JP2017212057A - Conductive base material, conductive membrane transfer film, and display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a conductive base material, a conductive membrane transfer film, and a display device having excellent light resistance.SOLUTION: This invention relates to a conductive base material 10 that has a base material 3, a first layer 1 on the base material 3, and a second layer 2 on the first layer 1, wherein the first layer 1 includes resin and at least one metal particle selected from a silver particle and a copper particle, the second layer 2 includes resin, and at least one of the first layer 1 and the second layer 2 includes a phenolic compound. This invention relates to the conductive base material 10 in which the metal particle includes a silver nanowire with an aspect ratio of 5 or more. This invention relates to a conductive membrane transfer film that is the conductive base material 10 and in which the base material 3 can be peeled off.SELECTED DRAWING: Figure 1

Description

  Embodiments of the present disclosure relate to a conductive substrate, a conductive film transfer film, and a display device.

  In recent years, metal particles such as nanowires have attracted attention as conductive materials used for conductive substrates. The conductive substrate using metal particles has, for example, a metal-containing layer containing metal particles and a resin material.

Many of such conductive substrates are used by patterning a metal-containing layer formed on a substrate into a desired shape, for example, a wiring substrate such as a display device or a touch panel member provided on the display device. It is used as.
When the conductive base material using the metal particles is exposed to sunlight for a long time, the resistivity may increase due to metal oxidation or shape change.

  As a technique for improving light resistance, Patent Document 1 discloses a conductive film containing a conductive fiber and having a content ratio of an element constituting the conductive fiber and a halogen element within a specific range. .

JP 2012-230881 A

  An object of the embodiment of the present disclosure is to provide a conductive substrate, a conductive film transfer film, and a display device excellent in light resistance.

One embodiment of the present disclosure includes a substrate, a first layer on the substrate, and a second layer on the first layer;
The first layer includes a resin and at least one metal particle selected from silver particles and copper particles,
The second layer includes a resin,
Provided is a conductive substrate in which at least one of the first layer and the second layer contains a phenol compound.

  One embodiment of the present disclosure provides a conductive substrate in which the metal particles include silver nanowires having an aspect ratio of 5 or more.

  In one embodiment of the present disclosure, the phenol compound is selected from the group consisting of a phenol compound, a tocopherol compound, and a tocotrienol compound having one or more atoms selected from a nitrogen atom and a sulfur atom. An electrically conductive substrate that is one or more of the above is provided.

  One embodiment of the present disclosure provides a conductive substrate, wherein the first layer has a pattern shape.

One embodiment of the present disclosure is a conductive substrate according to the embodiment,
Provided is a conductive film transfer film from which the substrate can be peeled.

One embodiment of the present disclosure includes a first layer and a second layer on the first layer;
The first layer includes a resin and at least one metal particle selected from silver particles and copper particles,
The second layer includes a resin,
Provided is a display device in which at least one of the first layer and the second layer includes a conductive film containing a phenol-based compound.

  According to the present disclosure, it is possible to provide a conductive base material, a conductive film transfer film, and a display device that are excellent in light resistance.

It is a schematic sectional drawing which shows an example of the electroconductive base material of this indication. It is a schematic sectional drawing which shows another example of the electroconductive base material of this indication. It is a schematic process drawing which shows an example of the manufacturing method of the conductive substrate of this indication. It is a schematic sectional drawing which shows an example of the electrically conductive film transfer film of this indication. It is a schematic sectional drawing which shows another example of the electrically conductive film transfer film of this indication. It is a schematic sectional drawing which shows an example of the display apparatus of this indication.

Hereinafter, embodiments and examples of the present disclosure will be described with reference to the drawings and the like. However, the present disclosure can be implemented in many different modes, and should not be construed as being limited to the description of the embodiments and examples illustrated below. In addition, the drawings may be schematically represented with respect to the width, thickness, shape, and the like of each part in comparison with actual aspects for clarity of explanation, but are merely examples, and the interpretation of the present disclosure may be interpreted. It is not limited. In addition, in the present specification and each drawing, elements similar to those described above with reference to the previous drawings are denoted by the same reference numerals, and detailed description may be omitted as appropriate. Further, for convenience of explanation, the description may be made using the terms “upper” or “lower”, but the vertical direction may be reversed.
In this specification, when a certain configuration such as a certain member or a certain region is “above (or below)” another configuration such as another member or another region, unless otherwise limited, This includes not only when directly above (or directly below) another configuration, but also when above (or below) another configuration, i.e., another configuration above (or below) another configuration. This includes cases where elements are included.

  In the present disclosure, light includes electromagnetic waves having wavelengths in the visible and non-visible regions, and further includes radiation, and the radiation includes, for example, microwaves and electron beams. Specifically, it means an electromagnetic wave having a wavelength of 5 μm or less and an electron beam. In the present disclosure, (meth) acryl means either acryl or methacryl, and (meth) acrylate represents each of acrylate or methacrylate.

[Conductive substrate]
The conductive substrate of the present disclosure has a substrate, a first layer on the substrate, and a second layer on the first layer,
The first layer includes a resin and at least one metal particle selected from silver particles and copper particles,
The second layer includes a resin,
At least one of the first layer and the second layer contains a phenolic compound.

Such a conductive substrate of the present disclosure will be described with reference to the drawings. FIG. 1 is a schematic cross-sectional view illustrating an example of the conductive substrate of the present disclosure. As shown in FIG. 1, the conductive substrate 10 of the present disclosure includes a substrate 3, a first layer 1 containing metal particles on the substrate 1, and a second layer on the first layer 1. 2.
A 1st layer is a layer containing the said metal particle, and has electroconductivity by the said metal particle. The second layer is a resin layer formed on the first layer, and has a function as a protective layer that prevents the first layer from being damaged.
Furthermore, the light resistance improves the electroconductive base material of this embodiment by containing a phenol-type compound in at least one of a 1st layer and a 2nd layer.

Conventionally, when a display device or the like having a conductive base material is exposed to sunlight for a long time, the surface resistance of the conductive base material sometimes increases. It is presumed that this is mainly because free radicals react with oxygen to generate highly active peroxy radicals, thereby degrading the metal in the conductive substrate. In particular, nanowires used as metal particles from the viewpoint of excellent transparency and conductivity have a thin fiber diameter of several tens of nanometers and a large surface area. The impact is estimated to be large.
The conductive substrate of the present embodiment contains a phenolic compound in at least one of the first layer and the second layer. Phenol compounds capture peroxy radicals at an early stage and donate hydrogen to the peroxy radicals to make them more stable hydroperoxides. On the other hand, the phenolic compound itself becomes a low activity phenoxy radical. This action prevents an increase in the number of radicals. Therefore, it is presumed that the conductive base material suppresses metal oxidation and form change by the action of the phenolic compound even when strong light is irradiated. For these reasons, the conductive substrate of this embodiment is excellent in light resistance even if it is a conductive substrate having metal particles.

  The conductive substrate according to the embodiment of the present disclosure includes at least a substrate, a first layer that is a metal-containing layer, and a second layer that is a resin layer, and does not impair the effect. And may have other layers. Hereinafter, each structure of such an electroconductive base material is demonstrated in order.

1. 1st layer The 1st layer in one embodiment of this indication is a metal content layer containing resin and at least one sort of metal particles chosen from silver particles and copper particles.

  Here, the “resin material” is a concept including monomers, oligomers, polymers and the like unless otherwise specified.

The “particles” mean, for example, those having an average primary particle diameter of 0.1 nm or more and 100 μm or less and having a shape such as a fibrous shape, a spherical shape, a substantially spherical shape, and a scale shape. The substantially spherical shape means a shape that can approximate a sphere including a spheroid and a polyhedron.
In addition, an average primary particle diameter can be calculated | required by the method of measuring the magnitude | size of a primary particle directly from an electron micrograph. Specifically, when the “particles” are fibrous, a particle image was measured with a transmission electron micrograph (TEM) (for example, H-7650 manufactured by Hitachi High-Tech), and 100 randomly selected primary particles. The average length of the short axis, that is, the average value of the fiber diameters can be used as the average primary particle diameter. In addition, when the “particles” have other shapes such as a substantially spherical shape and a scale shape, a particle image is measured with a TEM, and an average value of the lengths of the longest portions of 100 randomly selected primary particles is obtained as an average primary value. It can be a particle size.

In the first layer according to an embodiment of the present disclosure, for example, as shown in FIG. 1, metal particles are uniformly dispersed throughout the first layer 1, and the entire area of the first layer 1 has a predetermined conductivity. Alternatively, the conductive portion 1a may have a metal particle, or the metal particles may be non-uniformly dispersed in the first layer 1 as shown in FIG. Specifically, as shown in FIG. 2, the metal particles concentrate on the surface layer of the first layer 1 on the second layer 2 side, and the surface layer of the first layer 1 on the second layer 2 side has a predetermined surface layer. The conductive part 1a having conductivity, and the surface layer of the first layer 1 opposite to the second layer 2 may be the non-conductive part 1b.
Here, the “surface layer” refers to a region near the surface of the first layer. The “conductive portion” refers to a region having conductivity due to metal particles, and the “non-conductive portion” refers to a region other than the conductive portion in the first layer. Note that “having conductivity” means that the surface resistance value is, for example, 1 × 10 ⁶ Ω / □ or less.

  Since the thickness of the first layer in one embodiment of the present disclosure can be appropriately adjusted according to the use of the conductive substrate, the size of the metal particles contained in the first layer, and the like, description here Is omitted.

  Hereinafter, the first layer according to an embodiment of the present disclosure will be described separately for a conductive portion and a non-conductive portion.

(1) Conductive part The first layer in one embodiment of the present disclosure may be, for example, as shown in FIG. 1, the entire area of the first layer 1 may be the conductive part 1a, or as shown in FIG. The surface layer on the second layer 2 side of the first layer 1 may be the conductive portion 1a.

  In one embodiment of the present disclosure, the conductive portion in the first layer has a predetermined amount or more of metal particles, whereby a conductive base material having desired conductivity can be obtained. The conductivity of the conductive part can be adjusted as appropriate according to the use of the conductive base material in one embodiment of the present disclosure. For example, the surface resistance value of the conductive part is 1000Ω / □ or less. Among them, 500Ω / □ or less is preferable, and 100Ω / □ or less is particularly preferable. When the surface resistance value of the conductive portion in the first layer is within the above range, a conductive substrate having desired conductivity can be obtained.

  The surface resistance value of the conductive part can be measured, for example, by bringing Loresta-AX MCP-T370 (Mitsubishi Chemical Analytec) in contact with the surface of the conductive part opposite to the substrate.

  In the first layer according to an embodiment of the present disclosure, metal particles are dispersed in a resin material. In the first layer according to an embodiment of the present disclosure, all the metal particles may not be embedded in the resin material, and some of the metal particles may protrude. The content of the metal particles contained in the first layer in one embodiment of the present disclosure is preferably such that, for example, the first layer can achieve desired conductivity. Specifically, the metal particles are preferably 3 parts by mass or more with respect to 100 parts by mass of the resin material, and more preferably 4 parts by mass or more. Further, the metal particles are preferably 100 parts by mass or less with respect to 100 parts by mass of the resin material, and the content of the metal particles contained in the resin material preferably 50 parts by mass or less is within the above range. Therefore, a conductive substrate having sufficient conductivity can be obtained.

In the conductive part according to an embodiment of the present disclosure, for example, the ratio of the element of the metal particles is preferably 0.05 at% or more, particularly preferably 0.10 at% or more, particularly in terms of atomic composition percentage. It is preferable that it is 0.15 at% or more. Further, the ratio of the elements of the metal particles is preferably 10 at% or less in terms of atomic composition percentage, more preferably 7 at% or less, and particularly preferably 5 at% or less. When the ratio of the elements of the metal particles in the conductive portion is within the above range, predetermined conductivity can be imparted to the conductive portion.
In addition, the ratio of the element of the metal particle which exists in an electroconductive part can be measured on condition of the following using X-ray photoelectron spectroscopy, for example.
・ Acceleration voltage: 15 kV
・ Emission current: 10mA
・ X-ray source: A1 dual anode ・ Measurement area: 300 × 700 μmφ
・ Measured depth of 10nm from the surface ・ Average of n = 3 times

  The thickness of the conductive part in one embodiment of the present disclosure can be appropriately adjusted according to the use of the conductive base material, the size of the metal particles contained in the conductive part, and the like, and is not particularly limited. For example, when the metal particles contained in the conductive part are fibrous, the thickness of the conductive part is preferably less than the fiber diameter. In addition, since the fiber diameter of a metal particle is mentioned later, description here is abbreviate | omitted.

(A) Metal Particle The metal particle in one embodiment of the present disclosure is a material included in the conductive portion and is a material dispersed in the resin material.

  The metal particles in one embodiment of the present disclosure are at least one selected from silver particles and copper particles. That is, the metal particles may be either silver particles or copper particles, and may contain both silver particles and copper particles. As the metal particles, silver particles are particularly preferable.

Here, “silver” refers to silver or a silver alloy, and “copper” refers to copper or a copper alloy.
The “silver alloy” means that silver is a main component, and specifically, the ratio of silver elements is 90 at% or more in terms of atomic composition percentage.
Furthermore, the “copper alloy” means that copper is a main component, and specifically, the ratio of copper elements is 90 at% or more in terms of atomic composition percentage.
In addition, the ratio of the element of silver or copper in a silver alloy or a copper alloy can be measured by quantifying the element using X-ray photoelectron spectroscopy, for example.

  The shape of the metal particles in one embodiment of the present disclosure is preferably a shape that can be dispersed in the resin material and can constitute a conductive part having conductivity. For example, shapes such as a fibrous shape, a spherical shape, a substantially spherical shape, and a scale shape are exemplified. In one embodiment of the present disclosure, it is particularly preferable to use fibrous metal particles.

Here, “fibrous” means, for example, a shape in which the ratio of the length of the long axis to the length of the short axis, that is, the aspect ratio (length of long axis / length of short axis) is 5 or more. Say.
Further, the “metal particles having a fibrous shape” may be linear or curved, and may have a linear portion or a curved portion in a part thereof. Furthermore, the “metal particles having a fibrous shape” includes, for example, a case where a plurality of metallic particles having a fibrous shape are connected.

In one embodiment of the present disclosure, when the metal particles are in a fibrous form, for example, the fiber diameter that is the length of the short axis is 200 nm or less. From the viewpoint of suppressing the decrease, it is preferable.
When the metal particles are fibrous, for example, the fiber diameter is preferably 10 nm or more from the viewpoint of forming a conductive portion having sufficient conductivity.

  Furthermore, when the metal particles are fibrous, for example, the length of the long axis is preferably 1 μm or more from the viewpoint of forming a conductive part having sufficient conductivity. When the metal particles are fibrous, the fiber length is preferably 500 μm or less from the viewpoint of suppressing an increase in haze value due to the occurrence of aggregation and a decrease in light transmittance.

Considering the above-described matters when the metal particles are fibrous, in one embodiment of the present disclosure, the fiber diameter of the metal particles is preferably 15 nm or more, and preferably 180 nm or less.
Moreover, it is preferable that the fiber length of a metal particle is 3 micrometers or more, and it is preferable that it is 10 micrometers or more especially. Moreover, it is preferable that the fiber length of a metal particle is 300 micrometers or less, and it is preferable that it is 30 micrometers or less especially.

When the metal particles have a fiber shape, the shape of the fiber shape is not particularly limited as long as the aspect ratio (length of major axis / length of minor axis) is 5 or more. In order to form an excellent film, the aspect ratio is preferably 10 or more, and more preferably 100 or more.
The aspect ratio is preferably 10,000 or less from the viewpoint that when the aspect ratio is excessive, the haze value is increased due to the occurrence of aggregation and the light transmittance is decreased.

  The fiber diameter and fiber length of the metal particles are 1000 to 500,000 times using an electron microscope such as a scanning electron microscope called SEM, a transmission electron microscope called TEM, and a scanning transmission electron microscope called STEM. Can be obtained as an average value of 10 places where the fiber diameter and fiber length of the fibrous metal particles are measured.

  When the metal particles in one embodiment of the present disclosure are at least one selected from silver particles and copper particles and are fibrous, the silver particles and the copper particles are so-called silver nanowires or copper nanowires. It may be a fiber, or may be a metal-coated synthetic fiber obtained by coating silver or copper on an acrylic fiber. In one embodiment of the present disclosure, one type of metal fiber or metal-coated synthetic fiber may be used, or a combination of metal fiber and metal-coated synthetic fiber may be used.

  When the metal particles in one embodiment of the present disclosure are metal fibers, examples of the method for forming the metal particles include a wire drawing method for extending a metal such as silver or copper, a cutting method, or the like. Moreover, when a metal particle is a metal covering synthetic fiber, as a formation method of a metal particle, the method of coating metals, such as silver and copper, on an acrylic fiber is mentioned, for example.

  In the present disclosure, in particular, the conductive portion has an aspect ratio of 5 because it can suppress the increase in haze value and decrease in light transmittance of the conductive substrate of the present disclosure. It is preferable to include the above silver nanowires, more preferably to include silver nanowires having an aspect ratio of 10 or more, and even more preferably to include silver nanowires having an aspect ratio of 100 or more.

(B) Resin material The resin material in one embodiment of the present disclosure is a material included in the conductive portion, and is a material in which the above-described metal particles are dispersed.

  The resin material according to an embodiment of the present disclosure is preferably a resin material in which the above-described metal particles can be dispersed, for example, a material having transparency. Here, unless otherwise specified, “transparent” means that, for example, when the conductive substrate according to the embodiment of the present disclosure is used for a touch panel display device or the like, visual recognition from an operator is not hindered. It means being transparent. Therefore, “transparent” includes colorless and transparent, and colored transparency that does not hinder visibility, is not defined by strict transmittance, and depends on the use of the conductive substrate in one embodiment of the present disclosure. The degree of transparency can be determined.

  Such a resin material in one embodiment of the present disclosure is preferably, for example, an ionizing radiation curable resin that is cured by ionizing radiation. Here, “ionizing radiation” means an electromagnetic wave or charged particle beam having an energy quantum capable of polymerizing or cross-linking molecules, and usually an ultraviolet ray or an electron beam is used. Electromagnetic waves such as γ rays, and charged particle beams such as α rays and ion rays can also be used.

  Examples of the ionizing radiation curable resin include compounds having one or more unsaturated bonds such as compounds having a functional group such as acrylate. Examples of the compound having one unsaturated bond include ethyl (meth) acrylate, ethylhexyl (meth) acrylate, styrene, methylstyrene, N-vinylpyrrolidone and the like. Examples of the compound having two or more unsaturated bonds include trimethylolpropane tri (meth) acrylate, tripropylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, dipropylene glycol di (meth) acrylate, and pentaerythritol. Tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1,6-hexanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, trimethylolpropane tri (meth) ) Acrylate, ditrimethylolpropane tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, tripentaerythritol octa (meth) acrylate Rate, tetrapentaerythritol deca (meth) acrylate, isocyanuric acid tri (meth) acrylate, isocyanuric acid di (meth) acrylate, polyester tri (meth) acrylate, polyester di (meth) acrylate, bisphenol di (meth) acrylate, diglycerin Polyfunctional compounds such as tetra (meth) acrylate, adamantyl di (meth) acrylate, isoboronyl di (meth) acrylate, dicyclopentane di (meth) acrylate, tricyclodecane di (meth) acrylate, ditrimethylolpropane tetra (meth) acrylate Etc. Among these, pentaerythritol triacrylate (PETA), dipentaerythritol hexaacrylate (DPHA), and pentaerythritol tetraacrylate (PETTA) are preferably used. The “(meth) acrylate” mentioned above refers to methacrylate and acrylate. In one embodiment of the present disclosure, an ionizing radiation curable resin obtained by modifying the above-described compound with PO, EO, or the like can be used.

  In one embodiment of the present disclosure, in addition to the above-described compounds, relatively low molecular weight polyester resins having unsaturated double bonds, polyether resins, acrylic resins, epoxy resins, urethane resins, alkyd resins, spiroacetals. Resins, polybutadiene resins, polythiol polyene resins and the like can also be used as ionizing radiation curable resins.

  The ionizing radiation curable resin can also be used in combination with a solvent-drying resin. Here, the “solvent-drying resin” refers to a resin that forms a film only by drying a solvent added to adjust the solid content during coating, such as a thermoplastic resin. By using the solvent-drying resin in combination, it is possible to effectively suppress the occurrence of film defects or the like on the coating surface of the coating liquid when the conductive portion is formed using the resin material.

  Such a solvent-drying resin is not particularly limited, and generally a thermoplastic resin can be used. Examples of thermoplastic resins include styrene resins, (meth) acrylic resins, vinyl acetate resins, vinyl ether resins, halogen-containing resins, alicyclic olefin resins, polycarbonate resins, polyester resins, polyamide resins. , Cellulose derivatives, silicone resins and rubbers or elastomers.

  The thermoplastic resin is preferably non-crystalline and soluble in an organic solvent such as a common solvent that can dissolve a plurality of polymers and curable compounds. In particular, from the viewpoint of transparency and weather resistance, styrene resins, (meth) acrylic resins, alicyclic olefin resins, polyester resins, cellulose derivatives (cellulose esters, etc.) and the like are preferable.

Furthermore, the resin material may contain a thermosetting resin. Examples of the thermosetting resin include phenol resin, urea resin, diallyl phthalate resin, melamine resin, guanamine resin, unsaturated polyester resin, polyurethane resin, epoxy resin, aminoalkyd resin, melamine-urea cocondensation resin, silicon resin, Examples thereof include polysiloxane resins.
A combination of a silicone resin such as a siloxane copolymer and a siloxane having a reactive group such as an epoxy group is also preferably used from the viewpoint of improving the dispersibility of the metal particles.

(C) Phenolic Compound In one embodiment of the present disclosure, a phenolic compound is contained in at least one of the first layer and the second layer described later. In addition, what is necessary is just to contain the said phenolic compound in at least one of a 1st layer and the 2nd layer mentioned later, Moreover, a phenolic compound in a 1st layer is a conductive part and the nonelectroconductive mentioned later. It may be contained in at least one of the parts. In the conductive substrate of the present disclosure, the phenolic compound improves light resistance by suppressing oxidation of metal particles during light irradiation.

  The phenolic compound of the present disclosure is a compound having at least one phenolic hydroxyl group and having a molecular weight of 1000 or less, preferably a molecular weight of 800 or less. In the present disclosure, the phenolic hydroxyl group means a hydroxyl group directly bonded to an aromatic ring, and the aromatic ring includes a condensed polycyclic aromatic such as a naphthalene ring in addition to a benzene ring.

  In the embodiment of the present disclosure, the phenolic compound is represented by the tocopherol compound represented by the following general formula (I), the tocotrienol compound represented by the following general formula (II), and the following general formula (III). It is preferable that it is 1 or more types selected from the compound to be made.

（一般式（Ｉ）中、Ｒ^１〜Ｒ^３は、各々独立に、水素原子又はメチル基である。）

(In general formula (I), R ^{1 to} R ³ each independently represents a hydrogen atom or a methyl group.)

（一般式（ＩＩ）中、Ｒ^４〜Ｒ^６は、各々独立に、水素原子又はメチル基である。）

(In general formula (II), R ^{4 to} R ⁶ are each independently a hydrogen atom or a methyl group.)

（一般式（ＩＩＩ）中、Ｒ^７及びＲ^８は、各々独立にヘテロ原子を有してもよい直鎖、分岐、環状のアルキル基、又は、下記一般式（ＩＶ）で表される置換基であり、Ｒ^９は、水素原子、ヘテロ原子を有してもよい直鎖、分岐、環状のアルキル基、又は、下記一般式（ＩＶ）で表される置換基である。）

(In general formula (III), R ⁷ and R ⁸ are each independently a linear, branched or cyclic alkyl group which may have a hetero atom, or a substituent represented by the following general formula (IV). R ⁹ is a hydrogen atom, a linear, branched or cyclic alkyl group which may have a hetero atom, or a substituent represented by the following general formula (IV).

（一般式（ＩＶ）中、Ｒ^１０及びＲ^１１は、各々独立にヘテロ原子を有してもよい直鎖、分岐、環状のアルキル基であり、Ｌは２価の連結基である。）

(In general formula (IV), R ¹⁰ and R ¹¹ are each independently a linear, branched or cyclic alkyl group which may have a hetero atom, and L is a divalent linking group.)

In the above R ^{7 to} R ¹¹ , the alkyl group is an alkyl group having 1 or more carbon atoms, and may be linear, branched or cyclic. Specific examples of the alkyl group include a methyl group, an ethyl group, a propyl group, a hexyl group, an octyl group, a dodecyl group, a cyclohexyl group, and a tert-butyl group. Examples of the hetero atom that the alkyl group may have include O (oxygen atom), N (nitrogen atom), and S (sulfur atom).
L in the general formula (IV) is a divalent linking group, and the structure is not particularly limited. Among them, in the carbon chain, —O—, —N—, —S—, —O—C ( It is preferably an alkyl group that may have a partial structure represented by ═O) —, —C (═O) —O—, C (═O) —NH—.
In General Formula (III), it is preferable that at least one of R ⁷ and R ⁸ is an alkyl group having 4 or more carbon atoms or a substituent represented by General Formula (IV).
In general formula (IV), at least one of R ¹⁰ and R ¹¹ is preferably an alkyl group having 4 or more carbon atoms.
In the present disclosure, the compound represented by the general formula (III) is preferably a phenol compound having a nitrogen atom or a sulfur atom from the viewpoint of light resistance.

Preferred specific examples of the compound represented by formula (I) include α-tocopherol, β-tocopherol, γ-tocopherol, δ-tocopherol and the like.
Preferred specific examples of the compound represented by the general formula (II) include α-tocotrienol, β-tocotrienol, γ-tocotrienol, δ-tocotrienol and the like.
In addition, preferred specific examples of the compound represented by the general formula (III) include compounds represented by the following chemical formulas (1) to (3).

In this embodiment, a phenol type compound can be used individually by 1 type or in combination of 2 or more types.
In this embodiment, the content ratio of the phenolic compound in the first layer is not particularly limited, but is preferably 0.1% by mass or more and 5% by mass or less in the first layer from the viewpoint of light resistance. The content is more preferably 0.2% by mass or more and 4.5% by mass or less, and still more preferably 0.5% by mass or more and 4% by mass or less.

(D) Other components In addition to the above-described resin material and metal particles, the conductive portion is within the range that does not impair the effects of the present disclosure, and improves the hardness of the conductive portion, suppresses curing shrinkage, and further controls the refractive index. Depending on the purpose such as, various additives may be added. Examples of the additive include a photopolymerization initiator, a migration inhibitor, a dispersant, a surfactant, an antistatic agent, a silane coupling agent, a thickener, an anti-coloring agent, a coloring agent (pigment, dye), an erasing agent. Examples include foaming agents, leveling agents, flame retardants, ultraviolet absorbers, adhesion-imparting agents, polymerization inhibitors, antioxidants, and surface modifiers.

(2) Non-conductive part As shown in FIG. 2, for example, the first layer in one embodiment of the present disclosure is that the surface layer of any one of the first layers 1 is the conductive part 1 a and the other regions are non-conductive. The conductive portion 1b may be used.

In one embodiment of the present disclosure, the non-conductive portion is a region made of a resin material and having non-conductivity.
Here, “having non-conductivity” means having no conductivity.

  Since the resin material contained in the non-conductive part in one embodiment of the present disclosure can be the same as the resin material used for the conductive part described above, description thereof is omitted here.

  Moreover, the non-conductive part in 1 embodiment of this indication may contain the phenolic compound and other various additives other than the resin material as needed. As a phenolic compound and an additive, since it can be the same as that of the phenolic compound and additive of the electrically conductive part mentioned above, description here is abbreviate | omitted.

  The thickness of the non-conductive part in the present invention can be appropriately adjusted according to the use of the conductive substrate of the present invention, and is not particularly limited. For example, it can be in the range of 50 nm to 3000 nm.

  Further, the first layer may be arranged in a pattern. By disposing the first layer in a desired pattern, the conductive substrate of the present disclosure can be used as a wiring substrate for a display device or the like, specifically, for example, a touch panel It can be used as a sensor electrode substrate.

The shape of the pattern may be appropriately selected and is not particularly limited. For example, when it is used as a sensor electrode substrate of a touch panel, a shape and arrangement that can provide a predetermined position detection function and minimize the degradation of visibility can be selected.
The shape of the pattern is, for example, a mesh and a linear lattice pattern in which straight lines (both electrodes X and Y are arranged in parallel at a predetermined pitch) are substantially orthogonal, and at least one conductive portion between intersecting portions. For example, a wavy lattice pattern having two curves, a diamond-like pattern, and the like.
In the present disclosure, the ability to improve the light resistance of the first layer makes it possible to obtain a pattern with a pitch that can cope with higher definition of display pixels and higher accuracy of touch detection. .

2. 2nd layer The 2nd layer in this indication is a layer containing resin, and is arranged on the 1st layer, ie, the surface on the opposite side to the substrate of the 1st layer, as needed. And may contain a phenolic compound. The second layer improves the durability of the first layer, the surface of which tends to be brittle.
In the present embodiment, it is preferable to have a phenolic compound in the second layer from the viewpoint of light resistance and conductivity.
Note that the second layer preferably has transparency, and the conductive material is preferably a transparent conductive material. Here, “transparent” means that, for example, when the conductive substrate of the present disclosure is used for a display device or the like, it is transparent to the extent that the visual recognition from the operator is not hindered. Therefore, “transparent” includes colorless and transparent and colored transparency that does not hinder visibility, is not defined by strict transmittance, and has a degree of transparency according to the use of the conductive substrate of the present disclosure, etc. Can be determined.

The resin material used for the second layer is not particularly limited, and for example, the same resin material as that described in the first layer can be used. Among them, a resin material containing an ionizing radiation curable resin is preferable in order to have excellent durability and to have good adhesion to the substrate. In addition, it is preferable that the resin material has transparency.
The resin material contained in the second layer and the resin material contained in the first layer may be the same or different.

  Further, the second layer may be one in which various additives are added within a range not impairing the effects of the present disclosure. Examples of the additive include those similar to the additive that can be included in the first layer, and among them, it is preferable to contain an antistatic agent. It does not specifically limit as an antistatic agent, It can select suitably from conventionally well-known things.

The thickness of the second layer is not particularly limited, but is preferably 50 nm or more, and more preferably 100 nm or more, from the viewpoint of excellent durability of the first layer. In addition, the thickness of the second layer is preferably 50 μm or less, and more preferably 10 μm or less, from the viewpoint of excellent flexibility and transparency of the conductive substrate of the present disclosure.
According to the present disclosure, the antistatic resin layer can improve light resistance while achieving both the durability of the first layer and the conductivity, flexibility, transparency, and the like of the conductive substrate. it can.

  In the electroconductive base material of this indication, it is preferable to arrange | position so that a said 2nd layer may become the outermost surface on the opposite side to the base material of an electroconductive base material. Thereby, durability of the electroconductive base material of this indication can be improved.

  Moreover, in the electroconductive base material of this indication, it is preferable that the said 2nd layer is arrange | positioned adjacent to the said 1st layer. Thereby, the durability of the conductive substrate of the present disclosure can be improved, and the conductive substrate of the present disclosure can be thinned, so that flexibility can be improved.

  When the first layer is arranged in a pattern, it is preferable that the second layer is arranged in the same pattern as the first layer.

3. Base Material The base material in the present disclosure is a member that supports the first layer and the second layer.
The base material preferably has transparency. Here, “transparent” means, for example, that it is transparent to the extent that it does not interfere with visual recognition from an operator when the conductive substrate of the present disclosure is used in a display device or the like. Therefore, “transparent” includes colorless and transparent and colored transparency that does not hinder visibility, is not defined by strict transmittance, and has a degree of transparency according to the use of the conductive substrate of the present disclosure, etc. Can be determined.

  Examples of the material constituting the base material include polyester resins such as polyethylene terephthalate, acetate resins, polyethersulfone resins, polycarbonate resins, polyamide resins, polyimide resins, polyolefin resins, and (meth) acrylic. Resin, polyvinyl chloride resin, polyvinylidene chloride resin, polystyrene resin, polyvinyl alcohol resin, polyarylate resin, polyphenylene sulfide resin, etc., among which polyester resin, polycarbonate resin, polyolefin resin Resins are preferred.

The substrate may be an amorphous olefin polymer (Cyclo-Olefin-Polymer: COP) film having an alicyclic structure. This is a base material in which a norbornene polymer, a monocyclic olefin polymer, a cyclic conjugated diene polymer, a vinyl alicyclic hydrocarbon polymer, and the like are used. Zeonoa (norbornene-based resin), Sumitrite FS-1700 manufactured by Sumitomo Bakelite, Arton (modified norbornene-based resin) manufactured by JSR, Appel (cyclic olefin copolymer) manufactured by Mitsui Chemicals, Topas (cyclic) manufactured by Ticona Olefin copolymer), Optretz OZ-1000 series (alicyclic acrylic resin) manufactured by Hitachi Chemical Co., Ltd., and the like. In addition, FV series (low birefringence, low photoelastic modulus film) manufactured by Asahi Kasei Chemicals Co., Ltd. can be used as an alternative base material for triacetylcellulose.
In addition to the materials described above, the base material may be added with various additives such as an antistatic agent within a range not impairing the effects of the present disclosure.

  The thickness of the base material can be appropriately adjusted according to the use of the conductive base material of the present disclosure, and is not particularly limited. However, because of excellent mechanical strength, the thickness is preferably 10 μm or more, and 20 μm or more. It is more preferable that the thickness is 40 μm or more. In addition, since the desired flexibility can be realized, the thickness of the base material is preferably 150 μm or less, more preferably 100 μm or less, and even more preferably 80 μm or less. , 60 μm or less is particularly preferable.

  In one embodiment of the present disclosure, the substrate may be peelable. That is, the conductive substrate of the present disclosure includes a conductive film transfer film from which the substrate can be peeled. In the present disclosure, a peelable substrate may be referred to as a support.

Such a conductive film transfer film of the present disclosure will be described with reference to the drawings. 4 and 5 are each a schematic cross-sectional view showing an example of the conductive film transfer film of the present disclosure. As shown in FIG. 4, the conductive film transfer film 20 of the present disclosure includes a support (base material) 4, a first layer 1 disposed on the support (base material) 4, and a first layer 1. And a second layer 2 disposed thereon. The conductive film transfer film of the present embodiment has improved light resistance by containing a phenolic compound in at least one of the first layer 1 and the second layer 2.
As shown in the example of FIG. 5, the conductive film transfer film 20 of one embodiment of the present disclosure has a release agent (release layer) 5 between the support (base material) 4 and the first layer 1. You may do it.

  In the present disclosure, the support is a member that supports the first layer and the second layer, and is a member that is usually peeled off during use. Therefore, the support may be transparent or opaque. It may be flexible or rigid. The thickness of the support may be selected as appropriate and is not particularly limited. As a material constituting the support, the same material as the substrate can be used.

  From the viewpoint of improving the peelability between the support and the first layer, a release agent may be applied on the support or a release layer may be formed. The release agent can be appropriately selected from conventionally known release agents such as silicone and fluorine.

  According to the conductive film transfer film of this embodiment, since the conductive film can be used with a thinner film, it contributes to thinning of the display device, and also in a flexible display device and the like in which the display portion can be flexibly deformed. It can be used suitably.

4). Hard Coat Layer The conductive substrate of the present disclosure may have a hard coat layer between the substrate and the first layer.
The hard coat layer in the present disclosure has a function of improving the mechanical strength of the conductive substrate of the present disclosure and imparting a predetermined hardness to the surface of the first layer. Here, the “predetermined hardness” refers to a hardness that can suppress, for example, the surface of the first layer from being damaged.

  The hardness of the hard coat layer is not particularly limited, but the pencil hardness of JIS K5600-5-4 (1999) on the surface of the hard coat layer is preferably 2B or more, and preferably HB or more. . Thereby, when the hard coat layer has the above-described hardness, a desired function as the hard coat layer can be sufficiently exhibited. Further, the pencil hardness of the hard coat layer is preferably 7H or less, and more preferably 5H or less.

  Such a hard coat layer preferably has transparency. “Transparent” is the same as “transparent” in the base material described above.

  The material constituting the hard coat layer in the present disclosure is preferably a material capable of exhibiting a desired function, and is not particularly limited. For example, an organic material or an inorganic material may be used, but an organic material such as an ionizing radiation curable resin is particularly preferable. Examples of the organic material such as ionizing radiation curable resin include the same materials as the resin material used for the first layer.

The thickness of the hard coat layer is preferably a thickness that can exhibit the function as the hard coat layer described above, and can be appropriately adjusted according to the use of the conductive substrate of the present disclosure. . Since the desired hardness can be realized and the function as the hard coat layer can be sufficiently exhibited, the thickness of the hard coat layer is preferably 0.1 μm or more, preferably 1 μm or more. More preferably, it is more preferably 2 μm or more. The thickness of the hard coat layer is preferably 50 μm or less, more preferably 20 μm or less, and even more preferably 10 μm or less.
In addition, the thickness of a hard-coat layer can be measured by observing using a cross-sectional microscope, for example.

The overall thickness of the conductive substrate of the present disclosure is not particularly limited, but from the point of excellent strength,
The thickness is preferably 25 μm or more, and more preferably 50 μm or more. In addition, the overall thickness of the conductive substrate of the present disclosure is excellent in flexibility and transparency.
It is preferably 500 μm or less, and more preferably 200 μm or less.

[Method for producing conductive substrate]
The manufacturing method of the electroconductive base material of this indication should just be a method which can manufacture the electroconductive base material of this indication mentioned above, and is not specifically limited. Hereinafter, specific examples of the method for producing a conductive substrate according to the present disclosure will be described with reference to the drawings.

  (A)-(d) of FIG. 3 is a schematic process drawing which shows another example of the manufacturing method of the electroconductive base material of this indication. First, as shown in FIG. 3 (a), a first layer coating composition containing metal particles and a resin material is applied on a substrate 1 to form a first layer coating film 2 ′. As shown in FIG. 3B, the first layer 1 is formed by curing the first-layer coating film 2 ′. Next, as shown in FIG. 3C, the second layer composition containing a resin material is applied to the surface of the first layer 1 to form a second layer coating film 3 ′. As shown in FIG. 3 (d), the second layer 2 is formed by curing the second layer coating film 3 '. By these steps, the conductive substrate 10 having the substrate 1, the first layer 1 on the substrate 1, and the second layer 2 on the first layer 1 can be obtained. The phenolic compound may be contained in at least one of the first layer composition and the second layer composition.

  In the present disclosure, the first layer can be obtained by curing a coating film formed using the first layer composition, if necessary. Examples of the first layer composition include those obtained by further adding a solvent to each of the components contained in the first layer. Examples of the solvent include alcohols (eg, methanol, ethanol, propanol, isopropanol, n-butanol, s-butanol, t-butanol, benzyl alcohol, PGME, ethylene glycol), ketones (acetone, methyl ethyl ketone, methyl isobutyl ketone). , Cyclohexanone, etc.), ethers (dioxane, tetrahydrofuran, etc.), aliphatic hydrocarbons (hexane, etc.), alicyclic hydrocarbons (cyclohexane, etc.), aromatic hydrocarbons (toluene, xylene, etc.), halogenated carbon (Dichloromethane, dichloroethane, etc.), esters (methyl acetate, ethyl acetate, butyl acetate, etc.), cellosolves (methyl cellosolve, ethyl cellosolve, etc.), cellosolve acetates, sulfoxides (dimethylsulfoxide, etc.) , Amides (dimethylformamide, dimethylacetamide, etc.) and the like. Moreover, as said solvent, only 1 type may be used and 2 or more types of mixtures may be used.

  When the composition for the first layer contains the solvent, the content ratio of the solid content (components other than the solvent) contained in the composition for the first layer is not particularly limited. % Or more, preferably 0.2% by mass or more. Moreover, the content rate of solid content (components other than a solvent) contained in the said 1st layer composition can be 70 mass% or less, for example, and it is preferable that it is 60 mass% or less.

  The method for preparing the first layer composition is preferably a method capable of uniformly mixing the above-described components. For example, a known apparatus such as a paint shaker, a bead mill, a kneader, or a mixer is used. The method used is mentioned.

  As a method for applying the first layer composition, a general application method can be used, and is not particularly limited. For example, a spin coating method, a dip method, a spray method, a die coating method, and a bar coating method. , Known methods such as a roll coater method, a meniscus coater method, a flexographic printing method, a screen printing method, and a pead coater method.

When the first layer composition contains a solvent, a coating film is formed by heating and drying as necessary.
The method for curing the coating film of the first layer composition is appropriately selected depending on the type of resin material contained in the first layer composition, and is not particularly limited.
For example, when the first layer composition contains an ionizing radiation curable resin, the coating film can be cured by irradiating with ionizing radiation. Examples of the light source used at this time include an ultra-high pressure mercury lamp, a high-pressure mercury lamp, a low-pressure mercury lamp, a carbon arc lamp, a black light fluorescent lamp, and a metal halide lamp.
The wavelength region of ionizing radiation can be set to 190 nm or more, for example. Moreover, the wavelength range of ionizing radiation can be 380 nm or less, for example.
Specific examples of the electron beam source include various electron beam accelerators such as a cockcroft-wald type, a bandegraft type, a resonant transformer type, an insulated core transformer type, a linear type, a dynamitron type, and a high frequency type. It is done.
When the first layer composition contains a thermosetting resin, the coating film can be cured by heating. The heating temperature can be appropriately selected depending on the type of resin, and is not particularly limited, but may be, for example, 50 ° C. or higher.

In the present disclosure, the second layer is obtained by curing a coating film formed using the second layer composition as necessary. As said 2nd layer composition, what added the solvent further to each component contained in the said 2nd layer mentioned above is mentioned, for example. As said solvent, the thing similar to the solvent used for a said 1st layer composition is mentioned, for example.
When the composition for the second layer contains a solvent, the content ratio of the solid content (components other than the solvent) contained in the composition for the second layer is the same as that of the composition for the first layer. be able to.
Each of the method for preparing the second layer composition, the method for applying the second layer composition, the method for forming a coating film, and the method for curing the second layer composition As for the method, the same methods as the respective methods of the first layer composition may be mentioned.

In the conductive substrate of the present disclosure, the first layer may be formed in a pattern.
The method of patterning treatment for forming the first layer in a pattern is not particularly limited and can be performed by a known method, for example, a photolithography method. Specifically, when patterning the first layer, a photoresist is applied to the surface of the first layer opposite to the substrate, for example, the surface of the second layer, and a photomask having a predetermined pattern is applied. By performing development using a developer such as an alkaline solution, forming a resist pattern, and further etching the first layer which is unnecessary by a wet or dry etching method, and then removing the resist. A first layer having a predetermined pattern can be formed.

  Furthermore, in the conductive substrate of the present disclosure, for example, a step of forming a hard coat layer on the substrate, and a second layer is further formed on the surface of the first layer on the substrate side, if necessary. The above-described steps such as a step to perform may have other steps.

  The electroconductive base material of this indication can be used as transparent electrodes, such as displays, such as a liquid crystal display (LCD) and a plasma display (PDP), a touch panel, and a solar cell, for example.

[Display device]
The display device of the present disclosure includes a first layer and a second layer on the first layer,
The first layer includes a resin and at least one metal particle selected from silver particles and copper particles,
The second layer includes a resin,
At least one of the first layer and the second layer includes a conductive film containing a phenolic compound.
In the display device of the present disclosure, light resistance is improved by including a phenolic compound in at least one of the first layer and the second layer.

As the display device of the present disclosure, for example, the conductive substrate of the present disclosure described above or the conductive film obtained by peeling the support from the conductive film transfer film of the present disclosure described above is provided as an electrode substrate. The thing provided with the touchscreen in the image display surface is mentioned.
Specifically, for example, there is a touch panel in which two of the conductive base material or the electrode base material that is a conductive film of the present disclosure are arranged with the electrodes facing each other at a constant interval via a spacer. The other parts of the touch panel can employ various configurations of conventionally known various types of touch panels.
When the first layer of the conductive substrate or conductive film transfer film according to the present disclosure is patterned and has a first layer formation region and a first layer non-formation region, the first layer This layer functions as a wiring for coordinate recognition, for example, and is suitably used for a capacitive touch panel.

  As shown in FIG. 6, the display device 30 of the present disclosure includes a touch panel 20 that includes a conductive base material or a conductive film obtained from a conductive film transfer film according to the present disclosure as an electrode base material. It has the structure which arranges on the surface. In the display device 30 of the present disclosure, the touch panel 20 may be bonded to the display panel 31 via an adhesive layer, or the display panel 31 using a flat panel display such as an LCD is formed with a gap between the touch panel 20. It may be arranged. Note that the display device of the present disclosure may be a device having only a display function, or may be a device having a display function as a part of the function of the device. As a device having only a display function, an FPD (flat panel display) such as an LCD (liquid crystal display), an ELD (electroluminescent display), a PDP (plasma display), or a CRT is used for a display panel. The apparatus etc. which were used are mentioned. As a device having a display function as a part of the function of the device, for example, a PDA such as an electronic notebook or a portable information terminal (device), a car navigation system, a POS (point of sale information management) terminal, a portable order input terminal , ATM (automatic cash deposit machine), facsimile, fixed telephone terminal, mobile phone terminal, digital camera, video camera, personal computer, personal computer display, television receiver, television monitor display, ticket vending machine, measuring instrument, calculator And electronic devices such as electronic musical instruments, office machines such as copiers and ECR (cash registering machines), and electrical products such as washing machines and microwave ovens.

  Hereinafter, the present disclosure will be specifically described with reference to examples.

[Example 1]
(1) Formation of metal-containing layer (first layer) On a polyethylene terephthalate film (thickness: 50 μm) as a substrate, silver nanowires (short axis length: 35 ± 15 nm, long axis length: 15 μm, Blueano) SLV-NW-35) is about 0.01 wt%, tetrakis epoxysiloxane is 0.01 wt%, (n-pyrrolidonepropyl) methylsiloxane-dimethylsiloxane copolymer is 0.2 wt%, and isopropyl alcohol is 39.78 wt%. A metal-containing layer composition containing 30% by weight of 1%, 1-butanol and 30% by weight of cyclohexane was applied using a die coating method to form a wet coating film (thickness: 12 μm). Thereafter, the coating film formed on the substrate was oven heated at 70 ° C. for 1 minute to form a metal-containing layer.

(2) Formation of resin layer (second layer) Next, on the obtained metal-containing layer, BS-1200W (produced by Arakawa Chemical Co., Ltd.), which is an ultraviolet curable material, is 20 wt%, DL-α. -The composition for resin layers containing 0.1 wt% of tocopherol, 15 wt% of cyclohexanone, and 65 wt% of methyl ethyl ketone was applied using a die coating method to form a wet coating (thickness: 1 µm). Thereafter, the resin is heated in an oven at 70 ° C. for 1 minute, and cured with ultraviolet rays so that the exposure amount at a wavelength of 365 nm is 180 mJ / cm ² with a metal halide lamp (metal halide lamp MJ-1500L manufactured by Harrison Toshiba Lighting Co., Ltd.). The layer was formed and the electroconductive base material of Example 1 was obtained.

[Example 2]
In Example 1, instead of DL-α-tocopherol, Example 1 was used except that the compound represented by the chemical formula (1) (2,4-bis (dodecylthiomethyl) -6-methylphenol) was used. In the same manner, a conductive substrate of Example 2 was obtained.

[Example 3]
In Example 1, Example 1 was used except that instead of DL-α-tocopherol, the compound represented by the chemical formula (2) (2,4-bis (octylthiomethyl) -o-cresol) was used. Similarly, the conductive substrate of Example 3 was obtained.

[Example 4]
In Example 1, instead of DL-α-tocopherol, the compound represented by the chemical formula (3) (2 ′, 3-bis [3- [3,5-ditertiarybutyl-4-hydroxyphenyl] propionyl] A conductive substrate of Example 4 was obtained in the same manner as Example 1 except that propionhydrazine) was used.

[Comparative Example 1]
In Example 1, the electroconductive base material of the comparative example 1 was obtained like Example 1 except not having used DL- (alpha) -tocopherol.

[Comparative Example 2]
In Example 1, in place of DL-α-tocopherol, 6- (dibutylamino) -1,3,5-triazine-2,4-dithiol was used in the same manner as in Example 1 and Comparative Example 2 conductive substrates were obtained.

<Light resistance evaluation>
Each conductive base material obtained in the examples and comparative examples was cut into a square of 5 cm on each side to obtain a film test piece, using a xenon light resistance tester Q-SUN (manufactured by Q-Lab Corporation). Light irradiation was performed under the following conditions.
Strength: 1.5 W / m ²
Irradiation light wavelength: 420 nm
Temperature: 25 ° C
Humidity: 40%
Time: 100 hours

The sheet resistance values before and after the light irradiation were measured by the following method for each of the conductive substrates of Examples and Comparative Examples. The results are shown in Table 1.
The light resistance test was repeated three times, and the resistance value was an average value.
(Sheet resistance measurement method)
About the film test piece produced above, the sheet resistance was measured before and after the xenon light resistance test using an eddy current type resistivity meter EC-80P (Napson Co., Ltd.) to evaluate the light resistance of the conductive layer.

[Summary of results]
It became clear that the conductive base materials of Examples 1 to 4 having the second layer containing the phenolic compound are suppressed in the resistance value even after light irradiation and are excellent in light resistance. It was.

DESCRIPTION OF SYMBOLS 1 1st layer 1a Conductive part 1 '1st layer coating film 2 2nd layer 2' 2nd layer coating film 3 Base material 4 Support body (base material)
5 Release agent (release layer)
10 conductive substrate 20 conductive film transfer film (conductive substrate)
30 Touch Panel 31 Display Panel 100 Display Device

Claims (6)

A substrate, a first layer on the substrate, and a second layer on the first layer;
The first layer includes a resin and at least one metal particle selected from silver particles and copper particles,
The second layer includes a resin,
The conductive substrate in which at least one of the first layer and the second layer contains a phenol-based compound.   The conductive substrate according to claim 1, wherein the metal particles include silver nanowires having an aspect ratio of 5 or more.   The phenol compound is at least one selected from the group consisting of a nitrogen atom and a phenol compound having one or more atoms selected from sulfur atoms, a tocopherol compound, and a tocotrienol compound. The electroconductive base material of Claim 1 or 2.   The conductive substrate according to any one of claims 1 to 3, wherein the first layer has a pattern shape. A conductive substrate according to any one of claims 1 to 4,
A conductive film transfer film from which the substrate can be peeled. A first layer and a second layer on the first layer;
The first layer includes a resin and at least one metal particle selected from silver particles and copper particles,
The second layer includes a resin,
A display device, wherein at least one of the first layer and the second layer includes a conductive film containing a phenol compound.

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