JP2017208485A - Mounting method of electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a mounting method of electronic component, capable of reducing cost by a convenient process.SOLUTION: A mounting method of electronic component sequentially performs a first adhesive part formation step of forming a first adhesive part 3 by imparting stickiness to the surface of a first conductive electrode 2 provided in a first member 1, a solder powder attachment step of attaching solder powder 4 to the first adhesive part, an electrode pushing step of pushing a second conductive electrode 6 provided in a second member 5 against the first conductive electrode 2 to which the solder powder 4 is attached, and a joining step of thermally fusing the solder powder 4 and joining the first conductive electrode 2 and second conductive electrode 6 by a solder 7.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic component mounting method.

  In recent years, after forming a circuit pattern on a plastic substrate, a ceramic substrate, or an insulating substrate coated with plastic, an electronic component such as an IC element or semiconductor chip is mounted on the circuit pattern by soldering. Has been.

  When mounting an electronic component, as a method of joining the lead terminal of the electronic component to a predetermined portion of the circuit pattern, a solder layer is formed in advance on the surface of the circuit pattern on the insulating substrate, and the solder layer A method is known in which solder paste or flux is printed on a predetermined portion above, and then the electronic component is placed on the solder layer while repositioning the lead terminal and the solder paste, and then reflowed to perform soldering. Yes. Also, mounting by flip chip bonder is known in which the solder layer formed on the solder substrate and the gold stud bump formed on the bare chip side are superposed and heated while applying pressure to melt the solder and mount the bare chip. Yes.

  In Patent Document 1, a resist forming step of partially covering a surface of a conductive circuit electrode on a printed wiring board with a resist, and a portion of the surface of the conductive circuit electrode that is not covered with a resist are provided with adhesiveness to adhere. An adhesive part forming step for forming the part, a solder attaching step for attaching the solder powder to the adhesive part, a resist removing step for removing the resist, and a first heating step for heating the printed wiring board to melt the solder powder; A method for manufacturing a solder circuit board is sequentially disclosed. Further, Patent Document 1 includes an electronic component placing step for placing an electronic component on a solder circuit board, and an electronic component joining step for reflowing solder powder to join the electrode part of the electronic component and the solder circuit board. An electronic component mounting method including the same is disclosed.

JP 2014-204070 A

  However, there is a need for an electronic component mounting method capable of reducing costs through a simpler process than ever.

  An object of one embodiment of the present invention is to solve the above problems and provide an electronic component mounting method capable of reducing costs through a simple process.

The inventor of the present invention has reached the present invention as a result of diligent efforts to solve the above problems. That is, the present invention relates to the following.
(1) a first adhesive part forming step of forming adhesiveness on the surface of the first conductive electrode provided on the first member to form the first adhesive part; and the first adhesive part A solder powder attaching step for attaching solder powder, an electrode pressing step for pressing a second conductive electrode provided on a second member against the first conductive electrode to which the solder powder is attached, and the solder A method for mounting an electronic component, comprising sequentially performing a joining step of thermally melting powder and joining the first conductive electrode and the second conductive electrode with solder.
(2) Before the electrode pressing step, a second adhesive portion forming step for forming a second adhesive portion by applying adhesiveness to the surface of the second conductive electrode is provided. The electronic component mounting method according to (1).
(3) The electronic component mounting method according to (1) or (2), wherein the first conductive electrode is a metal bump electrode or a metal foil electrode.
(4) The first member is any one of (1) to (3), wherein the first member is a glass substrate, a ceramic substrate, a resin substrate, a semiconductor substrate, an electronic component, a device chip, or a wafer. Electronic component mounting method.
(5) The first conductive electrode is a copper electrode or a copper alloy electrode, and in the first adhesive part forming step, the first conductive electrode and the adhesive are formed in the first adhesive part forming step. By the reaction with the property-imparting compound, tackiness is imparted to the surface of the first conductive electrode. The electronic component mounting method according to any one of (1) to (4), wherein the electronic component mounting method is one or more selected from the group consisting of mercaptobenzothiazole derivatives and benzothiazole thiofatty acid derivatives.
(6) Before the first adhesive part forming step, a resist forming step is provided to partially cover the surface of the first conductive electrode with a resist, and among the surfaces of the first conductive electrode, The electronic component mounting method according to any one of (1) to (5), wherein the first adhesive portion is formed by imparting the adhesiveness to a portion not covered with the resist.
(7) The electronic component mounting method according to (6), wherein a resist removing step for removing the resist is provided after the first adhesive portion forming step.
(8) The electronic component mounting method according to any one of (1) to (7), wherein the joining step is performed in a reducing gas atmosphere.
(9) In any one of (1) to (8), a flux application step of applying a flux to the solder powder is provided after the solder powder attaching step and before the joining step. The electronic component mounting method described.
(10) The solder powder is Sn—Pb solder powder, and the heating temperature when the solder powder is melted by heat is within a range of 190 ° C. to 350 ° C. (1) to (9) The electronic component mounting method according to any one of the above.
(11) The solder powder is Sn-Ag solder powder, and the heating temperature when the solder powder is thermally melted is in the range of 230 ° C to 350 ° C. (1) to (9) The electronic component mounting method according to any one of the above.
(12) The solder powder is Sn-Bi based solder powder, and the heating temperature when the solder powder is thermally melted is in the range of 150 ° C to 350 ° C (1) to (9) The electronic component mounting method according to any one of the above.

  According to one embodiment of the present invention, it is possible to provide an electronic component mounting method capable of reducing costs through a simple process.

It is sectional drawing which shows the mounting method of the electronic component which is embodiment of this invention. It is sectional drawing which shows the mounting method of the electronic component which is embodiment of this invention. It is sectional drawing which shows the mounting method of the electronic component which is embodiment of this invention. It is sectional drawing which shows the mounted electronic component which is embodiment of this invention.

  Hereinafter, an electronic component mounting method according to an embodiment of the present invention will be described with reference to the drawings. The drawings used in the following description are schematic, and the length, width, thickness ratio, and the like are not necessarily the same as the actual ones.

  FIG. 1 shows an electronic component mounting method according to an embodiment of the present invention.

  In the electronic component mounting method of the present embodiment, the first adhesive portion 3 is formed by applying adhesiveness to the surface of the first conductive electrode 2 (see FIG. 1A) provided on the first member 1. A first pressure-sensitive adhesive portion forming step (see FIG. 1B), a solder powder attaching step of attaching the solder powder 4 to the first pressure-sensitive adhesive portion 3 (see FIG. 1C), and a solder powder 4 An electrode pressing step (see FIG. 1D) for pressing the second conductive electrode 6 provided on the second member 5 against the first conductive electrode 2 to which the solder adheres; The joining process (refer FIG.1 (e)) which fuse | melts and joins the 1st conductive electrode 2 and the 2nd conductive electrode 6 with the solder 7 is performed sequentially. By employing the electronic component mounting method of the present embodiment, the electronic component can be mounted in a simple process, so that the cost can be reduced.

  The first member 1 (provided with the first conductive electrode 2) is a member for mounting an electronic component. As the first member 1 (provided with the first conductive electrode 2), For example, a glass substrate, a ceramic substrate, a resin substrate, a semiconductor substrate, an electronic component, a device chip, and a wafer are used. The first member 1 (provided with the first conductive electrode 2) uses the first conductive electrode 2 to supply an electric signal or the like to the electronic component, or to send an electric signal or the like from the electronic component. Is taken out.

  When a glass substrate, a ceramic substrate, a resin substrate, a semiconductor substrate, or a wafer is used as the first member 1, a circuit pattern is formed on the surface of the first member 1, and a part of the formed circuit pattern is It corresponds to the first conductive electrode 2.

  Examples of the material of the first conductive electrode 2 include copper and a copper alloy, but are not limited thereto, and any conductive material can be used as long as it can impart tackiness with a tackifier compound described later. In addition to copper and copper alloys, conductive materials that can impart tackiness with tackifying compounds include substances including, for example, Ni, Sn, Ni-P, solder alloys, and the like.

  Further, the first conductive electrode 2 may be a metal bump electrode or a metal foil electrode.

  Next, a 1st adhesion part formation process (refer FIG.1 (b)) is demonstrated. Specifically, the first adhesive electrode 3 is formed by imparting adhesiveness to the surface of the first conductive electrode 2 by a reaction between the first conductive electrode 2 and the tackifier compound.

  In the electronic component mounting method of the present embodiment, it is preferable to use a tackifying compound that is highly reactive with the conductive material of the first conductive electrode 2. When copper or a copper alloy is used as a conductive substance that can be tackified by the tackifier compound, examples of the tackifier compound include benzotriazole derivatives, naphthotriazole derivatives, imidazole derivatives, and benzimidazole derivatives. , Mercaptobenzothiazole derivatives, and benzothiazole thio fatty acids, which may be used in combination of two or more. Although these tackifying compounds have a particularly high reactivity with copper, they can impart tackiness to other conductive substances.

  In the electronic component mounting method of the present embodiment, the benzotriazole derivative suitably used is represented by the general formula

(However, R1 to R4 are each independently a hydrogen atom, an alkyl group having 1 to 16 carbon atoms, an alkoxy group, F, Br, Cl, I, a cyano group, an amino group, or an OH group.)
It is a compound represented by these.

  In general, the compound represented by the general formula (1) becomes more tacky as the number of carbon atoms of R1 to R4 increases. Therefore, it is preferable that the carbon number of R1-R4 is 5-16.

  In the electronic component mounting method of the present embodiment, the naphthotriazole derivative suitably used is represented by the general formula

(However, R5 to R10 are each independently a hydrogen atom, an alkyl group having 1 to 16 carbon atoms, preferably an alkyl group having 5 to 16 carbon atoms, an alkoxy group, F, Br, Cl, I, a cyano group, an amino group. Group or OH group.)
It is a compound represented by these.

  In the electronic component mounting method of the present embodiment, the imidazole derivative suitably used is a general formula.

(However, R11 and R12 are each independently a hydrogen atom, an alkyl group having 1 to 16 carbon atoms, an alkoxy group, F, Br, Cl, I, a cyano group, an amino group, or an OH group.)
It is a compound represented by these.

  In the electronic component mounting method of the present embodiment, the benzimidazole derivative suitably used is represented by the general formula

(However, R13 to R17 are each independently a hydrogen atom, an alkyl group having 1 to 16 carbon atoms, an alkoxy group, F, Br, Cl, I, a cyano group, an amino group, or an OH group.)
It is a compound represented by these.

  Also about the compound represented by General formula (3) and General formula (4), adhesiveness becomes strong, so that carbon number of R11-R17 increases. Therefore, it is preferable that the carbon number of R11-R17 is 5-16.

  In the electronic component mounting method of the present embodiment, the mercaptobenzothiazole derivative suitably used is a general formula.

(However, R18 to R21 are each independently a hydrogen atom, an alkyl group having 1 to 16 carbon atoms, preferably an alkyl group having 5 to 16 carbon atoms, an alkoxy group, F, Br, Cl, I, a cyano group, an amino group. Group or OH group.)
It is a compound represented by these.

  In the electronic component mounting method of the present embodiment, the benzothiazole thio fatty acid derivative suitably used is a general formula

(However, R22 to R26 are each independently a hydrogen atom, an alkyl group having 1 to 16 carbon atoms, preferably an alkyl group having 1 or 2 carbon atoms, an alkoxy group, F, Br, Cl, I, a cyano group, an amino group. Group or OH group.)
It is a compound represented by these.

  The tackifying compound is preferably dissolved in water or acidic water, and preferably reacted in a state where the pH is adjusted to slightly acidic at about 3 to 4.

  As the substance used for adjusting the pH of the tackifier compound solution, when the conductive substance is a metal, for example, inorganic acid such as hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, or formic acid, acetic acid, propionic acid, malic acid And organic acids such as oxalic acid, malonic acid, succinic acid, tartaric acid.

  The concentration of the tackifying compound in the tackifying compound solution may be set as appropriate according to solubility and use conditions, and is not strictly limited, but is in the range of 0.05% by mass to 20% by mass. It is preferable to be inside. When the concentration of the tackifying compound in the tackifying compound solution is 0.05% by mass or more, the first adhesive part 3 is sufficiently formed, and when it is 20% by mass or less, the tackifying compound is treated. It becomes easy.

  The first member 1 provided with the first conductive electrode 2 (see FIG. 1A) is immersed in the tackifying compound solution, or the tackifying compound is formed on the surface of the first conductive electrode 2. By injecting the solution, adhesiveness is imparted to the surface of the first conductive electrode 2 to form the first adhesive portion 3 (see FIG. 1B).

  The temperature at which the tackifying compound is reacted is not particularly limited because it varies depending on the concentration of the tackifying compound, the type of the conductive material, etc., but is preferably slightly higher than room temperature, and is preferably 30 ° C to 60 ° C. It is preferable to be in the range. Thereby, the production | generation speed and production | generation amount of the 1st adhesion part 3 become appropriate.

  The time for immersing the first member 1 provided with the first conductive electrode 2 in the tackifier compound solution is not particularly limited, but is in the range of about 5 seconds to 5 minutes from the viewpoint of work efficiency. Thus, it is preferable to adjust other conditions.

  In addition, it is preferable to coexist a copper ion with a density | concentration of about 100-1000 ppm in the tackifying compound solution from the point which production | generation efficiency, such as the production | generation speed | rate of 1st adhesion part 3, production amount, etc. increases more.

  Subsequently, the first adhesive portion 3 formed on the surface of the first conductive electrode 2 is washed with water and dried.

  Next, the solder powder 4 is adhered to the first adhesive portion 3 by a method such as sprinkling the solder powder 4 on the first member 1 (see FIG. 1C). At this time, excess solder powder 4 is removed.

  In the electronic component mounting method of this embodiment, examples of the solder powder 4 to be used include Sn—Pb, Sn—Ag, Sn—Pb—Ag, Sn—Pb—Bi, and Sn—Pb—Bi—. Examples thereof include Ag-based and Sn-Pb-Cd-based solder alloy powders.

  Moreover, from the point of the Pb exclusion in recent industrial waste, as the solder powder 4, Sn—In, Sn—Bi, In—Ag, In—Bi, Sn—Zn, Sn—, which does not contain Pb, are used. Ag-based, Sn-Cu-based, Sn-Sb-based, Sn-Au-based, Sn-Bi-Ag-Cu-based, Sn-Ge-based, Sn-Bi-Cu-based, Sn-Cu-Sb-Ag-based, Sn-- Ag—Zn, Sn—Cu—Ag, Sn—Bi—Sb, Sn—Bi—Sb—Zn, Sn—Bi—Cu—Zn, Sn—Ag—Sb, Sn—Ag—Sb— It is preferable to use a Zn-based, Sn-Ag-Cu-based, Sn-Ag-Cu-Zn-based, or Sn-Zn-Bi-based solder alloy powder.

  The alloy composition of the solder powder 4 is 96.5Sn / 3.5Ag, 62Sn / 36Pb /, centering on eutectic solder (hereinafter referred to as 63Sn / 37Pb) with 63% by mass of Sn and 37% by mass of Pb. 2Ag, 62.6Sn / 37Pb / 0.4Ag, 60Sn / 40Pb, 50Sn / 50Pb, 30Sn / 70Pb, 25Sn / 75Pb, 10Sn / 88Pb / 2Ag, 46Sn / 8Bi / 46Pb, 57Sn / 3Bi / 40Pb, 42Sn / 42Pb / 14Bi / 2Ag, 45Sn / 40Pb / 15Bi, 50Sn / 32Pb / 18Cd, 48Sn / 52In, 43Sn / 57Bi, 97In / 3Ag, 58Sn / 42In, 95In / 5Bi, 60Sn / 40Bi, 91Sn / 9Zn, 96.5Sn / 3Ag / 0.5Cu, 99.3Sn / 0 7Cu, 95Sn / 5Sb, 20Sn / 80Au, 90Sn / 10Ag, 90Sn / 7.5Bi / 2Ag / 0.5Cu, 97Sn / 3Cu, 99Sn / 1Ge, 92Sn / 7.5Bi / 0.5Cu, 97Sn / 2Cu / 0. 8Sb / 0.2Ag, 95.5Sn / 3.5Ag / 1Zn, 95.5Sn / 4Cu / 0.5Ag, 52Sn / 45Bi / 3Sb, 51Sn / 45Bi / 3Sb / 1Zn, 85Sn / 10Bi / 5Sb, 84Sn / 10Bi / 5Sb / 1Zn, 88.2Sn / 10Bi / 0.8Cu / 1Zn, 89Sn / 4Ag / 7Sb, 88Sn / 4Ag / 7Sb / 1Zn, 98Sn / 1Ag / 1Sb, 97Sn / 1Ag / 1Sb / 1Zn, 91.2Sn / 2Ag / 0.8Cu / 6Zn, 89Sn / 8Zn / 3Bi, 86Sn / 8Zn 6Bi, and the like 89.1Sn / 2Ag / 0.9Cu / 8Zn. The solder powder 4 may be a mixture of two or more kinds of solder powders having different metal compositions.

  In the electronic component mounting method of the present embodiment, the average particle size of the solder powder 4 is preferably in the range of 3 μm to 50 μm, although it depends on the size of the first conductive electrode 2.

  In the electronic component mounting method of this embodiment, the first adhesive portion forming step and the solder powder attaching step may be repeated a plurality of times. That is, after the surface of the solder powder 4 (see FIG. 1 (c)) attached to the first conductive electrode 2 is again reacted with the tackifier compound to impart tackiness to form the tacky portion. Then, a new solder powder is attached to the adhesive part. Thereby, it becomes possible to increase the quantity of the solder powder adhering to the surface of the 1st electroconductive electrode 2, and it can reduce the bad influence by dropping-off of the solder powder in a subsequent process.

  When the first adhesive part forming step and the solder powder attaching step are repeated a plurality of times, it is possible to reduce the particle size of the newly attached solder powder with respect to the particle size of the solder powder 4 previously attached. It is preferable for reducing the falling off of the powder.

  In addition, the method of providing adhesiveness to the surface of the solder powder 4 attached to the first conductive electrode 2 to form an adhesive part is the first method of applying adhesiveness to the surface of the first conductive electrode 2. Since it can carry out similarly to the method of forming the adhesion part 3, the description is abbreviate | omitted.

  In the electronic component mounting method of the present embodiment, as shown in FIG. 2, the first conductive electrode 2 (FIG. 2 (f) provided on the first member 1 is formed before the first adhesive portion forming step. ))) Is partially covered with a resist 8, and a resist forming step (see FIG. 2G) is provided, and a portion of the surface of the first conductive electrode 2 that is not covered with the resist 8 is adhesive. It is preferable to form 1st adhesion part 3 (refer FIG.2 (h)). In this case, a resist removal step (see FIG. 2 (j)) for removing the resist 8 is provided after the solder powder attaching step (see FIG. 2 (i)). By adopting the resist forming process, the solder powder 4 (see FIG. 1C) that does not participate in the bonding with the second conductive electrode 6 and adheres to the side of the first conductive electrode 2 is omitted. It becomes possible. As a result, the solder powder 4 to be used can be saved, the amount of solder in the mounted electronic component can be reduced, and an environment-friendly electronic component mounting method can be supplied.

  In addition, as shown in FIG. 3, you may provide a resist removal process (refer FIG.3 (n)) before a solder powder adhesion process (refer FIG.3 (o)).

  As the resist 8, a resist that can be applied to fine patterning using a photolithography technique even if it does not have heat resistance at the melting temperature of the solder powder 4 can be used. Thereby, a fine pattern with a fine pitch can be formed on the first substrate 1.

  Moreover, as the resist 8, it is preferable to use a resist in which the resist stripping solution does not alter the tackifier compound. Since the compounds represented by the general formulas (1) to (6) have alkali resistance, when the compounds represented by the general formulas (1) to (6) are used as the tackifier compound, as the resist 8 It is preferable to use an alkali-peeling resist, that is, a resist made of an alkali-soluble or swelling resin.

  Examples of the resist made of an alkali-soluble or swelling resin include a PVA photoresist, a polyoxyalkylene photoresist, a polyether ester photoresist, and the like.

  Examples of the resist developing solution made of an alkali-soluble or swelling resin include tetramethylammonium hydroxide (TMAH), tetrabutylammonium hydroxide (TBAH), and an ammonium salt.

  The stripping solution for the resist 8 is not particularly limited as long as it does not dissolve or alter the first adhesive portion 3 (and the solder powder 4).

  For example, tetramethylammonium hydroxide (TMAH), sodium hydroxide aqueous solution, tetrabutylammonium hydroxide (TBAH), ammonium salt can be used as a peeling solution that does not dissolve or alter the first adhesive portion 3 (and the solder powder 4). And alkaline stripping solution.

  Next, an electrode pressing process is performed in which the second conductive electrode 6 provided on the second member 5 is pressed against the first conductive electrode 2 to which the solder powder 4 is adhered (see FIG. 1D). ). In the electrode pressing step, the solder powder 4 attached to the first conductive electrode 2 falls off so that the positions of the first conductive electrode 2 and the second conductive electrode 6 coincide with each other. It is preferable to move the first member 1 and the second member 5 so that the opposing surfaces of the first conductive electrode 2 and the second conductive electrode 6 are parallel to each other. .

  The second member 5 is mainly an electronic component. As the second member 5, for example, an IC element, a semiconductor chip, or a bare chip is used, but in addition to this, a glass substrate on which a circuit is formed. Ceramic substrates, resin substrates, semiconductor substrates, and wafers can also be used.

  In addition, since the thing similar to the above-mentioned 1st conductive electrode 2 can be used for the 2nd conductive electrode 6, the description is abbreviate | omitted.

  Further, in the present embodiment, before the electrode pressing step, a second adhesive portion forming step for forming the second adhesive portion by imparting adhesiveness to the surface of the second conductive electrode 6 may be provided. preferable. By providing the second adhesive portion forming step, the falling off of the solder powder 4 adhering to the first conductive electrode 2 is reduced during the electrode pressing step. That is, as described above, in the electrode pressing step, the first conductive electrode 2 and the second conductive electrode 6 are arranged so that the opposing surfaces of the first conductive electrode 2 and the second conductive electrode 6 are parallel to each other. Even when the position of the first conductive electrode 2 and the second conductive electrode 6 is slightly shifted when the member 5 is moved, in addition to the first conductive electrode 2, the second conductive The solder powder 4 may be held by the adhesiveness imparted to the surface of the conductive electrode 6.

  In addition, since the 2nd adhesion part formation process can be performed similarly to a 1st adhesion part formation process, the description is abbreviate | omitted.

  Next, a joining step is performed in which the solder powder 4 is thermally melted to join the first conductive electrode 2 and the second conductive electrode 6 with the solder 7 (see FIG. 1E). Thus, the first member 1 and the second member 5 are joined via the first conductive electrode 2, the solder 7, and the second conductive electrode 6.

  What is necessary is just to set suitably the heating temperature and heating time at the time of heat-melting the solder powder 4 in consideration of the alloy composition and particle size of the solder powder 4.

  When the solder powder 4 is Sn—Pb solder powder, the heating temperature is preferably in the range of 190 ° C. to 350 ° C. When the solder powder 4 is a Sn—Ag solder powder, the heating temperature is preferably in the range of 230 ° C. to 350 ° C. When the solder powder 4 is a Sn—Bi solder powder, the heating temperature is preferably in the range of 150 ° C. to 350 ° C.

  The heating time is usually 3 to 180 seconds, preferably 3 to 120 seconds.

  The heating temperature in the case of using other alloy-based solder powder 4 is usually +10 to + 50 ° C. and preferably +10 to + 30 ° C. with respect to the melting point of the solder alloy.

  Under such conditions, the solder powder 4 is melted satisfactorily and the solder 7 having an appropriate thickness is formed as shown in FIG.

  Further, in the electronic component mounting method of the present embodiment, a flux applying step of applying a flux to the solder powder 4 may be provided before the joining step. The meltability of the solder powder 4 can be increased by the flux application process.

  As the flux, rosin, organic acid or the like can be used.

  In the electronic component mounting method of the present embodiment, when the flux application process is not provided, it is preferable to perform the bonding process in a reducing gas atmosphere. By performing the joining step in a reducing gas atmosphere, the meltability of the solder powder 4 can be further increased.

  In the electronic component mounting method of this embodiment, it is preferable to use formic acid for forming the reducing gas.

  When the flux application process is not provided or when the joining process is not performed in a reducing gas atmosphere, one of the first conductive electrode 2 and the second conductive electrode 6 to which the solder powder 4 is attached is provided. It is preferable to perform plasma treatment on or both.

  In the electronic component mounting method of the present embodiment, as shown in FIG. 4, the cross-sectional shapes of both the first conductive electrode 2 and the second conductive electrode 6 are trapezoidal so that the molten solder It is possible to concentrate the powder 4 in a region where the first conductive electrode 2 and the second conductive electrode 6 are opposed to each other by the surface tension, thereby increasing the bonding force between the first member 1 and the second member 5. it can. At this time, the cross-sectional shape of one of the first conductive electrode 2 and the second conductive electrode 6 may be a trapezoid.

  The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the specific embodiments, and various modifications are possible within the scope of the gist of the present invention described in the claims. Modifications and changes are possible.

  For example, in the electronic component mounting method of the present embodiment, both the first member 1 provided with the first conductive electrode 2 and the second member 5 provided with the second conductive electrode 6 are It may be a substrate or a device chip on which a circuit is formed.

  In the electronic component mounting method of the present embodiment, the first member 1 may be an electronic component, and the second member 5 may be a member for mounting the electronic component.

  EXAMPLES Hereinafter, although an Example demonstrates this invention, this invention is not limited to an Example.

Example 1
[First member provided with first conductive electrode]
A printed wiring board on which a linear circuit pattern was formed was produced using copper as the conductive material. Here, the line width of the circuit pattern was set to 25 μm, and the interval between the narrowest circuit patterns was set to 25 μm.

[Resist formation process]
A photoresist (model number: H-7034, manufactured by Hitachi Chemical Co., Ltd.) was attached to the printed wiring board. Next, the printed wiring board was exposed to ultraviolet rays using a photomask, and then developed using a 1% by mass aqueous sodium carbonate solution, and a photoresist was patterned on the surface of the printed wiring board. Of the surface of the circuit pattern, regions not covered with the photoresist were formed every other circuit, and the size was 25 μm × 80 μm.

[First adhesive part forming step]
As the tackifier compound solution, a 2% by mass aqueous solution of a compound in which R12 is C ₁₁ H ₂₃ and R11 is a hydrogen atom in General Formula (3), the pH of which is adjusted to about 4 with acetic acid was used. .

  After pre-treating the printed wiring board with hydrochloric acid, it is immersed in a tackifying compound solution heated to 40 ° C. for 3 minutes to give tackiness to an area not covered with the photoresist to form the first adhesive portion. did. Next, the printed wiring board was washed with water and then dried.

[Solder powder adhesion process]
A solder powder having an average particle size of about 10 μm and an alloy composition of 63Sn / 37Pb was sprinkled on the printed wiring board and lightly brushed to selectively adhere to the first adhesive portion. Thereafter, the printed wiring board was heated at 120 ° C. for 10 minutes.

[Resist removal process]
The photoresist formed on the surface of the printed wiring board was peeled off using a 3% by mass aqueous sodium hydroxide solution.

[Flux application process]
Polymerized rosin was applied to the portion of the printed wiring board where the solder powder was placed.

[Second member provided with second conductive electrode]
A bare chip on which a copper bump electrode was formed was prepared. Here, the copper bump electrode has a diameter of 50 μm, a height of 50 μm, and a pitch of 100 μm. Moreover, the taper is provided in the front-end | tip part of a copper bump electrode, and the cross section of a front-end | tip part has an inverted trapezoid shape.

[Joint process]
After installing the printed wiring board on the flip chip bonder, it was heated to 160 ° C. The bare chip was mounted on the printed wiring board by heating at 230 ° C. for 3 seconds while aligning the position of the copper bump electrode of the bare chip with the position of the first adhesive portion of the printed wiring board and pressurizing the bare chip at about 5 kPa. At this time, the bonding state of the bare chip was good.

DESCRIPTION OF SYMBOLS 1 1st member 2 1st electroconductive electrode 3 1st adhesion part 4 Solder powder 5 2nd member 6 2nd electroconductive electrode 7 Solder 8 Resist

Claims (12)

A first adhesive part forming step of forming adhesiveness on the surface of the first conductive electrode provided on the first member to form the first adhesive part;
A solder powder attaching step of attaching solder powder to the first adhesive portion;
An electrode pressing step of pressing the second conductive electrode provided on the second member against the first conductive electrode to which the solder powder is attached;
A method of mounting an electronic component, comprising sequentially performing a joining step of joining the first conductive electrode and the second conductive electrode by soldering by melting the solder powder.   2. The second pressure-sensitive adhesive portion forming step for forming a second pressure-sensitive adhesive portion by imparting adhesiveness to the surface of the second conductive electrode before the electrode pressing step is provided. The electronic component mounting method described in 1.   3. The electronic component mounting method according to claim 1, wherein the first conductive electrode is a metal bump electrode or a metal foil electrode.   The electronic component mounting according to any one of claims 1 to 3, wherein the first member is a glass substrate, a ceramic substrate, a resin substrate, a semiconductor substrate, an electronic component, a device chip, or a wafer. Method. The first conductive electrode is a copper electrode or a copper alloy electrode;
In the first pressure-sensitive adhesive portion forming step, by the reaction between the first conductive electrode and the tackifier compound, the surface of the first conductive electrode is given tackiness,
The tackifier compound is at least one selected from the group consisting of benzotriazole derivatives, naphthotriazole derivatives, imidazole derivatives, benzimidazole derivatives, mercaptobenzothiazole derivatives, and benzothiazole thio fatty acid derivatives. The electronic component mounting method according to claim 1, wherein: Before the first adhesive part forming step, a resist forming step of partially covering the surface of the first conductive electrode with a resist is provided.
The first adhesive part is formed by imparting the adhesiveness to a portion of the surface of the first conductive electrode that is not covered with the resist. The electronic component mounting method according to the item.   The method for mounting an electronic component according to claim 6, further comprising a resist removing step of removing the resist after the first adhesive portion forming step.   The electronic component mounting method according to claim 1, wherein the joining step is performed in a reducing gas atmosphere.   9. The electronic component according to claim 1, further comprising a flux application step of applying a flux to the solder powder after the solder powder adhesion step and before the joining step. Implementation method. The solder powder is a Sn-Pb solder powder,
10. The electronic component mounting method according to claim 1, wherein a heating temperature when the solder powder is thermally melted is in a range of 190 ° C. to 350 ° C. 10. The solder powder is a Sn-Ag solder powder,
10. The electronic component mounting method according to claim 1, wherein a heating temperature when the solder powder is thermally melted is in a range of 230 ° C. to 350 ° C. 10. The solder powder is a Sn-Bi solder powder,
10. The electronic component mounting method according to claim 1, wherein a heating temperature when the solder powder is thermally melted is in a range of 150 ° C. to 350 ° C. 10.

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