JP2018020358A - Joint device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To achieve high-quality joint in the case of joining for a short time using a resistance-welding type or a pulse heat type joint device.SOLUTION: A joint device includes: an electrode 80c abutting on an object to be joined; a power source 20; physical quantity detection means 21 which detects a physical quantity related to the object to be joined during joining; a storage section 17 which stores physical quantity setting information that specifies a desired time change of a physical quantity; a temperature detection section 14 which detects a temperature of the electrode 80c or in the vicinity of the electrode; and a control section 15 which controls an energizing amount from the power source 20 to the electrode 80c in a state in which the electrode 80c abuts on the object to be joined or does not abut thereon so that a temperature detected by the temperature detection section 14 becomes a preliminary heating temperature, before joint of the object to be joined starts and controls the energizing amount from the power source 20 to the electrode 80c so that a time change in the physical quantity detected during joint after the preliminary heating coincides with a time change specified by the physical quantity setting information.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a resistance welding type or pulse heat type joining device.

  In resistance welding, feedback control is generally performed so that the welding current flowing through the electrodes, the welding voltage between the electrodes, the welding power supplied to the electrodes, and the like follow a set waveform. However, the initial temperature of the electrode becomes high when welding is continuously performed, and becomes low when the welding is stopped for a while. Due to the influence of this initial temperature, the temperature reached by the electrode changes, and unbonded and overbonded defects occur.

  On the other hand, in the pulse heat type bonding apparatus, the temperature of the electrode is detected by a thermocouple attached to an electrode (heater chip or heater tool) that pressurizes the object to be bonded, and the electrode is set so that this temperature becomes a preset temperature. The current supplied to the was controlled. In this pulse heat type bonding apparatus, since the current is started to be supplied to the electrode after the object is pressed with the electrode, the heating time of the object is increased, and the amount of heat transmitted to the object is increased. There was a problem of causing a drop.

  Therefore, in a conventional pulse heat type bonding apparatus, it has been proposed to heat the electrode to a preheating temperature lower than a set temperature necessary for bonding prior to pressing of the electrode against the object to be bonded (see Patent Document 1). ). According to the technique disclosed in Patent Document 1, by preheating the electrode to the preheating temperature, the amount of heat transmitted to the object to be bonded can be reduced, and the thermal failure generated in the object to be bonded can be reduced. Can be prevented.

Japanese Patent Laid-Open No. 11-54906

  In the technique disclosed in Patent Document 1, since all processes up to the completion of bonding are performed by temperature control using a thermocouple, the temperature of the electrode can be made to follow a preset temperature profile, and the ultimate temperature of the electrode can be achieved. It is possible to prevent a bonding failure due to the change of.

  However, since temperature detection by thermocouple has a delay in temperature detection, it is not suitable for an object to be joined by supplying current to an electrode for a short time of the order of, for example, msec. Therefore, when performing such short-time joining, it is necessary to employ energization control similar to resistance welding. As an example of the short-time joining, there is an example in which the coating of the end portion of the coated wire such as a chip inductor is melted and the copper wire is thermocompression bonded to the electrode of the chip inductor. However, when energization control similar to resistance welding is employed, as described above, the ultimate temperature of the electrode changes due to the influence of the initial temperature of the electrode, resulting in poor bonding.

  Also, in resistance welding, if the technique disclosed in Patent Document 1 is applied, it is possible to prevent poor bonding due to changes in the temperature reached by the electrodes. For the same reason, it has been difficult to apply the technique disclosed in Patent Document 1.

  The present invention has been made to solve the above-described problem, and a bonding apparatus capable of realizing high-quality bonding in the case of performing short-time bonding using a resistance welding type or pulse heat type bonding apparatus. The purpose is to provide.

  The bonding apparatus according to the present invention includes an electrode that comes into contact with an object to be bonded at the time of bonding, a power source that supplies current to the electrode, a physical quantity detection unit that detects one or more physical quantities related to the bonded object being bonded, Storage means for preliminarily storing physical quantity setting information for designating a desired time change of the physical quantity detected during joining, temperature detecting means for detecting the temperature of the electrode or the vicinity of the electrode, and joining of the objects to be joined are started. Before the electrode from the power source, the temperature detected by the temperature detecting means becomes a pre-heating temperature defined in advance in a state where the electrode is in contact with or not in contact with the workpiece. Preheating control means for controlling the energization amount of the power source, and the time change of one physical quantity among the physical quantities detected during the joining after the preheating coincides with the time change specified by the physical quantity setting information. To, and is characterized in further comprising a feedback control means for controlling the energization amount to the electrodes from the power supply.

Moreover, in one structural example of the joining apparatus of this invention, the said preheating temperature is joining of one to-be-joined object, when joining the several to-be-joined object used as an object continuously without preheating. It is preset at the highest temperature among the minimum temperatures of the electrodes during the rest period between the next objects to be bonded.
In addition, one configuration example of the bonding apparatus according to the present invention further includes a case where the highest temperature among the temperatures detected by the temperature detection means exceeds a predetermined upper limit temperature threshold until a predetermined time has elapsed since the start of bonding. An abnormality detection means for issuing an alarm is provided.
Further, one configuration example of the bonding apparatus of the present invention further includes a case where the maximum temperature among the temperatures detected by the temperature detection means until a predetermined time elapses from the start of bonding is lower than a predetermined lower limit temperature threshold value. An abnormality detection means for issuing an alarm is provided.
Moreover, in one structural example of the joining apparatus of this invention, the said electrode is the electrode of the resistance welding system which presses with the said to-be-joined object pinched | interposed, or the pulse heat system to which the said to-be-joined object is pressed from above Electrode.

  According to the present invention, by performing preheating before performing feedback control every time one object is bonded, the temperature reached by the electrode during bonding can be substantially reduced even when short-time bonding is repeated. It can be made constant and high quality bonding can be realized.

  Further, in the present invention, when the joining of a plurality of objects to be joined is continuously performed without preheating, a pause period between the joining of one joined object and the joining of the next joined object By setting the highest temperature among the lowest electrode temperatures in advance as the preheating temperature, the electrode temperature can be reached to the desired temperature in a short time, and the amount of heat transferred to the object to be joined can be reduced. It is possible to prevent thermal failure occurring in the object to be joined.

  Further, according to the present invention, when the maximum temperature detected by the temperature detection means before the fixed time elapses from the start of bonding exceeds a predetermined upper limit temperature threshold or less than a predetermined lower limit temperature threshold, By issuing an alarm that the defect is one of a defect, an abnormality in the bonding apparatus, or deterioration of the electrode, the user can be informed of the bonding failure.

It is a block diagram which shows the structure of the joining apparatus of the resistance welding system which concerns on the 1st Embodiment of this invention. It is an expanded sectional view of the head part concerning a 1st embodiment of the present invention. It is a flowchart which shows operation | movement of the joining apparatus which concerns on the 1st Embodiment of this invention. It is a block diagram which shows the structure of the control part of the joining apparatus which concerns on the 1st Embodiment of this invention. It is a figure which shows one example of the temperature of the electrode in the case of joining continuously to several to-be-joined objects in the conventional joining apparatus. It is a figure which shows an example of the temperature of the electrode in the case of joining several to-be-joined objects continuously in the joining apparatus which concerns on the 1st Embodiment of this invention. It is a block diagram which shows the structure of the joining apparatus of the pulse heat system which concerns on the 2nd Embodiment of this invention. It is an expanded sectional view of the head part concerning a 2nd embodiment of the present invention.

[Principle of the Invention]
In the present invention, in the resistance welding type or pulse heat type joining device, the initial temperature of the electrode is kept constant at an arbitrary temperature, so that the ultimate temperature of the electrode heating by the subsequent feedback control is made constant and the joining quality is stabilized. .

[First Embodiment]
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a block diagram showing a configuration of a resistance welding type joining apparatus according to a first embodiment of the present invention. The joining device according to the present embodiment includes a start switch 2, a rectifier circuit 3, a capacitor 4, an inverter 5, a welding transformer 6, a diode 7, a head portion 8, a hall element 9, and a current detection portion 10. A voltage detection unit 11, a power detection unit 12, a load detection unit 13, a temperature detection unit 14, a control unit 15, an operation unit 16, a storage unit 17, and a display unit 18.

  The start switch 2, the rectifier circuit 3, the capacitor 4, the inverter 5, the welding transformer 6, and the diode 7 constitute a power source 20 that supplies current to the head unit 8. In addition, the Hall element 9, the current detection unit 10, the voltage detection unit 11, the power detection unit 12, the load detection unit 13, and the control unit 15 constitute a physical quantity detection unit 21 that detects a physical quantity related to an object to be joined. doing.

  FIG. 2 is an enlarged cross-sectional view of the head portion 8. The head unit 8 includes electrodes 80a and 80b made of, for example, a copper (Cu) alloy, molybdenum (Mo), tungsten (W), or the like. As the article 83 to be joined, for example, there is an article composed of a covered wire 84 and a U-shaped terminal 85 arranged so as to wrap around the covered wire 84. In joining (fusing) of the article 83 to be joined, the sheath 86 of the sheath wire 84 is peeled off by heat, and the core 87 and the U-shaped terminal 85 are welded. In addition, it cannot be overemphasized that this Embodiment is applicable not only to such a to-be-joined object but another to-be-joined object.

  The head unit 8 includes thermocouples 81a and 81b attached to the electrodes 80a and 80b, and pressurizing mechanisms 82a and 82b that sandwich and pressurize the workpiece 83 by moving the electrodes 80a and 80b up and down. The pressurizing mechanisms 82a and 82b are provided with load cells (not shown) so that the magnitude of the load applied to the workpiece 83 can be converted into an electric signal.

  Hereinafter, the operation of the bonding apparatus according to the present embodiment will be described. FIG. 3 is a flowchart showing the operation of the joining apparatus, and FIG. 4 is a block diagram showing the configuration of the control unit 15. The control unit 15 includes a preheating control unit 150, a feedback control unit 151, and an abnormality detection unit 152.

  For example, when the user operates the operation unit 16 to instruct the start of joining, a start signal is output from the operation unit 16 and the start switch 2 is turned on. When the start switch 2 is turned on, the rectifier circuit 3 performs full-wave rectification on the AC output of the commercial three-phase AC power supply 1 of AC 200V, and charges the capacitor 4 connected in parallel between the output terminals of the rectifier circuit 3. This rectifier circuit 3 is constituted by a three-phase full-wave mixing bridge using six diodes 30.

  The temperature detector 14 detects the temperatures of the electrodes 80a and 80b based on the voltages from the thermocouples 81a and 81b. The preheating control unit 150 of the control unit 15 controls the pressurization mechanisms 82a and 82b of the head unit 8 to connect the electrodes 80a and 80b before starting the bonding of the workpiece 83 according to an instruction from the user. The inverter 5 is phase-controlled so that the temperatures of the electrodes 80a and 80b detected by the temperature detection unit 14 become the preheating temperature Tr defined in advance.

  The inverter 5 converts the charging voltage of the capacitor 4 into an AC voltage and supplies it to the primary side of the welding transformer 6. The inverter 5 is configured by a bridge composed of four transistors 50. The secondary output of the welding transformer 6 is full-wave rectified by a rectifier (diode) 7 and guided to the electrodes 80a and 80b. Joule heat is generated by passing a current between the electrodes 80a and 80b. As described above, the preheating control unit 150 controls the on / off of the transistor 50 of the inverter 5 so that the temperature of the electrodes 80a and 80b becomes the preheating temperature Tr, thereby reducing the energization amount to the electrodes 80a and 80b. Control. In this manner, the electrodes 80a and 80b can be preheated before starting the bonding of the workpiece 83 (step S1 in FIG. 3). Information on the preheating temperature Tr is preset in the storage unit 17. A method for determining the preheating temperature Tr will be described later.

  Next, the control unit 15 controls the pressurizing mechanisms 82a and 82b of the head unit 8 in a state where the article 83 is disposed between the electrodes 80a and 80b as shown in FIG. Thus, the workpiece 83 is sandwiched and pressed from above and below. The load detection unit 13 detects the load applied to the workpiece 83 based on the output of the load cell provided in the pressurization mechanisms 82a and 82b. The pressurizing mechanisms 82a and 82b adjust the force applied to the electrodes 80a and 80b so that the load applied to the workpiece 83 matches a predetermined load setting value. In this way, preparation for joining is completed.

  In this embodiment, before starting the bonding of the workpiece 83, the electrodes 80a and 80b are brought into contact with each other in a state where the workpiece 83 is not disposed between the electrodes 80a and 80b, and preheating is performed. However, the present invention is not limited to this, and the electrodes 80a and 80b may be preheated in a state where the workpiece 83 is sandwiched and pressed by the electrodes 80a and 80b from above and below as shown in FIG. Whether preheating is performed in a state where the workpiece 83 is not disposed between the electrodes 80a and 80b or whether preheating is performed in the state where the workpiece 83 is disposed is appropriately determined according to the object to be bonded. Good.

  Next, as in the case of preheating, the control unit 15 causes a current to flow between the electrodes 80a and 80b. As a result, a current flows through the workpiece 83, and the workpiece 83 is melted by the generated Joule heat to perform bonding. At this time, the current detection unit 10 detects the current I flowing through the secondary side of the welding transformer 6 (current flowing through the electrodes 80a and 80b) from the output of the Hall element 9 provided on the secondary side of the welding transformer 6. . The voltage detector 11 detects the voltage V applied between the electrodes 80a and 80b. The power detection unit 12 detects the power W supplied to the electrodes 80a and 80b by multiplying the value of the current I detected by the current detection unit 10 and the value of the voltage V detected by the voltage detection unit 11 ( FIG. 3 step S2).

  The feedback control unit 151 of the control unit 15 performs feedback control based on the physical quantity detected during bonding (step S3 in FIG. 3). As described above, the physical quantities detected during bonding include current I, voltage V, and power W. In the storage unit 17, as a physical quantity setting information, a desirable reference waveform of a physical quantity detected during joining (that is, a physical quantity value for each elapsed time from the start of joining) is set in advance.

  The feedback control unit 151 applies current to the electrodes 80a and 80b by operating the inverter 5 to generate an alternating voltage. Then, the feedback control unit 151 monitors the physical quantity (current I, voltage V, power W) detected in step S2 in real time, and the physical quantity at the present time when the elapsed time from the start of joining is t is the storage unit. The on / off state of the transistor 50 of the inverter 5 is controlled so as to coincide with the value at the elapsed time t on the reference waveform of the physical quantity stored in 17 to control the energization amount to the electrodes 80a and 80b (step S3). ). By repeatedly executing such control at every predetermined control period, feedback control is performed so that the waveform of the physical quantity detected during bonding matches a preset reference waveform.

  When the feedback control unit 151 performs control based on feedback of the current I, the current I detected at the present time when the elapsed time from the start of the junction is t is the reference waveform of the current I stored in the storage unit 17. The energization amount to the electrodes 80a and 80b is controlled so as to coincide with the value at the elapsed time t. Similarly, when the feedback control unit 151 performs control based on feedback of the voltage V, the voltage V detected at the present time is the value at the elapsed time t on the reference waveform of the voltage V stored in the storage unit 17. The energization amount may be controlled so as to match, and when the control based on the feedback of the electric power W is performed, the elapsed time on the reference waveform of the electric power W stored in the storage unit 17 is the electric power W detected at the present time. The energization amount may be controlled so as to coincide with the value at t. The user can select which of the current I, voltage V, and power W is used for control.

  The abnormality detection unit 152 of the control unit 15 is the highest of the temperatures detected by the temperature detection unit 14 until a certain time elapses from the start of bonding when the energization to the electrodes 80a and 80b is completed and the bonding is completed. When the temperature exceeds the predetermined upper limit temperature threshold (YES in step S4 in FIG. 3), for example, an alarm is issued by displaying an alarm message on the display unit 18 (step S5 in FIG. 3). Since the temperature of the electrodes 80a and 80b reaches the maximum temperature after the end of energization to the electrodes 80a and 80b, the maximum temperature is monitored.

  Further, when the maximum temperature is lower than the predetermined lower limit temperature threshold value (YES in step S6 in FIG. 3), the abnormality detection unit 152 issues an alarm by displaying an alarm message on the display unit 18, for example (step S7 in FIG. 3). ). Needless to say, the lower limit temperature threshold is lower than the upper limit temperature threshold. Moreover, generally, said preheating temperature Tr becomes a value lower than a minimum temperature threshold value. It is preferable that the period from the start of bonding until a predetermined time elapses before the preheating period for the next bonding of the objects to be bonded starts.

  With the above, the processing of the joining apparatus is completed. When joining a plurality of articles 83 to be joined continuously, the processes of steps S1 to S7 may be performed for each article 83 to be joined.

  Next, a method for determining the preheating temperature Tr will be described. When current is supplied to the electrodes 80a and 80b, the temperature of the electrodes 80a and 80b rises. When the energization to the electrodes 80a and 80b is completed and the joining is completed, the temperature of the electrodes 80a and 80b is lowered. When the joining of the plurality of workpieces 83 is continuously performed, this cycle is repeated. In the conventional joining apparatus, when joining a plurality of workpieces 83 continuously, the ultimate temperatures Tu1, Tu2 and Tu3 of the electrodes 80a and 80b are changed every time the workpiece 83 is joined, for example, FIG. Changes as shown.

  In addition, the temperature of the electrodes 80a and 80b decreases during the rest period from the end of energization to the electrodes 80a and 80b to the start of the next bonding (start of energization) after the bonding of one workpiece 83 is completed. Also, the lowest temperatures (temperatures immediately before the start of the next bonding) Td1, Td2, and Td3 of the electrodes 80a and 80b during the rest period also bond the workpiece 83 in accordance with the changes in the ultimate temperatures Tu1, Tu2, and Tu3. Change in degrees.

  The preheating temperature Tr of the present embodiment is such that when a plurality of objects to be bonded 83 are continuously bonded without preheating, the bonding of one bonded object 83 and the bonding of the next bonded object 83 What is necessary is just to set to the highest temperature (Td3 in the example of FIG. 5) among the minimum temperatures of the electrodes 80a and 80b in the rest period. If a test for obtaining temperature characteristics as shown in FIG. 5 is performed on the object 83 to be joined in advance, the preheating temperature Tr is determined, and information on the determined preheating temperature Tr is registered in the storage unit 17. Good.

  In this embodiment, every time one workpiece 83 is joined, preheating is performed before feedback control similar to that of conventional resistance welding is performed, so that even in the case where short-time joining is repeatedly performed, FIG. As shown in FIG. 6, the ultimate temperature Tu of the electrodes 80a and 80b during bonding can be made substantially constant, and high-quality bonding can be realized. In the present embodiment, by setting the preheating temperature Tr as described above, the temperature of the electrodes 80a and 80b can be reached to a desired temperature in a short time, and the amount of heat transmitted to the article 83 to be bonded. Can be reduced, and thermal failure occurring in the article 83 can be prevented.

  Further, in the present embodiment, when the maximum temperature among the temperatures detected from the start of bonding until a predetermined time elapses exceeds a predetermined upper limit temperature threshold or is lower than a predetermined lower limit temperature threshold, bonding failure, bonding By issuing an alarm that the device is abnormal or the electrodes 80a and 80b are deteriorated, it is possible to notify the user of a bonding failure.

[Second Embodiment]
Next, a second embodiment of the present invention will be described. In the first embodiment, the resistance welding type joining apparatus has been described. In the present embodiment, a pulse heat type joining apparatus will be described. FIG. 7 is a block diagram showing a configuration of a pulse heat type bonding apparatus according to the second embodiment of the present invention. The same reference numerals are given to the same configurations as those in FIG.

  FIG. 8 is an enlarged cross-sectional view of the head portion of the present embodiment. The head portion 8c of the present embodiment includes an electrode (heater chip or heater tool) 80c made of, for example, molybdenum, tungsten, etc., a thermocouple 81c attached to the electrode 80c, and the electrode 80c lowered to move the workpiece 83c. And a pressurizing mechanism (not shown) for sandwiching and pressurizing.

  As the article 83c, for example, a chip inductor covering wire 88 and a chip inductor terminal 89 disposed under the covering wire 88 are available. In the joining of the workpiece 83c, the electrode 90c is caused to generate heat, whereby the covering 90 of the covered wire 88 is peeled off by heat and the core wire 91 and the terminal 89 are thermocompression bonded.

Next, operation | movement of the joining apparatus of this Embodiment is demonstrated. Also in the present embodiment, the flow of processing is the same as in the first embodiment, and therefore, description will be made using the reference numerals in FIG.
In the present embodiment, the electrode 80c generates heat by passing a current through the electrode 80c. The current detection unit 10 detects the current I flowing through the electrode 80c. The voltage detector 11 detects the voltage V across the electrode 80c. The power detection unit 12 detects the power W supplied to the electrode 80c. The temperature detector 14 detects the temperature of the electrode 80c based on the voltage from the thermocouple 81c.

  The preheating control unit 150 of the control unit 15 includes an inverter so that the temperature of the electrode 80c detected by the temperature detection unit 14 becomes a preliminarily preheated temperature Tr before starting the bonding of the workpiece 83c. 5 may be phase-controlled (step S1 in FIG. 3).

  Next, the control unit 15 controls the pressurizing mechanism (not shown) of the head unit 8c to pressurize the workpiece 83c from above with the electrode 80c. The load detector 13 detects the load applied to the article 83c based on the output of the load cell provided in the pressurizing mechanism. And a pressurization mechanism adjusts the force applied to the electrode 80c so that the load applied to the to-be-joined object 83c may correspond with a predetermined load setting value. In this way, preparation for joining is completed.

  Similarly to the first embodiment, the electrode 80c may be preheated in a state where the object 83c is pressurized from above with the electrode 80c, or the electrode 80c may be in a state where it is not in contact with the object 83c. The preheating may be performed.

Next, as in the first embodiment, the feedback control unit 151 of the control unit 15 applies a current to the electrode 80c and performs feedback control based on the physical quantity detected during bonding (steps S2 and S3 in FIG. 3). ).
Moreover, the abnormality detection part 152 of the control part 15 performs abnormality detection similarly to 1st Embodiment (FIG. 3 step S4-S7).

  In this way, the process of the joining apparatus is completed. Similar to the first embodiment, when the joining of the plurality of workpieces 83c is continuously performed, the processes of steps S1 to S7 may be performed for each workpiece 83c. The method for determining the preheating temperature Tr is as described in the first embodiment.

  In the first and second embodiments, a thermocouple is provided on the electrode, and the temperature of the electrode itself is detected. Although the quality of joining can be improved by detecting the temperature of the electrode itself, the location where the thermocouple is provided may be in the vicinity of the electrode (for example, a metal holder for fixing the electrode).

  In the first and second embodiments, the case where the present invention is applied to an inverter type power supply is described. However, the present invention may be applied to a transistor type power supply that directly controls a welding current with a transistor. Is possible. The transistor type power supply is disclosed in, for example, Japanese Patent Application Laid-Open No. 9-277066 and has a well-known configuration, and thus detailed description thereof is omitted.

  The functions of the control unit 15, the operation unit 16, the storage unit 17, and the display unit 18 of the first and second embodiments are a CPU (Central Processing Unit), a computer having a storage device, and an external interface, and these It can be realized by a program that controls the hardware resources. The CPU executes the processing described in the first and second embodiments in accordance with a program stored in the storage device.

  The present invention can be applied to resistance welding type or pulse heat type joining devices.

  DESCRIPTION OF SYMBOLS 1 ... Three-phase alternating current power supply, 2 ... Start switch, 3 ... Rectifier circuit, 4 ... Capacitor, 5 ... Inverter, 6 ... Welding transformer, 7 ... Diode, 8, 8c ... Head part, 9 ... Hall element, 10 ... Current detection 11 ... Voltage detection unit 12 ... Power detection unit 13 ... Load detection unit 14 ... Temperature detection unit 15 ... Control unit 16 ... Operation unit 17 ... Storage unit 18 ... Display unit 20 ... Power source 21 ... Physical quantity detection means, 80a-80c ... Electrode, 81a-81c ... Thermocouple, 82a, 82b ... Pressurization mechanism, 83, 83c ... Bonded object, 150 ... Preheating control part, 151 ... Feedback control part, 152 ... Anomaly detector.

Claims (5)

An electrode that contacts the object to be joined at the time of joining;
A power supply for supplying current to the electrodes;
Physical quantity detection means for detecting one or more physical quantities relating to the objects to be joined during joining;
Storage means for preliminarily storing physical quantity setting information for designating a desired time change of the physical quantity detected during joining;
Temperature detecting means for detecting the temperature of the electrode or the vicinity of the electrode;
Before starting the joining of the object to be joined, the temperature detected by the temperature detecting means is set to a predetermined preheating temperature in a state where the electrode is in contact with or not in contact with the object to be joined. Preheating control means for controlling the energization amount from the power source to the electrode,
Feedback for controlling the energization amount from the power source to the electrode so that the time change of one of the physical quantities detected during joining after preheating coincides with the time change specified by the physical quantity setting information. And a control means. The joining apparatus according to claim 1,
The preheating temperature is a pause period between the bonding of one object to be bonded and the bonding of the next object when the bonding of a plurality of objects to be bonded is continuously performed without preheating. The joining device is preset to the highest temperature among the minimum temperatures of the electrodes in FIG. The joining apparatus according to claim 1 or 2,
Further, the apparatus includes an abnormality detection unit that issues an alarm when a maximum temperature of the temperatures detected by the temperature detection unit exceeds a predetermined upper limit temperature threshold until a predetermined time has elapsed since the start of bonding. Joining device. The joining apparatus according to claim 1 or 2,
Further, the apparatus includes an abnormality detection unit that issues an alarm when the maximum temperature detected by the temperature detection unit is less than a predetermined lower limit temperature threshold before a predetermined time elapses from the start of bonding. Joining device. In the joining device according to any one of claims 1 to 4,
The electrode is a resistance welding type electrode that pressurizes the object to be bonded, or a pulse heat type electrode that presses and presses the object to be bonded from above.

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