JP2018049185A - Wavelength conversion member and light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wavelength conversion member that can suppress temperature extinction of phosphor in the wavelength conversion member due to heat generated by a light source such as LED, and a light-emitting device using the wavelength conversion member.SOLUTION: A wavelength conversion member 10 arranged above a light-emitting element 3 for use comprises: a wavelength conversion member body 1; and a spacer layer 2 formed on the surface of the wavelength conversion member body 1 for securing a gap G between the wavelength conversion member body 1 and the light-emitting element 3.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a wavelength conversion member that converts a wavelength of light emitted from a light emitting diode (LED) or a laser diode (LD) to another wavelength, and a light emitting device using the same.

  In recent years, attention has been focused on light emitting devices using LEDs and LDs as next-generation light sources that replace fluorescent lamps and incandescent lamps. As an example of such a next-generation light source, a light-emitting device that combines an LED that emits blue light and a wavelength conversion member that absorbs part of the light from the LED and converts it into yellow light is disclosed. This light emitting device emits white light that is a combined light of blue light emitted from the LED and yellow light emitted from the wavelength conversion member. Patent Document 1 proposes a wavelength conversion member in which an inorganic phosphor powder is dispersed in a glass matrix as an example of a wavelength conversion member.

JP 2003-258308 A

  In the above light emitting device, there is a problem that the phosphor in the wavelength conversion member is quenched by the heat generated from the LED, and the emission intensity is reduced.

  Accordingly, an object of the present invention is to propose a wavelength conversion member capable of suppressing the temperature quenching of the phosphor in the wavelength conversion member due to heat emitted from a light source such as an LED, and a light emitting device using the same. And

  The wavelength conversion member of the present invention is a wavelength conversion member used by being placed above the light emitting element, and is formed on the surface of the wavelength conversion member main body and the wavelength conversion member main body. And a spacer layer for securing a gap between the light emitting element and the light emitting element. When the wavelength conversion member having the configuration is placed above the light emitting element, a gap can be secured between the wavelength conversion member main body and the light emitting element by the spacer layer. Therefore, heat from the light emitting element is insulated by the air layer present in the gap, and is difficult to be transmitted to the wavelength conversion member body. As a result, the temperature rise of the phosphor included in the wavelength conversion member main body is reduced, and temperature quenching can be suppressed. In addition, since the wavelength conversion member of the present invention is formed by integrating the wavelength conversion member main body and the spacer layer, by placing the side of the wavelength conversion member on which the spacer layer is formed above the light emitting element. It is possible to secure a desired gap between the light emitting element and the wavelength conversion member main body. Here, since the gap thickness can be adjusted only by changing the thickness of the spacer layer as appropriate, the device design is easy.

  In the wavelength conversion member of the present invention, it is preferable that the spacer layer is formed on the peripheral edge portion of the surface of the wavelength conversion member main body. If it does in this way, it will become difficult to prevent the incident of the excitation light from the light emitting element to the wavelength conversion member main body by the spacer layer.

  In the wavelength conversion member of the present invention, the spacer layer is preferably made of a transparent material. If it does in this way, it will become difficult to prevent the incident of the excitation light from the light emitting element to the wavelength conversion member main body by the spacer layer.

  In the wavelength conversion member of the present invention, the spacer layer is preferably made of glass. Since glass is excellent in transparency and heat resistance, it can be made into a wavelength conversion member having excellent light emission intensity and little deterioration over time.

  In the wavelength conversion member of the present invention, the spacer layer preferably has a thickness of 1 to 100 μm. If it does in this way, since it becomes easy to inject the excitation light from a light emitting element into a wavelength conversion member main body, emitted light intensity becomes easy to improve.

  In the wavelength conversion member of the present invention, the wavelength conversion member main body is preferably formed by dispersing phosphor powder in a glass matrix. If it does in this way, the heat resistance of the wavelength conversion member main part can be improved.

  A light-emitting device of the present invention includes a light-emitting element and the above-described wavelength conversion member placed above the light-emitting device, and a gap is formed between the light-emitting element and the wavelength conversion member body by the spacer layer. It is characterized by being.

  In the light emitting device of the present invention, the gap between the light emitting element and the wavelength conversion member main body is preferably 1 to 100 μm.

  The manufacturing method of the wavelength conversion member of the present invention is a method for manufacturing the above-described wavelength conversion member, and the glass paste layer is formed by applying a spacer layer-forming glass paste on the surface of the wavelength conversion member main plate. Forming the spacer layer on the surface of the original plate for wavelength conversion member by firing the glass paste layer, obtaining the wavelength conversion member original plate, and dividing the spacer layer into the original plate for wavelength conversion member And cutting into pieces. If it does in this way, mass production of the wavelength conversion member of the present invention will become easy.

  ADVANTAGE OF THE INVENTION According to this invention, the wavelength conversion member which can improve emitted light intensity, and a light-emitting device using the same can be provided.

(A) It is a typical perspective view which shows the wavelength conversion member which concerns on the 1st Embodiment of this invention. (B) It is typical sectional drawing which shows the light-emitting device using the wavelength conversion member which concerns on the 1st Embodiment of this invention. It is a typical perspective view which shows the wavelength conversion member which concerns on the 2nd Embodiment of this invention. It is a typical perspective view which shows the wavelength conversion member which concerns on the 3rd Embodiment of this invention. (A) It is a typical perspective view which shows the wavelength conversion member which concerns on the 4th Embodiment of this invention. (B) It is typical sectional drawing which shows the light-emitting device using the wavelength conversion member which concerns on the 4th Embodiment of this invention. (A) It is a typical perspective view which shows the wavelength conversion member which concerns on the 5th Embodiment of this invention. (B) It is typical sectional drawing which shows the light-emitting device using the wavelength conversion member which concerns on the 5th Embodiment of this invention. It is a typical top view showing one process of a method for manufacturing a wavelength conversion member concerning a 1st embodiment of the present invention.

  Hereinafter, preferred embodiments will be described. However, the following embodiments are merely examples, and the present invention is not limited to the following embodiments. Moreover, in each drawing, the member which has the substantially the same function may be referred with the same code | symbol.

(I) Wavelength conversion member and light-emitting device using the same (1) Wavelength conversion member according to the first embodiment FIG. 1A is a schematic diagram illustrating the wavelength conversion member according to the first embodiment of the present invention. It is a perspective view, (b) is typical sectional drawing which shows the light-emitting device using the wavelength conversion member which concerns on the 1st Embodiment of this invention. The wavelength conversion member 10 includes a wavelength conversion member main body 1 and a spacer layer 2 formed on the peripheral edge of the surface. In the light emitting device 100, the wavelength conversion member 10 is placed above the light emitting element 3 installed on the substrate 4, and the reflective layer 5 is formed so as to cover the periphery of the light emitting element 3 and the wavelength conversion member 10. ing. Here, the wavelength conversion member 10 is placed so that the side on which the spacer layer 2 is formed faces the light emitting element 3. For example, the wavelength conversion member 10 can be fixed on the light emitting element 3 by providing a resin adhesive layer (not shown) between the spacer layer 2 and the light emitting element 3. Thereby, a gap G is formed between the light emitting element 3 and the wavelength conversion member main body 1.

  The excitation light E emitted from the light emitting element 3 is converted in wavelength within the wavelength conversion member main body 1 to become fluorescence L, and emitted to the opposite side to the light emitting element 3. As described above, heat from the light emitting element 3 is insulated by the air layer existing in the gap G, and is not easily transmitted to the wavelength conversion member main body 1. As a result, the temperature rise of the phosphor contained in the wavelength conversion member main body 1 is reduced, temperature quenching can be suppressed, and the emission intensity of the wavelength conversion member main body 1 is easily improved.

  The wavelength conversion member main body 1 is made of, for example, a phosphor glass including a glass matrix and phosphor particles. The phosphor particles are dispersed in a glass matrix. The shape of the wavelength conversion member main body 1 may be appropriately selected according to the shape of the light emitting element 3, but is usually a rectangular plate, specifically a square plate.

The glass matrix is not particularly limited as long as it can be used as a dispersion medium for phosphor particles such as inorganic phosphors. For example, borosilicate glass, phosphate glass, tin phosphate glass, bismuthate glass, tellurite glass, and the like can be used. The borosilicate-based glass, in _{mass%, SiO 2 30~85%, Al} 2 O 3 0~30%, B 2 O 3 0~50%, Li 2 O + Na 2 O + K 2 O 0~10%, and , MgO + CaO + SrO + BaO containing 0 to 50%. Examples of the tin phosphate glass include those containing, in mol%, SnO 30 to 90% and P ₂ O ₅ 1 to 70%. As the tellurite-based glass, TeO ₂ 50% or more, ZnO 0 to 45%, RO (R is at least one selected from Ca, Sr and Ba) 0 to 50%, and La ₂ O _{3 in} mol%. Examples include + Gd ₂ O ₃ + Y ₂ O ₃ 0 to 50%.

  The softening point of the glass matrix is preferably 250 ° C to 1000 ° C, more preferably 300 ° C to 950 ° C, and further preferably in the range of 500 ° C to 900 ° C. If the softening point of the glass matrix is too low, the mechanical strength and chemical durability of the wavelength conversion member body may be lowered. Further, since the heat resistance of the glass matrix itself is low, there is a possibility that the glass matrix is softened and deformed by heat generated from the inorganic phosphor. On the other hand, if the softening point of the glass matrix is too high, the phosphor particles may be deteriorated and the emission intensity of the wavelength conversion member main body 1 may be lowered when a baking step is included in the production. From the viewpoint of increasing the chemical stability and mechanical strength of the wavelength conversion member body 1, the softening point of the glass matrix is 500 ° C. or higher, 600 ° C. or higher, 700 ° C. or higher, 800 ° C. or higher, particularly 850 ° C. or higher. Is preferred. Examples of such glass include borosilicate glass. However, when the softening point of the glass matrix increases, the firing temperature also increases, and as a result, the manufacturing cost tends to increase. Therefore, from the viewpoint of manufacturing the wavelength conversion member 10 at a low cost, the softening point of the glass matrix is preferably 550 ° C. or lower, 530 ° C. or lower, 500 ° C. or lower, 480 ° C. or lower, particularly 460 ° C. or lower. Examples of such glass include tin phosphate glass, bismuthate glass, and tellurite glass.

  The phosphor particles are not particularly limited as long as they emit fluorescence when incident excitation light is incident. Specific examples of the phosphor particles include oxide phosphors, nitride phosphors, oxynitride phosphors, chloride phosphors, acid chloride phosphors, sulfide phosphors, oxysulfide phosphors, and halogens. And one or more selected from a phosphor, a chalcogenide phosphor, an aluminate phosphor, a halophosphate phosphor, and a garnet compound phosphor. When blue light is used as the excitation light, for example, a phosphor that emits green light, yellow light, or red light as fluorescence can be used.

  The average particle diameter of the phosphor particles is preferably 1 μm to 50 μm, and more preferably 5 μm to 25 μm. If the average particle size of the phosphor particles is too small, the emission intensity may be reduced. On the other hand, if the average particle diameter of the phosphor particles is too large, the emission color may be non-uniform.

  The content of the phosphor particles in the wavelength conversion member body 1 is preferably 1% by volume or more, 1.5% by volume or more, and particularly preferably 2% by volume, 70% by volume or less, 50% by volume or less, 30% by volume. % Or less is preferable. If the content of the phosphor particles is too small, it is necessary to increase the thickness of the wavelength conversion member main body 1 in order to obtain a desired emission color, and as a result, the internal scattering of the wavelength conversion member main body 1 increases. The light extraction efficiency may be reduced. On the other hand, if the content of the phosphor particles is too large, it is necessary to reduce the thickness of the wavelength conversion member body 1 in order to obtain a desired emission color, and therefore the mechanical strength of the wavelength conversion member body 1 may be reduced. is there.

  The thickness of the wavelength conversion member main body 1 is preferably 0.01 mm or more, 0.03 mm or more, 0.05 mm or more, 0.075 mm or more, 0.1 mm or more, preferably 1 mm or less, 0.5 mm or less, 0.35 mm. Hereinafter, it is preferably 0.3 mm or less and 0.25 mm or less. If the wavelength conversion member main body 1 is too thick, light scattering and absorption in the wavelength conversion member main body 1 become too large, and the fluorescence emission efficiency may be lowered. If the thickness of the wavelength conversion member main body 1 is too thin, it may be difficult to obtain sufficient light emission intensity. Moreover, the mechanical strength of the wavelength conversion member main body 1 may become insufficient.

  In addition, the wavelength conversion member main body 1 may be made of ceramics such as YAG ceramics or the like in which phosphor particles are dispersed in a resin other than the fluorescent glass.

  Examples of the spacer layer 2 include glass, ceramics, glass ceramics, resins, and metals. Among these, a transparent material such as glass or resin is preferable because it is difficult to prevent excitation light from entering the wavelength conversion member body 1 from the light emitting element 3. In particular, glass is preferable because of its excellent heat resistance. The total light transmittance in the visible region (400 to 800 nm) of the transparent material is preferably 50% or more, 70% or more, and particularly preferably 80% or more.

  The thickness of the spacer layer 2 is preferably 1 to 100 μm, 2 to 50 μm, 3 to 20 μm, and particularly preferably 5 to 10 μm. If the thickness of the spacer layer 2 is too small, the gap G having a sufficient thickness is not formed between the wavelength conversion member main body 1 and the light emitting element 3, so that it is difficult to obtain the effect of improving the light emission intensity. On the other hand, when the thickness of the spacer layer 2 is too large, excitation light and fluorescence are likely to be absorbed or scattered by the spacer layer 2 and the light emission intensity may be reduced. The gap between the light emitting element 3 and the wavelength conversion member main body 1 is also preferably 1 to 100 μm, 2 to 50 μm, 3 to 20 μm, and particularly preferably 5 to 10 μm.

  The width of the spacer layer 2 is preferably 0.02 to 0.5 mm, 0.05 to 0.3 mm, and particularly preferably 0.07 to 0.2 mm. If the width of the spacer layer is too small, the mechanical strength tends to decrease or the production tends to be difficult. On the other hand, if the width of the spacer layer 2 is too large, the area of the spacer layer 2 occupying the surface of the wavelength conversion member main body 1 becomes large, so that the excitation light from the light emitting element 3 is easily scattered or absorbed. The light emission intensity of the light source tends to decrease.

  As the light emitting element 3, for example, a light source such as an LED light source or a laser light source that emits blue light is used.

  As the substrate 4, for example, white LTCC (Low Temperature Co-fired Ceramics) capable of efficiently reflecting the light emitted from the light emitting element 3 is used. Specifically, a sintered body of an inorganic powder such as aluminum oxide, titanium oxide, or niobium oxide and a glass powder can be used.

  Further, as the substrate 4, a material having high thermal conductivity may be used in order to efficiently exhaust heat generated from the light emitting element 3. In particular, it is preferable to use a substrate made of ceramics because of its excellent heat resistance and weather resistance. Specific examples include ceramic substrates such as aluminum oxide and aluminum nitride.

  The reflective layer 5 is provided to reflect light leaking from the light emitting element 3 and the wavelength conversion member 10. The reflection layer 5 is made of a resin (high reflection resin) containing a white pigment such as titanium oxide.

(2) Wavelength Conversion Member According to Second Embodiment FIG. 2 is a schematic perspective view showing a wavelength conversion member according to the second embodiment of the present invention. The wavelength conversion member 20 according to the present embodiment is the wavelength conversion according to the first embodiment in that the spacer layer 2 is provided only in the vicinity of two opposite sides of the peripheral portion of the surface of the wavelength conversion member main body 1. Different from member 10. In this way, since the formation area of the spacer layer 2 can be reduced, the manufacturing cost can be reduced.

(3) Wavelength conversion member according to the third embodiment FIG. 3 is a schematic perspective view showing a wavelength conversion member according to the third embodiment of the present invention. The wavelength conversion member 30 according to the present embodiment is different from the wavelength conversion member 10 according to the first embodiment in that the spacer layer 2 is provided only near the four corners of the wavelength conversion member main body 1. In this way, the formation area of the spacer layer 2 can be further reduced, so that the manufacturing cost can be greatly reduced. In FIG. 3, each spacer layer 2 has a rectangular parallelepiped shape, but may be a cylinder (or a part thereof, for example, a fan-shaped pillar, etc.) or a hemisphere (or a part thereof).

(4) Wavelength Conversion Member According to Fourth Embodiment FIG. 4A is a schematic perspective view showing a wavelength conversion member according to the fourth embodiment of the present invention. The wavelength conversion member 40 according to this embodiment is different from the wavelength conversion member 10 according to the first embodiment in that it has a structure in which two wavelength conversion members 10 according to the first embodiment are connected. Specifically, the wavelength conversion member 40 includes a rectangular plate-shaped wavelength conversion member main body 1 and spacer layers 2 a and 2 b formed on the surface of the wavelength conversion member main body 1. The spacer layer 2 a is formed on the peripheral edge of the surface of the wavelength conversion member main body 1. The spacer layer 2b is formed in a direction parallel to the short side of the wavelength conversion member main body 1 at the central portion of the surface of the wavelength conversion member main body 1, and connects the spacer layers 2a arranged opposite to each other. The spacer layer 2b may not be necessarily formed.

  FIG. 4B is a schematic cross-sectional view showing a light emitting device using the wavelength conversion member according to the fourth embodiment of the present invention. In the light emitting device 400 according to the present embodiment, two light emitting elements 3a and 3b are arranged side by side on the substrate 4, and the wavelength conversion member 40 is placed thereon. The exposed surfaces 1a and 1b of the wavelength conversion member main body 1 in the wavelength conversion member 40 are placed so as to correspond to the light emitting elements 3a and 3b, respectively. A gap is provided between the light emitting elements 3a and 3b, and the reflective layer 5 may be formed in the gap.

  As described above, if the wavelength conversion member 40 according to the present embodiment is used, it can be applied to the light emitting device 400 having a light emitting device having a plurality of light emitting elements.

(5) Wavelength conversion member according to the fifth embodiment FIG. 5A is a schematic perspective view showing the wavelength conversion member according to the first embodiment of the present invention, and FIG. It is typical sectional drawing which shows the light-emitting device using the wavelength conversion member which concerns on 1 embodiment. Similar to the wavelength conversion member 10 according to the first embodiment, the wavelength conversion member 50 includes a wavelength conversion member main body 1 and a spacer layer 2 formed on the peripheral portion of the surface thereof. Here, the wavelength conversion member main body 1 is larger than the light emitting element 3, and in particular, the area of the exposed surface of the wavelength conversion member main body 1 is larger than the area of the light emitting element 3. The spacer layer 2 is larger than the thickness of the light emitting element 3. In the light emitting device 500 using the wavelength conversion member 50 according to the present embodiment, as shown in FIG. 5B, the spacer layer 2 is directly placed on the surface of the substrate 4, and light is emitted inside the spacer layer 3. It has a structure in which the element 3 is fitted.

  In the present embodiment, it is preferable to appropriately adjust the thickness of the spacer layer so as to ensure a desired gap between the light emitting element 3 and the wavelength conversion member main body 1 described above. Specifically, the thickness of the spacer layer is preferably 50 to 300 μm, particularly preferably 100 to 200 μm.

(II) Manufacturing method of wavelength conversion member Next, an example of the manufacturing method of the wavelength conversion member of this invention is demonstrated.
First, a wavelength conversion member main plate for manufacturing a plurality of wavelength conversion members is produced as follows. A slurry containing glass particles serving as a glass matrix and phosphor particles is prepared. The slurry contains organic components such as a binder resin and a solvent. The prepared slurry is applied onto a supporting substrate, and a doctor blade installed at a predetermined interval from the substrate is moved relative to the slurry to form a green sheet. As said support base material, resin films, such as a polyethylene terephthalate, can be used, for example. Subsequently, the wavelength conversion member main plate is obtained by firing the green sheet. In order to obtain a wavelength conversion member main plate having a desired thickness, a plurality of green sheets may be baked and integrated in a stacked state. The firing temperature is preferably within the softening point of glass particles ± 150 ° C., more preferably within the softening point of glass particles ± 100 ° C. If the firing temperature is too low, the glass particles may not soften and flow, and a dense sintered body may not be obtained. On the other hand, if the firing temperature is too high, the phosphor particles 13 are eluted in the glass and the emission intensity is lowered, or the phosphor components are diffused in the glass and the glass is colored to reduce the emission intensity. There is.

  Next, a glass paste layer is formed by applying a glass paste for spacer layer formation to the surface of the wavelength conversion member main plate. Here, the position, area, thickness, shape, and the like for applying the glass paste may be appropriately selected so as to obtain a wavelength conversion member on which a desired spacer layer is formed. For example, in order to obtain the wavelength conversion member 10 according to the first embodiment shown in FIG. 1, as shown in FIG. 6, a lattice-like spacer layer 2 is obtained on the surface of the wavelength conversion member main plate 1 ′. A glass paste layer may be formed as described above. The glass paste can be applied by a known method such as a screen printing method.

The glass paste contains glass powder and organic components such as a binder resin and a solvent. The average particle diameter _{D 50} of the glass powder used is 20μm or less, 10 [mu] m or less, more preferably 5μm or less. When the average particle diameter D ₅₀ of the glass powder is too large, increases the porosity of the spacer layer obtained after firing, the light transmittance tends to decrease. In addition, it becomes difficult to reduce the thickness and width of the spacer layer.

  It is preferable that the glass powder can be sintered at a temperature at which the wavelength conversion member main plate is not deformed in the subsequent firing step. For example, the softening point of the glass powder used for the spacer layer forming glass paste is 100 ° C. or higher, 150 ° C. or higher, particularly 200 ° C. or higher, than the softening point of the glass powder used for producing the original plate for wavelength conversion member body. Preferably it is low.

  Then, by baking the glass paste layer, a spacer layer is formed on the surface of the original plate for wavelength conversion member main body to obtain the original plate for wavelength conversion member. The firing temperature is preferably within the softening point ± 150 ° C. of the glass particles contained in the glass paste, and more preferably within the softening point ± 100 ° C. of the glass particles. If the firing temperature is too low, the glass particles may not soften and flow, and a dense sintered body may not be obtained. On the other hand, if the firing temperature is too high, the glass particles soften and flow too much, making it difficult to obtain a spacer layer having a desired shape. In addition, the wavelength conversion member main plate may be softened and deformed.

  Furthermore, the wavelength conversion member of the present invention can be obtained by cutting the original plate for wavelength conversion member into pieces so as to divide the spacer layer. For example, in FIG. 6, the wavelength conversion member original plate 10 ′ is cut into individual pieces by cutting along a cutting line C that is parallel to each spacer layer 2 and passes through a substantially central portion of each spacer layer 2. The wavelength conversion member 10 according to the first embodiment shown in FIG. 1 can be obtained.

  According to the above manufacturing method, it becomes possible to easily produce a plurality of wavelength conversion members from a single wavelength conversion member main plate. In addition, a wavelength conversion member having a spacer layer with a small line width can be manufactured with high accuracy.

DESCRIPTION OF SYMBOLS 1 Wavelength conversion member main body 1 'Wavelength conversion member main body 2 Spacer layer 3 Light emitting element 4 Substrate 5 Reflection layer 10, 20, 30, 40, 50 Wavelength conversion member 10' Wavelength conversion member original 100, 400, 500 Light-emitting device

Claims (9)

A wavelength conversion member used by being placed above the light emitting element,
A wavelength conversion member body;
Formed on the surface of the wavelength conversion member body, a spacer layer for securing a gap between the wavelength conversion member body and the light emitting element;
A wavelength conversion member comprising:   The wavelength conversion member according to claim 1, wherein the spacer layer is formed on a peripheral portion of the surface of the wavelength conversion member main body.   The wavelength conversion member according to claim 1, wherein the spacer layer is made of a transparent material.   The wavelength conversion member according to claim 1, wherein the spacer layer is made of glass.   The thickness of a spacer layer is 1-100 micrometers, The wavelength conversion member as described in any one of Claims 1-4 characterized by the above-mentioned.   The wavelength conversion member according to any one of claims 1 to 5, wherein the wavelength conversion member main body is formed by dispersing phosphor powder in a glass matrix. A light emitting element;
The wavelength conversion member according to any one of claims 1 to 6 placed above the light emitting device,
With
A light emitting device characterized in that a gap is formed between the light emitting element and the wavelength conversion member main body by the spacer layer.   The light emitting device according to claim 7, wherein a gap between the light emitting element and the wavelength conversion member main body is 1 to 100 μm. It is a method for manufacturing the wavelength conversion member as described in any one of Claims 1-6,
A step of forming a glass paste layer by applying a glass paste for forming a spacer layer on the surface of the wavelength conversion member main plate,
A step of forming a spacer layer on the surface of the original plate for wavelength conversion member body to obtain the original plate for wavelength conversion member by firing the glass paste layer,
A step of cutting the original plate for wavelength conversion member into pieces so as to divide the spacer layer;
The manufacturing method of the wavelength conversion member containing this.