JP2017217832A5 - - Google Patents

Claims (7)

A laminated film in which a resin layer is laminated on at least one surface of a base material layer,
The laminated film whose recess ratio measured by the following measuring method is 1% or more and 50% or less on the surface of the resin layer.
[Method of measuring recess ratio]
The surface roughness is measured using the atomic force microscope DimensionIcon manufactured by Burker Corporation under the following measurement conditions. The surface roughness data of the obtained HeightSensor channel is analyzed by "NanoScopeAnalysis V1.40". The analysis is performed after plane fitting under the following analysis conditions, and the height of the reference plane obtained by approximation is defined as a depth of 0 nm. In a cross-sectional chart of 10 μm in length randomly selected, the sum (ΣDn) of the length of the peak with the maximum depth from the reference plane of 5 nm or more and 40 nm or less projected onto a straight line The divided ratio is taken as the concave portion ratio (%) (concave portion ratio = (ΣDn / 10) × 100). The surface measurement is performed 10 times by changing the measurement range, and the recess ratio (%) is obtained from 10 cross section charts randomly selected for each measurement range, and the average value of total 100 times is the recess ratio (%) I assume.
<Measurement conditions>
Measuring device: Atomic force microscope (AFM) manufactured by Burker Corporation
Measurement mode: ScanAsyst
Cantilever: Bruker AXS SCANASYS T-AIR
(Material: Si, Spring constant K: 0.4 (N / m), Tip radius of curvature R: 2 (nm))
Measurement atmosphere: 23 ° C · Atmospheric measurement range: 10 (μm) square resolution: 512 × 512
Cantilever moving speed: 10 (μm / s)
<Analysis condition>
Plane Fit Mode: XY
Plane Fit Order: 3rd The laminated film according to claim 1, wherein the surface elastic modulus of the resin layer is 100 MPa or more and 1000 MPa or less. The laminated film according to claim 1 or 2, wherein the surface energy of the resin layer is 25 mN / m or more and 38 mN / m or less. The laminated film according to any one of claims 1 to 3, wherein the thermal shrinkage at 120 ° C is 0.1% or more and 2.0% or less in any of the MD direction and the TD direction. The thermal contraction stress at 120 ° C measured by raising the temperature from 25 ° C at a heating rate of 5 ° C / min by thermal mechanical analysis (TMA) is 0.001 MPa or more and 0.5 MPa in both the film MD direction and the TD direction The laminated film according to any one of claims 1 to 4, which is the following. The laminated film according to any one of claims 1 to 5, which is used for mold release application. A coating step of coating the resin composition (α) on at least one surface of the polyester film, a stretching step of stretching the polyester film coated with the resin composition (α) in at least one uniaxial direction, and the resin composition (α) A method of manufacturing a laminated film having a heating step of heating a resin layer to form a resin layer, and a heating and relaxing step of relaxing the laminated film subjected to the heating step while heating in at least one axial direction in this order, The heating temperature (Tk) is 150 ° C. or more and 240 ° C. or less, the relaxation treatment in the heat relaxation step is performed in two or more steps, and the heating temperature (Tks1) in at least one heat relaxation step is Tk-10 to Tk + 10 ° C. The heating temperature (Tks2) of at least one step of heat relaxation step is Tk-50-Tk-20 ° C according to any of claims 1 to 6, Method of manufacturing a layer film.