JP2017224423A - Led lighting fixture - Google Patents

Led lighting fixture Download PDF

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JP2017224423A
JP2017224423A JP2016117440A JP2016117440A JP2017224423A JP 2017224423 A JP2017224423 A JP 2017224423A JP 2016117440 A JP2016117440 A JP 2016117440A JP 2016117440 A JP2016117440 A JP 2016117440A JP 2017224423 A JP2017224423 A JP 2017224423A
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led
led lighting
cover
lighting apparatus
peripheral region
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JP6816978B2 (en
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小倉 智雄
Tomoo Ogura
智雄 小倉
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Hotalux Ltd
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NEC Lighting Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide an LED lighting fixture in which, for example, a center part looks bright when the lighting fixture is installed on a ceiling and is looked up from right below, and which has little light loss.SOLUTION: An LED lighting fixture includes: a body; an LED substrate 11 on which a plurality of LEDs 111 are mounted; and a cover 12. The body, the LED substrate 11 and the cover 12 are arranged in this order. In the LED substrate 11, the surface opposing to the cover 12 is a mounting surface of the LEDs 111. The cover 12 includes an inner peripheral region 12a, an outer peripheral region 12c and an intermediate region 12b located between the inner peripheral region 12a and the outer peripheral region 12c, and it covers the mounting surface of the LED substrate 11. The cover 12 has a first thick wall part which is thicker than the thickness in the intermediate region 12b in the inner peripheral region 12a.SELECTED DRAWING: Figure 2

Description

本発明は、LED照明器具に関する。   The present invention relates to an LED lighting apparatus.

近年、蛍光ランプ等に代えて、省電力・長寿命な発光ダイオード(LED)を用いたLED照明器具が普及しつつある。例えば、複数のLEDを円周上に基板に配置し、それらを円環状のカバーで覆ったLED照明器具が提案されている(特許文献1参照)。しかしながら、特許文献1に記載のLED照明器具には、例えば、天井に設置して真下から見上げたときに、中心部が暗く見えるという問題があった。   In recent years, LED lighting fixtures using light-emitting diodes (LEDs) with low power consumption and long life are becoming popular instead of fluorescent lamps and the like. For example, an LED lighting apparatus in which a plurality of LEDs are arranged on a substrate on a circumference and covered with an annular cover has been proposed (see Patent Document 1). However, the LED lighting apparatus described in Patent Document 1 has a problem that, for example, the center portion looks dark when installed on the ceiling and looked up from directly below.

この問題を解決するものとして、複数のLEDを同心円状に配置し、各LEDを、個別に半球状のカバーで覆ったLED照明器具が提案されている(特許文献2参照)。   As a solution to this problem, there has been proposed an LED lighting apparatus in which a plurality of LEDs are arranged concentrically and each LED is individually covered with a hemispherical cover (see Patent Document 2).

特開2008−124008号公報JP 2008-124008 A 特開2014−67529号公報JP 2014-67529 A

特許文献2に記載のLED照明器具によれば、カバーによりもたらされるレンズ効果により、真下から見上げたときに中心部が明るく見える。しかしながら、一般的に、特許文献2に記載のLED照明器具におけるカバーの構造では、光が拡散しすぎてロスが大きくなるという問題が生じている。   According to the LED lighting apparatus described in Patent Document 2, the center portion looks bright when viewed from directly below due to the lens effect provided by the cover. However, generally, in the structure of the cover in the LED lighting apparatus described in Patent Document 2, there is a problem that light is excessively diffused and loss is increased.

そこで、本発明は、例えば、天井に設置して真下から見上げたときに中心部が明るく見え、且つ、光のロスの少ないLED照明器具の提供を目的とする。   Therefore, an object of the present invention is to provide an LED lighting apparatus that has a central portion that looks bright when installed on the ceiling and looks up from directly below, and has little light loss.

前記目的を達成するために、本発明のLED照明器具は、
本体と、
複数のLEDが実装されたLED基板と、
カバーとを含み、
前記本体、前記LED基板および前記カバーの順に配置され、
前記LED基板は、前記カバーと対向する面が、前記LEDの実装面であり、
前記カバーは、内周領域と、外周領域と、前記内周領域と前記外周領域との間に位置する中間領域とを有し、前記LED基板の実装面を覆い、
前記カバーは、前記内周領域に、前記中間領域よりも厚みが厚い第1肉厚部を有することを特徴とする。
In order to achieve the above object, the LED lighting apparatus of the present invention comprises:
The body,
An LED substrate on which a plurality of LEDs are mounted;
Including a cover,
Arranged in the order of the main body, the LED substrate and the cover,
In the LED substrate, a surface facing the cover is a mounting surface of the LED,
The cover has an inner peripheral region, an outer peripheral region, and an intermediate region located between the inner peripheral region and the outer peripheral region, and covers the mounting surface of the LED substrate,
The cover has a first thick portion that is thicker than the intermediate region in the inner peripheral region.

本発明のLED照明器具は、例えば、天井に設置して真下から見上げたときに中心部が明るく見え、且つ、光のロスが少ない。   For example, when the LED lighting apparatus of the present invention is installed on the ceiling and looked up from directly below, the central portion looks bright and the loss of light is small.

図1は、実施形態1のLED照明器具の各構成部材の一例を示す分解斜視図である。FIG. 1 is an exploded perspective view showing an example of each component of the LED lighting apparatus of Embodiment 1. FIG. 図2(A)および(B)は、実施形態1のLED照明器具におけるLED基板およびカバーの一例を示す断面図および底面図である。2A and 2B are a cross-sectional view and a bottom view showing an example of an LED substrate and a cover in the LED lighting apparatus of Embodiment 1. FIG. 図3(A)および(B)は、実施形態2のLED照明器具におけるLED基板およびカバーの一例を示す断面図および底面図である。3A and 3B are a cross-sectional view and a bottom view showing an example of an LED substrate and a cover in the LED lighting apparatus of Embodiment 2. FIG.

本発明のLED照明器具において、前記LED基板の前記実装面は、同心円状に前記LEDが実装され、前記第1肉厚部は、最も中心に近い円周上に実装された前記LEDの内側を覆っていてもよい。   In the LED lighting apparatus of the present invention, the mounting surface of the LED substrate is mounted with the LEDs concentrically, and the first thick portion is located on the inner side of the LED mounted on the circumference closest to the center. It may be covered.

本発明のLED照明器具において、前記第1肉厚部は、表面処理された表面を有してもよい。   In the LED lighting device of the present invention, the first thick part may have a surface-treated surface.

本発明のLED照明器具において、前記第1肉厚部の厚みは、例えば、2mm〜6mmの範囲である。   In the LED lighting device of the present invention, the thickness of the first thick portion is, for example, in the range of 2 mm to 6 mm.

本発明のLED照明器具において、前記第1肉厚部の厚みは、例えば、前記中間領域の厚みの1.2倍〜1.5倍の範囲である。   In the LED lighting apparatus of the present invention, the thickness of the first thick portion is, for example, in the range of 1.2 times to 1.5 times the thickness of the intermediate region.

本発明のLED照明器具において、前記カバーは、さらに、前記外周領域に、前記中間領域よりも厚みが厚い第2肉厚部を有してもよい。   The LED lighting fixture of this invention WHEREIN: The said cover may have a 2nd thick part thicker than the said intermediate | middle area | region further in the said outer peripheral area | region.

本発明のLED照明器具において、前記LED基板の前記実装面は、同心円状に前記LEDが実装され、前記第2肉厚部は、最も中心から遠い円周上に実装された前記LEDの外側を覆っていてもよい。   In the LED lighting device of the present invention, the mounting surface of the LED substrate is mounted concentrically on the LED, and the second thick portion is outside the LED mounted on the circumference farthest from the center. It may be covered.

本発明のLED照明器具において、前記第2肉厚部は、表面処理された表面を有してもよい。   In the LED lighting device of the present invention, the second thick part may have a surface-treated surface.

本発明のLED照明器具において、前記第2肉厚部の厚みは、例えば、2mm〜6mmの範囲である。   In the LED lighting apparatus of the present invention, the thickness of the second thick portion is, for example, in the range of 2 mm to 6 mm.

本発明のLED照明器具において、前記第2肉厚部の厚みは、例えば、前記中間領域の厚みの1.2倍〜1.5倍の範囲である。   In the LED lighting device of the present invention, the thickness of the second thick portion is, for example, in the range of 1.2 times to 1.5 times the thickness of the intermediate region.

以下、本発明のLED照明器具について、図面を参照して詳細に説明する。ただし、本発明は、以下の説明に限定されない。なお、以下の図1から図3において、同一部分には、同一符号を付し、その説明を省略する場合がある。また、図面においては、説明の便宜上、各部の構造は適宜簡略化して示す場合があり、各部の寸法比等は、実際とは異なり、模式的に示す場合がある。   Hereinafter, the LED lighting fixture of this invention is demonstrated in detail with reference to drawings. However, the present invention is not limited to the following description. In the following FIGS. 1 to 3, the same portions are denoted by the same reference numerals, and the description thereof may be omitted. In the drawings, for convenience of explanation, the structure of each part may be simplified as appropriate, and the dimensional ratio of each part may be schematically shown, unlike the actual case.

[実施形態1]
本実施形態は、カバーの内周領域に肉厚部を有するLED照明器具の一例である。図1に、本実施形態のLED照明器具の構成の一例を示す。図1は、LED照明器具の主な構成部材を分解して示した斜視図である。本実施形態において、LED照明器具は、円形としたが、これには制限されない。
[Embodiment 1]
This embodiment is an example of the LED lighting fixture which has a thick part in the inner peripheral area | region of a cover. In FIG. 1, an example of a structure of the LED lighting fixture of this embodiment is shown. FIG. 1 is an exploded perspective view showing main components of the LED lighting apparatus. In the present embodiment, the LED lighting apparatus is circular, but is not limited thereto.

本実施形態のLED照明器具は、例えば、天井に取り付けるLEDシーリングライトとして使用できる。この場合、前記LED照明器具は、例えば、取付部を有し、他方、天井は、引掛けシーリングボディ等の屋内配線器具と、これに電気的に接続されたアダプタとを備える。そして、前記LED照明器具は、前記取付部により、前記アダプタに取付けられ、且つ、前記屋内配線器具と電気的に接続される。なお、以下の説明において、特に説明しない限り、前記LED照明器具は、天井に取付けられた状態を基準とし、天井側を上面側、その反対側(床側)を下面側という。   The LED lighting fixture of this embodiment can be used as an LED ceiling light attached to a ceiling, for example. In this case, the LED lighting apparatus has, for example, an attachment portion, and the ceiling includes an indoor wiring apparatus such as a hooking ceiling body and an adapter electrically connected thereto. And the said LED lighting fixture is attached to the said adapter by the said attaching part, and is electrically connected with the said indoor wiring fixture. In the following description, unless otherwise specified, the LED lighting fixture is referred to as the upper surface side, and the opposite side (floor side) is referred to as the lower surface side, based on the state of being attached to the ceiling.

図1に示すように、LED照明器具1は、上面側から、本体10、電源基板14、電源カバー15、複数のLED111が実装されたLED基板11、カバー12およびグローブ13が、この順序で配置されている。LED照明器具1において、電源基板14、電源カバー15およびグローブ13は、任意の構成部材であり、有してもよいし、有さなくてもよい。   As shown in FIG. 1, the LED lighting apparatus 1 includes a main body 10, a power supply board 14, a power supply cover 15, an LED board 11 on which a plurality of LEDs 111 are mounted, a cover 12, and a globe 13 are arranged in this order from the upper surface side. Has been. In the LED lighting device 1, the power supply substrate 14, the power supply cover 15, and the globe 13 are arbitrary constituent members and may or may not be included.

本体10は、前記天井に対向する部材であり、その上面は、前記天井に対向する面であり、その下面は、LED基板11が配置される面である。本体10は、中央に、下面側に突出した開口101を有し、中央よりであって前記開口の周囲に、上面側に凹んだ円周帯状の凹部102を有する。前者の突出した開口101には、前記天井に対する取付部が配置され、後者の前記円周帯状の凹部102には、例えば、後述の電源基板14が配置される。本体10の素材は、特に制限されず、例えば、スチール等の金属があげられる。   The main body 10 is a member facing the ceiling, the upper surface is a surface facing the ceiling, and the lower surface is a surface on which the LED substrate 11 is disposed. The main body 10 has an opening 101 protruding to the lower surface side at the center, and a circumferential band-shaped recess 102 recessed from the center to the upper surface side around the opening. The former projecting opening 101 is provided with a mounting portion for the ceiling, and the latter circumferential belt-like recess 102 is provided with, for example, a power supply board 14 to be described later. The material of the main body 10 is not particularly limited, and examples thereof include metals such as steel.

本体10の上面は、LED照明器具1の設置対象(前記天井)に対向する設置面であり、前記設置面には、例えば、前記設置対象に接する緩衝部材が配置されてもよい。前記緩衝部材は、特に制限されず、例えば、スポンジ等があげられる。このような形態によれば、LED照明器具1を設置対象に設置した際、LED照明器具1と前記設置対象との間に前記緩衝部材が存在するため、例えば、前記設置対象へのLED照明器具1の固定化をより安定にすることができる。   The upper surface of the main body 10 is an installation surface that faces an installation target (the ceiling) of the LED lighting apparatus 1. For example, a buffer member that contacts the installation target may be disposed on the installation surface. The buffer member is not particularly limited, and examples thereof include a sponge. According to such a form, when the LED lighting apparatus 1 is installed on the installation target, the buffer member exists between the LED lighting apparatus 1 and the installation target. The immobilization of 1 can be made more stable.

前記緩衝部材の設置位置は、特に制限されない。前記緩衝部材は、例えば、本体10の前記設置面において周方向に配置され、具体例として、LED照明器具1の中心から、本体10の外周までの長さを1とした場合、前記中心から2/5〜1の範囲があげられる。前記緩衝部材は、例えば、周方向において、連続して配置されてもよいし、非連続で配置されてもよい。また、本体10の上面がフラットな場合、前記緩衝部材は、例えば、本体10の外周側に配置され、外観の点から、外部から見えない程度に内よりであることが好ましい。   The installation position of the buffer member is not particularly limited. For example, when the length from the center of the LED lighting device 1 to the outer periphery of the main body 10 is 1, the buffer member is arranged in the circumferential direction on the installation surface of the main body 10, and is 2 from the center. The range of / 5 to 1 is raised. The said buffer member may be arrange | positioned continuously in the circumferential direction, for example, and may be arrange | positioned discontinuously. Moreover, when the upper surface of the main body 10 is flat, it is preferable that the said buffer member is arrange | positioned on the outer peripheral side of the main body 10, for example, and it is inward from the point of appearance so that it cannot be seen from the outside.

前述のとおり、本体10の前記円周帯状の凹部102には、電源基板14が配置されてもよい。電源基板14は、その上面が、本体10に対向し、その下面に、LED111の発光を駆動する電源モジュールが配置される。前記電源モジュールは、特に制限されず、従来公知の回路部品等があげられる。電源基板14の前記電源モジュールは、LED照明器具1が、天井のアダプタに電気的に接続されると、前記アダプタを介して交流電源に接続される。そして、前記電源モジュールは、受けた交流電流から直流電源を生成し、これをLED基板11の各LED111に供給して、LED111の発光を駆動することができる。前記電源モジュールは、例えば、電源制御用の制御電源を有し、前記制御電源の電圧は、例えば、1.5V〜17Vである。前記制御電源は、例えば、1系統でもよいし、2系統でもよく、一例として、5Vと14Vの2系統があげられる。   As described above, the power supply substrate 14 may be disposed in the circumferential band-shaped recess 102 of the main body 10. The upper surface of the power supply substrate 14 faces the main body 10, and a power supply module that drives light emission of the LEDs 111 is disposed on the lower surface of the power supply substrate 14. The power supply module is not particularly limited, and examples thereof include conventionally known circuit components. When the LED lighting apparatus 1 is electrically connected to a ceiling adapter, the power supply module on the power supply board 14 is connected to an AC power supply via the adapter. The power supply module can generate a DC power supply from the received AC current and supply it to each LED 111 of the LED substrate 11 to drive the light emission of the LED 111. The power supply module has a control power supply for power supply control, for example, and the voltage of the control power supply is 1.5V to 17V, for example. The control power supply may be, for example, one system or two systems, and examples include two systems of 5V and 14V.

電源カバー15は、その上面が、電源基板14に対向し、その下面が、LED基板11に対向する。LED照明器具1が電源カバー15を有する場合、例えば、電源カバー15によって、本体10内の空間を2室に区切ることができる。そして、電源カバー15によれば、例えば、LED111からの放熱の促進、電源基板14の発する放熱の遮断、LED基板11の固定等を、より効率よく行うことができる。電源カバー15の素材は、特に制限されず、例えば、アルミニウム、スチール等の金属等があげられる。   The power supply cover 15 has an upper surface facing the power supply substrate 14 and a lower surface facing the LED substrate 11. When the LED lighting apparatus 1 has the power supply cover 15, for example, the power supply cover 15 can divide the space in the main body 10 into two rooms. According to the power supply cover 15, for example, promotion of heat dissipation from the LED 111, interruption of heat dissipation generated by the power supply substrate 14, fixation of the LED substrate 11, etc. can be performed more efficiently. The material of the power supply cover 15 is not particularly limited, and examples thereof include metals such as aluminum and steel.

LED基板11は、その上面が、本体10に対向し、電源カバー15を有する場合は、電源カバー15に対向し、その下面が、カバー12と対向し、且つ、LED111が実装された実装面である。LED照明器具1を天井に設置した際、LED111の実装面は、前面側となり、下方を照射することになる。   When the LED substrate 11 has an upper surface facing the main body 10 and a power source cover 15, the LED substrate 11 is opposed to the power source cover 15, its lower surface is opposed to the cover 12, and the mounting surface on which the LED 111 is mounted. is there. When the LED lighting apparatus 1 is installed on the ceiling, the mounting surface of the LED 111 is the front side, and the lower side is irradiated.

LED基板11において、複数のLED111の実装形態は、特に制限されない。複数のLED111は、例えば、LED基板11において、円周上に実装されている。円周の数は、特に制限されず、例えば、同心円状の複数の円周上が好ましい。同じ円周上におけるLED111の実装間隔は、例えば、等間隔でもよいし、異なる間隔でもよい。隣接する円周上において、LED111は、中心から外周方向に向かって、同じ線上に実装されてもよいし、ずれた位置関係となるように実装されてもよい。   In the LED board 11, the mounting form of the plurality of LEDs 111 is not particularly limited. For example, the plurality of LEDs 111 are mounted on the circumference of the LED substrate 11. The number of circumferences is not particularly limited, and for example, preferably on a plurality of concentric circles. The mounting intervals of the LEDs 111 on the same circumference may be equal intervals or different intervals, for example. On adjacent circles, the LEDs 111 may be mounted on the same line from the center toward the outer periphery, or may be mounted so as to have a shifted positional relationship.

図1において、LED基板11の中央は、開口部を有しているが、開口部を有していなくてもよい。また、図1において、LED基板11の形状は、正八角形であるが、円等の他の形状であってもよい。さらに、図1において、LED基板11は、一枚板であるが、複数枚の基板の集合体であってもよい。LED基板11を一枚板とすれば、組み立て等の製造工程数を低減できる。   In FIG. 1, the center of the LED substrate 11 has an opening, but may not have an opening. In FIG. 1, the shape of the LED substrate 11 is a regular octagon, but may be other shapes such as a circle. Further, in FIG. 1, the LED substrate 11 is a single plate, but may be an aggregate of a plurality of substrates. If LED board 11 is made into one board, the number of manufacturing processes, such as an assembly, can be reduced.

カバー12は、その上面が、LED基板11に対向し、その下面が、照射面となる。カバー12の部材は、例えば、透光性を有し、また、さらに拡散性を有する部材があげられ、具体例としては、ポリカーボネート樹脂、アクリル樹脂等の透光性樹脂等があげられる。   The cover 12 has an upper surface facing the LED substrate 11 and a lower surface serving as an irradiation surface. Examples of the member of the cover 12 include a member having translucency and further diffusibility. Specific examples thereof include a translucent resin such as polycarbonate resin and acrylic resin.

カバー12について、図2(A)および(B)を参照して、さらに詳細に説明する。図2(A)および(B)は、本実施形態のLED照明器具1におけるLED基板11およびカバー12の一例を示す断面図および底面図である。図2(A)および(B)に示すように、カバー12は、内周領域12aと、外周領域12cと、内周領域12aと外周領域12cとの間に位置する中間領域12bとを有し、LED基板11の実装面を覆っている。   The cover 12 will be described in more detail with reference to FIGS. 2 (A) and 2 (B). 2A and 2B are a cross-sectional view and a bottom view showing an example of the LED substrate 11 and the cover 12 in the LED lighting apparatus 1 of the present embodiment. As shown in FIGS. 2A and 2B, the cover 12 has an inner peripheral region 12a, an outer peripheral region 12c, and an intermediate region 12b located between the inner peripheral region 12a and the outer peripheral region 12c. The mounting surface of the LED substrate 11 is covered.

カバー12は、内周領域12aに、中間領域12bよりも厚みが厚い第1肉厚部を有する。本実施形態のLED照明器具1は、前記第1肉厚部によりもたらされるレンズ効果により、例えば、天井に設置して真下から見上げたときに、中心部が明るく見える。また、本実施形態のLED照明器具1は、複数のLEDを同心円状に配置し、各LEDを、個別に半球状のカバーで覆った特許文献2に記載のLED照明器具のように光を過度に拡散することがなく、ロスが少ない。また、本実施形態のLED照明器具1によれば、光のロスが少ないため、例えば、LED111の実装数を適切に調整することで、特許文献2に記載のLED照明器具よりも消費電力および発熱量を低減可能である。なお、図2(A)に示すように、前記第1肉厚部は、中間領域12bからなだらかに傾斜して中心側に膨らんだ形状であることが好ましいが、下側に突出するように膨らんだ形状であってもよい。   The cover 12 has a first thick portion that is thicker in the inner peripheral region 12a than in the intermediate region 12b. The LED lighting apparatus 1 according to the present embodiment, for example, has a bright central portion when installed on the ceiling and looked up from directly below due to the lens effect provided by the first thick portion. Moreover, the LED lighting fixture 1 of this embodiment arrange | positions several LED concentrically, and light is excessive like the LED lighting fixture of patent document 2 which covered each LED with the hemispherical cover separately. There is little loss. Moreover, according to the LED lighting fixture 1 of this embodiment, since there is little loss of light, for example, by adjusting the mounting number of LED111 appropriately, power consumption and heat_generation | fever than the LED lighting fixture of patent document 2 are demonstrated. The amount can be reduced. As shown in FIG. 2A, the first thick portion preferably has a shape that is gently inclined from the intermediate region 12b and bulges toward the center, but bulges so as to protrude downward. It may be a shape.

前記第1肉厚部の厚みは、特に制限するものではないが、例えば、2mm〜6mmの範囲である。また、前記第1肉厚部の厚みは、例えば、中間領域12bの厚みの1.2倍〜1.5倍の範囲である。   The thickness of the first thick portion is not particularly limited, but is, for example, in the range of 2 mm to 6 mm. Further, the thickness of the first thick portion is, for example, in the range of 1.2 to 1.5 times the thickness of the intermediate region 12b.

図2(A)および(B)に示すように、前記第1肉厚部は、最も中心に近い円周上に実装されたLED111の内側を覆っていてもよい。前記第1肉厚部は、最も中心に近い円周上に実装されたLED111の内側約半分を覆っていることが好ましい。   As shown in FIGS. 2A and 2B, the first thick portion may cover the inside of the LED 111 mounted on the circumference closest to the center. The first thick part preferably covers about half of the inside of the LED 111 mounted on the circumference closest to the center.

前記第1肉厚部は、表面処理された表面を有してもよい。前記第1肉厚部が表面処理された表面を有すれば、グローブ13を有するときに外観上の問題となる明暗の照度ムラおよび干渉による縞模様の発生を抑制可能である。前記表面処理された表面は、前記第1肉厚部の外表面のみが有してもよいし、前記第1肉厚部の内表面のみが有してもよいし、前記外表面および前記内表面の双方が有してもよい。また、前記表面処理された表面は、前記外表面および前記内表面の一部であってよいし、全体であってもよい。前記表面処理の一例として、前記第1肉厚部の表面は、シボを有してもよい。   The first thick part may have a surface that has been surface-treated. If the first thick portion has a surface that has been surface-treated, it is possible to suppress the occurrence of bright and dark illuminance unevenness and interference fringe patterns, which are problems in appearance when the globe 13 is provided. The surface treated surface may have only the outer surface of the first thick part, or may have only the inner surface of the first thick part, or the outer surface and the inner Both of the surfaces may have. Further, the surface-treated surface may be a part of the outer surface and the inner surface, or may be the whole. As an example of the surface treatment, the surface of the first thick portion may have a texture.

グローブ13は、本体10、電源基板14、電源カバー15、LED基板11およびカバー12を覆うドーム形状とされ、例えば、アクリル樹脂等の透光性(乳白色、透明、半透明を含む)樹脂等から形成される。グローブ13には、光拡散粒子、顔料等が分散されていてもよい。また、グローブ13の外表面および内表面の少なくとも一方は、サンドブラスト処理等により粗面化されていてもよいし、シボを有してもよい。グローブ13としては、例えば、従来公知の照明器具に用いられているのと同様のものを用いてもよい。   The globe 13 has a dome shape that covers the main body 10, the power supply board 14, the power supply cover 15, the LED board 11, and the cover 12, and is made of, for example, translucent resin (including milky white, transparent, and translucent) such as acrylic resin. It is formed. In the globe 13, light diffusing particles, pigments and the like may be dispersed. Further, at least one of the outer surface and the inner surface of the globe 13 may be roughened by sandblasting or the like, or may have wrinkles. For example, the globe 13 may be the same as that used in conventionally known lighting fixtures.

[実施形態2]
本実施形態は、カバーの内周領域に加え、カバーの外周領域にも肉厚部を有するLED照明器具の一例である。本実施形態のLED照明器具は、さらに、カバーの外周領域に、中間領域よりも厚みの厚い第2肉厚部を有する点を除き、実施形態1のLED照明器具1と同様である。
[Embodiment 2]
The present embodiment is an example of an LED lighting apparatus having a thick portion in the outer peripheral region of the cover in addition to the inner peripheral region of the cover. The LED lighting apparatus of the present embodiment is the same as the LED lighting apparatus 1 of Embodiment 1 except that the outer peripheral area of the cover has a second thick part that is thicker than the intermediate area.

図3(A)および(B)は、本実施形態のLED照明器具におけるLED基板11およびカバー12の一例を示す断面図および底面図である。   3A and 3B are a cross-sectional view and a bottom view showing an example of the LED substrate 11 and the cover 12 in the LED lighting apparatus of the present embodiment.

カバー12は、内周領域12aに、中間領域12bよりも厚みが厚い第1肉厚部を有するのに加え、外周領域12cに、中間領域12bよりも厚みが厚い第2肉厚部を有する。本実施形態のLED照明器具によれば、実施形態1のLED照明器具1が奏する効果に加え、前記第2肉厚部によりもたらされるレンズ効果により、外周側の明るさも確保できる。このため、本実施形態のLED照明器具によれば、例えば、天井に設置して真下から見上げたときの明るさの均一性を、さらに向上可能である。なお、図3(A)に示すように、前記第2肉厚部は、中間領域12bからなだらかに傾斜して外側に膨らんだ形状であることが好ましいが、下側に突出するように膨らんだ形状であってもよい。   The cover 12 has a first thick portion thicker than the intermediate region 12b in the inner peripheral region 12a, and has a second thick portion thicker than the intermediate region 12b in the outer peripheral region 12c. According to the LED lighting fixture of this embodiment, in addition to the effect produced by the LED lighting fixture 1 of Embodiment 1, the brightness on the outer peripheral side can also be secured by the lens effect brought about by the second thick part. For this reason, according to the LED lighting fixture of this embodiment, the uniformity of the brightness when it is installed on the ceiling and looked up from directly below can be further improved, for example. As shown in FIG. 3 (A), the second thick portion preferably has a shape that is gently inclined from the intermediate region 12b and bulges outward, but bulges so as to protrude downward. It may be a shape.

前記第2肉厚部の厚みは、特に制限するものではないが、例えば、2mm〜6mmの範囲である。また、前記第2肉厚部の厚みは、例えば、中間領域12bの厚みの1.2倍〜1.5倍の範囲である。   The thickness of the second thick portion is not particularly limited, but is, for example, in the range of 2 mm to 6 mm. Further, the thickness of the second thick portion is, for example, in the range of 1.2 to 1.5 times the thickness of the intermediate region 12b.

図3(A)および(B)に示すように、前記第2肉厚部は、最も中心から遠い円周上に実装されたLED111の外側を覆っていてもよい。前記第2肉厚部は、最も中心から遠い円周上に実装されたLED111の外側約半分を覆っていることが好ましい。   As shown in FIGS. 3A and 3B, the second thick portion may cover the outside of the LED 111 mounted on the circumference farthest from the center. The second thick part preferably covers about half of the outside of the LED 111 mounted on the circumference farthest from the center.

前記第2肉厚部は、表面処理された表面を有してもよい。前記第2肉厚部が表面処理された表面を有すれば、グローブ13を有するときに外観上の問題となる明暗の照度ムラおよび干渉による縞模様の発生を抑制可能である。前記表面処理された表面は、前記第2肉厚部の外表面のみが有してもよいし、前記第2肉厚部の内表面のみが有してもよいし、前記外表面および前記内表面の双方が有してもよい。また、前記表面処理された表面は、前記外表面および前記内表面の一部であってよいし、全体であってもよい。前記表面処理の一例として、前記第2肉厚部の表面は、シボを有してもよい。   The second thick part may have a surface treated surface. If the second thick part has a surface that has been surface-treated, it is possible to suppress the occurrence of bright and dark illuminance unevenness and stripes due to interference, which are problems in appearance when the globe 13 is provided. The surface treated surface may have only the outer surface of the second thick part, or may have only the inner surface of the second thick part, or the outer surface and the inner Both of the surfaces may have. Further, the surface-treated surface may be a part of the outer surface and the inner surface, or may be the whole. As an example of the surface treatment, the surface of the second thick portion may have a texture.

以上、実施形態を参照して本発明を説明したが、本発明は、上記実施形態に限定されるものではない。本発明の構成や詳細には、本発明のスコープ内で当業者が理解しうる様々な変更をすることができる。   The present invention has been described above with reference to the embodiments. However, the present invention is not limited to the above embodiments. Various changes that can be understood by those skilled in the art can be made to the configuration and details of the present invention within the scope of the present invention.

本発明のLED照明器具は、例えば、天井に設置して真下から見上げたときに中心部が明るく見え、且つ、光のロスが少ないものである。本発明のLED照明器具は、例えば、屋内用のシーリングライト等、幅広い用途に用いることが可能である。   The LED lighting apparatus of the present invention has, for example, a bright central part and a small loss of light when installed on the ceiling and looked up from directly below. The LED lighting apparatus of the present invention can be used for a wide range of applications such as indoor ceiling lights.

1 LED照明器具
10 本体
11 LED基板
12 カバー
12a 内周領域
12b 中間領域
12c 外周領域
13 グローブ
14 電源基板
15 電源カバー
111 LED

DESCRIPTION OF SYMBOLS 1 LED lighting fixture 10 Main body 11 LED board 12 Cover 12a Inner periphery area | region 12b Middle area | region 12c Outer periphery area | region 13 Globe 14 Power supply board 15 Power supply cover 111 LED

Claims (10)

本体と、
複数のLEDが実装されたLED基板と、
カバーとを含み、
前記本体、前記LED基板および前記カバーの順に配置され、
前記LED基板は、前記カバーと対向する面が、前記LEDの実装面であり、
前記カバーは、内周領域と、外周領域と、前記内周領域と前記外周領域との間に位置する中間領域とを有し、前記LED基板の前記実装面を覆い、
前記カバーは、前記内周領域に、前記中間領域よりも厚みが厚い第1肉厚部を有することを特徴とするLED照明器具。
The body,
An LED substrate on which a plurality of LEDs are mounted;
Including a cover,
Arranged in the order of the main body, the LED substrate and the cover,
In the LED substrate, a surface facing the cover is a mounting surface of the LED,
The cover has an inner peripheral region, an outer peripheral region, and an intermediate region located between the inner peripheral region and the outer peripheral region, and covers the mounting surface of the LED substrate,
The LED lighting apparatus according to claim 1, wherein the cover has a first thick portion having a thickness larger than that of the intermediate region in the inner peripheral region.
前記LED基板の前記実装面は、同心円状に前記LEDが実装され、
前記第1肉厚部は、最も中心に近い円周上に実装された前記LEDの内側を覆っている、請求項1記載のLED照明器具。
The LED is mounted on the mounting surface of the LED substrate concentrically,
The LED lighting apparatus according to claim 1, wherein the first thick part covers an inner side of the LED mounted on a circumference closest to the center.
前記第1肉厚部は、表面処理された表面を有する、請求項1または2記載のLED照明器具。 The LED lighting apparatus according to claim 1, wherein the first thick portion has a surface that has been surface-treated. 前記第1肉厚部の厚みは、2mm〜6mmの範囲である、請求項1から3のいずれか一項に記載のLED照明器具。 4. The LED lighting apparatus according to claim 1, wherein a thickness of the first thick part is in a range of 2 mm to 6 mm. 前記第1肉厚部の厚みは、前記中間領域の厚みの1.2倍〜1.5倍の範囲である、請求項1から4のいずれか一項に記載のLED照明器具。 5. The LED lighting apparatus according to claim 1, wherein a thickness of the first thick portion is in a range of 1.2 to 1.5 times a thickness of the intermediate region. 前記カバーは、さらに、前記外周領域に、前記中間領域よりも厚みが厚い第2肉厚部を有する、請求項1から5のいずれか一項に記載のLED照明器具。 6. The LED lighting apparatus according to claim 1, wherein the cover further includes a second thick portion having a thickness larger than that of the intermediate region in the outer peripheral region. 前記LED基板の前記実装面は、同心円状に前記LEDが実装され、
前記第2肉厚部は、最も中心から遠い円周上に実装された前記LEDの外側を覆っている、請求項6記載のLED照明器具。
The LED is mounted on the mounting surface of the LED substrate concentrically,
The LED lighting apparatus according to claim 6, wherein the second thick part covers an outside of the LED mounted on a circumference farthest from the center.
前記第2肉厚部は、表面処理された表面を有する、請求項6または7記載のLED照明器具。 The LED lighting fixture according to claim 6 or 7, wherein the second thick part has a surface that has been surface-treated. 前記第2肉厚部の厚みは、2mm〜6mmの範囲である、請求項6から8のいずれか一項に記載のLED照明器具。 The LED lighting fixture according to any one of claims 6 to 8, wherein a thickness of the second thick part is in a range of 2 mm to 6 mm. 前記第2肉厚部の厚みは、前記中間領域の厚みの1.2倍〜1.5倍の範囲である、請求項6から9のいずれか一項に記載のLED照明器具。

10. The LED lighting apparatus according to claim 6, wherein a thickness of the second thick part is in a range of 1.2 times to 1.5 times a thickness of the intermediate region.

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