の側面１１８に結合部材１０５によって固定されている。基台１０３の側面は、センサパネル１１３の側面１１８を構成している。このため、配線基板１０２は、センサパネル１１３の側面に固定されているともいえる。 As shown in FIGS. 1A to 1C, the radiation imaging apparatus 100 of the present embodiment includes a sensor panel 113 and a scintillator panel 109. The sensor panel 113 includes a sensor unit 114 in which a plurality of sensor chips 101 fixed by a sensor chip fixing member 104 are arranged on the surface of the base 103. Since the sensor unit 114 includes the plurality of sensor chips 101, the imaging area can be increased. Each sensor chip 101 has a plurality of sensors arranged in a two-dimensional array on the surface. The surface 115 of the sensor chip 101 (sensor unit 114) can be said to be a main surface on the side where radiation is incident, out of the two main surfaces of the sensor chip 101 (sensor unit 114). A scintillator panel 109 is disposed on the sensor chip 101 (sensor unit 114). The scintillator panel 109 includes a scintillator base 108 and a scintillator 107 that converts radiation formed on the scintillator base 108 into light. The sensor panel 113 and the scintillator panel 109 are arranged so that the scintillator 107 and the sensor chip 101 face each other. Each sensor arranged in the sensor chip 101 includes a photoelectric conversion element that generates an electrical signal corresponding to light converted from radiation by the scintillator 107. The electrical signal generated by each sensor is output from the sensor unit 114 by the wiring board 102 electrically connected to each sensor chip 101. The wiring board 102 is arranged so as to be bent along the surface 115 of the sensor chip 101 and the side surface 118 of the base 103 in order to narrow the frame of the radiation imaging apparatus 100. The wiring board 102 is electrically connected to each sensor chip 101 on the surface 115 of the sensor chip 101 and is fixed to the surface 115 of the sensor chip 101. It can be said that the wiring board 102 is fixed to the surface of the sensor unit 114. Further, the wiring board 102 is fixed to the side surface 118 of the base 103 by the coupling member 105. A side surface of the base 103 constitutes a side surface 118 of the sensor panel 113. For this reason, it can be said that the wiring board 102 is fixed to the side surface of the sensor panel 113.

センサチップ１０１には、例えばシリコン基板が用いられてもよく、この場合、センサチップ１０１に形成されるセンサは、シリコン基板上に形成されたＣＭＯＳセンサやＰＩＮセンサなどであってもよい。また、センサチップ１０１に、ガラス基板の上に配されたシリコンに、センサが形成されたチップを用いてもよい。また、シリコン以外の半導体材料にセンサを形成したチップが、センサチップ１０１に用いられてもよい。 For example, a silicon substrate may be used as the sensor chip 101. In this case, a sensor formed on the sensor chip 101 may be a CMOS sensor or a PIN sensor formed on the silicon substrate. Alternatively, the sensor chip 101 may be a chip in which a sensor is formed on silicon provided on a glass substrate. A chip in which a sensor is formed on a semiconductor material other than silicon may be used for the sensor chip 101.

シンチレータ１０７には、粒子状のシンチレータ材料や柱状結晶構造を有するシンチレータ材料が用いられてもよい。粒子状の材料として、例えば、テルビウム（Ｔｂ）が微量に添加された酸硫化ガドリニウム（Ｇｄ_２Ｏ_２Ｓ：Ｔｂ）などが用いられてもよい。また、柱状結晶の材料として、例えば、タリウム（Ｔｌ）やナトリウム（Ｎａ）が添加されたヨウ化セシウム、臭化セシウム（ＣｓＩ：Ｔｌ、ＣｓＩ：Ｎａ、ＣｓＩ：Ｂｒ）が用いられてもよい。また、柱状結晶の材料として、Ｔｌが添加されたヨウ化ナトリウム、ヨウ化カリウム（ＮａＩ：Ｔｌ、ＫＩ：Ｔｌ）、ユウロピウム（Ｅｕ）が添加されたヨウ化リチウム（ＬｉＩ：Ｅｕ）などが用いられてもよい。シンチレータ１０７は、これらの材料をシンチレータ基台１０８の上に塗布や蒸着することによって形成されうる。図１（ｂ）、（ｃ）に示すように、センサパネル１１３の表面１１５に対する正射影において、シンチレータ１０７の外縁は、シンチレータ基台１０８の外縁よりも内側に配されうる。シンチレータ基台１０８には、アルミなどの金属、ガラス、アモルファスカーボンや炭素繊維強化プラスチック（ＣＦＲＰ）などのカーボン系材料、ポリエーテルエーテルケトン（ＰＥＥＫ）などの樹脂材料などが用いられうる。 For the scintillator 107, a particulate scintillator material or a scintillator material having a columnar crystal structure may be used. As the particulate material, for example, gadolinium oxysulfide (Gd ₂ O ₂ S: Tb) to which a small amount of terbium (Tb) is added may be used. Further, for example, cesium iodide and cesium bromide (CsI: Tl, CsI: Na, CsI: Br) to which thallium (Tl) or sodium (Na) is added may be used as the columnar crystal material. Further, as a columnar crystal material, sodium iodide to which Tl is added, potassium iodide (NaI: Tl, KI: Tl), lithium iodide (LiI: Eu) to which europium (Eu) is added, or the like is used. May be. The scintillator 107 can be formed by applying or vapor-depositing these materials on the scintillator base 108. As shown in FIGS. 1B and 1C, the outer edge of the scintillator 107 can be arranged on the inner side of the outer edge of the scintillator base 108 in the orthogonal projection with respect to the surface 115 of the sensor panel 113. The scintillator base 108 may be made of a metal such as aluminum, glass, a carbon-based material such as amorphous carbon or carbon fiber reinforced plastic (CFRP), or a resin material such as polyetheretherketone (PEEK).

次に、配線基板１０２がセンサチップ１０１（センサ部１１４）に固定される接続部分の保護や、潮解性を有するシンチレータ１０７を大気中の水分などから保護するために、放射線撮像装置１００の外縁に沿って配される封止部材について説明する。本実施形態において、封止部材は、それぞれ別の工程で形成される封止部材１０６および封止部材１２６を含む。封止部材１２６は、センサパネル１１３の基台１０３とシンチレータパネル１０９との間に配される。具体的には、図１（ｂ）に示すように、基台１０３とシンチレータパネル１０９との間に配線基板１０２が配される部分において、封止部材１２６は、配線基板１０２とシンチレータパネル１０９のシンチレータ基台１０８との間に配される。また、図１（ｃ）に示すように、基台１０３とシンチレータパネル１０９との間に配線基板１０２が配されない部分において、封止部材１２６は、基台１０３とシンチレータパネル１０９のシンチレータ基台１０８との間に配される。 Next, in order to protect the connection portion where the wiring substrate 102 is fixed to the sensor chip 101 (sensor unit 114) and to protect the scintillator 107 having deliquescence from moisture in the atmosphere, the outer periphery of the radiation imaging apparatus 100 is provided. The sealing member arranged along will be described. In the present embodiment, the sealing member includes a sealing member 106 and a sealing member 126 that are formed in separate steps. The sealing member 126 is disposed between the base 103 of the sensor panel 113 and the scintillator panel 109. Specifically, as shown in FIG. 1B, in the portion where the wiring board 102 is arranged between the base 103 and the scintillator panel 109, the sealing member 126 includes the wiring board 102 and the scintillator panel 109. It is arranged between the scintillator base 108. Further, as shown in FIG. 1C, the sealing member 126 is formed on the scintillator base 108 of the base 103 and the scintillator panel 109 in a portion where the wiring board 102 is not disposed between the base 103 and the scintillator panel 109. Between.

図１（ｂ）に示すように、基台１０３の表面１１５に対する正射影において、複数のセンサチップ１０１によって構成されるセンサ部１１４の外縁は、基台１０３の外縁よりも内側に配される。このため、センサパネル１１３の配線基板１０２に覆われる部分には空間が生じる。この空間に封止部材を配さない場合、センサパネル１１３およびシンチレータパネル１０９によって構成される放射線撮像装置１００の内部を封止する能力が低下する可能性がある。具体的には基台１０３およびセンサ部１１４を構成する複数のセンサチップ１０１の隙間を通り、外部から水分が侵入する可能性がある。そこで、センサチップ１０１（センサ部１１４）の表面１１５および基台１０３の側面１１８に沿うように曲がった配線基板１０２とセンサパネル１１３との間には、センサ部１１４の周囲を封止するための封止部材１０６が配される。封止部材１０６の形成方法については後述する。 As shown in FIG. 1B, the outer edge of the sensor unit 114 constituted by the plurality of sensor chips 101 is arranged inside the outer edge of the base 103 in the orthogonal projection with respect to the surface 115 of the base 103. For this reason, a space is generated in a portion of the sensor panel 113 covered with the wiring board 102. If no sealing member is provided in this space, the ability to seal the inside of the radiation imaging apparatus 100 constituted by the sensor panel 113 and the scintillator panel 109 may be reduced. Specifically, moisture may enter from the outside through the gaps between the plurality of sensor chips 101 constituting the base 103 and the sensor unit 114. Therefore, the periphery of the sensor unit 114 is sealed between the wiring board 102 and the sensor panel 113 bent along the surface 115 of the sensor chip 101 (sensor unit 114) and the side surface 118 of the base 103. A sealing member 106 is disposed. A method for forming the sealing member 106 will be described later.

図１（ｄ）は、図１（ａ）の四角形Ｃで囲まれた部分のセンサチップ１０１（センサ部１１４）の表面１１５の高さでの断面図を示す。図１（ｄ）に示すように、配線基板１０２の配線基板１０２がセンサパネルから延在する方向と交差する方向の端部において、封止部材１０６と封止部材１２６とが互いに接する。換言すると、基台１０３とセンサチップ１０１（センサ部１１４）の表面１１５との間は、封止部材１０６および封止部材１２６によって封止される。図１（ｅ）は、図１（ａ）の四角形Ｃで囲まれた部分のセンサパネル１１３の表面１１５とシンチレータ基台１０８との間の高さでの断面を示す。図１（ｅ）で示されるように、センサチップ１０１（センサ部１１４）の表面１１５とシンチレータ基台１０８との間は、封止部材１２６によって封止される。このように、封止部材１０６および封止部材１２６によって、センサパネル１１３の基台１０３とシンチレータパネル１０９のシンチレータ基台１０８との間の隙間が封止される。結果として、放射線撮像装置１００に配されたセンサパネル１１３およびシンチレータ１０７を大気中の塵埃や水分などから保護することが可能となる。封止部材１０６および封止部材１２６の材料として、シリコン系樹脂やエポキシ系樹脂などの樹脂材料が用いられうる。封止部材１０６と封止部材１２６とは、同じ材料が用いられてもよいし、異なる材料が用いられてもよい。 FIG. 1D shows a cross-sectional view at the height of the surface 115 of the sensor chip 101 (sensor part 114) in the part surrounded by the square C in FIG. As shown in FIG. 1D, the sealing member 106 and the sealing member 126 are in contact with each other at the end of the wiring substrate 102 in the direction intersecting the direction in which the wiring substrate 102 extends from the sensor panel. In other words, the space between the base 103 and the surface 115 of the sensor chip 101 (sensor unit 114) is sealed by the sealing member 106 and the sealing member 126. FIG. 1E shows a cross section at a height between the surface 115 of the sensor panel 113 and the scintillator base 108 in a portion surrounded by the square C in FIG. As shown in FIG. 1E, the space between the surface 115 of the sensor chip 101 (sensor unit 114) and the scintillator base 108 is sealed by a sealing member 126. As described above, the gap between the base 103 of the sensor panel 113 and the scintillator base 108 of the scintillator panel 109 is sealed by the sealing member 106 and the sealing member 126. As a result, it is possible to protect the sensor panel 113 and the scintillator 107 disposed in the radiation imaging apparatus 100 from dust and moisture in the atmosphere. As a material for the sealing member 106 and the sealing member 126, a resin material such as a silicon resin or an epoxy resin can be used. The same material may be used for the sealing member 106 and the sealing member 126, and different materials may be used.

次いで、図２を用いて本実施形態で用いる配線基板１０２および放射線撮像装置１００の製造方法について説明する。図２（ａ）は、配線基板１０２の平面図である。また、図２（ｂ）〜（ｄ）は、図１（ａ）に示すＡ−Ａ’間での、放射線撮像装置１００の製造方法を示す断面図である。配線基板１０２には、センサチップ１０１で生成された電気信号を出力するための導電線１１２が配され、導電線１１２の間に貫通口１１１が配される。この貫通口１１１は、図２（ｂ）の断面図に示される配線基板１０２の、配線基板１０２のセンサチップ１０１（センサ部１１４）の表面１１５を覆う部分１２１と、基台１０３の側面１１８を覆う部分１２３との間の部分１２２に配されている。配線基板１０２は、貫通口１１１を開口した基板となる樹脂の上に、導体箔を接着剤などの結合層によって貼り合わせ、その後、導電線１１２などの回路が残るように導体箔をエッチングすることによって形成されうる。配線基板１０２の樹脂材料には、柔軟性および絶縁性を有している材料が用いられる。配線基板１０２の樹脂材料には、例えば、ポリイミドやポリエステルなどの樹脂材料が用いられうる。また、導電線１１２を形成するための導体箔には、電気抵抗の低い金属材料などが用いられうる。価格などの観点から導体箔として、例えば、銅が用いられる。 Next, a method for manufacturing the wiring board 102 and the radiation imaging apparatus 100 used in this embodiment will be described with reference to FIG. FIG. 2A is a plan view of the wiring board 102. 2B to 2D are cross-sectional views showing a method for manufacturing the radiation imaging apparatus 100 between A and A ′ shown in FIG. On the wiring board 102, conductive wires 112 for outputting an electrical signal generated by the sensor chip 101 are arranged, and through holes 111 are arranged between the conductive wires 112. The through hole 111 includes a portion 121 of the wiring board 102 shown in the cross-sectional view of FIG. 2B that covers the surface 115 of the sensor chip 101 (sensor unit 114) of the wiring board 102, and a side surface 118 of the base 103. It is arranged in a portion 122 between the covering portion 123. The wiring substrate 102 is formed by bonding a conductive foil on a resin that becomes a substrate having an opening through the through-hole 111 with a bonding layer such as an adhesive, and then etching the conductive foil so that a circuit such as the conductive wire 112 remains. Can be formed. As the resin material for the wiring substrate 102, a material having flexibility and insulation is used. As the resin material of the wiring substrate 102, for example, a resin material such as polyimide or polyester can be used. In addition, a metal material having a low electrical resistance can be used for the conductive foil for forming the conductive wire 112. From the viewpoint of price and the like, for example, copper is used as the conductor foil.

次に、放射線撮像装置１００の製造方法について説明する。まず、上述の配線基板１０２が、センサパネル１１３のセンサ部１１４を構成するセンサチップ１０１に電気的に接続され、固定される。次いで、一端がセンサチップ１０１（センサ部１１４）の表面１１５に固定された配線基板１０２の他端の側を、放射線撮像装置１００を狭額縁化するために、基台１０３の側面１１８に沿うように曲げる。曲げられた配線基板１０２は、図２（ｂ）に示すように、センサパネル１１３の基台１０３の側面１１８を覆う部分１２３において、基台１０３の側面１１８に、両面テープや接着剤などを用いた結合部材１０５によって固定される。 Next, a method for manufacturing the radiation imaging apparatus 100 will be described. First, the above-described wiring board 102 is electrically connected and fixed to the sensor chip 101 constituting the sensor unit 114 of the sensor panel 113. Next, the other end side of the wiring board 102 having one end fixed to the surface 115 of the sensor chip 101 (sensor unit 114) is arranged along the side surface 118 of the base 103 in order to narrow the frame of the radiation imaging apparatus 100. Bend to. As shown in FIG. 2B, the bent wiring board 102 uses a double-sided tape or an adhesive on the side surface 118 of the base 103 at a portion 123 that covers the side surface 118 of the base 103 of the sensor panel 113. The fixing member 105 is fixed.

配線基板１０２を基台１０３の側面１１８に固定した後、センサパネル１１３の基台１０３とシンチレータパネル１０９のシンチレータ基台１０８との間の隙間を封止するための封止部材１０６および封止部材１２６を形成する。まず、封止部材１０６を形成する方法について説明する。センサパネル１１３の配線基板１０２の部分１２２で覆われた部分（基台１０３の表面のうちセンサ部１１４で覆われない部分１２０、センサ部１１４の側面１１９および配線基板１０２の部分１２２で囲まれる部分。）に封止部材１０６を形成するために、上述のように配線基板１０２の部分１２２に設けられた貫通口１１１に封止部材１０６の材料１１６を注入するためのニードル１１７を挿入する。次いで、図２（ｃ）に示すように、配線基板１０２の貫通口１１１を通してセンサパネル１１３の配線基板１０２の部分１２２に覆われた部分に封止部材１０６の材料１１６を塗布する。この工程によって、図２（ｄ）に示すように、センサパネル１１３のセンサ部１１４の側面１１９、基台１０３の表面のうちセンサ部１１４が配されない部分１２０および配線基板１０２の部分１２２によって囲まれる領域に封止部材１０６を形成することができる。次いで、封止部材１２６を形成することによって、図１（ｂ）、（ｃ）に示すように放射線撮像装置１００の内部が封止される。封止部材１２６は、配線基板１０２によって覆われる部分ではないため、ニードル１１７などを用いて封止部材１２６の材料を、それぞれ封止部材１２６を形成する部分に直接塗布することによって、封止部材１２６を形成することができる。本実施形態において、封止部材１０６を形成した後、封止部材１２６を形成する説明をしたが、封止部材１０６と封止部材１２６とを形成する順番は、これに限られるものではない。封止部材１２６を形成した後に封止部材１０６を形成してもよい。また例えば、基台１０３とシンチレータ基台１０８との間の配線基板１０２の配される部分および隣接する配線基板１０２の配されない部分ごとに、封止部材１０６と封止部材１２６とを交互に形成してもよい。 After fixing the wiring board 102 to the side surface 118 of the base 103, a sealing member 106 and a sealing member for sealing a gap between the base 103 of the sensor panel 113 and the scintillator base 108 of the scintillator panel 109 126 is formed. First, a method for forming the sealing member 106 will be described. The portion of the sensor panel 113 covered with the portion 122 of the wiring board 102 (the portion of the surface of the base 103 that is not covered with the sensor portion 114, the side surface 119 of the sensor portion 114, and the portion 122 of the wiring substrate 102) In order to form the sealing member 106, the needle 117 for injecting the material 116 of the sealing member 106 is inserted into the through-hole 111 provided in the portion 122 of the wiring substrate 102 as described above. Next, as shown in FIG. 2C, the material 116 of the sealing member 106 is applied to the portion of the sensor panel 113 covered by the portion 122 of the wiring substrate 102 through the through hole 111 of the wiring substrate 102. 2D, the side surface 119 of the sensor unit 114 of the sensor panel 113, the portion 120 where the sensor unit 114 is not disposed, and the portion 122 of the wiring board 102 are surrounded by the process. The sealing member 106 can be formed in the region. Next, by forming the sealing member 126, the inside of the radiation imaging apparatus 100 is sealed as shown in FIGS. Since the sealing member 126 is not a portion covered with the wiring substrate 102, the material of the sealing member 126 is directly applied to the portion where the sealing member 126 is formed by using the needle 117 or the like, thereby forming the sealing member 126. 126 can be formed. In the present embodiment, the sealing member 126 is formed after the sealing member 106 is formed. However, the order of forming the sealing member 106 and the sealing member 126 is not limited to this. The sealing member 106 may be formed after the sealing member 126 is formed. Further, for example, the sealing member 106 and the sealing member 126 are alternately formed for each portion where the wiring substrate 102 is disposed between the base 103 and the scintillator base 108 and for each portion where the adjacent wiring substrate 102 is not disposed. May be.

ここで、本実施形態の効果について説明する。基台１０３とシンチレータ基台１０８との隙間を封止する封止部材１０６および封止部材１２６を形成する工程において、封止部材１３６を形成した後、配線基板１０２をセンサパネル１１３の側面１１８に沿うように曲げる工程順序が考えられる。この工程順序を採用した場合、例えば封止部材１３６の材料を多く塗布してしまうと、図６に示すように、基台１０３の側面１１８の結合部材１０５と配線基板１０２との間に封止部材１３６が入り込んでしまう可能性がある。封止部材１３６が入り込んだ場合、配線基板１０２を基台１０３の側面に固定できなくなることによって、放射線撮像装置の信頼性が低下する可能性がある。また、基台１０３の側面１１８の結合部材１０５と配線基板１０２との間に封止部材１３６が入り込むことによって、基台１０３の側面１１８と配線基板１０２との間にスペースが生じ、狭額縁化が難しくなる。一方、本実施形態において、封止部材１０６を形成する前に配線基板１０２を基台１０３の側面１１８に結合部材１０５によって固定する。このため、基台１０３の側面１１８の結合部材１０５と配線基板１０２との間に封止部材１０６が入り込んでしまう可能性を抑制することができる。また、本実施形態において、配線基板１０２に貫通口１１１が配される。このため、センサパネル１１３の配線基板１０２に覆われる部分（基台１０３の表面のうちセンサ部１１４で覆われない部分１２０、センサ部１１４の側面１１９および配線基板１０２の部分１２２で囲まれる部分。）にも封止部材１０６の材料１１６を塗布することが可能となる。貫通口１１１が配されない配線基板を用いた場合、センサパネル１１３の配線基板１０２に覆われる部分に十分に材料１１６が充填できず、封止部材１０６が十分に形成できない可能性がある。封止部材１０６が十分に形成されない場合、基台１０３およびセンサ部１１４を構成する複数のセンサチップ１０１の隙間から水分などが侵入する可能性がある。結果として、貫通口１１１のない配線基板を用いた放射線撮像装置に対して、信頼性の高い放射線撮像装置１００が実現されうる。 Here, the effect of this embodiment will be described. In the step of forming the sealing member 106 and the sealing member 126 that seal the gap between the base 103 and the scintillator base 108, after forming the sealing member 136, the wiring board 102 is attached to the side surface 118 of the sensor panel 113. A process sequence that bends along can be considered. When this process sequence is adopted, for example, if a large amount of the material of the sealing member 136 is applied, sealing is performed between the coupling member 105 on the side surface 118 of the base 103 and the wiring board 102 as shown in FIG. The member 136 may get in. When the sealing member 136 enters, the wiring board 102 cannot be fixed to the side surface of the base 103, and the reliability of the radiation imaging apparatus may be lowered. Further, when the sealing member 136 enters between the coupling member 105 on the side surface 118 of the base 103 and the wiring substrate 102, a space is generated between the side surface 118 of the base 103 and the wiring substrate 102, thereby narrowing the frame. Becomes difficult. On the other hand, in this embodiment, the wiring board 102 is fixed to the side surface 118 of the base 103 by the coupling member 105 before the sealing member 106 is formed. For this reason, the possibility that the sealing member 106 enters between the coupling member 105 on the side surface 118 of the base 103 and the wiring board 102 can be suppressed. In the present embodiment, the through hole 111 is provided in the wiring board 102. Therefore, a portion of the sensor panel 113 covered by the wiring substrate 102 (a portion of the surface of the base 103 that is not covered by the sensor portion 114, a side surface 119 of the sensor portion 114, and a portion 122 of the wiring substrate 102). ), The material 116 of the sealing member 106 can be applied. When a wiring board in which the through-hole 111 is not provided is used, there is a possibility that the material 116 cannot be sufficiently filled in the portion covered with the wiring board 102 of the sensor panel 113 and the sealing member 106 cannot be sufficiently formed. If the sealing member 106 is not sufficiently formed, moisture or the like may enter from the gaps between the plurality of sensor chips 101 constituting the base 103 and the sensor unit 114. As a result, a highly reliable radiation imaging apparatus 100 can be realized with respect to a radiation imaging apparatus using a wiring board without the through-hole 111.

配線基板１０２の貫通口１１１から封止部材１０６の材料１１６を注入した場合、注入された材料１１６の広がる幅は、次の（１）式より求めることができる。 When the material 116 of the sealing member 106 is injected from the through-hole 111 of the wiring substrate 102, the spreading width of the injected material 116 can be obtained from the following equation (1).

Ｗ＝παω^４ｐｔ／２μＤＨ・・・（１）
ここで、αは、センサパネル１１３（基台１０３のセンサ部１１４で覆われない部分１２０およびセンサ部１１４の側面１１９）の表面粗さ（Ｒａ）と関係する粗面係数、ω（ｃｍ）は、ニードル１１７の開口の直径、ｐ（ＭＰａ）は、材料１１６を注入する際の圧力、ｔ（ｓｅｃ）は、材料を注入する時間、μ（ｄＰａ・ｓｅｃ）は、材料１１６の粘度、Ｄ（ｃｍ）およびＨ（ｃｍ）は、図３に示すように、センサパネル１１３と配線基板１０２との間の材料１１６が注入、塗布される奥行きおよび高さである。（１）式において、ＤとＨとの積は、センサパネル１１３と配線基板１０２の部分１２２との間の断面の面積（断面積）を表す。このため、（１）式は、Ｗ＝παω^４ｐｔ／２μＳ（ここで、Ｓ（ｃｍ^２）は、センサパネル１１３と配線基板１０２の部分１２２との間の断面積）と書き換えてもよい。例えば、それぞれのパラメータを、α＝１．１１８×１０^５、ω＝０．０３１（ｃｍ）、ｐ＝０．４（ＭＰａ）、ｔ＝１５（ｓｅｃ）、μ＝２００（ｄＰａ・ｓｅｃ）、Ｄ＝０．０７６（ｃｍ）、Ｈ＝０．０７（ｃｍ）とする。この場合、Ｗ＝１．８３（ｃｍ）となるため、１．８３ｃｍ以下の幅を有し、例えば中央部に貫通口１１１を備える配線基板１０２を用いると、配線基板１０２に覆われる部分に封止部材１０６を形成することが可能となる。 W = παω ⁴ pt / 2 μDH (1)
Here, α is a rough surface coefficient related to the surface roughness (Ra) of the sensor panel 113 (the portion 120 not covered with the sensor portion 114 of the base 103 and the side surface 119 of the sensor portion 114), and ω (cm) is , The diameter of the opening of the needle 117, p (MPa) is the pressure when injecting the material 116, t (sec) is the time for injecting the material, μ (dPa · sec) is the viscosity of the material 116, D ( cm) and H (cm) are the depth and height at which the material 116 between the sensor panel 113 and the wiring board 102 is injected and applied, as shown in FIG. In the equation (1), the product of D and H represents a cross-sectional area (cross-sectional area) between the sensor panel 113 and the portion 122 of the wiring board 102. Therefore, the equation (1) may be rewritten as W = παω ⁴ pt / 2 μS (where S (cm ² ) is a cross-sectional area between the sensor panel 113 and the portion 122 of the wiring board 102). For example, the parameters are α = 1.118 × 10 ⁵ , ω = 0.031 (cm), p = 0.4 (MPa), t = 15 (sec), μ = 200 (dPa · sec), It is assumed that D = 0.76 (cm) and H = 0.07 (cm). In this case, since W = 1.83 (cm), a width of 1.83 cm or less is used. For example, when the wiring substrate 102 having the through-hole 111 in the center is used, the portion covered by the wiring substrate 102 is sealed. The stop member 106 can be formed.

配線基板１０２に設けられる貫通口１１１の数は、図２（ａ）に示すように、配線基板１０２の中央部に１つ配されることに限られるものではない。配線基板１０２に設けられる貫通口１１１の数は、例えば図４に示すように２つであってもよいし、３つ以上であってもよい。１つの貫通口１１１だけでは、封止部材１０６の材料１１６を十分にセンサパネル１１３と配線基板１０２の部分１２２との間に注入できない場合、他の貫通口１１１から材料１１６を注入することが可能となる。配線基板１０２に配される貫通口１１１の数や配置は、配線基板１０２の幅、封止部材１０６の材料１１６の特性、封止部材１０６の塗布に用いるニードル１１７の大きさ、ニードル１１７を用いて材料１１６を注入する際の条件などによって、適宜選択すればよい。上述の（１）式を用いて、貫通口１１１の数や配置を見積もることが可能である。 The number of through-holes 111 provided in the wiring board 102 is not limited to being provided at the center of the wiring board 102 as shown in FIG. The number of through holes 111 provided in the wiring board 102 may be two as shown in FIG. 4, for example, or may be three or more. If the material 116 of the sealing member 106 cannot be sufficiently injected between the sensor panel 113 and the portion 122 of the wiring board 102 with only one through-hole 111, the material 116 can be injected from the other through-hole 111. It becomes. The number and arrangement of the through-holes 111 arranged on the wiring board 102 are determined using the width of the wiring board 102, the characteristics of the material 116 of the sealing member 106, the size of the needle 117 used for applying the sealing member 106, and the needle 117. The material 116 may be selected as appropriate depending on the conditions for injecting the material 116. It is possible to estimate the number and arrangement of the through-holes 111 using the above formula (1).

また、本実施形態において、配線基板１０２を基台１０３の側面１１８に固定してから封止部材１０６が形成される。このため、配線基板１０２のセンサチップ１０１（センサ部１１４）の表面１１５を覆う部分１２１と基台１０３の側面１１８を覆う部分１２３との間の部分１２２の形状は、封止部材１０６の形状によらない。図１（ｂ）に示すように、配線基板１０２の部分１２２が、センサチップ１０１（センサ部１１４）の表面１１５を覆う部分１２１と基台１０３の側面１１８を覆う部分１２３との間を結ぶ線よりも基台１０３の表面から離れた側に配された部分を有していてもよい。また例えば、図２（ｅ）に示すように、配線基板１０２の部分１２２が、センサチップ１０１（センサ部１１４）の表面１１５を覆う部分１２１と基台１０３の側面１１８を覆う部分１２３との間を直線状に結んでもよい。また例えば、図２（ｆ）に示すように、配線基板１０２の部分１２２が、センサチップ１０１（センサ部１１４）の表面１１５を覆う部分１２１と基台１０３の側面１１８を覆う部分１２３との間を結ぶ線よりも基台１０３の表面の側に配された部分を有してもよい。換言すると、配線基板１０２の部分１２２が、図２（ｆ）に示すように下に垂れ下がるように配されていてもよい。配線基板１０２の樹脂材料、導電線１１２の材料の特性、貫通口１１１の数や配置、封止部材１０６の材料１１６の特性、ニードル１１７を用いて材料１１６を注入する際の条件などによって、配線基板１０２の部分１２２の形状を適宜選択すればよい。 In the present embodiment, the sealing member 106 is formed after the wiring board 102 is fixed to the side surface 118 of the base 103. Therefore, the shape of the portion 122 between the portion 121 covering the surface 115 of the sensor chip 101 (sensor portion 114) of the wiring substrate 102 and the portion 123 covering the side surface 118 of the base 103 is the shape of the sealing member 106. It does n’t matter. As shown in FIG. 1B, a line 122 connects a portion 122 of the wiring board 102 to a portion 121 that covers the surface 115 of the sensor chip 101 (sensor unit 114) and a portion 123 that covers the side surface 118 of the base 103. It may have a portion arranged on the side farther from the surface of the base 103 than. Further, for example, as shown in FIG. 2E, a portion 122 of the wiring board 102 is between a portion 121 covering the surface 115 of the sensor chip 101 (sensor unit 114) and a portion 123 covering the side surface 118 of the base 103. May be tied in a straight line. Further, for example, as shown in FIG. 2 (f), a portion 122 of the wiring board 102 is between a portion 121 covering the surface 115 of the sensor chip 101 (sensor unit 114) and a portion 123 covering the side surface 118 of the base 103. It may have a portion arranged on the surface side of the base 103 from the line connecting the two. In other words, the portion 122 of the wiring board 102 may be arranged so as to hang down as shown in FIG. Depending on the resin material of the wiring substrate 102, the characteristics of the conductive wire 112, the number and arrangement of the through-holes 111, the characteristics of the material 116 of the sealing member 106, the conditions for injecting the material 116 using the needle 117, etc. The shape of the portion 122 of the substrate 102 may be selected as appropriate.

また、貫通口１１１の大きさが、封止部材１０６の材料１１６を注入するニードル１１７の直径よりも大きくてもよい。配線基板１０２は、上述のように柔軟性を有するため、貫通口１１１の大きさが、ニードル１１７の直径と同じであっても、また多少小さくてもニードル１１７を貫通口１１１に挿入できる。しかしながら、貫通口１１１の大きさをニードル１１７の直径よりも大きくすることで、ニードル１１７をセンサパネル１１３と配線基板１０２との間で様々な方向に傾けることが可能となる。ニードル１１７の操作性が向上することによって、より確実に封止部材１０６の材料１１６をセンサパネル１１３と配線基板１０２との間に注入し、センサパネル１１３と配線基板１０２との間に封止部材１０６を形成することが可能となる。これによって、放射線撮像装置１００の信頼性をより高めることが可能となる。ここで、ニードル１１７の直径よりも貫通口１１１の大きさが大きいとは、例えば、貫通口１１１が円の場合、円の直径がニードル１１７の直径よりも大きくてもよい。また例えば、図２（ａ）に示すように貫通口１１１が楕円形の場合、貫通口１１１の長径方向の長さがニードル１１７の直径よりも大きく、短径方向の長さがニードル１１７の直径と同等以上であってもよい。ニードル１１７を貫通口１１１に挿入する際、ニードル１１７を傾けられる角度の自由度が増す形状であればよい。 Moreover, the size of the through-hole 111 may be larger than the diameter of the needle 117 that injects the material 116 of the sealing member 106. Since the wiring board 102 has flexibility as described above, the needle 117 can be inserted into the through-hole 111 even when the size of the through-hole 111 is the same as or slightly smaller than the diameter of the needle 117. However, the needle 117 can be tilted in various directions between the sensor panel 113 and the wiring board 102 by making the size of the through-hole 111 larger than the diameter of the needle 117. By improving the operability of the needle 117, the material 116 of the sealing member 106 is more reliably injected between the sensor panel 113 and the wiring board 102, and the sealing member is interposed between the sensor panel 113 and the wiring board 102. 106 can be formed. Thereby, the reliability of the radiation imaging apparatus 100 can be further improved. Here, when the through-hole 111 is larger than the diameter of the needle 117, for example, when the through-hole 111 is a circle, the diameter of the circle may be larger than the diameter of the needle 117. Further, for example, when the through-hole 111 is elliptical as shown in FIG. 2A, the length of the through-hole 111 in the major axis direction is larger than the diameter of the needle 117, and the length in the minor axis direction is the diameter of the needle 117. It may be equal to or greater than. When the needle 117 is inserted into the through-hole 111, any shape that increases the degree of freedom of the angle at which the needle 117 can be tilted may be used.

図１（ａ）に示される放射線撮像装置１００において、配線基板１０２は、センサ部１１４のそれぞれのセンサチップ１０１ごとに１つずつ接続されているが、これに限られることはない。それぞれのセンサチップ１０１に複数の配線基板１０２が接続されていてもよい。また、図５に示すように、センサ部１１４に配された複数のセンサチップ１０１のうち２つ以上のセンサチップ１０１で、１つの配線基板１０２が共有されていてもよい。図５に示される幅広の配線基板１０２を用いる場合、配線基板１０２に貫通口１１１が配されないと、配線基板１０２を基台１０３の側面１１８に固定した後、センサパネル１１３と配線基板１０２との間に封止部材１０６を形成することは難しい。一方、本実施形態に示す貫通口１１１が配された配線基板１０２の場合、貫通口１１１を通して封止部材１０６の材料１１６を注入し、センサパネル１１３の配線基板１０２に覆われた部分に封止部材１０６を形成することが可能となる。これによって、信頼性の高い放射線撮像装置１００の製造が実現される。 In the radiation imaging apparatus 100 shown in FIG. 1A, one wiring board 102 is connected to each sensor chip 101 of the sensor unit 114, but the invention is not limited to this. A plurality of wiring boards 102 may be connected to each sensor chip 101. As shown in FIG. 5, one wiring board 102 may be shared by two or more sensor chips 101 among a plurality of sensor chips 101 arranged in the sensor unit 114. When the wide wiring board 102 shown in FIG. 5 is used, if the through hole 111 is not arranged on the wiring board 102, the wiring board 102 is fixed to the side surface 118 of the base 103, and then the sensor panel 113 and the wiring board 102 are fixed. It is difficult to form the sealing member 106 therebetween. On the other hand, in the case of the wiring board 102 provided with the through-hole 111 shown in the present embodiment, the material 116 of the sealing member 106 is injected through the through-hole 111 to seal the portion covered with the wiring board 102 of the sensor panel 113. The member 106 can be formed. Thereby, the manufacture of the radiation imaging apparatus 100 with high reliability is realized.

以上、本発明に係る実施形態を示したが、本発明はこれらの実施形態に限定されないことはいうまでもなく、本発明の要旨を逸脱しない範囲で、上述した実施形態は適宜変更、組み合わせが可能である。例えば、本実施形態のセンサパネル１１３は、複数のセンサチップ１０１がタイリングされたセンサ部１１４を備えるが、１つのセンサチップによってセンサ部１１４が構成されていてもよい。 As mentioned above, although embodiment which concerns on this invention was shown, it cannot be overemphasized that this invention is not limited to these embodiment, In the range which does not deviate from the summary of this invention, embodiment mentioned above can be changed and combined suitably. Is possible. For example, the sensor panel 113 of the present embodiment includes the sensor unit 114 in which a plurality of sensor chips 101 are tiled, but the sensor unit 114 may be configured by one sensor chip.

以下、図７を参照しながら本実施形態の放射線撮像装置１００が組み込まれた放射線撮像システムを例示的に説明する。放射線源であるＸ線チューブ２１０で発生したＸ線２１１は、患者又は被験者２２０の胸部２２１を透過し、本発明の放射線撮像装置１００に入射する。この入射したＸ線に患者又は被験者２２０の体内部の情報が含まれる。放射線撮像装置１００において、Ｘ線２１１の入射に対応してシンチレータ１０７が発光し、これがセンサ部１１４に配されたセンサチップ１０１のそれぞれのセンサで光電変換され、電気的情報を得る。この情報は、デジタルに変換され信号処理部としてのイメージプロセッサ２３０によって画像処理され、制御室の表示部としてのディスプレイ２４０で観察できる。 Hereinafter, a radiation imaging system in which the radiation imaging apparatus 100 of this embodiment is incorporated will be described as an example with reference to FIG. X-rays 211 generated by the X-ray tube 210 serving as a radiation source pass through the chest 221 of the patient or subject 220 and enter the radiation imaging apparatus 100 of the present invention. The incident X-ray includes information inside the body of the patient or subject 220. In the radiation imaging apparatus 100, the scintillator 107 emits light in response to the incidence of the X-ray 211, and this is photoelectrically converted by each sensor of the sensor chip 101 arranged in the sensor unit 114 to obtain electrical information. This information is converted into digital data, image-processed by an image processor 230 as a signal processing unit, and can be observed on a display 240 as a display unit in a control room.

また、この情報は、電話、ＬＡＮ、インターネットなどのネットワーク２５０などの伝送処理部によって遠隔地へ転送できる。これによって別の場所のドクタールームなどの表示部であるディスプレイ２４１に表示し、遠隔地の医師が診断することも可能である。また、この情報は、光ディスクなどの記録媒体に記録することができ、またフィルムプロセッサ２６０によって記録媒体となるフィルム２６１に記録することもできる。 Further, this information can be transferred to a remote place by a transmission processing unit such as a network 250 such as a telephone, a LAN, and the Internet. In this way, it is possible to display on a display 241 which is a display unit such as a doctor room in another place and make a diagnosis by a doctor at a remote place. Further, this information can be recorded on a recording medium such as an optical disk, and can also be recorded on a film 261 serving as a recording medium by the film processor 260.

１００：放射線撮像装置、１０１：センサチップ１０２：配線基板、１０６、１２６：封止部材、１０９：シンチレータパネル、１１１：貫通口、１１４：センサ部、１１５：センサ部の表面、１１８：基台の側面 100: radiation imaging apparatus, 101: sensor chip 102: wiring board, 106, 126: sealing member, 109: scintillator panel, 111: through port, 114: sensor unit, 115: surface of the sensor unit, 118: base side

Claims

A base, a sensor unit that generates a signal corresponding to incident radiation disposed on the surface of the base, a scintillator panel disposed on the surface of the sensor unit, the surface of the sensor unit, and the A radiation imaging device including a wiring board bent along a side surface of a base, and a sealing member disposed between the base and the scintillator panel,
The sensor unit is composed of a plurality of sensor chips,
A through-hole is arranged in a first part between the part covering the surface of the sensor part and the part covering the side surface of the base in the wiring board,
The radiation imaging apparatus, wherein the sealing member includes a first sealing member disposed between a side surface of the sensor unit and the first portion.

The radiation imaging apparatus according to claim 1, wherein the wiring board is fixed to a surface of the sensor unit and a side surface of the base.

The sealing member further includes a second sealing member,
The second sealing member is
In the portion where the wiring board is arranged between the base and the scintillator panel, it is arranged between the wiring board and the scintillator panel,
In a portion where the wiring board is not disposed between the base and the scintillator panel, the base is disposed between the base and the scintillator panel.
At the end of the first portion in the direction intersecting with the direction in which the wiring board extends from the surface of the sensor unit to the side surface of the base, the first sealing member and the second sealing member Touch each other,
3. The radiation imaging apparatus according to claim 1, wherein an interior of the radiation imaging apparatus is sealed by the first sealing member and the second sealing member.

In the orthogonal projection to the surface of the base, the outer edge of the sensor unit is arranged on the inner side of the outer edge of the base,
The said 1st sealing member is distribute | arranged to the area | region enclosed by the side where the said sensor part is not distribute | arranged among the side surface of the said sensor part, and the surface of the said base, and the said 1st part. The radiation imaging apparatus according to any one of 1 to 3.

5. The radiation imaging apparatus according to claim 1, wherein at least one wiring board is connected to each of the plurality of sensor chips. 6.

The radiation imaging apparatus according to claim 1, wherein one wiring board is shared by two or more sensor chips among the plurality of sensor chips.

The said 1st part connects between the part which covers the surface of the said sensor part, and the part which covers the side surface of the said base in a straight line shape, The any one of Claim 1 thru | or 6 characterized by the above-mentioned. Radiation imaging device.

The first portion includes a portion arranged on the surface side of the base with respect to a line connecting a portion covering the surface of the sensor unit and a portion covering the side surface of the base. The radiation imaging apparatus according to any one of claims 1 to 6.

The radiation imaging apparatus according to claim 1, wherein the through hole is disposed between conductive wires disposed on the wiring board.

The radiation imaging apparatus according to any one of claims 1 to 9,
A signal processing unit for processing a signal from the radiation imaging apparatus;
A radiation imaging system comprising:

A base, a sensor unit that generates a signal corresponding to incident radiation disposed on the surface of the base, a scintillator panel disposed on the surface of the sensor unit, the surface of the sensor unit, and the A method of manufacturing a radiation imaging apparatus, comprising: a wiring board bent along a side surface of a base; and a sealing member disposed between the base and the scintillator panel,
The sensor unit is composed of a plurality of sensor chips,
The sealing member includes a first sealing member disposed between a side surface of the sensor unit and the wiring board,
A through-hole is arranged in a portion between the portion covering the surface of the sensor part in the wiring board and the portion covering the side surface of the base,
The manufacturing method characterized by including the injection | pouring process which inject | pours the material of a said 1st sealing member through the said through-hole.

Before the injection step,
Bending the other end side of the wiring board, one end of which is fixed to the surface of the sensor unit, along the side surface of the base;
Fixing the portion of the wiring board that covers the side surface of the base to the side surface of the base;
The manufacturing method according to claim 11, further comprising:

The manufacturing method according to claim 11 or 12, wherein, in the injection step, a size of the through-hole is larger than a diameter of a needle for injecting a material of the first sealing member.