JP2017217702A - Laser cutting processing method and device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laser cutting processing method and a device capable of performing accurate laser cutting processing by suppressing an influence of heat accumulation caused by heat conduction during laser cutting processing time.SOLUTION: In a laser cutting processing method for a tabular workpiece, laser cutting processing of the workpiece is performed after cooling the whole workpiece beforehand by spraying cooling water over the whole workpiece. In this case, when carrying in relatively the workpiece to a laser cutting processing position of a laser cutting processing device, or after carrying it in, cooling water is jetted out onto an upper surface of the workpiece, and then laser cutting processing is performed.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a laser cutting processing method and apparatus for performing laser cutting processing of a workpiece such as a metal plate, and more specifically, processing of the shape and dimensions at the time of laser cutting processing of a workpiece such as a hole. The present invention relates to a laser cutting method and apparatus capable of suppressing a decrease in accuracy.

  When laser cutting is performed on a plate-shaped workpiece, for example, the plate-shaped workpiece stored outdoors in the summer is higher than the temperature in the factory. There is a problem that the processing accuracy of the dimensions is lowered. In addition, when laser cutting processing is performed by arranging holes having appropriate shapes in a plurality of rows and rows, it is possible to perform cutting processing with high accuracy in shape and dimensions in the initial laser cutting processing. However, when the laser cutting process proceeds, the heat at the time of the laser cutting process is conducted to the surroundings and gradually stored. Therefore, cutting accuracy may be reduced due to thermal expansion caused by heat storage. In some cases, burning may occur due to heat storage. Therefore, cooling of the laser cutting processing position is performed by jetting cooling water to the laser cutting processing position (see, for example, Patent Documents 1 and 2).

JP 58-23590 A Japanese Patent Laid-Open No. 5-157474

  In the configuration described in Patent Document 1, since cooling is performed by ejecting cooling water around the laser cutting position, laser cutting can be performed while suppressing thermal expansion of the workpiece, and the accuracy is high. Laser cutting can be performed. However, when the workpiece is not sufficiently cooled, heat may be stored by heat conduction in the front side of the laser cutting process, and the accuracy of laser cutting may be reduced due to this heat storage.

  In the configuration according to Patent Document 2, the temperature of the workpiece near the laser cutting processing position is detected by a temperature sensor provided in the laser processing head, and when the detected temperature is equal to or higher than the set temperature, the laser processing position is detected from the nozzle. The laser cutting process is performed while jetting cooling water to cool the workpiece. Then, when the temperature detected by the temperature sensor becomes equal to or lower than the set temperature, the cooling water jet is stopped. Accordingly, for example, laser cutting can be performed while preventing burning.

  The configurations described in Patent Documents 1 and 2 are configured to cool the vicinity of the processing position by injecting cooling water around the vicinity of the laser cutting processing position. Accordingly, at the time of laser cutting processing, laser cutting processing can be performed while preventing the portion of the laser cutting processing position from being easily melted. However, it is not possible to prevent heat from being stored by heat conduction on the front side in the direction of laser cutting.

  Therefore, when laser cutting processing proceeds and laser cutting processing is performed on the part of the heat storage that is in front of the direction of laser cutting processing, heat at the time of laser cutting processing is added to the heat storage. In spite of cooling by injecting cooling water, cooling may be insufficient and the accuracy of laser cutting may be reduced.

  The present invention has been made in view of the above-described problems, and is a method for laser cutting of a plate-like workpiece. The workpiece is laser-cut after being cooled in advance by applying cooling water to the entire workpiece. It is characterized by performing processing.

  Further, in the laser cutting processing method, when the workpiece is relatively loaded into the laser cutting processing position of the laser cutting processing apparatus, or after the workpiece is loaded, the workpiece is cooled by spraying cooling water onto the workpiece upper surface. Laser cutting is performed later.

  In the laser cutting method, the height position of the laser processing head when cooling water is jetted from the cooling water nozzle provided in the laser processing head is higher than the height position of the laser processing head at the time of laser cutting processing. Then, laser cutting is performed.

  Further, in the laser cutting processing method, when the detected temperature of the workpiece is detected and the set temperature, as a result of comparison between the detected temperature and the set temperature, the cooling water is ejected from the cooling water nozzle. The height position of the laser processing head is higher than the height position of the laser processing head at the time of laser cutting.

  Further, in the laser cutting method, the coolant is sprayed on the entire upper surface of the workpiece, and the laser cutting of the workpiece is started when the upper surface of the workpiece is wet with the cooling water.

Also, laser cutting provided with a laser processing head that is provided with a cooling water nozzle for injecting cooling water onto the workpiece and is movable in the X, Y, and Z axis directions, and a control device for controlling the operation of the laser processing head. A processing device,
The controller is
To move the laser processing head in order to inject cooling water from the cooling water nozzle onto the upper surface of the workpiece when the workpiece is relatively loaded into the laser cutting processing position of the laser cutting processing apparatus or after loading the workpiece. There is provided an injection operation program storage means for storing a program of the above operation pattern (full injection operation pattern).

  The present invention performs laser cutting after jetting cooling water onto a workpiece and cooling it before starting laser cutting of the workpiece. Therefore, it is possible to suppress a decrease in accuracy due to thermal expansion of the workpiece.

It is the functional block diagram which showed notionally and schematically the structure of the laser processing apparatus which concerns on embodiment of this invention. It is explanatory drawing of a laser cutting process.

  Hereinafter, a laser cutting apparatus according to an embodiment of the present invention will be described with reference to the drawings. As shown conceptually and schematically in FIG. 1, the laser cutting apparatus 1 is used for a metal plate as a workpiece W. The laser processing head 3 is relatively movable in the X, Y, and Z axis directions. A laser oscillator 5 is optically connected to the laser processing head 3. Further, the laser processing head 3 is provided with a servo motor 7 for moving and positioning the laser processing head 3 in the X, Y, and Z axis directions with respect to the workpiece W. Therefore, the laser processing head 3 is moved in the X, Y, and Z axis directions by driving the servo motor 7 while irradiating the workpiece W with the laser beam LB oscillated from the laser oscillator 5. As a result, the laser cutting of the workpiece W is performed.

  A temperature sensor 9 for detecting the temperature of the workpiece W is provided at an appropriate position of the laser processing head 3, and cooling water for injecting (injecting) cooling water around the laser cutting processing position. A nozzle 11 is provided. The cooling water nozzle 11 is connected to a cooling water jetting means 13 such as a pump via an on-off valve 15. Therefore, the temperature of the workpiece W can be measured by the temperature sensor 9 by moving the laser processing head 3 relative to the workpiece W. And it can cool by ejecting a cooling water from the cooling water nozzle 11 with respect to the location where measured temperature is more than preset temperature.

  In order to control the output of the laser oscillator 5, the operation of the servo motor 7, the operation of the cooling water jetting means 13, and the opening / closing operation of the on-off valve 15, the laser cutting apparatus 1 is provided with a control device 17. ing. The control device 17 is composed of a computer and includes a CPU 19, a RAM 21, a ROM 23, an input unit 25 and a display unit 27.

  The control device 17 includes processing program storage means 31 that stores various laser cutting processing programs generated (created) by the automatic programming device 29. Further, the control device 17 includes an injection operation program storage means for storing an operation pattern for performing a moving operation of injecting (injecting) cooling water to the laser cutting processing position or the entire surface of the laser cutting processing region prior to the laser cutting processing. 33 is provided.

  That is, when the workpiece W is entirely hot, the cooling water is ejected from the cooling water nozzle 11 to the entire surface of the laser processing region (laser processing range) of the workpiece W. An operation pattern that moves in a zigzag or spiral manner relative to the entire laser processing region of the workpiece W while positioning the height of the laser processing position higher than the height position of the head 3 (entire surface Program of the general injection operation pattern) is stored in the injection operation program storage means 33.

  The injection operation program storage means 33 stores a pre-injection program that performs an operation for cooling the machining position in advance in association with the No of each laser cutting machining program stored in the machining program storage means 31. ing. This pre-injection program, for example, when laser-cutting an appropriately shaped hole, when the temperature detection temperature (measurement temperature) of the laser cutting processing position by the temperature sensor 9 is higher than a preset set temperature, An operation program for ejecting cooling water from the cooling water nozzle 11 to a laser cutting processing position, which is created in association with the laser cutting processing program when the automatic programming device 29 generates the laser cutting processing program. is there.

  That is, the pre-ejection program is a result of measuring the temperature of the workpiece W at the laser cutting processing position in advance by the temperature sensor 9 before starting the laser cutting processing, for example, when performing laser cutting processing such as holes sequentially. When the measurement temperature is equal to or higher than the set value, the laser processing head 3 is moved to a position near the cutting processing position such as a hole at a position higher than the height position at the time of laser cutting processing, and the cooling water nozzle 11 lasers the cooling water. It is for ejecting in advance around the machining position.

  The control device 17 is connected to the temperature sensor 9 and includes a set value memory 35 in which a set temperature to be compared with a detected temperature (measured temperature) detected by the temperature sensor 9 is stored in advance. The control device 17 includes a comparison unit 37 that compares the detected temperature with the set temperature.

  In the configuration as described above, the work W is subjected to laser cutting after the work W is placed and positioned on a work table (not shown) in the laser cutting apparatus 1. Here, the temperature of the workpiece W is detected by the temperature sensor 9 provided in the laser processing head 3 before the workpiece W is laser-cut. When the detected temperature and the preset temperature stored in the preset value memory 35 are compared with each other by the comparison means 37, the detected temperature is greater than the preset temperature. Cooling water is ejected to cool the workpiece W before starting laser processing.

  That is, before the laser cutting of the workpiece W starts, when the workpiece detection temperature ≧ the set temperature, the cooling water is jetted over the entire laser processing area in accordance with a laser cutting processing program for performing laser cutting processing. . In this case, since the operation is for ejecting cooling water, the output of the laser oscillator 5 is maintained at zero under the control of the oscillator operation control means 39. Then, under the control of the machining head operation control means 41, the height position of the laser machining head 3 is held at a higher position than the height position at the time of laser cutting. The laser processing head 3 is controlled to move relative to the workpiece W in the X and Y axis directions. Further, the operations of the cooling water jetting means 13 and the on-off valve 15 are controlled under the control of the cooling water jetting control means 43, and the cooling water is jetted over the entire laser processing region.

  If the detected temperature is lower than the set temperature, the laser cutting of the workpiece W is started without ejecting the cooling water over the entire laser processing region. By the way, as shown in FIG. 2, when the holes H1 to H4 are sequentially processed in the workpiece W, since the temperature of the workpiece W is normal at the start of the processing of the first hole H1, stable laser cutting is performed. It will be.

  However, when laser cutting is sequentially performed, heat at the time of laser cutting in the previous process is conducted and stored at the next processing position. Therefore, this heat-stored portion undergoes thermal expansion and the like, and the accuracy of the shape and dimensions of the laser cutting process is reduced. Therefore, before laser cutting of the next hole H2, the temperature of the laser processing region of the hole H2 is detected by the temperature sensor 9, and when the detected temperature ≧ the set temperature, the laser processing head 3 is subjected to laser cutting processing. By positioning the position higher than the height position and ejecting the cooling water from the cooling water nozzle 11, the vicinity of the laser processing region is cooled.

  That is, laser cutting is performed after the cooling water is jetted to cool the laser processing region of the workpiece in advance. Therefore, the laser cutting process is performed while suppressing the adverse effect of heat storage due to heat conduction, and the laser cutting process can be performed with high accuracy. When laser cutting is performed after cooling, it is desirable to perform laser cutting with a lower output than the laser output at the previous laser cutting. In this case, laser cutting can be performed without applying excessive heat to the workpiece W.

  In addition, in order to preliminarily cool the coolant by ejecting the coolant to the laser processing region of the workpiece W, as described above, when the coolant is ejected to the hole H2 position, the laser processing is performed to the laser processing regions of the holes H3 and H4. The head 3 can be moved in advance, and the cooling water can be ejected in advance to the laser cutting processing area on the front side in the direction of laser cutting processing. As described above, the temperature rise in the front laser cutting region in the laser cutting direction of the workpiece W can be suppressed by jetting the cooling water in advance to the laser cutting region in the front direction in the laser cutting direction. In addition, the hole machining for the workpiece W can be efficiently performed.

  As can be understood from the above description, when the detected temperature of the workpiece W is equal to or higher than the set temperature, the laser cutting is performed after the cooling water is jetted to cool the workpiece W, so that a laser with high accuracy is obtained. Cutting can be performed.

  Also, since the cooling water is jetted in advance to the laser cutting process area in the front direction of the laser cutting process, heat storage due to heat conduction during the laser cutting process can be suppressed, and the laser cutting process area is cooled again. This can be omitted, and the efficiency of laser cutting can be improved. In addition, when performing laser cutting while cooling by injecting cooling water into the laser cutting region in advance, the effect of suppressing heat storage is increased and temperature rise can be further suppressed. In addition, it has been described that when the cooling water is injected, the height position of the laser processing head 3 is held higher than the height position at the time of laser cutting processing. You may hold it.

  In the above description, the temperature sensor 9 detects the temperature of the workpiece W, and when the temperature is equal to or higher than the set temperature, the cooling water is entirely jetted onto the upper surface of the workpiece W to be cooled. However, for example, when the workpiece W is stored under the hot weather in summer, it is known that the workpiece W has a high temperature without measuring the temperature. Therefore, in such a case, after carrying in the laser cutting processing position of the laser cutting processing apparatus or when carrying it in, the cooling water is generally jetted onto the upper surface of the work W, and the work is cooled in advance. It is desirable to perform laser cutting.

  As described above, in order to inject the cooling water to the workpiece W entirely after being carried into the laser cutting processing position, as described above, the laser processing head 3 is moved relative to the workpiece W relative to X, Y. , Move in the Z-axis direction, and the cooling water may be ejected from the cooling water sill 11 provided in the laser processing head 3. Note that when the workpiece W is carried into the laser cutting position, the cooling water is entirely sprayed onto the workpiece W. The configuration is appropriately arranged above the carry-in path of the workpiece W to the laser cutting position. What is necessary is just to set it as the structure provided with the cooling water nozzle. In this case, a workpiece detection sensor is provided, and cooling water is injected from the cooling water nozzle when the workpiece W is carried into a predetermined position, and the cooling water injection is stopped when the predetermined position has elapsed. Is desirable.

  As described above, when laser cutting is performed by preliminarily cooling the workpiece W entirely by jetting cooling water over almost the entire upper surface of the workpiece W, the workpiece upper surface is wet with the cooling water. It is desirable to start laser cutting.

DESCRIPTION OF SYMBOLS 1 Laser cutting processing apparatus 3 Laser processing head 9 Temperature sensor 11 Cooling water nozzle 31 Processing program storage means 33 Injection operation program storage means 35 Setting value memory 37 Comparison means

Claims (6)

  A laser cutting method for a plate-like workpiece, wherein the workpiece is laser-cut after being cooled in advance by applying cooling water to the entire workpiece.   The laser cutting processing method according to claim 1, wherein cooling of the workpiece is performed by injecting cooling water onto the upper surface of the workpiece when the workpiece is relatively loaded into the laser cutting processing position of the laser cutting processing apparatus or after loading. A laser cutting processing method characterized by performing laser cutting processing after performing.   3. The laser cutting processing method according to claim 1, wherein the height position of the laser processing head when the cooling water is jetted from the cooling water nozzle provided in the laser processing head is the height of the laser processing head at the time of laser cutting processing. A laser cutting method characterized by being higher than the vertical position.   In the laser cutting processing method according to claim 1, 2 or 3, as a result of a comparison between a detected temperature of a temperature sensor for detecting a temperature of a workpiece and a set temperature, when the detected temperature ≥ set temperature, the cooling water nozzle A laser cutting processing method, wherein the height position of the laser processing head when jetting the cooling water is higher than the height position of the laser processing head at the time of laser cutting processing.   The laser cutting processing method according to any one of claims 1 to 4, wherein the cooling water is sprayed on the entire upper surface of the workpiece, and the workpiece laser cutting processing is performed when the upper surface of the workpiece is wet with the cooling water. The laser cutting processing method characterized by starting. Laser cutting processing apparatus including a cooling water nozzle for injecting cooling water onto a workpiece and movable in the X, Y, and Z-axis directions, and a control device for controlling the operation of the laser processing head Because
The controller is
To move the laser processing head in order to inject cooling water from the cooling water nozzle onto the upper surface of the workpiece when the workpiece is relatively loaded into the laser cutting processing position of the laser cutting processing apparatus or after loading the workpiece. A laser cutting processing apparatus comprising: an injection operation program storage means storing a program of the operation pattern (full injection operation pattern).

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