JP2017197847A5 - - Google Patents

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JP2017197847A5
JP2017197847A5 JP2017127282A JP2017127282A JP2017197847A5 JP 2017197847 A5 JP2017197847 A5 JP 2017197847A5 JP 2017127282 A JP2017127282 A JP 2017127282A JP 2017127282 A JP2017127282 A JP 2017127282A JP 2017197847 A5 JP2017197847 A5 JP 2017197847A5
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copper alloy
cielab
value
weight
manganese
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（ａ）６〜２５重量％の亜鉛、(A) 6-25 wt% zinc,
（ｂ）７〜１７重量％のマンガン、(B) 7 to 17% by weight of manganese,
（ｃ）０．１〜３．５重量％のニッケル、および(C) 0.1-3.5 wt% nickel, and
（ｄ）残余分の銅(D) Remaining copper
を含む銅合金であって、該銅合金が、−２〜３のＣＩＥＬＡＢ ａA copper alloy comprising -2 to 3 CIELAB a ＊* 値および−２〜１０のＣＩＥＬＡＢ ｂValue and CIELAB b of -2 to 10 ＊* 値を有する、銅合金。A copper alloy having a value. （ａ）６〜２５重量％の亜鉛、(A) 6-25 wt% zinc,
（ｂ）７〜１７重量％のマンガン、(B) 7 to 17% by weight of manganese,
（ｃ）０．１〜３．５重量％のニッケル、(C) 0.1-3.5 wt% nickel,
（ｄ）Ｓｎ、Ｓｉ、Ｃｏ、Ｔｉ、Ｃｒ、Ｆｅ、Ｍｇ、ＺｒもしくはＡｇの１つ以上を０．５重量％まで、または(D) up to 0.5 wt% of one or more of Sn, Si, Co, Ti, Cr, Fe, Mg, Zr or Ag, or
Ｐ、Ｂ、Ｃａ、Ｇｅ、ＳｅもしくはＴｅの１つ以上を０．１重量％まで、あるいはUp to 0.1% by weight of one or more of P, B, Ca, Ge, Se or Te, or
Ｓｎ、Ｓｉ、Ｃｏ、Ｔｉ、Ｃｒ、Ｆｅ、Ｍｇ、ＺｒもしくはＡｇの１つ以上を０．５重量％まで、およびＰ、Ｂ、Ｃａ、Ｇｅ、ＳｅもしくはＴｅの１つ以上を０．１重量％までの両方、ならびにOne or more of Sn, Si, Co, Ti, Cr, Fe, Mg, Zr or Ag up to 0.5% by weight and one or more of P, B, Ca, Ge, Se or Te is 0.1% by weight % Up to both
（ｅ）残余分の銅(E) Remaining copper
を含む銅合金であって、該銅合金が、−２〜３のＣＩＥＬＡＢ ａA copper alloy comprising -2 to 3 CIELAB a ＊* 値および−２〜１０のＣＩＥＬＡＢ ｂValue and CIELAB b of -2 to 10 ＊* 値を有する、銅合金。A copper alloy having a value. 銅合金が、−２〜２のＣＩＥＬＡＢ ａThe copper alloy is -2 to 2 CIELAB a ＊* 値および−２〜８のＣＩＥＬＡＢ ｂValue and CIELAB b of -2 to 8 ＊* 値を有する、請求項１に記載の銅合金。The copper alloy of claim 1 having a value. （ａ）６〜２５重量％の亜鉛、(A) 6-25 wt% zinc,
（ｂ）７〜１７重量％のマンガン、(B) 7 to 17% by weight of manganese,
（ｃ）０．１〜３．５重量％のニッケル、(C) 0.1-3.5 wt% nickel,
（ｄ）０．３重量％までのＺｒ、および(D) Zr up to 0.3% by weight, and
（ｅ）残余分の銅(E) Remaining copper
を含む銅合金であって、該銅合金が、−２〜３のＣＩＥＬＡＢ ａA copper alloy comprising -2 to 3 CIELAB a ＊* 値および−２〜１０のＣＩＥＬＡＢ ｂValue and CIELAB b of -2 to 10 ＊* 値を有する、銅合金。A copper alloy having a value. 銅合金が、６０ｋＨｚ〜４８０ｋＨｚの渦電流ゲージ励振周波数において２．５％ＩＡＣＳを超える導電率を有する、請求項１に記載の銅合金。The copper alloy of claim 1, wherein the copper alloy has a conductivity greater than 2.5% IACS at an eddy current gauge excitation frequency of 60 kHz to 480 kHz. （ａ）６〜２５重量％の亜鉛、(A) 6-25 wt% zinc,
（ｂ）７〜１７重量％のマンガン、(B) 7 to 17% by weight of manganese,
（ｃ）０．１〜３．５重量％のニッケル、および(C) 0.1-3.5 wt% nickel, and
（ｄ）残余分の銅(D) Remaining copper
を含む銅合金であって、該銅合金が、−２〜３のＣＩＥＬＡＢ ａA copper alloy comprising -2 to 3 CIELAB a ＊* 値および−２〜１０のＣＩＥＬＡＢ ｂValue and CIELAB b of -2 to 10 ＊* 値を有し、２２ｍｍ×２２ｍｍの正方形の該銅合金が、コーティングされていない銅合金の表面上にある５〜２０μｌの懸濁液中の細菌の９９．９％を曝露から１２０分以内に不活性化し、該懸濁液は、１ミリリットルあたり１０The 22 mm × 22 mm square copper alloy has a value of 99.9% of bacteria in 5-20 μl suspension on the surface of the uncoated copper alloy within 120 minutes of exposure. Activated and the suspension is 10 per milliliter. ６6 〜１０-10 ８8 コロニー形成単位の該細菌を含み、該細菌は大腸菌または黄色ブドウ球菌である、銅合金。A copper alloy comprising the bacteria of a colony forming unit, wherein the bacteria are Escherichia coli or Staphylococcus aureus. 銅合金が、曝露から６０分以内に細菌の９９．９％を不活性化する、請求項６に記載の銅合金。The copper alloy of claim 6, wherein the copper alloy inactivates 99.9% of bacteria within 60 minutes of exposure. 銅合金が、曝露から４５分以内に細菌の９９．９％を不活性化する、請求項７に記載の銅合金。8. The copper alloy of claim 7, wherein the copper alloy inactivates 99.9% of bacteria within 45 minutes of exposure. 銅合金が、曝露から１０分以内に細菌の９９．９％を不活性化する、請求項８に記載の銅合金。9. The copper alloy of claim 8, wherein the copper alloy inactivates 99.9% of bacteria within 10 minutes of exposure. 物体の接触表面としての、請求項６に記載の銅合金の使用。Use of the copper alloy according to claim 6 as a contact surface of an object. 該物体が、病院用器具またはドア金物である、請求項１０に記載の使用。Use according to claim 10, wherein the object is a hospital instrument or door hardware. （ａ）６〜２５重量％の亜鉛、(A) 6-25 wt% zinc,
（ｂ）７〜１７重量％のマンガン、(B) 7 to 17% by weight of manganese,
（ｃ）０．１〜３．５重量％のニッケル、および(C) 0.1-3.5 wt% nickel, and
（ｄ）残余分の銅(D) Remaining copper
を含む銅合金であって、該銅合金が、−２〜３のＣＩＥＬＡＢ ａA copper alloy comprising -2 to 3 CIELAB a ＊* 値および−２〜１０のＣＩＥＬＡＢ ｂValue and CIELAB b of -2 to 10 ＊* 値を有し、該銅合金が、ヒトの皮膚または体液と接触させずに２０〜２５℃の空気中で３０日曝露した後、１未満のΔＥA value of less than 1 ΔE after the copper alloy was exposed in air at 20-25 ° C. for 30 days without contact with human skin or body fluids ＣＭＣCMC を有する、銅合金。Having a copper alloy. ΔＥΔE ＣＭＣCMC が０．７３以下である、請求項１２に記載の銅合金。The copper alloy according to claim 12, wherein is not more than 0.73. ΔＥΔE ＣＭＣCMC が０．５２以下である、請求項１３に記載の銅合金。The copper alloy according to claim 13, which is 0.52 or less. （ａ）６〜２５重量％の亜鉛、(A) 6-25 wt% zinc,
（ｂ）７〜１７重量％のマンガン、(B) 7 to 17% by weight of manganese,
（ｃ）０．１〜３．５重量％のニッケル、および(C) 0.1-3.5 wt% nickel, and
（ｄ）残余分の銅(D) Remaining copper
を含む銅合金であって、該銅合金が、−２〜３のＣＩＥＬＡＢ ａA copper alloy comprising -2 to 3 CIELAB a ＊* 値および−２〜１０のＣＩＥＬＡＢ ｂValue and CIELAB b of -2 to 10 ＊* 値を有し、該銅合金が、１５０℃の空気中で２４時間曝露した後、２０未満のΔＥAnd the copper alloy has a ΔE of less than 20 after being exposed in air at 150 ° C. for 24 hours. ＣＭＣCMC を有する、銅合金。Having a copper alloy. ΔＥΔE ＣＭＣCMC が１５．１以下である、請求項１５に記載の銅合金。The copper alloy according to claim 15, which is 15.1 or less. ΔＥΔE ＣＭＣCMC が９．９以下である、請求項１６に記載の銅合金。The copper alloy according to claim 16, wherein is 9.9 or less. （ａ）６〜２５重量％の亜鉛、(A) 6-25 wt% zinc,
（ｂ）７〜１７重量％のマンガン、(B) 7 to 17% by weight of manganese,
（ｃ）０．１〜３．５重量％のニッケル、(C) 0.1-3.5 wt% nickel,
（ｄ）０．０５重量％〜２．５重量％の鉄、および(D) 0.05 wt% to 2.5 wt% iron, and
（ｅ）残余分の銅(E) Remaining copper
を含む銅合金であって、該銅合金が、−２〜３のＣＩＥＬＡＢ ａA copper alloy comprising -2 to 3 CIELAB a ＊* 値および−２〜１０のＣＩＥＬＡＢ ｂValue and CIELAB b of -2 to 10 ＊* 値を有する、銅合金。A copper alloy having a value. ２２ｍｍ×２２ｍｍの正方形の該銅合金が、コーティングされていない銅合金の表面上にある５〜２０μｌの懸濁液中の細菌の９９．９％を曝露から１２０分以内に不活性化し、該懸濁液は、１ミリリットルあたり１０The 22 mm × 22 mm square copper alloy inactivates 99.9% of the bacteria in 5-20 μl suspension on the surface of the uncoated copper alloy within 120 minutes of exposure, and the suspension 10 suspensions per milliliter ６6 〜１０-10 ８8 コロニー形成単位の該細菌を含み、該細菌は大腸菌または黄色ブドウ球菌である、請求項１８に記載の銅合金。19. The copper alloy according to claim 18, comprising the bacterium of a colony forming unit, wherein the bacterium is Escherichia coli or Staphylococcus aureus. 該銅合金が、ヒトの皮膚または体液と接触させずに２０〜２５℃の空気中で３０日曝露した後、１未満のΔＥLess than 1 ΔE after the copper alloy has been exposed in air at 20-25 ° C. for 30 days without contact with human skin or body fluids ＣＭＣCMC を有する、請求項１８に記載の銅合金。The copper alloy according to claim 18, comprising: 該銅合金が、１５０℃の空気中で２４時間曝露した後、２０未満のΔＥAfter the copper alloy was exposed in air at 150 ° C. for 24 hours, a ΔE of less than 20 ＣＭＣCMC を有する、請求項１８に記載の銅合金。The copper alloy according to claim 18, comprising: 物体の接触表面としての、請求項１、１２または１５に記載の銅合金の使用。Use of a copper alloy according to claim 1, 12 or 15 as a contact surface of an object. 該物体が、病院用器具またはドア金物である、請求項２２に記載の使用。23. Use according to claim 22, wherein the object is a hospital instrument or door hardware. 硬貨地板に形成するための、請求項１、６、１２または１５に記載の銅合金の使用。Use of a copper alloy according to claim 1, 6, 12 or 15 for forming a coin base plate. 銅合金が、９重量％〜１５重量％の亜鉛、１２重量％〜１６重量％のマンガン、２．５重量％〜３重量％のニッケルおよび６６重量％〜７６．５重量％のＣｕを含む、請求項１、６、１２または１５に記載の銅合金。The copper alloy comprises 9 wt% to 15 wt% zinc, 12 wt% to 16 wt% manganese, 2.5 wt% to 3 wt% nickel and 66 wt% to 76.5 wt% Cu; The copper alloy according to claim 1, 6, 12 or 15. 銅合金が、１１．５〜１７重量％のマンガンを含み、銅合金が、０．０９〜２．０１のＣＩＥＬＡＢ ａThe copper alloy contains 11.5 to 17% by weight manganese and the copper alloy is CIELAB a from 0.09 to 2.01. ＊* 値および５．３２〜８．４３のＣＩＥＬＡＢ ｂValue and CIELAB b from 5.32 to 8.43 ＊* 値を有する、請求項１、２、および４〜２４のいずれか１項に記載の銅合金。The copper alloy according to any one of claims 1, 2, and 4 to 24, which has a value. 銅合金が、１２〜１６重量％のマンガンを含み、銅合金が、０．６４〜２．０１のＣＩＥＬＡＢ ａThe copper alloy contains 12-16 wt% manganese and the copper alloy is CIELAB a from 0.64 to 2.01. ＊* 値および６．２３〜８．４３のＣＩＥＬＡＢ ｂValue and CIELAB b from 6.23 to 8.43 ＊* 値を有する、請求項１、２、および４〜２６のいずれか１項に記載の銅合金。27. The copper alloy of any one of claims 1, 2, and 4 to 26 having a value. （ａ）６〜２５重量％の亜鉛、
（ｂ）７〜１７重量％のマンガン、
（ｃ）０．１〜２．５重量％の鉄、および
（ｄ）残余分の銅
からなる銅合金を含む製品であって、該銅合金が、−２〜３のＣＩＥＬＡＢ ａ＊値および−２〜１０のＣＩＥＬＡＢ ｂ＊値を有する、製品。 (A ) 6-25 wt% zinc,
( B) 7 to 17% by weight of manganese,
( C) 0.1-2.5 wt% iron, and
( D) A product comprising a copper alloy consisting of excess copper, the copper alloy having a CIELAB a * value of −2 to 3 and a CIELAB b * value of −2 to 10. ２２ｍｍ×２２ｍｍの正方形の該銅合金が、コーティングされていない銅合金の表面上にある５〜２０μｌの懸濁液中の細菌の９９．９％を曝露から１２０分以内に不活性化し、該懸濁液は、１ミリリットルあたり１０６〜１０８コロニー形成単位の該細菌を含み、該細菌は大腸菌または黄色ブドウ球菌である、請求項２８に記載の製品。 The 22 mm × 22 mm square copper alloy inactivates 99.9% of the bacteria in 5-20 μl suspension on the surface of the uncoated copper alloy within 120 minutes of exposure, and the suspension 29. The product of claim 28 , wherein the suspension comprises 10 < 6 > to 10 < 8 > colony forming units of the bacterium per milliliter, wherein the bacterium is E. coli or S. aureus. 銅合金が、１２〜２０重量％の亜鉛、１０〜１７重量％のマンガン、および０．５〜２．５重量％の鉄を含む、請求項２８または２９に記載の製品。 30. A product as claimed in claim 28 or 29 , wherein the copper alloy comprises 12-20% by weight zinc, 10-17% by weight manganese, and 0.5-2.5% by weight iron. 銅合金が、１５〜１８重量％の亜鉛、１４〜１７重量％のマンガン、および０．５〜１．５重量％の鉄を含む、請求項２８〜３０いずれかに記載の製品。 31. A product according to any of claims 28 to 30 , wherein the copper alloy comprises 15 to 18% by weight zinc, 14 to 17% by weight manganese, and 0.5 to 1.5% by weight iron.
JP2017127282A 2008-09-10 2017-06-29 White-colored copper alloy with reduced nickel content Pending JP2017197847A (en)

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US9571908P 2008-09-10 2008-09-10
US9573308P 2008-09-10 2008-09-10
US61/095,719 2008-09-10
US61/095,733 2008-09-10
US10627508P 2008-10-17 2008-10-17
US61/106,275 2008-10-17

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