JP2018027034A - Rice tempura flour composition and food processing method therewith - Google Patents
Rice tempura flour composition and food processing method therewith Download PDFInfo
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Abstract
Description
本発明は、天ぷら粉組成物、特に、アレルギー特定原材料である小麦粉を含まない米粉天ぷら粉組成物、及び、それを用いた食品加工方法に関するものである。 The present invention relates to a tempura flour composition, in particular, a rice flour tempura flour composition that does not contain wheat flour, which is an allergy specific raw material, and a food processing method using the same.
食品表示法では、食物アレルギー症状を引き起こすことが明らかである食品のうち、とくに発症者数や症状の重症度が高い食品として７品目（えび、かに、小麦、そば、卵、乳、落花生）を「特定原材料」として定めて表示を義務づけており、２０品目を「特定原材料に準ずるもの」として、可能な限り表示するよう推奨している。 According to the food labeling law, among the foods that are known to cause food allergy symptoms, there are 7 items (shrimp, crab, wheat, buckwheat, egg, milk, peanuts) as foods with a particularly high number of cases and symptoms. Is designated as “specified raw materials” and is required to be displayed, and 20 items are recommended to be displayed as much as possible according to “specified raw materials”.
一般に、家庭で天ぷらを作るときには薄力粉（小麦粉）を用い、天ぷら粉を使う場合でも、天ぷら粉には小麦粉が含まれており、そのために小麦アレルギーの人は天ぷらを食することができなかった。そのような人のために、小麦粉を含まない米粉により天ぷらを揚げるレシピも知られてはいる。 Generally, when tempura is made at home, weak flour (flour) is used, and even when tempura is used, the tempura contains wheat flour, so that people who are allergic to wheat cannot eat tempura. For such people, there are also known recipes for frying tempura with rice flour that does not contain flour.
しかしながら、米粉による天ぷらは、米粉の量を多くすると、天ぷら特有の花が咲いたような衣ができず、ベトッとした感じの天ぷらになってしまう。そのために、被加工食品を絡めるバッター液に卵を入れることも考えられるが、これも食物アレルギー症状を引き起こす「特定原材料」である。 However, if the amount of rice flour is increased, the tempura made from rice flour cannot be dressed as if tempura-specific flowers are in bloom, resulting in a tempura that feels sticky. To that end, it is possible to put eggs in batter liquid that is entangled with processed food, but this is also a “specific raw material” that causes food allergy symptoms.
また、従来の小麦天ぷら粉で揚げた天ぷらの場合は、揚げてから時間が然程経たない間はパリパリとした食感が保たれていても、時間経過とともにベトッとなってしまい、食感が落ちてしまう。このような状況は、時間が経った後の天ぷらを加熱するために電子レンジに入れて処理してもパリッとした食感は戻ってこず、ベトッとした天ぷらになってしまう。これは、揚げた天ぷら粉に吸われる油の量が大きく拘わってくる。 In addition, in the case of tempura fried with conventional wheat tempura flour, the texture becomes crunchy over time even if the crispy texture is kept until it has not passed so long since it is fried. It will fall. In such a situation, even if it is put in a microwave oven to heat the tempura after time, the crisp texture does not return and it becomes a sticky tempura. This is largely related to the amount of oil sucked into the deep-fried tempura.
特許文献１（特開２０１４―２００２２５号公報）には、天ぷらの製造に使用した際に、ヒキが無く、口溶けの良いサクッとした食感の天ぷらを製造することができる天ぷら粉を提供することを課題として、マイクロ波を１００W・秒／g〜７７５W・秒/g照射した処理小麦粉を小麦粉の全質量に対して２〜８７％配合する。マイクロ波処理する前の小麦粉のアミロ粘度は４００B.U.以上の天ぷら粉が開示されている。 Patent Document 1 (Japanese Patent Application Laid-Open No. 2014-200225) provides a tempura powder that can produce a tempura with a crispy texture that has no cracks and melts well when used in the production of tempura. As a subject, 2 to 87% of the processed wheat flour irradiated with microwaves at 100 W · sec / g to 775 W · sec / g is added to the total mass of the flour. A tempura powder having a amylo viscosity of 400 B.U. or more before flour treatment is disclosed.
特許文献２（特開２０１３−１６９１４８号公報）には、油調理時の吸油量を低減させ、レンジアップで加熱復元可能とする油揚げ用衣組成物を提供するために、小麦粉を主成分とするパン粉または天ぷら粉組成物であって、原料粉に水その他を添加した組成物に対しデンプン粉を含む水溶性分散剤に分散させ、こんにゃくマンナン成分換算で組成物の０．１〜０．５重量％のこんにゃくマンナン粉末とこんにゃくマンナン成分の１０分の１以上の重量の水溶性ミネラル成分を添加して調製する。パン粉または天ぷら粉を用いると、冷凍保存後解凍時の離水を抑制して支障なく油調理が可能で、一旦油調理したフライ物を冷蔵保存してもレンジアップで油調理直後の仕上がり感を再現することができる天ぷら粉組成物が開示されている。 Patent Document 2 (Japanese Patent Application Laid-Open No. 2013-169148) includes wheat flour as a main component in order to provide a fried garment composition that reduces the amount of oil absorption during oil cooking and can be heated and restored by range-up. It is a bread crumb or tempura flour composition, which is dispersed in a water-soluble dispersant containing starch flour with respect to a composition obtained by adding water or the like to the raw material flour, and 0.1 to 0.5 weight of the composition in terms of konjac mannan component % Konjac mannan powder and a water-soluble mineral component having a weight of 1/10 or more of the konjac mannan component. By using bread crumbs or tempura flour, it is possible to cook oil without hindrance by suppressing water separation when thawing after freezing storage, and even if fried food that has been cooked once is refrigerated, the finish immediately after oil cooking is reproduced by range up Tempura powder compositions that can be made are disclosed.
特許文献３（特開２０１３―１６２７６７号公報）には、生地のスプレット性に優れ、かつ従来なかったサク味のある食感で、口溶けが良い菓子類が得られる、特に菓子類用小麦粉として用いて好適な小麦粉組成物を提供するために、主としてソフト系小麦からなる原料小麦を常法により製粉して得られた小麦粉であり、平均粒径が１０〜４０μｍの小麦粉で構成され、蛋白含量が４．５〜６．８質量％である小麦粉を、３３〜１００質量％含有する小麦粉組成物。好ましくは、前記小麦粉は、粒径が５〜５５μｍの小麦粉の割合が７５質量％以上の粒度分布を有する小麦粉が開示されている。 Patent Document 3 (Japanese Patent Application Laid-Open No. 2013-162767) is used as a flour for confectionery, in particular, a confectionery excellent in the spreadability of the dough and having a crispy texture that has not been heretofore well melted in the mouth. In order to provide a suitable wheat flour composition, it is a wheat flour obtained by milling raw material wheat mainly composed of soft wheat flour by a conventional method, comprising wheat flour having an average particle size of 10 to 40 μm, and having a protein content The wheat flour composition which contains 33-100 mass% of wheat flour which is 4.5-6.8 mass%. Preferably, the wheat flour has a particle size distribution in which the proportion of wheat flour having a particle size of 5 to 55 μm is 75% by mass or more.
特許文献４（特開２００５−２６１２９６号公報）には、熟成させた小麦粉を使用せずに、しかも熟練を要さずとも、薄衣で食感の歯脆い天ぷらを得ることができる天ぷら粉を提供することを課題として、小麦粉及び膨張剤を主原料成分とする天ぷら粉に、油脂と共にリパーゼを配合してなる天ぷら粉が開示されている。 Patent Document 4 (Japanese Patent Application Laid-Open No. 2005-261296) provides a tempura powder that can obtain a friable tooth tempura with a thin coat without using aged flour and without requiring skill. To solve this problem, a tempura powder is disclosed in which lipase is blended with fats and oils into tempura powder containing wheat flour and a swelling agent as main raw materials.
本発明は、アレルギー特定原材料である小麦粉を含まない米粉天ぷら粉組成物、及び、それを用いた食材の加工方法を提供することを目的とし、さらに、小麦粉を含まない米粉天ぷら粉組成物でもサクサクした食感の天ぷらを提供することを目的とするものである。 An object of the present invention is to provide a rice flour tempura powder composition that does not contain wheat flour, which is an allergic specific raw material, and a food processing method using the same, and even a rice flour tempura powder composition that does not contain flour is crisp. It is intended to provide a tempura with a texture.
本発明の米粉天ぷら粉組成物は、米粉を７０重量部以上８０重量部以下含んだ米粉天ぷら粉であって、ケイ素を２重量部、シュガーエステルを１〜２.５重量部、乳酸カルシウムを３.５〜６.３重量部含んだことを特徴とする。 The rice flour tempura powder composition of the present invention is a rice flour tempura powder containing 70 to 80 parts by weight of rice flour, comprising 2 parts by weight of silicon, 1 to 2.5 parts by weight of sugar ester, and 3 parts of calcium lactate. It is characterized by containing 0.5 to 6.3 parts by weight.
さらに、本発明の米粉天ぷら粉組成物は、ベーキングパウダーを０.８〜１.５重量部、澱粉を１５〜１９.２重量部、カロチンを０.０５重量部からなることを特徴とする。 Furthermore, the rice flour tempura powder composition of the present invention is characterized by comprising 0.8 to 1.5 parts by weight of baking powder, 15 to 19.2 parts by weight of starch, and 0.05 parts by weight of carotene.
さらに、本発明の米粉天ぷら粉組成物は、米粉を７０.５重量部、ケイ素を２重量部、シュガーエステルを２.５重量部、乳酸カルシウムを６.３重量部含んだことを特徴とする。 Furthermore, the rice flour tempura powder composition of the present invention comprises 70.5 parts by weight of rice flour, 2 parts by weight of silicon, 2.5 parts by weight of sugar ester, and 6.3 parts by weight of calcium lactate. .
さらに、本発明の米粉天ぷら粉組成物は、米粉を７１重量部、ケイ素を２重量部、シュガーエステルを１.８重量部、乳酸カルシウムを５.８重量部含んだことを特徴とする。 Furthermore, the rice flour tempura composition of the present invention is characterized by containing 71 parts by weight of rice flour, 2 parts by weight of silicon, 1.8 parts by weight of sugar ester, and 5.8 parts by weight of calcium lactate.
さらに、本発明の米粉天ぷら粉組成物は、米粉を７３重量部、ケイ素を２重量部、シュガーエステルを１.１重量部、乳酸カルシウムを３.５重量部含んだことを特徴とする。 Furthermore, the rice flour tempura powder composition of the present invention comprises 73 parts by weight of rice flour, 2 parts by weight of silicon, 1.1 parts by weight of sugar ester, and 3.5 parts by weight of calcium lactate.
さらに、本発明の米粉天ぷら粉組成物は、米粉を７６重量部、ケイ素を２重量部、シュガーエステルを１.５重量部、乳酸カルシウムを４.５重量部含んだことを特徴とする。 Furthermore, the rice flour tempura composition of the present invention is characterized in that it contains 76 parts by weight of rice flour, 2 parts by weight of silicon, 1.5 parts by weight of sugar ester, and 4.5 parts by weight of calcium lactate.
本発明の食品加工方法は、米粉を７０重量部以上８０重量部以下含み、ケイ素を２重量部、シュガーエステルを１〜２.５重量部、乳酸カルシウムを３.５〜６.３重量部、ベーキングパウダーを０.８〜１.５重量部、澱粉を１５〜１９.２重量部、カロチンを０.０５重量部含んだ米粉天ぷら粉組成物に対して、所定量の水を追加してバッター液を作り、該バッター液を被加工食品に絡めて油により加熱して食品を加工することを特徴とする。 The food processing method of the present invention comprises 70 to 80 parts by weight of rice flour, 2 parts by weight of silicon, 1 to 2.5 parts by weight of sugar ester, 3.5 to 6.3 parts by weight of calcium lactate, A batter by adding a predetermined amount of water to a rice flour tempura powder composition containing 0.8 to 1.5 parts by weight of baking powder, 15 to 19.2 parts by weight of starch, and 0.05 parts by weight of carotene. A liquid is prepared, and the batter liquid is entangled with the processed food and heated with oil to process the food.
さらに、本発明の食品加工方法のバッター液として用いる米粉天ぷら粉組成物は、米粉を７０.５重量部、ケイ素を２重量部、シュガーエステルを２.５重量部、乳酸カルシウムを６.３重量部含んだことを特徴とする。 Furthermore, the rice flour tempura powder composition used as the batter for the food processing method of the present invention comprises 70.5 parts by weight of rice flour, 2 parts by weight of silicon, 2.5 parts by weight of sugar ester, and 6.3 parts by weight of calcium lactate. It is characterized by including a part.
さらに、本発明の食品加工方法のバッター液として用いる米粉天ぷら粉組成物は、米粉を７１重量部、ケイ素を２重量部、シュガーエステルを１.８重量部、乳酸カルシウムを５.８重量部含んだことを特徴とする。 Furthermore, the rice flour tempura powder composition used as the batter liquid for the food processing method of the present invention contains 71 parts by weight of rice flour, 2 parts by weight of silicon, 1.8 parts by weight of sugar ester, and 5.8 parts by weight of calcium lactate. It is characterized by that.
さらに、本発明の食品加工方法のバッター液として用いる米粉天ぷら粉組成物は、米粉を７３重量部、ケイ素を２重量部、シュガーエステルを１.１重量部、乳酸カルシウムを３.５重量部含んだことを特徴とする。 Furthermore, the rice flour tempura powder composition used as the batter liquid for the food processing method of the present invention contains 73 parts by weight of rice flour, 2 parts by weight of silicon, 1.1 parts by weight of sugar ester, and 3.5 parts by weight of calcium lactate. It is characterized by that.
さらに、本発明の食品加工方法のバッター液として用いる米粉天ぷら粉組成物は、米粉を７６重量部、ケイ素を２重量部、シュガーエステルを１.５重量部、乳酸カルシウムを４.５重量部含んだことを特徴とする。 Furthermore, the rice flour tempura powder composition used as the batter liquid for the food processing method of the present invention comprises 76 parts by weight of rice flour, 2 parts by weight of silicon, 1.5 parts by weight of sugar ester, and 4.5 parts by weight of calcium lactate. It is characterized by that.
これにより、アレルギー特定原材料である小麦粉を含まない米粉天ぷら粉組成物により、アレルギーの虞のない米粉天ぷら粉組成物および天ぷらが提供できる。さらに、サクサク感のある米粉天ぷら粉組成物を提供可能となる。 Thereby, the rice flour tempura powder composition and tempura which do not have the allergy fear can be provided by the rice flour tempura powder composition which does not contain wheat flour which is an allergy specific raw material. Furthermore, it is possible to provide a crisp rice flour tempura powder composition.
本発明の米粉天ぷら粉組成物は、米粉を７０重量部以上８０重量部以下含み、ケイ素を２重量部、シュガーエステルを１〜２.５重量部、乳酸カルシウムを３.５〜６.３重量部を含む。 The rice flour tempura composition of the present invention contains 70 to 80 parts by weight of rice flour, 2 parts by weight of silicon, 1 to 2.5 parts by weight of sugar ester, and 3.5 to 6.3 parts by weight of calcium lactate. Part.
さらに、本発明の米粉天ぷら粉組成物は、ベーキングパウダーを０.８〜１.５重量部、澱粉を１５〜１９.２重量部、カロチンを０.０５重量部含む。 Furthermore, the rice flour tempura powder composition of the present invention contains 0.8 to 1.5 parts by weight of baking powder, 15 to 19.2 parts by weight of starch, and 0.05 parts by weight of carotene.
実施例１の米粉天ぷら粉組成物を構成する素材の構成比は以下のとおりである。
ケイ素を２重量部、ベーキングパウダーを１.５重量部、シュガーエステルを２.５重量部、澱粉を１７.２重量部、米粉を７０.５重量部、乳酸カルシウムを６.３重量部、カロチンを０.０５重量部
The composition ratios of the materials constituting the rice flour tempura powder composition of Example 1 are as follows.
2 parts by weight of silicon, 1.5 parts by weight of baking powder, 2.5 parts by weight of sugar ester, 17.2 parts by weight of starch, 70.5 parts by weight of rice flour, 6.3 parts by weight of calcium lactate, carotene 0.05 parts by weight
実施例１の米粉天ぷら粉組成物は、米粉を７０.５重量部として従来に比して多くの米粉量を含ませている。それにより油の吸収量を少なくしている。しかし、従来は、５〜７重量部程度以上の米粉を入れると、米粉特有の餅のようなネチャネチャ感がでて、天ぷらに花が咲いたよう仕上げにならなかった。そこで本発明の実施例１においては、水に溶けない繊維質としてケイ素を２重量部入れ、サクサク感を出すために米粉同士の手を繋がせないように乳酸カリウムを６.３重量部入れ、天ぷらに花を咲かせるために卵白に代えてシュガーエステルを２.５重量部入れている。これにより、アレルギーフリーで、且つ、天ぷらのサクサク感を出すことができている。 The rice flour tempura powder composition of Example 1 contains a larger amount of rice flour than in the past with 70.5 parts by weight of rice flour. This reduces the amount of oil absorbed. However, in the past, when 5 to 7 parts by weight or more of rice flour was added, a feeling of a sticky peculiar to rice flour appeared, and the tempura was not finished like a flower. Therefore, in Example 1 of the present invention, 2 parts by weight of silicon is added as a fiber that is insoluble in water, and 6.3 parts by weight of potassium lactate is added so as not to hold hands between rice flours in order to give a crisp feeling. In order to make tempura bloom, 2.5 parts by weight of sugar ester is added instead of egg white. As a result, allergy is free and the tempura is crisp.
実施例２の米粉天ぷら粉組成物を構成する素材の構成比は以下のとおりである。
ケイ素を２重量部、ベーキングパウダーを０.８重量部、シュガーエステルを１.８重量部、澱粉を１８.６重量部、米粉を７１重量部、乳酸カルシウムを５.８重量部、カロチンを０.０５重量部
The composition ratios of the materials constituting the rice flour tempura powder composition of Example 2 are as follows.
2 parts silicon, 0.8 parts baking powder, 1.8 parts sugar ester, 18.6 parts starch, 71 parts rice flour, 5.8 parts calcium lactate, 0 carotene 0.05 parts by weight
実施例２の米粉天ぷら粉組成物は、より多くの米粉を含有させ、ケイ素、乳酸カリウム、シュガーエステルの量を調整している。これにより、アレルギーフリーで、且つ、天ぷらのサクサク感を出すことができている。 The rice flour tempura powder composition of Example 2 contains more rice flour and adjusts the amounts of silicon, potassium lactate, and sugar ester. As a result, allergy is free and the tempura is crisp.
実施例３の米粉天ぷら粉組成物を構成する素材の構成比は以下のとおりである。
ケイ素を２重量部、ベーキングパウダーを１.２重量部、シュガーエステルを１.１重量部、澱粉を１９.２重量部、米粉を７３重量部、乳酸カルシウムを３.５重量部、カロチンを０.０５重量部
The composition ratios of the materials constituting the rice flour tempura powder composition of Example 3 are as follows.
2 parts by weight of silicon, 1.2 parts by weight of baking powder, 1.1 parts by weight of sugar ester, 19.2 parts by weight of starch, 73 parts by weight of rice flour, 3.5 parts by weight of calcium lactate, 0 parts of carotene 0.05 parts by weight
実施例３の米粉天ぷら粉組成物は、さらに多くの米粉を含有させ、ケイ素、乳酸カリウム、シュガーエステルの量を調整している。これにより、アレルギーフリーで、且つ、天ぷらのサクサク感を出すことができている。 The rice flour tempura powder composition of Example 3 contains more rice flour and adjusts the amounts of silicon, potassium lactate, and sugar ester. As a result, allergy is free and the tempura is crisp.
実施例４の米粉天ぷら粉組成物を構成する素材の構成比は以下のとおりである。
ケイ素を２重量部、ベーキングパウダーを１重量部、シュガーエステルを１.５重量部、澱粉を１５重量部、米粉を７６重量部、乳酸カルシウムを４.５重量部、カロチンを０.０５重量部
The composition ratios of the materials constituting the rice flour tempura powder composition of Example 4 are as follows.
2 parts by weight of silicon, 1 part by weight of baking powder, 1.5 parts by weight of sugar ester, 15 parts by weight of starch, 76 parts by weight of rice flour, 4.5 parts by weight of calcium lactate, and 0.05 parts by weight of carotene
実施例４の米粉天ぷら粉組成物は、極めて多くの米粉を含有させ、ケイ素、乳酸カリウム、シュガーエステルの量を調整している。これにより、アレルギーフリーで、且つ、天ぷらの好ましいサクサク感を出すことができている。 The rice flour tempura powder composition of Example 4 contains an extremely large amount of rice flour and adjusts the amounts of silicon, potassium lactate, and sugar ester. As a result, allergy is free and a crisp preferable crispness can be produced.
従来の天ぷら粉組成物と、本発明の実施例１及び４の米粉天ぷら粉組成物で作ったバッター液の油の吸油量の差を比較してみた。 The difference of the oil absorption of the batter liquid made with the conventional tempura flour composition and the rice flour tempura flour compositions of Examples 1 and 4 of the present invention was compared.
試験方法は以下のとおりである。
比較対象とその加水率は下記のとおりである。
（１）市販天ぷら粉 加水率 ５００％
（２）実施例１ 加水率 ５００％
（３）実施例４ 加水率 ２００％
上記（１），（２）及び（３）を対象とし、それぞれの加水率で溶解し、各１２ｇのバッター液を作成する。
次いで、１７０℃の油で２分間素揚げ後、５分間油切りして重量を計測したものである。
The test method is as follows.
The comparison target and its water content are as follows.
(1) Commercial tempura powder with water content of 500%
(2) Example 1 Water content 500%
(3) Example 4 Water content 200%
The above (1), (2), and (3) are targeted, and dissolved at their respective hydrolysis rates to make 12 g of batter solution.
Next, after frying for 2 minutes with 170 ° C. oil, the oil was drained for 5 minutes and the weight was measured.
図２の実験結果は、上記（１）（２）（３）の天ぷら粉を素揚げしたものを夫々１２ｃｍの円を描いたキッチンペーパー上に載せて油の染み出し量の大きさを比較したものである。図２の実験結果によれば、従来の天ぷら粉の吸油量と比較して、本発明の実施例１の吸油量が少ないことが分かる。また、本発明の実施例４の吸油量は、従来の天ぷら粉と比較して半分程度であり、特に少ないことが分かる。 The experimental results shown in FIG. 2 were obtained by comparing the amount of oil exudation by placing the deep-fried tempura powder from the above (1), (2), and (3) on a kitchen paper with a circle of 12 cm. Is. According to the experimental result of FIG. 2, it can be seen that the oil absorption amount of Example 1 of the present invention is smaller than the oil absorption amount of the conventional tempura powder. Moreover, it turns out that the oil absorption amount of Example 4 of this invention is about half compared with the conventional tempura powder, and is especially small.
このように、本発明の実施例の吸油量が少ないことにより、サクサクした食感が長く維持され、電子レンジにより再加熱してもサクサク感が失われない米粉天ぷら粉組成物を提供できるものである。 As described above, the oil absorption amount of the embodiment of the present invention can provide a rice flour tempura composition that maintains a crispy texture for a long time and does not lose a crispy texture even when reheated by a microwave oven. is there.
Claims (7)
ベーキングパウダーを０.８〜１.５重量部、澱粉を１５〜１９.２重量部、カロチンを０.０５重量部からなることを特徴とする米粉天ぷら粉組成物。 In the rice flour tempura composition according to claim 1,
A rice flour tempura composition comprising 0.8 to 1.5 parts by weight of baking powder, 15 to 19.2 parts by weight of starch, and 0.05 parts by weight of carotene.
米粉を７０.５重量部、ケイ素を２重量部、シュガーエステルを２.５重量部、乳酸カルシウムを６.３重量部含んだことを特徴とする米粉天ぷら粉組成物。 In the rice flour tempura composition according to claim 2,
A rice flour tempura composition comprising 70.5 parts by weight of rice flour, 2 parts by weight of silicon, 2.5 parts by weight of sugar ester, and 6.3 parts by weight of calcium lactate.
米粉を７１重量部、ケイ素を２重量部、シュガーエステルを１.８重量部、乳酸カルシウムを５.８重量部含んだことを特徴とする米粉天ぷら粉組成物。 In the rice flour tempura composition according to claim 2,
A rice flour tempura composition comprising 71 parts by weight of rice flour, 2 parts by weight of silicon, 1.8 parts by weight of sugar ester, and 5.8 parts by weight of calcium lactate.
米粉を７３重量部、ケイ素を２重量部、シュガーエステルを１.１重量部、乳酸カルシウムを３.５重量部含んだことを特徴とする米粉天ぷら粉組成物。 In the rice flour tempura composition according to claim 2,
A rice flour tempura composition comprising 73 parts by weight of rice flour, 2 parts by weight of silicon, 1.1 parts by weight of sugar ester, and 3.5 parts by weight of calcium lactate.
米粉を７６重量部、ケイ素を２重量部、シュガーエステルを１.５重量部、乳酸カルシウムを４.５重量部含んだことを特徴とする米粉天ぷら粉組成物。 In the rice flour tempura composition according to claim 2,
A rice flour tempura composition comprising 76 parts by weight of rice flour, 2 parts by weight of silicon, 1.5 parts by weight of sugar ester, and 4.5 parts by weight of calcium lactate.
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| JP2016159866A JP2018027034A (en) | 2016-08-17 | 2016-08-17 | Rice tempura flour composition and food processing method therewith |
| PCT/JP2017/029287 WO2018034267A2 (en) | 2016-08-17 | 2017-08-14 | Rice flour–based tempura flour composition and food processing method using same |
| TW106127794A TW201811194A (en) | 2016-08-17 | 2017-08-16 | Composition of rice tempura flour and food processing method using the same |
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| JP2016159866A JP2018027034A (en) | 2016-08-17 | 2016-08-17 | Rice tempura flour composition and food processing method therewith |
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| JPS5116932B2 (en) * | 1972-06-10 | 1976-05-28 | ||
| JPS58162252A (en) * | 1982-03-24 | 1983-09-26 | Nitto Seifun Kk | Flour mix for tempura (japanese deep-fat fried food) |
| JP3091982B2 (en) * | 1992-03-03 | 2000-09-25 | 日本製粉株式会社 | Fried food, fried food ingredients and mixes for fried food |
| JP2010104246A (en) * | 2008-10-28 | 2010-05-13 | Nitto Fuji Flour Milling Co Ltd | Tempura mix powder, and tempura |
| JP5877638B2 (en) * | 2010-12-24 | 2016-03-08 | 日清オイリオグループ株式会社 | Fried food |
| JP5828709B2 (en) * | 2011-08-10 | 2015-12-09 | 日本製粉株式会社 | Tempura clothing flour composition containing rice flour and tempura using the same |
| CN104768394B (en) * | 2012-12-04 | 2017-09-22 | 不二制油股份有限公司 | granular starch composition |
| JP6255214B2 (en) * | 2013-10-29 | 2017-12-27 | 昭和産業株式会社 | Tempura batter mix |
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