JP2018022800A - Stage, jig for adjusting stage, adjustment method for adjusting stage - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve positioning of each post of a stage for supporting a substrate.SOLUTION: A stage for supporting a substrate, adjusted by a substrate for adjustment, includes a base, and multiple posts positioned for the base, and supporting the substrate. The post has a support configured to support the substrate for adjustment and the support, and an insertion shaft for attachment to the base. The base has a first engaging part provided at the first position of the base, and engaging with a jig pin for aligning the center of the substrate for adjustment and the center of the base, and long holes provided at positions separated from the first engaging part, and where the insertion shaft of the post is arranged.SELECTED DRAWING: Figure 22

Description

  The present invention relates to a stage for supporting or holding a substrate such as a semiconductor wafer, a method for adjusting the stage, and a jig for adjusting the stage. The substrate includes a work in which a semiconductor wafer is bonded onto a glass substrate.

  In semiconductor manufacturing equipment, when any treatment (chemical / mechanical processing, transport to the next process) is performed on a substrate such as a semiconductor wafer, it is necessary to transport the substrate from the current position to the position of the next process in the apparatus. is there. At this time, the substrate is moved using a substrate transfer robot or a transfer mechanism using various power devices. A stage for placing the substrate is prepared at the destination of the substrate, and from there, the transfer robot takes out the substrate and moves it to another location, or the stage itself moves and moves the substrate to another location. Move to. As described above, the substrate on the stage needs to be held so as not to be displaced on the stage in order to surely carry out the next delivery.

  As the simplest stage structure, there is a structure in which several support parts (for example, posts) with steps are attached to a plate-like base (base) so as to be arranged around the substrate. This post is easy to manufacture and is often cylindrical in order to minimize the contact area with the substrate. Further, if the gap between the post and the substrate is made as small as possible, the positional displacement of the substrate is small, and the delivery of the substrate can be carried out reliably.

  Conventionally, in the stage having such a structure, the gap between the post and the substrate depends on the processing accuracy of the post and the processing accuracy of the hole position of the base for fixing the post. Therefore, the size of the gap between the post and the board varies due to the machining accuracy of each component, and the positional deviation of the board may increase. If such a stage is used, the substrate may not be delivered successfully, which may result in a conveyance error.

  Examples of the conventional stage include those described in Patent Document 1 and Patent Document 2. Patent Document 1 describes a configuration in which eight guide pieces 23 are provided around the storage portion 11 of the transfer hand 1, and the wafer 100 is guided and supported by these guide pieces 23 (Patent Document 1). 1 of FIG. However, with this configuration, the gap between the guide piece 23 and the wafer 100 may vary due to the processing accuracy of the guide piece 23 and the like. 23 and 24 of Patent Document 2 describe a temporary placement unit 130 configured to support the wafer W by posts 132 provided at the four corners of the base plate 131. Also in this configuration, the gap between the post 132 and the wafer W may vary due to the processing accuracy of the post 132 and the mounting hole.

JP-A-9-277161 International Publication No. 2007/099976

In order to reduce substrate transport mistakes in semiconductor manufacturing equipment, the gap between the substrate and post must be kept at a predetermined value on the stage that holds the substrate (with the post attached to the base) to reduce the deviation of the substrate. I must. When using parts that have been machined with high precision in order to reduce the deviation, there is a problem that the cost increases.

  Further, if the machining accuracy of each part is improved, it is possible to reduce the variation in the gap, but it is difficult to completely match the size of the gap between a plurality of stages.

  Furthermore, in recent years, wafers used in semiconductor manufacturing apparatuses have a tendency to increase in diameter, and it has become more difficult than before to process holes in a base to which posts are attached with sufficient accuracy. This is because it is more difficult to achieve the same accuracy (within ± ˜mm) when the distance between the holes is smaller than when the distance is smaller.

Further, a method of reducing the displacement of the position of the substrate by providing and adjusting a movable range on the post is also conceivable. In this case, unless the plurality of posts are moved and adjusted uniformly, the center of the base and the center of the substrate are shifted. In addition, the performance of the operator to be adjusted is not good or bad, and it is difficult for even a skilled worker to make the same adjustment for all products.
An object of the present invention is to solve at least a part of the problems described above.

  [1] One embodiment of the present invention relates to a stage for supporting a substrate, which is adjusted by an adjustment substrate. The stage includes a base and a plurality of posts positioned with respect to the base and supporting the substrate. The post includes the adjustment substrate and a support portion configured to support the substrate, and an insertion shaft portion attached to the base. The base is in the center of the base, and the adjustment is performed. A first engagement portion that engages with a jig pin for alignment between the center of the substrate for use and the first position on the base; and a position spaced from the first engagement portion; And a plurality of elongated holes in which the insertion shaft portion is disposed. The first position is a specific position that is aligned with the center of the substrate, and is also referred to as a substrate positioning position. The first position is a specific position that is aligned with the center of the substrate, and is also referred to as a substrate positioning position. The first position can be set, for example, at a position on the center or center line of the stage or base, but is not limited thereto. The first position can be any position on the stage (base) as long as a post for supporting the substrate can be disposed around the first position on the stage (base).

In this case, the jig pin is engaged with the first position (substrate positioning position) on the base of the stage and the center of the adjustment substrate larger than the radius of the substrate used in the actual process, and the adjustment substrate. Each post is reciprocated within the insertion hole (long hole) of the base until the post uniformly contacts each post. Therefore, the first position on the stage (base) matches the center of the adjustment substrate, and the distance between each post and the first position is uniform. For this reason, when the stage holds a substrate having a smaller radius than the adjustment substrate, the gap between each post and the substrate is also constant and uniform. As a result, it is possible to suppress variations in the alignment of the substrate between the plurality of stages and accurately align the substrate with a certain position with respect to the stage.
Further, in order to adjust the position of each post in a state where the first position on the stage is aligned with the center of the adjustment substrate by the jig pins, the first position on the stage and the adjustment substrate It is possible to prevent deviation from the center. As a result, it is possible to suppress or prevent the first position on the stage and the center of the substrate from shifting when the substrate W used in the actual process is supported on the stage.
In addition, the stage according to the present embodiment is provided with a first engagement portion for engaging with a jig pin at a substrate positioning position on the base, and a long hole for inserting a post may be provided. There is no need to make significant changes.
By adjusting the position of the post in the stage after manufacture, the substrate can be positioned accurately, so that the increase in cost is suppressed or prevented compared to the case where high precision machining is used in the manufacture of the stage. can do.
In addition, since the position of the post is adjusted by the adjustment substrate whose center coincides with the substrate positioning position on the stage, the distance from the substrate positioning position on the stage to each post is prevented from varying between multiple stages or Can be prevented. As a result, it is possible to suppress or prevent the position of the substrate (substrate support position with respect to the stage) from varying between the plurality of stages.
Furthermore, since the substrate can be accurately positioned by adjusting the position of the post in the stage after manufacture, variations in the adjustment accuracy of the post can be suppressed or prevented even for a large-diameter substrate. .
In addition, since the position of the post is adjusted by aligning the substrate positioning position on the stage with the center of the adjustment substrate using the jig pins, the variation in adjustment for each product is suppressed regardless of the skill of the operator to adjust. Or it can be prevented.

[2] In the stage described in [1], the first engagement portion is a hole provided in the first position for inserting the jig pin.
In this case, the center of the base and the adjustment substrate can be easily aligned by inserting jig pins into the holes of the base.

[3] In the stage according to [1], the first engagement portion is a protrusion provided at the first position, and a first insertion hole is provided at a bottom portion of the jig pin, The protrusion of the first engaging portion is inserted into the first insertion hole of the pin.
In this case, the first position of the base and the center of the adjustment substrate can be easily aligned by fitting the first insertion hole of the jig pin into the protrusion of the base.

[4] In the stage according to any one of [1] to [3], the elongated hole of the base extends radially outward of the adjustment substrate when the adjustment substrate is installed. .
Since the direction in which the elongated hole of the base extends coincides with the radial direction of the adjustment substrate, the position adjustment of the post is easy.

[5] In the stage according to any one of [1] to [3], the base is substantially rectangular, and the elongated hole extends along a long side or a short side of the base.
In this case, it is possible to reduce the change in the distance of the post from the base center (the amount of movement in the radial direction of the post) relative to the amount of movement of the post within the long hole. A highly accurate adjustment of the contact position is facilitated.

[6] In the stage according to any one of [1] to [3], the base is substantially rectangular, one of the two adjacent long holes extends along a long side of the base, and the other is the It extends along the short side of the base.
In this case, it is possible to reduce the change in the distance of the post from the base center (the amount of movement in the radial direction of the post) relative to the amount of movement of the post within the long hole. A highly accurate adjustment of the contact position is facilitated.

[7] The stage according to any one of [1] to [6], wherein the support portion of the post is reduced in diameter toward a side opposite to the insertion side of the post to the base. And a second support section having a substantially constant diameter located on the opposite side of the first support section from the insertion side.
In this case, it is possible to adjust the outer edge of the adjustment substrate so as to contact the second support section of the post, and to support the substrate used in the actual process by the first support section. Therefore, the adjustment position of the post by the adjustment substrate can be confirmed easily and accurately.

[8] In the stage according to any one of [1] to [7], the jig pin is formed integrally with the adjustment substrate at the center of the adjustment substrate, or different from the adjustment substrate. And can be attached to the center of the adjustment substrate.
The jig pin can be aligned with the center of the adjustment substrate by integrally forming or attaching the jig pin to the center of the adjustment substrate.

[9] In the stage according to any one of [1] to [8], the bottom of the elongated hole extends along a direction in which the elongated hole extends, and is opposite to the opening side of the elongated hole. A through hole penetrating the surface of the base is formed, and a fastening member for fixing the post can be inserted into the through hole.
The post-position-adjusted post is firmly fixed by the fastening member in the long hole, and it is possible to suppress or prevent the position of the post from shifting when the substrate is placed.

  [10] One embodiment of the present invention relates to a jig for adjusting a stage for supporting a substrate. The jig includes an adjustment substrate having a diameter larger than the diameter of the substrate by a predetermined length, and a jig pin for aligning the center of the adjustment substrate and the first position on the base of the stage; Is provided. The jig pin is formed integrally with the adjustment substrate at the center of the adjustment substrate, or is separate from the adjustment substrate and can be attached to the center of the adjustment substrate. The first position is a specific position that is aligned with the center of the substrate, and is also referred to as a substrate positioning position. The first position is a specific position that is aligned with the center of the substrate, and is also referred to as a substrate positioning position. The first position can be set, for example, at a position on the center or center line of the stage or base, but is not limited thereto. The first position can be any position on the stage (base) as long as a post for supporting the substrate can be disposed around the first position on the stage (base).

In this adjustment jig, the jig pin is engaged with the first position (substrate positioning position) on the base of the stage and the center of the adjustment substrate larger than the radius of the substrate used in the actual process, Each post can be moved until the adjustment substrate abuts uniformly on each post. For example, a long hole is provided in the base, and the post is moved in the long hole. As a result, the first position on the stage (base) matches the center of the adjustment substrate, and the distance between each post and the first position is uniform. For this reason, when the stage holds a substrate having a smaller radius than the adjustment substrate, the gap between each post and the substrate is also constant and uniform. As a result, it is possible to suppress variations in substrate alignment among a plurality of stages and accurately align the substrate with a certain position with respect to the stage.
Further, in order to adjust the position of each post in a state where the first position on the stage is aligned with the center of the adjustment substrate by the jig pins, the first position on the stage and the adjustment substrate It is possible to prevent deviation from the center. As a result, it is possible to suppress or prevent the first position on the stage and the center of the substrate from shifting when the substrate W used in the actual process is supported on the stage.
Further, the adjustment jig and the stage can be applied without significant change. For example, at a first position on the base of the stage, an engaging portion (center hole, protrusion) for engaging with the jig pin may be provided, and a long hole for inserting the post may be provided.
In addition, since the substrate can be accurately positioned by adjusting the position of the post in the stage after manufacture, the increase in cost is suppressed compared to the case of relying on high-precision machining in stage manufacture. Or it can be prevented.
In addition, since the position of the post is adjusted by the adjustment substrate whose center coincides with the substrate positioning position on the stage, the distance from the substrate positioning position on the stage to each post is prevented from varying between multiple stages or Can be prevented. As a result, it is possible to suppress or prevent the position of the substrate (substrate support position with respect to the stage) from varying between the plurality of stages.
Furthermore, since the substrate can be accurately positioned by adjusting the position of the post in the stage after manufacture, variations in the adjustment accuracy of the post can be suppressed or prevented even for a large-diameter substrate. .
In addition, since the position of the post is adjusted by matching the positioning position on the stage and the center of the adjustment substrate with the jig pins, the variation in adjustment for each product can be suppressed or adjusted regardless of the skill of the operator to adjust. Can be prevented.
Since the adjustment jig can be composed of an adjustment substrate and jig pins for attaching the center of the adjustment substrate to the substrate positioning position on the stage, the adjustment jig can be configured easily.

[11] In the jig according to [10], the jig pin has a first insertion shaft portion that can be fitted into a hole at a first position of the base.
By fitting the first insertion shaft portion of the jig pin into the first position center hole on the base, the center of the base and the adjustment substrate can be easily aligned.

[12] In the jig according to [10], the jig pin has a first insertion hole that fits into a protrusion provided at a first position on the base.
By fitting the first insertion hole of the jig pin into the protrusion of the base, the first position of the base and the center of the adjustment substrate can be easily aligned.

[13] In the jig according to any one of [10] to [12], the adjustment substrate has a protrusion at a center thereof, and the jig pin is fitted to the protrusion of the adjustment substrate. A second insertion hole.
By fitting the protrusion of the adjustment substrate into the second insertion hole of the jig pin, the center of the base and the adjustment substrate can be easily aligned.

[14] The jig according to any one of [10] to [12], wherein the adjustment substrate has a center hole at a center thereof, and the jig pin is inserted into the center hole of the adjustment substrate. The second insertion shaft portion is provided.
By fitting the center hole of the adjustment substrate to the second insertion shaft portion of the jig pin, the centers of the base and the adjustment substrate can be easily aligned.

[15] In the jig according to [11], the jig pin has a main body portion having a diameter larger than that of the first insertion shaft portion, and a step difference of the main body portion with respect to the first insertion shaft portion. The jig pin is attached to the base in contact with the base.
In this case, the attachment position of the jig pin to the base can be accurately defined.

[16] In the jig according to [14], the jig pin has a main body portion having a diameter larger than that of the second insertion shaft portion, and a step difference of the main body portion with respect to the second insertion shaft portion. The jig pins are attached to the adjustment substrate in contact with the adjustment substrate.
In this case, the attachment position of the jig pin to the adjustment substrate can be accurately defined.

[17] One embodiment of the present invention relates to a method for adjusting a stage for supporting a substrate. The adjustment method is a stage including a base and a plurality of posts, wherein the base is provided at a first position for positioning the substrate and spaced apart from the first position, and each post is disposed. Preparing the stage having a plurality of elongated holes, preparing an adjustment substrate having a size larger than the substrate, and a jig pin, and replacing each post with each elongated hole in the base A step of aligning the first position on the base and the center of the adjustment substrate via the jig pins, and adjusting each post of the base according to the dimensions of the adjustment substrate. Moving the inside of the elongated hole to adjust the contact position between the adjustment substrate and each post. The first position is a specific position that is aligned with the center of the substrate, and is also referred to as a substrate positioning position. The first position can be set, for example, at a position on the center or center line of the stage or base, but is not limited thereto. The first position can be any position on the stage (base) as long as a post for supporting the substrate can be disposed around the first position on the stage (base).

In this case, the first position (substrate positioning position) on the stage and the center of the adjustment substrate larger than the radius of the substrate used in the actual process are aligned via the jig pins, and the adjustment substrate is aligned. Each post is reciprocated within the insertion hole (long hole) of the base until the post uniformly contacts each post. Therefore, the first position on the stage (base) matches the center of the adjustment substrate, and the distance between each post and the first position is uniform. For this reason, when the stage holds a substrate having a smaller radius than the adjustment substrate, the gap between each post and the substrate is also constant and uniform. As a result, it is possible to suppress variations in the alignment of the substrate between the plurality of stages and accurately align the substrate with a certain position with respect to the stage.
Further, in order to adjust the position of each post in a state where the first position on the stage is aligned with the center of the adjustment substrate by the jig pins, the first position on the stage and the adjustment substrate It is possible to prevent deviation from the center. As a result, it is possible to suppress or prevent the first position on the stage and the center of the substrate from shifting when the substrate W used in the actual process is supported on the stage.
Moreover, the stage of this embodiment has only to provide an engaging portion for engaging with the jig pin at the substrate positioning position on the base, and to provide a long hole for inserting the post. There is no need to change to
By adjusting the position of the post in the stage after manufacture, the substrate can be positioned accurately, so that the increase in cost is suppressed or prevented compared to the case where high precision machining is used in the manufacture of the stage. can do.
In addition, since the position of the post is adjusted by the adjustment substrate whose center coincides with the substrate positioning position on the stage, the distance from the substrate positioning position on the stage to each post is prevented from varying between multiple stages or Can be prevented. As a result, it is possible to suppress or prevent the position of the substrate (substrate support position with respect to the stage) from varying between the plurality of stages.
Furthermore, since the substrate can be accurately positioned by adjusting the position of the post in the stage after manufacture, variations in the adjustment accuracy of the post can be suppressed or prevented even for a large-diameter substrate. .
In addition, since the position of the post is adjusted by aligning the substrate positioning position on the stage with the center of the adjustment substrate using the jig pins, the variation in adjustment for each product is suppressed regardless of the skill of the operator to adjust. Or it can be prevented.

[18] In the method according to [17], the jig pin is formed integrally with the adjustment substrate at a center of the adjustment substrate, and the positioning step includes the step of positioning the jig pin. Attaching to a first position on the base.
In this case, it is not necessary to attach jig pins to the adjustment substrate, and the adjustment work is simplified.

[19] In the method according to [17], the jig pin is separate from the adjustment substrate, and the positioning step includes the step of aligning each end of the jig pin on the base. 1 and mounting at the center of the adjustment substrate.
Since the adjustment substrate and the jig pin can be stored with the jig pin removed from the adjustment substrate, the storage space for the adjustment jig can be saved.

1 is a plan view showing an overall configuration of an exemplary polishing apparatus according to an embodiment. It is a perspective view which shows the outline of a grinding | polishing apparatus. It is a perspective view which shows an example swing transporter. It is a perspective view which shows a temporary placement part. It is a perspective view which shows the state which the temporary placement part fell. It is a top view which shows the holding part of a swing transporter. It is a side view of the holding part of a swing transporter. It is an expanded side view of the top of the holding part of a swing transporter. It is a front view of an exemplary linear transporter. It is a top view of a linear transporter. It is a top view of the conveyance stage of a linear transporter. It is a side view of the conveyance stage of a linear transporter. It is an enlarged side view of the pin of the conveyance stage of a linear transporter. It is a perspective view which shows an example reversing machine. It is a top view of a reversing machine. It is a side view of a reversing machine. It is a longitudinal cross-sectional view which shows the opening / closing mechanism of a reversing machine. It is a longitudinal cross-sectional view which shows the opening / closing mechanism of a reversing machine, and is a figure which shows the state which releases a wafer. It is a longitudinal cross-sectional view which shows a lifter. It is a top view which shows the stage of a lifter. It is a side view which shows the stage of a lifter. It is a partial expanded side view which shows the nail | claw of the stage of a lifter. It is a perspective view which shows the conveyance unit of a washing | cleaning part. It is a perspective view of the stage which concerns on a comparative example. It is a partially cutaway side view of the stage which concerns on a comparative example. It is a perspective view of the stage which concerns on one Embodiment. It is a top view of a base. It is the perspective view seen from the opposite side to the insertion side of a post. It is the perspective view seen from the insertion side of a post. It is a perspective view of an adjustment jig. It is a partially cutaway side view of a stage in a state where an adjustment jig is installed. It is the perspective view seen from the 2nd surface side of a base, and shows fixation of the post by a fastening member. It is an expansion perspective view of the fastening member in the 2nd surface side of a base. It is a partially cutaway side view of a stage in a state where an adjustment jig is installed after adjustment. It is a partially cutaway side view of the stage after adjustment in the state where the substrate used in the actual process is supported. It is a top view of the base concerning the 1st modification. It is a top view of the base concerning the 2nd modification. It is a top view of the base concerning the 3rd modification. It is sectional drawing which shows the modification of the engagement structure of a jig | tool pin and a base. It is sectional drawing which shows the modification of the engagement structure of a jig | tool pin and the board | substrate for adjustment. It is sectional drawing which shows the modification of the engagement structure of a jig | tool pin, the board | substrate for adjustment, and a base. It is a top view of a base when the engaging position of a jig | tool pin exists in a position different from the center of a stage. It is a perspective view of the adjustment jig which formed the jig | tool pin and the board | substrate for adjustment integrally.

  Embodiments of the present invention will be described below with reference to the accompanying drawings. As an example, a semiconductor wafer polishing apparatus similar to that disclosed in International Publication No. 2007/099976 (Patent Document 2) is taken up. In the accompanying drawings, the same or corresponding components are denoted by the same reference numerals, and redundant description is omitted. Further, in the polishing apparatus described below, a known configuration or a configuration disclosed in the pamphlet of International Publication No. 2007/099976 can be adopted except for the structure related to the transfer stage, and thus detailed description thereof will be omitted. .

(First embodiment)
FIG. 1 is a plan view showing an overall configuration of an exemplary polishing apparatus according to an embodiment. FIG. 2 is a perspective view schematically showing the polishing apparatus. As shown in FIG. 1, the polishing apparatus includes a substantially rectangular housing 1, and the interior of the housing 1 includes a load / unload section 2 and a polishing section 3 (3a, 3b) by partition walls 1a, 1b, 1c. It is partitioned into a cleaning unit 4. The load / unload unit 2, the polishing units 3a and 3b, and the cleaning unit 4 are assembled independently and exhausted independently. In the following description, a semiconductor wafer will be described as an example, but the present invention can be applied to a work in which a semiconductor wafer is bonded to a glass substrate and other substrates.

  The load / unload unit 2 includes two or more (four in this embodiment) front load units 20 on which a wafer cassette for stocking a large number of semiconductor wafers is placed. These front load portions 20 are arranged adjacent to each other in the width direction (direction perpendicular to the longitudinal direction) of the polishing apparatus. The front load unit 20 can be equipped with an open cassette, a SMIF (Standard Manufacturing Interface) pod, or a FOUP (Front Opening Unified Pod). Here, SMIF and FOUP are sealed containers that can maintain an environment independent of the external space by accommodating a wafer cassette inside and covering with a partition wall.

  The polishing unit 3 is a region where a semiconductor wafer is polished, and includes a first polishing unit 3a having a first polishing unit 30A and a second polishing unit 30B, a third polishing unit 30C, and a fourth polishing unit 30D. The 2nd grinding | polishing part 3b which has these inside. The first polishing unit 30A, the second polishing unit 30B, the third polishing unit 30C, and the fourth polishing unit 30D are arranged along the longitudinal direction of the apparatus as shown in FIG.

  As shown in FIG. 1, the first polishing unit 30A includes a polishing table 300A having a polishing surface, a top ring 301A for holding a semiconductor wafer and polishing the semiconductor wafer while pressing the semiconductor wafer against the polishing table 300A, A polishing liquid supply nozzle 302A for supplying a polishing liquid or a dressing liquid (for example, water) to the polishing table 300A, a dresser 303A for dressing the polishing table 300A, a liquid (for example, pure water), and a gas (for example, nitrogen). ), And an atomizer 304A that mists the mixed fluid or liquid (for example, pure water) from one or a plurality of nozzles onto the polishing surface. Similarly, the second polishing unit 30B includes a polishing table 300B, a top ring 301B, a polishing liquid supply nozzle 302B, a dresser 303B, and an atomizer 304B. The third polishing unit 30C includes a polishing table. 300C, a top ring 301C, a polishing liquid supply nozzle 302C, a dresser 303C, and an atomizer 304C. The fourth polishing unit 30D includes a polishing table 300D, a top ring 301D, and a polishing liquid supply nozzle 302D. , A dresser 303D and an atomizer 304D.

Between the first polishing unit 30A and the second polishing unit 30B of the first polishing unit 3a and the cleaning unit 4, four transfer positions along the longitudinal direction (first transfer in order from the load / unload unit 2 side). A first linear transporter 5 for transferring the wafer is disposed between the position TP1, the second transfer position TP2, the third transfer position TP3, and the fourth transfer position TP4. Above the first transfer position TP1 of the first linear transporter 5, a reversing machine 31 for inverting the wafer received from the transfer robot 22 of the load / unload unit 2 is arranged, and below it is vertically moved. A lifter 32 that can be raised and lowered is disposed. A pusher 33 that can be moved up and down is disposed below the second transport position TP2, and a pusher 34 that can be moved up and down is disposed below the third transport position TP3. A shutter 12 is provided between the third transport position TP3 and the fourth transport position TP4.

  In addition, the second polishing unit 3b is adjacent to the first linear transporter 5 and has three transfer positions along the longitudinal direction (the fifth transfer position TP5 and the sixth transfer in order from the load / unload unit 2 side). A second linear transporter 6 for transferring the wafer between the position TP6 and the seventh transfer position TP7 is disposed. A pusher 37 is disposed below the sixth transport position TP6 of the second linear transporter 6, and a pusher 38 is disposed below the seventh transport position TP7. A shutter 13 is provided between the fifth transport position TP5 and the sixth transport position TP6.

  The cleaning unit 4 is an area for cleaning the polished semiconductor wafer, and includes a reversing machine 41 that reverses the wafer, four cleaning machines 42 to 45 that clean the polished semiconductor wafer, a reversing machine 41, and a cleaning machine 42. And a transfer unit 46 for transferring a wafer between .about.45. The reversing machine 41 and the washing machines 42 to 45 are arranged in series along the longitudinal direction. In addition, a filter fan unit (not shown) having a clean air filter is provided above the washing machines 42 to 45, and clean air from which particles have been removed by this filter fan unit is always directed downward. Is blowing. Further, the inside of the cleaning unit 4 is constantly maintained at a pressure higher than that of the polishing unit 3 in order to prevent inflow of particles from the polishing unit 3.

As shown in FIG. 1, between the first linear transporter 5 and the second linear transporter 6, between the first linear transporter 5, the second linear transporter 6, and the reversing machine 41 of the cleaning unit 4. A swing transporter (wafer transport mechanism) 7 for transporting the wafer is disposed. The swing transporter 7 moves from the fourth transport position TP4 of the first linear transporter 5 to the fifth transport position TP5 of the second linear transporter 6, and from the fifth transport position TP5 of the second linear transporter 6 to the reversing machine 41. The wafers can be transferred from the fourth transfer position TP4 of the first linear transporter 5 to the reversing machine 41, respectively.
Hereinafter, each conveyance mechanism will be described.

The swing transporter swing transporter 7 will be described.

  FIG. 3 is a perspective view of an exemplary swing transporter. More specifically, it is a perspective view showing the swing transporter 7 together with the reversing machine 41 of the cleaning unit 4. As shown in FIG. 3, the swing transporter 7 according to the present embodiment is installed in a frame 102 of the casing of the first polishing unit 3a, and is arranged inside a frame 102 having a substantially U-shaped cross section extending vertically. The robot cylinder 104, the base bracket 106 that moves up and down on the robot cylinder 104, the motor 107 that moves the robot cylinder 104 up and down, the motor cover 108 attached to the base bracket 106, and the motor cover 108. A turning arm 110 attached to the rotation shaft of the motor, and a wafer gripping mechanism 112 attached to the tip of the turning arm 110 are provided.

The wafer gripping mechanism 112 includes a pair of gripping portions 114 that grip the periphery of the wafer W from both sides, and an opening / closing mechanism 116 that opens and closes the rod 114a of the gripping portion 114 in the radial direction of the wafer W (arrow A). The pair of gripping portions 114 are arranged so as to face each other across the center of the wafer W, and at each end of each gripping portion 114, a top (chuck mechanism) 118 that makes point contact with the outer peripheral portion of the wafer W is provided. Two each are provided. These pieces 118 are provided so as to protrude downward from both ends of the gripping portion 114.

  The opening / closing mechanism 116 is constituted by, for example, an air cylinder, and grips the wafer W by moving the gripping portions 114 in directions close to each other, and releases the wafer W by moving the gripping portions 114 in directions away from each other.

  FIG. 4A is a top view showing a grip portion of the swing transporter. FIG. 4B is a side view of the grip portion of the swing transporter. FIG. 4C is an enlarged side view of the top of the grip portion of the swing transporter.

  4A, 4B, and 4C, the structure other than the grip portion 114 is omitted for clarity of illustration and description. As shown in FIG. 4C, the top 118 is formed with tapered portions 120a and 120b having different inclination angles, and the tapered portions 120a and 120b can support wafers (W1 and W2) having different dimensions. . Therefore, in the swing transporter 7 of this embodiment, wafers having different dimensions can be transferred. In this embodiment, the example in which the two pieces 118 are provided in each gripping portion 114 has been described. However, the present invention is not limited to this, and three or more pieces 118 may be provided in each gripping portion 114. Good.

  As described above, the wafer gripping mechanism 112 of the swing transporter 7 of the present embodiment grips and releases the wafer W by moving the pair of gripping portions 114 in one direction opposite to each other. The wafer W can be gripped.

  A ball screw and a slide guide are provided in the ROBO cylinder 104, and the base bracket 106 on the ROBO cylinder 104 is moved up and down by the drive of the motor 107 (arrow B). As a result, the wafer gripping mechanism 112 moves up and down together with the base bracket 106, and the vertical movement mechanism that moves the wafer gripping mechanism 112 up and down along the frame 102 is constituted by the ROBO cylinder 104 and the base bracket 106.

  Further, the turning arm 110 is turned around the rotation axis of the motor by driving the motor in the motor cover 108 (arrow C). As a result, the wafer gripping mechanism 112 is moved between the first linear transporter 5, the second linear transporter 6, and the reversing machine 41 of the cleaning unit 4, and the motor 108 adjacent to the frame 102. A turning mechanism for turning the wafer gripping mechanism 112 around the rotation axis is constituted by the motor in the motor cover 108 and the turning arm 110. In this embodiment, the example in which the wafer gripping mechanism 112 is turned around the rotation axis of the motor in the motor cover 108 adjacent to the frame 102 has been described. However, the present invention is not limited to this, and the frame 102 is the center. The wafer gripping mechanism 112 may be turned.

  When gripping the wafer W, the base bracket 106 is lowered with the gripping portion 114 open until the top 118 of the gripping portion 114 is positioned below the wafer W. Then, the opening / closing mechanism 116 is driven to move the gripping part 114 in a direction approaching each other, so that the innermost peripheral part of the top 118 of the gripping part 114 is positioned inside the outermost peripheral part of the wafer W. In this state, the base bracket 106 is raised, and the wafer W is lifted while being gripped by the top 118 of the gripping portion 114. In this embodiment, the top 118 and the wafer W are in point contact, and the contact area of the wafer W can be reduced as much as possible. Therefore, dust attached to the surface of the wafer W when the wafer is held can be reduced. .

Linear transporter Next, the first linear transporter 5 of the first polishing section 3a will be described.

  FIG. 5 is a front view of an exemplary linear transporter. FIG. 6 is a plan view of the linear transporter. FIG. 7A is a top view of the transport stage of the linear transporter. FIG. 7B is a side view of the transport stage of the linear transporter. FIG. 7C is an enlarged side view of the pins of the transport stage of the linear transporter.

  As shown in FIGS. 5 and 6, the first linear transporter 5 includes four transfer stages TS1, TS2, TS3, TS4 that can move back and forth in a straight line. It has become. That is, the first transfer stage TS1, the second transfer stage TS2, and the third transfer stage TS3 are arranged in the lower stage, and the fourth transfer stage TS4 is arranged in the upper stage.

  The lower transfer stages TS1, TS2, TS3 and the upper transfer stage TS4 move on the same axis in the plan view of FIG. 6, but are installed at different heights. TS2 and TS3 and the upper transfer stage TS4 can freely move without interfering with each other. The first transfer stage TS1 transfers a wafer between a first transfer position TP1 where the reversing device 31 and the lifter 32 are arranged, and a second transfer position TP2 where the pusher 33 is arranged (which is a wafer transfer position). Transport. The second transfer stage TS2 transfers the wafer between the second transfer position TP2 and the third transfer position TP3 where the pusher 34 is disposed (wafer transfer position). The third transfer stage TS3 transfers the wafer between the third transfer position TP3 and the fourth transfer position TP4. The fourth transfer stage TS4 transfers the wafer between the first transfer position TP1 and the fourth transfer position TP4.

  As shown in FIG. 6, four pins (also referred to as posts) 50 are fixed to each of the transfer stages TS1, TS2, TS3, TS4, and the wafers placed on the transfer stage by these pins 50 are fixed. The wafer is supported on the transfer stage in a state where the outer peripheral edge is guided and positioned. These pins 50 are made of a resin such as polypropylene (PP), polychlorotrifluoroethylene (PCTFE), or polyetheretherketone (PEEK). Each transfer stage is configured with a sensor (not shown) that detects the presence or absence of a wafer by a transmission sensor or the like, so that the presence or absence of a wafer on each transfer stage can be detected. .

  As shown in FIG. 7C, the pin 50 is formed with tapered portions 50a and 50b having different inclination angles, and the tapered portions 50a and 50b can support wafers (W1 and W2) having different dimensions. it can. Therefore, in the linear transporter 5 of this embodiment, wafers having different dimensions can be transferred.

Reversing machine will now be described reversing machine 31 of the first polishing section 3a. The reversing machine 31 of the first polishing unit 3a is disposed at a position where the hand of the transfer robot 22 of the load / unload unit 2 can reach, receives the wafer before polishing from the transfer robot 22, and reverses the wafer upside down. To the lifter 32.

  FIG. 8 is a perspective view of an exemplary reversing machine. FIG. 9 is a plan view of the reversing machine. FIG. 10 is a side view of the reversing machine.

As shown in FIGS. 8 to 10, the reversing machine 31 includes a pair of arc-shaped gripping portions 310 that grip the peripheral edge of the wafer W from both sides, a shaft 314 attached to the gripping portion 310, and the shaft 314 as its axis. And an opening / closing mechanism 312 that opens and closes the grip portion 310. The pair of gripping portions 310 are arranged to face each other across the center of the wafer W, and two chuck portions 311 that are in line contact with the outer peripheral portion of the wafer W are provided at both ends of each gripping portion 310. Is provided. In this embodiment, an example in which two chuck portions 311 are provided in each gripping portion 310 will be described. However, the present invention is not limited to this, and each gripping portion 310 is provided with three or more chuck portions 311. May be.

  FIG. 11 is a longitudinal sectional view showing an opening / closing mechanism of the reversing machine. FIG. 12 is a longitudinal sectional view showing the opening / closing mechanism of the reversing machine, and shows a state in which the wafer is released.

  As shown in FIG. 11, the opening / closing mechanism 312 includes a compression spring 315 that biases each shaft 314 and the grip portion 310 in the closing direction, and a sliding air cylinder 313 coupled to each shaft 314. . The opening / closing mechanism 312 is configured to grip the wafer W by moving the gripping portion 310 toward each other by a compression spring 315. At this time, the movable portion 313 a of the air cylinder 313 is in contact with the mechanical stopper 317. It has become. In addition, the opening / closing mechanism 312 releases the wafer W by moving the gripping portions 310 in directions away from each other by driving the air cylinder 313. The state at this time is shown in FIG.

  That is, when gripping the wafer W, one air cylinder 313 is pressurized, and the other air cylinder 313 is closed only by the urging force of the compression spring 315. At this time, only the movable portion 313a of the pressurized air cylinder 313 is pressed against the mechanical stopper 317 and fixed at that position. At this time, the position of the grip portion 310 connected to the other air cylinder 313 urged by the compression spring 315 is detected by the sensor 319. When there is no wafer W, the air cylinder 313 that is not pressurized is in the full stroke position, and the sensor 319 does not respond, so that it is detected that the wafer W is not gripped.

  As described above, by using the compression spring 315 for gripping the wafer W and using the air cylinder 313 for releasing the wafer W, it is possible to prevent the wafer W from being damaged by the air pressure of the air cylinder 313.

  As shown in FIGS. 8 to 10, the opening / closing mechanism 312 is provided with a rotating shaft 316 that rotates about an axis perpendicular to the central axis of the wafer W. The rotating shaft 316 is connected to a reversing mechanism 318 and is rotated by the reversing mechanism 318. Therefore, when the reversing mechanism 318 is driven, the opening / closing mechanism 312 and the gripping portion 310 rotate around the rotation shaft 316 so that the wafer W gripped by the gripping portion 310 is reversed.

Temporary Placement FIG. 3A is a perspective view showing the temporary placement part. FIG. 3B is a perspective view illustrating a state in which the temporary placement unit is lowered.

  As shown in FIG. 3, the reversing machine 41 of the cleaning unit 4 has a temporary placement unit 130 below the gripping unit 114. As illustrated in FIG. 3A, the temporary placement unit 130 includes a rectangular base plate 131, frames (posts) 132 provided at the four corners of the base plate 131, a support cylinder 133 that supports the base plate 131, and a support cylinder 133 that moves up and down. And a moving air cylinder 134. A substantially hemispherical protrusion 132a is provided on the top of each post 132, and the wafer W is positioned by the protrusion 132a. The support cylinder 133 is connected to an air cylinder 134 via a rod 135, and the base plate 131 moves up and down together with the support cylinder 133 by driving the air cylinder 134.

  When the wafer W is reversed, the air cylinder 134 of the temporary placement unit 130 is driven, and the base plate 131 is raised to the receiving position of the wafer W. When the base plate 131 is raised to the receiving position of the wafer W, the opening / closing mechanism 312 is driven to move the gripping portions 310 in directions away from each other. As a result, the wafer W is released from the grip portion 310 and placed on the post 132 of the base plate 131. Thereafter, the air cylinder 134 of the temporary placement unit 130 is driven, and the base plate 131 is lowered to a predetermined position as shown in FIG. 3B. The wafer W placed on the post 132 of the temporary placement unit 130 is transferred to a transfer unit 46 described later, sequentially transferred to each of the cleaning machines 42 to 45, and cleaned by each cleaning machine.

  Since such a temporary placement unit 130 can be used as a buffer for a wafer before cleaning, the tact time of the entire process can be improved. If the reversing machine 41 is provided with a cleaning mechanism, the wafer W can be temporarily cleaned before the cleaning by each of the cleaning machines 42 to 45.

Lifter will be described next lifter 32 of the first polishing section 3a. The lifter 32 of the first polishing unit 3a is disposed at a position where the transfer robot 22 and the first linear transporter 5 can be accessed, and functions as a delivery mechanism for delivering a wafer between them. That is, the wafer reversed by the reversing machine 31 is transferred to the first transfer stage TS1 or the fourth transfer stage TS4 of the first linear transporter 5.

  FIG. 13 is a longitudinal sectional view showing the lifter. FIG. 14A is a top view showing the stage of the lifter. FIG. 14B is a side view showing the stage of the lifter. FIG. 14C is a partially enlarged side view showing the nail of the lifter stage.

  The lifter 32 includes a stage 322 on which a wafer is placed, and a cylinder 323 that moves the stage 322 up and down. The cylinder 323 and the stage 322 are connected by a slidable shaft 324. As shown in FIG. 14A, the stage 322 is divided into a plurality of claws 325, and each of the claws 325 is arranged at an interval that can hold the wafer within a range that does not affect the conveyance even when a wafer with an orientation flat is placed. Is done. The claw 325 is arranged in a direction that does not match the phase of the chuck portion 311 of the reversing machine 31. That is, the first wafer edge portion where the chuck portion 311 holds the wafer does not coincide with the second wafer edge portion held by the claw 325 of the lifter 32. Further, the claw 325 for delivering the wafer to the reversing machine 31 and the first linear transporter 5 has a surface on which the wafer is placed, and the upper part absorbs the transfer positioning error when the wafer is placed. The taper is formed so as to center the wafer. As shown in FIG. 14C, the claw 325 includes a wafer support member 326. Preferably, the wafer support member 326 is formed from an elastomer material. More preferably, the wafer support member 326 can be formed from an elastomeric material having a durometer D scale of 30 to 50, most preferably 40 hardness.

Transport unit of the cleaning unit will be described next transport unit 46 of the cleaning section 4.

FIG. 15 is a perspective view illustrating the transport unit of the cleaning unit. As shown in FIG. 15, the transport unit 46 includes four chucking units 461 to 464 as wafer gripping mechanisms for detachably gripping the wafer in the cleaning machine, and these chucking units 461 to 464 include A guide frame 466 extending in the horizontal direction from the main frame 465 is attached. A ball screw (not shown) extending in the vertical direction is attached to the main frame 465, and the chucking units 461 to 464 are moved up and down by driving a motor 468 connected to the ball screw. ing. Therefore, the motor 468 and the ball screw constitute a vertical movement mechanism that moves the chucking units 461 to 464 up and down.

  A ball screw 469 extending in parallel with the arrangement of the cleaning machines 42 to 45 is attached to the main frame 465, and the main frame 465 and the chucking unit 461 are driven by driving a motor 470 connected to the ball screw 469. 464 move in the horizontal direction. Therefore, the motor 470 and the ball screw 469 constitute a moving mechanism that moves the chucking units 461 to 464 along the arrangement direction of the cleaning machines 42 to 45 (the arrangement direction of the chucking units 461 to 464).

  In the present embodiment, the same number of chucking units as the washing machines 42 to 45 are used. Since the chucking units 461 and 462 and the chucking units 463 and 464 have basically the same structure and are symmetrical with respect to the main frame 465, only the chucking units 461 and 462 will be described below.

  The chucking unit 461 includes a pair of openable and closable arms 471a and 471b that hold the wafer W, and the chucking unit 462 includes a pair of arms 472a and 472b. At least three (four in this embodiment) chuck pieces 473 are provided on the arms of each chucking unit. These chuck pieces 473 sandwich and hold the peripheral edge of the wafer W so that the wafer can be conveyed to the next cleaning machine.

  As shown in FIG. 15, the guide frame 466 has an air cylinder for opening and closing the arms 471a and 471b of the chucking unit 461 and the arms 472a and 472b of the chucking unit 462 in a direction close to each other or in a direction away from each other. 474 is provided. Although not described in detail, a link mechanism for transmitting the motion of the air cylinder 474 to the arms 471a, 471b, 472a, 472b is provided. Therefore, by closing the arms 471a, 471b, 472a, 472b with the air cylinder 474, the wafer W can be held while the end surface of the wafer W is sandwiched between the arms 471a, 471b, 472a, 472b. As described above, the air cylinder 474 constitutes an opening / closing mechanism that opens and closes the arms of the chucking units 461 to 464 in a direction close to each other or a direction away from each other. Each chucking unit can detect the presence or absence of a wafer by detecting the stroke of the air cylinder. Note that the wafer may be held by vacuum suction. In this case, the presence or absence of the wafer can be detected by measuring the vacuum pressure.

  Further, the arms 471 a and 471 b of the chucking unit 461 and the arms 472 a and 472 b of the chucking unit 462 are attached to a rotation shaft 475 provided rotatably on the guide frame 466. The guide frame 466 is provided with an air cylinder 476 that rotates these arms 471a, 471b, 472a, 472b around the rotation shaft 475. A link member 478 that can rotate around a pin 477 is provided at the tip of the rod of the air cylinder 476. The link member 478 is connected to the rotation shaft 475 via the rod 479. Thus, the air cylinder 476, the link member 478, and the rod 479 constitute a rotation mechanism that rotates the arms of the chucking units 461 to 464 around the rotation shaft 475.

Stage FIG. 16 is a perspective view of a stage according to a comparative example. FIG. 17 is a partially cutaway side view of a stage according to a comparative example. The stage 700 according to this comparative example includes, for example, FIGS.
7A-7C and the first to fourth transfer stages TS1 to TS4 and / or the temporary placement unit 130 of FIGS. 1, 3, 3A, and 3B, and / or FIGS. 13 and 14A-14C. It is possible to use the stage 322 instead. However, the stage 700 is not limited to the above-described stage, and is disposed at an arbitrary location in a semiconductor manufacturing apparatus or semiconductor manufacturing facility. Further, the stage 700 is not limited to a polishing apparatus, but is disposed at an arbitrary place in a semiconductor manufacturing apparatus or a semiconductor manufacturing facility such as a plating apparatus.

  The stage 700 includes a base 710 and a plurality of posts 720 fixed to the base 710. The post 720 includes a support portion 721, a main body portion 722, and an insertion portion 723, and the support portion 721, the main body portion 722, and the insertion portion 723 are formed coaxially. Four posts 720 are arranged at the four corners of the base 710. A substrate W such as a semiconductor wafer is supported by a support portion 721 of the post 720. The base 710 is provided with an insertion hole 711 corresponding to the post 720. The insertion hole 711 is formed as an elongated hole extending in a direction corresponding to the radial direction of the substrate W so that the post 720 can be moved so as to conform to the size of the substrate W. In assembling the stage 700, the insertion portion 723 of the post 720 is inserted into the insertion hole 711 of the base 710, and the post 720 is temporarily fixed to the base 710 from the back surface of the base 710 by a fastening member 730 such as a bolt. In the temporarily fixed state, the substrate W is supported by the post 720 and the position of each post 720 is adjusted in the insertion hole 711. After the adjustment, the fastening member 730 is tightened to firmly fix each post 720 to the base 710. In this stage 700, depending on how each post 720 is moved, the position of the center Cw of the substrate W and the center of the center Cb of the stage 700 are shifted as shown in FIGS. There is a problem that the position of the substrate W on the stage 700 varies. In other words, the position of the center Cw of the substrate W varies on the stage 700 among the plurality of stages 700, and the position of the substrate W on the stage 700 is not constant. Depending on the size of the positional deviation of the substrate W on the stage 700, the delivery of the substrate W may fail.

  FIG. 18 is a perspective view of a stage according to an embodiment. FIG. 19 is a plan view of the base. FIG. 20A is a perspective view seen from the side opposite to the insertion side of the post. FIG. 20B is a perspective view seen from the insertion side of the post.

  The stage 500 according to an embodiment includes a base 510 and a plurality of posts 520 fixed to the base 510. On this stage 500, as shown in FIG. 25, a substrate W such as a semiconductor wafer is placed on a plurality of posts 520 and supported or held. The substrate W may have an alignment flat for alignment, a notch, or the like, but as a whole has a substantially circular shape having a constant radius R0.

  The base 510 is a substantially rectangular plate-shaped member as shown in FIG. The base 510 has a first surface 510a that is a surface on which the post 520 is inserted, and a second surface 510b that is an opposite surface opposite to the first surface 510a. In this embodiment, the base 510 has a rectangular shape having a long side 510c and a short side 510d, but may have a square shape in which each side is equal. The base 510 is provided in the insertion hole 511 for inserting the post 520 and the center Cb of the base 510, and for inserting a first insertion shaft portion 612 (see FIGS. 21 and 22) of a jig pin 610 described later. Center hole 512. The insertion holes 511 are provided in the vicinity of the four corners of the base 510. In addition, the shape of the base 510 is a structure in which a jig pin 610 described later can be engaged with the first position P1 as a substrate positioning position, and a post can be disposed around the first position P1. Any shape is possible.

Here, a case where a center hole 512 into which the first insertion shaft portion 612 of the jig pin 610 is inserted is provided at the center Cb of the base 510 will be described as an example. That is, a case where a specific position (first position P1, substrate positioning position) on the stage (base) to be aligned with the center of the substrate W is set as the center Cb of the stage (base) is taken as an example. However, the specific position on the stage (base) to be aligned with the center of the substrate W is not limited to the center Cb of the stage (base), and a post for supporting the substrate can be arranged around the specific position. As long as the position is arbitrary on the stage (base). According to the present embodiment, the center of the substrate W is aligned with a specific position between a plurality of stages regardless of the specific position (the first position P1, the substrate positioning position). Thus, since the substrate W can be supported, the positional deviation of the substrate W can be suppressed or prevented.

  FIG. 30 is a plan view of the base when the engagement position of the jig pin is at a position different from the center of the stage. As shown in the figure, the hole 512b on the base 510 into which the jig pin 610 (first insertion shaft portion 612) is inserted is at a first position P1 different from the center Cb of the base 510. In this case, when the substrate W is supported by the post 520, the center Cw of the substrate W coincides with or is aligned with the hole 512b at the first position P1 different from the center Cb of the base 510. It should be noted that a projection 512a may be provided in place of the hole 512b at the first position P1, as in the modified examples of FIGS. 27 and 29 described later.

  The first position P1 is a substrate positioning position on the stage 500 (base 510) for alignment with the center of the substrate. FIG. 19 shows a case where the first position P1 is the center Cb of the base, and FIG. 30 shows a case where the first position P1 is located at a position other than the base center Cb. The first position P1 can be any position on the stage (base) as long as a post for supporting the substrate can be disposed around the first position P1 on the stage (base).

  Each insertion hole 511 has a size and a shape for receiving an insertion shaft portion 523 (described later) of the post 520 so as to be able to reciprocate. At the bottom of each insertion hole 511, a through hole 513 is formed through which a fastening member 530 such as a bolt described later (see FIGS. 23A and 23B) is inserted from the second surface 510b side. The through hole 513 penetrates from the second surface 510 b of the base 510 to the bottom of the insertion hole 511. The through hole 513 is also formed in a long hole so that the insertion position of the fastening member 530 can be changed as the post 520 moves in the insertion hole 511.

  The center hole 512 has a diameter in which a first insertion shaft portion 612 (see FIGS. 21 and 22) of a jig pin 610 described later can be inserted and fitted at the center Cb of the base 510. In the example of FIG. 30, the hole 512b has a diameter at which a first insertion shaft portion 612 (see FIGS. 21 and 22) of a jig pin 610 described later can be inserted and fitted at the first position P1 of the base 510. Have. In the present embodiment, the center hole 512 (hole 512b) is formed as a through hole penetrating from the first surface 510a to the second surface 510b of the base 510. However, the center hole 512 (hole 512b) does not necessarily have to be a through hole, and may be a bottomed hole as long as it can be fitted to and supported by the first insertion shaft portion 612 of the jig pin 610. There may be.

  In this example, four posts 520 are provided, and four insertion holes 511 are provided correspondingly. The number of posts 520 and insertion holes 511 is not limited to four, and may be three or less or five or more. Further, the number of insertion holes 511 may be equal to or greater than the number of posts 520. In addition, the base 510 is not limited to a substantially rectangular plate-like member, and as long as the center hole 512 (hole 512b) and the insertion hole 511 can be provided, one or a plurality of positions on the peripheral portion like the stage 322. Or a shape in which a plurality of extended portions extend radially from the central body.

As shown in FIG. 20A, the post 520 includes a support portion 521, a main body portion 522, and an insertion shaft portion 523. The support portion 521, the main body portion 522, and the insertion shaft portion 523 may be integrally formed, or may be connected to each other after being partially or entirely formed separately.

  The insertion shaft portion 523 is a member having a substantially cylindrical shape. The insertion shaft portion 523 is inserted into an insertion hole 511 formed of a long hole, and after the position is adjusted in the insertion hole 511, the insertion shaft portion 523 is fixed to the base 510 by a fastening member 530 such as a bolt. As shown in FIG. 20B, a screw hole 523 a that engages with a screw of the fastening member 530 is provided on the insertion side end surface (bottom surface) of the insertion shaft portion 523. The fastening member 530 (see FIG. 22) inserted through the through hole 513 from the second surface 510b side of the base 510 is screwed into the screw hole 523a of the post 520, whereby the post 520 is fixed to the base 510. .

  As shown in FIG. 20A, the main body portion 522 has a substantially cylindrical shape having a larger diameter than the insertion shaft portion 523 and is disposed coaxially with the insertion shaft portion 523. The support portion 521 is provided coaxially with the main body portion 522 on the opposite side of the main body portion 522 from the insertion shaft portion 523. The support portion 521 is arranged continuously with the main body portion 522, and has a tapered first support section 521a having a diameter reduced in the direction opposite to the insertion side, and the opposite side of the first support section 521a from the main body portion 522. And a substantially cylindrical second support section 521b having a substantially constant diameter. The first support section 521a and the second support section 521b are disposed coaxially with the main body 522. A tapered portion 525 whose diameter decreases in the direction opposite to the insertion side is formed on the distal end side of the second support section 521b, and this tapered portion 525 functions as a guide portion that guides the substrate W to the support portion 521. To do.

  Here, an example in which the support portion 521 of the post 20, the main body portion 522, and the insertion shaft portion 523 are arranged coaxially is shown. Of the support portion 521, the main body portion 522, and the insertion shaft portion 523, It is also possible to employ the post 20 having a configuration in which at least a part is eccentric.

  In any post 520, when the position of the insertion shaft portion 523 of the post 520 is displaced in the insertion hole 511 which is a long hole, the surface of the support portion 521 of the post 520 and the center Cb of the base 510 (or the substrate W). The distance from the center Cw) changes. In the example of FIG. 30, the distance between the surface of the support portion 521 of the post 520 and the hole 512b of the base 510 (or the center Cw of the substrate W) changes. Thereby, the magnitude | size of the clearance gap S (FIG. 25) between each post 520 (2nd support division 521b of the support part 521) and the board | substrate W can be adjusted.

Stage Adjustment Jig FIG. 21 is a perspective view of an adjustment jig. FIG. 22 is a partially cutaway side view of the stage with the adjustment jig installed. FIG. 23A is a perspective view seen from the second surface side of the base and shows fixing of the post by the fastening member. FIG. 23B is an enlarged perspective view of the fastening member on the second surface side of the base. FIG. 24 is a partially cutaway side view of the stage in a state where the adjustment jig after the adjustment is installed. FIG. 25 is a partially cutaway side view of the stage after adjustment in a state where the substrate used in the actual process is supported. Note that the bases of FIGS. 22, 24, and 25 are shown in a cross section taken along line AA of FIG.

  The adjustment jig 600 includes an adjustment substrate Wa and jig pins 610 for attaching the adjustment substrate Wa to the stage 500.

  The adjustment substrate Wa has a radius R1 (= R0 + ΔR) larger by a predetermined length ΔR than the radius R0 of the substrate W (see FIG. 25) used in the actual process. The predetermined length ΔR corresponds to a gap S (FIG. 25) formed between the substrate W and each post 520 when the substrate W used in the actual process is placed on the stage 500.

The jig pin 610 includes a main body portion 611, a first insertion shaft portion 612 disposed on the base insertion side of the main body portion 611, and a second insertion shaft portion 613 disposed on the side opposite to the base insertion side of the main body portion 611.
And. The main body portion 611, the first insertion shaft portion 612, and the second insertion shaft portion 613 may be integrally formed, or may be connected to each other after being partially or entirely formed separately. The main body 611 is formed in a substantially cylindrical shape, and has an axial length corresponding to the distance between the base 510 and the adjustment substrate Wa when installed on the stage 500, as shown in FIG. . The axial length of the main body 611 is selected so that the outer edge of the adjustment substrate Wa is aligned with the height of the second support section 521b of the post 520 when the adjustment substrate Wa is placed on the stage 500. . The first insertion shaft portion 612 has a size and shape to be inserted into and fitted into the center hole 512 of the base 510. In the example of FIG. 30, the first insertion shaft portion 612 has a size and shape to be inserted into and fitted into the hole 512b of the base 510. The first insertion shaft portion 612 may be non-rotatably fitted in the center hole 512 (hole 512b) or may be rotatably fitted in the center hole 512 (hole 512b).

  In the present embodiment, the center hole 512 (hole 512b) of the base 510 is a through hole penetrating from the first surface 510a to the second surface 510b. In the present embodiment, the first insertion shaft portion 612 has a length larger than the thickness of the base 510, passes through the center hole 512 (hole 512 b) of the base 510, and the distal end side extends from the second surface 510 b of the base 510. It protrudes (see FIG. 22). In other embodiments, the first insertion shaft portion 612 has a length smaller than the thickness of the base 510. In that case, the depth of the center hole 512 (hole 512b) of the base 510 may be at least a length corresponding to the length of the first insertion shaft portion 612, and the center hole 512 (hole 512b) has a bottom. It may be a hole.

The stage 500 is adjusted as follows.
First, each post 520 is inserted and installed in each insertion hole 511 of the base 510 of the stage 500. At this time, the fastening member 530 is not yet attached, or is temporarily fixed so that the post 520 can reciprocate within the insertion hole 511.
Next, as shown in FIG. 22, the adjustment jig 600 is attached to the stage 500. First, jig pins 610 are attached to the stage 500. Specifically, the jig pin 610 is attached to the stage 500 by inserting and fitting the first insertion shaft portion 612 of the jig pin 610 into the center hole 512 (hole 512b) of the base 510 of the stage 500. (FIG. 22). Next, the adjustment substrate Wa is attached to the jig pin 610. Specifically, the center hole 620 of the adjustment substrate Wa is fitted into the second insertion shaft portion 613 of the jig pin 610. At this time, the adjustment substrate Wa may be non-rotatably fitted to the second insertion shaft portion 613 of the jig pin 610 or may be rotatable relative to the second insertion shaft portion 613 of the jig pin 610. May be fitted. When the adjustment substrate Wa is attached to the jig pin 610, the outer peripheral portion of the adjustment substrate Wa approaches the support portion 521 of the post 520 (FIG. 22).
Next, as shown in FIG. 24, each post 520 is reciprocated in the insertion hole 511 until the second support section 521b of the support portion 521 of each post 520 contacts the outer edge of the adjustment substrate Wa. When the second support section 521b of each post 520 contacts the outer edge of the adjustment substrate Wa, the position adjustment of each post 520 is completed.
As shown in FIGS. 23A and 23B, the post 520 is firmly fixed to the base 510 by fastening the fastening member 530 to the post 520 at the position of each post after adjustment. After adjusting the position of each post 520 on the base 510 in this way, the adjustment jig 600 (adjustment substrate Wa and jig pins 610) is removed from the stage 500.

  After adjusting the post position, as shown in FIG. 25, when the substrate W used in the actual process is placed on the stage 500 and supported or held by the post 520, the substrate W and the support portions 521 of the posts 520 A constant gap S = ΔR (corresponding to the difference between the radius R1 of the adjustment substrate Wa and the radius R0 of the substrate W) is formed uniformly between the two support sections 521b.

In the above adjustment method, the procedure for attaching the adjustment substrate Wa to the jig pin 610 after attaching the jig pin 610 to the stage 500 (base 510) has been described. However, the adjustment substrate Wa is attached to the jig pin 610 in advance. After attaching the jig pin, the jig pin may be attached to the stage 500 (base 510). Further, the jig pin may be integrally formed at the center of the adjustment substrate. In this case, the jig pin integrally formed at the center of the adjustment substrate is attached to the first position P1 of the base.

  In the present embodiment, the first insertion shaft portion 612 of the jig pin 610 is used for adjustment larger than the radius of the center hole 512 (hole 512b) of the base 510 of the stage 500 and the substrate W used in the actual process by ΔR. Each post 520 is reciprocated in the insertion hole 511 of the base 510 until it is attached to the center hole 620 of the substrate Wa and the adjustment substrate Wa uniformly contacts each post 520 (second support section 521b). For this reason, the first position P1 of the stage 500 (base 510) (for example, the center Cb of the base, the hole 512b) and the center Cwa of the adjustment substrate Wa coincide, and each post 520 and the center hole 512 ( Or the distance (shortest distance) to the hole 512b) is uniform. For this reason, when the stage 500 holds the substrate W having a radius R0 smaller than the adjustment substrate Wa, the gap S between each post 520 and the substrate W is also constant and uniform. As a result, variation among a plurality of stages can be suppressed, and the substrate W can be accurately aligned with a certain position with respect to the stage 500.

  Further, the position of each post 520 is adjusted by the jig pin 610 in a state where the first position P1 of the stage 500 (for example, the center Cb of the base, the hole 512b) and the center Cwa of the adjustment substrate Wa are aligned. Therefore, the first position P1 of the stage 500 and the center Cwa of the adjustment substrate Wa can be prevented from shifting. As a result, it is possible to suppress or prevent the first position P1 of the stage and the center Cw of the substrate W from being shifted when the stage 500 supports the substrate W used in the actual process.

Further, the stage according to this embodiment is provided with a center hole 512 (hole 512b) for inserting the jig pin 610 in the base 510, and the insertion hole 511 for inserting the post 520 may be a long hole. There is no need to make significant changes.
Further, the post is provided with a first support section 521a formed of a tapered portion and a second support section 521b formed of a substantially constant diameter, and the second support section 521b is brought into contact with the outer edge of the adjustment substrate Wa. Since the post 520 is positioned and the substrate W used in the actual process is supported by the first support section 521a, the position of the post 520 can be adjusted easily and accurately. The gap S between the two can be made uniform.

By adjusting the position of the post in the stage after manufacture, the substrate can be positioned accurately, so that the increase in cost is suppressed or prevented compared to the case where high precision machining is used in the manufacture of the stage. can do.
Further, since the position of the post is adjusted by the adjustment substrate whose center coincides with the first position P1 (substrate positioning position) of the stage, the distance from the first position of the stage to each post is set between the plurality of stages. It is possible to suppress or prevent variation. As a result, the position of the substrate relative to the first position P1 of the stage (substrate support position with respect to the stage) can be suppressed or prevented from varying between the plurality of stages.
Furthermore, since the substrate can be accurately positioned by adjusting the position of the post in the stage after manufacture, variations in the adjustment accuracy of the post can be suppressed or prevented even for a large-diameter substrate. .
In addition, since the position of the post is adjusted by making the first position P1 of the stage coincide with the center of the adjustment substrate by the jig pin, variations in adjustment for each product can be achieved regardless of the skill of the operator to adjust. It can be suppressed or prevented.

Since the adjustment jig can be composed of an adjustment substrate and a jig pin for attaching the center of the adjustment substrate to the first position P1 of the stage, the adjustment jig can be configured easily.

(Modification)
(1) FIG. 26A is a plan view of a base according to a first modification. FIG. 26B is a plan view of a base according to a second modification. FIG. 26C is a plan view of a base according to a third modification.
In the above embodiment, the long hole of the insertion hole 511 of the base 510 extends outward in the radial direction of the substrate W when the substrate W is placed on the stage 500. For example, the long hole as shown in FIGS. Holes can also be used. In FIG. 26A, the insertion hole 511 is a long hole extending along the long side 510 c of the base 510. In FIG. 26B, the insertion hole 511 is a long hole extending along the short side 510 d of the base 510. In FIG. 26C, one of the two adjacent insertion holes 511 extends along the long side 510 c of the base 510, and the other extends along the short side 510 d of the base 510. In the base according to the first to third modifications, the post from the first position P1 of the base 510 (for example, the center Cb of the base, the hole 512b) with respect to the amount of movement of the post 520 in the elongated hole 511. It is possible to reduce the change in the distance of 520 (the amount of movement of the post 520 in the radial direction), and easy adjustment with high accuracy of the contact position between the adjustment substrate Wa and the post 520 is facilitated.

(2) FIG. 27 is a sectional view showing a modification of the engagement structure between the jig pin and the base.
In the above embodiment, the jig pin 610 and the base 510 are engaged with each other by the combination of the first insertion shaft portion 612 of the jig pin 610 and the center hole 512 (hole 512b) of the base 510. As shown in FIG. 4, a protrusion 512a is provided at a first position P1 (for example, the center Cb, hole 512b) of the base 510, and a first insertion hole 611a is provided at the stage side end surface of the body portion 611 of the jig pin 610. The first insertion hole 611a of the jig pin 610 may be fitted into the protrusion 512a of the base 510. In this case, the jig pin 610 includes a main body portion 611, a first insertion hole 611a, and a second insertion shaft portion 613. The base 510 has a protrusion 512a instead of the center hole 512 (hole 512b).

(3) FIG. 28 is a cross-sectional view showing a modification of the engagement structure between the jig pin and the adjustment substrate.
As shown in FIG. 28, a protrusion 620a is provided at the center Cwa of the adjustment substrate Wa, a second insertion hole 611b is provided at the substrate-side end surface of the body portion 611 of the jig pin 610, and the protrusion 620a of the adjustment substrate Wa is provided. You may make it fit in the 2nd insertion hole 611b of the jig | tool pin 610. FIG. In this case, the jig pin 610 includes a main body portion 611, a first insertion shaft portion 612, and a second insertion hole 611b. The adjustment substrate Wa has a protrusion 620a instead of the center hole 620.

(4) FIG. 29 is a sectional view showing a modification of the engagement structure between the jig pin, the adjustment substrate, and the base.
As shown in FIG. 29, a protrusion 512a is provided at a first position P1 (eg, center Cb, hole 512b) of the base 510, a protrusion 620a is provided at the center Cwa of the adjustment substrate Wa, and the main body of the jig pin 610 is provided. A first insertion hole 611a and a second insertion hole 611b are provided on the stage-side and substrate-side end surfaces of 611, respectively, and the first insertion hole 611a of the jig pin 610 is fitted to the protrusion 512a of the base 510, and the adjustment substrate The protrusion 620a of Wa may be fitted into the second insertion hole 611b of the jig pin 610. In this case, the jig pin 610 includes a main body portion 611, a first insertion hole 611a, and a second insertion hole 611b.

(5) FIG. 31 is a perspective view of an adjustment jig in which a jig pin and an adjustment substrate are integrally formed.
21 and 27-29 may be formed integrally with the center Cwa of the adjustment substrate Wa. In this case, the jig pin 610 formed integrally with the center Cwa of the adjustment substrate Wa is used. The base 510 is attached to the first position P1. For example, in the case of FIGS. 21 and 28, the first insertion shaft portion 612 is inserted into the center hole 512 or the hole 512b. For example, in the case of FIGS. 27 and 29, the protrusion 512a of the base 510 is inserted into the first insertion hole 611a of the jig pin 610.
Instead of forming the jig pins 610 integrally with the adjustment substrate Wa, the jig pins 610 may be formed integrally with the base 510 at the first position P1 (substrate positioning position) of the base 510. In this case, for example, the structure shown in FIGS. 21 and 27 to 29 can be adopted as the attachment structure between the jig pins 610 and the adjustment substrate Wa.

  The embodiments of the present invention have been described above based on some examples. However, the above-described embodiments of the present invention are for facilitating understanding of the present invention and do not limit the present invention. . The present invention can be changed and improved without departing from the gist thereof, and the present invention naturally includes equivalents thereof. In addition, any combination or omission of each constituent element described in the claims and the specification is possible within a range where at least a part of the above-described problems can be solved or a range where at least a part of the effect is achieved. It is.

TS1 to TS4 ... First to fourth transfer stages 322 ... Stage 500 ... Stage 510 ... Base 510a ... First surface 510b ... Second surface 510c ... Long side 510d ... Short side 511 ... Insertion hole 512 ... Center hole 512a ... Projection 512b ... hole 513 ... through hole 520 ... post 521 ... support part 521a ... first support section 521b ... second support section 522 ... main body part 523 ... insertion shaft part 523a ... screw hole 525 ... taper part 530 ... fastening member 600 ... adjustment jig Tool 610 ... Jig pin 611 ... Main body 611a ... First insertion hole 611b ... Second insertion hole 612 ... First insertion shaft 613 ... Second insertion shaft 620 ... Center hole 620a ... Projection 700 ... Stage 710 ... Base 711 ... Insertion hole 720 ... Post 721 ... Support part 722 ... Main body part 723 ... Insertion part 730 ... Fastening member

Claims (19)

A stage for supporting the substrate, which is adjusted by the adjustment substrate,
Base and
A plurality of posts positioned relative to the base to support the substrate;
With
The post is
A support portion configured to support the adjustment substrate and the substrate;
An insertion shaft portion attached to the base,
The base is
A first engagement portion that is at the center of the base and engages with a jig pin for alignment between the center of the adjustment substrate and the first position on the base;
A stage provided at a position spaced from the first engagement portion and having a plurality of elongated holes in which the insertion shaft portions of the posts are disposed. The stage according to claim 1,
The stage, wherein the first engagement portion is a hole provided in the first position for inserting the jig pin. The stage according to claim 1,
The first engaging portion is a protrusion provided at the first position, a first insertion hole is provided at a bottom portion of the jig pin, and the first engagement hole is provided at the first insertion hole of the jig pin. A stage into which the projections at the joint are inserted. In the stage according to any one of claims 1 to 3,
The stage, wherein the elongated hole of the base extends radially outward of the adjustment substrate when the adjustment substrate is installed. In the stage according to any one of claims 1 to 3,
The base is substantially rectangular;
The long hole extends along a long side or a short side of the base. In the stage according to any one of claims 1 to 3,
The base is substantially rectangular;
A stage in which one of the two adjacent long holes extends along the long side of the base and the other extends along the short side of the base. In the stage according to any one of claims 1 to 6,
The support portion of the post is
A first support section whose diameter is reduced toward the side opposite to the insertion side of the post to the base;
A second support section having a substantially constant diameter located on the opposite side of the first support section from the insertion side;
Having a stage. The stage according to any one of claims 1 to 7,
The stage, wherein the jig pin is formed integrally with the adjustment substrate at the center of the adjustment substrate, or is separate from the adjustment substrate and can be attached to the center of the adjustment substrate. The stage according to any one of claims 1 to 8,
A through hole is formed in the bottom of the elongated hole so as to extend along the extending direction of the elongated hole and penetrate the surface of the base opposite to the opening side of the elongated hole. A stage capable of inserting a fastening member for fixing the post to the stage. A jig for adjusting a stage for supporting a substrate,
An adjustment substrate having a diameter larger than the diameter of the substrate by a predetermined length;
A jig pin for aligning the center of the adjustment substrate and the first position on the base of the stage;
The jig pin is formed integrally with the adjustment substrate at the center of the adjustment substrate, or is a separate body from the adjustment substrate and can be attached to the center of the adjustment substrate. . The jig according to claim 10, wherein
The jig pin has a first insertion shaft portion that can be inserted into a hole at the first position on the base. The jig according to claim 10, wherein
The jig pin has a first insertion hole that fits into a protrusion provided at the first position on the base. The jig according to any one of claims 10 to 12,
The adjustment substrate has a protrusion at its center,
The jig pin has a second insertion hole that fits into the protrusion of the adjustment substrate. The jig according to any one of claims 10 to 12,
The adjustment substrate has a center hole at its center,
The jig pin has a second insertion shaft portion that is inserted into a center hole of the adjustment substrate. The jig according to claim 11,
The jig pin has a main body portion having a diameter larger than that of the first insertion shaft portion,
A jig in which a step of the main body part with respect to the first insertion shaft part abuts on the base, and the jig pin is attached to the base. The jig according to claim 14, wherein
The jig pin has a main body portion having a diameter larger than that of the second insertion shaft portion,
A jig in which a step of the main body portion with respect to the second insertion shaft portion abuts on the adjustment substrate, and the jig pin is attached to the adjustment substrate. A method for adjusting a stage for supporting a substrate,
A stage including a base and a plurality of posts, wherein the base is provided at a first position for positioning the substrate, and spaced apart from the first position, and a plurality of positions for disposing each post. Providing the stage with a slot of
Preparing an adjustment substrate having a size larger than the substrate, and a jig pin;
Placing each post in each slot in the base;
Aligning the first position on the base and the center of the adjustment substrate via the jig pins;
Moving each post within the elongated hole of the base according to the dimensions of the adjustment substrate to adjust the contact position between the adjustment substrate and each post;
Including methods. The method of claim 17, wherein
The jig pin is formed integrally with the adjustment substrate at the center of the adjustment substrate,
The aligning step includes attaching the jig pin to the first position on the base. The method of claim 17, wherein
The jig pin is separate from the adjustment substrate,
The aligning step includes attaching each end of the jig pin to the first position on the base and the center of the adjustment substrate, respectively.

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