JP2017224696A - Electronic apparatus support structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic apparatus support device that is able to cool a housed electronic apparatus in a balanced manner.SOLUTION: An electronic apparatus support structure comprises fluid supply means that supports one side of each of a plurality of apparatuses and supplies each of the plurality of electronic apparatuses with a fluid that has flowed in. The fluid supply means is provided with one inlet through which gas flowing in passes. According to each of the plurality of electronic apparatuses, a supply port is provided, in which a fluid that has flowed in from the inlet flows and which supplies the fluid to each of the plurality of electronic apparatuses. A channel is provided, which extends from the inlet to the supply port and through which the fluid that has flowed in from the inlet passes. A channel includes at least one branching means that separates a supply area and a bypass area, the supply area being for passing a fluid flowing out from the supply port located nearest the inlet among the supply ports, and the bypass area being for passing a fluid flowing out from a supply port farthest from the inlet.SELECTED DRAWING: Figure 28

Description

  The present invention relates to an electronic device support apparatus.

  There is a rack in which electronic devices are stored. Various techniques for cooling electronic equipment stored in such a rack have been proposed.

  There is a rack configured to flow a fluid into a plurality of ducts branched from an air supply duct and cool an electronic device connected to each duct. In such a rack, for example, the following method is used in order to equalize the amount of fluid flowing inside each duct and to cool each electronic device evenly.

  That is, a method of adjusting the cross-sectional area of the inlet through which fluid flows in each duct is used. Further, a method of providing a plate for adjusting the direction of fluid flow inside the air supply duct is used. Further, a method is used in which pressure is applied to the fluid in the air supply duct so that the fluid flows through each duct with a negligible difference in the flow rate of the fluid flowing through each duct.

  Patent Document 1 describes a rack with an air conditioning duct that includes a suction duct whose opening cross-sectional area decreases as the distance from the intake fan increases. In the rack with an air-conditioning duct described in Patent Document 1, a suction duct having an opening area that becomes narrower as the air flows away from the air supply fan is used in order to allow cold air to flow evenly between the stages of the shelf board.

JP 2004-55883 A JP 2005-105942 A JP 2012-169554 A JP 2014-170765 A

  The method of adjusting the cross-sectional area of the inlet through which the fluid flows in each duct has a problem that it takes a lot of time and labor to calculate and adjust the cross-sectional area of the inlet.

  In addition, the method of providing a plate for adjusting the direction of fluid flow inside the air supply duct changes the direction of fluid flow, so that pressure loss increases and the flow rate of fluid flowing through the air supply duct can be reduced. There is.

  In addition, the method of applying pressure to the fluid in the air supply duct has a problem that power consumption increases, leading to inefficient operation.

  The rack with an air-conditioning duct described in Patent Document 1 needs to use a suction duct having a special shape in order to uniformly cool each shelf board, which may cause problems such as a complicated configuration.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an electronic device support device that can cool a stored electronic device with a simple configuration in a balanced manner.

  In order to achieve the above object, an electronic device support apparatus according to an aspect of the present invention includes a fluid supply unit that supports one side surface of a plurality of electronic devices and supplies an inflowing fluid to each of the plurality of electronic devices. The fluid supply means is provided with one inflow port through which an inflowing gas passes, provided according to each of the plurality of electronic devices, and the fluid flowing in from the inflow port flows out and the plurality of electrons A supply port for supplying the fluid is provided in each of the devices, a flow path from the inflow port to the supply port and through which the fluid flowing in from the inflow port passes is provided. Among these, at least one partitioning a supply region for allowing fluid flowing out from the supply port close to the inflow port and a bypass region for allowing fluid flowing out of the supply port far from the inflow port to pass Characterized in that it comprises a branching means.

  ADVANTAGE OF THE INVENTION According to this invention, the accommodated electronic device can be cooled with sufficient balance with a simple structure.

It is sectional drawing which shows the structural example of the rack which concerns on the 1st Embodiment of this invention. It is sectional drawing which shows the structural example of the air supply duct in which the branch plate which concerns on the 1st Embodiment of this invention was installed. It is a perspective view which shows the structural example of the branch plate which concerns on the 1st Embodiment of this invention. It is a side view which shows the example of the side surface of the electronic device which concerns on the 1st Embodiment of this invention. It is sectional drawing which shows the structural example of the rack which concerns on the 2nd Embodiment of this invention. It is a perspective view which shows the structural example of the branch plate which concerns on the 2nd Embodiment of this invention. It is a front view which shows the structural example of the reference | standard board which concerns on the 2nd Embodiment of this invention. It is a front view which shows the structural example of the movable plate which concerns on the 2nd Embodiment of this invention. It is sectional drawing which shows the structural example of the rack which concerns on the 3rd Embodiment of this invention. It is a perspective view which shows the structural example of the branch plate which concerns on the 3rd Embodiment of this invention. It is a perspective view which shows the structural example of the reference | standard board which concerns on the 3rd Embodiment of this invention. It is an enlarged view which is an example which expanded a part of reference | standard board which concerns on the 3rd Embodiment of this invention. It is explanatory drawing which shows the example of attachment to the reference | standard board of the movable plate which concerns on the 3rd Embodiment of this invention. It is explanatory drawing which shows the example of attachment to the reference | standard board of the movable plate which concerns on the 3rd Embodiment of this invention. It is sectional drawing which shows the structural example of the rack which concerns on the 4th Embodiment of this invention. It is a front view which shows the structural example of the air supply duct which concerns on the 4th Embodiment of this invention. It is a perspective view which shows the structural example of the branch plate which concerns on the 4th Embodiment of this invention. It is a perspective view which shows the structural example of the bracket which concerns on the 4th Embodiment of this invention. It is explanatory drawing which shows the example of attachment to the air supply duct of the branch plate which concerns on the 4th Embodiment of this invention. It is explanatory drawing which shows the example of attachment to the air supply duct of the branch plate which concerns on the 4th Embodiment of this invention. It is a perspective view which shows the structural example of the wind leak prevention cover which concerns on the 4th Embodiment of this invention. It is sectional drawing which shows the structural example of the rack which concerns on the 5th Embodiment of this invention. It is sectional drawing which shows the structural example of the rack which concerns on the 6th Embodiment of this invention. It is a perspective view which shows the structural example of the air supply duct which concerns on the 6th Embodiment of this invention. It is a perspective view which shows the structural example of the 1st adapter which concerns on the 6th Embodiment of this invention. It is sectional drawing which shows the structural example of the rack which concerns on the 6th Embodiment of this invention. It is sectional drawing which shows the structural example of the rack which concerns on the 6th Embodiment of this invention. It is sectional drawing which shows the structural example of the rack which concerns on the 7th Embodiment of this invention. It is sectional drawing which shows the structural example of the rack except the branch plate from the rack which concerns on the 4th Embodiment of this invention. 6 is a table showing verification results in Example 1. 3 is a graph showing the air volume supplied to each electronic device in Example 1. It is an analysis result which shows the flow velocity of the gas which flows through the rack in Example 1. FIG. It is an analysis result which shows the flow velocity of the gas which flows through the rack in Example 1. FIG. 6 is a cross-sectional view illustrating a configuration example of a rack in Embodiment 2. FIG. 10 is a table showing verification results in Example 2. 6 is a graph showing the amount of air supplied to each electronic device in Example 2. It is an analysis result which shows the flow velocity of the gas which flows through the rack in Example 2. FIG. It is an analysis result which shows the flow velocity of the gas which flows through the rack in Example 2. FIG. It is explanatory drawing which shows the conditions on which this invention has a more remarkable effect.

(First embodiment)
A rack 100 according to a first embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a cross-sectional view illustrating a configuration example of a rack 100 according to the present embodiment. As shown in FIG. 1, the rack 100 includes an air supply duct 110, a blower 120, a branch plate 130, and an exhaust duct 140.

  As shown in FIG. 1, the rack 100 supports a plurality of electronic devices 150-1 to 150-10 stacked at predetermined intervals from the upper side to the lower side. Here, the electronic devices 150-1 to 150-10 are, for example, devices that amplify signals such as video and audio, transmitters that transmit these signals, computers such as servers, communication devices, and the like. In the following description, the electronic devices 150-1 to 150-10 are referred to as the electronic device 150 when it is not necessary to distinguish between the electronic devices 150-1 to 150-10.

  The electronic device 150 is arranged in the rack 100 such that one side surface is supported by the air supply duct 110 and the other side surface is supported by the exhaust duct 140.

  The air supply duct 110 is a duct formed in a hollow so that a fluid (a gas such as air in the present embodiment) can move inside. Specifically, the air supply duct 110 is a straight tubular duct provided with a hollow space whose longitudinal direction extends from above to below.

  The exhaust duct 140 is a duct formed hollow so that a fluid (a gas such as air in the present embodiment) can move inside. Specifically, the exhaust duct 140 is a straight tubular duct provided with a hollow space whose longitudinal direction is from above to below.

  A blower 120 for allowing outside air to flow into the inside of the air supply duct 110 from the outside is installed in the opening 116 above the air supply duct 110. Then, the air blower 120 generates an air flow from the upper side to the lower side in the air supply duct 110. The blower 120 is a blower such as a fan or a blower, for example.

  A branch plate 130, which is a plate-like body that divides (partitions) the internal space along a longitudinal direction of the air supply duct 110 into a supply area 112 and a bypass area 113 described later, is installed inside the air supply duct 110. The FIG. 2 is a cross-sectional view showing an installation example of the branch plate 130 in the air supply duct 110. FIG. 3 is a perspective view showing a configuration example of the branch plate 130.

  As shown in FIGS. 2 and 3, the branch plate 130 includes an upper end 131 and a lower end 132. The upper end 131 is one end of the branch plate 130 in the longitudinal direction. The lower end 132 is the other end of the branch plate 130 in the longitudinal direction. Then, the upper end 131 is positioned above the air supply duct 110 on the side close to the inflow region 111 described later, and the lower end 132 is positioned below the air supply duct 110 on the side close to the merge region 114 described later. The branch plate 130 is installed inside the air supply duct 110. Further, the branch plate 130 is installed such that both side surfaces abut against the inner wall of the air supply duct 110.

  As shown in FIG. 2, the hollow space inside the air supply duct 110 is divided into an inflow region 111, a supply region 112, a bypass region 113, and a merge region 114. Here, the supply region 112 is one of the spaces inside the air supply duct 110 divided by the branch plate 130, and is a region indicated by a broken line on the right side of the branch plate 130 in FIG. 2. The bypass region 113 is the other space inside the air supply duct 110 divided by the branch plate 130, and is a region indicated by a broken line on the left side of the branch plate 130 in FIG. 2. The upper part of the supply area 112 and the bypass area 113 is connected to the inflow area 111. The lower part of the supply area 112 and the bypass area 113 is connected to the merge area 114. That is, the inflow region 111 is a region connected to the supply region 112 and the bypass region 113 above the upper end 131. The merge area 114 is an area connected to the supply area 112 and the bypass area 113 below the lower end 132.

  With such a configuration, when the outside air flows into the air supply duct 110 by the blower 120, the outside air flows from the upper side to the lower side in the inflow region 111. Then, when the outside air is branched by the branch plate 130 and passes through the supply region 112 or the bypass region 113, it flows into the merge region 114 and merges.

  Further, on the side surface of the supply region 112 in the air supply duct 110 shown in FIG. 2, ventilation holes 115-1 to 115-10 which are openings for allowing the gas inside the air supply duct 110 to flow out to the electronic device 150 side. Is formed. The vent holes 115-1 to 115-10 are provided at positions corresponding to positions where the electronic devices 150-1 to 150-10 are arranged. Here, part of the gas flowing into the supply region 112 flows out to the electronic devices 150-1 to 150-6 via the vents 115-1 to 115-6. Therefore, in the supply area 112, the static pressure in the lower area is lower than that in the upper area. Further, the remaining part of the gas flowing into the supply region 112 flows into the merge region 114 and merges with the gas that has passed through the bypass region 113 in the merge region 114. Therefore, it is possible to suppress a decrease in the static pressure in the merging region 114 that is a region below the lower end 132 with respect to the static pressure in the inflow region 111 that is a region above the upper end 131. And the gas which flowed into the confluence | merging area | region 114 flows out into the electronic equipment 150-7-150-10 side via the vent holes 115-7-115-10. Therefore, the amount of gas passing through the vents 115-1 to 115-10 corresponding to each of the electronic devices 150-1 to 150-10 can be equalized. As shown in FIG. 2, the branch plate 130 is installed in the air supply duct 110 so that the upper end 131 thereof is closer to the opening 116 than the vent 115-1. In addition, as shown in FIG. 2, the branch plate 130 is installed in the air supply duct 110 so that the lower end 132 thereof is closer to the opening 116 than the vent 115-10. In the following description, the vents 115-1 to 115-10 will be referred to as the vent 115 when it is not necessary to distinguish between the vents 115-1 to 115-10.

  Further, as shown in FIG. 1, on one side surface of the exhaust duct 140, vent holes 141-1 to 141-, which are openings for allowing the gas flowing inside the electronic device 150 to flow out to the exhaust duct 140 side. 10 is formed. The vent holes 141-1 to 141-10 are provided at positions corresponding to positions where the electronic devices 150-1 to 150-10 are arranged.

  With such a configuration, the gas flowing from the air supply duct 110 to the electronic device 150 side passes through the electronic device 150 and flows out to the exhaust duct 140 side through the vent holes 141-1 to 141-10. In the following description, the vents 141-1 to 141-10 are referred to as vents 141 when there is no need to distinguish between the vents 141-1 to 141-10.

  FIG. 4 is a side view illustrating an example of a side surface of the electronic device 150. As shown in FIG. 4, the electronic device 150 includes a substrate 151 and a heat sink 152.

  For example, an electronic component such as a resistor is mounted on one surface of the substrate 151. When electric power is supplied to the electronic component, heat is generated from the electronic component.

  A heat sink 152 is installed on the other surface of the substrate 151 so that heat generated by the electronic component is transmitted to the heat sink 152 via the base 153. In the base 153, fin portions 154 are provided in a direction away from the substrate 151. The fin portion 154 is formed of, for example, a plate material formed by a plurality of protrusions or spelled.

  Then, the electronic device 150 is installed in the rack 100 so that the gas flowing in from the vent 115 of the air supply duct 110 passes between the fin portions 154 and flows out from the vent 141 of the exhaust duct 140.

  With such a configuration, the gas that has flowed into the air supply duct 110 by the blower 120 flows into the electronic device 150 through the vent 115. Then, the gas passes between the fin portions 154 of the heat sink 152 and flows out to the exhaust duct 140 through the vent hole 141. At this time, the heat generated by the electronic component mounted on the substrate 151 is dissipated by being transmitted to the gas via the heat sink 152.

  The gas flowing into the exhaust duct 140 flows from the bottom to the top in the exhaust duct 140 and is discharged to the outside from the exhaust port 142 provided on the upper surface of the exhaust duct 140.

  As described above, according to the present embodiment, the outside air that has flowed into the air supply duct 110 flows into the supply area 112 and the bypass area 113 when flowing from the upper side to the lower side in the air supply duct 110. Branch off. The outside air branched into the supply region 112 and the bypass region 113 merges in the merge region 114. With such a configuration, in the air supply duct 110, it is possible to prevent the lowering of the static pressure due to the gas flowing out from the vent hole 115 provided in the middle. Therefore, the difference in static pressure at the vents 115-1 to 115-10 of the air supply duct 110 can be reduced. Therefore, gas can be supplied to each of the electronic devices 150-1 to 150-10 in a well-balanced manner.

  Furthermore, according to the present embodiment, each of the electronic devices 150-1 to 150-10 can be cooled in a balanced manner with a simple configuration in which the branch plate 130 is installed inside the air supply duct 110.

  Therefore, according to this embodiment, it is possible to cool the accommodated electronic device with a simple configuration in a balanced manner.

(Second Embodiment)
A rack 200 according to a second embodiment of the present invention will be described with reference to the drawings.

  The rack 200 according to the second embodiment of the present invention is different from the rack 100 according to the first embodiment in that a branch plate 2300 is provided. Since the other configuration of the rack 200 in this embodiment is the same as that of the rack 100 in the first embodiment shown in FIG. 1, the corresponding elements are denoted by the same reference numerals as those in FIG. . FIG. 5 is a cross-sectional view illustrating a configuration example of the rack 200 according to the present embodiment.

  FIG. 6 is a perspective view illustrating a configuration example of the branch plate 2300. As shown in FIG. 6, the branch plate 2300 includes a reference plate 2310 and a movable plate 2320. A movable plate 2320 is attached to the reference plate 2310. The reference plate 2310 is installed so that the position of the upper end is the same as that of the branch plate 130 in the first embodiment.

  FIG. 7 is a front view illustrating a configuration example of the reference plate 2310. As shown in FIG. 7, the reference plate 2310 is a rectangular plate-like body. Further, in the reference plate 2310, holes 2311 are respectively formed at both end portions near the long side from the middle to the one short side along the long side. In the example shown in FIG. 7, the holes 2311 are provided at a predetermined interval.

  FIG. 8 is a front view illustrating a configuration example of the movable plate 2320. As shown in FIG. 8, the movable plate 2320 is a rectangular plate-like body. The length of one set of sides facing each other in the movable plate 2320 corresponds to the length of the short side of the reference plate 2310. A hole 2321 is formed from one side of one set of sides toward the other side along the other set of sides of the movable plate 2320 facing each other. In the example shown in FIG. 8, the holes 2321 are provided at a predetermined interval. In the example shown in FIG. 8, the hole 2321 is a long hole whose length in the direction from one side to the other side is longer than the length in the other direction. Here, for example, by passing a screw shaft through the hole 2321 and screwing into the hole 2311, the movable plate 2320 is screwed to the reference plate 2310. Then, the movable plate 2320 is screwed to the reference plate 2310 so that the short side of the reference plate 2310 and one set of sides of the movable plate 2320 are parallel to each other.

  Here, in the rack 200 according to this embodiment, the hole 2321 and the hole 2311 used for screwing are changed, or the position through which the screw shaft passes is changed in the hole 2321, so that the movable plate 2320 is connected to the reference plate 2310. The length of the branch plate 2300 in the longitudinal direction can be adjusted. That is, the distance between the lower end of the branch plate 2300 and the opening 116 can be adjusted. Therefore, the position where the gas branched into the supply region 112 and the gas branched into the bypass region 113 are merged can be adjusted.

  According to this embodiment, the same effect as that of the first embodiment can be obtained.

  Further, according to the present embodiment, the length of the branch plate 2300 in the longitudinal direction can be adjusted by adjusting the position where the movable plate 2320 is screwed to the reference plate 2310. Therefore, the position where the gas branched into the supply region 112 and the gas branched into the bypass region 113 merge can be adjusted. With such a configuration, even when the amount of gas flowing into the air supply duct 110 changes or when the amount of heat generated by each of the electronic devices 150-1 to 150-10 changes, the vent 115 The static pressure in -1 to 115-10 can be easily adjusted, and gas can be supplied to each of the electronic devices 150-1 to 150-10 in a well-balanced manner. Therefore, the electronic devices 150-1 to 150-10 can be cooled with good balance.

(Third embodiment)
A rack 300 according to a third embodiment of the present invention will be described with reference to the drawings.

  A rack 300 according to the third embodiment of the present invention is different from the rack 200 according to the second embodiment in that a branch plate 3300 is provided. Other configurations in the rack 200 of the present embodiment are the same as the configurations of the rack 200 in the second embodiment shown in FIG. 5, so corresponding elements are denoted by the same reference numerals as those in FIG. . FIG. 9 is a cross-sectional view illustrating a configuration example of the rack 300 according to the present embodiment.

  FIG. 10 is a perspective view illustrating a configuration example of the branch plate 3300. As shown in FIG. 10, the branch plate 3300 includes a reference plate 3310 and a movable plate 2320. A movable plate 2320 is attached to the reference plate 3310. Here, the movable plate 2320 is the movable plate 2320 in the second embodiment shown in FIG.

  FIG. 11 is a front view illustrating a configuration example of the reference plate 3310. As shown in FIG. 11, the reference plate 3310 is a rectangular plate-shaped body. In a region between the long sides of the reference plate 3310, a lattice portion 3311 is provided, which is a region in which a plurality of through holes are formed from the middle to one short side along the long side. In addition, holes 3312 are formed in the left and right regions of the lattice portion 3311 along the long sides. Here, in the example shown in FIG. 11, the shape of the through hole is a square hole, but may be another shape such as a round hole or another polygonal hole such as an octagonal shape. In the example shown in FIG. 11, the holes 3312 are provided at a predetermined interval.

  FIG. 12 is an enlarged view showing an example in which a part of the reference plate 3310 is enlarged. As shown in FIG. 12, the square holes in the lattice portion 3311 are formed, for example, at an interval equal to the interval P2 at which the holes 3312 in the reference plate 3310 are formed. Further, the interval P1 at which the square holes are formed in the lattice portion 3311 and the interval P2 at which the holes 3312 are formed in the reference plate 3310 are, for example, 10 mm, 13 mm, or the like. Note that it is desirable that a larger number of square holes be formed in the lattice portion 3311 so that the aperture ratio in the lattice portion 3311 is increased. The aperture ratio is indicated by, for example, a quotient value obtained by dividing the sum of the areas of the openings by the respective through holes by the area of the surface of the reference plate 3310 facing the bypass region 113. Further, the thickness of the reference plate 3310 is desirably 2 mm or more.

  For example, the movable plate 2320 is screwed to the reference plate 3310 by passing a screw shaft through the hole 2321 and screwing into the hole 3312. Then, the movable plate 2320 is screwed to the reference plate 2310 so that the short side of the reference plate 3310 and one set of sides of the movable plate 2320 are parallel to each other.

  FIG. 13 is a front view showing an example in which the movable plate 2320 is screwed to the reference plate 3310. In the rack 300 according to the present embodiment, the gas branched into the bypass region 113 in the air supply duct 110 passes through the portion not covered by the movable plate 2320 in the lattice portion 3311 and merges with the gas branched into the supply region 112. . Note that the gas branched into the bypass region 113 in the air supply duct 110 passes through the square holes of the lattice portion 3311 in the branch plate 3300 and is rectified. Here, as described above, by setting the thickness of the reference plate 3310 to 2 mm or more, it can be expected that the branch plate 3300 improves the function of rectifying the gas as compared with the case where the thickness is less than 2 mm.

  In the rack 300 according to this embodiment, as shown in FIGS. 13 and 14, the lattice portion 3311 is not covered with the branch plate 3300 by adjusting the position where the movable plate 2320 is screwed to the reference plate 3310. The width of the area is adjusted. With such a configuration, the position at which the gas branched into the bypass region 113 joins the gas branched into the supply region 112 in the air supply duct 110 can be adjusted.

  In the rack 300 according to the present embodiment, the length of the branch plate 3300 in the longitudinal direction is adjusted by adjusting the position where the movable plate 2320 is screwed to the reference plate 3310, as in the rack 200 according to the second embodiment. Can also be adjusted.

  According to this embodiment, the same effects as those of the first embodiment and the second embodiment can be obtained.

  Furthermore, according to the present embodiment, by adjusting the position where the movable plate 2320 is screwed to the reference plate 3310, the width of the area where the lattice portion 3311 is not covered in the branch plate 3300 can be adjusted. Therefore, the position where the gas branched into the bypass region 113 in the air supply duct 110 joins the gas branched into the supply region 112 can be adjusted. With such a configuration, even when the amount of gas flowing into the air supply duct 110 changes or when the amount of heat generated by each of the electronic devices 150-1 to 150-10 changes, the vent 115 The static pressure in -1 to 115-10 can be easily adjusted, and gas can be supplied to each of the electronic devices 150-1 to 150-10 in a well-balanced manner. Therefore, the electronic devices 150-1 to 150-10 can be cooled with good balance.

  Further, according to the present embodiment, the gas branched into the bypass region 113 is rectified by the lattice portion 3311 in the branch plate 3300 and merges with the gas branched into the supply region 112. Therefore, when the gas branched into the bypass region 113 merges with the outside air branched into the supply region 112, it is possible to prevent turbulent flow from occurring inside the air supply duct 110. Therefore, the cooling efficiency of the electronic device 150 can be further improved.

(Fourth embodiment)
A rack 400 according to a fourth embodiment of the present invention will be described with reference to the drawings.

  A rack 400 according to the fourth embodiment of the present invention is different from the rack 300 according to the third embodiment in that an air supply duct 410 and a branch plate 4300 are provided. The other configuration of the rack 400 in the present embodiment is the same as the configuration of the rack 300 in the second embodiment shown in FIG. 9, and therefore, the corresponding elements are denoted by the same reference numerals as those in FIG. . FIG. 15 is a cross-sectional view illustrating a configuration example of the rack 200 according to the present embodiment.

  FIG. 16 is a front view illustrating a configuration example of the air supply duct 410. The air supply duct 410 has the same configuration as the air supply duct 110 in the first embodiment except that the hole 411 is formed. As shown in FIG. 16, holes 411 are formed in the upper region and the lower region of the air supply duct 410, respectively. The hole 411 is formed, for example, such that the length in the short direction of the air supply duct 410 is longer than the length in the longitudinal direction. Further, in the air supply duct 410, holes 411 are similarly formed on the surface facing the surface shown in FIG. In this example, in the air supply duct 110 of the first to third embodiments, a hole 411 is provided on the surface where the branch plates 130, 2300 and 3300 are in contact.

  FIG. 17 is a perspective view illustrating a configuration example of the branch plate 4300. As shown in FIG. 17, the branch plate 4300 includes a reference plate 3310, a movable plate 2320, and a bracket 4310. The branch plate 4300 has the same configuration as the branch plate 3300 shown in FIG. Here, the reference plate 3310 is the reference plate 3310 in the third embodiment shown in FIG. The movable plate 2320 is the movable plate 2320 in the second embodiment shown in FIG.

  FIG. 18 is a perspective view illustrating a configuration example of the bracket 4310. In the example shown in FIG. 18, the bracket 4310 is a support member configured by joining two plates so as to form an L shape. Here, a hole 4311 is formed in the middle region of one plate constituting the bracket 4310. The brackets 4310 are attached to the four corners of the reference plate 3310. Specifically, for example, as shown in FIG. 17, the bracket 4310 is used as a reference so that one plate in which the hole 4311 is formed is arranged at a position corresponding to the end portion 3313 of the short side of the reference plate 3310. Attached to the plate 3310.

  For example, the branch plate 4300 is screwed into the air supply duct 410 by passing the screw shaft through the hole 411 and screwing into the hole 4311. Then, the branch plate 4300 is screwed to the air supply duct 410 so that the long side of the reference plate 3310 and the long side of the air supply duct 410 are parallel to each other.

  Here, in the rack 400 in this embodiment, the position where the branch plate 4300 in the air supply duct 410 is installed can be adjusted. Specifically, as shown in FIGS. 19 and 20, in the air supply duct 410, the position where the branch plate 4300 is installed is adjusted between a position close to the vent hole 115 and a position far from the vent hole 115. Can do.

  With such a configuration, the cross-sectional areas of the supply region 112 and the bypass region 113 can be adjusted. Therefore, the amount of gas branched to the supply region 112 and the amount of gas branched to the bypass region 113 can be adjusted. Therefore, it is possible to easily adjust the static pressure in the vent holes 115-1 to 115-6 formed in the supply region 112 of the air supply duct 410. Therefore, the balance of the static pressure in the vent holes 115-1 to 115-10 can be easily adjusted.

  FIG. 21 is a perspective view showing a configuration example of the wind leak prevention lid 460. After the branch plate 4300 is screwed into the air supply duct 410, the wind leak prevention lid 460 is installed in the air supply duct 410 so as to cover each hole 411 formed in the air supply duct 410. With such a configuration, outflow of gas from the hole 411 can be prevented.

  According to the present embodiment, by using the branch plate 130, the branch plate 2300, and the branch plate 3300 instead of the reference plate 3310 and the movable plate 2320, the same effects as those of the first to third embodiments can be achieved. it can.

  Furthermore, according to this embodiment, the position where the branch plate 4300 in the air supply duct 410 is installed can be adjusted. With such a configuration, the amount of outside air that flows into the supply region 112 and the amount of outside air that flows into the bypass region 113 can be adjusted. Therefore, the rack 400 in the present embodiment can adjust the static pressure in the vent holes 115-1 to 115-10 more flexibly.

(Fifth embodiment)
A rack 500 according to a fifth embodiment of the present invention will be described with reference to the drawings.

  A rack 500 according to the fifth embodiment of the present invention is different from the rack 400 according to the fourth embodiment in that an air supply duct 510 is provided. The other configuration of the rack 500 in the present embodiment is the same as the configuration of the rack 400 in the fourth embodiment shown in FIG. 15, and thus the corresponding elements are denoted by the same reference numerals as those in FIG. . FIG. 22 is a cross-sectional view showing a configuration example of the rack 500 of the present embodiment.

  As shown in FIG. 22, the air supply duct 510 is a U-shaped duct. Here, in the air supply duct 510, the cross-sectional area in the vicinity where the air supply port 511 for allowing the outside air to flow into the air supply duct 510 from the outside of the air supply duct 510 is formed is the cross-sectional area of other portions. It is formed to be wider. In addition, the other structure of the air supply duct 510 is the same structure as the air supply duct 410 in 4th Embodiment. The blower 120 is installed in the vicinity of the air supply port 511 inside the air supply duct 510.

  In addition, each embodiment mentioned above may be combined. For example, the branch plate 130, the branch plate 2300, and the branch plate 3300 may be installed in the air supply duct 510 in the rack 500.

  According to this embodiment, the same effect as the first to fourth embodiments can be obtained.

(Sixth embodiment)
A rack 600 according to a sixth embodiment of the present invention will be described with reference to the drawings.

  A rack 600 according to the sixth embodiment of the present invention is different from the rack 400 according to the fourth embodiment in that an air supply duct 610 is provided. The other configuration of the rack 600 in the present embodiment is the same as the configuration of the rack 400 in the fourth embodiment shown in FIG. 15, and therefore, the corresponding elements are denoted by the same reference numerals as those in FIG. . FIG. 23 is a cross-sectional view illustrating a configuration example of a rack 600 according to the present embodiment.

FIG. 24 is a perspective view illustrating a configuration example of the air supply duct 610. The air supply duct 610 is
16 except that a first opening / closing portion 611 that can be opened and closed is formed on the upper surface, and a second opening and closing portion 612 that can be opened and closed is formed in an upper region at one end portion in the short-side direction. This is the same as the air supply duct 410 in the fourth embodiment. The first opening / closing part 611 is opened when a first adapter 620 described later is attached to the air supply duct 610. Further, the second opening / closing part 612 is opened when a second adapter 630 described later is attached to the air supply duct 610.

  FIG. 25 is a perspective view illustrating a configuration example of the first adapter 620. As shown in FIG. 25, the first adapter 620 is a tubular body in which an opening is formed on one surface of the hexahedron and a surface facing the one surface. The configuration of the second adapter 630 is the same as the configuration of the first adapter.

  The first adapter 620 is attached to the air supply duct 610 so that the edge of the opening on one surface and the edge of the opening / closing part 611 on the upper surface of the air supply duct 610 are in contact with each other. FIG. 26 is a cross-sectional view illustrating a configuration example of a rack 600 in which the first adapter 620 is attached to the air supply duct 610. As shown in FIG. 26, in the rack 600, the air supply duct 610 is used as a part of a straight tubular duct. In this case, the blower 120 is installed in the vicinity of the opening formed on the other surface in the first adapter 620. And external air flows in from the opening part of another surface.

  FIG. 27 is a cross-sectional view illustrating a configuration example of a rack 600 in which the second adapter 630 is attached to the air supply duct 610 and the additional duct 640 is attached to the second adapter 630.

  The second adapter 630 is attached to the air supply duct 610 so that the edge of the opening on one surface and the edge of the second opening / closing part 612 of the air supply duct 610 are in contact with each other. Then, the additional duct 640 is attached to the second adapter 630 so that the edge of the opening of the second other surface and the edge of the opening 641 of the additional duct 640 are in contact with each other. Here, the additional duct 640 is a straight duct having a hollow space whose longitudinal direction extends from above to below. In addition, an opening 641 is formed in a region above one surface of the additional duct 640. In addition, an air supply port 642 for allowing outside air to flow into the inside of the additional duct 640 from the outside is formed on the lower surface of the additional duct 640. Further, the cross-sectional area of the lower region of the additional duct 640 is formed so as to be larger than the cross-sectional area of the other region of the additional duct 640.

  As shown in FIG. 27, in the rack 600, the air supply duct 610 is used as a part of a U-shaped duct. In this case, the blower 120 is installed in the vicinity of the air supply port 642 formed in the lower surface of the additional duct 640 in the additional duct 640. Then, outside air flows from the air supply port 642.

  In the rack 600, either one of the first adapter 620 and the second adapter 630 and the air supply duct 610 are selectively combined to form either a straight tube or a U-shaped duct as appropriate. Can do.

  In addition, each embodiment mentioned above may be combined. For example, the branch plate 130, the branch plate 2300, and the branch plate 3300 may be installed in the air supply duct 610 in the rack 600.

  According to this embodiment, the same effect as the first to fourth embodiments can be obtained.

  Furthermore, according to this embodiment, the usage mode of the air supply duct 610 can be changed as appropriate to a part of a straight tubular duct and a part of a U-shaped duct. With such a configuration, it is possible to flexibly cope with an air supply method and an air supply chamber that differ depending on the installation location of the rack 600.

(Seventh embodiment)
A rack 700 according to a seventh embodiment of the present invention will be described with reference to the drawings.

  FIG. 28 is a cross-sectional view illustrating a configuration example of a rack 700 according to the present embodiment. As shown in FIG. 28, the rack 700 includes a fluid supply unit 710.

  The fluid supply unit 710 is realized by, for example, the air supply duct 110 of the rack 100 in the first embodiment shown in FIG.

  The fluid supply unit 710 supports one side surface of the plurality of electronic devices, and supplies the inflowed fluid to each of the plurality of electronic devices.

  Here, the fluid supply unit 710 includes an inflow port 711, a supply port 712, a flow path 713, and a branching unit 714.

  The inflow port 711 is one opening through which the inflowing gas passes.

  The supply port 712 is provided according to each of the plurality of electronic devices, and the fluid flowing in from the inflow port 711 flows out to supply the fluid to each of the plurality of electronic devices.

  The flow path 713 reaches the supply port 712 from the inflow port 711, and the fluid that flows in from the inflow port 711 passes therethrough.

  In the flow path 713, the branch part 714 includes a supply region for allowing a fluid flowing out from the supply port 712 near the inflow port 711 in the supply port 712, and a fluid flowing out from the supply port 712 far from the inflow port 711. Partition the detour area for passing through.

  According to this embodiment, in the rack 700, the fluid supply unit 710 includes the branching unit 714. With such a configuration, the flow path 713 has a supply region for allowing fluid flowing out from the supply port 712 close to the inlet 711 and a detour for allowing fluid flowing out of the supply port 712 far from the inlet 711 to pass. Divided into areas. With such a configuration, in the fluid supply unit 710, it is possible to prevent a decrease in static pressure at the supply port 712 far from the inflow port 711 due to the fluid flowing out from the supply port 712 near the inflow port 711. Therefore, the difference in static pressure at each supply port 712 included in the fluid supply unit 710 can be reduced. Therefore, fluid can be supplied to each electronic device in a balanced manner. Therefore, each electronic device can be cooled with good balance.

  In addition, according to the present embodiment, each electronic device can be cooled in a balanced manner with a simple configuration in which the fluid supply unit 710 includes the branching unit 714.

  Therefore, according to this embodiment, it is possible to cool the accommodated electronic device with a simple configuration in a balanced manner.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and further modifications and substitutions are possible without departing from the basic technical idea of the present invention. You can make adjustments. Moreover, you may implement combining each embodiment suitably.

  It should be noted that the disclosures of the above patent documents are incorporated herein by reference. Within the scope of the entire disclosure (including claims) of the present invention, the embodiment can be changed and adjusted based on the basic technical concept. Various combinations and selections of various disclosed elements are possible within the scope of the claims of the present invention. That is, the present invention of course includes various variations and modifications that can be made by those skilled in the art according to the entire disclosure including the claims and the technical idea.

Example 1
In this example, the gas supplied to the electronic devices 150-1 to 150-10 in the rack 400 in the fourth embodiment shown in FIG. 15 and the rack 800 shown in FIG. 29 in which the branch plate 4300 is removed from the rack 400. The air volume of each was measured.

  Specifically, the amount of gas supplied to each electronic device 150 when the gas flowed into the rack 400 was measured. Further, the amount of gas supplied to each electronic device 150 when the gas flowed into the rack 800 was measured. Then, by comparing them, the cooling effect of the rack 400 having a configuration in which the branch plate 4300 is installed inside the air supply duct 410 was verified.

In the present embodiment, 64.12 [m ³ / min] of outside air is taken into the rack 400 and 65.34 [m ³ / min] of outside air is taken into the rack 800. Went.

  FIG. 30 is a table showing the verification results. Specifically, FIG. 30 shows the amount of air supplied to each electronic device 150 in the rack 400 and the rack 800. In FIG. 30, although the second decimal place is shown, a value with higher accuracy is used to calculate a value to be described later. Also, the average value of the air volume supplied to each electronic device 150 in rack 400 and rack 800 (hereinafter referred to as “average air volume”) is shown. Further, FIG. 30 shows the maximum variation value of the air volume supplied to each electronic device 150 in the rack 400 and the rack 800. The maximum variation value is the maximum variation value among the electronic devices 150-1 to 150-10. The variation value here is a value indicating the magnitude of the deviation with respect to the average air volume, and is obtained by | {(the air volume flowing in the electronic device 150) − (average air volume)} / (average air volume) |. Specifically, for example, the variation value of the electronic device 150-1 in the rack 400 is | (6.05-6.41) /6.41|=5.6%. The smaller the maximum variation value in the rack is, the more gas is supplied to each electronic device 150 in a balanced manner.

According to the verification result shown in FIG. 30, the maximum variation value in the rack 400 is 16.3%. The maximum variation value in the rack 800 is 94.5%. Therefore, it can be seen that the rack 400 having the characteristic configuration of the present invention can supply gas in a balanced manner to each electronic device 150 and cool each electronic device 150 in a more balanced manner. The maximum variation value in the rack 400 is a value based on the electronic device 150-5 in which the supplied air volume is 5.37 [m ³ / min]. In addition, the maximum variation value in the rack 800 is a value based on the electronic device 150-1 in which the supplied air volume is 12.71 [m ³ / min].

  FIG. 31 is a graph showing the amount of air that flows to each electronic device 150 in the rack 400 and the rack 800. FIG. 32 is an analysis result diagram showing the flow rate of outside air in the rack 400. FIG. 33 is an analysis result diagram showing the flow rate of outside air in the rack 800. Also from the results shown in FIGS. 31 to 33, the rack 400 having the characteristic configuration of the present invention can supply gas in a balanced manner to each electronic device 150 and can cool each electronic device 150 in a more balanced manner. I understand that.

(Example 2)
In this example, the air volume of the gas supplied to the electronic device 150 was measured in the rack 500 in the fifth embodiment shown in FIG. 22 and the rack 900 shown in FIG. 34 in which the branch plate 4300 was removed from the rack 500. Here, in the present embodiment, simulation is performed under the condition that 55.62 [m ³ / min] outside air is taken into the rack 500 and 54.43 [m ³ / min] outside air is taken into the rack 900. The experiment was conducted. Other details of the verification are the same as those in the first embodiment, and thus the description thereof is omitted.

  FIG. 35 is a table showing the verification results. FIG. 35 shows the amount of air supplied to each electronic device 150 in the rack 500 and the rack 900. In FIG. 35, the second decimal place is shown, but a value with higher accuracy is used for calculation of a value to be described later. In addition, in the rack 500 and the rack 900, the average value of the air volume supplied to each electronic device 150 (average air volume) is shown. Further, FIG. 35 shows the maximum variation value of the air volume supplied to each electronic device 150 in the rack 500 and the rack 900.

According to the verification result shown in FIG. 35, the maximum variation value in the rack 500 is 19.0%. The maximum variation value in the rack 900 is 142.4%. Therefore, it can be seen that the rack 500 having the branch plate 4300 can supply gas in a balanced manner to each electronic device 150 and cool each electronic device 150 in a more balanced manner. Note that the maximum variation value in the rack 500 is a value based on the electronic device 150-10 in which the supplied air volume is 4.50 [m ³ / min]. Further, the maximum variation value in the rack 900 is a value based on the electronic device 150-1 in which the supplied air volume is 13.20 [m ³ / min].

  FIG. 36 is a graph showing the amount of air that has flowed to each electronic device 150 in the rack 500 and the rack 900. FIG. 37 is an analysis result diagram showing the flow rate of outside air in the rack 500. FIG. 38 is an analysis result diagram showing the flow rate of outside air in the rack 900. As shown in FIGS. 36 to 38, it can be seen that the rack 500 can supply gas in a balanced manner by each electronic device 150 and can cool each electronic device 150 in a more balanced manner.

  Furthermore, according to the verification by the inventors, the amount of outside air that needs to be taken in by the rack provided with the branch plates 130, 2300, 3300, and 4300 to cool each electronic device is reduced to the rack that is not provided with the branch plate. It has been found that only 65% of the air volume that needs to be taken in is required.

Here, the air volume of the outside air taken into the rack increases and decreases in proportion to the rotational speed of the blower. The power consumption of the blower is proportional to the cube of the rotation speed of the blower. Therefore, the power consumption of the rack provided with the branch plate is (0.65) ³ = 27.5% of the power consumption of the rack provided with no branch plate. Therefore, power consumption can be reduced by 72.5%.

  FIG. 39 is a table showing exemplary rack dimensions. The present invention has a more remarkable effect under the conditions shown in FIG. In FIG. 39, the cooling unit indicates a plurality of stacked electronic devices 150. The height of the cooling unit indicates the length in the stacking direction of the electronic device 150 in the cooling unit. The width of the cooling unit indicates the length in the direction orthogonal to the stacking direction of the electronic devices 150 in the cooling unit.

100 rack 110 air supply duct 111 inflow area 112 supply area 113 bypass area 114 merging area 115-1 to 115-10 vent 116 opening 120 blower 130 branch plate 131 upper end 132 lower end 140 exhaust ducts 141-1 to 141-10 ventilation Port 142 Exhaust ports 150-1 to 150-10 Electronic device 151 Substrate 152 Heat sink 153 Base 154 Fin portion 200 Rack 2300 Branch plate 2310 Reference plate 2311 Hole 2320 Movable plate 2321 Hole 300 Rack 3300 Branch plate 3310 Reference plate 3311 Grid portion 3312 Hole 3313 End 400 Rack 410 Air supply duct 411 Hole 4300 Branch plate 4310 Bracket 4311 Hole 460 Air leakage prevention lid 500 Rack 510 Air supply duct 511 Air supply port 600 Rack 610 Air supply duct 61 First opening / closing unit 612 Second opening / closing unit 620 First adapter 630 Second adapter 640 Additional duct 641 Opening portion 642 Air supply port 700 Rack 710 Fluid supply unit 711 Inlet port 712 Supply port 713 Channel 714 Branch unit 800 Rack 900 rack

Claims (11)

A fluid supply unit that supports one side surface of the plurality of electronic devices and supplies the fluid that has flowed into each of the plurality of electronic devices.
There is one inlet through which the inflowing gas passes,
Provided according to each of the plurality of electronic devices, a supply port for supplying the fluid to each of the plurality of electronic devices by flowing out the fluid flowing in from the inflow port,
A flow path is provided from the inlet to the supply port through which the fluid flowing in from the inlet passes.
In the flow path, a supply region for allowing a fluid flowing out from a supply port close to the inlet to pass through among the supply ports, and a bypass region for allowing a fluid flowing out from a supply port far from the inlet to pass through An electronic device supporting apparatus comprising: at least one branching means for partitioning the electronic device. The branching means includes
A plate-like body,
The inlet side end, which is an end near the inlet, is installed in the supply port so as to be closer to the inlet than the supply port closest to the inlet. The electronic device supporting apparatus according to 1. The branching means includes
A plate-like body,
The non-inlet side end, which is the end far from the inflow port, is installed so as to be closer to the inflow port than the supply port farthest from the inflow port among the supply ports. The electronic device support apparatus of Claim 1 or Claim 2. The branching means includes a fixed part and a movable part,
Each of the fixed portion and the movable portion is a plate-like body,
The fixing portion includes an inlet side end portion that is an end portion on a side close to the inlet port in the branching unit, and the inlet side end portion is the supply port closest to the inlet port among the supply ports. It is installed to be closer to the inlet than
The movable portion includes a non-inlet side end that is an end far from the inflow port in the branching unit, and a distance between the non-inlet side end and the inflow port can be adjusted. The electronic device support device according to any one of claims 1 to 3, wherein the electronic device support device is movably installed along the fixed portion. The branching means includes a fixed part and a movable part,
Each of the fixed portion and the movable portion is a plate-like body,
The fixing portion includes an inlet side end portion that is an end portion on a side close to the inlet port in the branching unit, and the inlet side end portion is the supply port closest to the inlet port among the supply ports. It is installed to be closer to the inlet than
The fixing portion is formed with an opening through which the fluid in the detour region can move to the supply region,
The electronic device support according to any one of claims 1 to 3, wherein the movable portion is movably installed along the fixed portion so that an area covering the opening is adjustable. apparatus. The electronic device support apparatus according to claim 5, wherein the opening is formed by a plurality of through holes. The branching means includes
In the channel, the cross-sectional area for fluid to flow into the bypass area from the inlet and the cross-sectional area for fluid to flow into the supply area from the inlet are variably moved. The electronic device support apparatus according to any one of claims 1 to 6. 8. The electron according to claim 1, further comprising a fluid discharge unit that supports the other side surface of the plurality of electronic devices and discharges the fluid supplied to each of the plurality of electronic devices. Equipment support device. The electronic device support apparatus according to claim 1, further comprising an air supply duct that supplies a fluid to the inflow port. The electronic device support apparatus according to claim 9, wherein the air supply duct is a straight tubular duct. The electronic device support apparatus according to claim 9, wherein the air supply duct is a U-shaped duct.

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