JP2017537453A - Photoresist stripping apparatus and photoresist stripping method using the same - Google Patents

Abstract

The present invention relates to a stripper storage tank for removing a photoresist, a substrate transfer tool for moving a substrate on which a photoresist is formed, a stripper injection port for injecting a stripper for removing the photoresist onto the substrate transfer tool, and the photoresist removal A stripping chamber including a stripper transmission tool for transferring a stripper for removing a photoresist from a stripper storage tank to the stripper ejection port; a cooling device positioned above the stripping chamber for cooling the material evaporated from the stripping chamber; The present invention relates to a photoresist stripping method using a photoresist stripping device including a transporter that transports a material cooled by a cooling device to a stripper storage tank for stripping photoresist or a stripping chamber.

Description

  The present invention relates to a photoresist stripping apparatus and a photoresist stripping method using the same. More specifically, a photoresist stripping apparatus that can prevent loss of the stripper for removing the photoresist due to evaporation, reduce the amount of the stripper for stripping the photoresist, and maintain the stripping force of the stripper for stripping the photoresist is used. The present invention relates to a photoresist stripping method.

  The fine circuit process of the liquid crystal display element or the manufacturing process of the semiconductor direct circuit is performed on a conductive metal film such as aluminum, aluminum alloy, copper, copper alloy, molybdenum, molybdenum alloy or silicon oxide film, silicon nitride film, acrylic insulation on the substrate. Various lower films such as insulating films such as films are formed, and a photoresist is uniformly coated on the lower film, and selectively exposed and processed to form a photoresist pattern, which is then masked Various processes for patterning the lower film. After such a patterning step, a step of removing the photoresist remaining on the lower film is performed, and a stripper for removing the photoresist is used for this purpose.

  In general, in the step of removing the photoresist formed on the substrate using the photoresist removing stripper, the photoresist removing stripper evaporates due to a temperature condition and the like to generate a fume. There is a problem in that the amount of the stripper for removing the photoresist decreases and the total amount of the stripper for removing the photoresist increases. In particular, in the case of a stripper for removing a water-based photoresist, there is a limit that the peeling force as a stripper is reduced because the amount of evaporation of water is large.

  In addition, a photoresist stripping apparatus capable of preventing the loss of the stripper for removing the photoresist due to evaporation and reducing the amount of the stripper for stripping the photoresist and maintaining the stripping force of the stripper for stripping the photoresist, and a photoresist using the photoresist stripper. Development of a peeling method is required.

  The present invention provides a photoresist stripping apparatus that can prevent loss of a stripper for removing a photoresist due to evaporation, reduce the amount of the stripper for stripping the photoresist, and maintain the stripping force of the stripper for stripping the photoresist.

  The present invention also provides a photoresist stripping method using the photoresist stripping apparatus.

  In the present specification, a stripper storage tank for removing a photoresist, a substrate transfer tool for moving a substrate on which a photoresist is formed, a stripper injection port for injecting a stripper for removing the photoresist onto the substrate transfer tool, and the photoresist removal A stripping chamber including a stripper transmitter for transferring the stripper for removing the photoresist from the stripper storage tank to the stripper outlet, and a cooling device positioned above the stripping chamber to cool the material evaporated from the stripping chamber; There is provided a photoresist stripping device including a transporter that transports a material cooled by the cooling device to a stripper storage tank for stripping photoresist or a stripping chamber.

  The present specification also provides a photoresist stripping method using the photoresist stripping apparatus.

  According to the present invention, a photoresist stripping apparatus capable of preventing the loss of the stripper for removing the photoresist due to evaporation and reducing the usage of the stripper for stripping the photoresist and maintaining the stripping force of the stripper for stripping the photoresist can be used. An improved photoresist stripping method can be provided.

It is the figure which showed roughly the structure of the photoresist peeling apparatus used in the Example. It is the figure which showed roughly the structure of the photoresist peeling apparatus used by a comparative example.

  Hereinafter, a photoresist stripping apparatus and a photoresist stripping method according to specific embodiments of the invention will be described in more detail.

  According to one embodiment of the present invention, a stripper storage tank 4 for removing a photoresist, a substrate transfer tool 3 for moving a substrate having a photoresist formed thereon, and a stripper for injecting a stripper for removing the photoresist onto the substrate transfer tool 3 A stripping chamber 1 including a stripper transmitter 16 for transferring a stripper for removing photoresist from the jetting port 2 and the stripper storage tank 4 for removing the photoresist to the stripper jetting port 2; A cooling device 7 for cooling the material evaporated from the chamber 1, a transmission tool 6 for transferring the material evaporated from the peeling chamber 1 to the cooling device 7, and a stripper for removing the material cooled by the cooling device 7 from the photoresist. A photoresist stripping device may be provided that includes a transfer device that transfers to the storage tank 4 or the stripping chamber 1.

  If the above-mentioned specific photoresist stripping apparatus is used, the present inventors cool the evaporated substance generated in the stripping process and mix it again with the stripper for removing the photoresist, thereby removing the stripper for stripping the photoresist by evaporation. It was confirmed by experiments that loss could be prevented and the amount of stripper used to remove the photoresist could be saved, and the invention was completed.

In particular, the photoresist stripping device may include a transport tool for transporting the material cooled by the cooling device 7 to the stripper storage tank 4 for stripping photoresist or the stripping chamber 1. As a result, the photoresist stripping device can reduce the amount of the stripper for removing the photoresist by preventing loss of the stripper for removing the photoresist due to evaporation.
The specific example of the said conveying tool is not largely limited, Piping with various forms, lengths, diameters, etc. can be used without a restriction | limiting.

  The photoresist stripping apparatus includes a transport tool 9 for transporting the material cooled by the cooling device 7 to the stripper storage tank 4 for removing the photoresist or a transport tool 10 for transporting the material cooled by the cooling device to the stripping chamber 1. obtain. The transfer tool 9 for transferring to the stripper storage tank 4 for removing the photoresist and the transfer tool 10 for transferring the material cooled by the cooling device to the peeling chamber 1 are separately connected to the cooling device or combined with one pipe. It can be connected to a cooling device.

  Further, the transfer tool 9 for transferring the material cooled by the cooling device 7 to the stripper storage tank 4 for removing the photoresist is 50% or more of the height of the stripper storage tank 4 for removing the photoresist, or 55% to 100%. , Or 60% to 95%.

  The transport device 9 for transferring the material cooled by the cooling device 7 to the photoresist removal stripper storage tank 4 is connected to the photoresist removal stripper storage tank 4 at a position higher than that of the photoresist removal stripper storage tank 4. If it is less than 50%, the stripper contained in the photoresist removal stripper storage tank 4 transfers the substance cooled by the cooling device 7 to the photoresist removal stripper storage tank 4 on the side of the carrier 9. Can flow backwards.

  The transfer device 10 for transferring the material cooled by the cooling device 7 to the peeling chamber 1 is provided with a height of the stripper storage tank 4 for removing the photoresist and a substrate transfer device 3 for moving the substrate on which the photoresist is formed. It can be connected between heights.

  As described above, the transfer tool 10 for transferring the material cooled by the cooling device 7 to the peeling chamber 1 moves the substrate on which the photoresist is formed on the surface of the stripper storage tank 4 for removing the photoresist. By being connected to the height of the transfer device 3, the substrate moved by the substrate transfer device 3 is not affected, and the substance discharged from the cooling device 7 moves to the stripper storage tank 4 for removing the photoresist. obtain.

  The photoresist stripping device may further include a valve 8 that can adjust opening and closing of a transport tool that transfers the material cooled by the cooling device 7 to the stripper storage tank 4 for stripping photoresist or the stripping chamber 1.

  The “opening / closing” means opening and closing, and specifically, means that the conveying tool is opened and closed using the valve 8. When the transport tool is opened, the material cooled by the cooling device 7 can be transferred to the stripper storage tank 4 for removing the photoresist 4 or the peeling chamber 1, and when the transport tool is closed, the cooling device 7 The cooled substance can be transferred to a waste liquid tank 14 described later instead of the stripper storage tank 4 for removing the photoresist or the peeling chamber 1.

  The photoresist stripping apparatus includes a stripper storage tank 4 for removing a photoresist, a substrate transfer tool 3 for moving a substrate having a photoresist formed thereon, and a stripper for injecting a stripper for removing the photoresist onto the substrate transfer tool 3. A stripping chamber 1 including a stripper transmitter 16 for transferring the photoresist stripper from the spray port 2 and the stripper storage tank 4 to the stripper spray port 2 may be included.

  The specific type of the stripper for removing the photoresist contained in the stripper storage tank 4 for removing the photoresist is not limited, and any composition having a use as a stripper for removing the photoresist can be used without limitation. For example, 38% by weight of distilled water, 10% by weight of (1-amino) -isopropanol (AIP), 10% by weight of N-methylformamide (NMF), 41.9% by weight of diethylene glycol monobutyl ether (BDG) and 2, 2 ′ [ A mixture of 0.1% by weight of (methyl-1H-benzotriazole-1-reel) methyl] imino] bisethanol is mentioned.

  An example of the substrate transfer tool 3 that moves the substrate on which the photoresist is formed on the surface is not largely limited, and examples thereof include a conveyor belt, and the substrate transfer tool 3 extends in the direction parallel to the ground plane. 1 may be located inside. The method of moving the substrate on which the photoresist is formed on the surface is, for example, placing a substrate on which the photoresist is formed on the substrate transfer tool 3 and being parallel to the ground plane along the substrate transfer tool 3. Can be moved in the direction.

  The example of the stripper injection port 2 that injects the stripper for removing the photoresist onto the substrate transfer tool 3 is not limited to a large size. For example, a nozzle having 80 holes, specifically a hole nozzle, a pintle nozzle, a throttle pintle nozzle, A flat pintle nozzle or the like can be used. The method of spraying the stripper for removing the photoresist is, for example, a method of spraying the stripper for removing the photoresist at a pressure of 0.01 MPa to 0.9 MPa and a temperature of 30 ° C. to 50 ° C. through the stripper nozzle 2. is there.

  Specifically, a substrate transfer tool 3 for moving a substrate having a photoresist formed on the surface thereof is positioned above the photoresist removal stripper storage tank 4, and the substrate transfer tool 3 is positioned above the substrate transfer tool 3. A stripper injection port 2 for injecting a stripper for removing the photoresist 3 can be located. The “upper part” means being located at a higher position with respect to the ground plane.

  As a result, the stripper for removing the photoresist sprayed from the stripper injection port 2 for spraying the stripper for removing the photoresist onto the substrate transporter 3 is placed on the surface of the substrate transporter 3 positioned at the highest position. Contact may be made on the resist-formed substrate. In addition, the stripper for removing the photoresist that comes into contact with the substrate on which the photoresist is formed on the surface can move to the stripper storage tank 4 for removing the photoresist located at the lower end of the substrate transfer tool 3.

  Specifically, a drain device 12 may be further included between the substrate transfer tool 3 and the photoresist removal stripper storage tank 4. By including the drain device 12, the stripper for removing the photoresist sprayed on the substrate can be collected and flown into the stripper storage tank 4 for removing the photoresist.

  The stripping chamber 1 may include a stripper transmitter 16 that transports the photoresist removal stripper from the photoresist removal stripper storage tank 4 to the stripper injection port 2. The example of the stripper transmission tool 16 is not largely limited, and piping having various shapes, lengths, diameters, and the like can be used without limitation.

  The stripper transmitter 16 for transferring the photoresist removal stripper from the photoresist removal stripper storage tank 4 to the stripper outlet 2 may further include a filtering device 17. By including the filtering device 17, foreign substances that can be contained in the stripper for removing photoresist contained in the stripper storage tank 4 for removing photoresist can be removed, and the quality and performance of the stripper for removing photoresist can be maintained. .

  The example of the said filtration apparatus 17 is not largely limited, For example, a filter can be used. The material of the filter is not greatly limited. For example, a polymer resin such as polyethylene or polypropylene, or a Teflon (registered trademark) resin such as polyvinylidene fluoride can be used. The diameter of the pore contained in the substrate may be 0.1 μm to 300 μm. The size of the filter is not greatly limited, and filters of various sizes can be used.

  Further, the stripper transmitter 16 for transferring the photoresist removal stripper from the photoresist removal stripper storage tank 4 to the stripper injection port 2 may further include a pump 5. As described above, since the stripper injection port 2 for injecting the stripper for removing the photoresist onto the substrate transfer tool 3 is positioned above the photoresist removal stripper storage tank 4 above the substrate transfer tool 3, A stripper for removing the photoresist from the resist stripper storage tank 4 to the stripper injection port 2 for transferring to the stripper injection port 2 for spraying the stripper for removing the photoresist onto the substrate transfer unit 3 on the substrate transfer unit 3 from above the substrate transfer unit 3. The stripper transmitter 16 for transporting the liquid may further include a pump 5.

  Specifically, the stripper transmission tool 16 for transferring the photoresist removal stripper from the photoresist removal stripper storage tank 4 to the stripper injection port 2 ejects the photoresist removal stripper to the substrate transfer tool 3. It can be connected to the mouth 2 and the stripper storage tank 4 for removing the photoresist.

  In addition, the photoresist stripping device may include a cooling device 7 that is located above the stripping chamber 1 and cools the material evaporated from the stripping chamber 1. The cooling device 7 can reduce the amount of the photoresist stripper used by liquefying the material lost by evaporation during the photoresist stripping process.

  Examples of the cooling device 7 include a condenser, and the cooling device 7 supplies the refrigerant at a temperature of −10 ° C. to 50 ° C., or −8 ° C. to 30 ° C., or −5 ° C. to 10 ° C. Utilized condensation can take place. The refrigerant refers to a medium that takes heat from a low-temperature object and transfers heat to a high-temperature object as a working fluid of a refrigeration cycle, and various widely used refrigerants can be used without limitation.

  The cooling device 7 may be located in the upper part of the peeling chamber 1. The “upper part” means being located at a higher position with respect to the ground plane. That is, the height of the cooling device 7 may be higher than the height of the peeling chamber 1. In the process of peeling in the peeling chamber 1, some of the components contained in the photoresist removing stripper may be evaporated according to the temperature inside the peeling chamber 1. At this time, in order to prevent loss due to evaporated components, the evaporated components are collected, liquefied through the cooling device 7 and recovered, and therefore the cooling device 7 can be positioned higher than the peeling chamber 1.

  Further, it may further include a waste liquid tank 14 for storing the stripper waste liquid for removing the photoresist. The stripper waste liquid for removing the photoresist is a foreign material generated in the stripping process of the stripper for removing the photoresist, or a stripper for removing the photoresist that has been altered by being stored in the stripper storage tank 4 for removing the photoresist for a long time, or Foreign matter filtered by the filtering device 17 may be included.

  The position of the waste liquid tank 14 is not greatly limited, but may preferably be located in the lower part of the peeling chamber 1.

  A stripper waste liquid for removing a photoresist is directly transferred from the peeling chamber 1 to the waste liquid tank 14 or a material cooled by the cooling device 7 can be transferred. When the stripper waste liquid for removing the photoresist is directly transferred from the peeling chamber 1, it can be transferred through the pipe 13. Further, when the substance cooled by the cooling device 7 is transferred to the waste liquid tank 14, it can be transferred via a pipe 15 including a valve 11 that can be opened and closed.

  Meanwhile, according to another embodiment of the invention, a photoresist stripping method using the photoresist stripping apparatus can be provided.

  Specifically, the photoresist stripping method includes a step of spraying a stripper for removing a photoresist onto a substrate having a photoresist formed on a surface, and a gas generated during the spraying is collected and cooled by a cooling device 7. And recovering the sprayed photoresist removal stripper and the cooled material to the photoresist removal stripper storage tank 4.

  The photoresist stripping method may include a step of spraying a stripper for removing a photoresist onto a substrate having a photoresist formed on a surface thereof. Examples of the spraying method are not largely limited. For example, using a hole nozzle, a pintle nozzle, a throttle pintle nozzle, a flat pintle nozzle, etc., a photo at a pressure of 0.01 MPa to 0.9 MPa and a temperature of 30 ° C. to 50 ° C. For example, a method of spraying a stripper for resist removal may be used.

  In the step of spraying the stripper for removing the photoresist onto the substrate having the photoresist formed on the surface, the temperature of the stripper for removing the photoresist may be 40 ° C. to 60 ° C. When the temperature of the stripper for removing the photoresist is less than 40 ° C., the stripping performance may be deteriorated, and when the temperature of the stripper for removing the photoresist exceeds 60 ° C., there is a risk of ignition, so workability is improved. Can fall. The specific type of the stripper for removing the photoresist is not limited, and any composition having a use as a stripper for removing the photoresist can be used without limitation.

  The method may further include filtering the stripper for removing the photoresist with a filtering device 17 before spraying the stripper for removing the photoresist onto the substrate having the photoresist formed on the surface. As a result, foreign substances that can be contained in the photoresist removal stripper contained in the photoresist removal stripper storage tank 4 are removed, and the quality and performance of the sprayed photoresist removal stripper can be maintained.

  An example of the method of the filtration step is not largely limited. For example, the filtration device 17 included in the stripper transmission tool 16 that transfers the photoresist removal stripper from the photoresist removal stripper storage tank 4 to the stripper injection port 2 is provided. Can be done through. The contents related to the filtering device 17 include the contents described above in the embodiment.

  The photoresist stripping method may include a step of collecting and cooling a gas generated during the jetting. As described above, when the temperature of the stripper for removing photoresist shows 40 ° C. to 60 ° C., a part of the components contained in the stripper for removing photoresist can be evaporated. The photoresist stripping method includes a step of collecting and cooling the gas generated during the jetting, and can minimize the amount of the stripper for removing the photoresist that is lost by evaporation during the stripping process.

  Specifically, in the stage of collecting the gas generated during the injection and cooling with the cooling device 7, the gas generated during the injection is collected from the separation chamber 1 with the separation device of the embodiment. The cooling device 7 located in the upper part of the chamber 1 may be connected through a pipe 6 to transfer gas. The cooling may be performed by a condensation method using the cooling device 7 of the embodiment at a temperature of -10 ° C to 50 ° C, -8 ° C to 30 ° C, or -5 ° C to 10 ° C. The contents regarding the cooling device 7 include the contents described above in the embodiment.

  The sprayed stripper for removing the photoresist and the cooled material may be collected in the stripper storage tank 4 for removing the photoresist. This minimizes the amount of the stripper for removing the photoresist that is lost due to evaporation during the stripping process, thereby reducing the amount of the stripper for removing the photoresist, and maintaining the stripping force of the stripper for removing the photoresist. be able to.

  Examples of the cooled material are not largely limited, and may include, for example, water or an organic compound. Examples of the organic compound are not particularly limited, and examples include all components contained in a stripper for removing a photoresist such as amine, amide, and alkylene glycol monoalkyl ether.

  An example of a method for recovering the sprayed stripper for removing the photoresist in the stripper storage tank 4 for removing the photoresist is not largely limited. For example, the drain device 12 positioned at the lower part of the substrate transfer tool 3 according to the embodiment is provided. It can be performed by a method of transferring to the stripper storage tank 4 for removing the photoresist.

  An example of a method for recovering the cooled substance is not particularly limited. For example, the cooling device 7 of the above-described embodiment and the stripping chamber 1 or the stripper storage tank 4 for removing the photoresist are connected via a pipe 9, and a valve This can be done by opening 8.

  After the step of recovering the sprayed stripper for removing photoresist and the cooled material in the stripper storage tank 4 for removing photoresist, the stripper for removing photoresist contained in the stripper storage tank 4 for removing photoresist is another substrate. May be further included to recycle to process. By including the recycling step, the amount of photoresist stripper used can be reduced by using a certain amount of photoresist stripper several tens of times without using a new stripper for removing photoresist. Can do.

  In the photoresist stripping method, the maintenance ratio of the stripper for removing the photoresist obtained by the following formula 1 may be 90% or more, or 92% to 99%.

  Specifically, the stripper for removing the photoresist after the stripping is performed by spraying the stripper for stripping the photoresist before stripping by the photoresist stripping method of the other embodiment, and capturing the gas generated during the spraying. This means the stripper for removing the photoresist contained in the stripper storage tank 4 for collecting and cooling the sprayed photoresist removing stripper and the collected material after cooling.

  Accordingly, the photoresist stripping method can greatly reduce the amount of the stripper for removing the photoresist. If the retention rate of the stripper for removing photoresist obtained by Equation 1 is less than 90%, the amount of the stripper for removing photoresist can be increased by introducing an additional stripper for removing photoresist.

  Specifically, an example of a photoresist stripping method using the photoresist stripping apparatus will be described with reference to FIG. The stripper for removing the photoresist stored in the photoresist removing stripper storage tank 4 is transferred along the sixth pipe 16 by the pump 5, filtered through the filtering device 17, and then peeled off through the nozzle 2. The peeling process is performed by spraying on the substrate located on the substrate transfer tool 3 in the chamber 1. In the stripping step, the evaporated material in the material contained in the stripper for removing the photoresist flows into the cooling device 7 from the stripping chamber 1 through the first pipe 6 and is cooled in the cooling device 7. The stripper for removing the photoresist after the stripping process in the stripping chamber 1 is collected in the stripper storage tank 4 for removing the photoresist through the drain device 12, and the substance cooled by the cooling device 7 opens the first flow rate adjusting valve 8. The cooled material is transferred to the photoresist removal stripper storage tank 4 along the second pipe 9 or transferred to the peeling chamber 1 along the third pipe 10. At this time, the second flow rate adjustment valve 11 is closed. Then, the peeling process is recirculated again. The stripper waste liquid and foreign matter generated in the photoresist removal stripper storage tank 4 and the filtration device 17 are transferred to the waste liquid tank 14 through the fourth pipe 13.

  The present invention is further illustrated by the following examples. However, the following examples are merely illustrative of the present invention, and the content of the present invention is not limited by the following examples.

<Production example: Production of stripper for removing photoresist>
Distilled water 38% by weight, (1-amino) -isopropanol (AIP) 10% by weight, N-methylformamide (NMF) 10% by weight, diethylene glycol monobutyl ether (BDG) 41.9% by weight and 2, 2 ′ [(methyl A stripper for removing a photoresist was prepared by mixing 0.1% by weight of -1H-benzotriazole-1-reyl) methyl] imino] bisethanol.

<Example: Photoresist peeling method>
As shown in FIG. 1, the stripper for removing photoresist of the above manufacturing example is put in a stripper storage container for removing photoresist in the peeling chamber 1, pulled up to the nozzle 2 using a pump 5, and then peeled off at a temperature of 40 ° C. 1 for 24 hours. The substance evaporated in the spraying process was moved to the cooling device 7 through a pipe and cooled at a temperature of 25 ° C. The cooled material was injected into the stripper storage container for removing the photoresist through a pipe.

<Comparative example: Photoresist peeling method>
As shown in FIG. 2, the same procedure as in the above example was performed except that the cooled substance was injected into a waste liquid container via a pipe.

<Experimental Example: Measurement of Photoresist Stripping Efficiency in Examples and Comparative Examples>
The efficiency of the photoresist stripping methods of the examples and comparative examples was measured by the following method, and the results are shown in Table 1.

1. Water content (wt%)
In the photoresist stripping methods of the above-mentioned examples and comparative examples, a certain amount of photoresist stripper contained in the photoresist stripper storage container is sampled every 6 hours, and the moisture content is measured by the Karl Fischer moisture measurement method. It was measured.

2. Maintenance rate of stripper for removing photoresist (%)
In the photoresist stripping methods of the examples and comparative examples, the mass of the stripper for removing the photoresist contained in the stripper storage container for removing the photoresist is measured every 6 hours, and the stripper for removing the photoresist is maintained by the following formula 2. The rate was determined.

  As shown in Table 1, in the case of the photoresist stripping method of the example, the moisture content contained in the stripper for removing the photoresist was reduced by about 5% by weight from 38% by weight to 33.02% by weight. In the case of the photoresist stripping method of the example, the water content contained in the stripper for removing the photoresist is reduced by about 20% by weight from 38% by weight to 18.80% by weight. It was confirmed that the moisture contained in the stripper for removing the photoresist can be largely prevented as compared with the photoresist stripping method of the comparative example.

  Further, in the case of the photoresist stripping method of the example, even after stripping for 24 hours, the retention rate of the stripper for stripping the photoresist is 94.16% by weight, and the photoresist removal compared to 78.25% by weight of the comparative example. The stripper maintenance rate has been greatly improved. Thereby, in the case of the photoresist peeling method of the said Example, it confirmed that the reduction | decrease of the stripper for photoresist removal can be prevented significantly compared with a comparative example.

DESCRIPTION OF SYMBOLS 1 Stripping chamber 2 Nozzle 3 Substrate transfer tool 4 Stripper storage tank for removing photoresist 5 Pump 6 First pipe 7 Cooling device 8 First flow control valve 9 Second pipe 10 Third pipe 11 Second flow control valve 12 Drain device 13 Fourth piping 14 Waste liquid tank 15 Fifth piping 16 Sixth piping 17 Filtration device

Claims (14)

A stripper storage tank for removing photoresist, a substrate transfer tool for moving a substrate on which a photoresist is formed, a stripper injection port for spraying the stripper for removing photoresist onto the substrate transfer tool, and a stripper storage tank for removing the photoresist A stripping chamber including a stripper transmission tool for transferring a stripper for removing a photoresist to the stripper ejection port;
A cooling device located at the top of the stripping chamber, for cooling the material evaporated from the stripping chamber;
A photoresist stripping device comprising a transport tool for transferring the material cooled by the cooling device to a stripper storage tank or stripping chamber for stripping photoresist. A transport tool for transferring the material cooled by the cooling device to a stripper storage tank for removing the photoresist,
The photoresist stripping apparatus according to claim 1, wherein the photoresist stripping apparatus is connected to a position of 50% or more of a height of the stripper storage tank for removing the photoresist. A carrier for transferring the substance cooled by the cooling device to the peeling chamber,
The photoresist stripping apparatus according to claim 1, wherein the photoresist stripping apparatus is connected between a height of the stripper storage tank for removing the photoresist and a height of a substrate transfer tool for moving the substrate on which the photoresist is formed.   The photoresist stripping apparatus according to claim 1, further comprising a valve capable of adjusting opening / closing of a transport tool for transferring the material cooled by the cooling unit to a stripper storage tank for stripping photoresist or a stripping chamber.   A substrate transfer tool for moving a substrate on which the photoresist is formed is positioned above the photoresist removal stripper storage tank, and a stripper injection port for spraying the photoresist removal stripper on the substrate transfer tool. The photoresist stripping apparatus according to claim 1, wherein:   2. The photoresist stripping apparatus according to claim 1, wherein the stripper transmitter for transferring the photoresist stripper from the photoresist stripper storage tank to the stripper jet port further includes a filtering device.   The photoresist stripping apparatus according to claim 1, further comprising a waste liquid tank for storing a stripper waste liquid for removing the photoresist.   A photoresist stripping method using the photoresist stripping apparatus according to claim 1. Spraying a stripper for removing photoresist onto a substrate having a photoresist formed on the surface;
Collecting the gas generated during the injection and cooling it to a cooling device;
9. The method of removing a photoresist according to claim 8, further comprising the step of recovering the sprayed stripper for removing the photoresist and the cooled material in a stripper storage tank for removing the photoresist. In the step of spraying a stripper for removing a photoresist on a substrate having a photoresist formed on the surface,
The photoresist stripping method according to claim 9, wherein a temperature of the stripper for removing the photoresist is 40 ° C. to 60 ° C. Before the step of spraying a stripper for removing a photoresist onto a substrate having a photoresist formed on the surface,
The photoresist stripping method according to claim 9, further comprising: filtering the stripper for removing the photoresist with a filtering device. In the stage of collecting the gas generated during the injection and cooling with a cooling device,
The method according to claim 9, wherein the cooling is performed at a temperature of −10 ° C. to 50 ° C. After recovering the sprayed photoresist removal stripper and the cooled material in a photoresist removal stripper storage tank,
The photoresist stripping method according to claim 9, further comprising a step of recirculating a photoresist stripper included in the photoresist stripper storage tank to process another substrate. The photoresist stripping method according to claim 8, wherein a retention rate of the stripper for removing the photoresist obtained by the following formula 1 is 90% or more.

Images