JP2017203058A - Imide crosslinked resin, transparent film, and surface protective film - Google Patents
Imide crosslinked resin, transparent film, and surface protective film Download PDFInfo
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- JP2017203058A JP2017203058A JP2016094004A JP2016094004A JP2017203058A JP 2017203058 A JP2017203058 A JP 2017203058A JP 2016094004 A JP2016094004 A JP 2016094004A JP 2016094004 A JP2016094004 A JP 2016094004A JP 2017203058 A JP2017203058 A JP 2017203058A
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- Prior art keywords
- group
- copolymer
- imide
- transparent film
- examples
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920005989 resin Polymers 0.000 title claims abstract description 61
- 239000011347 resin Substances 0.000 title claims abstract description 61
- 150000003949 imides Chemical class 0.000 title claims abstract description 37
- 230000001681 protective effect Effects 0.000 title claims abstract description 11
- 229920001577 copolymer Polymers 0.000 claims abstract description 69
- 150000004985 diamines Chemical class 0.000 claims abstract description 44
- 238000004132 cross linking Methods 0.000 claims abstract description 26
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical group O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims abstract description 19
- 150000008064 anhydrides Chemical group 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 238000007740 vapor deposition Methods 0.000 claims description 8
- UMRZSTCPUPJPOJ-KNVOCYPGSA-N norbornane Chemical group C1C[C@H]2CC[C@@H]1C2 UMRZSTCPUPJPOJ-KNVOCYPGSA-N 0.000 claims description 2
- 150000001990 dicarboxylic acid derivatives Chemical class 0.000 abstract description 25
- 239000000463 material Substances 0.000 abstract description 8
- 125000003518 norbornenyl group Chemical group C12(C=CC(CC1)C2)* 0.000 abstract description 2
- 238000001465 metallisation Methods 0.000 abstract 1
- 125000000217 alkyl group Chemical group 0.000 description 56
- -1 cyclic olefin Chemical class 0.000 description 52
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 38
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 34
- 238000006243 chemical reaction Methods 0.000 description 27
- 238000000576 coating method Methods 0.000 description 27
- 239000000243 solution Substances 0.000 description 27
- 229920005575 poly(amic acid) Polymers 0.000 description 25
- 239000011248 coating agent Substances 0.000 description 24
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 23
- 125000003118 aryl group Chemical group 0.000 description 22
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 19
- 125000005843 halogen group Chemical group 0.000 description 18
- 125000001424 substituent group Chemical group 0.000 description 18
- 150000001875 compounds Chemical class 0.000 description 17
- 239000002904 solvent Substances 0.000 description 16
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 14
- 238000000034 method Methods 0.000 description 14
- 238000006116 polymerization reaction Methods 0.000 description 14
- 239000000758 substrate Substances 0.000 description 14
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 12
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 11
- 239000007870 radical polymerization initiator Substances 0.000 description 11
- 125000003277 amino group Chemical group 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 10
- 125000003710 aryl alkyl group Chemical group 0.000 description 9
- 238000006297 dehydration reaction Methods 0.000 description 9
- 229910052731 fluorine Inorganic materials 0.000 description 9
- 125000001153 fluoro group Chemical group F* 0.000 description 9
- 239000000178 monomer Substances 0.000 description 9
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 9
- 238000002834 transmittance Methods 0.000 description 9
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 8
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 8
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 8
- 125000003545 alkoxy group Chemical group 0.000 description 8
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 7
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 6
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 6
- 125000004414 alkyl thio group Chemical group 0.000 description 6
- 125000005110 aryl thio group Chemical group 0.000 description 6
- 125000004104 aryloxy group Chemical group 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 6
- 229910052801 chlorine Inorganic materials 0.000 description 6
- 125000001309 chloro group Chemical group Cl* 0.000 description 6
- 125000004122 cyclic group Chemical group 0.000 description 6
- 238000009826 distribution Methods 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 239000004793 Polystyrene Substances 0.000 description 5
- 150000008065 acid anhydrides Chemical class 0.000 description 5
- 125000004453 alkoxycarbonyl group Chemical group 0.000 description 5
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 5
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Substances C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 229920002223 polystyrene Polymers 0.000 description 5
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 4
- 238000012648 alternating copolymerization Methods 0.000 description 4
- 150000004984 aromatic diamines Chemical class 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 4
- 125000000468 ketone group Chemical group 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 238000000746 purification Methods 0.000 description 4
- 238000001226 reprecipitation Methods 0.000 description 4
- 238000003786 synthesis reaction Methods 0.000 description 4
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 3
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical group FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 description 3
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical group [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 3
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 3
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 3
- GHAZCVNUKKZTLG-UHFFFAOYSA-N N-ethyl-succinimide Natural products CCN1C(=O)CCC1=O GHAZCVNUKKZTLG-UHFFFAOYSA-N 0.000 description 3
- HDFGOPSGAURCEO-UHFFFAOYSA-N N-ethylmaleimide Chemical compound CCN1C(=O)C=CC1=O HDFGOPSGAURCEO-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 125000002178 anthracenyl group Chemical group C1(=CC=CC2=CC3=CC=CC=C3C=C12)* 0.000 description 3
- 125000005997 bromomethyl group Chemical group 0.000 description 3
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 3
- VKIRRGRTJUUZHS-UHFFFAOYSA-N cyclohexane-1,4-diamine Chemical compound NC1CCC(N)CC1 VKIRRGRTJUUZHS-UHFFFAOYSA-N 0.000 description 3
- 230000018044 dehydration Effects 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 229910052740 iodine Inorganic materials 0.000 description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 3
- 238000000691 measurement method Methods 0.000 description 3
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 125000001624 naphthyl group Chemical group 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 125000003367 polycyclic group Chemical group 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 230000035484 reaction time Effects 0.000 description 3
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 3
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 3
- GRWFGVWFFZKLTI-IUCAKERBSA-N (-)-α-pinene Chemical compound CC1=CC[C@@H]2C(C)(C)[C@H]1C2 GRWFGVWFFZKLTI-IUCAKERBSA-N 0.000 description 2
- AVQQQNCBBIEMEU-UHFFFAOYSA-N 1,1,3,3-tetramethylurea Chemical compound CN(C)C(=O)N(C)C AVQQQNCBBIEMEU-UHFFFAOYSA-N 0.000 description 2
- CYSGHNMQYZDMIA-UHFFFAOYSA-N 1,3-Dimethyl-2-imidazolidinon Chemical compound CN1CCN(C)C1=O CYSGHNMQYZDMIA-UHFFFAOYSA-N 0.000 description 2
- PAMIQIKDUOTOBW-UHFFFAOYSA-N 1-methylpiperidine Chemical compound CN1CCCCC1 PAMIQIKDUOTOBW-UHFFFAOYSA-N 0.000 description 2
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- NUIURNJTPRWVAP-UHFFFAOYSA-N 3,3'-Dimethylbenzidine Chemical group C1=C(N)C(C)=CC(C=2C=C(C)C(N)=CC=2)=C1 NUIURNJTPRWVAP-UHFFFAOYSA-N 0.000 description 2
- UFERIGCCDYCZLN-UHFFFAOYSA-N 3a,4,7,7a-tetrahydro-1h-indene Chemical group C1C=CCC2CC=CC21 UFERIGCCDYCZLN-UHFFFAOYSA-N 0.000 description 2
- QYIMZXITLDTULQ-UHFFFAOYSA-N 4-(4-amino-2-methylphenyl)-3-methylaniline Chemical group CC1=CC(N)=CC=C1C1=CC=C(N)C=C1C QYIMZXITLDTULQ-UHFFFAOYSA-N 0.000 description 2
- HESXPOICBNWMPI-UHFFFAOYSA-N 4-[2-[4-[2-(4-aminophenyl)propan-2-yl]phenyl]propan-2-yl]aniline Chemical compound C=1C=C(C(C)(C)C=2C=CC(N)=CC=2)C=CC=1C(C)(C)C1=CC=C(N)C=C1 HESXPOICBNWMPI-UHFFFAOYSA-N 0.000 description 2
- KNDQHSIWLOJIGP-UHFFFAOYSA-N 826-62-0 Chemical compound C1C2C3C(=O)OC(=O)C3C1C=C2 KNDQHSIWLOJIGP-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- IGHHPVIMEQGKNE-UHFFFAOYSA-N [3-(hydroxymethyl)-2-bicyclo[2.2.1]hept-5-enyl]methanol Chemical compound C1C2C=CC1C(CO)C2CO IGHHPVIMEQGKNE-UHFFFAOYSA-N 0.000 description 2
- 125000004054 acenaphthylenyl group Chemical group C1(=CC2=CC=CC3=CC=CC1=C23)* 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- OTBHHUPVCYLGQO-UHFFFAOYSA-N bis(3-aminopropyl)amine Chemical compound NCCCNCCCN OTBHHUPVCYLGQO-UHFFFAOYSA-N 0.000 description 2
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000012024 dehydrating agents Substances 0.000 description 2
- HANKSFAYJLDDKP-UHFFFAOYSA-N dihydrodicyclopentadiene Chemical group C12CC=CC2C2CCC1C2 HANKSFAYJLDDKP-UHFFFAOYSA-N 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- RMBPEFMHABBEKP-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2C3=C[CH]C=CC3=CC2=C1 RMBPEFMHABBEKP-UHFFFAOYSA-N 0.000 description 2
- 125000005842 heteroatom Chemical group 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- XMGQYMWWDOXHJM-UHFFFAOYSA-N limonene Chemical compound CC(=C)C1CCC(C)=CC1 XMGQYMWWDOXHJM-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 125000002950 monocyclic group Chemical group 0.000 description 2
- 125000002560 nitrile group Chemical group 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N o-biphenylenemethane Natural products C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- UBQKCCHYAOITMY-UHFFFAOYSA-N pyridin-2-ol Chemical compound OC1=CC=CC=N1 UBQKCCHYAOITMY-UHFFFAOYSA-N 0.000 description 2
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 2
- 238000010526 radical polymerization reaction Methods 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- PFNFFQXMRSDOHW-UHFFFAOYSA-N spermine Chemical compound NCCCNCCCCNCCCN PFNFFQXMRSDOHW-UHFFFAOYSA-N 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 2
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 description 2
- QAEDZJGFFMLHHQ-UHFFFAOYSA-N trifluoroacetic anhydride Chemical compound FC(F)(F)C(=O)OC(=O)C(F)(F)F QAEDZJGFFMLHHQ-UHFFFAOYSA-N 0.000 description 2
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 2
- 239000013585 weight reducing agent Substances 0.000 description 2
- WTARULDDTDQWMU-RKDXNWHRSA-N (+)-β-pinene Chemical compound C1[C@H]2C(C)(C)[C@@H]1CCC2=C WTARULDDTDQWMU-RKDXNWHRSA-N 0.000 description 1
- WTARULDDTDQWMU-IUCAKERBSA-N (-)-Nopinene Natural products C1[C@@H]2C(C)(C)[C@H]1CCC2=C WTARULDDTDQWMU-IUCAKERBSA-N 0.000 description 1
- OJOWICOBYCXEKR-APPZFPTMSA-N (1S,4R)-5-ethylidenebicyclo[2.2.1]hept-2-ene Chemical compound CC=C1C[C@@H]2C[C@@H]1C=C2 OJOWICOBYCXEKR-APPZFPTMSA-N 0.000 description 1
- GEQHKFFSPGPGLN-OLQVQODUSA-N (1r,3s)-cyclohexane-1,3-diamine Chemical compound N[C@H]1CCC[C@@H](N)C1 GEQHKFFSPGPGLN-OLQVQODUSA-N 0.000 description 1
- GEQHKFFSPGPGLN-WDSKDSINSA-N (1s,3s)-cyclohexane-1,3-diamine Chemical compound N[C@H]1CCC[C@H](N)C1 GEQHKFFSPGPGLN-WDSKDSINSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- OPCJOXGBLDJWRM-UHFFFAOYSA-N 1,2-diamino-2-methylpropane Chemical compound CC(C)(N)CN OPCJOXGBLDJWRM-UHFFFAOYSA-N 0.000 description 1
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
- QHQSCKLPDVSEBJ-UHFFFAOYSA-N 1,3,5-tri(4-aminophenyl)benzene Chemical compound C1=CC(N)=CC=C1C1=CC(C=2C=CC(N)=CC=2)=CC(C=2C=CC(N)=CC=2)=C1 QHQSCKLPDVSEBJ-UHFFFAOYSA-N 0.000 description 1
- WNXJIVFYUVYPPR-UHFFFAOYSA-N 1,3-dioxolane Chemical compound C1COCO1 WNXJIVFYUVYPPR-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 1
- PUKLCKVOVCZYKF-UHFFFAOYSA-N 1-[2-(2,5-dioxopyrrol-1-yl)ethyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1CCN1C(=O)C=CC1=O PUKLCKVOVCZYKF-UHFFFAOYSA-N 0.000 description 1
- AQGZJQNZNONGKY-UHFFFAOYSA-N 1-[4-(2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=C(N2C(C=CC2=O)=O)C=C1 AQGZJQNZNONGKY-UHFFFAOYSA-N 0.000 description 1
- XAZPKEBWNIUCKF-UHFFFAOYSA-N 1-[4-[4-[2-[4-[4-(2,5-dioxopyrrol-1-yl)phenoxy]phenyl]propan-2-yl]phenoxy]phenyl]pyrrole-2,5-dione Chemical compound C=1C=C(OC=2C=CC(=CC=2)N2C(C=CC2=O)=O)C=CC=1C(C)(C)C(C=C1)=CC=C1OC(C=C1)=CC=C1N1C(=O)C=CC1=O XAZPKEBWNIUCKF-UHFFFAOYSA-N 0.000 description 1
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- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 1
- WOFKFNZIJZWWPZ-UHFFFAOYSA-N pyrene-1,3-diamine Chemical compound C1=C2C(N)=CC(N)=C(C=C3)C2=C2C3=CC=CC2=C1 WOFKFNZIJZWWPZ-UHFFFAOYSA-N 0.000 description 1
- OWJJRQSAIMYXQJ-UHFFFAOYSA-N pyrene-1,6-diamine Chemical compound C1=C2C(N)=CC=C(C=C3)C2=C2C3=C(N)C=CC2=C1 OWJJRQSAIMYXQJ-UHFFFAOYSA-N 0.000 description 1
- BLYOXQBERINFDU-UHFFFAOYSA-N pyrene-1,8-diamine Chemical compound C1=C2C(N)=CC=C(C=C3)C2=C2C3=CC=C(N)C2=C1 BLYOXQBERINFDU-UHFFFAOYSA-N 0.000 description 1
- GRWFGVWFFZKLTI-UHFFFAOYSA-N rac-alpha-Pinene Natural products CC1=CCC2C(C)(C)C1C2 GRWFGVWFFZKLTI-UHFFFAOYSA-N 0.000 description 1
- 239000012966 redox initiator Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000010267 sodium hydrogen sulphite Nutrition 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 125000003003 spiro group Chemical group 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 125000004213 tert-butoxy group Chemical group [H]C([H])([H])C(O*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- BZBMBZJUNPMEBD-UHFFFAOYSA-N tert-butyl bicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C2C(C(=O)OC(C)(C)C)CC1C=C2 BZBMBZJUNPMEBD-UHFFFAOYSA-N 0.000 description 1
- 125000005931 tert-butyloxycarbonyl group Chemical group [H]C([H])([H])C(OC(*)=O)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- LALRXNPLTWZJIJ-UHFFFAOYSA-N triethylborane Chemical compound CCB(CC)CC LALRXNPLTWZJIJ-UHFFFAOYSA-N 0.000 description 1
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- KLNPWTHGTVSSEU-UHFFFAOYSA-N undecane-1,11-diamine Chemical compound NCCCCCCCCCCCN KLNPWTHGTVSSEU-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F232/00—Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F8/00—Chemical modification by after-treatment
- C08F8/30—Introducing nitrogen atoms or nitrogen-containing groups
- C08F8/32—Introducing nitrogen atoms or nitrogen-containing groups by reaction with amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/14—Protective coatings, e.g. hard coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Laminated Bodies (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Electroluminescent Light Sources (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Surface Treatment Of Optical Elements (AREA)
Abstract
Description
本発明は、イミド架橋型樹脂、透明フィルム及び表面保護フィルムに関する。 The present invention relates to an imide cross-linked resin, a transparent film, and a surface protective film.
近年、携帯情報端末等の普及によって、ディスプレイ表面を保護する表面保護フィルムの需要が増加している。例えば、特許文献1には、偏光板又はタッチパネル上にカバーウインドーを配置した有機電界発光表示装置が開示されている。 In recent years, with the widespread use of portable information terminals and the like, the demand for surface protective films for protecting the display surface is increasing. For example, Patent Document 1 discloses an organic electroluminescence display device in which a cover window is disposed on a polarizing plate or a touch panel.
表面保護フィルムは例えばフィルム基材の一方面上にアルミ等の金属を蒸着させて製造されるが、このとき、フィルム基材には十分な耐熱性が求められる。 The surface protective film is produced, for example, by vapor-depositing a metal such as aluminum on one surface of the film substrate. At this time, the film substrate is required to have sufficient heat resistance.
本発明は、良好な耐熱性を有し、表面保護フィルム用の樹脂材料として好適に利用可能なイミド架橋型樹脂を提供することを目的とする。また本発明は、イミド架橋型樹脂を含み、表面保護フィルム用のフィルム基材として好適に利用可能な透明フィルムを提供することを目的とする。更に本発明は、当該透明フィルムを備えた表面保護フィルムを提供することを目的とする。 An object of this invention is to provide the imide bridge | crosslinking type resin which has favorable heat resistance and can be utilized suitably as a resin material for surface protection films. Another object of the present invention is to provide a transparent film that contains an imide-crosslinked resin and can be suitably used as a film substrate for a surface protective film. Furthermore, an object of this invention is to provide the surface protection film provided with the said transparent film.
本発明の一側面は、環状オレフィン単位及び不飽和ジカルボン酸無水物単位を有する共重合体をジアミンで架橋してなる、イミド架橋型樹脂に関する。 One aspect of the present invention relates to an imide crosslinked resin obtained by crosslinking a copolymer having a cyclic olefin unit and an unsaturated dicarboxylic anhydride unit with a diamine.
一態様において、環状オレフィン単位はノルボルナン骨格を有していてよい。 In one embodiment, the cyclic olefin unit may have a norbornane skeleton.
一態様において、不飽和ジカルボン酸無水物単位は無水マレイン酸単位を含んでいてよい。 In one embodiment, the unsaturated dicarboxylic anhydride unit may comprise a maleic anhydride unit.
本発明の他の一側面は、イミド架橋型樹脂を含む、透明フィルムに関する。 Another aspect of the present invention relates to a transparent film containing an imide crosslinked resin.
本発明の更に他の一側面は、透明フィルムと、透明フィルムの少なくとも一方面上に設けられた金属蒸着層と、を備える、表面保護フィルムに関する。 Still another aspect of the present invention relates to a surface protective film comprising a transparent film and a metal vapor deposition layer provided on at least one surface of the transparent film.
本発明によれば、良好な耐熱性を有し、表面保護フィルム用の樹脂材料として好適に利用可能なイミド架橋型樹脂が提供される。また、本発明によれば、上記イミド架橋型樹脂を含み、表面保護フィルム用のフィルム基材として好適な透明フィルム、及び当該透明フィルムを備えた表面保護フィルムが提供される。 ADVANTAGE OF THE INVENTION According to this invention, the imide bridge | crosslinking type resin which has favorable heat resistance and can be utilized suitably as a resin material for surface protection films is provided. Moreover, according to this invention, the surface protection film provided with the said imide bridge | crosslinking type resin and suitable as a film base material for surface protection films, and the said transparent film is provided.
以下、本発明の好適な実施形態について説明する。 Hereinafter, preferred embodiments of the present invention will be described.
(イミド架橋型樹脂)
本実施形態に係るイミド架橋型樹脂は、環状オレフィン単位及び不飽和ジカルボン酸無水物単位を有する共重合体をジアミンで架橋した架橋体である。
(Imide crosslinking resin)
The imide cross-linking resin according to this embodiment is a cross-linked product obtained by cross-linking a copolymer having a cyclic olefin unit and an unsaturated dicarboxylic anhydride unit with a diamine.
本明細書中、環状オレフィン単位とは環状オレフィンに由来する構成単位であり、不飽和ジカルボン酸無水物単位とは不飽和ジカルボン酸無水物に由来する構成単位である。すなわち、共重合体は、環状オレフィンに由来する構成単位及び不飽和ジカルボン酸無水物に由来する構成単位を有する共重合体ということができ、環状オレフィン及び不飽和ジカルボン酸無水物を含むモノマー成分の共重合体ということもできる。 In this specification, the cyclic olefin unit is a structural unit derived from a cyclic olefin, and the unsaturated dicarboxylic acid anhydride unit is a structural unit derived from an unsaturated dicarboxylic acid anhydride. That is, the copolymer can be referred to as a copolymer having a structural unit derived from a cyclic olefin and a structural unit derived from an unsaturated dicarboxylic acid anhydride, and is a monomer component containing a cyclic olefin and an unsaturated dicarboxylic acid anhydride. It can also be called a copolymer.
本実施形態に係るイミド架橋型樹脂は、共重合体中の酸無水物とジアミン中のアミノ基との反応により形成されたイミド結合を有している。本実施形態に係るイミド架橋型樹脂は、分子内に環状オレフィン由来の環構造とイミド結合を介した架橋構造とを備えることで、十分な光透過性及び良好な耐熱性を示す。このため、本実施形態に係るイミド架橋型樹脂は、表面保護フィルム用の樹脂材料として好適に利用できる。 The imide crosslinked resin according to this embodiment has an imide bond formed by a reaction between an acid anhydride in the copolymer and an amino group in the diamine. The imide cross-linking resin according to the present embodiment has sufficient light transmittance and good heat resistance by including a cyclic structure derived from a cyclic olefin and a cross-linked structure via an imide bond in the molecule. For this reason, the imide bridge | crosslinking type resin which concerns on this embodiment can be utilized suitably as a resin material for surface protection films.
<共重合体>
本実施形態における共重合体は、環状オレフィン単位及び不飽和ジカルボン酸無水物単位を有し、ジアミンにより架橋可能なポリマーである。
<Copolymer>
The copolymer in the present embodiment is a polymer having a cyclic olefin unit and an unsaturated dicarboxylic anhydride unit and capable of being crosslinked by a diamine.
共重合体中、環状オレフィン単位の含有量C1(mol)に対する、不飽和ジカルボン酸無水物単位の含有量C2(mol)及び後述のマレイミド系単位の含有量C3(mol)の合計量C2+C3(mol)の比(C2+C3)/C1は、例えば、0.5〜2.0であってよく、好ましくは0.95〜1.05である。 In the copolymer, the total amount of unsaturated dicarboxylic acid anhydride unit content C 2 (mol) and maleimide unit content C 3 (mol) described later relative to cyclic olefin unit content C 1 (mol). The ratio of C 2 + C 3 (mol) (C 2 + C 3 ) / C 1 may be, for example, 0.5 to 2.0, and preferably 0.95 to 1.05.
上記合計量C2+C3に対する不飽和ジカルボン酸無水物単位の含有量C2の比C2/(C2+C3)は、例えば、0.01以上であってよく、好ましくは0.5以上であり、1(すなわち、マレイミド系単位の含有量が0)であってもよい。 The ratio C 2 / (C 2 + C 3 ) of the content C 2 of unsaturated dicarboxylic anhydride units to the total amount C 2 + C 3 may be, for example, 0.01 or more, preferably 0.5 or more. 1 (that is, the content of maleimide units is 0).
共重合体の数平均分子量Mnは、例えば190以上であってよく、好ましくは1000以上であり、3000以上であってよい。共重合体の数平均分子量Mnを大きくすることで、イミド架橋型樹脂の耐熱性が一層向上する傾向がある。また、共重合体の数平均分子量Mnは、例えば500000以下であってよく、好ましくは10000以下であり、7000以下であってよい。共重合体の数平均分子量Mnを小さくすることで、ジアミンによる架橋反応の反応率が向上する傾向がある。 The number average molecular weight Mn of the copolymer may be, for example, 190 or more, preferably 1000 or more, and may be 3000 or more. By increasing the number average molecular weight Mn of the copolymer, the heat resistance of the imide crosslinked resin tends to be further improved. The number average molecular weight Mn of the copolymer may be, for example, 500,000 or less, preferably 10,000 or less, and may be 7,000 or less. By reducing the number average molecular weight Mn of the copolymer, the reaction rate of the crosslinking reaction with diamine tends to be improved.
共重合体において、数平均分子量Mnに対する重量平均分子量Mwの比である分子量分布Mw/Mnは、例えば10以下であってよく、好ましくは5以下である。Mw/Mnが小さいと、イミド架橋型樹脂の耐熱性が一層向上するとともに、イミド架橋型樹脂中の揮発分量が低減される傾向がある。 In the copolymer, the molecular weight distribution Mw / Mn, which is the ratio of the weight average molecular weight Mw to the number average molecular weight Mn, may be, for example, 10 or less, and preferably 5 or less. When Mw / Mn is small, the heat resistance of the imide cross-linked resin is further improved, and the amount of volatile components in the imide cross-linked resin tends to be reduced.
なお、本明細書中、共重合体の数平均分子量Mn及び重量平均分子量Mwは、GPC測定法により、以下の条件で測定される値を示す。
機器:島津製作所製「RID−10A/CBM−20A/DGU−20A3,
LC−20AD/DPD−M20A/CTO−20A」
カラム:東ソー社製「TSKgel superHM−N」
検出器:示差屈折率検出器(RI検出器/内蔵)
溶媒:クロロホルム
温度:40℃
流速:0.3mL/分
注入量:20μL
濃度:0.1重量%
較正試料:単分散ポリスチレン
較正法:ポリスチレン
In addition, in this specification, the number average molecular weight Mn and the weight average molecular weight Mw of a copolymer show the value measured on condition of the following by GPC measuring method.
Equipment: “RID-10A / CBM-20A / DGU-20A3, manufactured by Shimadzu Corporation
LC-20AD / DPD-M20A / CTO-20A "
Column: “TSKgel superHM-N” manufactured by Tosoh Corporation
Detector: Differential refractive index detector (RI detector / built-in)
Solvent: Chloroform Temperature: 40 ° C
Flow rate: 0.3 mL / min Injection volume: 20 μL
Concentration: 0.1% by weight
Calibration sample: Monodisperse polystyrene Calibration method: Polystyrene
(i)環状オレフィン単位
環状オレフィン単位は、環状オレフィンに由来する構成単位である。環状オレフィンは、環構造と、環構造を構成する炭素原子を含む炭素−炭素二重結合と、を有し、不飽和ジカルボン酸無水物と重合可能な化合物である。
(I) Cyclic olefin unit The cyclic olefin unit is a structural unit derived from a cyclic olefin. The cyclic olefin is a compound having a ring structure and a carbon-carbon double bond including a carbon atom constituting the ring structure, and capable of being polymerized with an unsaturated dicarboxylic acid anhydride.
環状オレフィンは、例えば、環内に少なくとも1つの炭素−炭素二重結合を有する環構造を含む化合物であってよい。このような環状オレフィンは、不飽和ジカルボン酸無水物との重合反応が進行しやすい。また、このような環状オレフィンによれば、共重合体の主鎖中に環構造が組み込まれるため、主鎖の形状及び運動性が制限され、耐熱性及び光学特性に一層優れたイミド架橋型樹脂が得られる傾向がある。 The cyclic olefin may be, for example, a compound containing a ring structure having at least one carbon-carbon double bond in the ring. Such a cyclic olefin easily undergoes a polymerization reaction with an unsaturated dicarboxylic acid anhydride. Further, according to such a cyclic olefin, since a ring structure is incorporated in the main chain of the copolymer, the shape and mobility of the main chain are limited, and the imide cross-linked resin is further excellent in heat resistance and optical characteristics. Tends to be obtained.
環状オレフィンが有する環構造は、単環系であってよく、多環系であってもよい。単環系の環構造としては、例えば、シクロアルケン骨格、シクロアルカジエン骨格、シクロアルカトリエン骨格等が挙げられる。これらの環構造としては、例えば、下記式(1−1)〜(1−5)で表される環構造が挙げられる。 The ring structure of the cyclic olefin may be a monocyclic system or a polycyclic system. Examples of the monocyclic ring structure include a cycloalkene skeleton, a cycloalkadiene skeleton, a cycloalkatriene skeleton, and the like. Examples of these ring structures include ring structures represented by the following formulas (1-1) to (1-5).
多環系の環構造としては、縮合環、橋架け環等が挙げられる。多環系の環構造としては、例えば、ノルボルネン骨格、ノルボルナジエン骨格、ビシクロ[2.2.2]オクタ−2−エン骨格、ビシクロ[2.2.2]オクタ−2,5−ジエン骨格、ジシクロペンタジエン骨格、ジヒドロジシクロペンタジエン骨格、アセナフチレン骨格、インデン骨格、テトラヒドロインデン骨格、テトラシクロ[6.2.1.13,6.02,7]ドデカ−4−エン骨格、等が挙げられる。これらの環構造としては、例えば、下記式(2−1)〜(2−11)で表される環構造が挙げられる。 Examples of the polycyclic ring structure include a condensed ring and a bridged ring. Examples of the polycyclic ring structure include a norbornene skeleton, a norbornadiene skeleton, a bicyclo [2.2.2] oct-2-ene skeleton, a bicyclo [2.2.2] octa-2,5-diene skeleton, Cyclopentadiene skeleton, dihydrodicyclopentadiene skeleton, acenaphthylene skeleton, indene skeleton, tetrahydroindene skeleton, tetracyclo [6.2.1.1 3,6 . 0 2,7 ] dodec-4-ene skeleton, and the like. Examples of these ring structures include ring structures represented by the following formulas (2-1) to (2-11).
環状オレフィンが有する環構造は、置換基を有していてよい。また、環構造は、他の環と縮合していてよく、他の環とスピロ環を形成していてもよい。 The ring structure of the cyclic olefin may have a substituent. In addition, the ring structure may be condensed with another ring, and may form a spiro ring with another ring.
環状オレフィンとしては、例えば、下記式(3−1)〜(3−34)で表される構造を有する化合物が挙げられる。 Examples of the cyclic olefin include compounds having structures represented by the following formulas (3-1) to (3-34).
これらの環状オレフィンは、置換基を有していてよい。置換基は、重合反応を阻害しない範囲であれば特に制限されない。置換基は、例えば、ハロゲン原子、アルキル基、ハロゲン化アルキル基、アルコキシ基、アリール基、アラルキル基、シリル基、カルボキシル基、ヒドロキシ基、アミノ基、アルコキシカルボニル基等であってよい。また、これらの置換基に更に他の置換基が置換していてもよい。 These cyclic olefins may have a substituent. The substituent is not particularly limited as long as it does not inhibit the polymerization reaction. The substituent may be, for example, a halogen atom, an alkyl group, a halogenated alkyl group, an alkoxy group, an aryl group, an aralkyl group, a silyl group, a carboxyl group, a hydroxy group, an amino group, or an alkoxycarbonyl group. Further, these substituents may be further substituted with other substituents.
ハロゲン原子としては、フッ素原子、塩素原子、臭素原子、ヨウ素原子が挙げられ、これらのうちフッ素原子、塩素原子又は臭素原子であることが好ましく、フッ素原子であることがより好ましい。 Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. Among these, a fluorine atom, a chlorine atom, or a bromine atom is preferable, and a fluorine atom is more preferable.
アルキル基は、直鎖状、分岐状又は環状であってよい。アルキル基の炭素数は、例えば1〜30であってよく、好ましくは1〜10である。アルキル基の具体例としては、メチル基、エチル基、イソプロピル基、tert−ブチル等が挙げられる。 The alkyl group may be linear, branched or cyclic. Carbon number of an alkyl group may be 1-30, for example, Preferably it is 1-10. Specific examples of the alkyl group include a methyl group, an ethyl group, an isopropyl group, and tert-butyl.
ハロゲン化アルキル基は、アルキル基が有する水素原子の一部又は全部がハロゲン原子に置換した基である。アルキル基及びハロゲン原子としては上記と同じ例が挙げられる。ハロゲン化アルキル基としては、例えば、トリフルオロメチル基、クロロメチル基、ブロモメチル基等が挙げられる。 The halogenated alkyl group is a group in which part or all of the hydrogen atoms of the alkyl group are substituted with halogen atoms. Examples of the alkyl group and the halogen atom are the same as described above. Examples of the halogenated alkyl group include a trifluoromethyl group, a chloromethyl group, and a bromomethyl group.
アルコキシ基は、−OR(Rはアルキル基を示す。)で表される基であり、Rのアルキル基としては上記と同じ例が挙げられる。アルコキシ基としては、例えば、メトキシ基、エトキシ基、イソプロポキシ基、n−プロポキシ基、tert−ブトキシ基等が挙げられる。 The alkoxy group is a group represented by —OR (R represents an alkyl group), and examples of the alkyl group of R include the same examples as described above. Examples of the alkoxy group include a methoxy group, an ethoxy group, an isopropoxy group, an n-propoxy group, and a tert-butoxy group.
アリール基は、芳香族炭化水素から水素原子一つを除いた構造を有する基である。アリール基としては、例えば、フェニル基、ナフチル基、アントラセニル基等が挙げられる。 The aryl group is a group having a structure in which one hydrogen atom is removed from an aromatic hydrocarbon. Examples of the aryl group include a phenyl group, a naphthyl group, and an anthracenyl group.
アラルキル基は、アルキル基の水素原子の一部又は全部(好ましくは1つ)がアリール基に置換した基である。アルキル基及びアリール基としては上記と同じ例が挙げられる。アラルキル基としては、例えば、ベンジル基、フェニルエチル基、フェニルプロピル基等が挙げられる。 An aralkyl group is a group in which part or all (preferably one) of hydrogen atoms of an alkyl group is substituted with an aryl group. Examples of the alkyl group and aryl group are the same as those described above. Examples of the aralkyl group include a benzyl group, a phenylethyl group, and a phenylpropyl group.
シリル基は、−Si(R’)3(R’はアルキル基、アリール基又はアラルキル基を示す。)で表される基であり、R’のアルキル基、アリール基及びアラルキル基としては上記と同じ例が挙げられる。シリル基としては、例えば、トリメチルシリル基、ジメチルフェニルシリル基、トリエチルシリル基、ジエチルフェニルシリル基等が挙げられる。 The silyl group is a group represented by —Si (R ′) 3 (R ′ represents an alkyl group, an aryl group, or an aralkyl group). Examples of the alkyl group, aryl group, and aralkyl group of R ′ are as described above. The same example is given. Examples of the silyl group include a trimethylsilyl group, a dimethylphenylsilyl group, a triethylsilyl group, and a diethylphenylsilyl group.
アルコキシカルボニル基は、−COOR(Rはアルキル基を示す。)で表される基であり、Rのアルキル基としては上記と同じ例が挙げられる。アルコキシカルボニル基としては、例えば、メトキシカルボニル基、エトキシカルボニル基、イソプロポキシカルボニル基、tert−ブトキシカルボニル基等が挙げられる。 The alkoxycarbonyl group is a group represented by —COOR (R represents an alkyl group), and examples of the alkyl group of R include the same examples as described above. Examples of the alkoxycarbonyl group include a methoxycarbonyl group, an ethoxycarbonyl group, an isopropoxycarbonyl group, a tert-butoxycarbonyl group, and the like.
環状オレフィンは、酸素、窒素及び硫黄以外のヘテロ原子を含まない化合物であることが好ましく、ヘテロ原子を含まない炭化水素であることがより好ましい。 The cyclic olefin is preferably a compound containing no hetero atom other than oxygen, nitrogen and sulfur, and more preferably a hydrocarbon containing no hetero atom.
環状オレフィンの具体例としては、例えば、アセナフチレン、5−アセチル−2−ノルボルネンビシクロ[3.2.1]オクト−2−エン、[ビシクロ[2.2.1]ヘプタ−5−エン−2−イル]トリエトキシシラン、tert−ブチル−5−ノルボルネン−2−カルボキシレート、ジシクロペンタジエン、5,6−ジヒドロジシクロペンタジエン、5−エチリデン−2−ノルボルネン、ヒドロキシジシクロペンタジエン、2−ノルボルネン、5−ノルボルネン−2,3−ジカルボン酸無水物、2,5−ノルボルナジエン、5−ノルボルネン−2,2−ジメタノール、5−ノルボルネン−2−カルボン酸メチル 5−ノルボルネン−2−カルボキシレート、5−ノルボルネン−2,3−ジメタノール、cis−5−ノルボルネン−exo−2,3−ジカルボン酸無水物、5−ノルボルネン−2−endo,3−endo−ジメタノール、5−ノルボルネン−2−exo,3−exo−ジメタノール、5−ノルボルネン−2−イル アセテート、5−ノルボルネン−2−カルボニトリル、5−ノルボルネン−2,3−ジカルボキシイミド、5−ノルボルネン−2−メチルアミン、5−ノルボルネン−2−メタノール、N−(2−エチルヘキシル)−5−ノルボルネン−2,3−ジカルボキシイミド、3a,4,7,7a−テトラヒドロインデン、テトラシクロ[6.2.1.13,6.02,7]ドデ−4−エン、4−ビニル−1−シクロヘキセン、5−ビニルビシクロ[2.2.1]ヘプト−2−エン、トリシクロペンタジエン、ジメタノベンズインデン、ジメタノフルオレン、α−ピネン、β−ピネン、リモネン等が挙げられる。 Specific examples of the cyclic olefin include, for example, acenaphthylene, 5-acetyl-2-norbornenebicyclo [3.2.1] oct-2-ene, and [bicyclo [2.2.1] hept-5-en-2- Yl] triethoxysilane, tert-butyl-5-norbornene-2-carboxylate, dicyclopentadiene, 5,6-dihydrodicyclopentadiene, 5-ethylidene-2-norbornene, hydroxydicyclopentadiene, 2-norbornene, 5 -Norbornene-2,3-dicarboxylic anhydride, 2,5-norbornadiene, 5-norbornene-2,2-dimethanol, methyl 5-norbornene-2-carboxylate 5-norbornene-2-carboxylate, 5-norbornene -2,3-dimethanol, cis-5-norbornene-exo- , 3-dicarboxylic anhydride, 5-norbornene-2-endo, 3-endo-dimethanol, 5-norbornene-2-exo, 3-exo-dimethanol, 5-norbornen-2-yl acetate, 5-norbornene -2-carbonitrile, 5-norbornene-2,3-dicarboximide, 5-norbornene-2-methylamine, 5-norbornene-2-methanol, N- (2-ethylhexyl) -5-norbornene-2,3 -Dicarboximide, 3a, 4,7,7a-tetrahydroindene, tetracyclo [6.2.1.13,6.02,7] dode-4-ene, 4-vinyl-1-cyclohexene, 5-vinyl Bicyclo [2.2.1] hept-2-ene, tricyclopentadiene, dimethanobenzindene, dimethanofluorene, α Pinene, beta-pinene, limonene, and the like.
環状オレフィンが2つ以上の炭素−炭素二重結合を有するとき、炭素−炭素二重結合の一部又は全部が重合反応で反応してよい。すなわち、環状オレフィン単位は、環状オレフィンが有する炭素−炭素二重結合の一部又は全部が重合反応で反応してなる構成単位であってよく、環状オレフィンが有する炭素−炭素二重結合の一部又は全部を単結合に置き換えた構造を有する構成単位であってよい。 When the cyclic olefin has two or more carbon-carbon double bonds, some or all of the carbon-carbon double bonds may react in the polymerization reaction. That is, the cyclic olefin unit may be a structural unit obtained by reacting part or all of the carbon-carbon double bond of the cyclic olefin by a polymerization reaction, and part of the carbon-carbon double bond of the cyclic olefin. Alternatively, it may be a structural unit having a structure in which all are replaced by single bonds.
環状オレフィン単位は、環構造の少なくとも一部が共重合体の主鎖を構成していることが好ましい。これにより、共重合体の主鎖の形状及び運動性が環状オレフィン単位の環構造により制御され、耐熱性及び光学特性に一層優れたイミド架橋型樹脂が得られる。 In the cyclic olefin unit, at least a part of the ring structure preferably constitutes the main chain of the copolymer. Thereby, the shape and mobility of the main chain of the copolymer are controlled by the cyclic structure of the cyclic olefin unit, and an imide-crosslinked resin having further excellent heat resistance and optical properties can be obtained.
(ii)不飽和ジカルボン酸無水物単位
不飽和ジカルボン酸無水物単位は、不飽和ジカルボン酸無水物に由来する構成単位である。不飽和ジカルボン酸無水物は、炭素−炭素二重結合と2つのカルボキシル基とを有する不飽和ジカルボン酸が、分子内脱水により酸無水物を形成してなる化合物である。
(Ii) Unsaturated dicarboxylic acid anhydride unit An unsaturated dicarboxylic acid anhydride unit is a structural unit derived from an unsaturated dicarboxylic acid anhydride. An unsaturated dicarboxylic acid anhydride is a compound formed by an unsaturated dicarboxylic acid having a carbon-carbon double bond and two carboxyl groups forming an acid anhydride by intramolecular dehydration.
不飽和ジカルボン酸無水物としては、例えば、無水マレイン酸、無水シトラコン酸、無水イタコン酸、2,3−ジメチルマレイン酸無水物、2−(2−カルボキシエチル)−3−メチルマレイン酸無水物、3,4,5,6−テトラヒドロフタル酸無水物、フェニルマレイン酸無水物、2,3−ジフェニルマレイン酸無水物、アリルこはく酸無水物、(2−メチル−2−プロペニル)こはく酸無水物、2−ブテン−1−イルこはく酸無水物、cis−4−シクロヘキセン−1,2−ジカルボン酸無水物、5−ノルボルネン−2,3−ジカルボン酸無水物、ビシクロ[2.2.2]オクト−5−エン−2,3−ジカルボン酸無水物等が挙げられる。 Examples of the unsaturated dicarboxylic acid anhydride include maleic anhydride, citraconic anhydride, itaconic anhydride, 2,3-dimethylmaleic anhydride, 2- (2-carboxyethyl) -3-methylmaleic anhydride, 3,4,5,6-tetrahydrophthalic anhydride, phenylmaleic anhydride, 2,3-diphenylmaleic anhydride, allyl succinic anhydride, (2-methyl-2-propenyl) succinic anhydride, 2-buten-1-yl succinic anhydride, cis-4-cyclohexene-1,2-dicarboxylic anhydride, 5-norbornene-2,3-dicarboxylic anhydride, bicyclo [2.2.2] oct- 5-ene-2,3-dicarboxylic acid anhydride and the like.
不飽和ジカルボン酸無水物は、例えば、下記式(4−1)で表される構造を有する化合物であってよい。 The unsaturated dicarboxylic acid anhydride may be, for example, a compound having a structure represented by the following formula (4-1).
式中、R1は水素原子、ハロゲン原子、アルキル基、ハロゲン化アルキル基又はアリール基を示し、2つのR1は互いに同一でも異なっていてもよい。 In the formula, R 1 represents a hydrogen atom, a halogen atom, an alkyl group, a halogenated alkyl group or an aryl group, and the two R 1 s may be the same as or different from each other.
不飽和ジカルボン酸無水物が式(4−1)で表される構造を有する化合物であると、共重合体の主鎖の形状及び運動性が、不飽和ジカルボン酸無水物由来の環構造により制御されるため、耐熱性及び光学特性に一層優れたイミド架橋型樹脂が得られる。 When the unsaturated dicarboxylic acid anhydride is a compound having a structure represented by the formula (4-1), the shape and mobility of the main chain of the copolymer are controlled by the ring structure derived from the unsaturated dicarboxylic acid anhydride. Therefore, an imide cross-linked resin having further excellent heat resistance and optical properties can be obtained.
R1のハロゲン原子としては、フッ素原子、塩素原子、臭素原子、ヨウ素原子が挙げられる。ハロゲン原子は、フッ素原子、塩素原子又は臭素原子であることが好ましく、フッ素原子であることがより好ましい。 Examples of the halogen atom for R 1 include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. The halogen atom is preferably a fluorine atom, a chlorine atom or a bromine atom, and more preferably a fluorine atom.
R1のアルキル基は、直鎖状、分岐状又は環状であってよい。アルキル基の炭素数は、例えば1〜30であってよく、好ましくは1〜10である。アルキル基の具体例としては、メチル基、エチル基、イソプロピル基、tert−ブチル等が挙げられる。 The alkyl group for R 1 may be linear, branched or cyclic. Carbon number of an alkyl group may be 1-30, for example, Preferably it is 1-10. Specific examples of the alkyl group include a methyl group, an ethyl group, an isopropyl group, and tert-butyl.
R1のハロゲン化アルキル基は、アルキル基が有する水素原子の一部又は全部がハロゲン原子に置換した基である。アルキル基及びハロゲン原子としては上記と同じ例が挙げられる。ハロゲン化アルキル基としては、例えば、トリフルオロメチル基、クロロメチル基、ブロモメチル基等が挙げられる。 The halogenated alkyl group for R 1 is a group in which part or all of the hydrogen atoms of the alkyl group are substituted with halogen atoms. Examples of the alkyl group and the halogen atom are the same as described above. Examples of the halogenated alkyl group include a trifluoromethyl group, a chloromethyl group, and a bromomethyl group.
R1のアリール基としては、例えば、フェニル基、ナフチル基、アントラセニル基等が挙げられる。 Examples of the aryl group for R 1 include a phenyl group, a naphthyl group, and an anthracenyl group.
R1は、好ましくは水素原子、アルキル基又はハロゲン化アルキル基であり、より好ましくは水素原子又はアルキル基である。また、環状オレフィンとの反応性に優れ、共重合体の製造が容易となる観点からは、R1のうち、少なくとも1つは水素原子であることが好ましい。 R 1 is preferably a hydrogen atom, an alkyl group or a halogenated alkyl group, more preferably a hydrogen atom or an alkyl group. Further, from the viewpoint of excellent reactivity with the cyclic olefin and facilitating the production of the copolymer, at least one of R 1 is preferably a hydrogen atom.
不飽和ジカルボン酸無水物単位は、例えば、無水コハク酸が有する水素原子の一部又は全部を除いた構造を有していてよい。 The unsaturated dicarboxylic acid anhydride unit may have, for example, a structure in which some or all of the hydrogen atoms of succinic anhydride are removed.
不飽和ジカルボン酸無水物が式(4−1)で表される構造を有する化合物であるとき、不飽和ジカルボン酸無水物単位は、下記式(4−2)で表される構造を有する構成単位であってよい。なお、式中、R1は上記と同義である。 When the unsaturated dicarboxylic acid anhydride is a compound having a structure represented by the formula (4-1), the unsaturated dicarboxylic acid anhydride unit is a structural unit having a structure represented by the following formula (4-2) It may be. In the formula, R 1 has the same meaning as described above.
(iii)マレイミド系単位
本実施形態における共重合体は、マレイミド系化合物に由来する構成単位(マレイミド系単位)を更に有していてよい。マレイミド系化合物は、例えば下記式(5−1)で表される構造を有する化合物であり、マレイミド系単位は、例えば下記式(5−2)で表される構造を有する構成単位である。
(Iii) Maleimide-based unit The copolymer in the present embodiment may further have a structural unit (maleimide-based unit) derived from a maleimide-based compound. A maleimide-type compound is a compound which has a structure represented, for example by following formula (5-1), and a maleimide-type unit is a structural unit which has a structure represented, for example by following formula (5-2).
式中、R2は水素原子、ハロゲン原子、アルキル基、ハロゲン化アルキル基又はアリール基を示し、2つのR2は互いに同一でも異なっていてもよい。R3は一価の基を示す。 In the formula, R 2 represents a hydrogen atom, a halogen atom, an alkyl group, a halogenated alkyl group or an aryl group, and two R 2 s may be the same or different from each other. R 3 represents a monovalent group.
R2のハロゲン原子としては、フッ素原子、塩素原子、臭素原子、ヨウ素原子が挙げられる。ハロゲン原子は、フッ素原子、塩素原子又は臭素原子であることが好ましく、フッ素原子であることがより好ましい。 Examples of the halogen atom for R 2 include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. The halogen atom is preferably a fluorine atom, a chlorine atom or a bromine atom, and more preferably a fluorine atom.
R2のアルキル基は、直鎖状、分岐状又は環状であってよい。アルキル基の炭素数は、例えば1〜30であってよく、好ましくは1〜10である。アルキル基の具体例としては、メチル基、エチル基、イソプロピル基、tert−ブチル等が挙げられる。 The alkyl group for R 2 may be linear, branched or cyclic. Carbon number of an alkyl group may be 1-30, for example, Preferably it is 1-10. Specific examples of the alkyl group include a methyl group, an ethyl group, an isopropyl group, and tert-butyl.
R2のハロゲン化アルキル基は、アルキル基が有する水素原子の一部又は全部がハロゲン原子に置換した基である。アルキル基及びハロゲン原子としては上記と同じ例が挙げられる。ハロゲン化アルキル基としては、例えば、トリフルオロメチル基、クロロメチル基、ブロモメチル基等が挙げられる。 The halogenated alkyl group for R 2 is a group in which part or all of the hydrogen atoms of the alkyl group are substituted with halogen atoms. Examples of the alkyl group and the halogen atom are the same as described above. Examples of the halogenated alkyl group include a trifluoromethyl group, a chloromethyl group, and a bromomethyl group.
R2のアリール基としては、例えば、フェニル基、ナフチル基、アントラセニル基等が挙げられる。 Examples of the aryl group for R 2 include a phenyl group, a naphthyl group, and an anthracenyl group.
R2は、好ましくは水素原子、アルキル基又はハロゲン化アルキル基であり、より好ましくは水素原子又はアルキル基である。また、環状オレフィン及び不飽和ジカルボン酸無水物との反応性に優れ、共重合体の製造が容易となる観点からは、R2のうち、少なくとも1つは水素原子であることが好ましい。 R 2 is preferably a hydrogen atom, an alkyl group or a halogenated alkyl group, more preferably a hydrogen atom or an alkyl group. In addition, from the viewpoint of excellent reactivity with cyclic olefins and unsaturated dicarboxylic acid anhydrides, and easy production of the copolymer, at least one of R 2 is preferably a hydrogen atom.
R3の一価の基は、環状オレフィンとの重合反応を阻害しない範囲であれば特に制限されない。R3の一価の基としては、例えば、アルキル基、ハロゲン化アルキル基、アリール基、アルコキシカルボニル基、アラルキル基、シリル基等が挙げられる。一価の基は更に置換基を有していてよく、当該置換基としては、例えば、ハロゲン原子、アルキル基、アリール基、アミノ基、アルコキシ基、アリールオキシ基、アルキルチオ基、アリールチオ基、シリル基等が挙げられる。 The monovalent group of R 3 is not particularly limited as long as it does not inhibit the polymerization reaction with the cyclic olefin. Examples of the monovalent group of R 3 include an alkyl group, a halogenated alkyl group, an aryl group, an alkoxycarbonyl group, an aralkyl group, and a silyl group. The monovalent group may further have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an aryl group, an amino group, an alkoxy group, an aryloxy group, an alkylthio group, an arylthio group, and a silyl group. Etc.
アルキル基、ハロゲン化アルキル基、アリール基、アラルキル基、アルコキシ基、アルコキシカルボニル基及びシリル基としては上記と同じ例が挙げられる。 Examples of the alkyl group, halogenated alkyl group, aryl group, aralkyl group, alkoxy group, alkoxycarbonyl group, and silyl group are the same as described above.
アルキルチオ基は、−SR(Rはアルキル基を示す。)で表される基であり、Rのアルキル基としては上記と同じ例が挙げられる。アルキルチオ基としては、例えば、メチルチオ基、エチルチオ基、プロピルチオ基等が挙げられる。 The alkylthio group is a group represented by —SR (R represents an alkyl group), and examples of the alkyl group of R include the same examples as described above. Examples of the alkylthio group include a methylthio group, an ethylthio group, and a propylthio group.
アリールオキシ基及びアリールチオ基は、それぞれ−OR’’及び−SR’’(R’’はアリール基を示す。)で表される基であり、R’’のアリール基としては上記と同じ例が挙げられる。アリールオキシ基としては、例えば、フェノキシ基、ナフトキシ基等が挙げられ、アリールチオ基としては、例えば、フェニルチオ基、ナフチルチオ基等が挙げられる。 The aryloxy group and the arylthio group are groups represented by —OR ″ and —SR ″ (R ″ represents an aryl group), respectively. Can be mentioned. Examples of the aryloxy group include a phenoxy group and a naphthoxy group, and examples of the arylthio group include a phenylthio group and a naphthylthio group.
(iv)その他の構成単位
本実施形態における共重合体は、上記以外の構成単位を更に有していてよい。例えば、共重合体は、マレイミド基を2つ有するビスマレイミド系化合物に由来する構造単位を更に有していてよい。
(Iv) Other structural unit The copolymer in this embodiment may further have structural units other than the above. For example, the copolymer may further have a structural unit derived from a bismaleimide compound having two maleimide groups.
ビスマレイミド系化合物としては、例えば、4,4’−ビスマレイミドジフェニルメタン、1,6−ビス(マレイミド)ヘキサン、ビス(3−エチル−5−メチル−4−マレイミドフェニル)メタン、1,4−ビス(マレイミド)ブタン、2,2−ビス[4−(4−マレイミドフェノキシ)フェニル]プロパン、1,2−ビス(マレイミド)エタン、N,N’−1,4−フェニレンジマレイミド、N,N’−1,3−フェニレンジマレイミド等が挙げられる。 Examples of bismaleimide compounds include 4,4′-bismaleimide diphenylmethane, 1,6-bis (maleimido) hexane, bis (3-ethyl-5-methyl-4-maleimidophenyl) methane, and 1,4-bis. (Maleimido) butane, 2,2-bis [4- (4-maleimidophenoxy) phenyl] propane, 1,2-bis (maleimido) ethane, N, N′-1,4-phenylenedimaleimide, N, N ′ Examples include -1,3-phenylene dimaleimide.
また、共重合体は、不飽和ジカルボン酸無水物又はマレイミド系化合物と交互共重合が可能なオレフィン化合物に由来する構成単位を更に有していてよい。 Moreover, the copolymer may further have a structural unit derived from an olefin compound capable of alternating copolymerization with an unsaturated dicarboxylic anhydride or a maleimide compound.
オレフィン化合物としては、例えば、スチレン、インデン、α−メチルスチレン、p−メチルスチレン等のスチレン誘導体;エチルビニルエーテル、n−プロピルビニルエーテル、イソプロピルビニルエーテル、n−ブチルビニルエーテル、イソブチルビニルエーテル、2−エチルヘキシルビニルエーテル、シクロヘキシルビニルエーテル等のアルキルモノビニルエーテル誘導体などが挙げられる。 Examples of the olefin compound include styrene derivatives such as styrene, indene, α-methylstyrene, p-methylstyrene; ethyl vinyl ether, n-propyl vinyl ether, isopropyl vinyl ether, n-butyl vinyl ether, isobutyl vinyl ether, 2-ethylhexyl vinyl ether, cyclohexyl. Examples thereof include alkyl monovinyl ether derivatives such as vinyl ether.
本実施形態における共重合体は、例えば、環状オレフィン及び不飽和ジカルボン酸無水物を含むモノマー成分の重合反応により得ることができる。モノマー成分は、マレイミド系化合物を更に含んでいてよく、他のモノマーを更に含んでいてもよい。 The copolymer in the present embodiment can be obtained, for example, by a polymerization reaction of monomer components including a cyclic olefin and an unsaturated dicarboxylic acid anhydride. The monomer component may further contain a maleimide compound and may further contain other monomers.
重合反応の形態は特に限定されず、例えば、ラジカル重合であってよい。 The form of the polymerization reaction is not particularly limited, and may be radical polymerization, for example.
重合反応がラジカル重合であるとき、重合開始剤としては、公知のラジカル重合開始剤を用いてよい。ラジカル重合開始剤としては、例えば、アゾビスイソブチロニトリル(AIBN)、ジ−tert−ブチルペルオキシド、tert−ブチルヒドロペルオキシド、過酸化ベンゾイル(BPO)、メチルエチルケトンペルオキシド、レドックス開始剤(過酸化水素と鉄(II)塩、過硫酸塩と亜硫酸水素ナトリウム等)、トリエチルボラン(Et3B)、ジエチル亜鉛(Et2Zn)等が挙げられる。 When the polymerization reaction is radical polymerization, a known radical polymerization initiator may be used as the polymerization initiator. Examples of the radical polymerization initiator include azobisisobutyronitrile (AIBN), di-tert-butyl peroxide, tert-butyl hydroperoxide, benzoyl peroxide (BPO), methyl ethyl ketone peroxide, redox initiator (hydrogen peroxide and Iron (II) salt, persulfate and sodium bisulfite), triethylborane (Et 3 B), diethyl zinc (Et 2 Zn) and the like.
ラジカル重合開始剤の使用量は、例えば、モノマー成分の総量基準で0.1〜10mol%であってよく、好ましくは1〜5mol%である。 The usage-amount of a radical polymerization initiator may be 0.1-10 mol% on the basis of the total amount of a monomer component, for example, Preferably it is 1-5 mol%.
重合反応は溶媒中で実施することが好ましい。溶媒としては、例えば、テトラヒドロフラン(THF)、ジオキサン、ジオキソラン、アセトン、クロロホルム、トルエン、ジメチルホルムアミド(DMF)、ジメチルアセトアミド(DMAc)、N−メチルピロリドン(NMP)、ジメチルスルホキシド(DMSO)、γ−ブチロラクトン、シクロペンタノン、シクロヘキサノン、テトラメチルウレア、1,3−ジメチル−2−イミダゾリジノン、ジグライム等のグライム系溶剤、エチルセロソルブ等のセロソルブ系溶剤、プロピレングリコールモノメチルエーテルアセテート等のグリコールエステル系溶剤、プロピレングリコールモノメチルエーテル等のグリコールエーテル系溶剤などを好適に用いることができる。 The polymerization reaction is preferably carried out in a solvent. Examples of the solvent include tetrahydrofuran (THF), dioxane, dioxolane, acetone, chloroform, toluene, dimethylformamide (DMF), dimethylacetamide (DMAc), N-methylpyrrolidone (NMP), dimethylsulfoxide (DMSO), and γ-butyrolactone. , Cyclopentanone, cyclohexanone, tetramethyl urea, 1,3-dimethyl-2-imidazolidinone, glyme solvents such as diglyme, cellosolv solvents such as ethyl cellosolve, glycol ester solvents such as propylene glycol monomethyl ether acetate, Glycol ether solvents such as propylene glycol monomethyl ether can be suitably used.
重合反応の条件は特に限定されず、例えば反応温度は−20〜200℃であってよく、反応時間は0.1〜100時間であってよい。 The conditions for the polymerization reaction are not particularly limited. For example, the reaction temperature may be -20 to 200 ° C, and the reaction time may be 0.1 to 100 hours.
<架橋体>
本実施形態に係るイミド架橋型樹脂は、上記共重合体をジアミンで架橋した架橋体であり、共重合体中の酸無水物とジアミンとの反応により形成されたイミド結合を有する。
<Crosslinked product>
The imide cross-linked resin according to this embodiment is a cross-linked product obtained by cross-linking the above copolymer with a diamine, and has an imide bond formed by a reaction between an acid anhydride in the copolymer and a diamine.
本実施形態では、共重合体中の不飽和ジカルボン酸無水物単位のうち一部又は全部がジアミンと反応してイミド結合を形成していてよい。共重合体中の不飽和ジカルボン酸無水物単位の総量を基準として、イミド架橋型樹脂中に残存する不飽和ジカルボン酸無水物単位の量は、90mol%以下であることが好ましく、70mol%以下であることがより好ましく、50mol%以下であることがさらに好ましい。 In this embodiment, some or all of the unsaturated dicarboxylic anhydride units in the copolymer may react with diamine to form an imide bond. Based on the total amount of unsaturated dicarboxylic acid anhydride units in the copolymer, the amount of unsaturated dicarboxylic acid anhydride units remaining in the imide cross-linked resin is preferably 90 mol% or less, and 70 mol% or less. More preferably, it is more preferably 50 mol% or less.
ジアミンは、共重合体中の酸無水物と反応してイミド結合を形成可能なアミノ基を2つ有する化合物であればよい。 The diamine should just be a compound which has two amino groups which can react with the acid anhydride in a copolymer and can form an imide bond.
ジアミンとしては、芳香族ジアミン、脂肪族ジアミン等が挙げられる。本明細書中、芳香族ジアミンは、芳香環に結合したアミノ基を2つ有する化合物を示し、脂肪族ジアミンは、sp3炭素に結合したアミノ基を2つ有する化合物を示す。また、ジアミンは、芳香環に結合したアミノ基とsp3炭素に結合したアミノ基とを有する化合物であってもよい。 Examples of diamines include aromatic diamines and aliphatic diamines. In the present specification, an aromatic diamine indicates a compound having two amino groups bonded to an aromatic ring, and an aliphatic diamine indicates a compound having two amino groups bonded to an sp 3 carbon. The diamine may also be a compound having an amino group bonded to an aromatic ring and an amino group bonded to an sp 3 carbon.
芳香族ジアミンとしては、例えば下記式(6−1)〜(6−4)で表される構造を有する化合物が挙げられる。 Examples of the aromatic diamine include compounds having structures represented by the following formulas (6-1) to (6-4).
式中、Q1は、二価の基を示す。 In the formula, Q 1 represents a divalent group.
これらの芳香族ジアミンは、置換基を有していてよい。置換基は、架橋反応を阻害しない範囲であれば特に制限されない。置換基は、例えば、ハロゲン原子、アルキル基、ハロゲン化アルキル基、アリール基、スルホ基、アルコキシ基、アリールオキシ基、シリル基、ヒドロキシ基、チオール基、アルキルチオ基、アリールチオ基、ニトリル基、ケトン基、カルボキシル基等であってよい。また、これらの置換基に更に他の置換基が置換していてもよい。 These aromatic diamines may have a substituent. The substituent is not particularly limited as long as it does not inhibit the crosslinking reaction. Substituents are, for example, halogen atoms, alkyl groups, halogenated alkyl groups, aryl groups, sulfo groups, alkoxy groups, aryloxy groups, silyl groups, hydroxy groups, thiol groups, alkylthio groups, arylthio groups, nitrile groups, ketone groups. May be a carboxyl group or the like. Further, these substituents may be further substituted with other substituents.
ハロゲン原子、アルキル基、ハロゲン化アルキル基、アリール基、アルコキシ基、アリールオキシ基、シリル基、アルキルチオ基、アリールチオ基としては上記と同じ例が挙げられる。 Examples of the halogen atom, alkyl group, halogenated alkyl group, aryl group, alkoxy group, aryloxy group, silyl group, alkylthio group, and arylthio group are the same as described above.
ケトン基は、−COR’(R’はアルキル基、アリール基又はアラルキル基を示す。)で表される基であり、R’のアルキル基、アリール基及びアラルキル基としては上記と同じ例が挙げられる。ケトン基としては、例えば、メチルカルボニル基、フェニルカルボニル基、ベンジルカルボニル基等が挙げられる。 The ketone group is a group represented by —COR ′ (R ′ represents an alkyl group, an aryl group or an aralkyl group). Examples of the alkyl group, aryl group and aralkyl group of R ′ are the same as those described above. It is done. Examples of the ketone group include a methylcarbonyl group, a phenylcarbonyl group, and a benzylcarbonyl group.
Q1における二価の基は、架橋反応を阻害しない範囲であれば特に制限されない。二価の基の具体例としては、−O−、−S−、−CH2−、−SO2−、−CO−、−O−C6H4−O−、−NHCO−、−O−C6H4−C(Me)2−C6H4−O−、−O−C6H4−C(CF3)2−C6H4−O−、−C(Me)2−C6H4−C(Me)2−、−O−C6H4−C6H4−O−、−O−C6H4−SO2−C6H4−O−、−C6H4−、−NHCO−C6H4−CONH−、−CONH−C6H4−NHCO−、−(Si(OMe)2−O)n−、−(Si(OEt)2−O)n−、−(Si(OPh)2−O)x−等が挙げられる。なお、xは1以上の整数を示し、好ましくは1〜100の整数である。 The divalent group in Q 1 is not particularly limited as long as it does not inhibit the crosslinking reaction. Specific examples of the divalent group include —O—, —S—, —CH 2 —, —SO 2 —, —CO—, —O—C 6 H 4 —O—, —NHCO—, —O—. C 6 H 4 -C (Me) 2 -C 6 H 4 -O -, - O-C 6 H 4 -C (CF 3) 2 -C 6 H 4 -O -, - C (Me) 2 -C 6 H 4 -C (Me) 2 -, - O-C 6 H 4 -C 6 H 4 -O -, - O-C 6 H 4 -SO 2 -C 6 H 4 -O -, - C 6 H 4 -, - NHCO-C 6 H 4 -CONH -, - CONH-C 6 H 4 -NHCO -, - (Si (OMe) 2 -O) n -, - (Si (OEt) 2 -O) n - , — (Si (OPh) 2 —O) x — and the like. In addition, x shows an integer greater than or equal to 1, Preferably it is an integer of 1-100.
脂肪族ジアミンとしては、例えば下記式(7−1)〜(7−7)で表される構造を有する化合物が挙げられる。 Examples of the aliphatic diamine include compounds having structures represented by the following formulas (7-1) to (7-7).
式中、Q2は二価の基を示す。 In the formula, Q 2 represents a divalent group.
これらの脂肪族ジアミンは、置換基を有していてよい。置換基は、架橋反応を阻害しない範囲であれば特に制限されない。置換基は、例えば、ハロゲン原子、アルキル基、ハロゲン化アルキル基、アリール基、スルホ基、アルコキシ基、アリールオキシ基、シリル基、ヒドロキシ基、チオール基、アルキルチオ基、アリールチオ基、ニトリル基、ケトン基、カルボキシル基等であってよい。また、これらの置換基に更に他の置換基が置換していてもよい。これらの基の例としては、上記と同じ例が挙げられる。 These aliphatic diamines may have a substituent. The substituent is not particularly limited as long as it does not inhibit the crosslinking reaction. Substituents are, for example, halogen atoms, alkyl groups, halogenated alkyl groups, aryl groups, sulfo groups, alkoxy groups, aryloxy groups, silyl groups, hydroxy groups, thiol groups, alkylthio groups, arylthio groups, nitrile groups, ketone groups. May be a carboxyl group or the like. Further, these substituents may be further substituted with other substituents. Examples of these groups include the same examples as described above.
Q2における二価の基は、架橋反応を阻害しない範囲であれば特に制限されない。二価の基の具体例としては、−O−、−S−、−CH2−、−SO2−、−CO−、−O−C6H4−O−、−NHCO−、−O−C6H4−C(Me)2−C6H4−O−、−O−C6H4−C(CF3)2−C6H4−O−、−C(Me)2−C6H4−C(Me)2−、−O−C6H4−C6H4−O−、−O−C6H4−SO2−C6H4−O−、−C6H4−、−NHCO−C6H4−CONH−、−CONH−C6H4−NHCO−、−(Si(OMe)2−O)n−、−(Si(OEt)2−O)n−、−(Si(OPh)2−O)x−等が挙げられる。なお、xは1以上の整数を示し、好ましくは1〜100の整数である。 The divalent group in Q 2 is not particularly limited as long as it does not inhibit the crosslinking reaction. Specific examples of the divalent group include —O—, —S—, —CH 2 —, —SO 2 —, —CO—, —O—C 6 H 4 —O—, —NHCO—, —O—. C 6 H 4 -C (Me) 2 -C 6 H 4 -O -, - O-C 6 H 4 -C (CF 3) 2 -C 6 H 4 -O -, - C (Me) 2 -C 6 H 4 -C (Me) 2 -, - O-C 6 H 4 -C 6 H 4 -O -, - O-C 6 H 4 -SO 2 -C 6 H 4 -O -, - C 6 H 4 -, - NHCO-C 6 H 4 -CONH -, - CONH-C 6 H 4 -NHCO -, - (Si (OMe) 2 -O) n -, - (Si (OEt) 2 -O) n - , — (Si (OPh) 2 —O) x — and the like. In addition, x shows an integer greater than or equal to 1, Preferably it is an integer of 1-100.
また、ジアミンは、例えば、ポリシロキサンの末端又は側鎖にアミノ基が導入されたポリシロキサン系ジアミンであってもよい。ポリシロキサン系ジアミンの分子量は、例えば100〜100000であってよく、200〜50000であってもよい。 The diamine may be, for example, a polysiloxane diamine having an amino group introduced at the terminal or side chain of the polysiloxane. The molecular weight of the polysiloxane diamine may be, for example, 100 to 100,000, or 200 to 50,000.
ジアミンの具体例としては、1,4−フェニレンジアミン、1,3−フェニレンジアミン、1,2−フェニレンジアミン、4,4’−エチレンジアニリン、2,2’−エチレンジアニリン、3,3’−ジアミノジフェニルエタン、4,4’−ジアミノビフェニル、3,3’−ジアミノビフェニル、2,2’−ジアミノビフェニル、3,4’−ジアミノビフェニル、4,4’−ジアミノ−2,2’−ジメチルビフェニル、4,4’−ジアミノ−3,3’−ジメチルビフェニル、4,4’−ジアミノオクタフルオロビフェニル、2,5−ジメチル−1,4−フェニレンジアミン、2,3,5,6−テトラフルオロ−1,4−フェニレンジアミン、2,3,5,6−テトラメチル−1,4−フェニレンジアミン、2,4,5,6−テトラフルオロ−1,3−フェニレンジアミン、1,3,5−トリス(4−アミノフェニル)ベンゼン、2,5−ジクロロ−1,4−フェニレンジアミン、2,6−ジブロモ−1,4−フェニレンジアミン、2,7−ジアミノフルオレン、1,5−ジアミノナフタレン、1,4−ジアミノナフタレン、2,6−ジアミノナフタレン、1,3−ジアミノピレン、1,6−ジアミノピレン、1,8−ジアミノピレン、3,3’−ジアミノジフェニルメタン、3,4’−ジアミノジフェニルメタン、4,4’−ジアミノジフェニルメタン、4,4’−ジアミノ−3,3’−ジメチルジフェニルメタン、4,4’−メチレンビス(2−クロロアニリン)、4,4’−メチレンビス(2−エチル−6−メチルアニリン)、4,4’−メチレンビス(2,6−ジエチルアニリン)、4,4’’−ジアミノ−p−ターフェニル、α,α’−ビス(4−アミノフェニル)−1,4−ジイソプロピルベンゼン、1,1−ビス(4−アミノフェニル)シクロヘキサン、1,3−ビス[2−(4−アミノフェニル)−2−プロピル]ベンゼン、4,4’−ジアミノ−2,2’−ジメチルビベンジル、o−トリジン、m−トリジン、3,3’−ジエチルベンジジン、3,3’,5,5’−テトラメチルベンジジン、2,2’,5,5’−テトラクロロベンジジン、2,2’−ビス(トリフルオロメチル)−4,4’−ジアミノビフェニル、3,3’−ジヒドロキシベンジジン、1,5−ビス(4−アミノフェノキシ)ペンタン、3,3’−ジアミノベンジジン、o−ジアニシジン、9,9−ビス(4−アミノフェニル)フルオレン、9,9−ビス(4−アミノ−3−クロロフェニル)フルオレン、9,9−ビス(4−アミノ−3−フルオロフェニル)フルオレン、9,9−ビス(4−アミノ−3−メチルフェニル)フルオレン、9,9−ビス(3−アミノ−4−ヒドロキシフェニル)フルオレン、2,7−ジアミノ−9,9−ジ−n−オクチルフルオレン、2,2−ビス(3−アミノ−4−ヒドロキシフェニル)プロパン、4,6−ジアミノレゾルシノール、2,5−ジアミノ−1,4−ベンゼンジチオール、4,4’−ジアミノベンゾフェノン、3,3’−ジアミノベンゾフェノン、3,3’−ジアミノジフェニルエーテル、3,4’−ジアミノジフェニルエーテル、4,4’−ジアミノジフェニルエーテル、1,4−ビス(4−アミノフェノキシ)ベンゼン、1,3−ビス(3−アミノフェノキシ)ベンゼン、1,3−ビス(4−アミノフェノキシ)ベンゼン、2,2−ビス[4−(4−アミノフェノキシ)フェニル]プロパン、4,4’−[1,3−フェニレンビス(1−メチル−エチリデン)]ビスアニリン、4,4’−[1,4−フェニレンビス(1−メチル−エチリデン)]ビスアニリン、4,4’−ビス(4−アミノフェノキシ)ビフェニル、1,4−ビス(4−アミノ−2−トリフルオロメチルフェノキシ)ベンゼン、4,4’−ジアミノジフェニルアミン、4,4’−ジアミノベンズアニリド、3,4’−ジアミノベンズアニリド、ビス(2−アミノフェニル)スルフィド、ビス(4−アミノフェニル)スルフィド、4,4’−ジチオジアニリン、2,2’−ジチオジアニリン、3,3’−ジアミノジフェニルスルホン、4,4’−ジアミノジフェニルスルホン、2,2’−ベンジジンジスルホン酸、ビス[4−(3−アミノフェノキシ)フェニル]スルホン、ビス[4−(4−アミノフェノキシ)フェニル]スルホン、ビス(3−アミノ−4−ヒドロキシフェニル)スルホン、3,7−ジアミノ−2,8−ジメチルジベンゾチオフェンスルホン、2,2−ビス(3−アミノ−4−メチルフェニル)ヘキサフルオロプロパン、2,2−ビス[4−(4−アミノフェノキシ)フェニル]ヘキサフルオロプロパン、2,2−ビス(4−アミノフェニル)ヘキサフルオロプロパン、2,2−ビス(3−アミノフェニル)ヘキサフルオロプロパン、2,2−ビス(3−アミノ−4−ヒドロキシフェニル)ヘキサフルオロプロパン、2,2’−ビス(トリフルオロメチル)ベンジジン、4,4’−ジアミノスチルベン、3,6−ジアミノカルバゾール、2,6−ジアミノアントラキノン、3,9−ビス[2−(3,5−ジアミノ−2,4,6−トリアザフェニル)エチル]−2,4,8,10−テトラオキサスピロ[5.5]ウンデカン、ベンゾグアナミン、2,4−ジアミノ−6−メチル−1,3,5−トリアジン、2,4−ジアミノ−6−ジメチルアミノ−1,3,5−トリアジン、2,4−ジアミノ−6−[2−(2−メチル−1−イミダゾール)エチル]−1,3,5−トリアジン、2,4−ジアミノ−6−[2−(2−ウンデシル−1−イミダゾール)エチル]−1,3,5−トリアジン、2,2’−ジアミノ−4,4’−ビチアゾール、エチレンジアミン、1,2−ジアミノプロパン、1,3−ジアミノプロパン、1,4−ジアミノブタン、1,5−ジアミノペンタン、1,6−ジアミノヘキサン、1,7−ジアミノヘプタン、1,8−ジアミノオクタン、1,10−ジアミノデカン、1,11−ジアミノウンデカン、1,12−ジアミノドデカン、2−メチル−1,3−プロパンジアミン、2,2−ジメチル−1,3−プロパンジアミン、1,2−ジアミノ−2−メチルプロパン、2,3−ジメチル−2,3−ブタンジアミン、2−メチル−1,5−ジアミノペンタン、2,2’−オキシビス(エチルアミン)、1,2−ビス(2−アミノエトキシ)エタン、1,4−ブタンジオールビス(3−アミノプロピル)エーテル、ジエチレングリコールビス(3−アミノプロピル)エーテル、1,14−ジアミノ−3,6,9,12−テトラオキサテトラデカン、ジエチレントリアミン、トリエチレンテトラアミン、3,3’−ジアミノジプロピルアミン、2,2’−ジアミノ−N−メチルジエチルアミン、3,3’−ジアミノ−N−メチルジプロピルアミン、N,N’−ビス(2−アミノエチル)−1,3−プロパンジアミン、N,N’−ビス(3−アミノプロピル)エチレンジアミン、N,N’−ビス(3−アミノプロピル)−1,4−ブタンジアミン、2,2’−チオビス(エチルアミン)、m−キシリレンジアミン、p−キシリレンジアミン、cis−1,3−ビス(アミノメチル)シクロヘキサン、1,3−ビス(3−アミノプロピル)テトラメチルジシロキサン、信越化学製アミノ変性シリコーンオイル(例えば、X−22−1660B−3(Mw:4400)、X−22−161B(Mw:3000)、X−22−161A(Mw:1600)X−22−9409(Mw:1340)等)、Gelest社製ジメチルシロキサン型ジアミン(例えば、DMS−A11、DMS−A12、DMS−A15、DMS−A21、DMS−A31、DMS−A32、DMS−A35等)、1,3−シクロヘキサンジアミン、1,4−シクロヘキサンジアミン、cis−1,3−シクロヘキサンジアミン、trans−1,3−シクロヘキサンジアミン、cis−1,4−シクロヘキサンジアミン、trans−1,4−シクロヘキサンジアミン、4,4’−メチレンビス(2−メチルシクロヘキシルアミン)、1,3−ビス(アミノメチル)シクロヘキサン、1,4−ビス(アミノメチル)シクロヘキサン、4,4’−メチレンビス(シクロヘキシルアミン)、ビス(アミノメチル)ノルボルナン、イソフォロンジアミン、3(4),8(9)−ビス(アミノメチル)トリシクロ[5.2.1.02,6]デカン、3−アミノベンジルアミン、4−アミノベンジルアミン、等が挙げられる。 Specific examples of the diamine include 1,4-phenylenediamine, 1,3-phenylenediamine, 1,2-phenylenediamine, 4,4′-ethylenedianiline, 2,2′-ethylenedianiline, 3,3 ′. -Diaminodiphenylethane, 4,4'-diaminobiphenyl, 3,3'-diaminobiphenyl, 2,2'-diaminobiphenyl, 3,4'-diaminobiphenyl, 4,4'-diamino-2,2'-dimethyl Biphenyl, 4,4′-diamino-3,3′-dimethylbiphenyl, 4,4′-diaminooctafluorobiphenyl, 2,5-dimethyl-1,4-phenylenediamine, 2,3,5,6-tetrafluoro -1,4-phenylenediamine, 2,3,5,6-tetramethyl-1,4-phenylenediamine, 2,4,5,6-tetrafluoro-1,3-phenyle Diamine, 1,3,5-tris (4-aminophenyl) benzene, 2,5-dichloro-1,4-phenylenediamine, 2,6-dibromo-1,4-phenylenediamine, 2,7-diaminofluorene, 1,5-diaminonaphthalene, 1,4-diaminonaphthalene, 2,6-diaminonaphthalene, 1,3-diaminopyrene, 1,6-diaminopyrene, 1,8-diaminopyrene, 3,3′-diaminodiphenylmethane, 3,4′-diaminodiphenylmethane, 4,4′-diaminodiphenylmethane, 4,4′-diamino-3,3′-dimethyldiphenylmethane, 4,4′-methylenebis (2-chloroaniline), 4,4′-methylenebis (2-ethyl-6-methylaniline), 4,4′-methylenebis (2,6-diethylaniline), 4,4 ″ -diamino- -Terphenyl, α, α'-bis (4-aminophenyl) -1,4-diisopropylbenzene, 1,1-bis (4-aminophenyl) cyclohexane, 1,3-bis [2- (4-aminophenyl) ) -2-propyl] benzene, 4,4'-diamino-2,2'-dimethylbibenzyl, o-tolidine, m-tolidine, 3,3'-diethylbenzidine, 3,3 ', 5,5'- Tetramethylbenzidine, 2,2 ′, 5,5′-tetrachlorobenzidine, 2,2′-bis (trifluoromethyl) -4,4′-diaminobiphenyl, 3,3′-dihydroxybenzidine, 1,5- Bis (4-aminophenoxy) pentane, 3,3′-diaminobenzidine, o-dianisidine, 9,9-bis (4-aminophenyl) fluorene, 9,9-bis (4-amino-3-chloropheny) ) Fluorene, 9,9-bis (4-amino-3-fluorophenyl) fluorene, 9,9-bis (4-amino-3-methylphenyl) fluorene, 9,9-bis (3-amino-4-hydroxy) Phenyl) fluorene, 2,7-diamino-9,9-di-n-octylfluorene, 2,2-bis (3-amino-4-hydroxyphenyl) propane, 4,6-diaminoresorcinol, 2,5-diamino -1,4-benzenedithiol, 4,4′-diaminobenzophenone, 3,3′-diaminobenzophenone, 3,3′-diaminodiphenyl ether, 3,4′-diaminodiphenyl ether, 4,4′-diaminodiphenyl ether, 1, 4-bis (4-aminophenoxy) benzene, 1,3-bis (3-aminophenoxy) benzene, 1,3-bis (4-aminophenoxy) benzene, 2,2-bis [4- (4-aminophenoxy) phenyl] propane, 4,4 ′-[1,3-phenylenebis (1-methyl-ethylidene)] bisaniline, 4, 4 ′-[1,4-phenylenebis (1-methyl-ethylidene)] bisaniline, 4,4′-bis (4-aminophenoxy) biphenyl, 1,4-bis (4-amino-2-trifluoromethylphenoxy) ) Benzene, 4,4′-diaminodiphenylamine, 4,4′-diaminobenzanilide, 3,4′-diaminobenzanilide, bis (2-aminophenyl) sulfide, bis (4-aminophenyl) sulfide, 4,4 '-Dithiodianiline, 2,2'-dithiodianiline, 3,3'-diaminodiphenylsulfone, 4,4'-diaminodiphenylsulfone, 2,2′-benzidine disulfonic acid, bis [4- (3-aminophenoxy) phenyl] sulfone, bis [4- (4-aminophenoxy) phenyl] sulfone, bis (3-amino-4-hydroxyphenyl) sulfone, 3,7-diamino-2,8-dimethyldibenzothiophene sulfone, 2,2-bis (3-amino-4-methylphenyl) hexafluoropropane, 2,2-bis [4- (4-aminophenoxy) phenyl] Hexafluoropropane, 2,2-bis (4-aminophenyl) hexafluoropropane, 2,2-bis (3-aminophenyl) hexafluoropropane, 2,2-bis (3-amino-4-hydroxyphenyl) hexa Fluoropropane, 2,2′-bis (trifluoromethyl) benzidine, 4,4′-diaminostilbene, , 6-diaminocarbazole, 2,6-diaminoanthraquinone, 3,9-bis [2- (3,5-diamino-2,4,6-triazaphenyl) ethyl] -2,4,8,10-tetra Oxaspiro [5.5] undecane, benzoguanamine, 2,4-diamino-6-methyl-1,3,5-triazine, 2,4-diamino-6-dimethylamino-1,3,5-triazine, 2, 4-diamino-6- [2- (2-methyl-1-imidazole) ethyl] -1,3,5-triazine, 2,4-diamino-6- [2- (2-undecyl-1-imidazole) ethyl ] -1,3,5-triazine, 2,2′-diamino-4,4′-bithiazole, ethylenediamine, 1,2-diaminopropane, 1,3-diaminopropane, 1,4-diaminobutane, 1,5 − Diaminopentane, 1,6-diaminohexane, 1,7-diaminoheptane, 1,8-diaminooctane, 1,10-diaminodecane, 1,11-diaminoundecane, 1,12-diaminododecane, 2-methyl-1 , 3-propanediamine, 2,2-dimethyl-1,3-propanediamine, 1,2-diamino-2-methylpropane, 2,3-dimethyl-2,3-butanediamine, 2-methyl-1,5 -Diaminopentane, 2,2'-oxybis (ethylamine), 1,2-bis (2-aminoethoxy) ethane, 1,4-butanediol bis (3-aminopropyl) ether, diethylene glycol bis (3-aminopropyl) Ether, 1,14-diamino-3,6,9,12-tetraoxatetradecane, diethylenetriamine, triethyl Rentetraamine, 3,3′-diaminodipropylamine, 2,2′-diamino-N-methyldiethylamine, 3,3′-diamino-N-methyldipropylamine, N, N′-bis (2-amino) Ethyl) -1,3-propanediamine, N, N′-bis (3-aminopropyl) ethylenediamine, N, N′-bis (3-aminopropyl) -1,4-butanediamine, 2,2′-thiobis (Ethylamine), m-xylylenediamine, p-xylylenediamine, cis-1,3-bis (aminomethyl) cyclohexane, 1,3-bis (3-aminopropyl) tetramethyldisiloxane, amino-modified by Shin-Etsu Chemical Silicone oils (for example, X-22-1660B-3 (Mw: 4400), X-22-161B (Mw: 3000), X-22-161A (Mw: 1600) X-22-9409 (Mw: 1340), etc.), dimethylsiloxane type diamine manufactured by Gelest (for example, DMS-A11, DMS-A12, DMS-A15, DMS-A21, DMS-A31, DMS-A32, DMS). -A35, etc.), 1,3-cyclohexanediamine, 1,4-cyclohexanediamine, cis-1,3-cyclohexanediamine, trans-1,3-cyclohexanediamine, cis-1,4-cyclohexanediamine, trans-1, 4-cyclohexanediamine, 4,4′-methylenebis (2-methylcyclohexylamine), 1,3-bis (aminomethyl) cyclohexane, 1,4-bis (aminomethyl) cyclohexane, 4,4′-methylenebis (cyclohexylamine) ), Bis (aminomethyl) Ruborunan, isophorone diamine, 3 (4), 8 (9) - bis (aminomethyl) tricyclo [5.2.1.0 2,6] decane, 3-amino-benzylamine, 4-amino-benzylamine, and the like Can be mentioned.
共重合体とジアミンとの架橋反応は、例えば、共重合体とジアミンとを反応させてポリアミック酸を形成する第一工程と、ポリアミック酸の脱水反応によりイミド結合を形成する第二工程と、により実施されてよい。 The cross-linking reaction between the copolymer and the diamine includes, for example, a first step in which a copolymer and a diamine are reacted to form a polyamic acid, and a second step in which an imide bond is formed by a dehydration reaction of the polyamic acid. May be implemented.
第一工程は、例えば、共重合体とジアミンとを溶媒中で反応させて、ポリアミック酸を得る工程であってよい。反応温度は、例えば−20〜200℃であってよく、反応時間は、例えば0.1〜100時間であってよい。 The first step may be, for example, a step of obtaining a polyamic acid by reacting a copolymer and a diamine in a solvent. The reaction temperature may be, for example, -20 to 200 ° C, and the reaction time may be, for example, 0.1 to 100 hours.
第一工程で用いる溶媒は、共重合体及びジアミンを溶解可能な溶媒であればよい。また、溶媒は、生成するポリアミック酸を溶解可能な溶媒であることが好ましい。溶媒としては、例えば、ジメチルアセトアミド(DMAc)、N−メチルピロリドン(NMP)、γ−ブチロラクトン、N,N−ジメチルホルムアミド(DMF)、ジメチルスルホキシド(DMSO)、テトラハイドロフラン(THF)、テトラメチルウレア、1,3−ジメチル−2−イミダゾリジノン、フェノール、p−クロロフェノール、ピリジン、シクロペンタノン、シクロヘキサノン等を好適に用いることができる。 The solvent used in the first step may be any solvent that can dissolve the copolymer and diamine. Moreover, it is preferable that a solvent is a solvent which can melt | dissolve the polyamic acid to produce | generate. Examples of the solvent include dimethylacetamide (DMAc), N-methylpyrrolidone (NMP), γ-butyrolactone, N, N-dimethylformamide (DMF), dimethyl sulfoxide (DMSO), tetrahydrofuran (THF), tetramethylurea. 1,3-dimethyl-2-imidazolidinone, phenol, p-chlorophenol, pyridine, cyclopentanone, cyclohexanone and the like can be preferably used.
共重合体と反応させるジアミンの量は、例えば、共重合体中の不飽和ジカルボン酸無水物単位の含有量を基準として、0.05当量以上であってよく、0.5当量以上であることがより好ましい。また、ジアミンの量は、例えば、共重合体中の不飽和ジカルボン酸無水物単位の含有量を基準として、1.5当量以下であってよく、1.0当量以下であることがより好ましい。 The amount of diamine to be reacted with the copolymer may be, for example, 0.05 equivalents or more, and 0.5 equivalents or more based on the content of unsaturated dicarboxylic anhydride units in the copolymer. Is more preferable. The amount of diamine may be 1.5 equivalents or less, and more preferably 1.0 equivalents or less, based on the content of unsaturated dicarboxylic anhydride units in the copolymer, for example.
第一工程では、ポリアミック酸を含む反応液が得られてよい。一態様においては、この反応液からポリアミック酸を回収し、回収したポリアミック酸を第二工程に供してよい。また、他の態様においては、この反応液を基板上に塗布してポリアミック酸の塗膜を形成した後、第二工程を実施してもよい。 In the first step, a reaction solution containing a polyamic acid may be obtained. In one aspect, the polyamic acid may be recovered from the reaction solution, and the recovered polyamic acid may be subjected to the second step. Moreover, in another aspect, after apply | coating this reaction liquid on a board | substrate and forming the coating film of a polyamic acid, you may implement a 2nd process.
第二工程では、ポリアミック酸の脱水反応によりイミド結合を形成して、イミド架橋型樹脂を得る。 In the second step, an imide bond is formed by dehydration reaction of polyamic acid to obtain an imide cross-linked resin.
脱水反応は、例えば、ポリアミック酸を加熱することにより実施してよい。脱水反応の反応温度は、例えば100〜400℃であってよく、反応時間は、例えば0.1〜100時間であってよい。 The dehydration reaction may be performed, for example, by heating a polyamic acid. The reaction temperature of the dehydration reaction may be, for example, 100 to 400 ° C., and the reaction time may be, for example, 0.1 to 100 hours.
なお、架橋反応の態様は上記のものに限定されない。例えば、架橋反応は、脱水触媒を用いて共重合体とジアミンとを反応させ、一段階でイミド結合を形成する反応であってもよい。脱水触媒としては、例えば、ピリジン、2−ヒドロキシピリジン、トリエチルアミン、イミダゾール、N−メチルピペリジン等が挙げられる。また、架橋反応は、発生する水をトラップする脱水剤の存在下に行ってよく、脱水剤としては、例えば、無水酢酸、無水プロピオン酸、無水トリフルオロ酢酸等が挙げられる。 In addition, the aspect of a crosslinking reaction is not limited to the above. For example, the crosslinking reaction may be a reaction in which a copolymer and a diamine are reacted using a dehydration catalyst to form an imide bond in one step. Examples of the dehydration catalyst include pyridine, 2-hydroxypyridine, triethylamine, imidazole, N-methylpiperidine and the like. The crosslinking reaction may be performed in the presence of a dehydrating agent that traps generated water. Examples of the dehydrating agent include acetic anhydride, propionic anhydride, and trifluoroacetic anhydride.
本実施形態に係るイミド架橋型樹脂は、共重合体中の酸無水物とジアミン中のアミノ基との反応により形成されたイミド結合を有している。本実施形態に係るイミド架橋型樹脂は、分子内に環状オレフィン由来の環構造とイミド結合を介した架橋構造とを備えることで、十分な光透過性及び良好な耐熱性を有する。このため、本実施形態に係るイミド架橋型樹脂は、表面保護フィルム用の樹脂材料として好適に利用できる。 The imide crosslinked resin according to this embodiment has an imide bond formed by a reaction between an acid anhydride in the copolymer and an amino group in the diamine. The imide cross-linked resin according to the present embodiment has sufficient light transmittance and good heat resistance by including in the molecule a cyclic structure derived from a cyclic olefin and a cross-linked structure via an imide bond. For this reason, the imide bridge | crosslinking type resin which concerns on this embodiment can be utilized suitably as a resin material for surface protection films.
(透明フィルム)
本実施形態に係る透明フィルムは、上記イミド架橋型樹脂を含む。本実施形態に係る透明フィルムは、例えば、表面保護フィルム用のフィルム基材として好適に用いることができる。なお、本明細書において、透明フィルムとは、可視光透過率(T450nm)が60%以上であるフィルムを示す。
(Transparent film)
The transparent film according to this embodiment includes the imide cross-linked resin. The transparent film which concerns on this embodiment can be used suitably as a film base material for surface protection films, for example. In addition, in this specification, a transparent film shows the film whose visible light transmittance ( T450nm ) is 60% or more.
透明フィルムの可視光透過率(T450nm)は、好ましくは80%以上であり、より好ましくは85%以上である。 The visible light transmittance (T 450 nm ) of the transparent film is preferably 80% or more, and more preferably 85% or more.
透明フィルムの厚さは特に限定されず、例えば1μm以上であっても10μm以上であってもよく、500μm以下であっても1000μm以下であってもよい。 The thickness of the transparent film is not particularly limited, and may be, for example, 1 μm or more, 10 μm or more, 500 μm or less, or 1000 μm or less.
透明フィルムは、イミド架橋型樹脂以外の成分を更に含有していてよい。例えば、透明フィルムは、酸化防止剤、光安定剤、帯電防止剤、滑剤、難燃剤、可塑剤、透明化剤、核剤、充填剤等を更に含有していてよい。 The transparent film may further contain components other than the imide crosslinked resin. For example, the transparent film may further contain an antioxidant, a light stabilizer, an antistatic agent, a lubricant, a flame retardant, a plasticizer, a clarifying agent, a nucleating agent, a filler, and the like.
透明フィルムの製造方法の好適な一態様について以下に説明する。 A preferred embodiment of the method for producing a transparent film will be described below.
本態様に係る透明フィルムの製造方法は、共重合体とジアミンとの反応物であるポリアミック酸を含有する塗布液を準備する準備工程と、塗布液を基板上に塗布して、ポリアミック酸を含有する塗膜を形成する塗布工程と、塗膜を加熱して、イミド架橋型樹脂を含有する透明フィルムを得る加熱工程と、を備えていてよい。 The manufacturing method of the transparent film which concerns on this aspect is a preparatory process which prepares the coating liquid containing the polyamic acid which is a reaction material of a copolymer and diamine, apply | coats a coating liquid on a board | substrate, and contains a polyamic acid The coating process which forms the coating film to perform, and the heating process of heating a coating film and obtaining the transparent film containing imide bridge | crosslinking type resin may be provided.
準備工程では、例えば、共重合体とジアミンとを溶媒中で反応させて、ポリアミック酸を含有する反応液を得て、当該反応液を塗布液としてよい。また、反応液からポリアミック酸を回収し、回収したポリアミック酸を溶媒に溶解させて塗布液を得てもよい。 In the preparation step, for example, the copolymer and diamine are reacted in a solvent to obtain a reaction solution containing polyamic acid, and the reaction solution may be used as a coating solution. Alternatively, polyamic acid may be recovered from the reaction solution, and the recovered polyamic acid may be dissolved in a solvent to obtain a coating solution.
塗布工程では、基板上に塗布液を塗布して塗膜を形成する。塗布方法は特に限定されず、公知の塗布方法(例えば、スピンコート法、バーコータ―法、スリット法、ダイコート法等)を用いてよい。 In the coating step, a coating solution is formed on the substrate to form a coating film. The coating method is not particularly limited, and a known coating method (for example, spin coating method, bar coater method, slit method, die coating method, etc.) may be used.
塗布工程では、塗布液の塗布後に溶媒を除去してもよい。溶媒の除去方法は特に限定されず、公知の除去方法(例えば、減圧下での加熱、常圧下での加熱、ホットプレートでの加熱、熱気流下での加熱、気流下での乾燥、遠赤外線加熱等)を用いてよい。 In the coating step, the solvent may be removed after coating the coating solution. The method for removing the solvent is not particularly limited, and a known removal method (for example, heating under reduced pressure, heating under normal pressure, heating on a hot plate, heating under a hot air current, drying under an air current, far infrared heating) Etc.) may be used.
基板は特に限定されず、所望の形状を有する塗膜を形成できる表面を有するものであればよい。基板としては、例えば、ガラス基板;銅、アルミ等の金属箔基板;スチール、ステンレス等の金属ベルト基板;ポリテトラフルオロエチレン、PPS、PET、アクリル樹脂、ポリエチレン、ポリプロピレン、ポリスチレン等の樹脂シート基板;などを好適に用いることができる。 The substrate is not particularly limited as long as it has a surface capable of forming a coating film having a desired shape. Examples of the substrate include a glass substrate; a metal foil substrate such as copper and aluminum; a metal belt substrate such as steel and stainless steel; a resin sheet substrate such as polytetrafluoroethylene, PPS, PET, acrylic resin, polyethylene, polypropylene, and polystyrene; Etc. can be used suitably.
加熱工程では、塗膜を加熱してポリアミック酸の脱水反応を進行させ、イミド架橋型樹脂を含有する透明フィルムを得る。加熱温度は、ポリアミック酸の脱水反応が進行する温度であればよく、例えば100〜400℃であってよく、好ましくは200〜300℃である。加熱時間は、例えば0.1〜100時間であってよく、好ましくは1〜10時間である。 In the heating step, the coating film is heated to advance the dehydration reaction of the polyamic acid to obtain a transparent film containing an imide cross-linked resin. The heating temperature may be a temperature at which the dehydration reaction of the polyamic acid proceeds, and may be, for example, 100 to 400 ° C, preferably 200 to 300 ° C. The heating time may be, for example, 0.1 to 100 hours, and preferably 1 to 10 hours.
(表面保護フィルム)
本実施形態に係る表面保護フィルムは、上記透明フィルムと、透明フィルムの少なくとも一方面上に設けられた金属蒸着層と、を備える。上記透明フィルムはイミド架橋型樹脂を含有し、耐熱性に優れる。このため、本実施形態では、透明フィルム上に金属を蒸着させた場合でも透明フィルムの熱による膨張・歪み等が十分に抑制され、良好な光透過性を有する表面保護フィルムが得られる。
(Surface protection film)
The surface protective film which concerns on this embodiment is provided with the said transparent film and the metal vapor deposition layer provided on the at least one surface of the transparent film. The transparent film contains an imide cross-linked resin and is excellent in heat resistance. For this reason, in this embodiment, even when a metal is vapor-deposited on a transparent film, the expansion, distortion, etc. by the heat | fever of a transparent film are fully suppressed, and the surface protection film which has favorable light transmittance is obtained.
金属蒸着層は、透明フィルム上に蒸着により形成された金属薄層である。金属は、例えばアルミ、シリコン等であってよく、これらの金属酸化物であってもよい。蒸着方法は特に限定されず、公知の蒸着方法を用いることができる。 A metal vapor deposition layer is a metal thin layer formed by vapor deposition on the transparent film. The metal may be, for example, aluminum, silicon, etc., and may be a metal oxide thereof. The vapor deposition method is not particularly limited, and a known vapor deposition method can be used.
金属蒸着層の厚さは、例えば1〜1000nmであってよく、100〜500nmであってもよい。 The thickness of the metal vapor deposition layer may be 1-1000 nm, for example, and may be 100-500 nm.
本実施形態に係る表面保護フィルムは、例えば、携帯情報端末のディスプレイ、タッチパネル、パソコン用ディスプレイ、テレビ用ディスプレイ、デジタルサイネージ等の表面保護のために好適に用いることができる。 The surface protective film which concerns on this embodiment can be used suitably for surface protection, such as a display of a portable information terminal, a touch panel, a display for personal computers, a display for television, a digital signage, for example.
以上、本発明の好適な実施形態について説明したが、本発明は上記実施形態に限定されるものではない。 The preferred embodiment of the present invention has been described above, but the present invention is not limited to the above embodiment.
以下、実施例により本発明をより具体的に説明するが、本発明は実施例に限定されるものではない。 EXAMPLES Hereinafter, although an Example demonstrates this invention more concretely, this invention is not limited to an Example.
[実施例1]
(1)共重合体(A−1)の合成
ノルボルネンと無水マレイン酸との交互共重合により、共重合体(A−1)を得た。ノルボルネンと無水マレイン酸との仕込比は1:1(モル比)とし、重合反応は、テトラヒドロフラン(THF)中、アゾビスイソブチロニトリル(AIBN)をラジカル重合開始剤とし、室温、24時間の条件で行った。AIBNの使用量は、モノマー成分の総量に対して1.9mol%とした。
(1) Synthesis of copolymer (A-1) Copolymer (A-1) was obtained by alternating copolymerization of norbornene and maleic anhydride. The charging ratio of norbornene and maleic anhydride was 1: 1 (molar ratio), and the polymerization reaction was carried out using tetrahydrofuran (THF) with azobisisobutyronitrile (AIBN) as a radical polymerization initiator at room temperature for 24 hours. Performed under conditions. The amount of AIBN used was 1.9 mol% with respect to the total amount of monomer components.
より具体的には、ノルボルネン2000mgと無水マレイン酸2080mgとをTHF3mLに溶解し、60mgのAIBNをラジカル重合開始剤として加え、60℃で24時間、反応を行った。ジエチルエーテルへの再沈殿精製を経て、2650mgの共重合体(A−1)を白色粉末として得た。 More specifically, 2000 mg of norbornene and 2080 mg of maleic anhydride were dissolved in 3 mL of THF, 60 mg of AIBN was added as a radical polymerization initiator, and the reaction was performed at 60 ° C. for 24 hours. After reprecipitation purification into diethyl ether, 2650 mg of copolymer (A-1) was obtained as a white powder.
得られた共重合体(A−1)の数平均分子量Mnは4.8×103、分子量分布Mw/Mnは1.7であった。なお、数平均分子量Mn及び分子量分布Mw/Mnは、以下の方法で測定した。 The number average molecular weight Mn of the obtained copolymer (A-1) was 4.8 × 10 3 , and the molecular weight distribution Mw / Mn was 1.7. The number average molecular weight Mn and the molecular weight distribution Mw / Mn were measured by the following methods.
<数平均分子量Mn及び重量平均分子量Mwの測定>
GPC測定法により以下の条件にて、数平均分子量Mn及び重量平均分子量Mwを測定した。
機器:島津製作所製「RID−10A/CBM−20A/DGU−20A3,
LC−20AD/DPD−M20A/CTO−20A」
カラム:東ソー社製「TSKgel superHM−N」
検出器:示差屈折率検出器(RI検出器/内蔵)
溶媒:クロロホルム
温度:40℃
流速:0.3mL/分
注入量:20μL
濃度:0.1重量%
較正試料:単分散ポリスチレン
較正法:ポリスチレン
<Measurement of number average molecular weight Mn and weight average molecular weight Mw>
The number average molecular weight Mn and the weight average molecular weight Mw were measured by the GPC measurement method under the following conditions.
Equipment: “RID-10A / CBM-20A / DGU-20A3, manufactured by Shimadzu Corporation
LC-20AD / DPD-M20A / CTO-20A "
Column: “TSKgel superHM-N” manufactured by Tosoh Corporation
Detector: Differential refractive index detector (RI detector / built-in)
Solvent: Chloroform Temperature: 40 ° C
Flow rate: 0.3 mL / min Injection volume: 20 μL
Concentration: 0.1% by weight
Calibration sample: Monodisperse polystyrene Calibration method: Polystyrene
(2)イミド架橋型樹脂(A−1−1)の製造
共重合体(A−1)のジメチルアセトアミド溶液(濃度100mg/mL)1mLに、ジアミンのジメチルアセトアミド溶液(濃度25mg/mL)1mLを添加し、室温で20時間撹拌して反応させ、ポリアミック酸を含有する塗布液を得た。ジアミンとしては、4,4’−ジアミノジフェニルエーテルを用い、ジアミンの添加量は、共重合体中の無水マレイン酸単位に対して1当量(すなわち、無水マレイン酸単位1モルに対してジアミン0.5モル)とした。
次いで、得られた塗布液500μLを、250mm四方のガラス基板にドロップキャストし、100℃で1時間乾燥させて自立膜を得た。得られた自立膜を、1mmHgの真空下、200℃で24時間加熱することでポリアミック酸をイミド化させ、イミド架橋型樹脂(A−1−1)を含む透明フィルムを得た。
(2) Production of Imide Crosslinked Resin (A-1-1) 1 mL of dimethylacetamide solution (concentration 25 mg / mL) of diamine is added to 1 mL of dimethylacetamide solution (concentration 100 mg / mL) of copolymer (A-1). The resulting mixture was stirred and reacted at room temperature for 20 hours to obtain a coating solution containing polyamic acid. As the diamine, 4,4′-diaminodiphenyl ether is used, and the addition amount of the diamine is 1 equivalent with respect to the maleic anhydride unit in the copolymer (that is, 0.5% of diamine with respect to 1 mole of maleic anhydride unit). Mol).
Next, 500 μL of the obtained coating solution was drop-cast on a 250 mm square glass substrate and dried at 100 ° C. for 1 hour to obtain a self-supporting film. The obtained self-supporting film was heated at 200 ° C. under a vacuum of 1 mmHg for 24 hours to imidize the polyamic acid to obtain a transparent film containing an imide-crosslinked resin (A-1-1).
得られたイミド架橋型樹脂(A−1−1)について、以下の方法で10%重量減少温度(T10)を測定した。その結果、T10は386℃であり、高い耐熱性が確認された。また、以下の方法で透明フィルムの可視光透過率(T450nm)を測定したところ、T450nmは82%であった。 The obtained imide crosslinked resin (A-1-1), was measured 10% weight reduction temperature (T 10) in the following manner. As a result, T 10 is 386 ° C., high heat resistance was confirmed. Moreover, when the visible light transmittance | permeability ( T450nm ) of the transparent film was measured with the following method, T450nm was 82%.
<10%重量減少温度の測定方法>
熱重量分析装置(株式会社リガク製の「Thermo plus Evo TG8120」)を利用して10%重量減少温度を測定した。窒素ガス雰囲気下、窒素ガスを流しながら、走査温度を30℃〜500℃に設定して、昇温速度:10℃/min.の条件で加熱して、用いた試料の重量が10%減少する温度を測定することにより求めた。
<Measurement method of 10% weight loss temperature>
A 10% weight reduction temperature was measured using a thermogravimetric analyzer (“Thermo plus Evo TG8120” manufactured by Rigaku Corporation). While flowing nitrogen gas in a nitrogen gas atmosphere, the scanning temperature was set to 30 ° C. to 500 ° C., and the rate of temperature increase was 10 ° C./min. The temperature was determined by measuring the temperature at which the weight of the sample used was reduced by 10%.
<光透過率の測定方法>
測定装置として分光光度計Jasco V−670 spectrophotometerを利用して、波長:280〜800nmの光に対する試料の透過率を測定し、波長450nmの光に対する透過率を求めた。
<Measurement method of light transmittance>
Using a spectrophotometer Jasco V-670 spectrophotometer as a measuring device, the transmittance of the sample with respect to light with a wavelength of 280 to 800 nm was measured, and the transmittance with respect to light with a wavelength of 450 nm was obtained.
[実施例2]
(1)イミド架橋型樹脂(A−1−2)の製造
ジアミンとして、2,2’−ビス(トリフルオロメチル)ベンジジンのDMAc溶液(濃度25mg/mL)1.6mLを用いたこと以外は、実施例1と同様の方法で、イミド架橋型樹脂(A−1−2)を含む透明フィルムを製造した。
[Example 2]
(1) Production of Imide Crosslinked Resin (A-1-2) As a diamine, except that 1.6 mL of DMAc solution (concentration 25 mg / mL) of 2,2′-bis (trifluoromethyl) benzidine was used, A transparent film containing an imide crosslinked resin (A-1-2) was produced in the same manner as in Example 1.
イミド架橋型樹脂(A−1−2)のT10は379℃、透明フィルムのT450nmは74%であった。 T 10 is 379 ° C. of the imide-crosslinked resin (A-1-2), T 450nm transparent film was 74%.
[実施例3]
(1)イミド架橋型樹脂(A−1−3)の製造
ジアミンとして、3(4),8(9)−ビス(アミノメチル)トリシクロ[5.2.1.02,6]デカンのDMAc溶液(濃度25mg/mL)1mLを用いたこと以外は、実施例1と同様の方法で、イミド架橋型樹脂(A−1−3)を含む透明フィルムを製造した。
[Example 3]
(1) Production of Imide Crosslinked Resin (A-1-3) DMAc of 3 (4), 8 (9) -bis (aminomethyl) tricyclo [5.2.1.0 2,6 ] decane as diamine A transparent film containing an imide-crosslinked resin (A-1-3) was produced in the same manner as in Example 1 except that 1 mL of the solution (concentration 25 mg / mL) was used.
イミド架橋型樹脂(A−1−3)のT10及び透明フィルムのT450nmはいずれも実施例2とほぼ同等の値を示した。 The T 10 of the imide cross-linked resin (A-1-3) and the T 450 nm of the transparent film both showed substantially the same values as in Example 2.
[実施例4]
(1)イミド架橋型樹脂(A−1−4)の製造
共重合体(A−1)のTHF溶液(濃度100mg/mL)1mLに、Gelest社製DMS−A12(アミノプロピル末端ジメチルシロキサン、分子量900〜1000)のTHF溶液(濃度37mg/mL)1mLを添加し、室温で20時間撹拌して反応させ、ポリアミック酸を含有する塗布液を得た。なお、ジアミンの添加量は約0.45当量とした。
次いで、得られた塗布液1mLを、底面が2cm四方のテフロン(登録商標)皿にドロップキャストし、室温で1時間乾燥させて自立膜を得た。得られた自立膜を、1mmHgの真空下、200℃で24時間加熱することでポリアミック酸をイミド化させ、イミド架橋型樹脂(A−1−4)を含む透明フィルムを得た。
[Example 4]
(1) Production of Imide Crosslinked Resin (A-1-4) To 1 mL of a THF solution (concentration 100 mg / mL) of copolymer (A-1), DMS-A12 (aminopropyl-terminated dimethylsiloxane, molecular weight) manufactured by Gelest 900 mL to 1000) of a THF solution (concentration: 37 mg / mL) was added and reacted by stirring at room temperature for 20 hours to obtain a coating solution containing polyamic acid. The amount of diamine added was about 0.45 equivalent.
Next, 1 mL of the obtained coating solution was drop-cast on a 2 cm square Teflon (registered trademark) dish and dried at room temperature for 1 hour to obtain a self-supporting film. The obtained self-supporting film was heated at 200 ° C. for 24 hours under a vacuum of 1 mmHg to imidize the polyamic acid to obtain a transparent film containing an imide-crosslinked resin (A-1-4).
イミド架橋型樹脂(A−1−4)のT10は352℃、透明フィルムのT450nmは60%であった。 T 10 is 352 ° C. of the imide-crosslinked resin (A-1-4), T 450nm transparent film was 60%.
[実施例5]
(1)イミド架橋型樹脂(A−1−5)の製造
共重合体(A−1)のTHF溶液(濃度100mg/mL)1mLに、信越化学工業のアミノ変性シリコーンオイル X−22−9409(アミノフェニル末端ジメチルシロキサン、分子量1340)のTHF溶液(濃度57mg/mL)1mLを添加し、室温で20時間撹拌して反応させ、ポリアミック酸を含有する塗布液を得た。なお、ジアミンの添加量は約0.3当量とした。
次いで、得られた塗布液1mLを、底面が2cm四方のテフロン(登録商標)皿にドロップキャストし、室温で1時間乾燥させて自立膜を得た。得られた自立膜を、1mmHgの真空下、200℃で24時間加熱することでポリアミック酸をイミド化させ、イミド架橋型樹脂(A−1−5)を含む透明フィルムを得た。
[Example 5]
(1) Production of Imide Crosslinked Resin (A-1-5) To 1 mL of a THF solution (concentration 100 mg / mL) of copolymer (A-1), amino-modified silicone oil X-22-9409 (Shin-Etsu Chemical Co., Ltd.) 1 mL of a THF solution (concentration 57 mg / mL) of aminophenyl-terminated dimethylsiloxane (molecular weight 1340) was added and reacted by stirring at room temperature for 20 hours to obtain a coating solution containing polyamic acid. The amount of diamine added was about 0.3 equivalent.
Next, 1 mL of the obtained coating solution was drop-cast on a 2 cm square Teflon (registered trademark) dish and dried at room temperature for 1 hour to obtain a self-supporting film. The obtained self-supporting film was heated at 200 ° C. under a vacuum of 1 mmHg for 24 hours to imidize the polyamic acid to obtain a transparent film containing an imide-crosslinked resin (A-1-5).
イミド架橋型樹脂(A−1−5)のT10は359℃、透明フィルムのT450nmは84%であった。 T 10 is 359 ° C. of the imide-crosslinked resin (A-1-5), T 450nm transparent film was 84%.
[実施例6]
(1)共重合体(A−2)の合成
ノルボルネンと無水マレイン酸とN−エチルマレイミドとの共重合により、共重合体(A−2)を得た。ノルボルネン、無水マレイン酸、N−エチルマレイミドの仕込比は3:1:2とした。重合反応は、THF中、AIBNをラジカル重合開始剤として、室温、24時間の条件で行った。AIBNの使用量は、モノマー成分の総量に対して1.6mol%とした。
(1) Synthesis of copolymer (A-2) Copolymer (A-2) was obtained by copolymerization of norbornene, maleic anhydride and N-ethylmaleimide. The charging ratio of norbornene, maleic anhydride and N-ethylmaleimide was 3: 1: 2. The polymerization reaction was carried out in THF at room temperature for 24 hours using AIBN as a radical polymerization initiator. The amount of AIBN used was 1.6 mol% with respect to the total amount of monomer components.
より具体的には、ノルボルネン2000mgと無水マレイン酸710mgとN−エチルマレイミド1780mgをTHF3mLに溶解し、60mgのAIBNをラジカル重合開始剤として加え、60℃で24時間、反応を行った。ジエチルエーテルへの再沈殿精製を経て、3340mgの共重合体(A−2)を白色粉末として得た。 More specifically, 2000 mg of norbornene, 710 mg of maleic anhydride, and 1780 mg of N-ethylmaleimide were dissolved in 3 mL of THF, 60 mg of AIBN was added as a radical polymerization initiator, and the reaction was performed at 60 ° C. for 24 hours. After reprecipitation purification into diethyl ether, 3340 mg of copolymer (A-2) was obtained as a white powder.
得られた共重合体(A−2)の数平均分子量Mnは4.7×103、分子量分布Mw/Mnは1.7であった。 The number average molecular weight Mn of the obtained copolymer (A-2) was 4.7 × 10 3 , and the molecular weight distribution Mw / Mn was 1.7.
(2)イミド架橋型樹脂(A−2−1)の製造
共重合体(A−2)のγ−ブチロラクトン溶液(濃度100mg/mL)1mLに、ジアミンのγ−ブチロラクトン溶液(濃度25mg/mL)1mLを添加し、室温で20時間撹拌して反応させ、ポリアミック酸を含有する塗布液を得た。ジアミンとしては、4,4’−ジアミノジフェニルエーテルを用い、ジアミンの添加量は、共重合体中の無水マレイン酸単位に対して0.5当量とした。
次いで、得られた塗布液500μmを、250mm四方のガラス基板にドロップキャストし、130℃で1時間乾燥させて自立膜を得た。得られた自立膜を、1mmHgの真空下、200℃で24時間加熱することでポリアミック酸をイミド化させ、イミド架橋型樹脂(A−2−1)を含む透明フィルムを得た。
(2) Production of Imide Crosslinked Resin (A-2-1) To 1 mL of γ-butyrolactone solution (concentration 100 mg / mL) of copolymer (A-2), γ-butyrolactone solution of diamine (concentration 25 mg / mL) 1 mL was added and stirred at room temperature for 20 hours to react to obtain a coating solution containing polyamic acid. As the diamine, 4,4′-diaminodiphenyl ether was used, and the amount of the diamine added was 0.5 equivalent to the maleic anhydride unit in the copolymer.
Next, 500 μm of the obtained coating solution was drop cast on a 250 mm square glass substrate and dried at 130 ° C. for 1 hour to obtain a self-supporting film. The obtained self-supporting film was heated at 200 ° C. under a vacuum of 1 mmHg for 24 hours to imidize the polyamic acid to obtain a transparent film containing an imide-crosslinked resin (A-2-1).
イミド架橋型樹脂(A−2−1)のT10は385℃であり、透明フィルムのT450nmは81%であった。 T 10 of the imide crosslinked resin (A-2-1) was 385 ° C., and T 450 nm of the transparent film was 81%.
得られた透明フィルムを7mm×25mmにカットして試験片を作製し、動的粘弾性試験を行った。その結果、試験片の貯蔵弾性率は2.1GPa、Tgは299℃となり、高い熱安定性及び機械強度を有することが確認された。 The obtained transparent film was cut into 7 mm × 25 mm to prepare a test piece, and a dynamic viscoelasticity test was performed. As a result, the storage elastic modulus of the test piece was 2.1 GPa, Tg was 299 ° C., and it was confirmed that the specimen had high thermal stability and mechanical strength.
[参考例1]
(1)共重合体(A−3)の合成
ジシクロペンタジエンと無水マレイン酸との交互共重合により、共重合体(A−3)を得た。ジシクロペンタジエンと無水マレイン酸との仕込比は1:1(モル比)とし、重合反応は、テトラヒドロフラン(THF)中、アゾビスイソブチロニトリル(AIBN)をラジカル重合開始剤とし、室温、24時間の条件で行った。AIBNの使用量は、モノマー成分の総量に対して2.1mol%とした。
(1) Synthesis of copolymer (A-3) A copolymer (A-3) was obtained by alternating copolymerization of dicyclopentadiene and maleic anhydride. The charging ratio of dicyclopentadiene and maleic anhydride was 1: 1 (molar ratio), and the polymerization reaction was carried out using azobisisobutyronitrile (AIBN) in tetrahydrofuran (THF) as a radical polymerization initiator at room temperature, 24 Performed under time conditions. The amount of AIBN used was 2.1 mol% with respect to the total amount of monomer components.
より具体的には、ジシクロペンタジエン2000mgと無水マレイン酸1490mgとをTHF3mLに溶解し、60mgのAIBNをラジカル重合開始剤として加え、60℃で24時間、反応を行った。ジエチルエーテルへの再沈殿精製を経て、1100mgの共重合体(A−3)を白色粉末として得た。 More specifically, 2000 mg of dicyclopentadiene and 1490 mg of maleic anhydride were dissolved in 3 mL of THF, 60 mg of AIBN was added as a radical polymerization initiator, and the reaction was performed at 60 ° C. for 24 hours. After reprecipitation purification into diethyl ether, 1100 mg of copolymer (A-3) was obtained as a white powder.
得られた共重合体(A−3)の数平均分子量Mnは3.3×103、分子量分布Mw/Mnは1.8であった。得られた共重合体(A−3)は、実施例1〜6と同様にジアミンによって架橋されることが確認された。 The number average molecular weight Mn of the obtained copolymer (A-3) was 3.3 × 10 3 , and the molecular weight distribution Mw / Mn was 1.8. It was confirmed that the obtained copolymer (A-3) was crosslinked with diamine in the same manner as in Examples 1-6.
[参考例2]
(1)共重合体(A−4)の合成
エテニルノルボルネンと無水マレイン酸との交互共重合により、共重合体(A−4)を得た。エテニルノルボルネンと無水マレイン酸との仕込比は1:1(モル比)とし、重合反応は、テトラヒドロフラン(THF)中、アゾビスイソブチロニトリル(AIBN)をラジカル重合開始剤とし、室温、24時間の条件で行った。AIBNの使用量は、モノマー成分の総量に対して2.3mol%とした。
(1) Synthesis of copolymer (A-4) Copolymer (A-4) was obtained by alternating copolymerization of ethenylnorbornene and maleic anhydride. The charging ratio of ethenylnorbornene and maleic anhydride was 1: 1 (molar ratio), and the polymerization reaction was carried out using azobisisobutyronitrile (AIBN) in tetrahydrofuran (THF) as a radical polymerization initiator at room temperature, 24 Performed under time conditions. The amount of AIBN used was 2.3 mol% with respect to the total amount of monomer components.
より具体的には、エテニルノルボルネン2000mgと無水マレイン酸1640mgとをTHF3mLに溶解し、60mgのAIBNをラジカル重合開始剤として加え、60℃で24時間、反応を行った。ジエチルエーテルへの再沈殿精製を経て、3030mgの共重合体(A−4)を白色粉末として得た。 More specifically, 2000 mg of ethenylnorbornene and 1640 mg of maleic anhydride were dissolved in 3 mL of THF, 60 mg of AIBN was added as a radical polymerization initiator, and the reaction was performed at 60 ° C. for 24 hours. After reprecipitation purification into diethyl ether, 3030 mg of copolymer (A-4) was obtained as a white powder.
得られた共重合体(A−4)の数平均分子量Mnは6.6×103、分子量分布Mw/Mnは2.0であった。得られた共重合体(A−4)は、実施例1〜6と同様にジアミンによって架橋されることが確認された。 The number average molecular weight Mn of the obtained copolymer (A-4) was 6.6 × 10 3 , and the molecular weight distribution Mw / Mn was 2.0. It was confirmed that the obtained copolymer (A-4) was crosslinked with diamine in the same manner as in Examples 1-6.
[比較例1]
実施例1で得られた共重合体(A−1)をジアミンによる架橋を行わずにT10測定に供した結果、T10は144℃であった。これにより、ジアミンによる架橋によって、耐熱性が著しく向上していることが確認された。
[Comparative Example 1]
The copolymer obtained in Example 1 (A-1) results subjected to T 10 measured without crosslinking with diamines, T 10 was 144 ° C.. Thereby, it was confirmed that the heat resistance is remarkably improved by crosslinking with diamine.
Claims (5)
前記透明フィルムの少なくとも一方面上に設けられた金属蒸着層と、
を備える、表面保護フィルム。 The transparent film according to claim 4,
A metal vapor deposition layer provided on at least one surface of the transparent film;
A surface protective film.
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