JP2018063159A5 - - Google Patents

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Publication number
JP2018063159A5
JP2018063159A5 JP2016201129A JP2016201129A JP2018063159A5 JP 2018063159 A5 JP2018063159 A5 JP 2018063159A5 JP 2016201129 A JP2016201129 A JP 2016201129A JP 2016201129 A JP2016201129 A JP 2016201129A JP 2018063159 A5 JP2018063159 A5 JP 2018063159A5
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JP
Japan
Prior art keywords
mounting substrate
wave radar
radar device
substrate
millimeter wave
Prior art date
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Application number
JP2016201129A
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Japanese (ja)
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JP6699500B2 (en
JP2018063159A (en
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Publication date
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Priority to JP2016201129A priority Critical patent/JP6699500B2/en
Priority claimed from JP2016201129A external-priority patent/JP6699500B2/en
Priority to PCT/JP2017/031603 priority patent/WO2018070137A1/en
Publication of JP2018063159A publication Critical patent/JP2018063159A/en
Publication of JP2018063159A5 publication Critical patent/JP2018063159A5/ja
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Publication of JP6699500B2 publication Critical patent/JP6699500B2/en
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Description

上記目的を達成するため、請求項1に記載の発明のミリ波レーダ装置は、
ケース(2)と、
ケースの内部に収容される実装基板(4)と、
実装基板に実装され、ミリ波を送信するアンテナ基板(10)とを備え、
アンテナ基板は、1つ以上の屈曲部(103、104)と、屈曲部を介して互いにつながる複数の平面部(105、106、107)と、複数の平面部のそれぞれの表面上に形成されたアンテナ素子(102)とを有し、
複数の平面部の全体は、実装基板の厚さ方向で実装基板から離れる側に向かって凸形状をなしており、
ミリ波レーダ装置は、ミリ波を発振させるための高周波用部品(8)を備え、
高周波用部品は、実装基板の一面(4a)に固定されており、
アンテナ基板は、高周波用部品を覆うように、実装基板の一面に固定されている。
In order to achieve the above object, a millimeter wave radar apparatus according to claim 1 is provided.
Case (2),
A mounting board (4) housed inside the case;
An antenna substrate (10) mounted on a mounting substrate and transmitting millimeter waves;
The antenna substrate is formed on the surface of each of the one or more bent portions (103, 104), the plurality of flat portions (105, 106, 107) connected to each other through the bent portions, and the plurality of flat portions. An antenna element (102),
The whole of the plurality of flat portions, and a convex shape toward the side away from the mounting substrate in a thickness direction of the mounting substrate,
The millimeter wave radar device includes a high frequency component (8) for oscillating millimeter waves,
The high frequency component is fixed to one surface (4a) of the mounting substrate,
The antenna substrate is fixed to one surface of the mounting substrate so as to cover the high frequency component .

Claims (2)

ミリ波レーダ装置であって、
ケース(2)と、
前記ケースの内部に収容される実装基板(4)と、
前記実装基板に実装され、ミリ波を送信するアンテナ基板(10)とを備え、
前記アンテナ基板は、1つ以上の屈曲部(103、104)と、前記屈曲部を介して互いにつながる複数の平面部(105、106、107)と、前記複数の平面部のそれぞれの表面上に形成されたアンテナ素子(102)とを有し、
前記複数の平面部の全体は、前記実装基板の厚さ方向で前記実装基板から離れる側に向かって凸形状をなしており、
前記ミリ波レーダ装置は、ミリ波を発振させるための高周波用部品(8)を備え、
前記高周波用部品は、前記実装基板の一面(4a)に固定されており、
前記アンテナ基板は、前記高周波用部品を覆うように、前記実装基板の一面に固定されているミリ波レーダ装置。
A millimeter wave radar device,
Case (2),
A mounting board (4) housed inside the case;
An antenna substrate (10) mounted on the mounting substrate and transmitting millimeter waves;
The antenna substrate has one or more bent portions (103, 104), a plurality of flat portions (105, 106, 107) connected to each other via the bent portions, and a surface of each of the plurality of flat portions. An antenna element (102) formed,
The whole of the plurality of planar portions has a convex shape toward the side away from the mounting substrate in the thickness direction of the mounting substrate ,
The millimeter wave radar device includes a high frequency component (8) for oscillating millimeter waves,
The high-frequency component is fixed to one surface (4a) of the mounting substrate,
The millimeter wave radar device , wherein the antenna substrate is fixed to one surface of the mounting substrate so as to cover the high frequency component .
前記複数の平面部の法線方向(N1、N2、N3)が互いに交差している請求項1に記載のミリ波レーダ装置。   The millimeter wave radar device according to claim 1, wherein normal directions (N1, N2, N3) of the plurality of plane portions intersect each other.
JP2016201129A 2016-10-12 2016-10-12 Millimeter wave radar device and manufacturing method thereof Active JP6699500B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2016201129A JP6699500B2 (en) 2016-10-12 2016-10-12 Millimeter wave radar device and manufacturing method thereof
PCT/JP2017/031603 WO2018070137A1 (en) 2016-10-12 2017-09-01 Millimeter-wave radar device and method for manufacturing same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016201129A JP6699500B2 (en) 2016-10-12 2016-10-12 Millimeter wave radar device and manufacturing method thereof

Publications (3)

Publication Number Publication Date
JP2018063159A JP2018063159A (en) 2018-04-19
JP2018063159A5 true JP2018063159A5 (en) 2019-04-11
JP6699500B2 JP6699500B2 (en) 2020-05-27

Family

ID=61906241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016201129A Active JP6699500B2 (en) 2016-10-12 2016-10-12 Millimeter wave radar device and manufacturing method thereof

Country Status (2)

Country Link
JP (1) JP6699500B2 (en)
WO (1) WO2018070137A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020027058A1 (en) * 2018-08-02 2020-02-06 株式会社村田製作所 Antenna device
JP7145402B2 (en) * 2019-01-30 2022-10-03 株式会社村田製作所 Antenna modules and antenna equipment
CN110082767A (en) * 2019-04-01 2019-08-02 深圳市九洲卓能电气有限公司 Millimetre-wave radar component
JP7272146B2 (en) * 2019-07-05 2023-05-12 株式会社デンソー radar equipment

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3964873B2 (en) * 2001-11-09 2007-08-22 株式会社日立製作所 In-vehicle millimeter wave radar system
US7834808B2 (en) * 2005-06-29 2010-11-16 Georgia Tech Research Corporation Multilayer electronic component systems and methods of manufacture
KR100735411B1 (en) * 2005-12-07 2007-07-04 삼성전기주식회사 Method For Forming Printed Wiring Board and Printed Wiring Board Thus Obtained
JP2012029163A (en) * 2010-07-26 2012-02-09 Furukawa Electric Co Ltd:The Array antenna and manufacturing method for the same
JP6216268B2 (en) * 2014-03-10 2017-10-18 日本ピラー工業株式会社 Antenna device

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