JP2017537295A - Hybrid heat transfer system - Google Patents

Abstract

In accordance with one aspect, a hybrid heat transfer system includes a first heat transfer path and a load configured to passively transfer heat between a load having a load temperature (TL) and an ambient environment having an ambient temperature (TA). Including a second heat conduction path configured to actively transport heat between the air and the surrounding environment, the second path comprising a heat pump. [Selection] Figure 2A

Description

Detailed Description of the Invention

[Prior application]
This application claims priority to US Provisional Patent Application No. 62 / 088,362, filed December 5, 2014, entitled “High Efficiency Hybrid Heat Removal System”, which is incorporated by reference in its entirety. Included in this specification.
[Disclosure]

The field of the disclosure relates generally to heat removal systems, and more particularly to hybrid heat transport systems.
[background]

  Concerned about limited resources and the environment, the demand for energy conservation continues to increase substantially. This leads to advances in energy efficient equipment. For example, current energy efficient refrigerators use nearly 40% less energy than models more than 15 years ago. The ability to further improve the efficiency of energy efficient refrigerators is limited to the need for multiple functions. For example, consumers need a refrigerator that operates over a wide temperature range while maintaining accurate temperature control and adapts to rapid changes.

  Existing refrigeration techniques use either passive or active cooling techniques. As used herein, when the term “passive” is used in the context of heating or cooling, it does not require additional energy, such as through natural processes such as conduction, convection, radiation, etc. Regarding the heat transport that occurs. As used herein, the term “active” occurs when used in the context of heating or cooling, eg, through the use of power consuming devices such as compressors, heat pumps, Peltier junctions, etc. It relates to heat transport that requires additional energy (eg electricity). Thus, active cooling systems relate to energy consumption for cooling objects as opposed to passive cooling that does not consume energy.

  The most common type of energy efficient refrigerator uses a vapor compression system. In these systems, mechanical components consume energy to actively transport heat. These components may include a compressor, a condenser, a temperature expansion valve, an evaporator, piping for circulating a working fluid (eg, refrigerant), and a thermostat. The component circulates a refrigerant that undergoes a forced phase change to transport heat from the cooling chamber to the external environment. Refrigeration systems including thermoelectric cooling systems are less common. In these systems, the thermoelectric heat pump consumes energy to actively transport heat from passive subsystems that accept heat from the cooling chamber to other passive subsystems that exhaust heat to the outside environment.

  Because refrigeration systems are usually well insulated, they are designed without a heat conduction path through which heat can be transported from the cooling chamber to the outside environment with only passive transmission. Thus, these refrigeration systems that do not have a means of exhausting heat from the cooling chamber may cause active components to fail.

  This problem can cause further problems in active systems designed to maintain the internal chamber at a temperature set according to the temperature of the external environment, causing active components to fail and heating the internal chamber as needed. Or there is no heat conduction path through which heat can be transported to cool. Furthermore, there is no option, and passive paths mean that external environmental conditions are not available to reduce power consumption. For example, if the room needs a slight temperature rise and the external environment is warmer than the room, the existence of an option, the passive path, causes the room to warm through passive heat transport instead of through active devices, This obviates the need to consume (and pay for) the energy used by active devices. The same applies to rooms where some cooling is required when the external environment is cooler than the room, and the passive path heats from the room to the external environment without consuming additional energy to operate the heat pump, compressor, etc. Used to transport to.

  Thus, there remains a need for systems and methods for heat transport that provide higher energy efficiency at lower cost while maintaining versatility of operation.

[Overview]
Systems and methods for hybrid heat transfer systems are disclosed.

According to one aspect, a hybrid heat transport system, the first heat conducting path and the load and the surrounding configured to transport the passively heat between the ambient environment with load and ambient temperature T _A with the load temperature T _L A second heat transfer path configured to actively transport heat between the environments, the second path includes a heat pump.

  According to one aspect, the heat pump is either in an activated state or a deactivated state, when the heat pump is activated, heat is actively transported through the second heat conduction path, and when the heat pump is deactivated, the heat is It is not actively transported through the second heat conduction path.

  According to another aspect, when the heat pump is at rest, heat is passively transported through the second heat transfer path.

  According to one aspect, each of the first and second paths comprises its own independent heat exchange component for transporting heat to or from the load. In accordance with other aspects, the first and second paths share common heat exchange components for transporting heat to and from the load.

  According to one aspect, each of the first and second paths includes its own independent heat exchange component for transporting heat to or from the surrounding environment. In accordance with other aspects, the first and second pathways share common heat exchange components for transporting heat to and from the surrounding environment.

  According to one aspect, the first heat conduction path comprises a series of thermal diodes between the load and the ambient environment. In accordance with one aspect, the thermal diode allows heat transfer from the load to the ambient environment and prevents heat transfer from the ambient environment to the load. According to one aspect, the thermal diode comprises a thermosyphon.

  According to one aspect, the second heat transfer path includes a series of thermal diodes between the load and the ambient environment. According to one aspect, the thermal diode is in series between the load and the heat pump.

  According to one aspect, the second heat transfer path includes a thermal capacitor in series between the load and the ambient environment. According to one aspect, the second heat transfer path includes a thermal capacitor in series between the load and the heat pump. According to one aspect, the thermal capacitor comprises a phase change material and / or a thermal mass.

  According to one aspect, the second heat transfer path includes a thermal diode, a thermal capacitor, and a heat pump in series between the load and the ambient environment. According to one aspect, the second heat transfer path includes a thermal diode and a thermal capacitor in series between the load and the heat pump.

  According to one aspect, the first heat transfer path further includes a heat pump.

According to another aspect, a hybrid heat transport system comprises a heat conduction path to transfer heat to the surrounding environment with ambient temperature T _A from the load with a load temperature T _L. Heat pump heat conduction path having a stopped state of the heat capacitor having a storage temperature T _S, activation of heat by the heat pump is actively transported condition and heat by the heat pump is not actively transported, and the load and the surrounding Includes thermal diodes connected in series between the environment.

  According to one aspect, the thermal capacitor comprises a phase change material and / or a thermal mass.

  According to one aspect, the first side of the thermal capacitor is in contact with the load, the first side of the heat pump is in contact with the second side of the thermal capacitor, and the first side of the thermal diode is in contact with the second side of the heat pump. And the second side of the thermal diode transports heat to the surrounding environment.

  According to yet another aspect, the hybrid heat transfer system includes a first component for active heating and / or cooling of a load, operation of which is controlled by at least one control input, and at least one control input according to an algorithm. And a control system configured to control the operation of the first component via.

  According to one aspect, the control system includes at least one temperature sensor and hardware, receives temperature information from the at least one temperature sensor, and outputs the information according to an algorithm to determine a desired operation of the first component. And a controller configured to process and control operation of the first component.

  According to one aspect, the controller controls the operation of the first component by activating and switching an electrical circuit between the controller and the first component.

According to yet another aspect, the load and the ambient temperature T _A actively between the first heat conducting path and the load and the ambient environment to transport passively heat between the ambient environment having a having a load temperature T _L There is a second heat conduction path for transporting heat, the second path including a heat pump. Method of controlling a hybrid heat transport system includes monitoring the value of T _L and T _A. T _L is below the determination that greater than the first threshold value T _LH, if T _A is greater than or equal to T _L, the heat pump starts to actively transported into the surrounding environment of heat from the load through the second path However, if T _A is less than T _L , the heat pump does not actively transfer heat from the load to the surrounding environment through the second path (eg, from the load to the surrounding environment through the first path). And stop to transport passively). Under the judgment that T _L is higher than the second threshold T _LL, if T _A is less than or equal to T _L, the heat pump starts to actively transported to the load heat from the surrounding environment through the second path However, if T _A is greater than T _L , the heat pump does not actively transfer heat from the ambient environment to the load through the second path (eg, heat from the ambient environment to the load through the first path). And stop to transport passively). Under the determination that T _LL ≦ T _L ≦ T _LH , the current operating state of the heat pump (whether it is activated or deactivated) is not changed.

  The methods and systems described herein provide increased efficiency at a lower cost while improving the versatility of operation such as operating in a wide temperature range and cooling rate while maintaining accurate control of temperature. provide.

  Upon reading the following detailed description of the preferred embodiments in connection with the accompanying drawings, the scope of the present disclosure will become apparent to those skilled in the art and further aspects will be appreciated.

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate several aspects of the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

An exemplary structure of a hybrid heat transfer system according to an embodiment of the present disclosure is described, the system including first and second heat conduction paths for transporting heat between a load and an ambient environment, the second path comprising a heat pump. Including. FIG. 6 illustrates an orthogonal view of a hybrid heat transfer system according to an embodiment of the present disclosure, where the first path is upwind of the second path, so that heat from the active second path affects the performance of the passive first path. Don't give. 2B illustrates a functional depiction of the system in FIG. 1A according to an embodiment of the present disclosure. FIG. 6 illustrates a flow diagram of an exemplary method for a hybrid heat transfer system according to an embodiment of the present disclosure. An exemplary structure and functional depiction of a hybrid heat transport system according to another embodiment of the present disclosure is described, respectively, where the first and second heat transfer paths are general heat exchangers for transporting heat from a load. Share. An exemplary structure and functional depiction of a hybrid heat transport system according to another embodiment of the present disclosure is described, respectively, where the first and second heat transfer paths are general heat exchangers for transporting heat from a load. Share. An exemplary structure and functional depiction of a hybrid heat transport system according to another embodiment of the present disclosure is described respectively, and the first and second heat conduction paths are general heat exchangers for transporting heat from the ambient environment Share An exemplary structure and functional depiction of a hybrid heat transport system according to another embodiment of the present disclosure is described respectively, and the first and second heat conduction paths are general heat exchangers for transporting heat from the ambient environment Share Each illustrating an exemplary structure and functional depiction of a hybrid heat transport system according to other embodiments of the present disclosure, the first heat conduction path is thermally connected to a load through a thermal diode. Each illustrating an exemplary structure and functional depiction of a hybrid heat transport system according to other embodiments of the present disclosure, the first heat conduction path is thermally connected to a load through a thermal diode. Each illustrating an exemplary structure and functional depiction of a hybrid heat transport system according to other embodiments of the present disclosure, wherein the first heat conduction path is thermally connected to a load through a thermal diode, and the first and second paths are Share a common heat exchanger for transporting heat to and from the surrounding environment. Each illustrating an exemplary structure and functional depiction of a hybrid heat transport system according to other embodiments of the present disclosure, wherein the first heat conduction path is thermally connected to a load through a thermal diode, and the first and second paths are Share a common heat exchanger for transporting heat to and from the surrounding environment. Each illustrating an exemplary structure and functional depiction of a hybrid heat transfer system according to other embodiments of the present disclosure, the second heat conduction path is thermally connected to the load through a thermal diode. Each illustrating an exemplary structure and functional depiction of a hybrid heat transfer system according to other embodiments of the present disclosure, the second heat conduction path is thermally connected to the load through a thermal diode. Each illustrating an exemplary structure and functional depiction of a hybrid heat transport system according to other embodiments of the present disclosure, the second heat conduction path is thermally connected to a load through a thermal capacitor. Each illustrating an exemplary structure and functional depiction of a hybrid heat transport system according to other embodiments of the present disclosure, the second heat conduction path is thermally connected to a load through a thermal capacitor. Each illustrating an exemplary structure and functional depiction of a hybrid heat transfer system according to other embodiments of the present disclosure, the second heat conduction path is thermally connected to a load through a thermal diode and a thermal capacitor. Each illustrating an exemplary structure and functional depiction of a hybrid heat transfer system according to other embodiments of the present disclosure, the second heat conduction path is thermally connected to a load through a thermal diode and a thermal capacitor. Each illustrating an exemplary structure and functional depiction of a hybrid heat transport system according to other embodiments of the present disclosure, wherein the second heat conduction path is thermally connected to a load through a thermal diode and a thermal capacitor, and the first heat conduction The path further includes a heat pump. Each illustrating an exemplary structure and functional depiction of a hybrid heat transport system according to other embodiments of the present disclosure, wherein the second heat conduction path is thermally connected to a load through a thermal diode and a thermal capacitor, and the first heat conduction The path further includes a heat pump. Each illustrating an exemplary structure and functional depiction of a hybrid heat transport system according to yet another embodiment of the present disclosure, wherein the heat conduction path between the load and the ambient environment is connected in series with a thermal capacitor, heat pump, and thermal diode including. Each illustrating an exemplary structure and functional depiction of a hybrid heat transport system according to yet another embodiment of the present disclosure, wherein the heat conduction path between the load and the ambient environment is connected in series with a thermal capacitor, heat pump, and thermal diode including. FIG. 4 illustrates a block diagram of an exemplary hybrid heat transport system according to another embodiment of the present disclosure.

[Detailed description]
Systems and methods for hybrid heat transfer systems are disclosed. The described embodiments represent the information necessary below to enable those skilled in the art to perform the embodiments and describe the optimal execution mode of the embodiments. Upon reading the following description in view of the accompanying drawings, those skilled in the art will understand the concepts of the present disclosure and it will be apparent that the application of these concepts is not specifically illustrated herein.

  It should be understood that these concepts and applications fall within the scope of this disclosure and the appended claims. Although terms such as first, second, etc. may be used herein to describe various elements, it should be understood that these elements should not be limited by these terms. These terms are only used to distinguish elements. For example, a first element may be referred to as a second element, and, similarly, a second element may be referred to as a first element, without departing from the scope of the present disclosure.

  When an element is referred to as being “connected” or “coupled” to another element, it may be directly connected to or coupled to the other element or any intervening element that may be present. It should be further understood. On the other hand, when an element is referred to as being “directly connected” or “directly connected” to another element, there are no intervening elements present.

  It should be understood that the singular forms “a”, “an”, and “the” include the plural unless the context clearly indicates otherwise. A feature expressed when the terms “comprises”, “comprising”, “includes”, and / or “including” are used herein. Describes the presence of integers, steps, actions, elements, and / or components, but describes the presence or addition of one or more of other features, integers, steps, actions, elements, components, and / or groups thereof. It will be further understood that it is not excluded. Further, the term “and / or” includes any and all combinations of one or more of the associated listed items.

  Unless defined otherwise, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. Terms used in this specification should be construed as having a meaning consistent with the context of this specification and the meaning in the prior art, and are idealized unless specifically defined as such in this specification. It will be further understood that it is not construed as an overly formalized or overly formal point.

  The heat transport path includes one or more components that can be thermally coupled in series to provide heat flow along the path. For example, heat can be removed from a housing (eg, a refrigerator cabinet) and subsequently moved along a heat transport path for release to the outside environment (ie, the surrounding environment). The heat transport path may be part of and / or thermally coupled to the “receiving side” and / or “exhaust side” of the heat exhaust system. The acceptor receives heat from the thermal load (eg, removes heat from the load). The discharge side discharges heat to the outside / ambient environment.

  Depending on whether the heat transport path provides active and / or passive heat flow, the heat transport path may be “active” and / or “passive”. For example, the heat transport path component (s) may cause the heat transport path to provide “active” heat transport when consuming energy. On the other hand, the same heat transport path can provide “passive” heat transport when the same component (s) do not consume energy. Thus, the distinction between active and passive heat transport paths depends on whether a large amount of heat can be actively and / or passively transported by the paths. More particularly, the heat transport path may include at least one active heat exchange component and one or more passive components. In addition, whether the heat transport path is called “active heat transport path” or “passive heat transport path” is whether the heat transport path is configured to actively and / or passively transport large amounts of heat by.

  The active heat transport path includes at least one component in which heat transport occurs due to energy consumption. Thus, an active heat transport path transports a large amount of heat when at least one component consumes energy. Such components are generally referred to herein as “active heat exchange components”. Examples of active heat exchange components include heat pumps such as steam compressors, Stirling coolers, thermoelectrics, and any structure, device, and / or material that transports or converts heat by energy consumption. Thus, the active heat transport path transports a large amount of heat when at least one active heat exchange component consumes energy.

The passive heat transport path includes one or more passive components that improve the effectiveness of the natural cooling process without consuming energy. Examples of passive components include heat sinks, thermosyphons, heat pipes, heat exchangers, phase change materials, or any structure, device, and / or that relies on the natural process of heat dissipation or conversion without consuming energy Contains materials.
Thus, passive heat transport paths transport large amounts of heat without consuming energy.

  Thus, a heat transport path that includes an active heat exchange component is an active heat transport path while consuming energy to actively transport heat, and the active heat exchange component is consuming energy. If the active heat transport path passively transports a large amount of heat while it is not, it may be a passive heat transport path. Conversely, a passive heat transport path may include active heat exchange components that do not consume energy while the passive heat transport path passively transports a large amount of heat.

  Embodiments for the heat removal system disclosed herein utilize a combination of active and / or passive components that form one or more active and / or passive heat transport paths. These combinations achieve one or more of better effects, wide temperature range, cooling rate, precise temperature control, and low cost.

  Before continuing the description of the embodiments of the present disclosure, it is useful to define some terms as follows.

  As used herein, “component” refers to a portion or one element in a large whole. A component may include any device, material, and / or system. For example, a component of the heat transport path is a part or part of the heat transport path. A “path” is formed from a plurality of components configured and connected in series to provide a direction for heat transport.

  As used herein, the term “active heat exchange” refers to the operation of any component to actively transfer heat by energy consumption. Heat travels at high temperatures from one location (ie, “source”) of the path to another location (ie, “sink”) at a low temperature. An example of an active heat exchange component is a heat pump. Only heat pumps transfer large amounts of heat when they consume energy. Without being limited thereto, in some embodiments, the heat pump is a solid state heat pump that includes one or more thermoelectric modules, each thermoelectric module comprising a plurality of thermoelectric devices (e.g., by reference to its thermoelectric module technology). Included in the specification, see US Pat. No. 8,216,871 entitled “Method for Manufacturing Thin Film Thermoelectric Modules”. Other examples of heat pumps include vapor compression heat pumps and Stirling cycle heat pumps. As active heat exchange components actively transfer heat, they can be modeled by analogy to the power supply of electrical circuits that actively transfer current.

  As used herein, the term “passive component” refers to a component that passively transfers or converts heat without consuming energy. Heat may be naturally accepted, transported and exhausted by passive components as a result of temperature differences across the passive components. Examples of passive components include heat sinks / heat exchangers, thermosyphons, heat pipes, phase change materials (PCM), and the like.

  FIG. 1A illustrates an exemplary structure of a hybrid heat transfer system according to an embodiment of the present disclosure, the system including first and second heat transfer paths for transferring heat between a load and an ambient environment, The path includes a heat pump.

In the embodiment illustrated in FIG. 1A, the hybrid heat transfer system 10, also referred to herein as “system 10”, is a first heat transfer path 12, also referred to herein as “first path 12”, And a second thermal conduction path 14, also referred to herein as a “second path 14”, both of which have a load 16 having a load temperature (T _L ) and an ambient environment 18 having an ambient temperature (T _A ). Operates to transport heat between. Examples of loads include, but are not limited to, environmentally controlled spaces such as electrical or electronic circuits, printed circuit boards (PCBs), electrical machines such as refrigerators, storage units, homes and office buildings. The first path 12 is configured to passively transport heat. The second heat conduction path 14 is configured to actively transport heat and includes a heat pump 20 for that purpose.

  In the embodiment illustrated in FIG. 1A, the first path 12 is for transporting heat to or from the heat exchanger 22 and the ambient environment 18 for transporting heat to or from the load 16. The heat exchanger 24 is included. The second path 14 includes a heat exchanger 26 for transporting heat to or from the load 16 and a heat exchanger 28 for transporting heat to or from the ambient environment 18. In this illustrated embodiment, heat exchangers 22, 24, 26, and 28 are finned metal heat exchangers / heat sinks, but are not limited to these. Other types of heat exchangers / sinks may be used. Examples of heat exchangers include, but are not limited to, air-cooled heat exchangers, water-cooled heat exchangers, and the like.

  In one embodiment, the heat pump 20 is in an activated state where heat is actively transported between the load 16 and the ambient environment 18 or in a stopped state where heat is not actively transported between the load 16 and the ambient environment 18. Either may be sufficient. For example, a controller or control system (not described) may control the heat pump 20 such that the heat pump 20 is selectively controlled to enter an activated state or a deactivated state according to a desired control algorithm. In some embodiments, the heat pump 20 may continue to passively transport heat even when at rest. In other embodiments, the heat pump 20 may prevent such heat transport when at rest, such as functioning as a thermal circuit breaker between the load 16 and the ambient environment 18, for example.

  In the embodiment illustrated in FIG. 1A, the first path 12 is separated from the second path 14 by a gap. The gap breaks the path to prevent heat leakage or at least reduce heat leakage and returns from the second path 14 to the first path 12 and through the heat exchanger 22 to the closed environment. In some embodiments, the gap may include a circuit breaker to further prevent backflow. In some embodiments, the gap may be omitted entirely, as described below.

  In one embodiment, the load 16 may be located in its own environment that is separate from the surrounding environment 18. In the embodiment illustrated in FIG. 1A, for example, the load 16 may be located in a structure 30 that provides a local environment for the load 16. In one embodiment, the structure 30 may be a climate or temperature controlled space such as an environmentally controlled enclosure such as a refrigerator, freezer, some with ingress protection (IP) rating, and the like. Similarly, heat exchangers 24 and 28 may be located in the structure or in a position to supply additional conditions. For example, the heat exchangers 24 and 28 may be located in a case, chassis, frame, or other environment that provides a continuous air stream (or water stream) over the heat exchanger. These environments may provide further advantages as described below in connection with FIG. 1B.

  FIG. 1B illustrates an orthogonal view of a hybrid heat transport system 10 according to an embodiment of the present disclosure. In the embodiment illustrated in FIG. 1B, each of the first path 12 and the second path 14 are both represented by dashed arrows, and in some embodiments, are mounted within the closure structure 36 in some embodiments. Each includes finned heat exchangers 24 and 28 that benefit from air flow 32 supplied by one or more fans 34 that may be provided.

  In the embodiment illustrated in FIG. 1B, the heat exchangers 22 and 26 are, for example, heat conductive plates (eg, metal plates) that provide a thermal interface between the load 16 and the first and second paths 12 and 14, respectively. However, in alternative embodiments, these structures may not be present. For example, the load 16 may engage directly with the heat exchanger 24 and the heat pump 20 through direct contact and holding in place, for example, via clamps, bolts, or other fasteners. Thermal paste may be present on the mating surface to more efficiently transport heat between these and other mating structures. Alternatively, the load 16 may be coupled to the heat exchanger indirectly (eg, via an intervening structure) or remotely (eg, by radiation of heat across the air gap). Other connection methods are considered as well.

In the embodiment described in FIG. 1B, the heat Q _C from the load 16 is drawn into the first path 12 through the heat exchanger 22 is dissipated into the surrounding environment 18 via the heat exchanger 24. The heat from the load 16 is further drawn into the second path 14 via the heat exchanger 26 and into the heat pump 20 which transports heat to the heat exchanger 28 when activated.

  FIG. 1B illustrates a configuration in which the heat exchanger 24 from the first path 12 is upwind from the heat exchanger 28 from the second path 14. Because the heat exchanger 28 can transport more heat than if an active heat pump could be passively transported, the heat exchanger 28 is likely to be hotter than the heat exchanger 24 and places the heat exchanger 28 leeward of the heat exchanger 24. Thus, the first path 12 is less susceptible to the heat generated by the second path 14, and is therefore more efficient than if the heat exchanger 24 was downwind from the heat exchanger 28. In other words, heat leakage from the second path 14 to the first path 12 is reduced by placing the heat exchanger 28 leeward of the heat exchanger 24.

  The operation of an exemplary hybrid heat transfer system, such as the system described in FIGS. 1A and 1B, may be described using a diagram similar to an electrical schematic, for example. This type of chart is referred to herein as a thermal circuit diagram. For example, a structure that conducts heat energy passively is similar to a resistor and is therefore referred to herein as a thermal resistor. As used herein, the term “thermal resistor” refers to a component that passively accepts heat from a higher temperature environment and exhausts heat to a lower temperature environment. Examples of thermal resistors include heat exchangers. A heat exchanger generally transports heat in a fluid medium. The fluid medium is often air, but may also be water or a refrigerant. A thermal resistor belongs to a specific heat exchanger. In this way, the heat exchanger can be modeled by a similarity to electrical circuit resistors.

  A structure that conducts heat only in one direction is similar to a diode and is therefore referred to herein as a thermal diode. As used herein, the term “thermal diode” refers to a component that preferentially flows heat preferentially in one direction of the path. Conversely, the thermal diode prevents backflow of heat in the direction opposite to the preferred direction of the path. Examples of thermal diodes include thermosyphons. Thermosyphons use passive two-phase heat exchange to transport heat based on natural convection. Thermosyphons use buoyancy and gravity and / or centripetal force to transfer heat between the evaporator and condenser via a working fluid without the need for a mechanical pump. In particular, when the working fluid is heated in the evaporator, the heated working fluid (eg, gas) naturally rises to the condenser through the thermosyphon due to buoyancy because the concentration of the heated working fluid decreases. When the working fluid is cooled by the condenser, the concentration of the cooled working fluid increases so that the cooled working fluid (eg, liquid) naturally sinks to the evaporator through the thermosyphon with gravity and / or centripetal force. .

  Unlike heat pipes that include wicking media to induce capillary forces that facilitate movement of the working fluid for heat transport, thermosyphons do not rely on capillary forces that move the working fluid. As a result, this allows heat flow from the evaporator to the condenser area and prevents backflow of heat to the evaporator. In this way, thermosyphons can be modeled by similarities to electrical circuit diodes.

  The structure for storing thermal energy or thermal energy deficiency (eg, the case where the PCM is in a frozen state, etc.) is similar to a capacitor and is therefore referred to herein as a thermal capacitor. As used herein, the term “thermal capacitor” refers to a component that passively stores heat. An example of a thermal capacitor is PCM. PCM is a material that changes from one phase to another at a specific temperature. As a result, PCM can passively store and release large amounts of heat. Heat is consumed when the material changes (eg, from solid to liquid) to a higher energy state, and heat is changed when the material changes (eg, from liquid to solid) to a lower energy state. Released. In this way, PCM can be modeled by analogy to capacitors in electrical circuits.

  A structure that actively conducts thermal energy is similar to a power supply and is therefore referred to herein as a heat source. The heat source may operate to supply heat, may operate to remove heat, or may be configurable for either.

  Thus, the thermal system can be represented by the equivalence symbol used in the electrical schematic, i.e. to create a thermal schematic. An example of a thermal circuit diagram for the embodiment described in FIG. 1A is shown in FIG. 1C.

FIG. 1C illustrates a functional depiction of the system 10 in FIG. 1A according to an embodiment of the present disclosure. In the embodiment illustrated in Figure 1C, the system 10, the flow of heat _{Q C} from the load 16 with a load temperature _{T L} through the first path 12 and the second path 14 to the ambient environment 18 with ambient temperature _{T A} It is explained as a thermal circuit diagram. In the first path 12, the heat exchanger 22 is represented as a thermal resistor _{Rth, L1} , and the heat exchanger 24 is represented as a thermal resistor _{Rth, A1} . In the second path, the heat exchanger 26 is represented as a thermal resistor _{Rth, L2} , the heat exchanger 28 is represented as a thermal resistor _{Rth, A2} , and the heat pump 20 is represented as a heat source. In one embodiment, heat pump 20 may be a thermoelectric (TEC) device that can supply the power indicated by arrow P _TEC in FIG. 1C.

The structure represented by the thermal circuit diagram illustrated in FIG. 1C may not be at the same temperature throughout the period, but may be at different temperatures at different locations. In the embodiment illustrated in Figure 1C, nodes that are labeled with T _L represents the thermal contact between the load 16 with a load temperature T _L, nodes that are labeled with T _A has an ambient temperature T _A It represents a thermal contact with the surrounding environment 18. Other marking nodes represent positions within the first or second path 12 and 14, and the temperature at each position may be different from T _L or T _A. In the embodiment illustrated in FIG. 1C, for example, T _LA is the temperature at a point in the first path 12 between the load 16 and the ambient environment 18 and T _LHP is the first between the load 16 and the heat pump 20. The temperature at the point in the two paths 14. T _HPA is the temperature at a point in the second path 14 between the heat pump 20 and the ambient environment 18. An exemplary operation of system 10 will now be described using FIG. 1D.

  FIG. 1D illustrates a flow diagram of an exemplary method for a hybrid heat transfer system (eg, the hybrid heat transfer system 10 of FIG. 1A or 1B) according to an embodiment of the present disclosure. FIG. 1D illustrates the concept that the hybrid heat transfer system 10 may operate in various modes and that these modes are selected or entered based on the triggering state. The method is described in connection with FIG. 1C.

In the embodiment illustrated in FIG. 1D, one or more temperatures, such as T _L and T _A (and optionally other temperatures such as T ₁ , T ₂ ) are monitored (step 100). As described in more detail below, detection of a particular trigger condition may cause the system to enter an active cooling mode, a passive cooling (or heating) mode, or an active heating mode.

For illustrative purposes, in the embodiment illustrated in FIG. 1D, it is assumed that the load 16 has a desirable operating range of temperatures from the load low temperature T _LL to the load high temperature T _LH . In this embodiment, it is desirable that T _LL ≦ T _LH and T _LL ≦ T _L ≦ T _LH .

In this embodiment, the process, T _L that indicates that the load 16 needs to be cooled to see if higher than T _LH (step 102), in which case the process is then T _A than T _L (Step 104). In that case, passive cooling alone may be sufficient to lower _TL , so active cooling is stopped (or remains stopped) (step 106), and the process returns to step 100. In step 104, if T _A is higher than T _L , then passive cooling requires that T _A be less than T _{L in} order to transfer heat from the load 16 to the ambient environment 18, so that active cooling is then performed. Necessary. In this case, active cooling is initiated (or remains activated) (step 108) and the process returns to step 100.

In this embodiment, in step 102, if _TL is not greater than or equal to upper limit T _LH , then the process confirms whether _TL is less than or equal to lower limit T _LL , indicating that the load needs to be heated. (Step 110), in that case, the process then checks whether T _A is higher than T _L (Step 112). In that case, passive heating alone may be sufficient to increase _TL , so active heating is stopped (or remains stopped) (step 114), and the process returns to step 100. In step 112, if T _A is lower than T _L , then passive heating requires subsequent heating because T _A needs to be greater than T _L. In this case, active heating is initiated (or maintained in an activated state) (step 116) and the process returns to step 100.

In this embodiment, if T _L is lower than T _{LL at} step 110, then the load 16 is within the desired temperature range, so the process does not change before returning to step 100 (step 118). In one embodiment, “do not change” means to maintain any mode in which the system is currently operating (eg, active cooling, passive cooling, active heating, or passive heating). To do. For example, if the system detects that active cooling is required (ie, the process moves from step 102 to step 104 and then to step 106), then over time, active cooling may occur at several subsequent points. T _L should be successfully lowered to between T _LL and T _LH (ie, the process moves from step 102 to step 110 and then to step 118). It may be necessary to continue operating in active cooling mode to maintain _TL within the desired temperature range.

  FIG. 1D illustrates an embodiment in which the second path 14 can be actively heated and further actively cooled. For example, in one embodiment, the operation of the heat pump 20 may be reversed, i.e. heat may be transported in either direction, for example by reversing the direction of the current through the heat pump 20. In this embodiment, the heat pump 20 may be used to warm the load 16. Alternatively, other devices such as resistance heaters may be employed, for example, to supply heat to the load 16 and / or to supplement the operation of the heat pump 20. In alternative embodiments, however, the heat pump 20 may operate only in one direction, for example to actively cool. In these embodiments, steps 110, 112, 114, and 116 may be omitted. Similarly, it will be appreciated that the process described in FIG. 1D may include additional steps not shown.

Generally, Figure 1D illustrates the principles of some embodiments, the first path 12 and second path 14 supplies a parallel heat flow path to remove Q _C at a temperature T _L. In some embodiments, the operation of the system 10 is a function of the difference between the temperature of any node upstream of the T _A and the heat exchanger 24 and 28. The temperature difference between T _LHP and T _A is the heat pump 20 may determine whether to start to remove the Q _C through the second path 14. For _{example, T LHP} time is less than or equal to _{T A,} the heat pump 20 may be activated to remove the _{Q C} through the second path 14. When T _LHP is greater than T _A, since the natural mortality is caused by the temperature difference, the heat pump 20, Q _C may be stopped as passively flows through the first path 12. Thus, the first path 12 may reduce costs and improve energy efficiency, and / or the second path 14 may provide a wide temperature range of operation. However, the operation of the system 10 is not limited to these.

In some embodiments, heat pump 20 may be activated while T _LHP is greater than T _A to provide rapid cooling. In other words, the heat pump 20, T _LHP when rapid cooling is required may start even greater than T _A. In some embodiments, the first path 12 may be used only as a backup path when the second path 14 is inoperable. Thus, system 10 can provide cost-effective operation to improve efficiency and performance when compared to systems that only use active or passive cooling techniques.

The method illustrated in FIG. 1D is for illustration and not limitation. For example, rather than just one value of T _LH , the system provides a form of hysteresis, eg, a different upper limit based on whether _TL is currently rising (T _LHR ) or falling (T _LHF ). May have a pair of temperature thresholds designed to be In one embodiment, _TLHR is some degree higher than _TLHF , so if _TL is rising, heat pump 20 will cause load 16 to cool down until _TL is greater than or equal to _TLHR. Although not activated, if _TL is falling, heat pump 20 does not stop until _TL is equal to or less than _TLHF . This can save energy when compared to having a heat pump 20 that can activate or deactivate active cooling based on a single threshold T _LH .

2A and 2B illustrate an exemplary structure and functional depiction, respectively, of a hybrid heat transport system according to another embodiment of the present disclosure, where the first and second heat conduction paths are general for transporting heat from a load. Common heat exchangers (which may also be referred to as “shared” heat exchangers). In one embodiment illustrated in FIG. 2A, the first heat transfer path 12 and the second heat transfer path 14 are thermally connected to the load 16 via a general heat exchanger 38. The descriptions of elements 18, 20, 24, 28, T _LA , T _LHP , and T _HPA are the same as in FIG. 1A and are therefore not repeated here.

Referring now to Figure 2B, system 10 shows the flow of heat _{Q C} to the ambient environment 18 with ambient temperature _{T A} from the load 16 with a load temperature _{T L} through the first path 12 and second path 14 It is explained as a thermal circuit diagram. A typical heat exchanger 38 is represented as a thermal resistor _{Rth, L.} The descriptions of elements 20, 24, 28, P _TEC , T _LA , T _LHP , and T _HPA are the same as in FIG. 1C and are therefore not repeated here.

  FIGS. 2C and 2D illustrate an exemplary structure and functional depiction, respectively, of a hybrid heat transport system according to another embodiment of the present disclosure, where the first and second heat conduction paths are for transporting heat from the surrounding environment. Share a common heat exchanger. In the embodiment illustrated in FIG. 2C, the first path 12 and the second path 14 not only share a general heat exchanger 38 but also share a general heat exchanger 40. The description of components 16, 18, 20, and 30 is the same as in FIG. 1A and is therefore not repeated here.

Referring now to FIG. 2D, the system 10 does not surrounding environment 18 (shown with the ambient temperature _{T A} from the load 16 with a load temperature _{T L} through the first path 12 and second path 14 (not shown) ) it is described as heat circuit diagram illustrating the flow of heat Q _C to. A typical heat exchanger 38 is represented as a thermal resistor _{Rth, L} , and a typical heat exchanger 40 is represented as a thermal resistor _{Rth, A.} The description of element 20, P _TEC , T _LHP , and T _HPA is the same as in FIG. 1C and is therefore not repeated here.

  3A and 3B illustrate an exemplary structure and functional depiction, respectively, of a hybrid heat transfer system according to another embodiment of the present disclosure, where the first heat conduction path is thermally connected to a load through a thermal diode. In the embodiment illustrated in FIG. 3A, the thermal diode 42 connects a general heat exchanger 38 to the heat exchanger 24 in the first path 12. The description of elements 16, 18, 20, 28, and 30 is the same as described above and therefore will not be repeated here.

  A characteristic of a thermal diode is that it effectively passively transports heat only in one direction. In some embodiments, the thermal diode 42 is a thermosyphon. A general thermosyphon is a tube containing a refrigerant that changes from liquid to gaseous under heating. In operation, when the refrigerant is heated, the resulting gas rises buoyantly through the tube to the tube cooling area, the gas liquefies into a liquid, and flows back to the tube heating area by gravity. A change of state from liquid to gas extracts heat, and condensation from gas to liquid releases that heat. In this method, heat is extracted from one end of the thermosyphon (eg, the load end) and released from the opposite end of the thermosyphon (eg, to the surrounding environment). In other words, the thermosyphon is passive, two-phase heat transport in one direction, that is, from the evaporator region of the thermosyphon (which in this embodiment is connected to a common heat exchanger 38) to the condenser of the thermosyphon. To the region (in this embodiment connected to the heat exchanger 24).

The presence of the thermal diode 42, heat is provided the advantage that the load 16 through the first path 12 can flow effectively to the ambient environment 18, not the case in the opposite direction, for example, the ambient temperature T _A In a state where it is higher than the load temperature _TL , the load 16 is prevented from receiving unnecessary heat via the first path 12. Another advantage of this configuration is that the heat exchanger 24 of the first path 12 may be located or located at some distance from the heat exchanger 28 of the second path 14, and the active operation of the heat pump 20. Very high temperatures can be obtained in between. Separating the heat exchanger 24 from the heat exchanger 28 at some distance can cause the heat exchanger 24 to be thermally isolated from the heat exchanger 28 so that any heat generated in the heat exchanger 28 is transferred to the heat exchanger 24 itself. Or the environment (eg, via convection) in proximity to the heat exchanger 24 is less likely to be affected (eg, via heat conduction or radiation).

  In one embodiment, one or more thermosyphons may be connected in series between the general heat exchanger 38 and the heat exchanger 24. The evaporator region of the thermosyphon may be thermally coupled to a general heat exchanger 38 and the condenser region of the thermosyphon may be coupled to a separate heat exchanger 24. In this way, the thermosyphon operates as a thermal diode, so that the thermal diode combined with any insulation prevents the heat from flowing back from the external environment to the closed environment 30.

Referring now to FIG. 3B, the system 10 does not surrounding environment 18 (shown with the ambient temperature _{T A} from the load 16 with a load temperature _{T L} through the first path 12 and second path 14 (not shown) ) it is described as heat circuit diagram illustrating the flow of heat Q _C to. T _DA is the temperature of the point in the path 12 between the thermal diode 42 and the ambient environment 18. The descriptions of components 20, 24, 28, 38, P _TEC , T _LHP , and T _HPA are the same as described above and are therefore not repeated here. In the embodiment illustrated in FIG. 3B, it can be seen that the first path 12 includes a thermal diode 42.

  4A and 4B illustrate an exemplary structure and functional depiction, respectively, of a hybrid heat transfer system according to another embodiment of the present disclosure, wherein the first heat conduction path is thermally connected to a load through a thermal diode, and The first and second paths share a common heat exchanger for transporting heat to or from the surrounding environment. The embodiment of the system 10 illustrated in FIG. 4A is a variation of the system 10 illustrated in FIG. 3A with the difference that both the first path 12 and the second path 14 share a common heat exchanger 40. It may be considered a form. The description of elements 16, 18, 20, 30, 38, and 42 is the same as described above, and therefore will not be repeated here.

Referring now to Figure 4B, the system 10, the heat circuit showing the flow of heat Q _C to the ambient environment with ambient temperature T _A from the load with a load temperature T _L through the first path 12 and second path 14 Illustrated as a diagram. The first path 12 includes a thermal diode 42 and the second path 14 includes a heat pump 20. A typical ambient heat exchange is represented as a thermal resistor _{Rth, A.} The descriptions of elements 38, 40, P _TEC , T _LHP , and T _HPA are the same as described above and are therefore not repeated here.

  The embodiment described above and illustrated in FIGS. 3A, 3B, 4A, and 4B includes a thermal diode in the first thermal conduction path 12. In an alternative embodiment, a thermal diode may be included in the second thermal conduction path 14, as illustrated in FIGS. 5A and 5B.

  FIGS. 5A and 5B illustrate an exemplary structure and functional depiction, respectively, of a hybrid heat transfer system 10 according to another embodiment of the present disclosure, wherein the second heat conduction path 14 heats through the thermal diode 42 to the load 16. Connected. The embodiment illustrated in FIG. 5A is a variation of the system 10 illustrated in FIG. 2A, with the difference that the second path 14 includes a thermal diode 42 in series between the general heat exchanger 38 and the heat pump 20. It may be considered a form. The description of elements 16, 18, 24, 28, and 30 is the same as described above, and therefore will not be repeated here.

  In this configuration, the heat pump 20 can actively extract heat away from the top of the thermal diode 42. For example, if the thermal diode 42 is a thermosyphon, the heat pump 20 can cool the top of the thermal diode 42 to promote condensation of the gas collected therein and thereby improve the performance of the thermal diode 42.

Referring now to FIG. 5B, the system 10 does not surrounding environment 18 (shown with the ambient temperature _{T A} from the load 16 with a load temperature _{T L} through the first path 12 and second path 14 (not shown) ) it is described as heat circuit diagram illustrating the flow of heat Q _C to. In this embodiment, the second path 14 includes both the thermal diode 42 and the heat pump 20 in series. T _LD is the temperature of a point in the second path 14 between the load 16 and the thermal diode 42. _TDHP is the temperature of the point in the second path 14 between the thermal diode 42 and the heat pump 20. The description of elements 24, 28, 38, P _TEC , T _HPA , and T _LA is the same as described above and is therefore not repeated here.

  The following embodiment describes a configuration including a thermal capacitor. Examples of thermal capacitors include, but are not limited to, devices that include or comprise phase change materials and / or thermal mass. For example, a thermal capacitor may include a reservoir of water that can be actively cooled to ice, which is subsequently used to passively cool the load 16 (or at least release heat therefrom). Similarly, the thermal capacitor may be actively heated and subsequently used to passively heat (or at least provide heat to) the load 16. A thermal capacitor may simply be a component having a large thermal mass that is used to dissipate heat from or supply heat to the load.

  6A and 6B illustrate exemplary structural and functional depictions, respectively, of a hybrid heat transfer system 10 according to another embodiment of the present disclosure, where the second heat conduction path 14 is thermally connected to a load through a thermal capacitor. The The embodiment described in FIG. 6A is a variation of the system 10 described in FIG. 2A, with the difference that the second path 14 includes a thermal capacitor 44 in series between the general heat exchanger 38 and the heat pump 20. It may be considered a form. The thermal capacitor 44 is PCM in some embodiments. In cooling adaptation, the thermal capacitor 44 is charged by the heat pump 20 such that the thermal capacitor 44 stores a thermal energy deficit (eg, the PCM is frozen). However, in a heating adaptation, the thermal capacitor 44 is configured to heat the heat pump 20 (configured to heat rather than cool) so that the thermal capacitor 44 stores thermal energy (eg, the PCM is thawing or liquid). Is charged by. The description of elements 12, 16, 18, 24, 28, and 30 is the same as described above, and therefore will not be repeated here.

  In one embodiment, heat pump 20 consumes energy and heat is extracted from thermal capacitor 44. As a result, the heat pump 20 charges the thermal capacitor 44. After the thermal capacitor 44 is fully charged, the heat pump 20 may continue to extract heat from the thermal capacitor 44 at the same rate that the thermal capacitor 44 removes heat from the load.

  When the heat pump 20 is not consuming energy, the thermal capacitor 44 may passively remove heat from the load until the thermal capacitor 44 is completely discharged. The thermal capacitor 44 can be recharged when the heat pump 20 is consuming energy again. Thus, the thermal capacitor 44 causes the second path 14 to actively or passively remove heat.

  In some embodiments, the thermal capacitor 44 operates as a clamp to regulate the temperature of the load 16. For example, the thermal capacitor 44 may comprise PCM. As the PCM releases heat, the state may change while the temperature of the PCM- and load 16- is fixed at its melting point (eg, from solid to liquid, from liquid to gas, or from solid to gas). ). On the other hand, the first path 12 provides a fail-safe heat flow path from the general heat exchanger 38 to the surrounding environment 18 when the load 16 places a burden on the thermal capacitor 44.

Referring now to Figure 6B, the system 10, the heat circuit showing the flow of heat Q _C to the ambient environment with ambient temperature T _A from the load with a load temperature T _L through the first path 12 and second path 14 Illustrated as a diagram. In this embodiment, the second path 14 includes a thermal capacitor 44 in series with the heat pump 20. T _LC is the temperature of the point in the second path 14 between the load 16 and the thermal capacitor 44. T _CHP is the temperature of the point in the second path 14 between the thermal capacitor 44 and the heat pump 20. The description of elements 24, 28, 38, P _TEC , T _HPA , and T _LA is the same as described above and is therefore not repeated here.

  The presence of the thermal capacitor 44 in the system 10 has several potential advantages. One such advantage is that when an external power source is available, the thermal capacitor 44 is “charged” by the operation of the heat pump 20 in the activated state (ie, actively cooled or heated to a target temperature, for example). ) So that the thermal capacitor 44 can cool or heat the load 16 with no external power available or the heat pump 20 is stopped, for example. For example, in the situation where a package containing food or other products is transported to a remote location, prior to transport, the thermal capacitor 44 is actively charged by a heat pump 20 connected to an electrical outlet or connected to an external power source ( This feature is useful because it can be cooled). Once the thermal capacitor 44 is fully charged, the heat pump 20 is disconnected from the external power source and the package being cooled is transported. Thermal capacitor 44 may then continue to cool the package contents sufficiently while the package is in transit and cannot be connected to an external power source.

  Another advantage, including the thermal capacitor 44, is in an environment where external power sources are continuously available and the power company typically charges additional power for power consumed during peak demand periods. In this situation, the system 10 that includes the thermal capacitor 44 charges the thermal capacitor 44 at a rate during the night or other low demand periods (and in some cases) to avoid having to pay an expensive rate to charge during peak demand periods. In some cases, an external power source may be used to actively cool the load 16. Thermal capacitor 44 may then be used to cool load 16 during peak time (at least a portion thereof). In addition, power companies often impose transactions based on peak instantaneous power usage. Utilizing the thermal capacitor 44 allows the company to stagger the time during which the heat pump 20 (or possibly the time in multiple heat pumps 20 of the system 10) is activated to reduce all peak power usage. . In this way, companies will dramatically reduce power costs.

  7A and 7B illustrate exemplary structural and functional depictions, respectively, of the hybrid heat transfer system 10 according to other embodiments of the present disclosure, with the second heat conduction path 14 to the load 16 through the thermal diode 42 and the thermal capacitor 44. And thermally connected. The embodiment described in FIG. 7A is a variation of the system described in FIG. 5A with the difference that the second path 14 includes a series thermal capacitor 44 between the thermal diode 42 and the heat exchanger 28. May be considered. The description of elements 12, 16, 18, 24, 30, and 38 is the same as described above, and therefore will not be repeated here.

Referring now to FIG. 7B, the system 10 does not surrounding environment 18 (shown with the ambient temperature _{T A} from the load 16 with a load temperature _{T L} through the first path 12 and second path 14 (not shown) ) it is described as heat circuit diagram illustrating the flow of heat Q _C to. In this embodiment, the second path 14 includes a thermal diode 42 and a thermal capacitor 44 in series with the heat pump 20. T _LD is the temperature of a point in the second path 14 between the load 16 and the thermal diode 42. T _DC is the temperature of the point in the second path 14 between the thermal diode 42 and the thermal capacitor 44. The descriptions of elements 24, 28, 38, P _TEC , T _LA , T _CHP , and T _HPA are the same as described above and are therefore not repeated here. The temperature T _LD on the load side of the thermal diode 42 may be different from the temperature T _DC on the peripheral side of the thermal diode 42. Similarly, the temperature T _DC on the load side of the thermal capacitor 44 may be different from the temperature T _CHP on the opposite side of the thermal capacitor 44.

  The presence of thermal capacitor 44 may provide some or all of the aforementioned advantages. For example, the heat pump 20 may actively charge the thermal capacitor 44 so that heat can be extracted from the load 16 even when the heat pump 20 is not activated or unavailable due to external power being unavailable. The efficiency of the thermal diode 42 can be improved.

  8A and 8B illustrate exemplary structural and functional depictions, respectively, of the hybrid heat transfer system 10 according to other embodiments of the present disclosure, with the second heat conduction path 14 to the load 16 through the thermal diode 42 and the thermal capacitor 44. The first heat conduction path 12 further includes a heat pump 20. The embodiment described in FIG. 8A may be considered a variation of the system 10 described in FIG. 7A, with the difference that the previous passive first path 12 now includes its own heat pump 46. Good. The descriptions of elements 12, 16, 18, 20, 24, 28, 30, 38, 42, and 44 are the same as described above and are therefore not repeated here.

Referring now to FIG. 8B, the system 10 does not surrounding environment 18 (shown with the ambient temperature _{T A} from the load 16 with a load temperature _{T L} through the first path 12 and second path 14 (not shown) ) it is described as heat circuit diagram illustrating the flow of heat Q _C to. In this embodiment, the first path 12 further includes a heat pump 46. T _CHP2 is the temperature of the point in the second path 14 between the thermal capacitor 44 and the heat pump 20. T _HP2 is the temperature of the point in the second path 14 between the heat pump 20 and the ambient environment 18. T _LHP1 is the temperature at a point in the first path 12 between the load 16 and the heat pump 46. T _HP1A is the temperature of the point in the first path 12 between the heat pump 46 and the ambient environment 18. The temperature T _LHP1 on the load side of the heat pump 46 may be different from the temperature T _HP1A . In the embodiment illustrated in FIG. 8B, the two heat pumps 20 and 46 can each be controlled independently of each other, and the power supplied to the heat pump 46 is indicated by the arrow P _TEC1 and supplied to the heat pump 20. The power that is applied is indicated by the arrow _PTEC2 . The description of components 20, 24, 28, 38, 42, and 44 is the same as described above, and therefore will not be repeated here.

FIGS. 9A and 9B illustrate an exemplary structural and functional depiction, respectively, of a hybrid heat transfer system 48 that is also referred to herein as a “system 48” according to yet another embodiment of the present disclosure. A heat conduction path 50, also referred to herein as a “path 50” between the ambient environment 18, includes a thermal capacitor 44, a heat pump 20, and a thermal diode 42 connected in series. In the embodiment illustrated in Figure 9A, the system 48 includes a thermally conductive path 50 between the ambient environment 18 having a load 16 and the ambient temperature T _A with the load temperature T _L, the path 50 is heat capacitor 44, the heat pump 20 and a thermal diode 42. In the embodiment illustrated in FIG. 9A, heat exchanger 26 provides a thermal interface between load 16 and path 50, and heat exchanger 28 provides a thermal interface between path 50 and ambient environment 18.

In the embodiment described in FIG. 9B, the system 48, the thermal load 16 having a load temperature T _L via heat conduction path 50 (not shown) to the ambient environment 18 (not shown) having a peripheral temperature T _A It is described as heat circuit diagram showing the flow of Q _C. In the embodiment illustrated in FIG. 9B, heat exchanger 26 is represented as thermal resistor R _{th, L} and heat exchanger 28 is represented as thermal resistor R _{th, A.} Path 50 further includes a thermal capacitor 44, a heat pump 46, and a thermal diode 42. T _HPD is the temperature of the point in the path 50 between the heat pump 20 and the thermal diode 42. T _DA is the temperature of a point in the path 50 between the thermal diode 42 and the ambient environment 18. The descriptions of elements 20, 24, 28, 38, 42, 44, P _TEC , T _LC , and T _CHP are the same as described above and are therefore not repeated here. The temperature T _CHP on the load side of the heat pump 46 may be different from the temperature T _HPD .

  FIG. 10 illustrates a block diagram of an exemplary hybrid heat transport system 52, also referred to herein as “system 52”, according to another embodiment of the present disclosure. In the embodiment illustrated in FIG. 10, system 52 includes an active heating and / or cooling component 54, also referred to herein as “active component 54”, and a control system 56. In some embodiments, the system 52 may optionally include a passive heating and / or cooling component 58, also referred to herein as “passive component 58”. In the embodiment illustrated in FIG. 10, the control system 56 includes one or more temperature sensors 60 that provide temperature data to the controller 62 as well as optionally other types of data. In one embodiment, the controller 62, which may be implemented as one or more central processing units (CPUs), application specific integrated circuits (ASICs), field programmable gate arrays (FPGAs), etc., or combinations thereof, The data supplied by sensor 60 is processed according to an algorithm. The controller 62 controls the operation of the active component 54 by activating and switching the circuit 64. System 52 may optionally include a computer memory 66 for storing computer programs and / or data.

  In one embodiment, for example, the control system 56 may determine whether one or more active components 54 cause a change from a start state to a stop state or vice versa, as described above and FIG. The process described in 1D may be performed.

In one embodiment, for example, the system 52 includes both an active component 54 and a passive component 58. In one such embodiment, the passive component 58 may continuously and passively transfer heat, and the system 52 may be passive such as when the ambient environment 18 is hotter than the target load temperature _TL. The active component 54 is activated only when the component 58 cannot transport sufficient heat. In other embodiments, the passive component 58 serves as a backup system for transporting heat when the active component 54 is unavailable, such as either due to a lack of external power or due to a component failure. Function.

  In one embodiment, a computer program comprising instructions that when executed by at least one processor causes the at least one processor to perform the functionality of the controller 62 in accordance with any one of the embodiments described herein. Supplied. In one embodiment, a carrier comprising the aforementioned computer program product is provided. The carrier is one of an electrical signal, an optical signal, a wireless signal, or a computer readable storage medium (eg, a non-transitory computer readable medium such as computer memory 66).

  The aforementioned embodiments are not limited to these. For example, the system may add or omit any component and arrange the components to form any number of paths in any order without departing from the scope of the present invention.

  As mentioned above, some embodiments of the present disclosure include a heat removal system that utilizes a plurality of components that form one or more heat transport paths. The plurality of components may include active components and passive components. In some embodiments, the hybrid heat removal system includes a plurality of components that form a plurality of heat transport paths including at least one active heat transport path and at least one passive heat transport path. The active heat transfer path includes an active heat exchange component and is configured to provide active heat removal from the load when the active heat exchange component is activated. The passive heat transport path is configured to provide passive heat removal from the load. The passive heat transport path is parallel to the active heat transport path.

  Those skilled in the art will recognize improvements and modifications to the preferred embodiments of the present disclosure. All such improvements and modifications are considered within the concept disclosed herein and the following claims.

Claims (30)

_A first heat conduction path configured to passively transport heat between a load having a load temperature (T _L ) and an ambient environment having an ambient temperature (T _A ); and active between the load and the ambient environment A hybrid heat transport system including a second heat conduction path configured to thermally transport heat, wherein the second path comprises a heat pump.   When the heat pump is either in the activated state or in the deactivated state, when the heat pump is in the activated state, heat is actively transported through the second heat conduction path, and when the heat pump is in the deactivated state, The hybrid heat transport system of claim 1, wherein is not actively transported through a second heat conduction path.   The hybrid heat transport system of claim 1, wherein each of the first and second paths comprises its own independent heat exchange component for transporting heat to or from the load.   4. The hybrid heat transport system of claim 3, wherein each of the first and second paths comprises its own independent heat exchange component for transporting heat to or from the surrounding environment.   The hybrid heat transport system of claim 1, wherein the first and second paths share common heat exchange components for transporting heat to or from the load.   6. The hybrid heat transport system of claim 5, wherein the first and second paths each comprise its own independent heat exchange component for transporting heat to or from the surrounding environment.   The hybrid heat transport system of claim 6, wherein the first heat transfer path comprises a series of thermal diodes between the load and the ambient environment.   The hybrid heat transport system of claim 6, wherein the second heat transfer path includes a thermal diode in series between the load and the heat pump.   The hybrid heat transport system of claim 6, wherein the second heat conduction path includes a thermal capacitor in series between the load and the heat pump.   The hybrid heat transport system of claim 6, wherein the second heat conduction path includes a thermal diode and a thermal capacitor in series between the load and the heat pump.   The hybrid heat transport system of claim 10, wherein the first heat conduction path includes a second heat pump.   6. The hybrid heat transport system of claim 5, wherein the first and second paths share the general heat exchange component for transporting heat to or from the ambient environment.   13. The hybrid heat transport system of claim 12, wherein the first heat transfer path comprises a thermal diode in series between the load and the ambient environment.   The hybrid heat transport system of claim 1, wherein the first and second paths share common heat exchange components for transporting heat to or from the ambient environment.   The hybrid heat transport system of claim 1, wherein each of the first and second paths comprises its own independent heat exchange component for transporting heat to or from the ambient environment.   The hybrid heat transport system of claim 1, wherein the first heat transfer path comprises a series of thermal diodes between the load and the ambient environment.   The hybrid heat transport system of claim 16, wherein the thermal diode comprises a thermosyphon.   The hybrid heat transfer system of claim 1, wherein the second heat transfer path includes a thermal diode in series between the load and the ambient environment.   The hybrid heat transport system of claim 18, wherein the thermal diode is in series between the load and the heat pump.   The hybrid heat transport system of claim 1, wherein the second heat transfer path includes a thermal capacitor in series between the load and the ambient environment.   21. The hybrid heat transport system of claim 20, wherein the thermal capacitor comprises phase change material and / or thermal mass.   The hybrid heat transport system of claim 1, wherein the second heat conduction path includes a thermal diode, a thermal capacitor, and the heat pump in series between the load and the ambient environment. _A hybrid heat transfer system comprising a heat transfer path for transferring heat from a load having a load temperature (T _L ) to an environment having an ambient temperature (T _A ), the heat transfer path being a stored temperature (TS) A heat capacitor, a heat pump, and the heat pump is in an activated state while heat is actively transported by the heat pump, and is in a stopped state while heat is not actively transported by the heat pump, and the load And a thermal diode connected in series between the ambient environment and the hybrid heat transport system.   24. The hybrid heat transport system of claim 23, wherein the thermal capacitor comprises phase change material and / or thermal mass.   A first side of the thermal capacitor is in contact with the load, a first side of the heat pump is in contact with a second side of the thermal capacitor, and a first side of the thermal diode is in contact with a second side of the heat pump; 24. The hybrid heat transport system of claim 23, wherein a second side of the thermal diode transports heat to the surrounding environment.   A first component for active heating and / or cooling of a load and operation of said first component is controlled by at least one control input, said first component via at least one control input according to an algorithm And a control system configured to control the operation of the hybrid heat transport system.   27. The hybrid heat transfer system of claim 26, further comprising a second component for passive heating and / or cooling of the load.   The control system receives temperature information from at least one temperature sensor and at least one temperature sensor having hardware, processes the information according to an algorithm to determine a desired operation of the first component; and 27. The hybrid heat transfer system of claim 26, comprising a controller configured to control the operation of a first component.   29. The hybrid heat transfer system of claim 28, wherein the controller controls the operation of the first component by activating and switching an electrical circuit between the controller and the first component. _A first heat conduction path for passively transporting heat between a load having a load temperature (T _L ) and an ambient environment having an ambient temperature (T _A ) and actively between the load and the ambient environment a second heat conduction path for transporting heat, the method of the second path to control the hybrid heat transport system comprising a heat pump, and monitoring the value of T _L and T _a, T _L is the With a determination that greater than one threshold T _{LH and} a determination that T _A is greater than or equal to T _L , heat is actively transported from the load to the surrounding environment via the second heat transfer path. the heat pump such that it activates the heat pump, T _a is the determination that less than T _L, no heat is actively transported into the ambient environment from the load via the second heat conduction path as Stop And Rukoto, determination that T _L is smaller than the second threshold value T _LL, the determination that T _A is less than or equal to T _L, the heat through the second path from the ambient environment to the load and to start the heat pump to be actively transported by determination that T _a is greater than T _L, heat is not actively transported to the load from the surrounding environment through the second path And stopping the heat pump and not changing the current operating state of the heat pump by determining that T _LL ≦ T _L ≦ T _LH .