JP2018100333A - High dielectric constant resin composition - Google Patents

Abstract

SOLUTION: There are provided a high dielectric constant resin composition which contains (A) a resin and (B) conductive oxide particles, and is obtained by blending 0.03-13.0 pts.mass of (B) the conductive oxide particles with respect to 100 pts.mass of (A) the resin; a molded article containing the high dielectric constant resin composition; and an electric/electronic component containing the high dielectric constant resin composition.EFFECT: A high dielectric constant resin composition exhibits a high dielectric constant and a low dielectric loss tangent by addition of an extremely small amount of a filler, can sufficiently activate characteristics of the constituting resin, is excellent in moldability, and can be widely adopted to electronic components such as a film and a capacitor.SELECTED DRAWING: None

Description

  The present invention relates to a high dielectric constant resin composition, and more particularly to a high dielectric constant resin composition containing a resin and a conductive oxide, a molded article such as a film using the composition, and an electric / electronic component. .

  In recent years, information communication equipment has been demanded for high-performance high-frequency electronic components that can be adapted to a high-frequency region. Therefore, high dielectric constant resin materials used for electronic parts such as capacitors and antennas are required to exhibit an appropriate dielectric constant according to their design and to have a low dielectric loss tangent.

  Conventionally known high dielectric constant resin materials include those obtained by adding a high dielectric constant metal oxide filler such as barium titanate to the resin, and those obtained by adding a conductive filler such as carbon black or metal. Yes.

  In Patent Document 1, by adding two types of barium titanate powders surface-treated with silane coupling agents having different end groups to a resin, a high dielectric constant resin composition can be obtained with a relatively small amount of dielectric constant powder. It is described that However, in this document, at least about 55 parts by mass of dielectric constant powder is added to 100 parts by mass of the epoxy resin, and the moldability as a resin composition is not sufficient.

  Moreover, in patent document 2, in order not to impair the moldability of a resin composition even if it increases the addition amount of barium titanate in order to improve a dielectric constant, the technique which contains a specific compound as an additive is mentioned. Proposed. However, in this technique, barium titanate is blended in an amount of 40% by mass or more, so that the original characteristics of the resin may be impaired.

  Furthermore, Patent Document 3 discloses a dielectric resin material containing a plate-shaped conductive filler. However, in this technique, since the filler shape is controlled and the resin is oriented in the resin, there is a problem that the production is complicated and the usage state is limited.

  Further, it is known that a high dielectric constant resin material in which a high dielectric constant filler is added to a resin does not increase the dielectric constant so much with respect to the addition amount when a very small amount of high dielectric constant filler is added. If the equivalent circuit represents a state in which a small amount of high dielectric constant filler is dispersed in the resin, a small capacitance corresponding to a low dielectric constant resin and a large capacitance corresponding to a high dielectric constant filler This is thought to be because of the series circuit. For this reason, in such a high dielectric constant resin material, even when the dielectric constant is adjusted to be relatively small, it is necessary to add a large amount of a high dielectric constant filler. As a result, the moldability and the inherent properties of the resin are impaired. End up.

  On the other hand, in the case of a high dielectric constant resin material in which a conductive filler is added to the resin, it is considered that the dielectric constant increases when the distance between electrodes (dielectric thickness) is substantially reduced. Since the capacitance is inversely proportional to the distance between the electrodes, it is considered that a certain dielectric constant increasing effect can be obtained even if the amount of filler added is small.

  However, sufficient dielectric constant cannot be obtained with carbon black or metal conventionally used as a conductive filler. Increasing the amount of conductive filler can be expected to increase the dielectric constant, but the properties and insulation as a resin will be impaired.

JP 2005-15652 A JP 2003-97074 A JP 2004-247382 A

  The present invention has been made in view of the above circumstances, and aims to provide a high dielectric constant resin composition obtained by adding a small amount of filler, a molded article such as a film using the composition, and an electric / electronic component. To do.

  As a result of intensive investigations to achieve the above object, the present inventors have blended a small amount of conductive oxide, in particular, conductive oxide particles having an average particle diameter of a predetermined range or less, into a resin material such as a thermoplastic resin. Thus, it is found that the dielectric constant can be increased and the dielectric loss tangent becomes lower than that of a conventionally used conductive filler without impairing properties such as moldability of the resin material. It has come.

That is, the present invention provides the following high dielectric constant resin composition and films, molded articles, and electric / electronic parts using the composition.
[1] It contains (A) resin and (B) conductive oxide particles, and 0.03 to 13.0 masses of the (B) conductive oxide particles with respect to 100 parts by mass of the (A) resin. A high dielectric constant resin composition comprising a part of the composition.
[2] The oxide of the conductive oxide particles (B) is an oxide or composite oxide containing at least one selected from the group consisting of tin oxide, indium oxide, antimony oxide, zinc oxide, and cadmium oxide. 1] The high dielectric constant resin composition according to the above.
[3] The high dielectric constant resin composition according to [1], wherein the oxide of the conductive oxide particles (B) is antimony-doped tin oxide or tin-doped indium oxide.
[4] The high dielectric constant resin composition according to any one of [1] to [3], wherein the (B) conductive oxide particles have an average particle size of 100 nm or less.
[5] The resin (A) is polystyrene resin, polyacrylic resin, polyvinyl chloride resin, polypropylene resin, polycarbonate resin, low density polyethylene resin, medium density polyethylene resin, high density polyethylene resin, polylactic acid resin, 6 nylon resin. 66 nylon resin, polyphenylene oxide resin, polyphenylene sulfide resin, polysulfone resin, polyester resin, polyimide resin, polyether ether ketone resin, polyether imide resin, polyvinylidene fluoride resin and polyvinylidene fluoride-hexafluoropropylene copolymer resin The high dielectric constant resin composition according to any one of [1] to [4], which is a thermoplastic resin containing at least one selected from the group of [1].
[6] A molded article comprising the high dielectric constant resin composition according to any one of [1] to [5].
[7] The molded article according to [6], wherein the volume resistivity is 1 × 10 ⁹ to 1 × 10 ¹⁵ Ω · cm.
[8] The molded product according to [6] or [7], wherein the molded product is a film.
[9] An electric / electronic component comprising the high dielectric constant resin composition according to any one of [1] to [5].

  The high dielectric constant resin composition of the present invention exhibits a high dielectric constant and a low dielectric loss tangent by adding a very small amount of filler, so that the characteristics of the resin constituting it can be fully utilized, and the moldability is excellent. It can be widely used for electronic parts such as films and capacitors.

  This invention contains (A) resin and (B) electroconductive oxide particle, and (B) electroconductive oxide particle is 0.03-13. With respect to 100 mass parts of (A) resin. It is a high dielectric constant resin composition containing 0 part by mass.

  (A) The resin is preferably a thermoplastic resin, specifically, polyvinyl chloride resin (PVC), polystyrene resin (PS), ABS resin, AS resin, polyacrylic resin (PMMA), ultra-low Density polyethylene resin (VLDPE), low density polyethylene resin (LDPE), linear low density polyethylene resin (LLDPE), medium density polyethylene resin (MDPE), high density polyethylene resin (HDPE), ultra high molecular weight polyethylene (U-PE) , Polypropylene resin (PP), polycarbonate resin (PC), modified PPE resin (m-PPE), 6 nylon resin (PA6), 66 nylon resin (PA66), polyacetal resin (POM), polyethylene terephthalate resin (PET), poly Butylene terephthalate (PBT), polyester Fat (PEs), polysulfone resin (PSF), polyarylate resin (PAR), polyetherimide resin (PEI), polyimide resin, polylactic acid resin (PLA), polyetheretherketone resin (PEEK), polyphenylene sulfide resin ( PPS), polyphenylene oxide resin (PPO), polyamideimide resin (PAI), liquid crystal polymer resin (LCP), polytetrafluoroethylene resin (PTFE), polychlorotrifluoroethylene resin (PCTFE), polyvinylidene fluoride resin (PVDF) , Polyvinylidene fluoride-hexafluoropropylene copolymer resin (PVDF-HFP), urethane resin, tetrafluoroethylene-hexafluoropropylene copolymer, tetrafluoroethylene-perfluoroalkylvinyl -Ter copolymer, vinylidene fluoride resin, ethylene-tetrafluoroethylene copolymer, ethylene-chlorofluoroethylene copolymer, vinylidene chloride resin, chlorinated polyolefin resin, modified polyolefin resin, water-crosslinked polyolefin resin, ethylene-vinyl Examples thereof include acetate copolymers, ethylene-ethyl acrylate copolymers, fluororesin phenol resins, epoxy resins, polyvinyl acetate resins, polyurethane resins, and copolymers and mixtures of various polymer substances.

  Among the above thermoplastic resins, (A) as the resin, in particular, polyphenylene oxide resin, polyphenylene sulfide resin, polysulfone resin, polyester resin, polyimide resin, polyether ether ketone resin, polystyrene resin, polyacrylic resin, polychlorinated resin Vinyl resin, polypropylene resin, polycarbonate resin, low density polyethylene resin, medium density polyethylene resin, high density polyethylene resin, polylactic acid resin, 6 nylon resin, 66 nylon resin, polyetherimide resin, polyvinylidene fluoride resin, polyvinylidene fluoride Hexafluoropropylene copolymer resin is preferred, polystyrene resin, polyacrylic resin, polycarbonate resin, polylactic acid resin, polyetherimide resin, polyvinylidene fluoride resin, polyfluoride resin. Vinylidene - hexafluoropropylene copolymer resin is more preferable, in particular, polyether imide resins, polyvinylidene fluoride resins, polyvinylidene fluoride - be employed hexafluoropropylene copolymer resin are preferred.

  Next, the conductive oxide particles (B) are not particularly limited, but are oxides or composite oxides containing at least one selected from the group consisting of tin oxide, indium oxide, antimony oxide, zinc oxide, and cadmium oxide. It is preferable. Specifically, antimony-doped tin oxide (ATO), tin-doped indium oxide (ITO), fluorine-doped tin oxide (FTO), phosphorus-doped tin oxide (PTO), aluminum-doped zinc oxide (AZO), gallium-doped zinc oxide (GZO) Etc. Among these, it is preferable to employ antimony-doped tin oxide (ATO) or tin-doped indium oxide (ITO).

(B) Although the average particle diameter of electroconductive oxide particle is not specifically limited, It is preferable that it is 100 nm or less, More preferably, it is 10-100 nm. If this particle size is too large, the moldability may be adversely affected. In addition, the said particle diameter of (B) electroconductive oxide is a primary particle diameter, and means the measured value directly observed by BET method (specific surface area calculation method), TEM, SEM, etc.

The conductive oxide particles used in the present invention have a volume resistivity of 10 ⁶ Ω · cm or less, preferably 1.0 × 10 ^{−4 to} 1.0 × 10 ⁵ Ω · cm. is there.

  In the present invention, the high dielectric constant resin composition of the present invention is prepared by blending (B) conductive oxide particles in the range of 0.03 to 13.0 parts by mass with respect to (A) 100 parts by mass of the resin. (B) The more preferable compounding quantity of electroconductive oxide particle is the range of 0.05-10.0 mass parts. (B) A dielectric constant will not fully increase that content of electroconductive oxide particle is less than 0.03 mass part. Moreover, when content of the said (B) component exceeds 13.0 mass parts, an aggregate will be easy to generate | occur | produce, and there exists a possibility that a dielectric loss tangent may increase by the deterioration of a moldability or insulation fall. In addition, about the usage form of the high dielectric constant resin composition of this invention, solid forms, such as a powder and a pellet, may be sufficient as liquid forms, such as a dispersion liquid and aqueous solution.

(A) Although it does not specifically limit as a method of mix | blending (B) electroconductive oxide particle with resin, For example, any of the following methods is mentioned.
(I) a method in which (A) a resin is dissolved in (C) an organic solvent and then (B) a conductive oxide is added and dispersed;
(Ii) (A) a method of dispersing resin in water and adding and dispersing (B) conductive oxide particles in the aqueous dispersion;
(Iii) (A) A method in which a resin is melt-kneaded and (B) conductive oxide particles are dispersed.

In the case of the method (i), the (C) organic solvent to be used may be appropriately selected from those in which (A) the resin dissolves, and the kind thereof is not particularly limited. Examples include alcohols, ethers, ketones, aromatic hydrocarbons, nitrogen-containing organic solvents, and the like, which are selected in consideration of the solubility parameter (SP value) and polarity of (A) resin and (C) organic solvent.
For example, if the resin (A) is a polyetherimide resin, polyacrylic resin, polycarbonate resin, polystyrene resin, polyvinylidene fluoride resin, polyvinyl chloride resin, polyvinylidene fluoride-hexafluoropropylene copolymer resin, N -Methylpyrrolidone (NMP) can be used as (C) organic solvent.

  In the case of (i) above, (B) conductive oxide particles may be directly added and mixed in a solution in which (A) resin is dissolved in (C) an organic solvent. The oxide particles may be dispersed in (C) an organic solvent and mixed.

  (C) Although the amount of organic solvent used is not particularly limited, it is preferable to use 10 to 5,000 parts by mass of (C) organic solvent with respect to 100 parts by mass of (A) resin for industrial use. .

  (A) Resin and (C) organic solvent are mixed and dissolved by a known mixing preparation method such as a propeller stirrer or homogenizer, and then (B) conductive oxide is added to (B) conductive oxide particles or (C) organic solvent. The high dielectric constant resin composition of the present invention can be obtained by mixing the oxide particles dispersed therein.

  In the case of the method (ii), (A) an aqueous dispersion such as an emulsion in which a resin is dispersed in water and (B) conductive oxide particles are mixed by a known mixing preparation method such as a propeller type agitator or a homogenizer. By doing so, the high dielectric constant resin composition of the present invention can be obtained. In this case, the aqueous dispersion used is preferably an aqueous dispersion of polyacrylic resin, polyvinyl chloride resin, polyvinyl acetate resin, polylactic acid resin, or polyurethane resin.

  In the methods (i) and (ii), the mixed solution thus obtained can be poured into a mold and dried to be formed into a desired shape, and is particularly suitable for a molded article such as a film. is there.

  In order to prevent the organic solvent or water from boiling and the air from mixing with the film, the drying is preferably performed stepwise at a temperature not higher than the boiling point of the organic solvent or water (for example, 30 to 400 ° C.). It is preferable to perform preliminary drying (pre-drying) at a temperature below the boiling point and then perform main drying at a temperature near the boiling point. In addition, after this drying, you may dry at higher temperature than a boiling point. By performing this preliminary drying, a film having a uniform quality can be formed. For example, (A) a resin is dissolved in N-methylpyrrolidone (NMP), and (B) an NMP dispersion mixed with conductive oxide particles is preliminarily dried at 150 ° C., and then finally dried at 200 ° C. near the boiling point. It is preferable to carry out. Although drying time can be suitably adjusted with a shape and the thickness of a film, when industrial use is considered, it is preferable to dry in 0.1 to 100 hours.

  In a film comprising such a high dielectric constant resin composition, the thickness of the coating film before drying may be appropriately set so as to have a desired thickness after drying, preferably 1 μm to 10 mm. Preferably it can set to the range of 2 micrometers-1 mm. When the thickness of the coating film exceeds 10 mm, the solvent remains in the film or drying takes a long time, which is not preferable. On the other hand, if the thickness of the coating film is less than 1 μm, defects such as tearing may increase, resulting in poor molding.

  In the case of the method (iii), (A) the resin is melted, and (B) the conductive oxide particles are mixed. This melt-kneading step is performed using a single screw extruder, a twin screw extruder, a kneader, a Banbury mixer, or the like. The conditions are not particularly limited, but preferably kneaded and molded at a temperature of 200 to 500 ° C. The melt-kneaded product can be molded into a desired shape by injection molding or the like, and can be used for a wide range of applications.

The obtained molded article such as a film preferably has a volume resistivity of 1 × 10 ⁹ Ω · cm or more, particularly 1 × 10 ¹⁰ Ω · cm or more. If the volume resistivity is lower than 1 × 10 ⁹ Ω · cm, there is a concern about defects due to deterioration of insulation. If it is 1 × 10 ⁹ Ω · cm or more, sufficient insulation can be secured for using the high dielectric constant resin composition of the present invention as a dielectric material. In addition, the upper limit value of the volume resistivity of the obtained molded article such as a film is preferably 1 × 10 ¹⁵ Ω · cm or less.

  The high dielectric constant resin composition of the present invention has a dielectric constant of 2.5 at a frequency of 100 kHz by changing the content of (B) conductive oxide particles in the range of 0.03 to 13.0 parts by mass. It can be set in the range of ~ 20. The dielectric constant may be selected appropriately depending on the intended application.

  In addition, the high dielectric constant resin composition has various additives such as an antioxidant, a colorant, an ultraviolet absorber, a light stabilizer, an antistatic agent, a plasticizer, and a flame retardant, as long as the performance is not affected. May be added as appropriate.

  The high dielectric constant resin composition of the present invention can be used for a wide range of applications such as molded products such as films and injection molded products, and has particularly high dielectric constant and excellent electrical characteristics. It can be suitably used as a material.

  EXAMPLES The present invention will be specifically described below with reference to examples and comparative examples, but the present invention is not limited to the examples. In addition, in the following example, a part and% show a mass part and the mass%, respectively.

[Example 1]
100 parts of polyacrylic resin (PMMA) (Delpet 60N manufactured by Asahi Kasei Chemicals Corporation) was dissolved in 500 parts of N-methylpyrrolidone (NMP) at room temperature. Thereto, 0.3 part of antimony-doped tin oxide (ATO) (manufactured by Sigma-Aldrich Japan) having a particle diameter of 50 nm was mixed to obtain a liquid resin composition.
The obtained resin composition was poured into an aluminum tray, preliminarily dried at 150 ° C. for 2 hours, and then main dried at 200 ° C. for 2 hours. A film having a thickness of 0.40 mm was obtained.
The volume resistivity, dielectric constant, and dielectric loss tangent of the obtained film were measured, and the results are shown in Table 1. Details of each measurement are shown below.

[Measurement of volume resistivity]
The Hiresta-UX MCP-HT800 manufactured by Mitsubishi Chemical Analytech Co., Ltd. as a high resistance resistivity meter, the URS probe manufactured by Mitsubishi Chemical Analytech Co., Ltd. as a ring probe, and the Mitsubishi Chemical Analytech Co., Ltd. as a register table Using the manufactured UFL, the produced resin film was sandwiched, and the volume resistivity of the resin film was measured under the condition of an applied voltage of 1,000 V for 10 seconds.

ｔ_m：膜厚［ｍ］
Ａ：主電極の表面積［ｍ²］
ｄ：主電極の直径［ｍ］
ε₀：真空の誘電率＝８．８５４×１０^-12［Ｆ／ｍ］ [Measurement of dielectric constant and dissipation factor]
Using an E-4980A manufactured by Agilent as an LCR meter and a 16451B dielectric test fixture manufactured by Agilent as a jig, the dielectric constant and dielectric loss tangent of the resin film were measured by an electrode contact method of a parallel plate method. The value of the capacitance C _p [F] measured at each frequency (100 Hz, 1 kHz, 10 kHz, 100 kHz, 1 MHz, 2 MHz) was substituted into the following equation to calculate the dielectric constant (ε _r ). At the same time, the dielectric loss tangent D was measured and calculated.

t _m : film thickness [m]
A: Main electrode surface area [m ² ]
d: Diameter of main electrode [m]
ε ₀ : Dielectric constant of vacuum = 8.854 × 10 ⁻¹² [F / m]

[Example 2]
A resin composition and a film were prepared and evaluated in the same manner as in Example 1 except that the polyacrylic resin (PMMA) in Example 1 was replaced with polystyrene resin (PS) (GPPS SGP10 manufactured by PS Japan Co., Ltd.). It was. The results are shown in Table 1.

[Example 3]
A resin composition and a film were prepared and evaluated in the same manner as in Example 1 except that the polyacrylic resin (PMMA) in Example 1 was replaced with polycarbonate resin (PC) (Taflon IR2200 manufactured by Idemitsu Kosan Co., Ltd.). It was. The results are shown in Table 1.

[Example 4]
A resin composition and a film were prepared and evaluated in the same manner as in Example 1 except that the polyacrylic resin (PMMA) in Example 1 was replaced with polyvinylidene fluoride resin (PVDF) (Kynar 741 manufactured by Arkema Co., Ltd.). It was. The results are shown in Table 1.

[Example 5]
Resin composition similar to Example 1 except that polyacrylic resin (PMMA) of Example 1 was replaced with polyvinylidene fluoride-hexafluoropropylene copolymer resin (PVDF-HFP) (Kynar 2801-00 manufactured by Arkema Co., Ltd.) A product and a film were prepared and evaluated. The results are shown in Table 1.

[Example 6]
Polylactic acid resin (PLA) emulsion (Randy PL-3000 manufactured by Miyoshi Oil & Fats Co., Ltd.) 250 parts (100 parts in terms of solid content) antimony doped tin oxide (ATO) having a particle diameter of 50 nm (manufactured by Sigma Aldrich Japan Co., Ltd.) 0.3 parts was dispersed to obtain a liquid resin composition. A film was prepared and evaluated in the same manner as in Example 1. The results are shown in Table 1.

[Example 7]
A resin composition and a film were produced in the same manner as in Example 1 except that the polyacrylic resin (PMMA) in Example 1 was replaced with a polyetherimide resin (PEI) (Ultem Resin 1000: manufactured by SABIC.IP). And evaluated. The results are shown in Table 2.

[Examples 8 to 14]
A resin composition and a film were prepared and evaluated in the same manner as in Example 7 except that the addition amount and / or particle diameter of antimony-doped tin oxide (ATO) was as shown in Table 2. The results are shown in Table 2.

[Examples 15 to 17]
(B) Resin composition and film in the same manner as in Example 7 except that tin-doped indium oxide (ITO) was used as the conductive oxide particles, and the addition amount and / or particle diameter was as shown in Table 2. Were prepared and evaluated. The results are shown in Table 2.

[Comparative Examples 1 to 7]
As shown in Tables 1 and 2, resin compositions and films were prepared and evaluated in the same manner as in each Example without adding antimony-doped tin oxide (ATO). The results are shown in Tables 1 and 2.

[Comparative Example 8 and Comparative Example 9]
A resin composition and a film were prepared and evaluated in the same manner as in Example 7 except that the addition amount of antimony-doped tin oxide (ATO) was as shown in Table 2. The results are shown in Table 2.

[Comparative Example 10 and Comparative Example 11]
Resin composition as in Example 7 except that antimony-doped tin oxide (ATO) was replaced with barium titanate (BaTiO ₃ ) (manufactured by Sigma-Aldrich Japan) and the amount added was adjusted as shown in Table 3. And a film were prepared and evaluated. The results are shown in Table 3.

[Comparative Example 12 and Comparative Example 13]
The resin composition was the same as in Example 7 except that the antimony-doped tin oxide (ATO) was replaced with carbon nanopowder (100 nm) (manufactured by Sigma-Aldrich Japan) and the amount added was adjusted as shown in Table 3. A film was prepared and evaluated. The results are shown in Table 3.

In addition, the detail of the material of the (B-1) and (B-2) component in the following Tables 1-3 is as follows.
(B-1)
Antimony-doped tin oxide (particle size 50 nm): Sigma-Aldrich Japan Co., Ltd. Antimony-doped tin oxide (particle size 20 nm): Mitsubishi Materials Electronics Chemical Co., Ltd. T-1
(B-2)
Tin-doped indium oxide (particle diameter 50 nm): Sigma-Aldrich Japan Co., Ltd. Tin-doped indium oxide (particle diameter 20 nm): Mitsubishi Materials Electronics Chemical Co., Ltd. E-ITO

  As shown in Tables 1-3, the high dielectric constant resin composition of this example and the resin film thereof all have (B) conductive oxide particles in an amount of 0.03 to 100 parts by mass of (A) resin. It can be seen that 13.0 parts by mass is blended and shows a higher dielectric constant than each comparative example containing carbon nanopowder and barium titanate particles.

  That is, as described above, in the high dielectric constant resin material in which the conductive filler is added to the resin, it is considered that the dielectric constant is increased by substantially reducing the distance between the electrodes (dielectric thickness). Since this effect itself does not depend on the type of the conductive filler, it has been considered that the dielectric constant does not change greatly even if the type of the conductive filler is changed. However, in the present invention (this example), as shown in Tables 1 to 3 above, by using conductive oxide particles, an extremely high dielectric constant increasing effect and low dielectric constant compared to carbon nanopowder. Can exhibit tangent. Furthermore, even when compared with a resin obtained by adding a high dielectric constant metal oxide filler such as barium titanate in the resin, in this example, when a specific dielectric constant is set, the addition amount is small and the moldability is also good. It is good.

Claims (9)

  (A) Resin and (B) electroconductive oxide particle are contained, 0.03-13.0 mass parts of said (B) electroconductive oxide particle is mix | blended with respect to 100 mass parts of said (A) resin. A high dielectric constant resin composition characterized by comprising:   2. The oxide of the conductive oxide particles (B) is an oxide or composite oxide containing at least one selected from the group consisting of tin oxide, indium oxide, antimony oxide, zinc oxide, and cadmium oxide. High dielectric constant resin composition.   The high dielectric constant resin composition according to claim 1, wherein the oxide of the conductive oxide particles (B) is antimony-doped tin oxide or tin-doped indium oxide.   The high dielectric constant resin composition according to any one of claims 1 to 3, wherein the conductive oxide particles (B) have an average particle diameter of 100 nm or less.   The resin (A) is polystyrene resin, polyacrylic resin, polyvinyl chloride resin, polypropylene resin, polycarbonate resin, low density polyethylene resin, medium density polyethylene resin, high density polyethylene resin, polylactic acid resin, 6 nylon resin, 66 nylon. Resins, polyphenylene oxide resins, polyphenylene sulfide resins, polysulfone resins, polyester resins, polyimide resins, polyether ether ketone resins, polyether imide resins, polyvinylidene fluoride resins, and polyvinylidene fluoride-hexafluoropropylene copolymer resins The high dielectric constant resin composition according to claim 1, which is a thermoplastic resin containing at least one selected.   A molded article comprising the high dielectric constant resin composition according to any one of claims 1 to 5. The molded article according to claim 6, wherein the volume resistivity is 1 × 10 ⁹ to 1 × 10 ¹⁵ Ω · cm.   The molded article according to claim 6 or 7, wherein the molded article is a film.   An electrical / electronic component comprising the high dielectric constant resin composition according to claim 1.