JP2018070045A - Temperature control base plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a temperature control base plate which can improve a degree of freedom of arrangement of a cooling passage and a heating passage.SOLUTION: A temperature control base plate 1A includes a base plate body 2 installed in a space environment test device, provides a given temperature environment to a test piece installed on a surface of the base plate body 2, and includes: a cooling passage 3 in which a cooling source for the base plate body 2 is disposed; and a heating passage 5 in which a heating source for the base plate body 2 is disposed. The cooling passage 3 is constituted of any one of an upper layer side groove part 8 and a lower layer side groove part 10 located at height positions which do not overlap with each other in a thickness direction of the base plate body 2, and the heating passage 5 is constituted of the other one.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a temperature control base plate that is installed in a space environment test apparatus and provides an arbitrary temperature environment to a test body using a heating source and a cooling source.

  In general, a small space environment test apparatus is used for a thermal vacuum environment test of a part-level test body used for an artificial satellite (see, for example, Patent Document 1). The space environment test apparatus includes a temperature control base plate (hereinafter referred to as “base plate”) in order to provide an arbitrary temperature environment to the test body. In the space environment test apparatus, a satellite component, which is a test body, is installed on the surface of a base plate, and the temperature of the base plate is controlled to give a specified temperature environment to the test body.

  In the base plate, temperature control is performed by using a cold fluid generated in a refrigerator or a refrigerant such as liquid nitrogen as a cooling source, and a heater such as a hot water heater or an electric heater as a heating source. When the lower limit specification value on the low temperature side is up to −70 ° C., the temperature control range often uses low temperature chlorofluorocarbons generated by a refrigerator as the refrigerant, and liquid nitrogen is used when the temperature is lower than that.

  Further, even when the lower limit specification value on the low temperature side is up to −70 ° C., it is possible to use liquid nitrogen. However, it has been avoided because of restrictions such as the high-pressure gas safety law and difficulties in completely unattended operation, and in general, Freon refrigerators are used. On the other hand, the temperature control range on the high temperature side is often set to a specification value of +100 to + 150 ° C. When a hot water heater is not possible, an electric heater is generally used as a heating source.

  Patent Document 1 below discloses a base plate in which a groove portion in which a heater serving as a heating source is disposed and a groove portion in which a refrigerant serving as a cooling source circulates exist on the same plane of the base plate body.

Japanese Patent No. 4142167

  However, in such a conventional base plate, the heater groove portion and the refrigerant groove portion are present on a plane at the same height, and therefore, the heater groove portion and the refrigerant groove portion are arranged so as to intersect with each other. In other words, the heater groove portions or the coolant groove portions could not be arranged close to each other, and the degree of freedom of arrangement of each was low.

  In addition, the gap between the heater groove portions or the refrigerant groove portions becomes large, and it becomes difficult to make the temperature on the base plate uniform. In addition, there are restrictions on the heater introduction position on the side of the base plate, the refrigerant introduction position, and the like.

  This invention is proposed in view of such a conventional situation, and it aims at providing the temperature control baseplate which can raise the freedom degree of arrangement | positioning of a cooling channel | path and a heating channel | path.

In order to achieve the above object, the present invention provides the following means.
[1] A temperature control base plate including a base plate body installed in a space environment test apparatus, and providing an arbitrary temperature environment to a test body installed on a surface of the base plate body,
A cooling passage in which a cooling source for the base plate body is disposed;
A heating passage in which a heating source for the base plate body is disposed,
The cooling passage is configured by any one of the upper layer side groove portion and the lower layer side groove portion at a height position that does not overlap with each other in the thickness direction of the base plate main body, and the heating passage is configured by any one of the other. And temperature control base plate.
[2] The base plate body has a structure in which an upper layer side plate and a lower layer side plate are laminated,
The upper layer side groove is provided on the upper surface or the lower surface of the upper layer side plate,
The temperature control base plate according to [1], wherein the lower layer side groove is provided on an upper surface or a lower surface of the lower layer side plate.
[3] The upper layer groove provided on the upper surface of the plate body or the upper surface of the upper layer plate, or the lower layer groove provided on the lower surface of the base plate body or the lower surface of the lower plate, The temperature control base plate according to the above [1] or [2], wherein an opening opposite to the cover is closed by a lid.
[4] The upper layer side groove provided on the lower surface of the upper layer side plate, the opening facing the bottom surface is closed by the upper surface of the lower layer side plate. Temperature control base plate.
[5] The lower layer side groove provided on the upper surface of the lower layer side plate, the opening facing the bottom surface is closed by the lower surface of the upper layer side plate, Temperature control base plate.
[6] One of the cooling channel and the heating channel is one continuous upper layer side groove from the refrigerant introduction port to the outlet port that is opened in a side surface of the base plate main body, the upper layer side plate, or the lower layer side plate. The temperature control base plate according to any one of [2] to [5], wherein the temperature control base plate is configured by a lower portion side groove or the lower layer side groove portion.

  As described above, according to the present invention, it is possible to provide a temperature control base plate that can increase the degree of freedom of arrangement of the cooling passage and the heating passage.

It is a see-through | perspective perspective view which shows schematic structure of the temperature control baseplate which concerns on the 1st Embodiment of this invention. It is a disassembled perspective view which shows the structure of the temperature control baseplate shown in FIG. It is a top view which shows an example of the upper layer side groove part of the temperature control baseplate shown in FIG. It is a top view which shows an example of the lower layer side groove part of the temperature control baseplate shown in FIG. It is a disassembled perspective view which shows schematic structure of the temperature control baseplate which concerns on the 2nd Embodiment of this invention. It is a disassembled perspective view which shows schematic structure of the temperature control baseplate which concerns on the 3rd Embodiment of this invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
In addition, in the drawings used in the following description, in order to make the features easy to understand, there are cases where the portions that become the features are enlarged for the sake of convenience, and the dimensional ratios of the respective components are not always the same as the actual ones. Absent. In addition, the materials, dimensions, and the like exemplified in the following description are merely examples, and the present invention is not necessarily limited thereto, and can be appropriately modified and implemented without departing from the scope of the invention. .

(First embodiment)
First, as a first embodiment of the present invention, for example, a temperature control base plate (hereinafter referred to as “base plate”) 1A shown in FIGS. 1 and 2 will be described. FIG. 1 is a perspective view showing the configuration of the base plate 1A. FIG. 2 is an exploded perspective view showing the configuration of the base plate 1A.

  The base plate 1A of the present embodiment includes a base plate body 2 installed in a space environment test apparatus, and an arbitrary temperature environment is applied to a test body (not shown) installed on the surface of the base plate body 2. It is to provide.

  Specifically, the base plate 1A includes a cooling passage 3 through which the refrigerant C flows as a cooling source for the base plate main body 2, and a heating passage 5 in which the heater 4 is disposed as a heating source for the base plate main body 2. . The cooling passage 3 and the heating passage 5 are at a height position where they do not overlap each other in the thickness direction of the base plate body 2. In the present embodiment, liquid nitrogen is used as the refrigerant C, and an electric heater is used as the heater 4.

  The base plate body 2 has a structure in which an upper layer side plate 6 and a lower layer side plate 7 are laminated. The material of the base plate body 2 (upper layer side plate 6 and lower layer side plate 7) is aluminum or aluminum alloy having good thermal conductivity, and it is preferable to use an aluminum alloy from the viewpoint of weight reduction. The material of the base plate main body 2 (upper layer side plate 6 and lower layer side plate 7) is not necessarily limited to these, and any material that can withstand the weight of the specimen and can be used within the specified temperature range. .

  In the present embodiment, the size of the upper layer side plate 6 is 1000 mm in length, 600 mm in width, and 25 mm in height. On the other hand, the size of the lower layer side plate 7 is 1000 mm in length, 600 mm in width, and 10 mm in height.

  The cooling passage 3 is formed in a rectangular cross section from an upper layer groove 8 provided on the lower surface of the upper layer plate 6 and a lid 9 that closes an opening facing the bottom surface of the upper layer groove 8. The lid 9 is integrally attached to the lower surface of the upper layer plate 6 by electron beam welding so as to form a surface continuous with the lower surface of the upper layer plate 6 with the opening of the upper layer groove 8 closed. Yes.

  The material of the lid 9 is aluminum or aluminum alloy having good thermal conductivity, and it is preferable to use an aluminum alloy from the viewpoint of weight reduction. The material of the lid body 9 is not necessarily limited to these, and any material can be used as long as it can withstand the weight of the test body and can be used within the specified temperature range.

  Moreover, as a method for attaching the lid body 9, a joining method such as friction stir welding may be used in addition to the above-described welding. When this joining method is used, the interval between the upper groove portions 8 adjacent in the plane of the upper layer plate 6 can be reduced. Thereby, the freedom degree of a pattern can be raised. Further, as long as the refrigerant C does not leak, other attachment methods such as brazing and adhesive may be used.

  In the present embodiment, the size of the upper layer side groove 8 is 10 mm in width and 10 mm in depth. The lid 9 has a width of 10 mm and a thickness of 3 mm.

  For example, as shown in FIG. 3, the cooling passage 3 is configured by one continuous upper layer side groove portion 8 from the inlet 3 a to the outlet 3 b of the refrigerant C opened on the side surface of the upper layer plate 6 in order to circulate the refrigerant C. Has been. Specifically, the inlet 3 a and the outlet 3 b are provided on the same side surface of the upper layer plate 6. The upper layer side groove portion 8 turns in one direction from the introduction port 3a of the upper layer side plate 6 toward the inside in the surface, and then turns in the other direction from the inside to the outside in the surface. Are continuously provided up to the outlet 3b.

  In order to make the temperature of the base plate body 2 more uniform in the cooling passage 3, it is preferable that the interval between the upper layer side groove portions 8 adjacent in the plane of the upper layer side plate 6 is made narrower. Further, the inlet 3 a and the outlet 3 b are not limited to the same side surface of the upper layer plate 6, but can be provided on any side surface of the upper layer plate 6.

  The heating passage 5 is rectangular in cross section from the lower layer side groove portion 10 provided on the upper surface of the lower layer side plate 7, the lower surface of the upper layer side plate 6 that closes the opening facing the bottom surface of the lower layer side groove portion 10, and the lid body 9. It is configured in shape. In addition, the size of the lower layer side groove part 10 is 5 mm in width and 5 mm in depth.

  For example, as shown in FIG. 4, the heating passage 5 is configured by a lower layer side groove portion 10 that is led out linearly from an outlet 5 a of the heater 4 that is opened on the side surface of the upper layer side plate 6. Specifically, a total of two outlets 5 a are provided so as to be located at diagonally opposite sides of the upper layer plate 6. The lower layer side groove 10 is continuously provided from these two outlets 5a to the positions close to each other while meandering in opposite directions.

  As a result, in the heating passage 5, the two heaters 4 are arranged linearly along the inside of the two lower layer side grooves 10. The number of heaters 4 to be arranged is not limited to the two described above, but may be one or three or more, and it is only necessary to provide the lower layer side groove portion 10 according to the number of heaters 4. .

  In order to make the temperature of the base plate main body 2 more uniform in the heating passage 5, it is preferable to narrow the interval between the lower layer side groove portions 10 adjacent in the plane of the lower layer side plate 7. Further, the outlet 5 a is not limited to the same side surface of the lower layer side plate 7, but can be provided on an arbitrary side surface of the lower layer side plate 7.

  As described above, in the base plate 1 of the present embodiment, the upper layer side groove portion 8 constituting the cooling passage 3 and the lower layer side groove portion 10 constituting the heating passage 5 do not overlap each other in the thickness direction of the base plate body 2. In position.

  Thereby, it is possible to arrange the cooling passage 3 and the heating passage 5 so as to cross each other in the plane of the base plate body 2. Further, there is no need to particularly limit the arrangement of the inlet 3a and outlet 3b of the cooling passage 3 and the arrangement of the outlet 5a of the heating passage 5.

  Further, the interval between the cooling passages 3 adjacent in the plane of the base plate body 2 (upper layer side plate 6) and the interval between the heating passages 5 adjacent in the plane of the base plate body 2 (lower layer side plate 7) can be reduced. it can.

  Therefore, in the base plate 1 of this embodiment, the freedom degree of arrangement | positioning of the cooling channel | path 3 and the heating channel | path 5 can be raised, As a result, the temperature of the baseplate main body 2 can be made more uniform.

  Specifically, in the base plate 1 of the present embodiment, when the base plate body 2 was cooled to −100 ° C., the temperature width became ± 3.5 ° C. On the other hand, in the conventional base plate, the temperature width at −100 ° C. was ± 5 ° C.

  Moreover, in the base plate 1 of this embodiment, when the base plate main body 2 was heated to 100 ° C., the temperature range became ± 9 ° C. On the other hand, in the conventional base plate, the temperature width at 100 ° C. was ± 10 ° C.

(Second Embodiment)
Next, for example, a base plate 1B shown in FIG. 5 will be described as a second embodiment of the present invention. FIG. 5 is an exploded perspective view showing the configuration of the base plate 1B. Moreover, in the following description, about the site | part equivalent to the said baseplate 1A, while omitting description, the same code | symbol shall be attached | subjected in drawing.

  As shown in FIG. 5, the base plate 1B of the present embodiment includes an upper layer side groove portion 8 that forms the cooling passage 3 on the upper surface of the base plate body 2A, and a lower layer side groove portion 10 that forms the heating passage 5 on the lower surface of the base plate body 2A. Is provided. The cooling passage 3 includes an upper layer side groove portion 8 and a lid body 9 </ b> A that closes an opening facing the bottom surface of the upper layer side groove portion 8. On the other hand, the heating passage 5 includes a lower layer side groove portion 10 and a lid body 9 </ b> B that closes an opening facing the bottom surface of the lower layer side groove portion 10.

  In the case of this configuration, the base plate body 2 </ b> A does not have a laminated structure of the upper layer side plate 6 and the lower layer side plate 7, and the upper layer side groove portion 8 that constitutes the cooling passage 3, and the lower layer side groove portion 10 that constitutes the heating passage 5, Can be arranged at a height position that does not overlap with each other in the thickness direction of the base plate body 2A.

  Thereby, it is possible to arrange the cooling passage 3 and the heating passage 5 so as to cross each other in the plane of the base plate body 2A. Further, there is no need to particularly limit the arrangement of the inlet 3a and outlet 3b of the cooling passage 3 and the arrangement of the outlet 5a of the heating passage 5.

  Further, the interval between the cooling passages 3 adjacent in the plane of the base plate body 2A and the interval between the heating passages 5 adjacent in the plane of the base plate body 2A can be reduced.

  Therefore, in the base plate 1B of the present embodiment, the degree of freedom of arrangement of the cooling passage 3 and the heating passage 5 can be increased, and as a result, the temperature of the base plate body 2A can be made more uniform.

(Third embodiment)
Next, for example, a base plate 1C shown in FIG. 6 will be described as a third embodiment of the present invention. FIG. 6 is an exploded perspective view showing the configuration of the base plate 1C. Moreover, in the following description, about the site | part equivalent to the said baseplate 1A, while omitting description, the same code | symbol shall be attached | subjected in drawing.

  As shown in FIG. 6, the base plate 1 </ b> C of this embodiment includes an upper layer side groove portion 8 that forms the cooling passage 3 on the upper surface of the upper layer side plate 6, and a lower layer side groove portion that forms the heating passage 5 on the upper surface of the lower layer side plate 7. 10 is provided. The cooling passage 3 includes an upper layer side groove portion 8 and a lid body 9 that closes an opening facing the bottom surface of the upper layer side groove portion 8. On the other hand, the heating passage 5 is composed of a lower layer side groove portion 10 and a lower surface of the upper layer side plate 6 that closes an opening facing the bottom surface of the lower layer side groove portion 10.

  In the case of this configuration, the upper layer side groove portion 8 constituting the cooling passage 3 and the lower layer side groove portion 10 constituting the heating passage 5 can be arranged at a height position that does not overlap with each other in the thickness direction of the base plate body 2. is there.

  Thereby, it is possible to arrange the cooling passage 3 and the heating passage 5 so as to cross each other in the plane of the base plate body 2. Further, there is no need to particularly limit the arrangement of the inlet 3a and outlet 3b of the cooling passage 3 and the arrangement of the outlet 5a of the heating passage 5.

  Further, the interval between the cooling passages 3 adjacent in the plane of the base plate body 2 (upper layer side plate 6) and the interval between the heating passages 5 adjacent in the plane of the base plate body 2 (lower layer side plate 7) can be reduced. it can.

  Therefore, in the base plate 1C of the present embodiment, the degree of freedom of arrangement of the cooling passage 3 and the heating passage 5 can be increased, and as a result, the temperature of the base plate body 2 can be made more uniform.

In addition, this invention is not necessarily limited to the thing of the said embodiment, A various change can be added in the range which does not deviate from the meaning of this invention.
For example, in the above embodiment, the cooling passage 3 is constituted by the upper layer side groove portion 8 and the heating passage 5 is constituted by the lower layer side groove portion 10, but the heating passage 5 is constituted by the upper layer side groove portion 8, It is also possible to configure the cooling passage 3 by the lower layer side groove portion 10.

  Further, the upper layer side groove portion 8 may be provided on either the upper surface or the lower surface of the upper layer side plate 6, and the lower layer side groove portion 10 may be provided on either the upper surface or the lower surface of the lower layer side plate 7. Further, the lower layer side groove portion 10 provided on the upper surface of the lower layer side plate 7 is not limited to the configuration in which the lower layer side groove portion 10 is closed by the lower surface of the upper layer side plate 6, and the upper layer side groove portion 8 provided on the lower surface of the upper layer side plate 6 It is good also as a structure obstruct | occluded by the upper surface.

  Further, the cooling source is not limited to the refrigerant C described above, and for example, a Peltier element or the like can be used. In this case, the cooling passage 3 is not constituted by one continuous upper layer side groove portion 8 or lower layer side groove portion 10 from the inlet 3a to the outlet 3b as shown in FIG. 3, but is drawn as shown in FIG. What is necessary is just to comprise by the upper layer side groove part 8 or the lower layer side groove part 10 drawn in the linear form from the exit.

  Further, the heating source is not limited to the above-described electric heater, and a hot water heater for circulating hot water in the heating passage 5 may be provided. In this case, the heating passage 5 is not constituted by the upper layer side groove portion 8 or the lower layer side groove portion 10 drawn linearly from the outlet 5a as shown in FIG. What is necessary is just to comprise by one continuous upper layer side groove part 8 or lower layer side groove part 10 from a lead-out port.

  1A, 1B, 1C ... Temperature control base plate (base plate) 2, 2A ... Base plate body 3 ... Cooling passage 3a ... Inlet 3b ... Outlet 4 ... Heater (heating source) 5 ... Heating passage 5a ... Drawer 6 ... Upper layer side plate 7 ... Lower layer side plate 8 ... Upper layer side groove 9, 9A, 9B ... Lid 10 ... Lower layer side groove C ... Refrigerant (cooling source)

Claims (6)

A temperature control base plate having a base plate body installed in a space environment test apparatus and providing an arbitrary temperature environment to a test body installed on the surface of the base plate body,
A cooling passage in which a cooling source for the base plate body is disposed;
A heating passage in which a heating source for the base plate body is disposed,
The cooling passage is configured by any one of the upper layer side groove portion and the lower layer side groove portion at a height position that does not overlap with each other in the thickness direction of the base plate main body, and the heating passage is configured by any one of the other. And temperature control base plate. The base plate body has a structure in which an upper layer side plate and a lower layer side plate are laminated,
The upper layer side groove is provided on the upper surface or the lower surface of the upper layer side plate,
The temperature control base plate according to claim 1, wherein the lower layer side groove is provided on an upper surface or a lower surface of the lower layer side plate.   The upper layer side groove provided on the upper surface of the plate body or the upper layer side plate, or the lower layer side groove provided on the lower surface of the base plate body or the lower surface of the lower layer side plate faces the bottom surface thereof. The temperature control base plate according to claim 1 or 2, wherein the opening is closed by a lid.   3. The temperature control base plate according to claim 2, wherein an opening facing the bottom surface of the upper layer groove provided on the lower surface of the upper layer plate is closed by the upper surface of the lower layer plate.   3. The temperature control base plate according to claim 2, wherein an opening facing the bottom surface of the lower layer side groove provided on the upper surface of the lower layer side plate is closed by the lower surface of the upper layer side plate.   Either the cooling passage or the heating passage is one continuous upper-layer groove from the refrigerant inlet to the outlet opening in the side surface of the base plate main body, the upper-layer plate, or the lower-layer plate. The temperature control base plate according to any one of claims 2 to 5, wherein the temperature control base plate is constituted by a lower layer side groove portion.

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