JP2017208574A5 - - Google Patents

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JP2017208574A5
JP2017208574A5 JP2017157704A JP2017157704A JP2017208574A5 JP 2017208574 A5 JP2017208574 A5 JP 2017208574A5 JP 2017157704 A JP2017157704 A JP 2017157704A JP 2017157704 A JP2017157704 A JP 2017157704A JP 2017208574 A5 JP2017208574 A5 JP 2017208574A5
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semiconductor
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imaging device
disposed
impurity concentration
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JP2017157704A
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JP2017208574A (en
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Priority to JP2017157704A priority Critical patent/JP2017208574A/en
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Claims (13)

光が入射される第1面と前記第1面とは反対の第2面とを有するP型半導体においてN型半導体が複数配置された撮像素子であって、An image sensor in which a plurality of N-type semiconductors are arranged in a P-type semiconductor having a first surface on which light is incident and a second surface opposite to the first surface,
複数の前記N型半導体のうち、第1分光特性を有するフィルタからの光が入射される第1半導体と、  Of the plurality of N-type semiconductors, a first semiconductor into which light from a filter having a first spectral characteristic is incident;
複数の前記N型半導体のうち前記第1半導体から第1方向において配置され、前記第1分光特性とは異なる第2分光特性を有するフィルタからの光が入射される第2半導体と、  A second semiconductor that is arranged in a first direction from the first semiconductor among the plurality of N-type semiconductors, and receives light from a filter having a second spectral characteristic different from the first spectral characteristic;
複数の前記N型半導体のうち前記第1半導体から前記第1方向と交差する第2方向において配置され、前記第1分光特性及び前記第2分光特性とは異なる第3分光特性を有するフィルタからの光が入射される第3半導体と、  The filter is disposed in a second direction intersecting the first direction from the first semiconductor among the plurality of N-type semiconductors, and has a third spectral characteristic different from the first spectral characteristic and the second spectral characteristic. A third semiconductor on which light is incident;
前記P型半導体において前記第1半導体と前記第2半導体との間に配置され、前記第1面から前記第2面に向かう方向に延伸した第4半導体と、  A fourth semiconductor disposed between the first semiconductor and the second semiconductor in the P-type semiconductor and extending in a direction from the first surface toward the second surface;
前記P型半導体において前記第1半導体と前記第3半導体との間に配置され、前記第1面から前記第2面に向かう方向に前記第4半導体よりも延伸した第5半導体と、  A fifth semiconductor disposed between the first semiconductor and the third semiconductor in the P-type semiconductor and extending from the first surface toward the second surface than the fourth semiconductor;
を備える撮像素子。An imaging device comprising:
前記第4半導体及び前記第5半導体は、前記P型半導体の不純物濃度よりも高い不純物濃度を有する請求項1に記載の撮像素子。The imaging device according to claim 1, wherein the fourth semiconductor and the fifth semiconductor have an impurity concentration higher than an impurity concentration of the P-type semiconductor. 前記P型半導体において前記第1半導体が配置された領域よりも前記第2面側の領域に配置され、前記第1半導体とは異なる導電型の第6半導体を備える請求項1又は請求項2に記載の撮像素子。3. The semiconductor device according to claim 1, further comprising a sixth semiconductor having a conductivity type different from that of the first semiconductor and disposed in a region closer to the second surface than the region where the first semiconductor is disposed in the P-type semiconductor. The imaging device described. 前記第6半導体は、前記P型半導体において前記第2面側における前記第4半導体の端部と接している請求項3に記載の撮像素子。The imaging device according to claim 3, wherein the sixth semiconductor is in contact with an end portion of the fourth semiconductor on the second surface side in the P-type semiconductor. 前記第6半導体は、前記P型半導体の不純物濃度よりも高い不純物濃度を有する請求項3又は請求項4に記載の撮像素子。The imaging device according to claim 3, wherein the sixth semiconductor has an impurity concentration higher than that of the P-type semiconductor. 前記P型半導体において前記第2半導体が配置された領域よりも前記第2面側の領域に配置され、前記第2半導体とは異なる導電型の第7半導体を備える請求項1から請求項5のいずれか一項に記載の撮像素子。6. The semiconductor device according to claim 1, further comprising a seventh semiconductor having a conductivity type different from that of the second semiconductor and disposed in a region closer to the second surface than a region where the second semiconductor is disposed in the P-type semiconductor. The imaging device according to any one of the above. 前記第7半導体は、前記P型半導体において前記第2面側における前記第5半導体の端部と接している請求項6に記載の撮像素子。The imaging device according to claim 6, wherein the seventh semiconductor is in contact with an end portion of the fifth semiconductor on the second surface side in the P-type semiconductor. 前記第7半導体は、前記P型半導体の不純物濃度よりも高い不純物濃度を有する請求項6又は請求項7に記載の撮像素子。The imaging device according to claim 6, wherein the seventh semiconductor has an impurity concentration higher than an impurity concentration of the P-type semiconductor. 前記P型半導体において前記第1半導体が配置された領域よりも前記第2面側の領域に配置され、前記第1半導体とは異なる導電型の第6半導体と、A sixth semiconductor having a conductivity type different from that of the first semiconductor, disposed in a region closer to the second surface than the region where the first semiconductor is disposed in the P-type semiconductor;
前記P型半導体において前記第2半導体が配置された領域よりも前記第2面側の領域に配置され、前記第2半導体とは異なる導電型の第7半導体と、  A seventh semiconductor having a conductivity type different from that of the second semiconductor disposed in a region closer to the second surface than the region where the second semiconductor is disposed in the P-type semiconductor;
を備える請求項1又は請求項2に記載の撮像素子。An imaging device according to claim 1 or claim 2, comprising:
前記第6半導体は、前記P型半導体において前記第2面側における前記第4半導体の端部と接し、The sixth semiconductor is in contact with an end of the fourth semiconductor on the second surface side in the P-type semiconductor;
前記第7半導体は、前記P型半導体において前記第2面側における前記第4半導体の端部と接している請求項9に記載の撮像素子。  The imaging device according to claim 9, wherein the seventh semiconductor is in contact with an end portion of the fourth semiconductor on the second surface side in the P-type semiconductor.
前記第6半導体と前記第7半導体とは、前記P型半導体において互いに離れて配置されている請求項9又は請求項10に記載の撮像素子。  The imaging device according to claim 9 or 10, wherein the sixth semiconductor and the seventh semiconductor are arranged apart from each other in the P-type semiconductor. 前記第6半導体は、前記P型半導体の不純物濃度よりも高い不純物濃度を有し、The sixth semiconductor has an impurity concentration higher than that of the P-type semiconductor;
前記第7半導体は、前記P型半導体の不純物濃度よりも高い不純物濃度を有する請求項9から請求項11のいずれか一項に記載の撮像素子。  The imaging device according to any one of claims 9 to 11, wherein the seventh semiconductor has an impurity concentration higher than an impurity concentration of the P-type semiconductor.
請求項1から請求項12のいずれか一項に記載の撮像素子を備えた撮像装置。The imaging device provided with the image pick-up element as described in any one of Claims 1-12.
JP2017157704A 2017-08-17 2017-08-17 Imager and imaging apparatus with imager Pending JP2017208574A (en)

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JP2017157704A JP2017208574A (en) 2017-08-17 2017-08-17 Imager and imaging apparatus with imager

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JP2013039918A Division JP6194598B2 (en) 2013-02-28 2013-02-28 Image pickup device and image pickup apparatus including image pickup device

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JP2017208574A JP2017208574A (en) 2017-11-24
JP2017208574A5 true JP2017208574A5 (en) 2018-01-11

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JP2020088293A (en) * 2018-11-29 2020-06-04 キヤノン株式会社 Photoelectric conversion device, photoelectric conversion system, and moving body

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JP2004152819A (en) * 2002-10-29 2004-05-27 Toshiba Corp Solid-state image sensing device and its manufacturing method
JP2005209695A (en) * 2004-01-20 2005-08-04 Toshiba Corp Solid-state image sensing device and its manufacturing method
JP2007115787A (en) * 2005-10-18 2007-05-10 Nikon Corp Solid-state imaging element
JP2007201267A (en) * 2006-01-27 2007-08-09 Fujifilm Corp Solid state imaging element and its fabrication process
JP4960058B2 (en) * 2006-10-04 2012-06-27 株式会社東芝 Amplification type solid-state image sensor
KR100821469B1 (en) * 2006-10-13 2008-04-11 매그나칩 반도체 유한회사 Small size cmos image sensor pixel with improved color cross talk and method for fabricating the same
JP2008182076A (en) * 2007-01-25 2008-08-07 Matsushita Electric Ind Co Ltd Solid-state imaging device and its manufacturing method
US7915652B2 (en) * 2008-10-24 2011-03-29 Sharp Laboratories Of America, Inc. Integrated infrared and color CMOS imager sensor
EP2180513A1 (en) * 2008-10-27 2010-04-28 Stmicroelectronics SA Near infrared/color image sensor
JP5558857B2 (en) * 2009-03-09 2014-07-23 キヤノン株式会社 Photoelectric conversion device and imaging system using the same
JP2010245100A (en) * 2009-04-01 2010-10-28 Nikon Corp Solid-state imaging element
JP5522980B2 (en) * 2009-06-18 2014-06-18 キヤノン株式会社 Solid-state imaging device, imaging system using solid-state imaging device, and manufacturing method of solid-state imaging device

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