JP2018061063A5 - - Google Patents

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JP2018061063A5
JP2018061063A5 JP2018000807A JP2018000807A JP2018061063A5 JP 2018061063 A5 JP2018061063 A5 JP 2018061063A5 JP 2018000807 A JP2018000807 A JP 2018000807A JP 2018000807 A JP2018000807 A JP 2018000807A JP 2018061063 A5 JP2018061063 A5 JP 2018061063A5
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Prior art keywords
substrate
hole
electrode
surface side
holes
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JP2018000807A
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Japanese (ja)
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JP2018061063A (en
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Priority to JP2018000807A priority Critical patent/JP2018061063A/en
Priority claimed from JP2018000807A external-priority patent/JP2018061063A/en
Publication of JP2018061063A publication Critical patent/JP2018061063A/en
Publication of JP2018061063A5 publication Critical patent/JP2018061063A5/ja
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Claims (13)

貫通電極基板であって、
第１面及び前記第１面の反対側に位置する第２面を含み、複数の孔が設けられた基板と、
前記基板の前記孔の内部に設けられた孔電極部と、
前記基板の前記第１面側に設けられた第１電極部と、
前記基板の前記第２面側に設けられた第２電極部と、を備え、
前記複数の孔は、前記孔電極部が前記基板の前記第１面側において前記第１電極部に電気的に接続され、且つ、前記孔電極部が前記基板の前記第２面側において前記第２電極部に電気的に接続されている複数の第１孔と、前記孔電極部が前記基板の前記第１面側において前記第１電極部から電気的に絶縁され、又は、前記孔電極部が前記基板の前記第２面側において前記第２電極部から電気的に絶縁されている複数の第２孔と、を含み、
前記基板は、前記第１孔と前記第２孔が設けられていない無孔領域を含む、貫通電極基板と、
前記無孔領域と重なるように設けられている受光素子と、
を含む、イメージセンサモジュール。 A through electrode substrate,
A substrate including a first surface and a second surface located on the opposite side of the first surface, the substrate having a plurality of holes;
A hole electrode provided in the hole of the substrate;
A first electrode portion provided on the first surface side of the substrate;
A second electrode portion provided on the second surface side of the substrate,
The plurality of holes are configured such that the hole electrode portion is electrically connected to the first electrode portion on the first surface side of the substrate, and the hole electrode portion is on the second surface side of the substrate. A plurality of first holes electrically connected to two electrode parts, and the hole electrode part is electrically insulated from the first electrode part on the first surface side of the substrate, or the hole electrode part There saw including a plurality of second holes being electrically insulated from the second electrode portion in the second surface side of the substrate,
The substrate includes a through electrode substrate including a non-porous region in which the first hole and the second hole are not provided;
A light receiving element provided to overlap the non-porous region;
Including an image sensor module. 貫通電極基板であって、
第１面及び前記第１面の反対側に位置する第２面を含み、複数の孔が設けられた基板と、
前記基板の前記孔の内部に設けられた孔電極部と、
前記基板の前記第１面側に設けられた第１電極部と、
前記基板の前記第２面側に設けられた第２電極部と、を備え、
前記複数の孔は、前記孔電極部が前記基板の前記第１面側において前記第１電極部に電気的に接続され、且つ、前記孔電極部が前記基板の前記第２面側において前記第２電極部に電気的に接続されている複数の第１孔と、前記孔電極部が前記基板の前記第１面側において前記第１電極部から電気的に絶縁され、又は、前記孔電極部が前記基板の前記第２面側において前記第２電極部から電気的に絶縁されている複数の第２孔と、を含み、
前記基板は、前記基板の第１面から第２面に貫通している開口部を含む、貫通電極基板と、
前記開口部と重なるように設けられている受光素子と、
を含む、イメージセンサモジュール。 A through electrode substrate,
A substrate including a first surface and a second surface located on the opposite side of the first surface, the substrate having a plurality of holes;
A hole electrode provided in the hole of the substrate;
A first electrode portion provided on the first surface side of the substrate;
A second electrode portion provided on the second surface side of the substrate,
The plurality of holes are configured such that the hole electrode portion is electrically connected to the first electrode portion on the first surface side of the substrate, and the hole electrode portion is on the second surface side of the substrate. A plurality of first holes electrically connected to two electrode parts, and the hole electrode part is electrically insulated from the first electrode part on the first surface side of the substrate, or the hole electrode part There saw including a plurality of second holes being electrically insulated from the second electrode portion in the second surface side of the substrate,
The substrate includes a through electrode substrate including an opening penetrating from the first surface to the second surface of the substrate;
A light receiving element provided to overlap the opening;
Including an image sensor module. 前記受光素子は、前記基板の前記第２面側に配置されている、請求項１又は２に記載のイメージセンサモジュール。The image sensor module according to claim 1, wherein the light receiving element is disposed on the second surface side of the substrate. 前記受光素子に光を導くレンズを含む、請求項１乃至３のいずれか一項に記載のイメージセンサモジュール。The image sensor module according to claim 1, further comprising a lens that guides light to the light receiving element. 前記レンズと、前記無孔領域と、前記受光素子とが重なるように設けられている、または前記レンズと、前記開口部と、前記受光素子とが重なるように設けられている、請求項４に記載のイメージセンサモジュール。The lens, the non-hole region, and the light receiving element are provided so as to overlap each other, or the lens, the opening, and the light receiving element are provided so as to overlap each other. The image sensor module described. 前記レンズは、前記第１孔と重ならないように設けられている、請求項４または５に記載のイメージセンサモジュール。The image sensor module according to claim 4, wherein the lens is provided so as not to overlap the first hole. 前記レンズは、前記第２孔と重なるように設けられている、請求項４または５に記載のイメージセンサモジュール。The image sensor module according to claim 4, wherein the lens is provided so as to overlap the second hole. 前記第２孔は、前記第１孔よりも前記無孔領域又は前記開口部に近い位置に設けられている、請求項１から７のいずれか一項に記載のイメージセンサモジュール。The image sensor module according to claim 1, wherein the second hole is provided at a position closer to the non-hole region or the opening than the first hole. 前記第２孔は、複数の前記第１孔が配置されている領域よりも外側の領域に配置されている、請求項１から７のいずれか一項に記載のイメージセンサモジュール。The image sensor module according to any one of claims 1 to 7, wherein the second hole is disposed in a region outside a region in which the plurality of first holes are disposed. 前記複数の第１孔は、前記無孔領域または前記開口部を囲むように設けられている、請求項１から９のいずれか一項に記載のイメージセンサモジュール。The image sensor module according to any one of claims 1 to 9, wherein the plurality of first holes are provided so as to surround the non-hole region or the opening. 前記複数の第２孔は、前記無孔領域または前記開口部を囲むように設けられている、請求項１から１０のいずれか一項に記載のイメージセンサモジュール。The image sensor module according to any one of claims 1 to 10, wherein the plurality of second holes are provided so as to surround the non-hole region or the opening. 貫通電極基板であって、
第１面及び前記第１面の反対側に位置する第２面を含み、複数の孔が設けられた基板と、
前記基板の前記孔の内部に設けられた孔電極部と、
前記基板の前記第１面側に設けられた第１電極部と、
前記基板の前記第２面側に設けられた第２電極部と、を備え、
前記複数の孔は、前記孔電極部が前記基板の前記第１面側において前記第１電極部に電気的に接続され、且つ、前記孔電極部が前記基板の前記第２面側において前記第２電極部に電気的に接続されている複数の第１孔と、前記孔電極部が前記基板の前記第１面側において前記第１電極部から電気的に絶縁され、又は、前記孔電極部が前記基板の前記第２面側において前記第２電極部から電気的に絶縁されている複数の第２孔と、を含み、
前記基板は、前記第１孔と前記第２孔が設けられていない無孔領域を含む、貫通電極基板と、
前記無孔領域と重なるように設けられている受光素子と、を含む、光デバイス。 A through electrode substrate,
A substrate including a first surface and a second surface located on the opposite side of the first surface, the substrate having a plurality of holes;
A hole electrode provided in the hole of the substrate;
A first electrode portion provided on the first surface side of the substrate;
A second electrode portion provided on the second surface side of the substrate,
The plurality of holes are configured such that the hole electrode portion is electrically connected to the first electrode portion on the first surface side of the substrate, and the hole electrode portion is on the second surface side of the substrate. A plurality of first holes electrically connected to two electrode parts, and the hole electrode part is electrically insulated from the first electrode part on the first surface side of the substrate, or the hole electrode part There saw including a plurality of second holes being electrically insulated from the second electrode portion in the second surface side of the substrate,
The substrate includes a through electrode substrate including a non-porous region in which the first hole and the second hole are not provided;
A light receiving element provided to overlap the non-porous region. 貫通電極基板であって、
第１面及び前記第１面の反対側に位置する第２面を含み、複数の孔が設けられた基板と、
前記基板の前記孔の内部に設けられた孔電極部と、
前記基板の前記第１面側に設けられた第１電極部と、
前記基板の前記第２面側に設けられた第２電極部と、を備え、
前記複数の孔は、前記孔電極部が前記基板の前記第１面側において前記第１電極部に電気的に接続され、且つ、前記孔電極部が前記基板の前記第２面側において前記第２電極部に電気的に接続されている複数の第１孔と、前記孔電極部が前記基板の前記第１面側において前記第１電極部から電気的に絶縁され、又は、前記孔電極部が前記基板の前記第２面側において前記第２電極部から電気的に絶縁されている複数の第２孔と、を含み、
前記基板は、前記基板の第１面から第２面に貫通している開口部を含む、貫通電極基板と、
前記開口部と重なるように設けられている受光素子と、
を含む、光デバイス。 A through electrode substrate,
A substrate including a first surface and a second surface located on the opposite side of the first surface, the substrate having a plurality of holes;
A hole electrode provided in the hole of the substrate;
A first electrode portion provided on the first surface side of the substrate;
A second electrode portion provided on the second surface side of the substrate,
The plurality of holes are configured such that the hole electrode portion is electrically connected to the first electrode portion on the first surface side of the substrate, and the hole electrode portion is on the second surface side of the substrate. A plurality of first holes electrically connected to two electrode parts, and the hole electrode part is electrically insulated from the first electrode part on the first surface side of the substrate, or the hole electrode part There saw including a plurality of second holes being electrically insulated from the second electrode portion in the second surface side of the substrate,
The substrate includes a through electrode substrate including an opening penetrating from the first surface to the second surface of the substrate;
A light receiving element provided to overlap the opening;
Including optical devices.
JP2018000807A 2018-01-05 2018-01-05 Through electrode substrate and method for manufacturing the same Pending JP2018061063A (en)

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JP2016021288A Division JP2017139433A (en) 2016-02-05 2016-02-05 Through electrode substrate and method for manufacturing the same

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JP2018061063A5 true JP2018061063A5 (en) 2019-02-28

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JP2005191243A (en) * 2003-12-25 2005-07-14 Ngk Spark Plug Co Ltd Build-up multilayer wiring board
JP5619372B2 (en) * 2009-04-16 2014-11-05 大日本印刷株式会社 Image sensor module
JP2013122962A (en) * 2011-12-09 2013-06-20 Ngk Spark Plug Co Ltd Wiring board
WO2014156353A1 (en) * 2013-03-27 2014-10-02 株式会社村田製作所 Camera module
JP6013960B2 (en) * 2013-03-28 2016-10-25 京セラ株式会社 Wiring board
JP6361179B2 (en) * 2014-03-10 2018-07-25 大日本印刷株式会社 Wiring board and wiring board manufacturing method
JP5811220B2 (en) * 2014-03-28 2015-11-11 株式会社ニコン Imaging module
JP2015211147A (en) * 2014-04-28 2015-11-24 京セラサーキットソリューションズ株式会社 Wiring board

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