JP2018001585A - Liquid emission head substrate, liquid emission head, and recording apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To decrease, in a liquid emission head substrate having a grid of wires, uneven resistance in the wires.SOLUTION: In a liquid emission head substrate, one aspect comprises a plurality of liquid emission elements; a plurality of power source terminals aligned in one direction; and a grid of first wires connected to an n (n is a natural number of 1 or larger) number of the plurality of power source terminals. Each of the first wires has a plurality of connection parts connected to one of the plurality of liquid emission elements different from one another. Each of the plurality of connection parts has: a first connection part highest in resistance from the n number of power source terminals; and a second connection part located furthest from the first connection part. If, in the first direction, the position coordinate of the arrangement gravity of the n number of power source wires, which is obtained by dividing the sum of the position coordinates of the n number of power terminals, is represented by Cm, the position coordinate of the first connection part is Ca, and the position coordinate of the second connection part is Cb, the absolute value of the difference between Ca and Cm is smaller than the absolute value of the difference between Cb and Cm.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a semiconductor substrate for a liquid discharge head, a liquid discharge head, and a recording apparatus.

  In the liquid discharge head substrate in which the power supply wiring and the ground wiring are branched and routed for each of the plurality of liquid discharge elements, the parasitic resistance of these lines with respect to each liquid discharge element is different. As a result, it is known that the degree of voltage drop in each liquid ejection element becomes non-uniform. In Patent Document 1, in order to reduce the difference in the degree of voltage drop caused by the parasitic resistance of the power supply wiring and the ground wiring, the design is made so that the total parasitic resistance of the power supply wiring and the ground wiring is matched in each liquid ejection element. Has been done.

JP-A-2015-96318

  The inventors have found that even in a liquid discharge head substrate having grid-like wiring, the resistance becomes non-uniform for each liquid discharge element. This non-uniformity of resistance and the arrangement of power supply terminals have not been studied.

One aspect of the substrate for a liquid discharge head described in this specification is:
A plurality of liquid ejection elements;
A plurality of power terminals arranged in a first direction;
A grid-like first wiring connected to n (n is a natural number of 1 or more) of the plurality of power supply terminals;
Have
The first wiring has a plurality of connection portions for connection to different ones of the plurality of liquid ejection elements,
The plurality of connecting portions include a first connecting portion having the largest resistance from the n power supply terminals, and a second connecting portion located farthest from the first connecting portion,
In the first direction, Cm is the position coordinate of the center of gravity of the n power supply wirings obtained by dividing the sum of the position coordinates of the n power supply terminals by n, and the position coordinate of the first connection portion is Ca. When the position coordinates of the second connection part is Cb,
The absolute value of the difference between Ca and Cm is smaller than the absolute value of the difference between Cb and Cm.

In addition, the liquid discharge head substrate described in this specification is
A plurality of liquid ejection elements;
A plurality of power terminals arranged in a first direction;
A grid-like first wiring connected to n (n is a natural number of 1 or more) of the plurality of power supply terminals;
Have
The first wiring has a plurality of connection portions for connection to different ones of the plurality of liquid ejection elements,
The plurality of connecting portions include a first connecting portion having the largest resistance from the n power supply terminals, and a second connecting portion located farthest from the first connecting portion,
Ni external wirings are connected to the i-th power supply terminal (i is a natural number of 1 to n) of the n power supply terminals,
In the first direction, when the position coordinate of the i-th power terminal is Ci, the connection center of gravity Cc of the n power terminals is

Represented by
When the position coordinate of the first connection part is Ca and the position coordinate of the second connection part is Cb,
The absolute value of the difference between Ca and Cc is smaller than the absolute value of the difference between Cb and Cc.

Another aspect of the liquid discharge head substrate described in this specification is:
A substrate having at least a first side and a second side extending along a first direction, and a third side and a fourth side extending along a second direction intersecting the first direction;
A plurality of liquid ejection elements disposed on the substrate;
A plurality of power supply terminals arranged along the first side of the substrate;
A grid-like first wiring connected to n (n is a natural number of 1 or more) power terminals among the plurality of power terminals;
Have
The first wiring has a plurality of connection portions for connection to different ones of the plurality of liquid ejection elements,
The substrate is
A perpendicular line drawn from an intersection of a straight line including the first side and a straight line including the third side to a straight line including the second side; and a first region including the third side at an outer edge;
A second region including the perpendicular and the fourth side at an outer edge;
At least one of the plurality of connection portions is disposed in the first region,
In the first direction, when the position coordinate of the arrangement center of gravity of the n power supply wirings obtained by dividing the sum of the position coordinates of the n power supply terminals by n is Cm,
The arrangement center of gravity having the position coordinates Cm is arranged at a position closer to the third side than the fourth side.

Furthermore, another aspect of the liquid discharge head substrate described in this specification is as follows:
A substrate having at least a first side and a second side extending along a first direction, and a third side and a fourth side extending along a second direction intersecting the first direction;
A plurality of liquid ejection elements disposed on the substrate;
A plurality of power supply terminals arranged along the first side of the substrate;
A grid-like first wiring connected to n (n is a natural number of 1 or more) power terminals among the plurality of power terminals;
Have
The first wiring has a plurality of connection portions for connection to different ones of the plurality of liquid ejection elements,
The substrate is
A first region including a perpendicular drawn from an intersection of a straight line including the first side and a straight line including the third side to a straight line including the second side, and the third side;
A second region including the perpendicular and the fourth side,
At least one of the plurality of connection portions is disposed in the first region,
Ni external wirings are connected to the i-th power supply terminal (i is a natural number of 1 to n) of the n power supply terminals,
In the first direction, when the position coordinate of the i-th power supply terminal is Ci, the position coordinate Cc of the connection gravity center of the n power supply terminals is:

Represented by
The connection center of gravity of the n power supply terminals having the position coordinates Cc is arranged closer to the third side than the fourth side.

  According to some aspects described in the present specification, in the liquid discharge head substrate, it is possible to reduce the non-uniformity of resistance for each liquid discharge element.

FIG. 3 is a top view of the liquid discharge head substrate according to the first embodiment. Circuit diagram showing connection of one liquid discharge element, a drive element and wiring connected to it Enlarged view of the region S surrounded by a dotted line in FIG. FIG. 3 is a top view of the liquid discharge head substrate according to the first embodiment. Top view of substrate for liquid ejection head of comparative example The figure which shows the relationship between the position of a some liquid discharge element in the substrate for liquid discharge heads of a comparative example and Embodiment 1, and a voltage drop. 1 is a top view of a liquid discharge head substrate having a substrate shape different from that of the liquid discharge head substrate of FIG. FIG. 1 is a top view illustrating an example of a liquid discharge head substrate having a larger number of power supply terminals connected to external wiring than the liquid discharge head substrate of FIG. FIG. 4 is a top view illustrating a liquid discharge head substrate according to Embodiment 1. Circuit diagram of a part of the substrate for a liquid discharge head that uses a voltage-compensated drive circuit FIG. 6 is a top view of a liquid discharge head semiconductor device according to a third embodiment. FIG. 6 is a top view of a liquid discharge head semiconductor device according to a third embodiment. The figure explaining the application example of the board | substrate for liquid discharge heads

  Hereinafter, a liquid discharge head substrate, a liquid discharge head having the same, and a recording apparatus according to an embodiment will be described with reference to the drawings. In the following, examples of preferred embodiments are shown, but the present invention is not limited thereto, and a part thereof may be changed without departing from the gist of the present invention.

  Each drawing is described for the purpose of explaining the structure or configuration, and the dimensions of the illustrated members may be different from the dimensions of the actual components. Moreover, in each figure, the same reference number is attached | subjected to the same member or the same component, and description is abbreviate | omitted about the overlapping content hereafter.

(Embodiment 1)
FIG. 6 is a top view according to the liquid discharge head substrate of the present embodiment. In the present embodiment, the liquid discharge head substrate 100 is connected to n (n is a natural number of 1 or more) among the plurality of liquid discharge elements 103, the plurality of power supply terminals 106 arranged in the X direction, and the plurality of power supply terminals 106. A grid-like wiring 105. Further, the liquid discharge head substrate 100 includes an ink supply port 102 arranged in the X direction and a plurality of drive elements 104 that respectively drive the plurality of liquid discharge elements 103. The plurality of liquid ejection elements 103 are connected to corresponding driving elements 104, respectively.

  FIG. 1 shows a top view of an example of the liquid discharge head substrate 100 when n = 4. A plurality of ink supply ports 102, a plurality of liquid ejection elements 103, and a plurality of drive elements 104 are arranged side by side in the X direction on the substrate 101. In addition, a wiring 105 electrically connected to the plurality of liquid ejection elements and a plurality of power supply terminals 106 for connecting the wiring 105 to the outside of the liquid ejection head substrate 100 are arranged. Each power supply terminal 106 is connected with one or a plurality of wirings by wire bonding, for example.

  The wiring 105 has a planar shape, specifically, a lattice shape. Among the power supply terminals 106, four power supply terminals 106 a to 106 d connected to the wiring 105 are externally connected to the power supply terminals 106 a to 106 d. A wiring for supplying a potential to the liquid ejection element is connected. The wiring 105 has a lattice shape, and the wiring 105 has a planar shape having a plurality of openings, and indicates a shape in which there are two or more current paths from one point to another point.

Arrangement center of gravity 107 is an arrangement center of gravity of power supply terminals 106a to 106d in the X direction. The position coordinate Cm4 of the arrangement gravity center 107 of the power supply terminals 106a to 106d is defined as the following equation 1 using the gravity center coordinates C1 to C4 of the power supply terminals 106a to 106d, where the position in the X direction of each element is the coordinate C. Is done.
Cm4 = [C1 + C2 + C3 + C4] ÷ 4 (Formula 1)

  That is, the coordinates of the arrangement center of gravity in the X direction of the n power terminals connected to the wiring 105 are obtained by dividing the sum of the position coordinates of the n power terminals by n (n is a natural number of 1 or more). Can do. Note that the origin of the coordinates of the position in the X direction is not particularly limited. For example, an intersection point (vertex A in this embodiment) of a straight line including the first side E and a straight line including the third side G may be used as the origin.

  The wiring 105 has a plurality of connection portions 117 for connection to different ones of the plurality of liquid ejection elements 103. The connection portion 117 includes a portion connected to a conductive layer functioning as another wiring in a conductive layer functioning as the wiring 105, or a portion connected to a contact plug or the like for connection between the wiring 105 and another wiring. Point to.

  Next, the connection between the liquid ejection element 103, the driving element 104, and the wiring will be described using one liquid ejection element 103 as an example with reference to the circuit diagram of FIG. The drive element 104 is configured by, for example, an NMOS transistor, and performs a switching operation when a voltage is input to a gate terminal. One end of the liquid ejection element 103 is connected to the power supply terminal 116 via the power supply wiring 115, and the other end is connected to the drain terminal of the drive element 104. The source terminal of the drive element 104 is connected to the power supply terminal 106 via the wiring 105. Here, as an example, the power supply terminal 116 is a power supply terminal for supplying a high potential, and the power supply terminal 106 is a ground terminal for supplying a ground potential. Although not shown, the wiring 105 and the power supply wiring 115 have parasitic resistance.

  FIG. 3 is an enlarged view of a region S surrounded by a dotted line in FIG. Hereinafter, the positional relationship among the ink supply port 102, the liquid ejection element 103, the drive element 104, and the wiring 105 will be described with reference to the drawings.

  Since the wiring 105 is arranged avoiding each ink supply port 102, the wiring 105 has a lattice shape as a whole. The wiring 105 is connected to the driving element 104 through a wiring 108 indicated by a dotted line. The wiring 105 has a connection portion 117 that is connected to the wiring 108 in another layer through a through hole formed in the insulating film. Here, an example is shown in which the wiring 105 is connected to one wiring 108 via three connection portions, but the number of connection portions is not limited to this, and the number of connection portions may be one, two, four, or more. . In FIG. 1, the wiring 108 is omitted.

  Further, the same number of wirings for connecting to the outside are connected to the n power supply terminals 106 by wire bonding. For example, the power supply terminals 106a to 106d can be configured to have one external wiring connected thereto.

  A liquid discharge head substrate 100 having the same configuration as that of FIG. 1 is shown in FIG. In the liquid discharge head substrate 100 of FIG. 4, the wiring 105 has a lattice shape, and the angle of the corner opposite to the side where the power supply terminal 106 is disposed is an acute angle and an obtuse angle, respectively. The parasitic resistance to the current from the power supply terminal 106 varies depending on the location. Therefore, the location dependence of the voltage drop amount due to the parasitic resistance with respect to the current from the power supply terminal 106 is larger than that in the case where the corner is a right angle.

  When performing printing or the like using a liquid ejection head, when increasing the number of liquid ejection elements 103 that perform ejection at the same time in order to increase the printing speed, if the resistance in the wiring 105 is large, there is a possibility that the voltage drop increases and cannot be driven. There is. Therefore, the voltage of the power supply terminal 116 is set in accordance with the power required for the discharge of the liquid discharge element 103 connected at the connection portion having the largest resistance from the power supply terminal 106. Then, surplus power is input to the liquid ejection element 103 connected to the connection portion having a small resistance from the power supply terminal 106. Inputting surplus power to the liquid ejection element 103 causes an increase in power consumption and a shortened life of the liquid ejection element 103. Furthermore, the size of the substrate is increased by setting the drive circuit size to the portion where the resistance is maximized.

  In the wiring 105, the resistance of the connection portion having the largest resistance is reduced, and the difference between the maximum value and the minimum value of the resistance is reduced, that is, the unevenness of the resistance in the wiring 105 is reduced, thereby solving the above-described problem. Can do. Therefore, the power supply terminal 106 that contributes to the potential of the power supply terminal 106 that supplies the potential is larger in the connection portion having the largest resistance due to the shape of the wiring 105 than in the other connection portion (for example, having the smallest resistance value). Arrange.

In FIG. 4, a plurality of connection portions 117 includes a connection portion 117a having the largest resistance due to the shape of the wiring 105 and a connection portion 117b farthest from the connection portion 117a with respect to the current from the power supply terminal 106. Have. The position coordinate of the connection part 117a in the X direction is Ca, and the position coordinate of the connection part 117b is Cb. FIG. 4 shows the position coordinates Cm of the arrangement center of gravity 107 of the n power terminals 106. The monodentate coordinate Cm can be obtained by the method described above. At this time, by arranging the n power supply terminals 106 so that the absolute value of the difference between Ca and Cm is smaller than the absolute value of the difference between Cb and Cm, the connection portion 117a and the other connection portion 117 The difference in resistance value can be reduced. That is, Ca, Cb, and Cm satisfy the following Expression 2.
| Cm-Ca | <| Cb-Cm | (Formula 2)

  In the liquid discharge head substrate of the present embodiment, the plurality of connection portions 117 have a plurality of rows having connection portions arranged along the X direction, and the plurality of rows are arranged in the Y direction intersecting the X direction. . Here, the Y direction is parallel to one side of the substrate 101. The connecting portion 117a is located in a row farthest from the n power supply terminals 116 in the Y direction among the plurality of rows. Further, the connecting portion 117a is located at the end in the row. That is, in FIG. 4, among the plurality of connection portions 117, the connection portion closest to the second side F and the third side G of the substrate 101 is 117 a.

  The liquid discharge head substrate 100 of the present embodiment will be described in more detail with reference to FIG. The substrate 101 includes a first side E and a second side F extending along a first direction, a third side G and a fourth side H extending along a second direction intersecting the first direction. At least. The interior angle between the straight line including the first side E and the straight line including the third side G is an obtuse angle. The obtuse angle end of the first side E is the vertex A, and the acute angle end is the vertex B. Here, an example in which the shape of the substrate 101 is a parallelogram is shown.

  The substrate 101 is divided by a vertical line 112 that is divided from a cross point (here, vertex A) of a straight line including the first side E and a straight line including the third side G into a straight line including the second side F. A region 118 and a second region 119 are included. The first region 118 is a region surrounded by a one-dot chain line in FIG. 1, and the second region 119 is a region surrounded by a one-dot chain line in FIG.

  That is, the outer edge of the first region 118 includes the perpendicular line 112 and the third side G, and is represented by a one-dot chain line in FIG. Further, the outer edge of the second region 119 includes a perpendicular line 112 and a fourth side H, and is represented by a broken line in FIG. When the intersection of the straight line including the first side E and the straight line including the third side G is inside the substrate, the outer edges of the first region 118 and the second region 119 are the straight line including the perpendicular 112 and the substrate 101. Including the intersection of the outer edges. The middle line 113 is a straight line passing through the midpoint of the first side E and the midpoint of the second side F.

  The plurality of liquid ejection elements 103 are arranged side by side in the X direction, and form a row of liquid ejection elements 103. Furthermore, in this embodiment, four rows of liquid ejection elements 103 are arranged on the substrate 101 in the Y direction with the arrangement origin being shifted in the X direction and the Y direction. For this reason, the liquid ejection element 103 is also disposed in the region 118. The wiring 105 has a shape corresponding to the arrangement of the liquid ejection element 103 in order to supply a potential to the liquid ejection element 103. Accordingly, the wiring 105 and a part of the connection portion 117 are also arranged in the first region 118, which is a region including an acute angle close to the intersection of the second side F and the third side G.

  The resistance of the wiring 105 to the current from the n power supply terminals 106 is increased in the first region 108, and in particular, an acute angle between the second side F and the third side G where the connection portion 117a is disposed. In the area of In addition, the voltage drop amount in the connection portion 117 with respect to the current from the n power supply terminals 106 due to the resistance of the wiring 105 is large in the first region 108, and in particular, the second side F where the connection portion 117 a is disposed It becomes large in an acute angle region between the second sides G. Therefore, the resistance distribution in the wiring 105 can be reduced by reducing the maximum resistance of the wiring 105 with respect to the current from the n power supply terminals 106 in the connection portion 117a. That is, the distribution of the voltage drop amount in the wiring 105 can be reduced.

  Therefore, by arranging the n power terminals 106 so that the arrangement gravity center 107 of the n power terminals 106 is closer to the third side G than the fourth side H in the X direction, the wiring 105 The maximum resistance value can be reduced, and the resistance distribution in the wiring 105 can be reduced.

  For example, among n power terminals 106, the number of power terminals 106 arranged at a position where the distance to the third side G is smaller than the distance to the fourth side H is set to the third side G. The number of power supply terminals 106 arranged at a position where the distance to the fourth side H is smaller than the distance is increased. Thereby, the arrangement center of gravity 117 of the n power supply terminals 106 is positioned closer to the third side G than the fourth side H.

  In the liquid discharge head substrate 100 of FIG. 4, two liquid discharge elements 103 are arranged along the ink supply port 102, and each is connected to a different drive element 104. Other connection relationships are not shown, but are as described with reference to FIG. The ink supply ports 102 are distributed in four rows along with the rows of the liquid ejection elements 103. In order to avoid the ink supply ports 102 arranged in two dimensions, the wiring 105 is a grid-shaped wiring. In other words, the wiring 105 is provided with an opening so that the ink supply port 102 penetrates. Such planar wiring 105 can be configured by using one of the metal layers of a semiconductor element formed by a semiconductor process.

  Next, the effect of this embodiment will be described using a comparative example. FIG. 5 is a top view of a liquid ejection head substrate having the same number of liquid ejection elements 103 as the liquid ejection head substrate 100 of the present embodiment and having the same shape of wiring 105 as a comparative example. Power supply terminals 506a to 506c are arranged along the first side E. The liquid discharge head substrate of the comparative example is different from the liquid discharge head substrate 100 of the present embodiment in that the power terminals 506a to 506c are arranged at the fourth side H side with a center of gravity slightly from the center of the substrate 101 in the X direction. The difference is that they are arranged so as to be shifted to the positions. On the substrate 101, four rows having 32 liquid ejection elements 103 arranged in the X direction are arranged in the Y direction.

  FIG. 6 shows the positions of the connecting portions 117 having different positions in the X direction and the Y direction and the respective connecting portions in the comparative example of FIG. 5 and the liquid discharge head substrate 100 of the present embodiment of FIG. It is the result of having simulated the relationship of the voltage drop amount of the liquid discharge element 103 to be performed. The simulation was performed under a condition in which current flows through all the liquid ejection elements 103. The vertical axis represents the voltage drop amount of the liquid discharge element 103 normalized with the voltage drop amount of the liquid discharge element 103 having the largest voltage drop amount being 1. The horizontal axis indicates the number of the connecting portion counted from the third side G side. That is, the smaller the number on the horizontal axis, the closer to the third side G the connection part 117 is.

  FIG. 6 shows the results for the liquid ejection elements 103 arranged in the first column closest to the first side E and in the fourth column closest to the second side F. Further, the voltage drop amount of the liquid discharge element 103 of the liquid discharge head substrate of the comparative example is represented by ◯, and the voltage drop amount of the liquid discharge element 103 of the liquid discharge head substrate of the present embodiment is represented by x.

  First, a difference in voltage drop amount of the liquid ejection element 103 due to a difference in position in the X direction and the Y direction in the liquid ejection head substrate 100 will be considered. Since the liquid discharge head substrate of the comparative example and the liquid discharge head substrate 100 of the present embodiment show the same tendency, the liquid discharge head substrate 100 of the present embodiment will be considered here.

  6 that the voltage drop of the liquid ejection element 103 having the smallest number in the fourth column has the largest voltage drop, that is, the liquid ejection element 103 having the largest voltage drop is present in the first region 118. Further, as shown in FIG. 6, the voltage drop is larger as the liquid ejection elements 103 are arranged in a row farther from the power supply terminal 106, and as the liquid ejection elements 103 are arranged in a position having a smaller number in the farther row. In this simulation, the only difference between the liquid ejection elements 103 is the resistance value of the connected wiring 105. Therefore, the connection portion 117 of the wiring 105 connected to the liquid ejection element 103 having a large voltage drop has a large resistance.

  FIG. 6 shows only the liquid ejection elements 103 in the first and fourth rows, but the voltage drop amounts of the liquid ejection elements 103 in the second and third rows are the same as those in the first and fourth rows. Show the trend. Further, as described above, the liquid drop elements 103 arranged in the second column from the first column, the third column from the second column, the third column from the third column, and the fourth column from the third column tend to have a larger voltage drop amount. is there. That is, in the liquid discharge head substrate 100, the connection portion 117 has a high resistance in a region near the third side G, and the connection portion 117 included in a column far from the power supply terminal 106 tends to have a higher resistance. .

  Therefore, it can be seen that the connection portion 117 having the largest resistance to the current from the power supply terminals 106 a to 106 d is in the first region 118. Similarly, the resistance to the current from the power supply terminals 106a to 106d is as much as the connection portion 117 arranged in a row far from the power supply terminal 106, and the connection portion 117 arranged in a position with a smaller number in the far row. Is big.

  As described above, there is a connection portion having the maximum resistance value for each column of the connection portions 117. In the region closer to the third side than the fourth side H, the closer to the side G, the larger the parasitic resistance of the connection unit 117 becomes. This is because the power supply terminals 106b to 106d other than the nearest power supply terminal 106a are farther at the connection part 117 closer to the third side G than the power supply terminal 106a as compared to the other connection parts 117. In addition, since the wiring 105 has a plurality of holes so as to form a lattice shape and has an acute angle and an obtuse angle, the current path of the current from the power supply terminal 106 is physically restricted. .

  On the other hand, in the liquid discharge head substrate 100 according to the present embodiment, the arrangement gravity center 107 of the n power supply terminals 106 connected to the wiring 105 is changed from the fourth side H to the third side G as described above. Close position. Thereby, in the X direction, the distance from the connection part 117a having the largest resistance from the n power supply terminals 106 to the arrangement center of gravity 107 among the plurality of connection parts 117 of the wiring 105 is the connection part 117b farthest from the connection part 117a. It becomes smaller than the distance from the placement center of gravity. Therefore, the resistance value of the connection portion 117a having the largest resistance can be reduced, and the non-uniformity of the resistance in the wiring 115 and the voltage drop amount can be reduced.

  Next, the effect of the liquid discharge head substrate 100 according to the present embodiment on the liquid discharge head substrate of the comparative example shown in FIG. 5 will be described with reference to FIG.

  From FIG. 6, the liquid discharge element 103 in the first region 118, particularly the liquid discharge element 103 closest to the second side F and the third side G, has a voltage drop amount in the present embodiment as compared with the comparative example. It is significantly smaller. That is, by adopting the configuration of the present embodiment from the configuration of the comparative example, the resistance of the connection portion having a high resistance in the first region 118, particularly the connection portion 117 a closest to the second side F and the third side G. It can be seen that is reduced.

  Further, from FIG. 6, the maximum voltage drop amount and the minimum voltage of the liquid discharge element 103 of the present embodiment with respect to the difference between the maximum voltage drop amount and the minimum voltage drop amount of the liquid discharge element 103 of the comparative example. The difference in the amount of descent is greatly reduced. In the example of FIG. 6, the position of the power supply terminal 106 connected to the wiring 105 in the X direction is changed from the position of the comparative example to the position of the present embodiment, so that the maximum value of the voltage drop in the liquid ejection element 103 is The difference between the minimum values can be reduced by about 30%.

  That is, with the configuration of this embodiment, the difference in resistance from the n power supply terminals 106 due to the shape of the wiring 105 due to the position of the connection portion 117 can be reduced, and a plurality of connection portions can be reduced. The difference in resistance value between 117 can be reduced. Therefore, the difference in the voltage drop amount between the plurality of connection portions 117 can be reduced.

  Therefore, since the drive element 104 can be designed to be small, the size of the liquid discharge head substrate 100 can be reduced. In addition, since the maximum resistance value of the connection portion 117 can be reduced, many liquid ejection elements 103 can be driven at the same time, and high-speed printing can be achieved. Furthermore, the surplus power applied to the liquid ejection element 103 having a small resistance at the connection portion 117 can be reduced, leading to a longer life.

  In this embodiment, the case where the ground potential is supplied to the wiring 105 having a lattice shape is described; however, the liquid discharge head substrate 100 described in this specification is not limited thereto. The arrangement of the power supply wiring described in this specification is effective when at least one of the power supply wirings has a grid shape. In the wiring having a grid shape and uneven resistance from the power supply wiring, The maximum value of can be reduced.

  Next, a liquid discharge head substrate having a substrate 101 shape different from the liquid discharge head substrate shown in FIG. 1 will be described with reference to the top view of FIG. The board 121 has a fifth side I perpendicular to the first side E and intersects the third side G, and a sixth side J perpendicular to the first side E and intersects the fourth side H. Different from the substrate 101. In this shape, the straight line including the third side G of the substrate 121 and the second side F form an acute angle, and the first region 118 is a region including the acute angle. Therefore, among the plurality of connection portions 117, the connection portion 117 a having the largest resistance from the n power supply terminals 106 is arranged in the first region 118.

  Even in this case, by arranging the n power supply terminals 106 so that the absolute value of the difference between Ca and Cm is smaller than the absolute value of the difference between Cb and Cm, the connection portion 117a and the other connection portions 117 The difference in resistance value and the difference in voltage drop can be reduced. Further, the n power terminals 106 are arranged so that the arrangement center of gravity 107 of the n power terminals 106 is closer to the third side G than the fourth side H in the X direction. Thereby, the maximum value of the resistance of the wiring 105 can be reduced, and the distribution of resistance and voltage drop in the wiring 105 can be reduced.

  In this embodiment, the ground potential is supplied to the power supply terminal 106 and the center of gravity 107 of the power supply terminal 106 is arranged closer to the third side G than the fourth side H. The substrate for the head is not limited to this. The effect of the present embodiment can also be obtained by connecting the power terminal 116 to the grid-shaped wiring and arranging the center of gravity of the power terminal 116 closer to the third side G than the fourth side H. In addition, when both the arrangement center of gravity 107 of the power supply terminal 106 and the arrangement center of gravity of the power supply terminal 116 are arranged at positions closer to the third side G than the fourth side H, the effect is highest.

  Note that an example in which the number of power supply terminals 106 to which an external current is shared is larger than that in FIG. This will be described with reference to the top view of the working substrate. In the present embodiment, the power supply terminals 106 are arranged in the X direction along the first side E, and the wiring 105 has a shape along the parallelogram substrate 301. Therefore, by placing the power supply terminal 106 connected to the wiring from the outside on the obtuse angle end A side with respect to the center of the first side E, the center of gravity of the power supply terminal 106 is brought closer to the connection portion having a large resistance. be able to. Therefore, on the substrate 301, four power supply terminals 106 to which wiring from the outside is connected are concentrated and arranged closer to the third side G than the middle line 113.

  For the sake of explanation, a perpendicular line 302 is defined. The perpendicular 302 is a straight line that passes through the midpoint of the first side E and is perpendicular to the first direction. In the parallelogram substrate 301, more liquid ejection elements 103 are arranged on the third side G side than the perpendicular 302 on the fourth side H side. Therefore, when the number of the liquid ejecting elements 103 that are driven simultaneously increases, the current concentrates on the power supply terminal 106 that is disposed on the third side G side from the perpendicular 302 and connected to the wiring from the outside.

  As shown in FIG. 8, by arranging the power supply terminal 106 connected to the wiring from the outside, the current flowing in the region on the third side G side from the perpendicular 302 is larger than the power supply terminal in the case of FIG. 1. 106. Therefore, when a large number of liquid ejection elements 103 are driven simultaneously, an increase in ground potential due to current concentration that occurs near the third side G from the perpendicular 302 can be reduced.

  In the present embodiment, an example is described in which the number of power supply terminals 106 arranged on the third side G side from the vertical line 302 is increased on the premise that bonding is performed from the outside to each power supply terminal one by one. . However, the realization method can be realized not only by changing the number of the power supply terminals 106 connected to the wiring from the outside, but also by increasing the number of bondings of the external wiring connected to each power supply terminal 106.

  Further, the substrate 100 for the liquid discharge head shown in FIG. For example, as shown in FIG. 9, the substrate shape in which the corners between the first side E and the third side G and the corners between the second side F and the third side G are removed, can do. Also in this case, the same effect can be obtained by arranging the power supply terminal 106 connected to the wiring from the outside so that the arrangement center of gravity 107 satisfies the above-described conditions. For example, the intersection A of the straight line including the first side E and the straight line including the third side G is located outside the liquid discharge head substrate 100 as shown in FIG. Even in this case, as in FIG. 1, the first region 118 and the second region 119 can be defined in the liquid discharge head substrate 100 by the vertical line 112. The other parts are the same as in FIG.

(Embodiment 2)
An example of a liquid discharge head substrate having a drive circuit different from that of Embodiment 1 and the liquid discharge element 103 will be described. In the first embodiment, the liquid ejection element 103 is driven by a driving element that performs a switching operation. However, the present embodiment is not limited to this. For example, it may be driven by a circuit that performs voltage compensation as shown in FIG. The configuration of the voltage compensated driving circuit will be described below with reference to the drawings. Here, an example is shown in which a ground potential is supplied to the power supply terminal 106 from the outside and a high voltage such as 32 V is applied to the power supply terminal 116. One end of the liquid ejection device 103 is connected to the wiring 105 through the driving element 202, and the other end is connected to the wiring 115 through the driving element 201.

  Specifically, one end of the liquid ejection element 103 is connected to the source terminal of an NMOS transistor (drive element 201) that performs a source follower operation. The other end of the liquid ejection element 103 is connected to the source terminal of a PMOS transistor (drive element 202) that performs a source follower operation. The drain terminal of the NMOS transistor as the driving element 201 is connected to the power supply terminal 116 through the power supply wiring 115.

  Further, the drain terminal of the PMOS transistor which is the driving element 202 is connected to the power supply terminal 106 through the wiring 105. With such a configuration, the voltage across the liquid ejection element 103 can be controlled by the gate voltage of the NMOS transistor that is the driving element 201 and the gate voltage of the PMOS transistor that is the driving element 202. This type of drive circuit is called a voltage compensated drive circuit.

  A drive pulse for controlling on / off of the NMOS transistor is applied from a control circuit (not shown) to the gate terminal of the NMOS transistor which is the drive element 201. A signal of a constant voltage VHTML is applied to the gate terminal of the PMOS transistor that is the driving element 202.

  In the voltage compensated driving circuit, the influence of the voltage rise due to the resistance of the wiring 105 and the voltage drop due to the resistance of the power supply wiring 115 can be reduced by sandwiching the liquid ejection element 103 between the NMOS and PMOS performing the source follower operation. Further, the voltage applied to both ends of the recording element can be made close to a constant voltage up to a certain voltage determined by the characteristics of the MOS.

However, if the resistance values of the wiring 105 and the power supply wiring 115 are large, when many liquid ejection elements 103 are simultaneously turned on, for example, the voltage drop in the power supply wiring 115 becomes large. When the drain terminal potential VH of the NMOS transistor is lower than the voltage V _limit expressed by the following Equation 3, the voltage supplied to the drive element cannot be maintained.
_{VH <V limit = V HTMH -V} th + V Dsat ( Equation 3)

In Equation 3, Vth represents the threshold voltage of the NMOS transistor that is the driving element 201, V _Dsat represents the saturation drain voltage, and V _HTMH represents the gate voltage.

  The same is true for the wiring 105 to which the ground potential is supplied. In this embodiment mode, at least one of the wirings 105 and 115 has non-uniformity due to the wiring shape of the resistance from the power supply terminal. Such a liquid discharge head substrate has a voltage compensation circuit using a MOS transistor that operates as a source follower, and at least one of the power supply terminals 106 and 116 becomes the center of gravity of the arrangement of the power supply wiring shown in the first embodiment. Placed in. With such a configuration, a voltage drop in the power supply wiring 115 and a voltage floating in the wiring 105 (deviation from the ground potential) are reduced. For this reason, even when more liquid ejecting elements 103 are driven simultaneously, the voltage compensation characteristic can be maintained.

(Embodiment 3)
In this embodiment, an example of a liquid discharge head substrate having a different number of external wirings connected to one power supply terminal 106 by wire bonding or the like will be described with reference to FIG. Wiring 706 from the outside is connected to n power supply terminals 106, and the number of wirings 706 connected to the i-th power supply terminal (i is a natural number of 1 to n) is Ni (Ni is a natural number of 1 or more). Consider the case. If the position coordinate of the i-th power supply terminal 106 in the X direction at this time is Ci, the connection center-of-gravity coordinate Cc of the n power supply terminals 106 is defined as the following Expression 4.

（式４）

(Formula 4)

  In this embodiment, the connection center of gravity of the n power supply terminals 106 calculated by the above equation 4 is arranged at the same position as the arrangement gravity center Cm of the first embodiment, so that the connection to the n power supply terminals 106 is performed. It is possible to reduce the non-uniformity of resistance of the wiring 105 to be used. In addition, nonuniformity in the voltage drop amount of the wiring 105 connected to the n power supply terminals 106 can be reduced.

  Specifically, the liquid discharge head substrate can be configured as follows. FIG. 11 illustrates a case where n = 4, N1, N2 = 2, N3, and N4 = 1. In this specification, the connection center of gravity means an electrical center of gravity in consideration of the position of n power supply terminals 106 connected to the wiring 105 and the number of external wirings 706 connected to each of them. To do.

  The wiring 105 has a plurality of connection portions 117 for connecting to different ones of the plurality of liquid ejection elements 103. The plurality of connecting portions 117 include a connecting portion 117a having the largest resistance from the n power supply terminals and a connecting portion 117b that is farthest from the connecting portion 117a. At this time, in the X direction, the absolute value of the difference between Ca and Cc is smaller than the absolute value of the difference between Cb and Cc, where Ca is the position coordinate of the connection portion 117a and Cb is the position coordinate of the connection portion 117b. Thus, n power supply terminals 106 are arranged. Thereby, in the X direction, the distance between the connection center of gravity of the n power terminals 106 and the connection part 117a having a large resistance can be made smaller than the distance between the connection part 117b farthest from the connection part 117a and the connection center of gravity.

  Similarly to the substrate 101, the substrate 701 also has a perpendicular line 112 extending from an intersection of a straight line including the first side E and a straight line including the third side G to a straight line including the second side F, and the first A first region 118 including three sides, and a second region 119 including a perpendicular 112 and a fourth side H. A part of the plurality of connection parts 117 including the connection part 117 a is arranged in the first region 118. At this time, the connection gravity center of the n power supply terminals having the position coordinate Cc in the X direction is arranged at a position closer to the third side G than the fourth side H.

  Therefore, since the drive element 104 can be designed to be small, the size of the liquid discharge head substrate 100 can be reduced. Further, since the maximum value of the voltage drop amount of the connection portion 117 can be reduced, many liquid ejection elements 103 can be driven at the same time, and high-speed printing can be achieved. Furthermore, the surplus power applied to the liquid ejection element 103 with a small voltage drop at the connection portion 117 can be reduced, leading to a longer life.

  Again, a ground potential may be supplied to the power supply terminal 106, or a high potential may be supplied to the power supply terminal 106.

  In the present embodiment, the effect of reducing the difference in resistance can be obtained even if the relationship between the arrangement center of gravity Cm and the connecting portions 117a and 117b described in the first and second embodiments is not satisfied. . Similarly, in the first and second embodiments, the effect can be obtained even if the relationship between the connection center of gravity Cc and the connection portions 117a and 117b described in the present embodiment is not satisfied.

(Embodiment 4)
In the present embodiment, the relationship between the center of gravity 107 of the power terminal 106 connected to the wiring from the outside and the center of gravity of the power terminal 403 connected to the wiring from the outside will be described. Specifically, in the liquid discharge head substrate 100 according to the present embodiment, the arrangement center of gravity 107 of the power supply terminal 106 has a smaller distance to the third side G than the arrangement center of gravity of the power supply terminal 116.

  FIG. 12 is a top view of the semiconductor device 100 for a liquid discharge head according to the present embodiment. On the substrate 401, the power supply terminal 106 and the power supply terminal 403 are arranged along the wiring 105 and the wiring 402 both having a lattice shape, and the first side E. Here, the power terminal 106 includes power terminals 106a to 106d, and the power terminal 403 includes power terminals 403a to 403d. An arrangement center of gravity 404 is an arrangement center of gravity of the power supply terminals 403a to 403d. In this embodiment mode, a ground potential is supplied to the power supply terminal 106, and a high potential such as 32 V is supplied to the power supply terminal 403.

  In a switching drive driver circuit, the source voltage of the driver circuit increases due to a voltage drop due to the resistance of the wiring 105 to which the ground potential is supplied, and the gate-source voltage decreases, whereby the on-resistance value of the driver circuit changes. . The resistance value of the wiring 105 can be preferentially reduced by arranging the arrangement gravity center 107 of the power supply terminal 106 on the third side G side with respect to the arrangement gravity center 404 of the power supply terminal 403 as in this embodiment. As a result, not only the resistance value in the wiring but also the on-resistance value of the driving element 104 can be reduced, and the effects of increasing the printing speed, extending the life of the heater, and reducing the size of the liquid discharge head substrate can be achieved. it can.

(Embodiment 5)
With reference to FIG. 13, an example in which the liquid discharge head substrate is mounted on a recording apparatus will be described using an inkjet recording system as an example. However, the recording apparatus is not limited to this form, and the same applies to, for example, a thermal transfer type recording apparatus such as a melt type or a sublimation type. The recording device may be, for example, a single function printer having only a recording function, or may be, for example, a multi-function printer having a plurality of functions such as a recording function, a FAX function, and a scanner function. Further, the recording apparatus may be a manufacturing apparatus for manufacturing a color filter, an electronic device, an optical device, a minute structure, and the like by a predetermined recording method, for example.

  “Recording” may include not only the formation of images, patterns, patterns, structures, etc. that are visible so that humans can perceive them visually, but also the processing of media. . "Recording medium" means not only paper used in general recording equipment but also cloth, plastic film, metal plate, glass, ceramics, resin, wood, leather, etc., to which a recording agent can be applied. May also be included. The “recording agent” is applied to the recording medium, whereby not only a liquid such as an ink that can be used for forming an image, a pattern, a pattern, or the like or processing of the recording medium, but also a treatment of the recording agent (for example, It may also include a liquid that can be used for coagulation or insolubilization of the contained colorant.

  FIG. 13A illustrates the appearance of the liquid discharge head unit 810. The liquid discharge head unit 810 can include a liquid discharge head 811 and an ink tank 812 attached to the liquid discharge head 811. The liquid discharge head unit 810 includes a liquid discharge head substrate and a plurality of nozzles 153 provided to face the liquid discharge head substrate. As the liquid discharge head substrate, the liquid discharge head substrate described in any of the first to seventh embodiments can be applied.

  The ink tank 812 holds ink to be supplied to the liquid ejection head 811. The ink tank 812 and the liquid discharge head 811 can be separated by, for example, a broken line K, and the ink tank 812 can be exchanged.

  The liquid discharge head unit 810 includes an electrical contact (not shown) for receiving an electrical signal from the carriage 920 (FIG. 13B), and ejects ink in accordance with the electrical signal to perform the above-described recording. Do. The ink tank 812 has, for example, a fibrous or porous ink holding material (not shown), and can hold ink by the ink holding material.

  FIG. 13B shows a bird's eye view of the recording apparatus 900. The liquid discharge head unit 810 is a liquid discharge head partially shown in FIG. 13A and can be mounted on the carriage 920 together with the ink tank (recording agent container). The carriage 920 can be attached to a lead screw 904 having a spiral groove 921. By the rotation of the lead screw 904, the liquid discharge head unit 810 can move in the direction of arrow a or b along the guide 919 together with the carriage 920. The rotation of the lead screw 904 is interlocked with the rotation of the drive motor 901 via the drive force transmission gears 902 and 903.

  The recording paper P can be transported onto the platen 906 by a transport unit (not shown). The paper pressing plate 905 can press the recording paper P against the platen 906 along the carriage movement direction. The recording apparatus 900 can confirm the position of the lever 909 provided on the carriage 920 via the photocouplers 907 and 908 and can switch the rotation direction of the drive motor 901. The support member 910 can support a cap member 911 that caps each nozzle of the liquid ejection head unit 810. The suction unit 912 can suck the inside of the cap member 911 and perform a suction recovery process of the liquid discharge head unit 810 through the cap opening 913.

  A known cleaning blade is used as the cleaning blade 914, and the moving member 915 can move the cleaning blade 914 in the front-rear direction. The main body support plate 916 can support the moving member 915 and the cleaning blade 914. The lever 917 can be provided to start the suction recovery process.

  As the cam 918 engaged with the carriage 920 moves, the lever 917 moves. The driving force from the drive motor 901 can be controlled by known transmission means such as clutch switching. The recording apparatus 900 is provided with a recording control unit (not shown), and the recording apparatus 900 can control the driving of each mechanism in accordance with an electric signal such as recording data from the outside. The recording apparatus 900 can complete the recording on the recording paper P by repeating the reciprocating movement of the liquid ejection head unit 810 and the conveyance of the recording paper P by a conveyance unit (not shown).

  The recording device can also be used as a device having 3D data and forming a three-dimensional image.

DESCRIPTION OF SYMBOLS 101 Board | substrate 103 Liquid discharge element 105 Wiring 106 Power supply terminal 107 Arrangement gravity center E 1st edge F 2nd edge G 3rd edge H 4th edge 112 Perpendicular

Claims (25)

A plurality of liquid ejection elements;
A plurality of power terminals arranged in a first direction;
A grid-like first wiring connected to n (n is a natural number of 1 or more) of the plurality of power supply terminals;
Have
The first wiring has a plurality of connection portions for connection to different ones of the plurality of liquid ejection elements,
The plurality of connecting portions include a first connecting portion having the largest resistance from the n power supply terminals, and a second connecting portion located farthest from the first connecting portion,
In the first direction, Cm is the position coordinate of the center of gravity of the n power supply wirings obtained by dividing the sum of the position coordinates of the n power supply terminals by n, and the position coordinate of the first connection portion is Ca. When the position coordinates of the second connection part is Cb,
A liquid discharge head substrate, wherein an absolute value of a difference between Ca and Cm is smaller than an absolute value of a difference between Cb and Cm. A grid-like second wiring connected to at least one of the plurality of power supply terminals different from the n power supply terminals and supplied with a potential different from that of the first wiring;
In the first direction, an arrangement gravity center of the n power supply terminals connected to the first wiring and an arrangement gravity center of the at least one power supply terminal connected to the second wiring are from the first connection portion. The substrate for a liquid discharge head according to claim 1, wherein the distance is smaller than the distance from the second connection portion. A plurality of liquid ejection elements;
A plurality of power terminals arranged in a first direction;
A grid-like first wiring connected to n (n is a natural number of 1 or more) of the plurality of power supply terminals;
Have
The first wiring has a plurality of connection portions for connection to different ones of the plurality of liquid ejection elements,
The plurality of connecting portions include a first connecting portion having the largest resistance from the n power supply terminals, and a second connecting portion located farthest from the first connecting portion,
Ni external wirings are connected to the i-th power supply terminal (i is a natural number of 1 to n) of the n power supply terminals,
In the first direction, when the position coordinate of the i-th power terminal is Ci, the connection center of gravity Cc of the n power terminals is

Represented by
When the position coordinate of the first connection part is Ca and the position coordinate of the second connection part is Cb,
A liquid discharge head substrate, wherein an absolute value of a difference between Ca and Cc is smaller than an absolute value of a difference between Cb and Cc. A grid-like second wiring connected to at least one of the plurality of power supply terminals different from the n power supply terminals and supplied with a potential different from that of the first wiring;
In the first direction, a connection gravity center of the n power supply terminals connected to the first wiring and a connection gravity center of the at least one power supply terminal connected to the second wiring are from the first connection portion. The liquid discharge head substrate according to claim 3, wherein the distance is smaller than the distance from the second connection portion. The plurality of connection portions each have a plurality of rows each having a plurality of connection portions arranged along the first direction,
The plurality of rows are arranged in a second direction intersecting the first direction,
4. The liquid discharge head substrate according to claim 1, wherein the first connection portion is included in a row farthest from the n power supply terminals in the second direction. 5.   6. The liquid discharge head substrate according to claim 5, wherein the first connection portion is located at the end of the connection portions included in a row farthest from the n power supply terminals. A substrate having at least a first side and a second side extending along a first direction, and a third side and a fourth side extending along a second direction intersecting the first direction;
A plurality of liquid ejection elements disposed on the substrate;
A plurality of power supply terminals arranged along the first side of the substrate;
A grid-like first wiring connected to n (n is a natural number of 1 or more) power terminals among the plurality of power terminals;
Have
The first wiring has a plurality of connection portions for connection to different ones of the plurality of liquid ejection elements,
The substrate is
A perpendicular line drawn from an intersection of a straight line including the first side and a straight line including the third side to a straight line including the second side; and a first region including the third side at an outer edge;
A second region including the perpendicular and the fourth side at an outer edge;
At least one of the plurality of connection portions is disposed in the first region,
In the first direction, when the position coordinate of the arrangement center of gravity of the n power supply wirings obtained by dividing the sum of the position coordinates of the n power supply terminals by n is Cm,
The liquid ejection head substrate, wherein the arrangement center of gravity having the position coordinates Cm is disposed at a position closer to the third side than the fourth side. A grid-like second wiring connected to at least one of the plurality of power supply terminals;
The distance between the arrangement center of gravity of the n power supply terminals connected to the first wiring and the third side is the arrangement center of gravity of the at least one power supply terminal connected to the second wiring. The liquid discharge head substrate according to claim 7, wherein the substrate is smaller than a distance from the side. A substrate having at least a first side and a second side extending along a first direction, and a third side and a fourth side extending along a second direction intersecting the first direction;
A plurality of liquid ejection elements disposed on the substrate;
A plurality of power supply terminals arranged along the first side of the substrate;
A grid-like first wiring connected to n (n is a natural number of 1 or more) power terminals among the plurality of power terminals;
Have
The first wiring has a plurality of connection portions for connection to different ones of the plurality of liquid ejection elements,
The substrate is
A first region including a perpendicular drawn from an intersection of a straight line including the first side and a straight line including the third side to a straight line including the second side, and the third side;
A second region including the perpendicular and the fourth side,
At least one of the plurality of connection portions is disposed in the first region,
Ni external wirings are connected to the i-th power supply terminal (i is a natural number of 1 to n) of the n power supply terminals,
In the first direction, when the position coordinate of the i-th power supply terminal is Ci, the position coordinate Cc of the connection gravity center of the n power supply terminals is:

Represented by
The liquid discharge head substrate, wherein a connection center of gravity of the n power supply terminals having the position coordinates Cc is arranged at a position closer to the third side than the fourth side. A grid-like second wiring connected to at least one of the plurality of power supply terminals;
The distance between the connection center of gravity of the n power supply terminals connected to the first wiring and the third side is the connection center of gravity of the at least one power supply terminal connected to the second wiring. The liquid discharge head substrate according to claim 9, wherein the substrate is smaller than a distance from the side. The plurality of connection portions each have a plurality of rows each having a plurality of connection portions arranged along the first direction,
The columns are arranged in the second direction;
The said at least 1 connection part distribute | arranged to the said 1st area | region is contained in the row | line | column of the connection part furthest from the said 1st edge | side among these connection parts. The substrate for a liquid discharge head according to any one of the above.   The at least one connection portion arranged in the first region is closest to the third side among connection portions included in a row of connection portions farthest from the first side. The liquid discharge head substrate according to claim 11.   The perpendicular line drawn from the intersection of the straight line including the first side and the straight line including the third side to the straight line including the second side intersects with the second side. The substrate for a liquid ejection head according to any one of 7 to 12.   In the n first power supply terminals, the number of the first power supply terminals arranged at a position where the distance to the third side is smaller than the distance to the fourth side is equal to the third side. 14. The liquid ejection head according to claim 7, wherein the distance to the fourth side is smaller than the number of the first power supply terminals arranged at a position smaller than the distance to the fourth side. substrate.   The liquid discharge head substrate according to claim 1, wherein the substrate is a parallelogram.   16. The liquid discharge head substrate according to claim 1, wherein each of the liquid discharge elements is connected to a corresponding drive element.   The liquid discharge head substrate according to claim 1, wherein the n first power supply terminals are ground terminals.   The liquid discharge head substrate according to claim 1, wherein one end of the liquid discharge element is connected to the first wiring via a first drive element.   Among the plurality of power supply terminals, a second wiring connected to at least one different from the n first power supply terminals is provided, and the liquid ejection element includes the first wiring and the second wiring. The liquid discharge head substrate according to claim 1, wherein the liquid discharge head substrate is connected between them.   The liquid discharge head substrate according to claim 19, wherein one end of the liquid discharge element is connected to the second wiring through a second drive element.   The one end of the liquid ejection element is connected to the first wiring via a first driving element, and the other end is connected to the second wiring via a second driving element. 20. A substrate for a liquid discharge head according to 19.   The connection part is a part of the first wiring and a part connected to another wiring or a part connected to a contact plug for connection to another wiring. The substrate for a liquid discharge head according to any one of the above.   The liquid discharge head substrate according to claim 1, wherein the lattice shape is a planar shape having a plurality of openings. Multiple nozzles,
The liquid discharge head substrate according to any one of claims 1 to 23, which faces the plurality of nozzles;
A liquid discharge head. A liquid discharge head according to claim 24,
An ink tank attached to the liquid discharge head;
A recording apparatus.

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