JP2017212285A - Coil and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a coil and manufacturing method therefor, having excellent insulation quality.SOLUTION: A coil 10 is formed by winding a conductor 12 for winding formed by molding a conductive strand 14 (a conductor) with resin 20. The conductor 12 for winding is filled with resin 20 until a surface of the strand 14 to form no clearance.SELECTED DRAWING: Figure 2

Description

  Embodiments described herein relate generally to a coil and a method for manufacturing the coil.

  The coil is formed, for example, by winding a conductor such as a round wire having a rectangular cross section and a lower half-angle line or a circular cross section. And the circumference | surroundings of a conductor and the outer periphery of a coil are covered with the resin.

JP 2000-90747 A

Now, when the insulation of a conductor or a coil falls, the performance of a coil will be reduced.
Therefore, a coil excellent in insulation and a method for manufacturing the coil are provided.

  The coil of the embodiment is formed by winding a winding conductor obtained by molding a conductor with a resin, and the winding conductor is filled with the resin without any gaps up to the surface of the conductor.

The figure which shows the schematic structural example of the coil by embodiment Diagram showing the cross-sectional structure of the coil The figure which shows the state of the middle process of the manufacturing process of the coil The figure which shows the state of the middle process of the manufacturing process of the coil The figure which shows the state of the middle process of the manufacturing process of the coil The figure which shows the state of the middle process of the manufacturing process of the coil The figure which shows the state of the middle process of the manufacturing process of the coil Sectional drawing which shows the state of the process in the middle of the manufacture process of a coil The figure which shows the state of the middle process of the manufacturing process of the coil The figure which shows the schematic structural example of another coil

Hereinafter, an embodiment will be described based on the drawings. In the description of the embodiment, substantially the same components are denoted by the same reference numerals, and description thereof is omitted.
FIG. 1 is a perspective view showing a schematic configuration example of a coil 10 shown as an example of an embodiment. FIG. 2 is a cross-sectional view showing the configuration of part A of the coil 10 of FIG. The coil 10 is composed of a multiconductor wire 12 made of, for example, copper. The coil 10 is configured such that the multi-conductor wire 12 has a hollow in the center and is concentrically formed, for example, an ellipse, and is wound in close contact with a spiral shape, and the whole is solidified by a resin. A portion A in FIG. 1 is a portion corresponding to the basic unit of the multiconductor wire 12, and FIG. 2 shows a basic configuration of the multiconductor wire 12 constituting the coil 10. The multiconductor wire 12 used for the coil 10 is a winding conductor composed of a plurality of, for example, two conductive strands 14 insulated from each other, for example, a plurality of enamel wires provided with an insulating film.

  As shown in FIG. 2, the multiconductor wire 12 includes a plurality of strands 14. The multi-conductor wire 12 is covered with a securing band 22 and a surrounding band 24.

  As the tying band 22, for example, a strong aramid fiber tape is used. The tying band 22 has a paper tape shape and is used to tie up the strands 14 so as not to be unwound. As shown in FIG. 4A, which will be described later, the tying band 22 is wound around the multi-conductor wire 12 so that a gap G (corresponding to the interval) is formed between the tying bands 22 to be wound. ing.

  The surrounding band 24 winds and covers the periphery of the multiconductor wire 12 secured by the securing band 22. The encircling band 24 is obtained by impregnating a non-woven tape 32 described later with a resin liquid 38 (corresponding to a liquid resin) described later and curing it. In this case, the nonwoven fabric tape 32 can be penetrated and permeated through a resin liquid 38, which will be described later, in the manufacturing process of the coil 10, which will be described later, and is exemplified as an example of a material that can be wound around the multiconductor wire 12. It is. If it has such a characteristic, the raw material which comprises the surrounding band 24 may not be limited to the nonwoven fabric tape 32. FIG.

  Insulating cured resin 20 (resin) exists between the plurality of strands 14 without any gap. In addition, the cured resin 20 exists between the wire 14, the lashing band 22, and the surrounding band 24 without a gap. That is, the entire coil 10 is three-dimensionally integrated and fixed by the curing resin 20 from the inside to the outside. Further, the securing band 22 and the surrounding band 24 are also solidified by the cured resin 20 without a gap. That is, the coil 10 and the multi-conductor wire 12 constituting the coil 10 have a configuration in which the space between the wires 14 and the periphery thereof are filled with the cured resin 20 without a gap and molded.

As the cured resin 20, that is, a resin liquid 38 to be described later, a resin having high thermal conductivity, that is, high heat dissipation may be adopted. As the resin having a high thermal conductivity, for example, an epoxy resin provided with a step of adding an additive that exhibits high thermal conductivity, and added with a micro-sized high thermal conductive filler such as alumina or boron nitride is used. When a resin having high thermal conductivity is adopted, the coil 10 and the multiconductor wire 12 constituting the coil 10 are arranged between the plurality of strands 14, between the strand 14 and the securing band 22 and the surrounding band 24, and The coil 10 has a configuration in which the outer peripheral surface of the coil 10 is filled with a cured resin 20 having high thermal conductivity, that is, heat dissipation. Therefore, the coil 10 to be formed and the multiconductor wire 12 constituting the coil 10 are filled with the cured resin 20 having a high thermal conductivity, that is, a high heat dissipation property without any gap, and the outer periphery of the coil 10 is also a cured resin 20 having a high heat dissipation property. Therefore, the entire coil 10 has high thermal conductivity, that is, heat dissipation.
Further, since the residual voids that are likely to become defects during insulation are minimal and the adhesion between the conductor portion and the resin is good, the insulation performance is high.

  Next, a method for manufacturing the coil 10 will be described. 3 to 9 are views for explaining a method of manufacturing the coil 10, and are diagrams illustrating states in each intermediate process of the manufacturing process. FIG. 3 is a diagram showing a state in the middle of the manufacturing process of the multi-conductor wire 12 constituting the coil 10. 4A and 4B are views showing a state in the middle of the manufacturing process of the multi-conductor wire 12 constituting the coil 10, wherein FIG. 4A is a perspective view and FIG. 4B is a cross-sectional view. FIG. 5 is a diagram showing a state in the middle of the manufacturing process of the multi-conductor wire 12 constituting the coil 10, FIG. 5 (a) is a perspective view, and FIGS. 5 (b) and 5 (c) are cross-sectional views. Show.

  First, as shown in FIG. 3, a plurality of strands 14 are prepared. In FIG. 3, two strands 14 are shown as a strand 14a and a strand 14b, respectively.

  Next, as shown in FIGS. 4 (a) and 4 (b), the periphery of the strand 14 is secured by being wound with a securing band 22 to form the multiconductor wire 12. The securing band 22 is wound so as to form a gap, that is, a gap. In this state, the strand 14 is exposed from the gap between the lashing bands 22 to be wound. Here, since the tying band 22 is, for example, an aramid paper tape, it cannot transmit a resin solution described later. That is, the tying band 22 has a property of not allowing the resin liquid before being cured to pass therethrough.

  Next, as shown in FIGS. 5A and 5B, the nonwoven fabric tape 32 is wound around the secured litz wire 30 b. In this case, the nonwoven fabric tape 32 is wound around the secured litz wire 30b so that no gap is generated between the wound nonwoven fabric tapes 32. The nonwoven fabric tape 32 can permeate and permeate a resin liquid 38 described later.

  Here, the nonwoven fabric tape 32 includes a curing accelerator (corresponding to a resin curing accelerator) of a resin liquid 38 described later. Examples of the curing accelerator include amines, imidazoles, phosphines, DBU (1,8-diazabicyclo (5.4.0) undecene-7) and organic acid salts thereof, ammonium or phosphonium compounds.

  In addition, when the nonwoven fabric tape 32 has sufficient strength for securing the wire 14, that is, sufficient strength for preventing the strand 14 from being unwound, the securing band 22 It is possible to omit the lashing of the wire 14 due to. That is, as shown in FIGS. 5 (a) and 5 (b), the multi-conductor wire 12 shown in FIG. 5 (c) is formed by winding the periphery of the wire 14 with the nonwoven fabric tape 32 without any gap. Can do. In this case, since the lashing by the lashing band 22 can be omitted, the process can be simplified and the manufacturing cost can be reduced. In addition, in the coil 10 and the multiconductor wire 12 constituting the coil 10 in this case, the surroundings of the element wire 14 are covered with the surrounding band 24. Other configurations are the same.

  Next, as shown in FIG. 6, the multiconductor wire 12 is spirally wound around the winding core material 34, thereby forming the multiconductor wire 12 in a coil shape. The wound core material 34 is made of wood, for example. As shown in FIG. 7, a coil 10b is formed by winding the multiconductor wire 12 around the winding core material 34 and forming it in a coil shape.

  Next, after the coil 10b is removed from the wound core member 34, it is immersed in a resin container 36 filled with a resin solution 38 as shown in FIG. By placing the resin container 36 in a space having a pressure lower than atmospheric pressure, filling of the resin liquid 38 into the coil 10b is promoted. Here, as described above, the nonwoven fabric tape 32 can transmit the resin liquid 38. Further, as shown in FIG. 4, the tying band 22 is wound around the strand 14 so that a gap G is formed therebetween. Therefore, the resin liquid 38 permeates through the nonwoven fabric tape 32 and penetrates to the outer peripheral surface (surface) of the strand 14, and further penetrates between the strands 14 through the gap G of the wound lashing band 22. To do. Thereby, between the strands 14, and also between the tie band 22, the nonwoven fabric tape 32, and these strands 14 is filled with the resin liquid 38 without a gap.

  Here, as described above, the nonwoven fabric tape 32 contains a curing accelerator for the resin liquid 38. With this curing accelerator, the coil 10b is immersed in the resin liquid 38, and after the resin liquid 38 has sufficiently penetrated into the inside of the nonwoven fabric tape 32 and the multiconductor wire 12, the resin liquid 38 in the nonwoven fabric tape 32 reacts with the curing accelerator. Harden. Thereby, as shown in FIG. 8 to be described later, a surrounding band 24 cured by the resin is formed. Here, since the curing accelerator is contained only in the non-woven tape 32, only the resin liquid 38 of the non-woven tape 32 is cured, and the internal resin liquid 38 covered with the non-woven tape 32 remains uncured. Remain in. That is, the inner region between the wire 14 and the lashing band 22 and covered with the nonwoven fabric tape 32 is filled with the resin liquid 38 before curing, that is, the uncured resin 40. Assuming that the coil in this state is a coil 10d, the multiconductor wire 12 constituting the coil 10d is filled with the uncured resin 40 between the strands 14 inside as shown in FIG. The non-woven tape 32 hardened with the resin liquid 38, that is, is covered with the encircling band 24.

  Next, the coil 10d in this state taken out from the resin container 36 is shown in FIG. As described above, the structure of the multi-conductor wire 12 constituting the coil 10d is shown in FIG. FIG. 8 shows a cross-sectional structure of portion B in FIG. At this time, the multiconductor wire 12 constituting the coil 10d is covered with the surrounding band 24 whose periphery is hardened with the resin liquid 38 as described above. Therefore, even if the coil 10d is taken out from the resin container 36, the resin liquid 38 inside the coil 10d, that is, the uncured resin 40, can be prevented from leaking to the outside, and there is no gap in the interior covered by the enveloping band 24. A held state is secured.

  Next, as shown in FIG. 9, the coil 10 d is put into the thermal drying furnace 42. The entire coil 10d is thermally dried by the heat drying furnace 42, whereby the uncured resin 40 of the coil 10d is cured. At the same time, hardening of the surrounding band 24 is promoted. The coil 10 shown in FIG. 1 can be manufactured through the above steps.

  In the step shown in FIG. 7, only the 32 parts of the non-woven tape is included in the curing accelerator and the resin liquid 38 in only this part is cured for the following reason. Assume that the nonwoven fabric tape 32 portion does not contain the curing accelerator of the resin liquid 38. In this case, even if the coil 10b is immersed in the resin liquid 38 in the resin container 36, the resin liquid 38 in the portion of the nonwoven fabric tape 32 is not cured. In this state, when the coil 10 is taken out from the resin container 36, the nonwoven fabric tape 32 allows the resin liquid 38 to pass therethrough, so that the uncured resin 40 in the coil 10 passes through the nonwoven fabric tape 32 and leaks outside. Accordingly, in this state, when the resin liquid 38 is cured in the heat drying furnace 42, the cured resin 20 is lost inside the multiconductor wire 12 constituting the coil 10, and the element wire 14, the securing band 22, and the encircling band A gap is formed between 24 and the like. If such a gap exists, the insulating property of the coil 10 is lowered.

  On the other hand, in order to cure the resin liquid 38 when the nonwoven fabric tape 32 does not contain a curing accelerator, the resin liquid 38 is cured by a method such as heating with the coil 10 placed in the resin container 36. . However, if it does in this way, the resin liquid 38 will harden | cure with the resin container 36 in which the coil 10 was put, and since these are integrated with the resin container 36, the coil 10 cannot be taken out. Moreover, the cured resin is also filled in the cavity in the center of the coil 10, and the cavity is blocked with the cured resin. For the above reason, the resin liquid 38 is cured only in this portion by adding a curing accelerator to the nonwoven fabric tape 32. That is, the nonwoven fabric tape 32 becomes a surrounding band 24 cured by the resin by adding a curing accelerator to the nonwoven fabric tape 32, the coil 10b is immersed in a resin container 36 filled with the resin liquid 38, and the resin liquid 38 is contained therein. When impregnated, the coil 10b has a function of maintaining a state in which the resin liquid 38 is filled without a gap. Thereby, there is no gap between the wire 14, the securing band 22, and the surrounding band 24 inside the coil 10, and the coil 10 with improved insulation can be obtained.

According to the coil 10 which concerns on embodiment mentioned above, there exist the following effects.
The coil 10 according to the embodiment and the multiconductor wire 12 constituting the coil 10 have a configuration in which the space between the wires 14 and the periphery thereof are filled with a cured resin 20 without a gap and molded. Thereby, the insulation of the coil 10 is improved. For example, even when this is used in a high-frequency electric device, excellent insulation is achieved.

  Furthermore, the coil 10 and the multi-conductor wire 12 constituting the coil 10 have a configuration in which the wire 14, the securing band 22, and the surrounding band 24 are integrally and firmly fixed by the cured resin 20 and fixed in a three-dimensional manner. . That is, the coil 10 and the multi-conductor wire 12 constituting the coil 10 have a configuration in which the space between the wires 14 and the periphery thereof are filled with the cured resin 20 without gaps, and are solidified and molded. Thereby, in the coil 10, generation | occurrence | production of a clearance gap and a peeling void is suppressed and there exists outstanding insulation.

  The coil 10 of the embodiment and the multi-conductor wire 12 constituting the coil 10 are covered with a surrounding band 24 made of a nonwoven fabric tape 32 whose periphery is cured with a resin. Thereby, the insulation between the multi-conductor wires 12 is improved, and the mechanical strength of the coil 10 is improved.

  In the coil 10 of the embodiment and the multiconductor wire 12 constituting the coil 10, a resin having a high thermal conductivity, that is, a heat dissipation property may be adopted as the cured resin 20, that is, the resin liquid 38 used for the coil 10. In this case, since the coil 10 has excellent heat dissipation, for example, even when abnormal heat generation occurs in the coil 10, damage to the coil 10 and the like can be suppressed.

  According to the method for manufacturing the coil 10 of the embodiment, the nonwoven fabric tape 32 contains the curing accelerator for the resin liquid 38. With this curing accelerator, the coil 10b being manufactured is immersed in the resin liquid 38, and after the resin liquid 38 has sufficiently penetrated into the inside of the multiconductor wire 12, the resin liquid 38 in the nonwoven fabric tape 32 reacts with the curing accelerator and cures. To do. Thereby, the inner region of the coil 10 is filled with the uncured resin liquid 38, that is, the uncured resin 40, and the outer periphery thereof is covered with the non-woven tape 32 that is cured with the resin liquid 38, that is, the surrounding band 24. Become. That is, the outer periphery of the uncured resin 40 in the inner region of the coil 10 is covered by the surrounding band 24 solidified by the resin, and a state in which the uncured resin 40 is confined inside can be created. Thereby, even if it takes out the coil 10 in the middle of manufacture from the resin container 36, it can prevent the unhardened resin 40 of the internal area | region of the coil 10 from leaking out. Thereby, the coil 10 provided with the structure by which the space | interval between the strands 14 and the circumference | surroundings were filled with the hardening resin 20 without gap and molded, and the multiconductor wire 12 which comprises this can be obtained. As described above, the coil 10 having excellent insulating properties can be manufactured.

In the above-described embodiment, an example in which a rectangular wire whose sectional view is substantially rectangular by bundling the two strands 14a and 14b is shown. However, as shown in FIG. One strand 14 may be used. Even in the case of such a wire 14, the nonwoven fabric tape 32 is wound and immersed in the resin container 36 in the same manner as in the embodiment, so that the resin liquid 38 becomes the wire 14 as shown in FIG. It penetrates to the surface. And it can be set as the multiple conductor wire 12 provided with the outstanding insulation as shown in FIG.10 (c) by heat-processing. Therefore, the coil 10 having excellent insulating properties can be manufactured.
In the above description, in the embodiment, an example in which a rectangular wire having a rectangular cross section is used as the multiconductor wire 12 has been described. However, the present invention is not limited to this. For example, a round wire having a circular cross section may be used.
Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

  In the drawings, 10, 10 b, 10 c, and 10 d are coils, 12 is a multi-conductor wire (winding conductor), 14 is an element wire, 20 is a cured resin (resin), 22 is a securing band, 24 is a surrounding band, 32 Is a non-woven tape, 36 is a resin container, 38 is a resin liquid (resin), 40 is an uncured resin (resin), and 42 is a heat drying furnace.

Claims (9)

A coil formed by winding a winding conductor obtained by molding a conductive conductor with a resin,
The winding conductor is a coil in which the resin is filled up to the surface of the conductor without any gap.   The coil according to claim 1, wherein a periphery of the winding conductor is covered with a nonwoven fabric cured by the resin.   The coil according to claim 1 or 2, wherein a periphery of the winding conductor is wound with a tape having a property of not transmitting the resin before being cured.   The coil according to any one of claims 1 to 3, wherein the resin has high thermal conductivity.   The coil according to any one of claims 1 to 4, wherein an additive that exhibits high thermal conductivity is added to the resin.   The coil according to any one of claims 1 to 5, wherein the winding conductor is configured by bundling a plurality of the conductors. Preparing a winding conductor composed of a conductive conductor;
Winding the periphery of the winding conductor with a nonwoven fabric containing a resin curing accelerator;
A step of spirally winding the winding conductor wound by the nonwoven fabric into a coil;
Immersing the coiled winding conductor in a liquid resin and impregnating the liquid resin;
A coil manufacturing method comprising a step of curing a resin by treating the winding conductor impregnated with the liquid resin in a heat drying furnace. The method according to claim 7, further comprising a step of winding the winding conductor around the winding conductor with a tape having a property of not allowing the liquid resin to permeate before the step of winding the non-woven fabric containing the resin curing accelerator. The manufacturing method of the coil of description.   The manufacturing method of the coil of Claim 7 or 8 provided with the process of adding the additive which expresses high thermal conductivity to the said resin.

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