JP2017208574A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2017208574A5 JP2017208574A5 JP2017157704A JP2017157704A JP2017208574A5 JP 2017208574 A5 JP2017208574 A5 JP 2017208574A5 JP 2017157704 A JP2017157704 A JP 2017157704A JP 2017157704 A JP2017157704 A JP 2017157704A JP 2017208574 A5 JP2017208574 A5 JP 2017208574A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- type
- imaging device
- disposed
- impurity concentration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 63
- 238000003384 imaging method Methods 0.000 claims 13
- 239000012535 impurity Substances 0.000 claims 8
- 230000003595 spectral Effects 0.000 claims 6
Claims (13)
複数の前記N型半導体のうち、第1分光特性を有するフィルタからの光が入射される第1半導体と、 Of the plurality of N-type semiconductors, a first semiconductor into which light from a filter having a first spectral characteristic is incident;
複数の前記N型半導体のうち前記第1半導体から第1方向において配置され、前記第1分光特性とは異なる第2分光特性を有するフィルタからの光が入射される第2半導体と、 A second semiconductor that is arranged in a first direction from the first semiconductor among the plurality of N-type semiconductors, and receives light from a filter having a second spectral characteristic different from the first spectral characteristic;
複数の前記N型半導体のうち前記第1半導体から前記第1方向と交差する第2方向において配置され、前記第1分光特性及び前記第2分光特性とは異なる第3分光特性を有するフィルタからの光が入射される第3半導体と、 The filter is disposed in a second direction intersecting the first direction from the first semiconductor among the plurality of N-type semiconductors, and has a third spectral characteristic different from the first spectral characteristic and the second spectral characteristic. A third semiconductor on which light is incident;
前記P型半導体において前記第1半導体と前記第2半導体との間に配置され、前記第1面から前記第2面に向かう方向に延伸した第4半導体と、 A fourth semiconductor disposed between the first semiconductor and the second semiconductor in the P-type semiconductor and extending in a direction from the first surface toward the second surface;
前記P型半導体において前記第1半導体と前記第3半導体との間に配置され、前記第1面から前記第2面に向かう方向に前記第4半導体よりも延伸した第5半導体と、 A fifth semiconductor disposed between the first semiconductor and the third semiconductor in the P-type semiconductor and extending from the first surface toward the second surface than the fourth semiconductor;
を備える撮像素子。An imaging device comprising:
前記P型半導体において前記第2半導体が配置された領域よりも前記第2面側の領域に配置され、前記第2半導体とは異なる導電型の第7半導体と、 A seventh semiconductor having a conductivity type different from that of the second semiconductor disposed in a region closer to the second surface than the region where the second semiconductor is disposed in the P-type semiconductor;
を備える請求項1又は請求項2に記載の撮像素子。An imaging device according to claim 1 or claim 2, comprising:
前記第7半導体は、前記P型半導体において前記第2面側における前記第4半導体の端部と接している請求項9に記載の撮像素子。 The imaging device according to claim 9, wherein the seventh semiconductor is in contact with an end portion of the fourth semiconductor on the second surface side in the P-type semiconductor.
前記第7半導体は、前記P型半導体の不純物濃度よりも高い不純物濃度を有する請求項9から請求項11のいずれか一項に記載の撮像素子。 The imaging device according to any one of claims 9 to 11, wherein the seventh semiconductor has an impurity concentration higher than an impurity concentration of the P-type semiconductor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017157704A JP2017208574A (en) | 2017-08-17 | 2017-08-17 | Imager and imaging apparatus with imager |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017157704A JP2017208574A (en) | 2017-08-17 | 2017-08-17 | Imager and imaging apparatus with imager |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013039918A Division JP6194598B2 (en) | 2013-02-28 | 2013-02-28 | Image pickup device and image pickup apparatus including image pickup device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017208574A JP2017208574A (en) | 2017-11-24 |
JP2017208574A5 true JP2017208574A5 (en) | 2018-01-11 |
Family
ID=60415687
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017157704A Pending JP2017208574A (en) | 2017-08-17 | 2017-08-17 | Imager and imaging apparatus with imager |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2017208574A (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020088293A (en) * | 2018-11-29 | 2020-06-04 | キヤノン株式会社 | Photoelectric conversion device, photoelectric conversion system, and moving body |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004152819A (en) * | 2002-10-29 | 2004-05-27 | Toshiba Corp | Solid-state image sensing device and its manufacturing method |
JP2005209695A (en) * | 2004-01-20 | 2005-08-04 | Toshiba Corp | Solid-state image sensing device and its manufacturing method |
JP2007115787A (en) * | 2005-10-18 | 2007-05-10 | Nikon Corp | Solid-state imaging element |
JP2007201267A (en) * | 2006-01-27 | 2007-08-09 | Fujifilm Corp | Solid state imaging element and its fabrication process |
JP4960058B2 (en) * | 2006-10-04 | 2012-06-27 | 株式会社東芝 | Amplification type solid-state image sensor |
KR100821469B1 (en) * | 2006-10-13 | 2008-04-11 | 매그나칩 반도체 유한회사 | Small size cmos image sensor pixel with improved color cross talk and method for fabricating the same |
JP2008182076A (en) * | 2007-01-25 | 2008-08-07 | Matsushita Electric Ind Co Ltd | Solid-state imaging device and its manufacturing method |
US7915652B2 (en) * | 2008-10-24 | 2011-03-29 | Sharp Laboratories Of America, Inc. | Integrated infrared and color CMOS imager sensor |
EP2180513A1 (en) * | 2008-10-27 | 2010-04-28 | Stmicroelectronics SA | Near infrared/color image sensor |
JP5558857B2 (en) * | 2009-03-09 | 2014-07-23 | キヤノン株式会社 | Photoelectric conversion device and imaging system using the same |
JP2010245100A (en) * | 2009-04-01 | 2010-10-28 | Nikon Corp | Solid-state imaging element |
JP5522980B2 (en) * | 2009-06-18 | 2014-06-18 | キヤノン株式会社 | Solid-state imaging device, imaging system using solid-state imaging device, and manufacturing method of solid-state imaging device |
-
2017
- 2017-08-17 JP JP2017157704A patent/JP2017208574A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2015188049A5 (en) | ||
EP4254502A3 (en) | Solid-state imaging device | |
JP2015122525A5 (en) | ||
JP2013149757A5 (en) | ||
WO2015147963A3 (en) | Anti-reflection layer for back-illuminated sensor | |
JP2015012174A5 (en) | ||
JP2014195063A5 (en) | ||
EP2978023A3 (en) | Photoelectronic device and image sensor | |
EP2978022A3 (en) | Visible and infrared image sensor | |
JP2015162646A5 (en) | ||
JP2011003608A5 (en) | ||
JP2013149740A5 (en) | ||
JP2011118887A5 (en) | Semiconductor device and display device | |
EP2978021A3 (en) | Imaging device and method for driving the same | |
JP2013239725A5 (en) | ||
JP2014003243A5 (en) | ||
JP2015103606A5 (en) | ||
JP2016184624A5 (en) | ||
JP2012175067A5 (en) | ||
JP2019145619A5 (en) | ||
EP3435416A3 (en) | Imaging device | |
JP2017005145A5 (en) | ||
JP2015153787A5 (en) | ||
JP2017162886A5 (en) | ||
WO2015048304A3 (en) | LOW NOISE InGaAs PHOTODIODE ARRAY |