JP2018059747A - Laser machining apparatus, and laser machining method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laser machining apparatus that can achieve satisfactory machining performance by irradiating a machining object immediately in front of the machining tool with a small-diameter laser beam even if the shape and surrounding environment of the machining object cannot be accurately known.SOLUTION: A laser machining apparatus is equipped with a laser oscillator or oscillators that oscillate laser beams, a machining tool 8 for machining objects to be machined and an optical fiber or fibers 1 for guiding laser beams from the laser oscillator or oscillators. It is further equipped with an optical fiber feed-out/lead-in mechanism 9 that can set as desired the distance from the laser beam 5 emitting end face of the optical fiber or fibers 1 to immediately before the machining point with the machining tool 8 by arranging at least one optical fiber 1 when a machining object 6 is to be removed from the machining tool 8 in a state of being kept at high temperature by irradiating the object 6 with the laser beam 5 without the presence of any lens in-between.SELECTED DRAWING: Figure 2(A)

Description

  The present invention relates to a laser processing apparatus and a laser processing method. For example, details of the shape and dimensions of a workpiece such as the inside of a reactor melted in a core are exhausted from underwater (fresh water, air, seawater and structures to be removed). Such as water mixed with solvent, water mixed with organic matter such as boron, etc.) and gas (gas discharged from the structure to be removed and new gas reacted with the discharged material) The present invention relates to a laser processing apparatus and a laser processing method suitable for use in a place where processing must be performed in a state where it cannot be grasped due to the atmosphere.

  Conventionally, a laser beam guided by an optical fiber is irradiated onto a workpiece to be processed into a predetermined shape.

  The conventional method of irradiating the processing point of the workpiece with the laser light guided by the optical fiber through at least one lens is roughly divided into the following two methods. .

  First, the light emitted from a single-mode optical fiber (hereinafter referred to as SMF) (spread at about 12 degrees in all angles because of NA 0.1) is converted into parallel light by a first lens called a collimating lens. After that, the laser beam is condensed by a second lens called a focusing lens and irradiated onto the workpiece. Since this method uses SMF, the diameter of the focused beam can be reduced to near the core diameter of SMF (usually around 10 μm).

  Usually, in order to reduce the influence of aberration, the focal length f1 of the first lens and the focal length f2 of the second lens are the same, and the working distance from the exit surface of the second lens to the irradiation point ( (WD) is approximately equal to the back focus of the second lens. At this time, it is preferable that the WD is as long as possible so that scattered objects from the workpiece do not adhere to the second lens during processing. Therefore, a focal length f2 of 100 mm or more is used.

  The second method is a method of irradiating the workpiece with light emitted from the SMF with a single lens. In this method, the fiber end face is placed at a position away from the focal length f, and the NA does not change. Therefore, a single lens system having only two interfaces between glass and air, which increases the beam diameter of the lens, is a two-lens system ( In order to obtain a condensing diameter equivalent to that of four interfaces between glass and air, the ability to bend per interface must be high. That is, a lens having a small curvature and a short focal length must be selected.

Therefore, the distance between the irradiation head and the workpiece is shortened, sludge that rebounds from the processing point adheres to the lens, and the lens is broken by heating it, and the problem that considers the exhaust heat of the lens is newly increased. . Therefore, it is not used for high output applications.
A multimode optical fiber (hereinafter referred to as MMF) having a core diameter of about 100 μm to 400 μm can be used instead of SMF having a core diameter of about 10 μm in a single lens system and a two lens system. Although there is a merit that a large output can be obtained by using the MMF, it is theoretically impossible to set the same condensing diameter as the SMF because of the multimode.

If the using 4kW output of 500W output and MMF500μm of SMF10myuemu, when compared with the power density, the former 6,400kW / mm ^2, the latter is 20 kW / mm ^2. SMF looks better at first glance, but the absolute amount of energy is higher with MMF, which is overwhelmingly suitable for cutting and welding thick plates.

  On the other hand, SMF can be said to be a process suitable for a fine region because light is condensed and narrowed down. For this reason, SMF is used for marking on fine parts and seam welding.

  In the first place, when the light output is less than 1 kW, it is difficult to destroy the composition of ceramics such as zirconia. For this reason, there is a case where high energy is transmitted by SMF.

  Guided to a core diameter of 10 μm with an output of 1 kW or more approaches the fracture threshold of quartz. Furthermore, at the interface where dust or the like easily adheres, the probability of being destroyed by its own optical power increases. Therefore, in reality, this choice is not possible.

  The two lens system has the following problems. That is, the light emitted from the SMF spreads at an aperture angle NA = 0.1. The relationship between the diameter d of the parallel light immediately after exiting the first lens, the aperture angle NA of the SMF, and the focal length f is expressed by d = 2 * NA * f. Therefore, if f = 100 mm and NA = 0.1, d = 20 mm.

  Since NA is expressed by 95% of the optical power, it is empirically appropriate that the lens diameter D is 1.5 times the calculated value d (30 mm) in order to obtain nearly 100%.

  Furthermore, the diameter D ′ of the casing that houses the lens must naturally be larger than the lens diameter D (about 40 mm). In addition, the total length of the case for housing the lens and the structure for fixing the SMF is at least 200 mm (the SMF fixing length is 80 mm + the distance between the lens 1 and the lens 2 is 20 mm + the distance between the SMF and the lens 1 is 100 mm). Is needed. Therefore, it can be easily imagined that if the emission head intended to be used even in a situation where the details of the shape and dimensions of the workpiece cannot be grasped is brought close to the tip of the tool, it interferes with the workpiece.

  In addition, the MMF output laser combines at least two SMF output lasers with a fusion optical coupler. Increasing the number of multiplexed waves tends to increase the core diameter even if optimized. Regardless of the one-lens system or the two-lens system, if the core diameter is increased, it is difficult to focus on the workpiece, and the WD cannot be increased.

  Patent Document 1 can be cited as a prior art document for processing by irradiating a workpiece with laser light.

  In this Patent Document 1, a laser beam is irradiated to a processed surface after processing a workpiece made of a brittle material, and the cracks generated on the processed surface are eliminated by dissolving the additive at the crystal grain boundary and filling the crack. In order to prevent the strength of the brittle workpiece from being reduced, a laser beam having a heat capacity to melt the additive contained in the workpiece is irradiated to the machining portion of the workpiece machined by the tool. Has been.

JP-A-5-208406

  However, according to the irradiation method using the conventional lens described above, in an environment where high radiation is emitted, for example, inside a nuclear reactor, the antireflection film applied to both surfaces of the lens deteriorates due to the influence of radiation and absorbs light. Start to do. If the anti-reflective film is not applied, in the case of the two-lens system, there are four interfaces between glass and air, and each of them has about 4% of Fresnel loss. Diffused inside the irradiation head. At the same time, in an environment where the humidity is close to 100%, floating impurities adhere to the surface of the lens, which also causes light absorption.

  As a result, the absorbed and diffused light is converted into heat, and the temperature rapidly increases, and the lens may melt. In addition, if the light is not sufficiently irradiated, it becomes impossible to obtain the required processing performance, so it is desirable to solve such a problem as soon as possible.

  The present invention has been made in view of the above points. The object of the present invention is to provide light having a small diameter immediately before a tool even if the shape and surrounding environment of the workpiece cannot be accurately grasped. It is an object to provide a laser processing apparatus and a laser processing method capable of irradiating a laser beam.

  In order to achieve the above object, a laser processing apparatus of the present invention includes a laser oscillator that oscillates laser light, a processing tool for processing a workpiece, and an optical fiber that guides laser light from the laser oscillator. A laser processing apparatus comprising: a laser beam guided to the optical fiber; and the workpiece is irradiated with the laser beam without passing through a lens; At the time of removal by the processing tool, at least one optical fiber is disposed immediately before the processing point by the processing tool, and the portion immediately before the processing point from the emission end face of the laser light from the optical fiber. An optical fiber feeding / retracting mechanism capable of arbitrarily setting the distance to is provided.

  The laser processing method of the present invention includes a laser oscillator that oscillates laser light to achieve the above object, a processing tool for processing a workpiece, and an optical fiber that guides laser light from the laser oscillator. The laser beam is guided to the optical fiber, and the workpiece is heated to a high temperature by irradiating the workpiece with the laser beam without using a lens. At the time of removing with the processing tool, at least one optical fiber is disposed immediately before the processing point by the processing tool, and immediately before the processing point from the emission end face of the laser light from the optical fiber. The optical fiber is sent out by an optical fiber feed-in / out mechanism that can arbitrarily set the distance to the part, or the laser beam is drawn out to process the workpiece. And wherein the door.

  ADVANTAGE OF THE INVENTION According to this invention, even if the shape and surrounding environment of a workpiece cannot be grasped | ascertained correctly, the light with a small diameter can be irradiated to the workpiece just before a tool.

It is a side view which shows a general laser processing apparatus. FIG. 2 is a front view of FIG. It is a side view which shows Example 1 of the laser processing apparatus of this invention. FIG. 3 is a front view of FIG. It is a figure which shows the distance relationship between an optical fiber and a workpiece. It is a figure which shows the example of arrangement | positioning of MMF used for Example 1 of the laser processing apparatus of this invention. It is a figure which shows the other example of the example of arrangement | positioning of MMF used for Example 1 of the laser processing apparatus of this invention. It is a figure which shows the front-end | tip shape of the optical fiber 1 used for Example 1 of the laser processing apparatus of this invention. It is a figure which shows the process of the front-end | tip of the optical fiber used for Example 1 of the laser processing apparatus of this invention, and shows the state which the front-end | tip of the optical fiber chipped in the irregular shape. It is a figure which shows the state which sent out the optical fiber from the state of FIG. 7 (A), pressed the front-end | tip to a workpiece, and protruded the end surface of the front-end | tip of an optical fiber. It is a figure which shows the state which pulled back the optical fiber from the state of FIG. 7 (A), and ensured the predetermined distance. It is a figure which shows the state which is irradiating a laser beam with the diffusion angle close | similar to the end surface of a normal optical fiber. The optical fiber used in the first embodiment of the laser processing apparatus according to the present invention is an example of a concept of removing a chipped portion in front of the workpiece rather than pressing it against a workpiece. It is a figure which shows the state which pulls back an optical fiber and pushes with a diamond cleaver blade and damages an optical fiber. It is a figure which shows the structure which provides a drawing-out roller instead of the sending-out roller shown to FIG. 8 (A), and draws out or returns an optical fiber. It is a figure which shows the structure which attaches both the sending roller and the drawing roller, and feeds an optical fiber. It is a side view which shows the structure provided with the cooling device of the diamond grindstone used for Example 1 of the laser processing apparatus of this invention. FIG. 10A is a front view of FIG. It is a side view which shows an example in the case of constructing the laser processing apparatus of this invention in water. It is a front view of FIG. It is an example of the refreshing method of the optical fiber when the front-end | tip of the optical fiber used for Example 1 of the laser processing apparatus of this invention is missing, and is a side view at the time of the non-pressing of an optical fiber pressing mechanism. It is a front view of FIG. It is an example of the refreshing method of the optical fiber when the front-end | tip of the optical fiber used for Example 1 of the laser processing apparatus of this invention has chipped, and is a side view at the time of pressing of an optical fiber pressing mechanism. It is another example of the refreshing method of the optical fiber when the front-end | tip of the optical fiber used for Example 1 of the laser processing apparatus of this invention is missing, and is a side view at the time of non-pressing of an optical fiber pressing mechanism. . It is a front view of FIG. It is another example of the refreshing method of the optical fiber when the front-end | tip of the optical fiber used for Example 1 of the laser processing apparatus of this invention is missing, and is a side view at the time of pressing of an optical fiber pressing mechanism. It is a side view which shows the example which replaced with the diamond grindstone used for Example 1 of the laser processing apparatus of this invention, and used the wire peening apparatus. FIG. 14 is a front view of FIG. It is a side view which shows the example which replaced with the diamond grindstone used for Example 1 of the laser processing apparatus of this invention, and used the cutting tool. FIG. 15 is a front view of FIG.

  The laser processing apparatus and laser processing method of the present invention will be described below based on the illustrated embodiments. In the drawings, the same reference numerals are used for the same components. In the embodiments described below, an arbitrary direction in the horizontal plane is the X direction, a direction orthogonal to the X direction in the horizontal plane is the Y direction, and a direction (vertical direction) orthogonal to the X direction and the Y direction is the Z direction. Define.

  1A and 1B show a laser processing apparatus using a general fiber laser.

  As shown in the figure, the laser processing apparatus using a fiber laser is not shown in the figure with two lenses of a first lens 3 and a second lens 4 within the laser head 2 of the laser guided by the optical fiber 1 or not shown. Is a method of heating the workpiece (for example, fuel debris) 6 by condensing the laser beam 5 by a single lens and scraping the heated portion 7 with a diamond grindstone 8 as a processing tool. In addition, 8a is an axis | shaft which rotates the diamond grindstone 8. FIG.

  FIG. 2A and FIG. 2B show Example 1 of the laser processing apparatus of the present invention.

  The laser processing apparatus of this embodiment shown in the figure includes a laser oscillator (not shown) that oscillates laser light and a diamond that is a processing tool for processing a workpiece (for example, fuel debris) that is a workpiece. A grindstone 8, an optical fiber 1 that guides laser light 5 from a laser oscillator, and an optical fiber feed-in / out mechanism 9 that can arbitrarily set the distance from the emission end face of the laser light 5 from the optical fiber 1 to the portion immediately before the processing point. It is roughly composed of

  That is, the laser processing apparatus of this embodiment is provided with the laser head 2 at the tip of the optical fiber 1 like the laser processing apparatus using the general fiber laser shown in FIGS. 1 (A) and 1 (B). (Without providing the first lens 3 and the second lens 4), an optical fiber feeding / drawing mechanism for feeding and drawing the optical fiber 1 (grinding with a diamond grindstone 8 from the emitting end face of the laser beam 5 from the optical fiber 1) An optical fiber feed-in / out mechanism (which can arbitrarily set the distance to the point immediately before the point) 9 and a fiber guide 10 are provided, and the optical fiber is fed out by the optical fiber feed-in / out mechanism 9 or the drawn laser beam 5 is emitted to make the workpiece 6 Is to process. Other structures are the same as those in FIGS. 1A and 1B.

  The optical fiber delivery / retraction mechanism 9 in the present embodiment performs delivery or withdrawal as a pair of rollers provided inside the device rotate with the optical fiber interposed therebetween, as shown in FIG.

  The optical fiber 1 in this embodiment has a visible light wavelength of 400 nm to 700 nm with a light output of 0.1 mW or more for the purpose of guiding the irradiation point, and a wavelength of 800 nm of light output for laser oscillation of 100 W or more for the purpose of processing. A laser beam of 3,000 nm is incident.

  By adopting such a configuration of the present embodiment, the laser beam 5 having a small diameter is applied to the workpiece 6 immediately before the diamond grindstone (tool) 8 even if the shape and surrounding environment of the workpiece 6 cannot be accurately grasped. Of course, it is possible to avoid the interference with the surroundings during construction. Further, since the first and second lenses 3 and 4 as in the laser processing apparatus shown in FIGS. 1 (A) and 1 (B) are not used, the tip of the optical fiber 1 is missing as described later, or Refreshing when dirty becomes possible without replacement of parts.

  If there is a space on the side of the optical fiber delivery / retraction mechanism 9 of the diamond grindstone 8, a plurality of optical fibers 1 and optical fiber delivery / retraction mechanisms 9 may be attached to irradiate the workpiece 6 with a plurality of laser beams 5. In addition, by setting the outputs of the plurality of laser beams 5 to arbitrary values, they may have the roles of preheating, main heating, and postheating, respectively.

  FIG. 3 shows the relationship between the optical fiber 1 and the workpiece 6. When the width of the laser beam 5 irradiated to the workpiece 6 with the laser beam 5 is d and the distance between the optical fiber 1 and the workpiece 6 is l, the following relationship is established.

d = 2 × l × NA
4 and 5 show typical arrangement examples of the MMF used in the laser processing apparatus of this embodiment.

  In the example shown in FIG. 4, two optical fibers 1a and 1b are set on both sides of the diamond grindstone 8, and the optical fibers 1a and 1b are protected by protective pipes 11a and 11b, respectively. 9b are installed.

  In the example shown in FIG. 5, the lower end of the protective pipe 11 and the upper end of the optical fiber delivery / retraction mechanism 9 are connected. Inside the optical fiber delivery / retraction mechanism 9, a pair of delivery rollers for delivering the optical fibers 1 a and 1 b. 13a and 13b, a diamond cleaver blade 14 for scratching the optical fibers 1a and 1b, and a pushing plate 15 for pushing the optical fibers 1a and 1 are incorporated. Further, at the upper end and the lower end of the optical fiber delivery / retraction mechanism 9, through-holes through which the optical fibers 1a, 1b pass (delivery, withdrawal) are provided.

  FIG. 6 shows the tip shape of the optical fiber 1 used in the laser processing apparatus of the present embodiment.

  As shown in the figure, the periphery of the optical fiber 1 is coated (UV coating 12) as in the pattern 1 to protect itself. When the UV coating 12 is not required when processing the end face of the optical fiber 1 described later, the UV coating 12 may be removed by a remover provided in the optical fiber feeding / withdrawing mechanism 9, or in an initial state. An uncoated optical fiber 1 may be used (shown in pattern 2).

  FIGS. 7A, 7B, 7C, and 7D show the processing of the tip of the optical fiber 1 used in the laser processing apparatus of the present embodiment.

  As shown in FIG. 7A, when the tip of the optical fiber 1 lacks an irregular shape for some reason, the laser beam 5 diffuses. Since the output decreases as the laser beam 5 diffuses, as shown in FIG. 7B, the optical fiber 1 is sent out, the tip is pressed against the workpiece 6, and the end face of the tip of the optical fiber 1 is brought out. To do. Thereafter, as shown in FIG. 7C, the optical fiber 1 is pulled back to secure a predetermined distance, so that the laser is diffused at a diffusion angle close to the end face of the normal optical fiber 1 as shown in FIG. The light 5 is irradiated and the workpiece 6 can be constructed.

  8 (A), 8 (B), and 8 (C) are portions where the optical fiber 1 is not pressed against the workpiece 6 by the optical fiber feeding / retracting mechanism 9 of the present embodiment, but is missing in front of it. It is an example of the concept which removes.

  In FIG. 8A, the optical fiber 1 is pulled back to a predetermined position as indicated by an arrow (A) by a pair of feed rollers 13a and 13b, and pushed by a diamond cleaver blade 14 as indicated by an arrow (B). Scratch 1 After that, the diamond cleaver blade 14 is retracted as shown by an arrow (c), and the push-in plate 15 is pushed in the direction of the arrow (d) and then pushed into the guide pipe 16 as shown by the arrow (e). In this structure, a force in the bending direction is applied to 1 to remove the chipped portion of the optical fiber 1.

  FIG. 8B shows a structure in which the drawing rollers 17a and 17b are provided instead of the sending rollers 13a and 13b shown in FIG.

  FIG. 8C shows a structure for ensuring the feeding of the optical fiber 1 by attaching both the feeding rollers 13a and 13b and the drawing rollers 17a and 17b.

  FIG. 9A and FIG. 9B show a cooling device for the diamond grindstone 8 used in the laser processing apparatus of this embodiment.

  As shown in the figure, in this embodiment, an optical fiber feeding / drawing mechanism 9 is provided on one side with the diamond grinding stone 8 interposed therebetween, and a grinding wheel cooling mechanism 18 having a cooling water jet nozzle 18a is provided on the opposite side. Therefore, the diamond grindstone 8 is cooled by jetting cooling water from the cooling water jet nozzle 18a of the grindstone cooling mechanism 18.

  That is, since the workpiece 6 is heated by the laser beam 5 and the cooling water is applied to the workpiece 6, the construction efficiency is lowered. Therefore, the workpiece 6 is injected by injecting the cooling water to the diamond grindstone 8. It is constructed so that it will not be exposed to cooling water. Further, if there is a space on the side of the optical fiber feeding / withdrawing mechanism 9 of the diamond grindstone 8, the grindstone cooling mechanism 18 can be attached to the same side as the optical fiber 1.

  10 (A) and 10 (B) show an example in which the laser processing apparatus of the present invention is applied in water.

  As shown in the figure, in this embodiment, a cover 20 for creating an atmosphere of underwater 19 is provided around the diamond grindstone 8.

  The underwater 19 atmosphere creation cover 20 has a box shape, a rare gas supply line 23 is connected to the upper portion, and telescopic poles 21 are provided at the lower four corners. Since the state on the workpiece 6 side is unknown, in FIGS. 10A and 10B, telescopic poles 21 are attached to the lower four corners of the cover 20 so as to follow the surface of the workpiece 6. Further, in order to create an air atmosphere, a gas 22 such as nitrogen or argon is supplied into the cover 20 from a rare gas supply line 23 and discharged to the copying surface of the workpiece 6.

  11 (A), FIG. 11 (B), FIG. 11 (C), FIG. 12 (A), FIG. 12 (B), and FIG. 12 (C) are shown in FIG. 7 (A), FIG. 7 (B), and FIG. As shown in FIGS. 7C and 7D, another example of the refreshing method of the optical fiber 1 when the tip of the optical fiber 1 is missing is shown.

  7 (A), 7 (B), 7 (C) and 7 (D), the optical fiber 1 is pressed against the workpiece 6 to refresh the tip, but FIG. 11 (A) 11B, FIG. 11C, FIG. 12A, FIG. 12B, and FIG. 12C show a refreshing method by applying the optical fiber 1 to the diamond grindstone 8.

  For this purpose, in this embodiment, the optical fiber feeding / withdrawing mechanism 9 and the optical fiber pressing that pushes the optical fiber 1 against the diamond grindstone 8 by rotating or pushing the optical fiber feeding / withdrawing mechanism 9 as an axis. An arm 24 is provided.

  11 (A), 11 (B), and 11 (C), the optical fiber pressing arm 24 is moved from the non-pressed state in the side direction in FIGS. 11 (A) and 11 (B). The fiber feeding / withdrawing mechanism 9 is rotated as an axis, and the end of the circumference of the diamond grindstone 8 is pressed against the curved surface of the diamond grindstone 8 from the side as shown in FIG. It is refreshed by bringing it into contact with the material and cutting it to reveal a new surface.

  12 (A), 12 (B), and 12 (C), the optical fiber pressing arm 24 is moved from the state when not pressed in the side direction in FIGS. 12 (A) and 12 (B). The fiber feeding / withdrawing mechanism 9 is rotated as an axis, and is pressed against the flat portion of the diamond grindstone 8 from the lateral direction so as to contact the side surface of the diamond grindstone 8 as shown in FIG. It is refreshed by cutting and bringing out a new surface.

  13 (A) and 13 (B) use the wire peening device 25 as a processing tool in place of the diamond grindstone 8 when the fiber laser described in FIGS. 2 (A) and 2 (B) is used. It shows the case where there was.

  It is also possible to use the wire peening apparatus 25 to discharge the melt after the workpiece 6 is heated and melted by the fiber laser.

  14A and 14B show a shaper (shaper) as a processing tool in place of the diamond grindstone 8 when the fiber laser described in FIGS. 2A and 2B is used. The case where the cutting tool 26 used for is used is shown.

  It is also possible to use the cutting tool 26 to discharge the melt after the workpiece is heated and melted by the fiber laser.

  As described above, the power density of the end face of the optical fiber 1 is very high, and water vapor and suspended matter approaching the end face are evaporated before reaching the end face of the optical fiber 1. The end face is not destroyed, and the light energy necessary for machining can be efficiently applied to the workpiece surface before the tool.

  Therefore, even if the shape of the work piece and the surrounding environment cannot be accurately grasped, the work piece immediately before the tool can be irradiated with light having a small diameter.

  In addition, this invention is not limited to an above-described Example, Various modifications are included. For example, the above-described embodiments have been described in detail for easy understanding of the present invention, and are not necessarily limited to those having all the configurations described. Further, a part of the configuration of one embodiment can be replaced with the configuration of another embodiment, and the configuration of another embodiment can be added to the configuration of one embodiment. Further, it is possible to add, delete, and replace other configurations for a part of the configuration of each embodiment.

  DESCRIPTION OF SYMBOLS 1, 1a, 1b ... Optical fiber, 2 ... Laser head, 3 ... 1st lens, 4 ... 2nd lens, 5 ... Laser beam, 6 ... Workpiece, 7 ... Heated part, 8 ... Diamond grindstone, 8a ... Diamond grindstone , 9, 9 a, 9 b... Optical fiber feeding and retracting mechanism, 10... Fiber guide, 11, 11 a, 11 b. Push plate, 16 ... guide pipe, 17a, 17b ... drawing roller, 18 ... grinding stone cooling mechanism, 18a ... cooling water injection nozzle, 19 ... underwater, 20 ... cover, 21 ... extensible pole, 22 ... gas, 23 ... Noble gas supply line, 24 ... optical fiber pressing arm, 25 ... wire peening device, 26 ... cutting tool, 27 ... cutting tool shaft.

Claims (15)

A laser processing apparatus comprising: a laser oscillator that oscillates laser light; a processing tool for processing a workpiece; and an optical fiber that guides laser light from the laser oscillator,
When the laser beam is guided to the optical fiber and is removed by the processing tool in a state where the workpiece is heated to a high temperature by irradiating the workpiece with the laser beam without passing through a lens, An optical fiber in which at least one of the optical fibers is disposed immediately before a processing point by a processing tool, and the distance from the laser light emission end surface to the immediately preceding portion of the processing point can be arbitrarily set. A laser processing apparatus comprising a delivery / retraction mechanism. In the laser processing apparatus of Claim 1,
The optical fiber feeding / drawing mechanism includes a pair of feeding and / or drawing rollers for feeding and / or drawing the optical fiber, a blade for scratching the optical fiber, and a pushing plate for pushing the optical fiber. A laser processing apparatus. In the laser processing apparatus according to claim 1 or 2,
The processing tool is a grindstone, two optical fibers are set on both sides of the grindstone, each of the optical fibers is protected by a protection pipe, and each of the optical fiber feeding and retracting mechanisms is installed. A featured laser processing apparatus. In the laser processing apparatus of Claim 1,
The processing tool is a grindstone, and a lower end of a protective pipe that protects the optical fiber is connected to an upper end of the optical fiber feeding / withdrawing mechanism, and a pair of the optical fiber is fed into the optical fiber feeding / withdrawing mechanism. A feeding roller, a blade for scratching the optical fiber, and a pushing plate for pushing the optical fiber, and the optical fiber passes through the upper end and the lower end of the optical fiber feeding / retracting mechanism. A laser processing apparatus having a through hole. The laser processing apparatus according to any one of claims 1 to 4,
The laser processing apparatus, wherein the optical fiber is UV coated around the optical fiber. The laser processing apparatus according to any one of claims 1 to 5,
The machining tool is a grindstone, the optical fiber feeding / drawing mechanism is provided on one side across the grindstone, and a grindstone cooling mechanism having a cooling water jet nozzle is provided on the opposite side. apparatus. In the laser processing apparatus according to claim 1 or 2,
The processing tool is installed in water with a grindstone, and a cover for creating an underwater atmosphere is installed around the grindstone, the cover forms a box shape, and a rare gas supply line is connected to the upper part, Laser processing apparatus characterized in that telescopic poles are provided at the lower four corners. In the laser processing apparatus according to claim 1 or 2,
The processing tool is a grindstone, and includes an optical fiber pressing arm that presses the optical fiber against the grindstone. In the laser processing apparatus according to claim 1 or 2,
The laser processing apparatus, wherein the processing tool is a wire peening apparatus. In the laser processing apparatus according to claim 1 or 2,
The laser processing apparatus, wherein the processing tool is a cutting tool. Using a laser processing apparatus including a laser oscillator that oscillates laser light, a processing tool for processing a workpiece, and an optical fiber that guides laser light from the laser oscillator, laser light is applied to the optical fiber. When the workpiece is removed by the processing tool in a state where the workpiece is heated to a high temperature by irradiating the workpiece with the laser beam without passing through a lens,
Light in which at least one of the optical fibers is disposed immediately before the processing point by the processing tool, and the distance from the laser light emission end face from the optical fiber to the immediately preceding portion of the processing point can be arbitrarily set A laser processing method, wherein the optical fiber is sent out by a fiber feeding / drawing mechanism or the laser beam is drawn out to process the workpiece. The laser processing method according to claim 11, wherein
When the tip of the optical fiber is chipped, the optical fiber is sent out by the optical fiber feed-in / out mechanism, the tip of the optical fiber is pressed against the workpiece, and the end face of the tip of the optical fiber is brought out, A laser processing method, wherein the optical fiber is pulled back by the optical fiber feeding / drawing mechanism to secure a predetermined distance, and the workpiece is processed by irradiating the laser light from the optical fiber. The laser processing method according to claim 11, wherein
The processing tool is a grindstone, and a lower end of a protective pipe that protects the optical fiber is connected to an upper end of the optical fiber feeding / withdrawing mechanism, and a pair of the optical fiber is fed into the optical fiber feeding / withdrawing mechanism. A feeding roller, a blade for scratching the optical fiber, and a pushing plate for pushing the optical fiber are incorporated,
The optical fiber is pulled back to a predetermined position by the pair of feeding rollers, and is pressed by the blade to damage the optical fiber, and then the blade is retracted, the pushing plate is pushed in, and then pushed into the feeding guide pipe. In this way, a bending force is applied to the optical fiber to remove the chipped portion of the optical fiber tip. The laser processing method according to claim 11, wherein
The processing tool is a grindstone, the optical fiber feeding and drawing mechanism is provided on one side across the grindstone, and a grindstone cooling mechanism having a cooling water spray nozzle is provided on the opposite side,
A laser processing method, wherein the grindstone is cooled by jetting cooling water from a cooling water jet nozzle of the cooling mechanism for the grindstone. The laser processing method according to claim 11, wherein
The processing tool is installed in water with a grindstone, and a cover for creating an underwater atmosphere is installed around the grindstone, the cover forms a box shape, and a rare gas supply line is connected to the upper part, Telescopic poles are provided at the bottom four corners,
The poles attached to the lower four corners of the cover move so as to follow the surface of the workpiece, and gas is supplied from the rare gas supply line into the cover. A laser processing method characterized by discharging to a copying surface.

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