JP2018085730A5 - Booster antenna - Google Patents
Booster antenna Download PDFInfo
- Publication number
- JP2018085730A5 JP2018085730A5 JP2017226777A JP2017226777A JP2018085730A5 JP 2018085730 A5 JP2018085730 A5 JP 2018085730A5 JP 2017226777 A JP2017226777 A JP 2017226777A JP 2017226777 A JP2017226777 A JP 2017226777A JP 2018085730 A5 JP2018085730 A5 JP 2018085730A5
- Authority
- JP
- Japan
- Prior art keywords
- insulating layer
- booster antenna
- chip
- mounting portion
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000004804 winding Methods 0.000 claims description 2
Description
本発明は、ＩＣチップに設けられたアンテナと略同一周波数で動作するブースターアンテナに関する。 The present invention relates to a booster antenna operating at substantially the same frequency as an antenna provided in an IC chip .
本発明のブースターアンテナは、ＩＣチップに設けられたアンテナと略同一周波数で動作するブースターアンテナであって、絶縁層と、該絶縁層内に、導体ラインを巻回して形成される導体パターンと、ＩＣチップを載置する絶縁性の載置部と、を備えることを特徴としている。 The booster antenna according to the present invention is a booster antenna that operates at substantially the same frequency as an antenna provided in an IC chip, and includes an insulating layer, and a conductor pattern formed by winding a conductor line in the insulating layer. comprising an insulating mounting portion for mounting the IC chip, the is characterized in Rukoto.
また、本発明のブースターアンテナは、前記絶縁層と前記載置部とは、セラミック製であり、前記載置部は、前記絶縁層の上に積層されていてもよい。 In the booster antenna of the present invention, the insulating layer and the placing portion may be made of ceramic, and the placing portion may be stacked on the insulating layer.
また、本発明のブースターアンテナは、絶縁性の台を備え、該台の上に前記絶縁層が積層され、該絶縁層の上に前記載置部が積層されていてもよい。 Moreover, the booster antenna of this invention may be equipped with an insulating base, the said insulating layer may be laminated | stacked on this base, and the said mounting part may be laminated | stacked on this insulating layer.
また、本発明のブースターアンテナにおいて、前記絶縁層と前記載置部と前記台とは、セラミック製であってもよい。 Further, in the booster antenna of the present invention, the insulating layer, the placing portion and the base may be made of ceramic.
また、本発明のブースターアンテナにおいて、前記載置部は、セラミック製であり、且つＩＣチップを載置するための凹部が形成され、該凹部には、前記ＩＣチップをモールドするためのセラミックスと同等の熱膨張率を有する樹脂が充填されていてもよい。 In the booster antenna according to the present invention, the placement portion is made of ceramic, and a recess for mounting an IC chip is formed, and the recess is equivalent to a ceramic for molding the IC chip. It may be filled with a resin having a coefficient of thermal expansion.
Claims (5)
絶縁層と、An insulating layer,
該絶縁層内に、導体ラインを巻回して形成される導体パターンと、A conductor pattern formed by winding a conductor line in the insulating layer;
ＩＣチップを載置する絶縁性の載置部と、An insulating mounting portion on which the IC chip is mounted;
を備えることを特徴とするブースターアンテナ。A booster antenna characterized by comprising.
前記載置部は、前記絶縁層の上に積層されている、The placement portion is stacked on the insulating layer,
請求項１に記載のブースターアンテナ。The booster antenna according to claim 1.
該台の上に前記絶縁層が積層され、The insulating layer is laminated on the pedestal,
該絶縁層の上に前記載置部が積層される、The mounting portion is stacked on the insulating layer,
請求項１又は２に記載のブースターアンテナ。The booster antenna according to claim 1 or 2.
請求項３に記載のブースターアンテナ。The booster antenna according to claim 3.
該凹部には、前記ＩＣチップをモールドするためのセラミックスと同等の熱膨張率を有する樹脂が充填されている、The recess is filled with a resin having a thermal expansion coefficient equivalent to that of the ceramic for molding the IC chip.
請求項１乃至請求項４の何れか１項に記載のブースターアンテナ。The booster antenna according to any one of claims 1 to 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017226777A JP6789202B2 (en) | 2017-11-27 | 2017-11-27 | Booster antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017226777A JP6789202B2 (en) | 2017-11-27 | 2017-11-27 | Booster antenna |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016082202A Division JP6251770B2 (en) | 2016-04-15 | 2016-04-15 | RFID tag |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018085730A JP2018085730A (en) | 2018-05-31 |
| JP2018085730A5 true JP2018085730A5 (en) | 2019-05-16 |
| JP6789202B2 JP6789202B2 (en) | 2020-11-25 |
Family
ID=62236723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017226777A Active JP6789202B2 (en) | 2017-11-27 | 2017-11-27 | Booster antenna |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6789202B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020203598A1 (en) * | 2019-03-29 | 2020-10-08 | 株式会社フェニックスソリューション | Rfid tag with boost antenna, conductor provided with rfid tag with boost antenna, and rfid system including rfid tag with boost antenna |
| JP6546711B1 (en) * | 2019-04-10 | 2019-07-17 | 株式会社エスケーエレクトロニクス | Non-contact information carrier |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4363735B2 (en) * | 1999-02-24 | 2009-11-11 | 日立マクセル株式会社 | Information carrier manufacturing method |
| KR101047189B1 (en) * | 2007-12-20 | 2011-07-06 | 가부시키가이샤 무라타 세이사쿠쇼 | Wireless IC devices |
| JP2010028351A (en) * | 2008-07-17 | 2010-02-04 | Fujikura Ltd | Booster antenna and contactless information medium |
| CN103946874B (en) * | 2011-11-17 | 2016-12-14 | 凸版印刷株式会社 | composite IC card |
| JP5961980B2 (en) * | 2011-11-19 | 2016-08-03 | ヤマハ株式会社 | Acoustic signal processing device |
| WO2015088486A1 (en) * | 2013-12-09 | 2015-06-18 | Intel Corporation | Antenna on ceramics for a packaged die |
-
2017
- 2017-11-27 JP JP2017226777A patent/JP6789202B2/en active Active
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