JP2018054979A - Virtual image display device and method for manufacturing image element unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a virtual image display device capable of maintaining the performance of an image element to form an excellent image while including a self-luminous image element and reducing the weight and size of the entire apparatus; an image element unit; and a method for manufacturing the image element unit.SOLUTION: Increase in the internal temperature of an image display device 80 is suppressed by including a thermally conductive member 88h for contacting a case part 88 of a display unit DU to the image display device 80 to conduct the heat of a light emitting part 80k, performance degradation and life-shortening accompanying the increase in the internal temperature are avoided even when the self-luminous image display device 80 includes, especially, an organic EL (OLED) element, and an excellent image can be formed.SELECTED DRAWING: Figure 13

Description

  The present invention relates to a virtual image display device that presents an image formed by an image display element or the like to an observer and a method for manufacturing a video element unit.

  2. Description of the Related Art As a virtual image display device such as a head mounted display (hereinafter also referred to as an HMD) that is mounted on an observer's head, a device that applies a liquid crystal display panel to an image display element (video element) is known (for example, a patent). Literature 1 etc.). When image formation is performed with a liquid crystal display panel, a light source such as a backlight is separately required, and a space for securing the light source is required. Under such circumstances, in order to realize miniaturization, a structure in which a liquid crystal display panel is sandwiched between two cases (see Patent Document 1) is known.

  On the other hand, in order to meet the demand for further miniaturization, it is conceivable to apply a self-luminous image element that does not require a separate light source.

  However, for example, a self-luminous image element such as an organic EL (OLED) panel has a structure in which a light emitting source is provided inside the panel substrate and a driver IC for driving and a power supply element are incorporated. Tends to rise. In particular, in the case of organic EL, it can be considered that the performance deterioration and the shortening of the life due to the increase of the internal temperature become remarkable as the characteristics.

JP 2014-1910113 A

  The present invention relates to a virtual image display device and a video element unit that have a self-luminous video element and can reduce the size and weight of the entire apparatus while maintaining the performance of the video element and forming a good image. It aims to provide a method.

  A first virtual image display device according to the present invention includes a video device including a light emitting unit that generates video light, and a case unit that houses the video device, and the case unit is a side of the video device that emits video light. A heat dissipation structure that radiates heat by opening the opposite side is provided.

  In the virtual image display device, the image element is a self-luminous element including a light emitting unit that generates image light, and does not require a separate light source. The overall weight and size can be reduced. Furthermore, the case part has a heat dissipation structure part that releases a part of the image element to dissipate heat, thereby suppressing an increase in the internal temperature of the image element and accompanying an increase in the internal temperature even if the image element is a self-luminous type It is possible to avoid the deterioration of performance and the life shortening and to form a good image.

  In a specific aspect of the present invention, the case portion has a one-member configuration that forms an opening that opens a part of the image element in the heat dissipation structure portion. In this case, by providing a one-member configuration in which the opening is provided to ensure heat dissipation of the video device, the configuration of the video device and its surroundings can be made simple and compact while maintaining necessary functions.

  In another aspect of the present invention, the video element forms an organic EL element constituting a light emitting part on a silicon substrate, and in the case part, the heat dissipation structure part radiates heat by opening the back surface of the silicon substrate. In this case, efficient heat dissipation is possible from the back surface of the silicon substrate. When opening the back surface of the silicon substrate, for example, when the entire back surface is exposed, a part of the back surface is exposed and the other part is in contact with another member (for example, a case) A part of the portion may be in contact with the back surface to support and fix the silicon substrate).

  In still another aspect of the present invention, the video device is positioned in contact with the case portion at an end surface other than the back surface of the silicon substrate. In this case, by using the dicing accuracy in forming the end surface of the silicon substrate, positioning with high accuracy becomes possible, and in the assembly of the image element to other members, the adjustment range can be suppressed, and the overall size of the apparatus can be reduced. Can be achieved.

  In still another aspect of the present invention, the case portion has a video element positioning portion that contacts a location other than the location where the video device is opened to determine a storage position of the video device. In this case, highly accurate positioning can be performed while ensuring heat dissipation of the image element.

  In still another aspect of the present invention, the image element positioning portion has a planar shape or a protrusion shape. In this case, for example, in the manufacturing process, the position of the image element can be aligned by abutting the image element positioning portion having a planar shape or a protrusion shape.

  In still another aspect of the present invention, the image display device further includes a heat radiating portion that radiates heat from an exposed portion opened by the heat radiating structure portion of the video device. In this case, the heat radiation part can further promote the heat radiation of the exposed portion.

  In still another aspect of the present invention, the heat radiating portion is a heat conductive tape attached to the exposed portion. In this case, it is possible to dissipate heat from the back surface of the silicon substrate to any location where the heat conductive tape is attached.

  In still another aspect of the present invention, the case portion is made of metal. In this case, heat dissipation at the case portion can be enhanced.

  In still another aspect of the present invention, the case portion includes a mask portion that covers a part of the image element emitting surface of the image element, and an attachment portion that performs attachment alignment with other optical components. . In this case, the case portion has a mask function for blocking unnecessary light and an alignment function at the time of attachment to other optical components.

  In still another aspect of the present invention, it has an adhesive portion that is formed of a high thermal conductive silicone adhesive or a thermal conductive epoxy adhesive and fixes the video device and the case portion. In this case, it is possible to improve heat dissipation at the bonding portion that connects the image element and the case portion.

  In yet another aspect of the present invention, a light guide member that guides image light from the image element by total reflection on a plurality of surfaces, and a projection optical system that causes the image light from the image element to enter the light guide member are further provided. Prepare. In this case, the image light from the image element can be guided to the eyes of the observer by the light guide member and the projection optical system.

  A first video device unit according to the present invention includes a video device including a light emitting unit that generates video light, and a case unit that houses the video device, and the case unit is a side of the video device that emits video light. A heat dissipating structure portion that releases heat by opening the opposite side, and a video element positioning portion that contacts a location other than the location where the video device is opened to determine a storage position of the video device.

  In the above-described image element unit, the image element is a self-luminous element including a light emitting unit that generates image light, and does not require a separate light source. The element unit can be reduced in weight and size, and the case part has a heat radiation structure part that releases heat by releasing a part of the image element, thereby suppressing an increase in the internal temperature of the image element. Even if it is a self-luminous type, it is possible to avoid performance deterioration and shortening of the life due to an increase in internal temperature and to form a good image.

  A first image element unit manufacturing method according to the present invention includes an image element including a light emitting unit that generates image light, and a case unit that houses the image element, and the case unit receives image light from the image element. Manufacture of an image element unit having a heat dissipating structure part for releasing heat by opening the opposite side of the emitting side, and an image element positioning part for contacting the part other than the part for opening the image element to determine the storage position of the image element The method is to apply an adhesive for fixing the image element in the image element positioning part of the case part, and align the image element and the case part while leaving the image element open in the heat dissipation structure part. And fix with an adhesive.

  In the manufacturing method of the image element unit described above, in the manufacture of a self-luminous image element unit capable of forming a good image while avoiding performance deterioration and shortening of the life due to an increase in internal temperature while achieving reduction in weight and size. Simple and reliable assembly can be performed while ensuring high heat dissipation in the heat dissipation structure.

  A second virtual image display device according to the present invention includes a video element including a light emitting unit that generates video light, and a case unit that houses the video element, and the case unit is in contact with the video element and heats the light emitting unit. It has a heat conductive member to conduct.

  In the virtual image display device, the image element is a self-luminous element including a light emitting unit that generates image light, and does not require a separate light source. The overall weight and size can be reduced. Furthermore, the case part has a heat conductive member that conducts heat of the light emitting part in contact with the image element, thereby suppressing an increase in the internal temperature of the image element, and an increase in the internal temperature even if the image element is a self-luminous type Therefore, it is possible to avoid the performance deterioration and the life shortening accompanying this, and to form a good image.

  In a specific aspect of the present invention, in the case portion, the heat conductive member is made of a metal, a resin containing filler, a graphene member, or a heat pipe. In this case, since a heat conductive member can be comprised with a thing with high heat conductivity, the heat dissipation effect can be improved.

  In another aspect of the present invention, the case portion is made of aluminum, titanium, copper, stainless steel, a graphene member, or a heat pipe. In this case, the case part is made of a metal having high thermal conductivity, so that the heat dissipation effect in the entire case part can be enhanced.

  In still another aspect of the present invention, in the case portion, the heat conductive member is in contact with the opposite side of the image element to the image light emitting side. In this case, typically, the entire surface opposite to the light emitting surface for emitting the image light can be radiated (cooled) by the heat conductive member.

  In still another aspect of the present invention, the video device includes an organic EL device that forms a light emitting unit on a silicon substrate, and the case unit determines a storage position of the video device by contacting the silicon substrate. It has a positioning part. In this case, highly accurate positioning can be performed while ensuring heat dissipation of the image element.

  In still another aspect of the present invention, the image display device further includes a mask portion that is provided on the image light emitting side of the image device and covers the periphery of the light emission region of the image device, and the case portion is configured to contact the mask portion. A mask positioning part for determining the position of the mask part is provided. In this case, the mask portion that blocks unnecessary light can be attached with high accuracy.

  In still another aspect of the present invention, in the case portion, the heat conductive member is provided at a connection portion with another optical member. In this case, heat can be released to the other optical member side through the connecting portion.

  In still another aspect of the present invention, the heat conductive member is provided at a connection portion with a lens barrel portion that houses a projection optical system that projects light emitted from the image element. In this case, heat can be released to the lens barrel.

  In still another aspect of the present invention, the case portion has a fin structure portion as a heat conductive member. In this case, heat can be efficiently radiated in the fin structure.

  In still another aspect of the present invention, the video device has an FPC portion connected and extending from a main body portion including a light emitting portion, and the FPC portion includes a heat conductive material that conducts heat of the light emitting portion. In this case, an increase in the internal temperature of the video device is suppressed in the FPC section, and even when the video device is a self-luminous type, performance deterioration and shortening of the life due to the increase in the internal temperature are avoided, and favorable image formation is possible.

  In still another aspect of the present invention, a pair of left and right light guide members for guiding image light from a pair of left and right image elements, a metal frame portion supporting the pair of light guide members, and a frame And a cable portion that is provided in contact with each other and that transmits a signal to a pair of left and right video elements. In this case, heat can be radiated by conducting heat from the image element to the frame portion via the cable portion.

  In still another aspect of the present invention, the apparatus further includes an outside air flow path forming portion that forms a flow path for allowing outside air to pass through the case portion and the image element. In this case, heat radiation can also be promoted by passing outside air.

  A second video device unit according to the present invention includes a video device including a light emitting unit that generates video light, and a case unit that houses the video device, and the case unit is in contact with the video device and heats the light emitting unit. It has a heat conductive member to conduct.

  In the image element unit, the image element is a self-luminous element including a light emitting unit that generates image light and does not require a separate light source. The overall weight and size can be reduced. Furthermore, the case part has a heat conductive member that conducts heat of the light emitting part in contact with the image element, thereby suppressing an increase in the internal temperature of the image element. Even if the image element is a self-luminous type, the internal temperature rises Therefore, it is possible to avoid the performance deterioration and the life shortening accompanying this, and to form a good image.

  A second method for manufacturing a video element unit according to the present invention includes a video element including a light emitting unit that generates video light, and a case unit that houses the video element, and the case unit is in contact with the video element and the light emitting unit. A method of manufacturing an image element unit having a heat conductive member that conducts heat of the image, wherein an adhesive for fixing the image element is applied at a contact portion of the heat conductive member with the image element, and the image element and the case The parts are aligned and fixed with an adhesive.

  In the manufacturing method of the image element unit described above, in the manufacture of a self-luminous image element unit capable of forming a good image while avoiding performance deterioration and shortening of the life due to an increase in internal temperature while achieving reduction in weight and size. Simple and reliable assembly can be performed while ensuring high heat dissipation in the heat conductive member constituting the case portion.

It is a perspective view explaining the external appearance of an example of the virtual image display apparatus which concerns on 1st Embodiment. It is a figure which illustrates notionally the optical path of image light. It is a figure explaining holding | maintenance of the optical system (projection lens) by a lens-barrel part. It is a perspective view which shows the mode of the assembly | attachment to the projection lens of a display apparatus unit. It is a perspective view which shows the mode of the structure of the display part of a virtual image display apparatus. (A) is a perspective view which shows the external appearance of a display apparatus unit, (B) is a perspective view which shows the state which looked at the display apparatus unit of (A) from another angle. (A) is a front view of a display device unit, (B) is a side view, and (C) is a rear view. (A) is a sectional side view of a display device unit, (B) is a sectional side view of a case part. (A) And (B) is a figure for demonstrating the positioning reference | standard in the assembly | attachment of a display apparatus unit. (A)-(E) are the figures for demonstrating an example of the manufacturing process of a display apparatus unit. (A) is a conceptual diagram for explaining a modified example of the positioning structure inside the display device unit, and (B) is another modified example of the positioning structure inside the display device unit. It is a conceptual diagram for demonstrating. (A) is a conceptual diagram for demonstrating the other modification of a display apparatus unit, (B) is an arrow cross section of (A). (A) is one perspective view of the display device unit incorporated in the virtual image display device according to the second embodiment, (B) is another perspective view, and (C) is a side sectional view. . (A) is a perspective view of the image display apparatus incorporated in a display apparatus unit, (B) is a side view. (A)-(E) are the figures for demonstrating an example of the manufacturing process of a display apparatus unit, and the assembly | attachment process of a display apparatus unit and a lens-barrel part. It is a perspective view which shows an example of the display apparatus unit integrated in the virtual image display apparatus which concerns on 3rd Embodiment. (A) is a perspective view which shows the mode of the assembly | attachment to the lens-barrel part of the display apparatus unit integrated in the virtual image display apparatus which concerns on 4th Embodiment, (B) is a front view, (C) FIG. (A) is a perspective view which shows the display apparatus unit of one modification, (B) is a rear view. It is a conceptual diagram for demonstrating another modification about a virtual image display apparatus. It is a figure for demonstrating another modification of a virtual image display apparatus. (A) is a conceptual top view for demonstrating another modification about a virtual image display apparatus, (B) is a side view. It is a conceptual top view for demonstrating another modification about a virtual image display apparatus.

[First Embodiment]
Hereinafter, an embodiment of a virtual image display device incorporating a display device unit, which is a video element unit according to the first embodiment of the present invention, will be described in detail with reference to FIG. 1 and the like.

  As shown in FIG. 1, the virtual image display device 100 of the present embodiment is a head-mounted display (HMD) having an appearance like glasses, and a virtual image is displayed to an observer or a user wearing the virtual image display device 100. The image light (video light) can be visually recognized, and the observer can visually recognize or observe the outside world image with see-through. The virtual image display device 100 includes a first display device 100A, a second display device 100B, and a frame unit 102.

  The first display device 100A and the second display device 100B are portions for forming right-eye and left-eye virtual images, respectively, and first and second optical members 101a and 101b that cover the front of the observer so as to be seen through. , And first and second image forming main body portions 105a and 105b, respectively. As will be described later, the first and second image forming main body portions 105a and 105b are configured by an optical system for image formation such as a display device (video element) and a projection lens, and members for housing these optical systems, respectively. Has been. The display device (video element), the projection lens, and the like are supported and accommodated by being covered with a cover-shaped exterior member 105d. The first and second optical members 101a and 101b guide the image light formed by the first and second image forming main body portions 105a and 105b and visually recognize the external light and the image light in an overlapping manner. And constitutes a light guide device. Hereinafter, the first optical member 101 a or the second optical member 101 b is also referred to as the light guide device 20. Note that the first display device 100 </ b> A and the second display device 100 </ b> B function alone as a virtual image display device.

  The frame portion 102 is an elongated member that is bent in a U shape in plan view, and is a metal integral part. Here, as an example, the frame portion 102 is made of a magnesium alloy, that is, the frame portion 102 is made of a magnesium frame that is a metal integral part as a main body portion 102p. Further, as shown in the figure, the frame portion 102 is connected to both the first optical member 101a and the second optical member 101b (the light guide device 20 which is a pair of light guide portions) and is provided at the center of the thick structure. And a support 102b that extends from the central portion 102a along the first and second optical members 101a and 101b and forms a U-shaped bent portion.

  The central portion 102a fixes the relative positions of the first and second optical members 101a and 101b by sandwiching the distal ends thereof. In addition, the support body 102b forms first and second peripheral portions 102c and 102d that are bent in a U-shape, and the first and second optical members are formed in the first and second peripheral portions 102c and 102d. By being connected (assembled) to 101a and 101b, the mutual fixation is further strengthened.

  A temple 104, which is a vine portion extending rearward from the left and right ends of the frame portion 102, is provided so as to be in contact with and supported by an observer's ear or temple. Further, the first and second image forming main body portions 105 a and 105 b may be added to the portion of the temple 104 from the frame portion 102.

  Hereinafter, an example of the structure for guiding the image light by the virtual image display device 100 will be conceptually described with reference to FIG. 2 and the like. As described above, the devices for guiding the image light are the first display device 100A and the second display device 100B (see FIG. 1 and the like), but the first display device 100A and the second display device are used. Since the device 100B is symmetrical and has an equivalent structure, only the first display device 100A will be described, and the description of the second display device 100B will be omitted. As shown in FIG. 2, the first display device 100 </ b> A includes an image display device 80 that forms video light, a projection lens 30 for image formation that is housed in a lens barrel, and the image display device 80 and the projection lens 30. And a light guide device 20 (first optical member 101a) for guiding the passed video light. The light guide device 20 includes a light guide member 10 for guiding light and see-through, and a light transmitting member 50 for see-through.

  The image display device 80 can be a video element (video display element) composed of a self-luminous element such as an organic EL. Further, for example, in addition to a video display element (video element) which is a transmissive spatial light modulator, an illumination device (not shown) which is a backlight for emitting illumination light to the video display element and a drive control unit ( (Not shown). In the present embodiment, the image display device 80 which is a video element is configured to be housed in a case portion and unitized (modularized), so that the projection lens 30 is aligned. In addition, an image display device (video element) 80 housed in a case portion and unitized (modularized) is referred to as a display device unit (or video element unit).

  The projection lens 30 is a projection optical system including a plurality of (for example, three) optical elements (lenses) arranged along the incident-side optical axis AX as components, and these optical elements are as shown in FIG. Further, it is housed and supported by the lens barrel portion 39. The optical element is constituted by an aspheric lens including, for example, a non-axisymmetric aspheric surface (non-axisymmetric aspheric surface) and an axially symmetric aspheric surface (axisymmetric aspheric surface). The intermediate image corresponding to the display image can be formed inside the light guide member 10 in cooperation with a part of the light guide member 10 constituting the structure 20. The projection lens 30 projects and enters the image light formed by the image display device 80 toward the light guide device 20.

  As described above, the light guide device 20 includes the light guide member 10 for light guide and see-through and the light transmitting member 50 for see-through. The light guide member 10 is a part of the prism type light guide device 20 and is an integral member. However, as shown in FIG. 2, the light guide side first light guide portion 11 and the light incident side second light guide member 10 are provided. The light guide portion 12 can be divided and understood. The light transmission member 50 is a member (auxiliary optical block) that assists the see-through function of the light guide member 10, and is fixed integrally with the light guide member 10 to form one light guide device 20. The light guide device 20 is positioned and fixed with respect to the projection lens 30 with high accuracy, for example, by being screwed to the lens barrel portion 39 (see FIG. 3 and the like). As shown in FIG. 3, a component that is unitized by attaching the projection lens 30 and the light guide device 20 to the barrel portion 39 is referred to as an optical display unit LU.

  Returning to FIG. 2, the light guide member 10 has first to fifth surfaces S11 to S15 as side surfaces having an optical function. Among these, the first surface S11 and the fourth surface S14 are continuously adjacent, and the third surface S13 and the fifth surface S15 are continuously adjacent. Further, the second surface S12 is disposed between the first surface S11 and the third surface S13. A half mirror layer is attached to the surface of the second surface S12. This half mirror layer is a light-transmitting reflective film (that is, a semi-transmissive reflective film), which is formed by forming a metal reflective film or a dielectric multilayer film, and the reflectivity for video light is appropriately set. .

  Hereinafter, the optical path of the image light (here, image light GL) will be schematically described with reference to FIG. The light guide member 10 allows the image light GL to enter from the projection lens 30 and guides the image light GL toward the eyes of the observer by reflection on the first to fifth surfaces S11 to S15. Specifically, the video light GL from the projection lens 30 first enters the fourth surface S14 and is reflected by the fifth surface S15, and then enters the fourth surface S14 again from the inside and is totally reflected. The light is incident on the surface S13 and totally reflected, and is incident on the first surface S11 and totally reflected. The video light GL totally reflected by the first surface S11 is incident on the second surface S12, and partially reflected while partially transmitting through the half mirror layer provided on the second surface S12. Again enters and passes. The video light GL that has passed through the first surface S11 is incident on the observer's eye or an equivalent position thereof as a substantially parallel light beam. That is, the observer observes an image with video light as a virtual image.

  As described above, the light transmission member 50 is integrally fixed to the light guide member 10 to form one light guide device 20, and is a member (auxiliary optical block) that assists the see-through function of the light guide member 10. . The light transmission member 50 includes a first transmission surface S51, a second transmission surface S52, and a third transmission surface S53 as side surfaces having an optical function. The second transmission surface S52 is disposed between the first transmission surface S51 and the third transmission surface S53. The first transmission surface S51 is on a surface obtained by extending the first surface S11 of the light guide member 10, and the second transmission surface S52 is a curved surface joined and integrated with the second surface S12. The three transmission surfaces S53 are on a surface obtained by extending the third surface S13 of the light guide member 10.

  As described above, the light guide device 20 allows the observer to visually recognize the image light by the light guide member 10, and allows the observer to observe an external image with less distortion by the cooperation of the light guide member 10 and the light transmission member 50. It has become a thing. That is, among the external light as component light constituting the external image to be visually recognized, the light incident on the + X side from the second surface S12 of the light guide member 10 is the third surface S13 of the first light guide portion 11. Although passing through the first surface S11, at this time, the third surface S13 and the first surface S11 are substantially parallel to each other (diopter is substantially 0), so that almost no aberration or the like occurs. Further, among the external light, those incident on the −X side with respect to the second surface S12 of the light guide member 10, that is, those incident on the light transmitting member 50 are the third transmitting surface S53 provided on the first surface S53 and the first light transmitting member 50. When passing through the transmission surface S51, the third transmission surface S53 and the first transmission surface S51 are substantially parallel to each other, so that no aberration or the like occurs. Further, among the external light, the light incident on the light transmission member 50 corresponding to the second surface S12 of the light guide member 10 passes through the third transmission surface S53 and the first surface S11. S53 and the first surface S11 are substantially parallel to each other, so that almost no aberration or the like occurs. As described above, the observer observes the external image without distortion through the light transmission member 50.

  The above configuration is the same in the second display device 100B (see FIG. 1 and the like). Thereby, it is possible to form images respectively corresponding to the left and right eyes.

  Hereinafter, with reference to FIG. 4 and the like, the display device unit DU which is a video device unit including the image display device (video device) 80 will be described. FIG. 4 is a perspective view showing how the display unit DU is assembled to the projection lens 30 (lens barrel portion 39). Note that, in the first display device 100A and the second display device 100B, the display device unit DU is bilaterally symmetric and has an equivalent structure. Therefore, in FIGS. 4 and 5, only the left side is shown and described, and the right side is shown. Will not be described.

  As shown in FIG. 4, the display device unit DU is configured by housing an image display device (video element) 80 in a case portion 88 and forming a unit (modularized). In other words, the image display device 80 is housed in the case-like case portion 88 by fitting and is held so as not to move. In particular, in this embodiment, as shown in the figure, the case portion 88 is exposed by opening the opposite side of the image display device 80 from which video light is emitted by providing the heat dissipation structure portion 88a. In this state, the image display device 80 is supported and fixed. Further, in the present embodiment, as shown in FIG. 5, for example, a heat radiating portion DP configured by directly attaching a heat conductive tape is provided on a portion of the back side portion of the image display device 80 exposed from the case portion 88. Thus, heat dissipation of the image display device 80 is promoted. In the illustrated example, the heat radiating portion DP formed of a heat conductive tape is attached so as to extend from the image display device 80 to the lens barrel portion 39 and further to the frame portion 102 which is a support frame.

  Here, when the so-called self-luminous image display device (video element) 80 as described above is applied to the HMD to form a high-luminance image, the panel substrate has a light-emitting source and further driven. For example, a built-in driver IC or power supply element. For this reason, a rise in internal temperature tends to be a problem. In particular, when an organic EL (OLED) panel is applied to the panel portion of the image display device (video element) 80 as in the present embodiment, there is a possibility that performance deterioration and shortening of the life due to increase in internal temperature may be significant as its characteristics. is there.

  In the present embodiment, in order to cope with the above problem, a part of the silicon substrate SS constituting the image display device 80 in the structure of the display device unit (video element unit) DU, particularly in the heat dissipation structure portion 88a of the case portion 88. By making the exposed state, it is possible to efficiently dissipate heat by the heat dissipating part DP (see FIG. 5) composed of a heat conductive tape or the like, and further, using the end face of the silicon substrate SS of the image display device 80 The case portion 88 and the image display device 80 have a structure for improving the assembly position accuracy.

  Hereinafter, with reference to FIG. 6 and the like, details of the structure of the display device unit (video element unit) DU, the case unit 88 constituting the display device unit DU, and the image display device 80 will be described.

  First, referring to FIGS. 6 (A), 6 (B), 7 (A) to 7 (C), FIGS. 8 (A) and 8 (B), the image display device 80 constituting the display device unit DU and The structure of the image display device 80 in the case unit 88 will be described. As illustrated, the image display device 80 includes a rectangular plate-shaped main body portion 80a housed in a case portion 88, and an FPC (Flexible Printed Circuits) portion 80f that is connected and extends from the main body portion 80a. Among these, as shown in FIG. 8 (A), the main body portion 80a includes a silicon substrate SS on which various circuits and the like are arranged and forms the outer shape of the main body portion 80a, and an organic EL element including an organic EL material. The light emitting unit 80k generates color light to be image light, and the sealing protective glass GG that seals the light emitting unit 80k in cooperation with the silicon substrate SS. The image display device 80 emits video light toward the protective glass GG side, that is, the + z side, by performing a light emission operation in accordance with the drive signal received from the FPC unit 80f. Further, the image display device 80 is housed in the case portion 88 as shown in the drawing and as described above, with a part of the main body portion 80a exposed. More specifically, the image display device 80 is supported and fixed in a state where the entire back surface SSr of the silicon substrate SS disposed on the side opposite to the side from which the image light is emitted is exposed.

  Here, in the present embodiment, with respect to the configuration of the image display device 80, a silicon (Si) substrate is employed as a self-luminous element substrate on which an organic EL (OLED) is mounted. Thereby, first, high heat conductivity can be given with respect to the heat dissipation mentioned above, and highly efficient heat dissipation is possible. Furthermore, it is possible to form a circuit having a fine structure, that is, a finer structure (for example, several microns) in the creation of a circuit board for constituting a light emitting element. Furthermore, since the silicon substrate forms the outer shape of the image display device 80, each end face of the silicon substrate is formed by utilizing the high precision in silicon dicing (for example, within a manufacturing error of several tens of microns). By cutting out with high accuracy and using it for positioning when the image display device 80 is housed in the case portion 88, the positional accuracy with respect to the case portion 88 (for example, far more than the surface of the protective glass GG, etc.) is high. It can be of precision. Further, as will be described later, the case unit 88 includes a display device unit (video element unit) DU including the image display device 80 as another optical member (in this embodiment, the lens barrel unit 39 that houses the projection lens 30). However, by maintaining the above high accuracy inside the unit, as a result, the positional accuracy of the image display device 80 relative to the projection lens 30 can be kept high.

  Next, the structure of the case unit 88 among the image display device 80 and the case unit 88 constituting the display unit DU will be described. As shown in the figure (see, for example, FIG. 8B), the case portion 88 has a frame structure having a through hole in the central portion, and forms a heat dissipation structure that opens an opening OP that opens a part of the image display device 80. 88a, a display device positioning portion (image element positioning portion) 88b for positioning and fixing the image display device 80, and an image light emitting side opposite to the heat radiation structure portion 88a and the display device positioning portion 88b. A mask portion 88m that removes unnecessary light from the component light emitted from the display device 80, and a protrusion member (fitting portion) 88u that is an attachment portion for performing attachment alignment to the lens barrel portion 39 (see FIG. 4 and the like). , 88v. The case portion 88 is a metal member having a high thermal conductivity such as aluminum or magnesium, and is a one-member structure formed by, for example, die casting, that is, a structure composed of one member.

  For example, as shown in FIG. 7C and FIG. 8B, in the case portion 88, the heat dissipation structure portion 88a is on the back side (the side opposite to the side from which the image light is emitted), that is, on the −z side in the drawing. It is formed as a U-shaped (U-shaped) groove portion opened on the + y side, and the main body portion 80a of the image display device 80 is inserted from the + y side. Further, as described above, the case portion 88 has a frame structure having a through hole in the center portion, and the heat dissipation structure portion 88a forms an opening OP together with a U-shaped groove portion. It has become a thing. That is, as shown in each drawing other than FIG. 8B, the entire back surface SSr of the silicon substrate SS is exposed through the opening OP. From the standpoint of the case part 88, the case part 88 has a heat dissipation structure part 88a that opens the back surface SSr through the opening OP to dissipate heat, thereby making the back surface SSr of the silicon substrate SS an exposed part by the heat dissipation structure part 88a. Yes.

  Further, in the case portion 88, a display device positioning portion (video element positioning portion) 88b that positions by contacting the image display device 80 is a plane portion that serves as a reference for positioning in the z direction, as shown. The first reference surface SF1, a second reference surface SF2 that is a plane portion serving as a positioning reference in the x direction, and a third reference surface SF3 that is a plane portion serving as a positioning reference in the y direction. . For example, as shown in FIGS. 9A and 9B, these reference surfaces SF1 to SF3 are end surfaces SS1 to SS3 other than the back surface SSr among the end surfaces of the rectangular silicon substrate SS. Is positioned with high accuracy.

  As described above, the case portion 88 constitutes the display device unit DU in which the image display device 80 is accommodated and supported and fixed, and the image display device 80 is accommodated and unitized (modulated). It is a member that forms an alignment portion for assembling the image display device 80, that is, the display device unit DU to the lens barrel portion 39.

  Further, the case portion 88 is formed with a pair of projecting members 88u and 88v extending in parallel to the optical axis AX on the + z side (the side from which the image light is emitted). These projection members 88u and 88v are loosely fitted to the rear end portion so as to sandwich the rear end portion of the lens barrel portion 39 of the projection lens (projection optical system) 30 from above and below, as shown in FIGS. 4 and 5, for example. It is a fitting part that is used to fix the case part 88 to the lens barrel part 39. That is, in FIG. 4 and the like, the adhesive is filled between the inner surfaces of the protruding members (fitting portions) 88u and 88v and the side surface of the lens barrel portion 39, and the case portion 88 is aligned with the lens barrel portion 39. The adhesive is cured later, and the case portion 88 is fixed to the lens barrel portion 39. At this time, in addition to up / down, left / right, front / rear, alignment with respect to the rotation shaft of three rotations is possible. In addition, as the previous stage of the alignment, the light guide member 10 of the light guide device 20 is fixed by fitting the root side into the lens barrel portion 39. In this state, the case portion 88 that houses the image display device 80 as described above performs alignment with the lens barrel portion 39 assembled with the light guide member 10 or the like, so that final image alignment is performed. Is possible. In particular, as in the present embodiment, in the case of a pair of left and right configurations, adjustment in units of pixels is necessary so that the image for the right eye side and the image for the left eye side are visually recognized in a state of being exactly overlapped. Alignment is very important. On the other hand, in the present embodiment, since the image display device 80 is incorporated in the case portion 88 with high accuracy, the adjustment margin can be minimized and the device can be adjusted in position. Can be avoided as much as possible.

  Hereinafter, with reference to FIGS. 10A to 10E, an example of a manufacturing process of the display device unit DU, which is also a process of manufacturing the virtual image display device 100, will be described.

  First, as shown in FIG. 10A, in the case portion 88 having a frame structure, on the surface including the first reference surface SF1 serving as a positioning reference in the z direction or in the vicinity of the first reference surface SF1. The adhesive 88s is applied to the marginal surface NS that is a surface (adhesive application step). Here, for example, a place where a drive circuit or the like is disposed can be used as a part of the marginal surface NS for bonding. The first reference surface SF1 may be configured such that the end surface of the image display device 80 (silicon substrate SS) directly contacts the first reference surface SF1 without using the adhesive 88s. Further, as the adhesive 88s, it is conceivable to use, for example, a high heat conductive silicone-based adhesive or a heat conductive epoxy adhesive. By using an adhesive having high thermal conductivity, heat dissipation can be improved even on the image light emission side.

  Next, as shown in FIG. 10B, the image display device 80 is dropped onto the surface of the first reference surface SF1, and the adhesive 88s is spread and positioned on the first reference surface SF1, that is, the first reference surface SF1. The end surface SS1 of the image display device 80 (silicon substrate SS) is brought into contact with the reference surface SF1, and positioning in the z direction (corresponding to FIG. 9A) is performed (first positioning step). At this time, in the x direction, there is essentially no margin (for example, a margin within a few tens of microns, which is an error in silicon dicing), and the positioning with respect to the second reference plane SF2, that is, the second reference. The end surface SS2 of the image display device 80 (silicon substrate SS) abuts on the surface SF2, and positioning in the x direction is also performed (second positioning step).

  Next, as shown in FIG. 10C, by pushing the image display device 80 in the −y direction (the direction of the arrow Y1) with the rod-shaped jig JG, the image display device 80 (silicone) on the third reference plane SF3. The end surface SS3 of the substrate SS) is brought into contact with (abuts), and positioning in the y direction (corresponding to FIG. 9B) is performed (third positioning step). Through the first to third positioning steps described above, the first to third reference surfaces SF1 to SF3 are fixed by the adhesive 88s while the image display device 80 normal surface SSr is opened, and thereby the image display device 80. It functions as a display device positioning part (video element positioning part) 88b that determines the storage position in the case part 88. 10B to 10C, when the adjustment is performed by the jig JG, that is, the slide movement, a rectangular display area EA (that is, an organic EL element or the like formed by a broken line in the figure is formed and the image light is emitted. ) Is prevented from adhering to the adhesive 88s.

  After the first to third positioning steps, as shown in FIG. 10 (D), the positional relationship between the image display device 80 and the case portion 88 is not moved by the hook jig FG that can be sandwiched in the x direction. Fix and harden the adhesive 88s. Finally, after the adhesive 88s is cured, the hook jig FG is removed, so that the display unit DU that is unitized by accommodating the image display device 80 in the case portion 88 as shown in FIG. Produced. The cured adhesive 88s serves as an adhesive part BP for fixing the image display device 80 and the case part 88 to each other.

  As described above, in the virtual image display device 100 including the display device unit DU according to the present embodiment, the image display device 80 that is a video device is a self-luminous element including the light emitting unit 80k that generates video light. Since the light source is not required, it is possible to reduce the weight and size of the virtual image display device 100, and to reduce the weight and size of the entire virtual image display device 100. Further, the case unit 88 of the display device unit DU includes a heat dissipation structure 88a that releases a part of the image display device 80 to dissipate heat, thereby suppressing an increase in the internal temperature of the image display device 80. Even if it is a self-luminous type and particularly includes an organic EL (OLED) element, it is possible to avoid performance deterioration and shortening of life due to an increase in internal temperature and to form a good image. Further, in manufacturing the display unit DU, simple and reliable assembly can be performed while ensuring high heat dissipation. At this time, high-precision alignment can be performed by utilizing the characteristics of the silicon substrate SS.

  Hereinafter, a virtual image display device according to a modification of the present embodiment will be described with reference to FIG. In the above embodiment, the first to third reference surfaces SF1 to SF3 constituting the display device positioning portion (video element positioning portion) 88b are all flat, but for example, a part may be a protrusion shape. Good. For example, in the example shown in FIG. 11A, the third reference protrusions TP3 and TP3 are provided at the corresponding place instead of the plane serving as a positioning reference in the y direction. In the example shown in the figure, the third reference plane SF3 is set at two positions on both ends of the plane corresponding to the plane. In this case, an error in positioning in the y direction caused by pressing in the direction of the arrow Y1 with a jig or the like can be made zero or close to zero by the third reference protrusions TP3 and TP3.

  Furthermore, for example, as shown in FIG. 11B, positioning in the x direction may be a protrusion shape. That is, in place of the plane serving as a positioning reference in the x direction, the second reference protrusions TP2 and TP2 are provided at the locations. In the example shown in the figure, the second reference surface SF2 is set by providing it at two locations on both ends of a surface corresponding to a flat surface (one surface). In this case, an error in positioning in the x direction and the y direction caused by pushing the direction including the components in the direction of the arrow X1 and the direction of the arrow Y1 or both of them with a jig or the like is expressed as the second reference protrusions TP2, TP2, and The third reference protrusions TP3 and TP3 can be made zero or close to zero.

  Although the present invention has been described based on the first embodiment, the present embodiment is not limited to the above, and can be implemented in various modes without departing from the scope of the present invention.

  For example, in the above example, the entire back surface SSr of the silicon substrate SS is exposed by the opening OP. However, the exposure of the back surface is not necessarily limited to the entire back surface SSr as long as heat dissipation or the like is sufficient. Need not be exposed, and a part thereof may be covered with another member. For example, as conceptually shown in FIG. 12 (B) corresponding to the cross section taken along the line AA in FIGS. 12 (A) and 12 (A), the case portion 88 contacts a part of the back surface SSr of the silicon substrate SS. It is also possible to provide a structure in which a pair of contact portions CP is provided and the silicon substrate SS is supported and fixed by the contact portions CP.

[Second Embodiment]
The virtual image display device according to the second embodiment will be described below with reference to FIG. Note that the virtual image display device according to the second embodiment is a partial modification of the virtual image display device of the first embodiment, and the other configurations are the same except for the structure of the display device unit DU. In particular, regarding the overall configuration, for example, FIGS. 1 to 3 in the first embodiment are used. This embodiment is different from the first embodiment in that the structure covers the back surface SSr of the silicon substrate SS. Accordingly, description of the overall configuration and the like will be omitted, and the display device unit DU, which is a video device unit including the image display device (video device) 80 and the image display device 80, will be described below with reference to FIG. 13A is one perspective view (a perspective view including the front side) of the display unit DU, and FIG. 13B is another perspective view (a perspective view including the back side). 13 (C) is a side sectional view. 14A is a perspective view of an image display device (video element) 80 incorporated in the display device unit DU, and FIG. 14B is a side view of the image display device 80. In the first display device 100A and the second display device 100B, the display device unit DU is bilaterally symmetrical and has an equivalent structure.

  As shown in FIGS. 13A to 13C, the display unit DU is configured as a unit (module) by storing an image display device (video element) 80 in a case portion (case member) 88. It is composed. In other words, the image display device 80 is housed in the case-like case portion 88 by fitting and is held so as not to move. In particular, in the present embodiment, as shown in the figure, the case portion 88 thermally conducts the plate-like portion 88p provided in contact with the opposite side (back side) of the image display device 80 from which video light is emitted. By having the member 88h, the image display device 80 is supported and fixed, and heat dissipation is promoted. In addition, the heat radiating part (the figure shown in 1st Embodiment) comprised by affixing the heat conductive tape comprised, for example by a graphite sheet etc., directly on the back side part of the heat conductive member 88h (plate-shaped part 88p). 4 and a heat radiating portion DP in FIG. 21 and the like described later) may be further provided to promote heat dissipation of the image display device 80.

  Here, when the so-called self-luminous image display device (video element) 80 as described above is applied to the HMD to form a high-luminance image, the panel substrate has a light-emitting source and further driven. For example, a built-in driver IC or power supply element. For this reason, a rise in internal temperature tends to be a problem. In particular, when an organic EL (OLED) panel is applied to the panel portion of the image display device (video element) 80 as in the present embodiment, there is a possibility that performance deterioration and shortening of the life due to increase in internal temperature may be significant as its characteristics. is there.

  In the present embodiment, in order to cope with the above problem, in the structure of the display device unit (video element unit) DU, in particular, the state in which the heat conductive member 88h of the case portion 88 is in surface contact with the image display device 80. By doing so, efficient heat dissipation is possible. Further, it has a structure for improving the assembling position accuracy between the case portion 88 and the image display device 80 by using the end face of the silicon substrate SS of the image display device 80.

  Hereinafter, with reference to FIG. 13 and the like, details of the structure of the display device unit (video element unit) DU, the case portion 88 constituting the display device unit DU, and the image display device 80 will be described.

  First, referring to FIGS. 13 (A) to 13 (C) and FIGS. 14 (A) and 14 (B), the image display device 80 among the image display device 80 and the case unit 88 constituting the display device unit DU. The structure of will be described. As illustrated, the image display device 80 includes a rectangular plate-shaped main body portion 80a housed in a case portion 88, and an FPC (Flexible Printed Circuits) portion 80f that is connected and extends from the main body portion 80a. Of these, as shown in each drawing (particularly, a cross-sectional side view of FIG. 13C), the main body portion 80a includes a silicon substrate SS on which various circuits are arranged and the outer shape of the main body portion 80a, and an organic EL material. A light emitting portion 80k that generates light of color to be image light, and a protective glass GG for sealing that seals the light emitting portion 80k in cooperation with the silicon substrate SS. Is provided. The image display device 80 emits video light toward the protective glass GG side, that is, the + z side, by performing a light emission operation in accordance with the drive signal received from the FPC unit 80f.

  Here, in the present embodiment, in particular, in the image display device 80, the back surface SSr (first end surface SS1) and the side surfaces (second and third end surfaces) of the silicon substrate SS disposed on the opposite side of the image light emitting side. SS2 and SS3) are entirely on the contact surface of the case portion 88 by the high thermal conductive adhesive portion BD formed by a high thermal conductive adhesive such as a high thermal conductive silicone adhesive or a thermal conductive epoxy adhesive. It is fixed in close contact with the In other words, the back surface SSr or the like is a portion (fixed portion) to be fixed in contact.

  In the present embodiment, as described above, with respect to the configuration of the image display device 80, a silicon (Si) substrate is employed as a self-luminous element substrate on which an organic EL (OLED) is mounted. Thereby, first, high heat conductivity can be given with respect to the heat dissipation mentioned above, and highly efficient heat dissipation is possible. Furthermore, it is possible to form a circuit having a fine structure, that is, a finer structure (for example, several microns) in the creation of a circuit board for constituting a light emitting element. Furthermore, since the silicon substrate forms the outer shape of the image display device 80, each end face of the silicon substrate is formed by utilizing the high precision in silicon dicing (for example, within a manufacturing error of several tens of microns). By cutting out with high accuracy and using it for positioning when the image display device 80 is housed in the case portion 88, the positional accuracy with respect to the case portion 88 (for example, far more than the surface of the protective glass GG, etc.) is high. It can be of precision. The case unit 88 includes a display device unit (video element unit) DU incorporating the image display device 80 as another optical member (in this embodiment, a lens barrel unit 39 that houses the projection lens 30, and an optical display unit). Although it is also a member for aligning with LU), the positional accuracy of the image display device 80 with respect to the projection lens 30 can be kept high as a result by maintaining the high accuracy inside the unit.

  Next, the structure of the case unit 88 among the image display device 80 and the case unit 88 constituting the display unit DU will be described. As shown in FIGS. 13A to 13C, the case 88 is made of, for example, aluminum, titanium, copper, stainless steel, a graphene member, a heat pipe, or the like, or made of magnesium or the like. A metal member having high thermal conductivity, for example, a one-member structure formed by die casting or the like, that is, a structure composed of one member. In particular, when the case portion 88 is made of aluminum, titanium, copper, stainless steel, a graphene member, a heat pipe, or the like, the case portion 88 has high thermal conductivity. In addition to the above, the case portion 88 may have a high thermal conductivity, for example, by forming at least a portion to be the thermal conductive member 88h with a metal, a resin containing filler, a graphene member, a heat pipe, or the like. Here, as described above, the integrally formed case portion 88 includes a plate-shaped portion 88p that is a flat plate-shaped portion, a frame-shaped portion 88f that is a frame-structured portion, and a protruding member that is a protruding portion. (Fitting part) It is comprised by 88u and 88v.

  The plate-like portion 88p forms a rectangular flat plate-like portion that forms the back-side planar portion of the case portion 88 and adheres to the back surface of the image display device 80 to support and fix the image display device 80. . That is, the plate-like portion 88p also functions as a video element positioning portion that determines the storage position of the image display device 80 by contacting the back surface SSr (also referred to as the first end surface SS1) of the silicon substrate SS of the image display device 80. .

  The frame-shaped portion 88f forms a U-shaped edge portion in which the side (+ y side) into which the image display device 80 is inserted at the time of assembly is opened on the peripheral side of the plate-shaped portion 88p in the case portion 88, The image display device 80 is supported and fixed by adhering to the side surface of the image display device 80, that is, the side surface of the silicon substrate SS (also referred to as second and third end surfaces SS2 and SS3). That is, the frame-shaped portion 88 f also functions as a video element positioning portion that determines the storage position of the image display device 80 by contacting the silicon substrate SS of the image display device 80.

  The protruding members (fitting portions) 88u and 88v are attachment portions for performing attachment alignment with the lens barrel portion 39 (see FIG. 3 and the like).

  The case portion 88 is in contact with a part of the image display device 80 and conducts heat generated in the image display device 80, and a display device positioning portion (video) that positions and fixes the image display device 80. It can also be considered that the device positioning element 88t is included. As described above, in the case where the case portion 88 is a metal single member configuration, the plate-shaped portion 88p, the frame-shaped portion 88f, and the protruding members (fitting portions) 88u and 88v all have high thermal conductivity. These can function as the heat conductive member 88h. In particular, in the illustrated example, the surface portions of the plate-like portion 88p and the frame-like portion 88f are in direct contact with the image display device 80 to conduct heat of the light emitting portion, and thus function as the main portion of the heat conductive member 88h. It can be said that. In particular, the plate-like portion 88 p has the largest contact portion with the image display device 80, and is considered to greatly contribute to the conduction (heat dissipation) of heat generated in the image display device 80. The projecting members 88u and 88v can function as a heat conductive member 88h by further conducting heat from the plate-like portion 88p and the frame-like portion 88f.

  In addition, part of the surface portions of the plate-like portion 88p and the frame-like portion 88f of the case portion 88 also function as a display device positioning portion (video element positioning portion) 88t that performs positioning by contacting the image display device 80. To do. Specifically, as shown in FIG. 13A and FIG. 13C, of the surface portions of the plate-like portion 88p and the frame-like portion 88f, the flat portion serving as a reference for positioning in the z direction. 1 reference plane SF1 (a plane perpendicular to the z direction), a second reference plane SF2 (a plane perpendicular to the x direction), which is a plane portion serving as a positioning reference in the x direction, and a positioning reference in the y direction The display device positioning portion 88t is configured by the third reference plane SF3 (a plane perpendicular to the y direction) which is a plane portion. The reference surfaces SF1 to SF3 are the first and second end surfaces SS1 that are the back surface SSr among the end surfaces of the rectangular silicon plate SS, and the second and third side surfaces that are formed on the sides of the end surface SS1. By abutting with the end surfaces SS2 and SS3, high-accuracy positioning is achieved.

  As described above, the case portion 88 constitutes the display device unit DU that is housed and modularized by housing the image display device 80 by positioning and supporting the image display device 80 by fitting and bonding. It is also a member that forms an alignment portion for assembling the image display device 80, that is, the display device unit DU to the lens barrel portion 39. Specifically, the case part 88 has a pair of projecting members (fitting parts) 88u and 88u and a pair of projecting members (fitting parts) 88v and 88v as the alignment part.

  As shown in FIGS. 13A to 13C, the projection members 88u, 88u, 88v, and 88v are inserted into the image display device 80 when the image display device 80 and the case portion 88 are assembled. The pair of projecting members 88v and 88v on the side to be viewed (+ y side) are vertically longer (longer in the y direction and shorter in the x direction) than the other pair of projecting members 88u and 88u on the abutting side of the image display device 80. ). As a result, the image display device 80 can be assembled while making the case portion 88 as small as possible.

  Further, these projecting members 88u and 88v which are fitting portions for fitting to other optical members (lens barrel portion 39) are, for example, the rear end portion of the barrel portion 39 of the projection lens (projection optical system) 30. The case portion 88 is fixed to the lens barrel portion 39 by loosely fitting with the rear end portion so as to sandwich the lens. In this case, an adhesive is filled between the inner surfaces of the protrusion members (fitting portions) 88u and 88v and the side surface of the lens barrel portion 39, and the adhesive is applied after the case portion 88 is aligned with the lens barrel portion 39. The case portion 88 is cured and fixed to the lens barrel portion 39. As a result, in addition to up / down / left / right and front / back, alignment is possible with respect to three rotation axes. In addition, as the previous stage of the alignment, the light guide member 10 of the light guide device 20 is fixed by fitting the root side into the lens barrel portion 39. In this state, the case portion 88 that houses the image display device 80 as described above performs alignment with the lens barrel portion 39 assembled with the light guide member 10 or the like, so that final image alignment is performed. Is possible. In particular, as in this embodiment, in the case of a pair of left and right configurations, adjustment in units of pixels is necessary so that the image for the right eye side and the image for the left eye side are visually recognized in a state of being exactly overlapped, This alignment is very important. On the other hand, in the present embodiment, since the image display device 80 is incorporated in the case portion 88 with high accuracy, the adjustment margin can be minimized and the device can be adjusted in position. Can be avoided as much as possible.

  Here, in addition to the above, it is conceivable to provide the image display device 80 itself with a structure for dissipating the heat generated inside. For example, in the image display device 80 having the above-described structure, the FPC unit 80f is configured to include a heat conductive material that conducts heat of the light emitting unit 80k, so that heat is radiated through the FPC unit 80f. Can be considered. That is, the FPC portion 80f extending from the main body portion 80a of the image display device 80 may function as a heat conducting portion.

  Hereinafter, with reference to FIGS. 15A to 15E, an example of a manufacturing process of the display unit DU, which is also a process of manufacturing the virtual image display device 100 (FIGS. 15A and 15B). Furthermore, an example (FIGS. 15C to 15E) of assembling steps of the display unit DU and the lens barrel portion 39 will be described. 15A and 15B, the display unit DU is shown in a side cross-sectional view, and in FIGS. 15C to 15E, it is shown in a side view.

  First, as shown in FIG. 15A, the first to third reference planes that serve as positioning references for the z, y, and x directions of the plate-like portion 88p and the frame-like portion 88f of the case portion 88. The adhesive 88s to be the high thermal conductive adhesive portion BD is applied to SF1 to SF3 (adhesive application step). As the adhesive 88s, as described above, for example, it is conceivable to use a high heat conductive silicone-based adhesive or a heat conductive epoxy adhesive. By using an adhesive having high thermal conductivity, heat dissipation can be improved even on the image light emission side.

  Next, as indicated by an arrow A1 in FIG. 15B, the image display device 80 is inserted from the + y side opened in the U-shaped frame-shaped portion 88f constituting the case portion 88, and the adhesive 88s is removed. Positioning is performed by bringing the end surfaces SS1 to SS3 of the silicon substrate SS of the image display device 80 into contact with the applied reference surfaces SF1 to SF3 (positioning step), and the adhesive 88s is cured to be bonded and fixed (adhesion) Fixing process). Thus, the display unit DU is manufactured (display unit manufacturing process).

  Next, as shown in FIG. 15C, in addition to the manufactured display device unit DU, a lens barrel portion 39 to be assembled to the display device unit DU is prepared (preparation step). For example, it is assumed that the lens barrel part 39 is fixed and the case part 88 is attached to a jig (not shown) so that the position of the case part 88 can be adjusted in six axis directions. . Further, it is assumed that each groove portion 39w, which is a connection portion between the protruding members (fitting portions) 88u and 88v of the case portion 88 in the lens barrel portion 39, is filled with the adhesive AH. From this state, as shown in FIG. 15 (D), the case portion 88 is appropriately moved, and the projection members 88u and 88v corresponding to the groove portions 39w filled with the adhesive AH are inserted, and the top, bottom, left and right, front and back. In addition to the three directions, alignment (six-axis alignment) with respect to the rotation axes in three directions is performed (alignment process). Finally, after assembling other parts and removing the dust at and around the joint as necessary, the case portion 88 is formed with a tape-shaped seal member SL as shown in FIG. The gap between the lens barrel portion 39 and the lens barrel portion 39 is sealed (sealing process). In the above, for example, it is conceivable that the sealing member SL has high thermal conductivity (the sealing member SL is made of a highly thermal conductive material). Further, when manufactured as described above, the projecting members 88u and 88v, which are connection portions with other optical members (lens barrel portion 39) in the case portion 88, also function as the heat conductive members 88h. Further, heat can be released to the other optical member side through the protruding members 88u and 88v (a detailed example will be described with reference to FIG. 17 and the like).

  As described above, in the virtual image display device 100 including the display device unit DU according to the present embodiment, the image display device 80 that is a video device is a self-luminous element including the light emitting unit 80k that generates video light. Since the light source is not required, it is possible to reduce the weight and size of the virtual image display device 100, and to reduce the weight and size of the entire virtual image display device 100. Further, the case unit 88 of the display device unit DU includes the heat conductive member 88h that is in contact with the image display device 80 and conducts heat of the light emitting unit 80k, thereby suppressing an increase in the internal temperature of the image display device 80 and image display. Even if the device 80 is a self-luminous type and particularly includes an organic EL (OLED) element, it is possible to avoid the performance deterioration and the shortening of the life due to the increase of the internal temperature and to form a good image. Further, in manufacturing the display unit DU, simple and reliable assembly can be performed while ensuring high heat dissipation. At this time, high-precision alignment can be performed by utilizing the characteristics of the silicon substrate SS.

[Third Embodiment]
Hereinafter, the virtual image display device according to the third embodiment will be described with reference to FIG. The virtual image display device according to the third embodiment is a partial modification of the virtual image display device according to the second embodiment. FIG. 16 is a diagram corresponding to FIG. It is a figure which shows an example of the display apparatus unit DU integrated in the virtual image display apparatus which concerns. In addition, since the parts that are not particularly described are the same as those in the second embodiment, the illustration and description of the entire virtual image display device are omitted.

  As shown in FIG. 16, the display device unit DU incorporated in the virtual image display device according to the present embodiment emits image light on the opposite side of the heat conductive member 88 h and the display device positioning portion 88 t constituting the case portion 88. Further provided is a mask portion 188m provided on the side for removing unnecessary light from the component light emitted from the image display device 80. In other words, the light shielding mask is added to the case portion 88. In the case of the case portion 88 having the configuration exemplified in the second embodiment, the plate-shaped portion 88p covers the back side (back side) of the image display device 80. For this reason, in the case part 88, it may be difficult in manufacturing to realize the display side mask structure up to one part. Therefore, in the present embodiment, the mask portion 188m as a light shielding mask is further provided as a separate member.

  The mask portion 188m has a main body portion MK1 that is, for example, a metal frame, and a protrusion MK2 that protrudes from a part of the main body portion MK1 and performs alignment (positioning) with the case portion 88. Yes. In the mask portion 188m, the opening portion OP1 formed in the main body portion MK1 is disposed at an appropriate position by positioning the protrusion portion MK2 with respect to the case portion 88, and unnecessary light is removed while emitting image light from the opening portion OP1 ( Light-shield).

  On the other hand, the case part 88 has a light shielding positioning part (mask positioning part) MKa provided corresponding to the protrusion part MK2 in order to accurately position the mask part 188m. For example, by forming a groove corresponding to the shape and position of the protrusion MK2 on the surface of the frame-shaped portion 88f, the mask portion 188m is brought into contact with the case portion 88 to determine the position of the mask portion 188m. It can be considered to function. By using the protrusion MK2 and the light shielding positioning portion MKa, it is possible to mount with high accuracy.

  In addition to the mask portion 188m having the above configuration, another light shielding tape or light shielding sheet may be positioned and fixed to the case portion 88. In this case, the light shielding sheet or the like may be fixed with an adhesive or double-sided tape.

[Fourth Embodiment]
Hereinafter, the virtual image display device according to the fourth embodiment will be described with reference to FIG. Note that the virtual image display device according to the fourth embodiment is a partial modification of the virtual image display device according to the second embodiment, and the virtual image display device according to the present embodiment shown as an example in FIG. The display device unit DU and the lens barrel unit 39 (or the optical display unit LU) to be incorporated are modifications of the display device unit DU and the lens barrel unit 39 constituting the virtual image display device 100 of the second embodiment. In addition, since the parts that are not particularly described are the same as those in the second embodiment, the illustration and description of the entire virtual image display device are omitted.

  As shown in FIGS. 17A to 17C, the display device unit DU incorporated in the virtual image display device according to the present embodiment has a larger number than the lens barrel portion 39 (or the optical display unit LU). Touching at a point. Thereby, heat conduction to the lens barrel portion 39 is made possible, and the effect of heat dissipation is further enhanced.

  In particular, in the illustrated example, in addition to the pair of projecting members 88u and 88u and the pair of projecting members 88v and 88v, the projecting member (fitting portion) is further paired with the other projecting members 88x and 88x and the pair of projecting members 88u and 88u. And a pair of projecting members 88v, 88v, and by applying a high thermal conductive adhesive such as a high thermal conductive silicone adhesive or a thermal conductive epoxy adhesive as the adhesive AH at each position, heat conduction is achieved. It can be assembled to the lens barrel portion 39 in the raised state.

  In addition to the above-described embodiments, various modifications can be considered. For example, like the display unit DU of one modified example shown in FIGS. 18A and 18B, a fin structure is provided on the back surface (back surface) of the plate-shaped portion 88p that functions as the heat conductive member 88h in the case portion 88. The part FS may be included. Here, as shown in the drawing, it is assumed that the fin structure portion FS is provided with a large number of fins FN so as to form a flow path particularly along the vertical direction (y direction) A2. When air is heated around the display unit DU, it expands and becomes lighter and rises. Then, new air enters from the lower side. In this case, it is considered that if a large number of fins FN are provided in the above-described shape, convection is likely to occur and heat exchange efficiency is increased. Further, for example, the display unit DU may be combined with other components while providing a flow path along the vertical direction (y direction) as described above. In addition to the structure having fins as described above, another heat dissipation structure may be separately provided, that is, a structure in which the heat dissipation structure is combined may be considered.

  FIG. 19 is a conceptual diagram for explaining another modification of the virtual image display device. In the illustrated virtual image display device 200, a frame that supports a pair of left and right light guide devices 20 and 20 that guide image light from display device units DU and DU including a pair of left and right image display devices 80 and 80, respectively. The harness member HP which is a cable part provided along the part 102 is included. In the figure, the FPC units 80f and 80f constituting the image display devices 80 and 80 are, for example, a circuit board and a connection unit that are folded in a portion extending from the image display devices 80 and 80 to the lens barrel units 39 and 39. It is assumed that each part is housed in a cover-shaped exterior member 105d (see FIG. 1).

  For example, as illustrated in FIG. 1, the harness member HP extends from one of the display devices 100 </ b> A and 100 </ b> B (in FIG. 1, extends from the display device 100 </ b> B) and is connected to a control device or the like provided outside. And a cable unit for transmitting the video signal from the control device to the display devices 100A and 100B configured by a pair of left and right. Inside the device, for example, as conceptually shown in FIG. The harness member HP includes cables CA and CB that are divided into the first display device 100A side and the second display device 100B side, and is connected to the image display devices 80 and 80 constituting the display devices 100A and 100B, respectively. The cables CA and CB are connected to, for example, the FPC units 80f and 80f of the image display devices 80 and 80, or a connection circuit provided at the ends thereof. That is, it extends so as to connect the display devices 100A and 100B, which are a pair of display units. Among these, the cable CA extending to the first display device 100 </ b> A side is provided along the metal frame portion 102 and is in contact with the frame portion 102. Regarding the cables CA and CB constituting the harness member HP, various materials and shapes and further arrangements are assumed, but here, as an example, the cables CA and CB have a flat shape. It shall be sealed with something like copper foil tape. With such a configuration, the cables CA and CB can also have high thermal conductivity. As a result, for example, heat from the FPC portions 80f and 80f can be radiated by the entire frame portion 102 via the harness member HP. Further, for example, as shown in the figure, the cables CA and CB may be arranged so as to be in direct contact with the image display device 80 (display device unit DU) to assist heat dissipation. Further, as described above, when the harness member HP is configured by sealing with a copper foil tape or the like, it is conceivable that only a part of the harness member HP is configured with a copper foil tape or the like. Specifically, for example, the harness member HP extending from a controller (not shown) side as a control device or the like provided outside is located inside (inside) the display device 100A, 100B side or in the vicinity thereof. It is conceivable that the harness member HP is made of such copper foil tape or the like. Thereby, there is no fear that the heat generated on the controller side is transmitted from the harness member HP. Further, when the harness member HP is entirely configured by sealing with a copper foil tape or the like up to a place including the controller side, the harness member HP is between the controller side and the display devices 100A and 100B side. It is good also as what interrupts | blocks the heat from a controller side by arrange | positioning members with low heat conductivity, such as a heat insulation film. Furthermore, for example, various modes are conceivable for the wiring of the cables CA and CB constituting the harness member HP. Specifically, in the illustration in FIG. 19, the cables CA and CB are separated from the parts before being connected corresponding to the display devices 100A and 100B. The cable is not divided into two, and one cable extends to the inside of one image display device 80 of the pair of left and right image display devices 80, 80, and the cable is connected inside the one image display device 80. It is also conceivable to adopt a mode in which is divided and extends toward the other image display device 80.

  FIG. 20 is a diagram for explaining another modification of the virtual image display device. The illustrated virtual image display device 300 includes an outside air flow path forming unit HL that forms a flow path for allowing outside air to pass through the display unit DU. More specifically, as shown in the drawing, the outside air flow path forming portion HL includes, for example, a vent hole FH provided on the front side of the exterior member 105d that houses the display unit DU, and a communication hole provided on the rear side. The air flow path is formed so that the outside air AR passes from the air hole FH to the air hole BH. It should be noted that the outside air flow path forming portion HL may be variously configured in addition to the illustrated example in consideration of suppression of stray light generation and entry of dust. As described above, heat radiation can also be promoted by providing the outside air flow path forming portion HL and allowing outside air to pass through. Further, when providing the above-described structure for allowing outside air to pass, a waterproof structure may be separately provided as necessary. For example, a filter member (PTFE filter or the like) that allows air to pass but does not allow water to pass therethrough is provided in each of the vent holes FH and BH that are the openings of the flow path. It may be possible to make it sealed and sealed in a separate space.

  Furthermore, in addition to the above, when providing the heat radiation portion DP as in a virtual image display device 400 conceptually showing the internal structure in FIGS. 21 (A) and 21 (B) as a modified example, a noise countermeasure sheet NP is further provided. It may be included. FIG. 21A conceptually shows a plan view of the virtual image display device 400, and FIG. 21B conceptually shows a side view of the virtual image display device 400. The virtual image display device 400 has a heat radiation part DP extending from the back side (back side) of the image display device 80 to the frame part 102. That is, the heat radiating part DP functions as a heat conducting member that releases heat. When such a heat radiating part DP is provided, electromagnetic waves are generated by weak power or the like on the circuit board of the organic EL panel constituting the image display device 80, and this becomes noise through the heat radiating part DP and other noises are generated. There is a possibility that a situation such as being transmitted to and affecting the member may occur. In order to prevent such a situation, a noise countermeasure sheet NP is provided between the image display device 80 and the heat radiation part DP as shown in the figure. As the noise suppression sheet NP, for example, it may be possible to apply a member such as an electromagnetic wave absorption sheet composed of a mixture of silicon polymer, magnetic metal powder, and ceramic. It can be a low quality. As described above, by providing the noise countermeasure sheet NP, the noise of the organic EL panel configured on the silicon substrate in the image display device 80 is framed through the silicon substrate and the heat radiating portion DP (for example, the heat conductive sheet). For example, it is possible to prevent the liquid from flowing on the unit 102 and riding on the circuit board or the like of each display device 100A, 100B. In addition, for example, it is conceivable that the heat radiating portion DP is composed of a member having excellent thermal conductivity and electromagnetic wave absorption. In addition to the case shown in FIG. 12, for example, as shown in FIG. 22, two parts of a first portion 102x and a second portion 102y in which a pair of frame members 102 are divided by portions that hold the left and right light guide members. It is also possible to adopt a configuration in which noise is prevented from being conducted in the left and right display devices by adopting a configuration and providing a noise countermeasure sheet NP therebetween. Further, a configuration in which a portion close to a circuit board, a flexible cable, or the like is covered with a noise countermeasure sheet (a member having low conductivity) is also conceivable.

[Others]
Although the present invention has been described with reference to the embodiments, the present invention is not limited to the above-described embodiments, and can be implemented in various modes without departing from the gist thereof.

  In the above description, for example, the adhesive 88s to be the high thermal conductive adhesive portion BD to be applied to each of the reference surfaces SF1 to SF3 is applied to the contact portion as a whole, but may be performed partially. Accordingly, for example, in each of the reference surfaces SF1 to SF3, the thermal conductivity may be achieved so that there is a portion that directly contacts the corresponding end surfaces SS1 to SS3 without using the high thermal conductive adhesive portion BD. Further, by utilizing the high thermal conductivity of the silicon substrate SS, the heat conductive member 88h of the case portion 88 may be configured to be in contact with a part of the silicon substrate SS instead of the entire end surfaces SS1 to SS3.

  For example, in FIG. 18, the fin structure is provided. However, the present invention is not limited to this, and the fin structure may be provided in other embodiments, or a cooling fan or a Peltier element may be provided. It is conceivable to apply structures and means.

  Also, other members that are directly or indirectly connected to the display unit DU and conduct heat, such as the lens barrel portion 39, may be made of, for example, a metal material, a resin material with filler, a graphene member, or a heat pipe. It may be configured.

  In the above description, the element substrate of the image display device 80 is a silicon substrate, but other members such as quartz glass can be used if sufficient heat dissipation and positional accuracy are ensured.

  In the above description, the case portion 88 is made of a metal having high thermal conductivity. However, other materials (for example, resin materials) are applied as long as heat dissipation and storage position accuracy of the image display device 80 are ensured. (It may be applied to a part).

  In the above, various types of image display devices 80 can be used. For example, a configuration using a reflective liquid crystal display device is also possible, and the image display device 80 is replaced with a video display element including a liquid crystal display device. A digital micromirror device or the like can also be used.

  In the above description, the half mirror layer on the second surface S12 is, for example, a metal reflection film or a dielectric multilayer film, but can be replaced with a planar or curved hologram element. Further, the fifth surface S15 can also be configured by a hologram element in addition to the case of using a mirror reflecting surface.

  In the above description, the light guide member 10 and the like extend in the lateral direction in which the eyes are arranged. However, the light guide member 10 may be arranged to extend in the vertical direction. In this case, the light guide member 10 has a structure arranged in parallel, not in series.

  In the above description, only the mode of superimposing the image light and the external light is described, but for example, it is possible to switch between the mode of only the image light without superimposing and the mode of only the external light. You may apply in a virtual image display apparatus.

  The technique of the present invention may be applied to a so-called video see-through product including a display and an imaging device.

  In addition, the casing (video element unit structure) having a structure for heat dissipation in the technology of the present invention, that is, the unitization of the image display device (video element) is used in a display device such as a camera finder or a small projector. It is also possible.

  In the case of other applications as described above, for example, when high-precision alignment with other optical components is not necessary for the display device unit (video element unit), an attachment portion for the alignment It is good also as a structure which does not have (typically like protrusion members (fitting part) 88u and 88v).

  A1 ... Arrow, A2 ... Vertical direction, AH ... Adhesive, AR ... Outside air, AX ... Incident side optical axis, BD ... High heat conductive adhesive part, BH ... Vent, BP ... Adhesive part, CA, CB ... Cable, DP ... Heat dissipation unit, DU ... Display unit, EA ... Display area, FG ... Hook jig, FH ... Vent, FN ... Fin, FS ... Fin structure, GG ... Protective glass, GL ... Video light, JG ... Jig NS ... extended surface, HL ... outside air flow path forming part, HP ... harness member (cable part), LU ... optical display unit, MK1 ... main body part, MK2 ... projection part, MKa ... light-shielding positioning part (mask positioning part), NP ... Noise suppression sheet, OP ... Opening, OP1 ... Opening, S11-S15 ... Surface, S51-S53 Transmission surface, SF1-SF3 ... Reference surface, SL ... Sealing member, SS ... Silicon substrate, SS1-SS3 ... End surface, SSr ... back surface (exposed portion, fixed portion), TP2, TP2 ... reference projection, TP3, TP3 ... reference projection, X1 ... arrow, Y1 ... arrow, 10 ... light guide member, 11 ... first light guide portion, 12 ... 2nd light guide part, 20 ... light guide device, 30 ... projection lens, 39 ... lens barrel part, 39w ... groove part, 50 ... light transmission member, 80 ... image display device (video element), 80a ... main body part, 80f ... FPC part, 80k ... light emitting part, 88 ... case part, 88a ... heat radiation structure part, 88b ... display device positioning part (video element positioning part), 88f ... frame-like part, 88h ... thermally conductive member, 88m, 188m ... Mask part, 88p ... Plate-like part, 88s ... Adhesive, 88t ... Display device positioning part (video element positioning part), 88u, 88v, 88x ... Projection member (attachment part, fitting part), 100 ... Virtual image display device , 100A ... first display device, 00B ... second display device, 101a, 101b ... optical member, 102 ... frame portion, 102a ... center portion, 102b ... support, 102c, 102d ... peripheral portion, 102p ... main body portion, 104 ... temple, 105a, 105b ... image Forming body part, 105d ... exterior member, 200 ... virtual image display device, 300 ... virtual image display device, 400 ... virtual image display device

Claims (20)

An image element including a light emitting unit for generating image light;
A case portion for storing the video element;
The said case part is a virtual image display apparatus which has the thermal radiation structure part which open | releases the opposite side to the side which inject | emits image light among the said image elements, and radiates heat.   2. The virtual image display device according to claim 1, wherein the case portion has a one-member structure that forms an opening that opens a part of the video element in the heat dissipation structure portion. The image element is formed by forming an organic EL element constituting the light emitting unit on a silicon substrate,
3. The virtual image display device according to claim 1, wherein in the case portion, the heat dissipation structure dissipates heat by opening a back surface of the silicon substrate.   The virtual image display device according to claim 3, wherein the video element is positioned in contact with the case portion at an end surface other than the back surface of the silicon substrate.   5. The virtual image display according to claim 1, wherein the case portion includes a video element positioning portion that contacts a location other than a location where the video device is opened to determine a storage position of the video device. apparatus.   The virtual image display device according to claim 1, further comprising a heat dissipating part that dissipates an exposed portion opened by the heat dissipating structure part of the video element.   The virtual image display device according to claim 6, wherein the heat radiating unit is a heat conductive tape attached to the exposed portion.   The said case part has the mask part which covers a part of surface by which the image light is radiate | emitted among the said image elements, and the attaching part for performing attachment alignment with respect to another optical component of Claims 1-7 The virtual image display device according to any one of the above.   The virtual image display device according to claim 1, wherein the virtual image display device includes an adhesive portion that is formed of a high thermal conductive silicone-based adhesive or a thermal conductive epoxy adhesive, and fixes the video device and the case portion. . A light guide member for guiding the image light from the image element by total reflection on a plurality of surfaces;
The virtual image display device according to claim 1, further comprising: a projection optical system that causes video light from the video element to enter the light guide member. An image element including a light emitting unit for generating image light and a case unit for housing the image element, wherein the case unit radiates heat by opening an opposite side of the image element to the side emitting the image light. A method for manufacturing an image element unit, comprising: a heat dissipation structure; and an image element positioning portion that contacts a position other than a position where the image element is opened to determine a storage position of the image element,
Applying an adhesive for fixing the video element in the video element positioning part of the case part,
A method of manufacturing an image element unit, wherein the image element and the case portion are aligned and fixed with the adhesive while the image element is opened in the heat dissipation structure. An image element including a light emitting unit for generating image light;
A case portion for storing the video element;
The virtual image display device, wherein the case unit includes a heat conductive member that is in contact with the video element and conducts heat of the light emitting unit.   The virtual image display device according to claim 12, wherein in the case portion, the thermally conductive member is made of a metal, a resin containing filler, a graphene member, or a heat pipe.   14. The virtual image display device according to claim 12, wherein the case portion is made of aluminum, titanium, copper, stainless steel, a graphene member, or a heat pipe.   The virtual image display device according to any one of claims 12 to 14, wherein, in the case portion, the thermally conductive member is in contact with a side opposite to a side from which video light is emitted in the video element. The image element is formed by forming an organic EL element constituting the light emitting unit on a silicon substrate,
15. The virtual image display device according to claim 12, wherein the case unit includes a video element positioning unit that contacts the silicon substrate to determine a storage position of the video element. A mask portion that is provided on the image light emitting side of the image element and covers the periphery of the light emitting area of the image element;
The virtual image display device according to any one of claims 12 to 16, wherein the case unit includes a mask positioning unit that abuts the mask unit to determine a position of the mask unit.   In the said case part, the said heat conductive member is a virtual image display apparatus as described in any one of Claims 12-17 provided in a connection part with another optical member. The video element has an FPC portion connected and extending from a main body portion including the light emitting portion,
The virtual image display device according to claim 12, wherein the FPC unit includes a heat conductive material that conducts heat of the light emitting unit. A pair of left and right light guide members for guiding image light from the image element composed of a pair of left and right respectively;
A metal frame portion that supports the pair of light guide members;
The virtual image display according to any one of claims 12 to 19, further comprising: a cable portion that is provided in contact with the frame portion and transmits a signal to the video element configured by a pair of left and right. apparatus.

Images