JP2017191873A - Card type electronic device and electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a card type electronic device which improves heat radiation performance from electronic components which generate heat and inhibits occurrence of heat spots without increasing its thickness.SOLUTION: A card type storage device 5 includes: electronic components, such as a controller IC 69 and flash memory ICs 65a to 65d, which generate heat; a card side substrate 64 on which the electronic components are mounted; a dummy component 430 mounted on the card side substrate 64; and a card housing 60 which has a flat and substantially rectangle shape and houses the card side substrate 64. A first injection hole 67a allowing communication between the interior and the exterior is provided at the card housing 60. A potting material fills an area in the card housing which excludes at least the mounting components.SELECTED DRAWING: Figure 10

Description

  The present invention relates to a card-type electronic device and an electronic apparatus including a slot into which the card-type electronic device is inserted and removed.

  A card-type storage device, which is an example of a card-type electronic device, is widely used for storing various types of information in portable electronic devices such as digital cameras and personal computers. Conventionally, the data transfer rate when data is stored in the card-type storage device from the outside or the data stored in the card-type storage device is read out is not high, so that the power consumed by the card-type storage device is small. As a result, the calorific value was not large. Therefore, the heat generated inside the card-type storage device is dissipated by heat conduction through the electrical contacts and natural convection in the card-type storage device, and as a result, the inside of the card-type storage device is rarely a problem. .

  However, recently, there is an increasing demand for card-type storage devices capable of writing / reading data at high speed. For example, when a digital camera is used to shoot a high resolution, high frame rate, and high gradation moving image (for example, a so-called 4K moving image or 8K moving image) with high image quality, the data transfer rate is dramatically increased. For this reason, card-type storage devices are required to be able to transfer data at high speed stably for a long time.

  As the data transfer rate increases, the power consumed by a semiconductor device or the like mounted inside the card-type storage device increases and the amount of heat generation increases. For this reason, it is necessary to take measures to suppress an increase in the internal temperature of the card type storage device so that a thermal runaway or the like does not occur in the semiconductor device or the like.

  In order to solve this problem, Patent Document 1 provides a first heat conductive material in an electronic package including a circuit board and a second heat conductive member in a case body that houses the electronic package. There has been proposed a structure in which a material and a second heat conducting member are brought into contact with each other in the case body. In the configuration described in Patent Document 1, heat generated in the electronic package can be released from the case body to the outside via the first heat conductive material and the second heat conductive member. Further, in Patent Document 2, a filler is filled in a lower case that accommodates a circuit board, and the upper case having a convex portion is covered so that the convex portion comes into contact with the filler. A configuration has been proposed in which heat generated in the electronic component is radiated from the upper case.

JP 2011-95961 A Japanese Patent Laying-Open No. 2015-192035

  However, in the configuration described in Patent Document 1, since the electronic package partially contacts the case body, a locally high temperature portion (heat spot) is generated on the surface of the case body. There's a problem. On the other hand, in the structure described in the said patent document 2, since a circuit board contacts a case body in a wide range via a filler, generation | occurrence | production of a heat spot is suppressed. However, in the card-type electronic device, providing the convex portion on the upper case has a problem of increasing the thickness.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a card-type electronic device that can increase heat dissipation from an electronic component that generates heat and can suppress generation of heat spots without increasing the thickness.

  The card-type electronic device according to the present invention has an electronic component that generates heat, a substrate on which the electronic component is mounted, a mounting component that is mounted on the substrate, and a flat and substantially rectangular shape, A card housing that houses a first hole that communicates the inside and the outside of the card housing, and a potting material is provided at least in a region excluding the mounting component inside the card housing. Is filled.

  ADVANTAGE OF THE INVENTION According to this invention, without increasing thickness, the card-type electronic device which can improve heat dissipation from the electronic component which generate | occur | produces heat, and can suppress generation | occurrence | production of a heat spot is realizable.

It is a figure explaining the structure of the imaging system containing the imaging device using the card-type memory | storage device which concerns on 1st Embodiment. It is a block diagram which shows schematic structure of an imaging device and a card-type memory | storage device. It is a figure explaining the insertion / extraction form of the card-type memory | storage device with respect to an imaging device. It is a perspective view which shows schematic structure of a card-type memory | storage device. It is a figure explaining the component of a card-type memory | storage device, and an assembly process. It is a figure explaining the typical holding | grip method of the user with respect to a card-type memory | storage device. It is a figure explaining the non-filling part of the potting material in a card-type memory | storage device. It is sectional drawing which expands and shows the partial area | region of the non-filling part of a potting material. It is a figure which shows schematic structure of a dispenser (potting material filling apparatus). It is a figure explaining the filling process of the potting material to a card | curd housing | casing. It is sectional drawing which shows the example of filling which does not fully fill a potting material in a card case. It is sectional drawing which shows the relationship between a 1st injection hole and the 2nd injection hole, and a nozzle. It is a figure which shows the display content of a 1st surface card label and a 2nd surface card label. It is a figure which shows schematic structure of the card-type memory | storage device which concerns on 2nd Embodiment. It is sectional drawing which shows the structural example which raises the sealing degree of a card case. It is a figure which shows schematic structure of the card-type memory | storage device which concerns on 3rd Embodiment.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Here, a card-type storage device is taken up as the card-type electronic device according to the present invention. In addition, as an electronic apparatus according to the present invention, an imaging device including a slot in which a card-type storage device can be inserted and removed is taken up.

  FIG. 1 is a diagram illustrating the configuration of an imaging system including an imaging device that uses a card-type storage device according to the first embodiment of the present invention. The imaging system includes a camera body 1, a lens unit 2, a card type storage device 5, a card reader 6, a connection cable 7, and a personal computer (PC) 8. The camera body 1 is a so-called digital single-lens reflex camera body. The camera body 1 converts an image 3 of an interface 3 (mount) for enabling attachment / detachment of the lens unit 2, an operation unit 4 for performing various operations on the camera body 1, and light passing through the lens unit 2 into image data. An image sensor. The camera body 1, the lens unit 2, and the card-type storage device 5 constitute an imaging device.

  The card-type storage device 5 has a flat and substantially rectangular card shape that can be inserted into and removed from (inserted / removed from) the camera body 1 and the card reader 6. Image data is stored in the card-type storage device 5 by imaging in a state where the predetermined lens unit 2 is attached to the camera body 1 and the card-type storage device 5 is attached. The card reader 6 and the PC 8 are connected by a connection cable 7 so as to be communicable. The image data stored in the card type storage device 5 can be transmitted to the PC 8 via the connection cable 7 with the card type storage device 5 being inserted into the card reader 6. The PC 8 may be a server on the network. Further, the card type storage device 5 and the PC 8 may be communicably connected by wireless communication without using the connection cable 7. Further, the camera body 1 and the PC 8 are connected to be communicable without using the card reader 6, thereby enabling communication between the card type storage device 5 attached to the camera body 1 and the PC 8. May be.

  FIG. 2A is a block diagram illustrating a schematic configuration of the imaging apparatus. In FIG. 2A, the same components as those shown in FIG. The camera body 1 includes an operation unit 4, a camera system control circuit 10, a storage unit 11, an image sensor 12, an image processing unit 13, a display unit 14, and a heat transfer unit 15. The lens unit 2 includes a lens system control circuit 20, a lens driving unit 21, and an imaging optical system 22. The camera body 1 and the lens unit 2 are detachable via the interface 3 as described above.

  The camera system control circuit 10 is a dedicated processor such as a microcomputer or ASIC, and controls the overall operation of the imaging apparatus. When the operation unit 4 is operated by the user, various operations are instructed to the camera system control circuit 10, and the camera system control circuit 10 performs operations and processes according to the input from the operation unit 4. The image sensor 12 converts an image of light guided from the imaging optical system 22 into an electrical signal and supplies the electrical signal to the image processing unit 13. The camera system control circuit 10, the lens system control circuit 20, and the lens driving unit 21 drive the imaging optical system 22 to perform so-called AF (automatic focusing), AE (automatic exposure), and the like. The display unit 14 includes a finder for the photographer to check the subject, and a liquid crystal panel capable of displaying the subject, the photographed image, the setting conditions of the camera body 1, and the like.

  The image processing unit 13 includes an A / D converter, a white balance adjustment circuit, a gamma correction circuit, an interpolation calculation circuit, and the like, and generates image data based on the electrical signal supplied from the image sensor 12. The image processing unit 13 compresses / decompresses image data, audio data, and the like. The storage unit 11 has a slot in which the card-type storage device 5 can be inserted and removed, and an interface that enables communication between the card-type storage device 5, the camera system control circuit 10, and the image processing unit 13. In response to an instruction from the camera system control circuit 10, the image data generated by the image processing unit 13 is written into the card type storage device 5, and conversely, the image data stored in the card type storage device 5 is stored in the image processing unit 13. Read out.

  The heat transfer unit 15 is configured by a heat pipe, a graphite sheet, or the like. The image processing unit 13 and the storage unit 11 that are heat sources in the imaging apparatus are thermally connected to a heat radiating unit (for example, an exterior member) of the camera body 1. Connect to. Thereby, the heat generated inside the camera body 1 can be released from the imaging device to the external atmosphere (ambient air) by natural convection or radiation. In addition, since a well-known structure can be used about imaging devices other than the card-type memory | storage device 5, the detailed description about components other than the card-type memory | storage device 5 is abbreviate | omitted.

  FIG. 2B is a block diagram showing an electrical schematic configuration of the card-type storage device 5. The card type storage device 5 includes a power supply IC 27, a card controller 28, and a flash memory 29. The camera body 1 has a host power supply 24 and a host controller 25. The card type storage device 5 is electrically connected to the camera body 1 (storage unit 11) via a card interface 26. Note that the specifications of the card interface 26 conform to the standards defined for the card type storage device 5.

  The host power supply 24 and the power supply IC 27 are connected via the power supply contact of the card interface 26, and the host controller 25 and the card controller 28 are connected via the signal transmission contact of the card interface 26. The host power supply 24 is a stable power supply including a battery and a power supply IC included in the camera body 1. The power supply IC 27 uses the power supplied from the host power supply 24 to create voltage levels necessary for the operation of the card controller 28 and the flash memory 29 and supply them to each. The host controller 25 is a control means for performing data communication with the card controller 28 and controlling the communication, and the function can be provided to the camera system control circuit 10 or the image processing unit 13. The flash memory 29 stores image data such as image data received from the image processing unit 13. The card controller 28 has functions such as error correction, block management, and wear leveling. The card controller 28 stores the image data sent from the image processing unit 13 via the host controller 25 in the flash memory 29, and sends the data stored in the flash memory 29 to the image processing unit 13. To send out. Although one flash memory 29 is shown here, the power supply IC 27 and the card controller 28 may be configured to correspond to a plurality of flash memories 29.

  FIG. 3A is a diagram schematically illustrating a form of insertion / extraction of the card-type storage device 5 with respect to the camera body 1. A slot lid 30 having a hook 30a and a button 4a for operating the hook 30a are provided on the back surface of the camera body 1. The button 4a is one of the components of the operation unit 4. When the button 4a is pressed, the hook 30a provided on the slot lid 30 is disengaged, the slot lid 30 is opened, and the opening of the slot 31 into which the card type storage device 5 is inserted and removed is exposed to the outside. In this way, the card type storage device 5 can be inserted into and removed from the slot 31. The camera body 1 is provided with an eject button 46 adjacent to the slot 31. When the card-type storage device 5 is inserted (attached) into the slot 31, the eject button 46 projects. When the eject button 46 is pushed into the camera body 1 side, the card-type storage device 5 protrudes from the slot 31 to a position where it can be grasped by a finger or the like, whereby the card-type storage device 5 can be removed from the slot 31. become.

  The slot 31 has a structure in which two cards of the same type or different types can be mounted in parallel. The slot lid 30 is provided with an open / close detection sensor (not shown). When the camera system control circuit 10 detects that the slot lid 30 is closed by a signal from the open / close detection sensor, the camera system control circuit 10 confirms whether or not the card type storage device 5 is mounted in the slot 31. The camera system control circuit 10 enables communication between the camera body 1 and the card type storage device 5 when the card type storage device 5 is inserted in the slot 31. On the other hand, when the button 4a is pressed, the camera system control circuit 10 immediately ends the communication between the camera body 1 and the card type storage device 5.

  FIG. 3B is a schematic diagram for explaining a schematic configuration of the slot 31 and a method for inserting the card-type storage device 5 into the slot 31, and shows the configuration of the slot 31 in an exploded manner. The slot 31 includes a slot side substrate 41, a slot base 42, and a slot cover 45. The slot base 42 is fixed to the slot side substrate 41. The slot base 42 includes a slot-side connector 42a that is electrically connected to the card electrical contact 58 (see FIG. 4) of the card-type storage device 5, and the card-type storage device 5 in the insertion / removal direction when the card-type storage device 5 is inserted / removed. Slot side guide portions 42b and 42c for guiding are provided. In FIG. 3B, the slot-side guide portion 42b is a slot-side guide portion in the width direction of the slot 31 (a direction orthogonal to both the insertion / removal direction of the card-type storage device 5 and the thickness direction of the slot-side substrate 41). Although it faces 42c, it cannot be seen due to the viewpoint shown in the figure.

  The slot base 42 is press-fitted and held with a plurality (two in this case) of slot heat contacts 44 and a plurality of slot electrical contacts 43. The slot electrical contact 43 has a power slot electrical contact 43a corresponding to the power signal and a communication slot electrical contact 43b corresponding to the communication signal. The power supply slot electrical contact 43a is used for electrical connection between the host power supply 24 and the power supply IC 27 shown in FIG. The communication slot electrical contact 43b is used for electrical connection between the host controller 25 and the card controller 28 shown in FIG.

  The slot base 42 is made of LCP (Liquid Crystal Polymer) from the viewpoint of heat resistance that can withstand reflow, thinness for making small and thin, molten metal flow that can form a complicated shape, and slidability. A product (for example, an injection-molded product) is preferably used. The slot electrical contact 43 is plated on phosphor bronze (for example, gold plating) from the viewpoints of spring property, solder wettability, contact electrical resistance, etc. for contacting the card electrical contact 58 of the card type storage device 5 with an appropriate force. Etc.) are preferably used. As the slot heat contact 44, a copper alloy that is plated (for example, hard chrome plating) is preferably used from the viewpoints of thermal conductivity, slidability, wear resistance, and the like.

  The slot cover 45 is preferably made of stainless spring steel from the viewpoint of thinness, workability, corrosion resistance, and the like. The slot cover 45 engages with the slot base 42 and is fixed to the slot side substrate 41 with screws or the like. When the eject button 46 provided on the slot cover 45 is pressed, the eject mechanism 47 provided on the slot cover 45 operates, and the card type storage device 5 installed in the slot 31 is pushed out to a predetermined position.

  Card side guide portions 55a and 56a are provided on the side surfaces of the card type storage device 5 in the width direction (corresponding to the width direction of the slot 31 when the card type storage device 5 is mounted in the slot 31). . The card type storage device 5 is inserted in the direction of the arrow 50 while being roughly positioned by the slot cover 45 (while being guided in a state with a lot of rattling). Thereafter, the card side guide portions 55a and 56a engage with the slot side guide portions 42b and 42c, respectively, and the card type storage device 5 is precisely positioned and guided in the direction of the arrow 50. The card type storage device 5 is finally inserted to a position where it abuts on the slot base 42, and the slot electrical contact 43 and the card electrical contact 58 come into contact with each other. Stable communication is possible.

  The slot thermal contacts 44 are arranged at two positions with a predetermined interval in the longitudinal direction of the slot base 42, and a plurality of slot electrical contacts 43 are provided therebetween. A power slot electrical contact 43a that does not require a signal for high-speed communication is disposed at a position near the slot heat contact 44. As described above, since the slot base 42 is formed of a resin material such as LCP having low thermal conductivity, the slot heat contact 44 and the power slot electrical contact 43a are insulated. Further, the position far from the slot heat contact 44 is not easily affected by the temperature. Therefore, it is desirable to arrange a signal line used for high-speed communication such as an equiimpedance pair line at a position with little thermal influence from the viewpoint of reducing the thermal influence on signal transmission. Therefore, in the slot base 42, a communication slot electrical contact 43b is disposed at a position far from the slot thermal contact 44 (between the power supply slot electrical contacts 43a provided in two places).

  Since the card-type storage device 5 is used in an imaging device or the like that is an example of a portable electronic device, the card-type storage device 5 has a small and thin shape because emphasis is placed on storage and portability. In addition, the card type storage device 5 is repeatedly inserted into and removed from the slot 31, the card reader 6 and the like, and when mounted in the slot 31, etc., the card type storage device 5 has a relatively simple configuration due to the engagement of the connector portion and the light contact at the guide portion. Retained. Therefore, in order to suppress heat storage in the card-type storage device 5, a heat radiating / heat absorbing member such as a fin or Peltier element, which is a heat radiating means having a large heat radiating effect, or a heat conducting member such as a graphite sheet or a heat pipe is brought into contact. It is not easy. Further, since it is not preferable to use a device that can be a noise source during moving image shooting by the imaging device, it is not realistic to cool the card-type storage device 5 by forced convection using a fan or the like.

  For this reason, it is considered desirable for heat countermeasures for the card-type storage device 5 to increase the natural heat dissipation by quickly diffusing the heat generated inside the entire housing of the card-type storage device 5. . One reason for this is that the heat generated in the electronic component is diffused to the surroundings, thereby making it possible to prevent destruction or malfunction due to high temperatures, a decrease in life, and the like. Another reason is that the temperature can be averaged over the entire casing, so that the efficiency of natural heat dissipation to the surroundings can be improved. Yet another reason is that generation of a locally high temperature region (heat spot) can be suppressed. By suppressing the generation of the heat spot, it is possible to prevent the card type storage device 5 from being dropped reflectively by touching the heat spot when the user takes out the card type storage device 5 after using the imaging device. be able to. Then, next, the structure of the card-type memory | storage device 5 based on the concrete heat countermeasure in the card-type memory | storage device 5 is demonstrated in detail.

  FIG. 4 is a perspective view showing a schematic configuration of the card type storage device 5. The card-type storage device 5 has a flat and substantially rectangular card shape. Therefore, for convenience of explanation, the thickness direction, the insertion / removal direction, and the width direction are defined as three directions orthogonal to each other with respect to the card-type storage device 5 as shown in FIG. The thickness direction is the smallest dimension in the card type storage device 5. The insertion / removal direction is a direction in which the card-type storage device 5 is inserted / removed with respect to the slot 31. The width direction is a direction orthogonal to both the thickness direction and the insertion / extraction direction. Accordingly, the two surfaces in the thickness direction of the card-type storage device 5 are referred to as a first surface 53 and a second surface 54, respectively, and the two surfaces in the insertion / removal direction are referred to as a terminal surface 51 and a rear end surface 52, respectively. In FIG. 4A, the rear end face 52 and the first face 53 are not visible because of the viewpoint shown. The card electrical contact 58 and the card thermal contact 59 are exposed on the terminal surface 51, and the card electrical contact 58 and the card thermal contact 59 correspond to the card interface 26 shown in FIG.

  FIG. 5 is a diagram for explaining the components of the card-type storage device 5 and the assembly process. In each figure of FIG. 5, contrary to FIG. 4, the first surface 53 side is shown as an upper side, and the second surface 54 side is shown as a lower side. FIG. 5A is an exploded perspective view showing components of the card-type storage device 5. The card-type storage device 5 includes a first surface card label 68, a first surface card exterior 67, a card side connector 61, a card frame 62, a card side substrate 64, a second surface card exterior 63, a second surface sheet member 73, and A second side card label 57 is provided. Although the card-side board 64 and the card frame 62 are separate components, FIG. 5A shows the card-side board 64 in a state where the card-side board 64 is arranged at a predetermined position with respect to the card frame 62 for convenience. ing. In a state where the card type storage device 5 is mounted in the slot 31, the first surface card exterior 67 faces the slot side substrate 41 and the second surface card exterior 63 faces the slot cover 45 in the thickness direction.

  The first surface card exterior 67 is formed with a first injection hole 67a (first hole part) and an air hole 67b (second hole part) used for injecting the potting material. A second injection hole 64a used for injection of the potting material is formed. Flash memory ICs 65a and 65b, a controller IC 69, and a dummy component 430a are mounted on the first surface 53 side of the card side substrate 64, and flash memory ICs 65c and 65d are disposed on the second surface 54 side of the card side substrate 64. A dummy component 430b is mounted. The flash memory ICs 65a to 65d correspond to the flash memory 29 shown in FIG. 2B, and the controller IC 69 corresponds to the card controller 28 shown in FIG. The first injection hole 67a and the second injection hole 64a are provided so as to be located on the same axis substantially parallel to the thickness direction (at a position overlapping when viewed from the thickness direction). By assembling the card side connector 61, the card frame 62, the first surface card exterior 67, and the second surface card exterior 63, a card housing 60 (see FIG. 5C, etc.) that houses the card side substrate 64 is assembled. It is formed.

  From the viewpoint of heat resistance that can withstand reflowing, thinness for making small and thin, hot water flowability and slidability that can form a complicated shape, the card side connector 61 is similar to the slot base 42. A molded article made of LCP is preferably used. A card electrical contact 58 and a card heat contact 59 are press-fitted and held in the card side connector 61. Both the card electrical contact 58 and the card thermal contact 59 have no spring property. The card electrical contact 58 is plated with a copper alloy (gold plating or the like) as in the slot electrical contact 43, while the card thermal contact 59 is plated on a copper alloy (as in the slot thermal contact 44). Those subjected to hard chrome plating or the like are preferably used. The card-side connector 61 has an engaging portion that engages with the card frame 62, the first surface card exterior 67, and the second surface card exterior 63.

  A polycarbonate (PC) molded product is preferably used for the card frame 62 from the viewpoints of strength, lightness, mass productivity, and the like. The card frame 62 has an engaging portion that engages with the card-side connector 61, the first surface card exterior 67, and the second surface card exterior 63. For the first surface card exterior 67 and the second surface card exterior 63, processed products of stainless steel plates are suitably used from the viewpoint of strength, press workability, and the like. A first surface sheet member 77 (not shown in FIG. 5) having an insulating property is provided on the inner surfaces of the first surface card exterior 67 and the second surface card exterior 63 as a surface treatment for preventing the internal electronic components from being short-circuited. 8) and the second surface sheet member 73 are affixed. For example, a resin tape having an adhesive surface is used for the first surface sheet member 77 and the second surface sheet member 73, but a similar film is formed by using insulating coating or the like instead of attaching the sheet member. May be. A sheet hole portion to be described later is provided at a position corresponding to the first injection hole 67 a and the air hole 67 b in the first surface sheet member 77. It is desirable that the outer surface of each of the first surface card exterior 67 and the second surface card exterior 63 is subjected to hairline processing, blast processing, or the like in consideration of appearance quality such as difficulty of conspicuous scratches. .

  For the card-side substrate 64, for example, a glass epoxy substrate that can be mounted on both sides is used. On the card side substrate 64, a circuit pattern of the card type storage device 5 and land portions for mounting various electronic components are formed. Corresponding to the land portion, various electronic components such as a card-side connector 61, a controller IC 69 and flash memory ICs 65a to 65d, other power supply ICs (not shown), passive components, and dummy components 430 are mounted. The controller IC 69 and the flash memory ICs 65a to 65d are electronic components (heat sources) that generate a lot of heat by operation. In particular, since the amount of heat generated by the operation of the controller IC 69 is large, the heat dissipation structure from the controller IC 69 is the most important in the heat dissipation structure in the card type storage device 5. The dummy part 430 is a part mounted for the purpose of controlling the flow of the potting material so that at least the region excluding the dummy part is filled with the potting material when the potting material is injected into the card housing 60. Details will be described later. In the following description, the controller IC 69, the flash memory ICs 65a to 65d, and the like are not particularly distinguished, and the term “exothermic element” is used when describing them as electronic components that generate heat by operation. .

  Each of the first side card label 68 and the second side card label 57 is made of a thin paper material, a resin material, or a metal material, and various information and designs of the card type storage device 5 are printed on the front surface, and adhesive processing is performed on the back surface. Is given. The first side card label 68 is used not only to display the appearance of the card type storage device 5 but also to cover the first injection hole 67a and the air hole 67b provided in the first side card exterior 67. Affixed to the exterior 67 surface.

  FIG. 5B to FIG. 5E are diagrams for explaining the assembly process of the card-type storage device 5. First, as shown in FIG. 5B, various electronic components such as the controller IC 69, the card-side connector 61, the dummy component 430, and the like are mounted on both surfaces of the card-side substrate 64 by reflow soldering. The side connector 61 is engaged with the card frame 62. At this stage, the card-side substrate 64 is cantilevered by the card-side connector 61 and is indirectly positioned with a gap with respect to the card frame 62. At that time, the card-side connector 61 is accurately mounted, so that the card-side substrate 64 is substantially parallel to the first surface 53 and the second surface 54 of the card type storage device 5.

  Subsequently, as shown in FIG. 5 (c), the first surface card exterior 67 and the second surface card exterior 63 are assembled to the card frame body 62 from the thickness direction by fitting snap fitting (so-called patching), Thereby, the card housing 60 is completed. For assembling the first surface card exterior 67 and the second surface card exterior 63 to the card frame 62, a technique such as adhesion or welding may be used. And as shown in FIG.5 (d), the nozzle 401c of dispenser (not shown) is inserted in the 1st injection hole 67a on the 1st surface card | curd exterior 67, and potting materials, such as thermosetting resin or rubber | gum, are used. It is poured into the card housing 60 and filled. The potting material fills a gap (space) between the electronic components such as the controller IC 69 and the flash memory IC 65 and the card housing 60 in the card housing 60, thereby promoting heat dissipation by heat conduction from the electronic components. .

  It is desirable that the card housing 60 be assembled so as to have a certain degree of sealing so that the potting material does not leak from the card housing 60 when the potting material is injected. For example, when assembling by fitting snap fit, it is desirable to devise such as setting the insertion pressure and accuracy between parts high, and when assembling by bonding or welding, it is desirable to devise such as not providing a large non-bonding part. Further, the card-side substrate 64 on which electronic components are mounted is assembled to the card frame 62 from one side in the thickness direction (the first surface 53 side or the second surface 54 side). Therefore, the card frame 62 may be integrally formed with either the first surface card exterior 67 or the second surface card exterior 63 in advance.

  After a predetermined amount of potting material is filled in the card housing 60, a heat treatment of the card housing 60 for curing the potting material is performed as a process (not shown). Thereby, the potting material does not leak from the card housing 60, and the overall robustness and weather resistance of the card housing 60 are improved. The potting material desirably has a good balance of various properties such as thermal conductivity, deep part curability, insulation, and weather resistance, and for example, it is desirable to use a silicone rubber material. On the other hand, a room temperature curable material called RTV (Room Temperature Vulcanizing) rubber may be used. In this case, the heat treatment step can be omitted. However, it is necessary to sufficiently confirm that the RTV rubber is sufficiently cured to a deep portion in the card housing 60. Finally, as shown in FIG. 5E, the first side card label 68 and the second side card label 57 are attached to the first side card exterior 67 or the second side card exterior 63, respectively. Thereby, the card-type storage device 5 is completed.

  Next, the filling process of the potting material into the card housing 60 will be described in detail. Generally, by filling a potting material in an electronic device (electronic device), heat is transferred to the housing by the exothermic element disposed inside the electronic device contacting the housing via the potting material, Heat is released from the housing to the outside. At that time, the larger the area where the potting material comes into contact with the exothermic element or the casing, the lower the thermal resistance between the exothermic element and the casing and the higher the heat dissipation effect. Therefore, basically, it is desirable that the potting material is filled so as to fill the space in the electronic device as much as possible. On the other hand, the temperature inevitably rises in a region on the way of heat dissipation. Therefore, the potting material is partly placed in areas near the main heat source in the housing, areas that are likely to become hot, and areas that the user may touch with fingers or the like during or immediately after using the electronic device. It is desirable that it is not filled (the potting material does not contact the inner surface of the housing).

  FIG. 6 is a diagram for explaining a user's typical gripping method for the card type storage device 5 when the card type storage device 5 is inserted into and removed from the slot 31. As shown in FIG. 6A, the card-type storage device 5 has two fingers 440a near the rear end surface 52 side in the insertion / extraction direction on the first surface 53 and the second surface 54 and near the center in the width direction. , 440b is often gripped so as to be pinched. Or as shown in FIG.6 (b), it is hold | gripped so that it may pinch | interpose in the width direction both ends (corner | edge part by the side of the rear end surface 52 of the card | curd case 60) in the rear end surface 52. In the case of the gripping method of FIG. 6B, the part touched by the user is relatively far from the heat generating element, and the card frame 62 is made of PC (polycarbonate) having a low thermal conductivity. Therefore, the possibility of a high temperature that hinders gripping is low. On the other hand, the part touched by the user in the case of the gripping method of FIG. 6A is the first side card outer case 67 and the second side card outer case 63 made of a thin metal plate, and a heat generating element is arranged in the immediate vicinity. It is a part. Moreover, in the card-type memory | storage device 5, the clearance gap between the 1st surface card exterior 67 and the 2nd surface card exterior 63, and a heat generating element is narrow in the thickness direction. Accordingly, since the portion touched by the user with the gripping method of FIG. 6A is likely to become high temperature, the area corresponding to the portion touched by the gripping method of FIG. It is desirable that the potting material is not filled.

  FIG. 7 is a diagram for explaining a non-filling portion of the potting material in the card type storage device 5. Here, only the first surface 53 side of the card side substrate 64 is illustrated and described, but the second surface 54 side has the same configuration. FIG. 7A is a diagram for explaining a non-filling portion of the potting material provided on the first surface 53 side of the card side substrate 64 in the card housing 60. The non-filling portion of the potting material is indicated by a broken line area 420 and is provided in a portion immediately below the first surface card exterior 67 and the second surface card exterior 63 near the center in the width direction on the rear end surface 52 side. . Of the broken line region 420, a region 420a indicates a region where a heat generating element is not mounted, and a region 420b indicates a region where a heat generating element is mounted.

  As a method for preventing the potting material from being filled in the broken line region 420, there is a method of mounting a dummy component 430, which is a mounting component for controlling the flow of the potting material, in the region 420a. This method is simple and reliable. It is one of. FIG. 7B is an enlarged perspective view showing the periphery of the dummy component 430. As the dummy component 430, a metal material using a plate material such as stainless steel having a relatively low thermal conductivity is preferably used. Here, the plate material such as stainless steel is bent or drawn to have a concave shape having an opening in the normal direction of the mounting surface of the card side substrate 64.

  The height (dimension in the thickness direction) of the dummy component 430 is such that the upper end is located in the gap between the card side substrate 64 and the first side card exterior 67 (first side sheet member 77 when the first side sheet member 77 is provided). It is desirable that the height be Thereby, an independent space 431 (internal space of the dummy component 430) surrounded by the dummy component 430 and the first surface card exterior 67 (not shown in FIG. 7B) can be formed in the card housing 60. . When a potting material is injected into the card housing 60 by a method described later, the potting material does not substantially flow into the space 431, and therefore, an area 420a serving as an unfilled portion of the potting material can be formed. Note that the potting material does not substantially flow into the dummy part 430 means that a certain amount (small amount) of the potting material may flow, but the inside of the dummy part 430 is not fully filled with the potting material. Point to.

  FIG. 8 is an enlarged cross-sectional view showing the vicinity of the region 420b. Here, the region including the flash memory IC 65a is shown. In the area 420b, the gap between the top surface of the flash memory IC 65a, which is a heat-generating element, and the first surface card exterior 67 (first surface sheet member 77) is narrow. When the potting material is injected into the card housing 60, the potting material tries to enter the gap so that the opposite surface is mainly wetted in the narrow space between the flash memory IC 65a and the first surface sheet member 77. To do. FIG. 8A schematically shows the flow of the potting material 400 when the wettability of the potting material 400 with respect to the respective surfaces of the flash memory IC 65a and the first surface sheet member 77 is large. In this case, since the potting material 400 is easily wetted on the solid surface, the potting material 400 easily enters the gap due to a capillary phenomenon.

  On the other hand, FIG. 8B schematically shows the flow of the potting material 400 when the wettability of the potting material 400 with respect to the surfaces of the flash memory IC 65a and the first surface sheet member 77 is small. In this case, since the potting material 400 is difficult to get wet with the solid surface, it is difficult to enter the gap. Therefore, in the region 420b serving as the unfilled portion, the potting material 400 is partially formed with respect to the top surface of the heat generating element and the inner surface of the first surface sheet member 77 so as to be in the state shown in FIG. A surface treatment that reduces wettability is preferably performed. Such a surface treatment varies depending on the material of the potting material 400, and thus cannot be generally described. For example, when the potting material is oily, measures to apply an oil-repellent coating or the like may be taken. On the contrary, in the region (filling region) that is not the non-filling portion of the potting material 400 in the card housing 60, the potting material 400 is subjected to surface treatment so as to increase the wettability of the potting material 400. It is good to fill in every corner by entering a narrow gap.

  Next, a specific filling method of the potting material 400 to the card housing 60 will be described. FIG. 9 is a diagram showing a schematic configuration of a dispenser 401 (potting material filling device) used for filling the potting material 400 into the card housing 60. In FIG. 9, the ratio of the size of the card housing 60 and the dispenser 401 is different from the actual size. The dispenser 401 generally includes a control device 401a, a cylinder portion 401b, a nozzle 401c, an interface portion 401d, and a three-dimensional stage 403. Like the syringe, the dispenser 401 is a device that discharges the potting material 400 from the nozzle 401c at the tip of the cylinder portion 401b with high accuracy.

  The cylinder portion 401b is filled with a potting material 400 having fluidity before the curing process. The cylinder portion 401b is driven by a linear actuator that can be electronically controlled, high-pressure gas, or the like. When a linear actuator is used, the interface unit 401d is an electrical wiring, and the cylinder unit 401b is driven by the control device 401a sending electric power and a control signal to the cylinder unit 401b. When driving the cylinder unit 401b using high-pressure gas, the interface unit 401d is a gas pipe (tube), and the control unit 401a sends the high-pressure gas to the cylinder unit 401b to drive the cylinder unit 401b. In any configuration, the discharge amount of the potting material 400 from the nozzle 401c is accurately controlled by the control device 401a. The three-dimensional stage 403 has a structure in which the cylinder portion 401b and the card housing 60 are stably held and relatively moved. When the potting material 400 is injected, the three-dimensional stage 403 adjusts the position of the tip of the nozzle 401c and the first injection hole 67a of the card housing 60 and the insertion depth of the nozzle 401c. As the dispenser 401, a well-known device capable of discharging the potting material 400 under a predetermined condition can be used, and thus a more detailed description is omitted.

  FIG. 10 is a diagram for explaining a filling process of the potting material 400 into the card housing 60. FIG. 10A is a plan view of the card housing 60 (card type storage device 5). FIGS. 10B to 10D are cross-sectional views taken along the line AA shown in FIG. 10A, and the card-type storage device 5 is completed from the start of injection of the potting material 400 into the card housing 60. It is a figure explaining the process until it does. 10B to 10D, the card housing 60 (card type storage device 5) is shown enlarged in the thickness direction.

  As shown in FIG. 10B, there are two main spaces in the card housing 60. One space is a first space 411 surrounded by the first surface card exterior 67, the card side substrate 64, and the card frame 62. Another space is a second space 412 surrounded by the second surface card exterior 63, the card side substrate 64, and the card frame 62. Strictly speaking, the card-side substrate 64 and the card frame 62 are not coupled to each other, and the first space 411 and the second space 412 communicate with each other through a minute gap 413 therebetween. For convenience, the first space 411 and the second space 412 are distinguished from each other.

  It is desirable to inject the potting material 400 in two stages from the first surface 53 side of the card housing 60. For this purpose, first, as shown in FIG. 10B, the tip of the nozzle 401 c of the dispenser 401 is passed through the first injection hole 67 a of the first surface card exterior 67 and the second injection hole 64 a of the card side substrate 64. Insert into the second space 412. Then, the potting material 400 is injected into the second space 412 so that the second space 412 is mainly filled with the potting material 400. At this time, the position of the tip of the nozzle 401c in the thickness direction may be as close as possible to the inner surface of the second card outer case 63, and may be lightly contacted as long as the discharge of the potting material 400 is not hindered. As a result, the potting material 400 injected into the second space 412 can flow along the inner surface of the second surface card exterior 63 and spread to every corner of the second space 412. The potting material 400 can be well filled.

  Subsequently, as shown in FIG. 10C, the nozzle 401 c is pulled up to move the tip into the first space 411, and the potting material 400 is injected so that the first space 411 is mainly filled with the potting material 400. . At this time, if the tip position of the nozzle 401c is at a position lower than the top surface of the electronic parts on the card side substrate 64 which are tall, the spread of the injected potting material 400 is likely to be hindered by the surrounding electronic parts. Moreover, if the tip position of the nozzle 401c is too close to the first injection hole 67a, the injected potting material 400 may rise up due to its own viscosity before it spreads around and leak out of the first injection hole 67a. . Therefore, the tip position of the nozzle 401c in the thickness direction may be set to approximately the same position as the top surface of the tall electronic component mounted on the card-side substrate 64. Thereby, the potting material 400 can be filled in the first space 411 so that at least a part of the upper surface of the potting material 400 reaches the inner surface of the first surface card exterior 67.

  Regarding the filling of the potting material 400 into the card housing 60, the viscosity of the potting material and the wettability of the various members inside the card housing 60 are important. When the potting material 400 has a viscosity that is higher than necessary or when the wettability is unnecessarily low, the potting material 400 is difficult to spread in the card housing 60, so that the potting material 400 is spread to every corner in the card housing 60. It may not be possible to fill as intended. On the other hand, when the potting material 400 has a viscosity that is lower than necessary or when the wettability is higher than necessary, the potting material 400 is easily filled to every corner, but can leak from the gap of the card housing 60 during injection. There is a risk that it will be filled in parts that you do not want to fill.

  As a specific example of the portion where the potting material 400 is not desired to be filled, it is formed between the card-side substrate 64 and various electronic components mounted thereon, in addition to the non-filling portion (broken line region 420 in FIG. 7). Mounting gaps. More specifically, the controller IC 69 or the like mounted on the card-side substrate 64 is in the form of a leadless package having a large number of ball-shaped electrodes on the mounting surface, generally called a BGA (Ball Grid Array). Since these electrodes are soldered in a state of substantially point contact with the land portion on the card side substrate 64, generally, the bonding strength at each bonding portion is larger than the bonding strength in the package with lead. Absent. For this reason, if the potting material 400 flows into the mounting gap, stress may act on the electrode joint during curing in the heat treatment process, resulting in poor bonding or peeling. In addition, the same problem may occur due to a change in volume of the hardened potting material 400 when the temperature of the card-type storage device 5 changes during use. Therefore, it is necessary to select a material having an appropriate viscosity and wettability for the potting material 400 in consideration of these circumstances.

  As described above, the card housing 60 has a certain sealing property so that the potting material 400 does not leak from the card housing 60 when the potting material 400 is injected into the card housing 60. However, it cannot be said that there is no possibility that the potting material 400 leaks from the gap of the card housing 60 due to the assembly variation of the card housing 60 for each individual. However, since the viscosity of the potting material is generally larger than that of water or machine oil, it is difficult to leak. Therefore, as long as no leakage occurs when the potting material 400 is injected, the potting material 400 may be injected as it is, and then the heat treatment process may be promptly performed.

  When the degree of sealing of the card case 60 is insufficient or it is difficult to increase the degree of sealing, the injection amount of the potting material 400 may be reduced so that the card case 60 is not fully filled with the potting material 400. FIG. 11 is a cross-sectional view schematically showing a filling example in which the potting material 400 is not fully filled in the card housing 60, and is shown by a cross-section taken along the line AA as in FIG. In this case, the injected potting material 400 does not flow to the engaging portion on the peripheral edge of the card housing 60, but comes into contact with the side surface of the heat generating element and the inner surface of the card housing 60 in the vicinity of the first injection hole 67a. In addition, it is desirable to use a potting material 400 having a relatively high viscosity. As a result, heat is transferred from the heat generating element to the card housing 60 via the potting material, and therefore a certain heat dissipation effect can be obtained.

  When the degree of sealing of the card case 60 is not high, the air in the card case 60 escapes from the gap between the components of the card case 60 as the potting material 400 is injected. The internal pressure does not increase greatly. However, when the sealing degree of the card housing 60 is high, the pressure in the card housing 60 increases with the pouring of the potting material 400, so that the potting material 400 may not easily flow. In order to cope with this, an air hole 67 b is provided in the first surface card exterior 67. The air hole 67b is preferably provided in a portion where the potting material 400 reaches the end when the potting material 400 is injected, and for example, provided in the peripheral portion of the first surface card exterior 67 (FIG. 10C). reference).

  It should be noted that the inside of the card housing 60 is decompressed or injected into the card housing 60 while pressurizing the potting material 400 from the first injection hole 67a so that the potting material 400 is filled in every corner of the card housing 60. You may make it do. In this case, measures to increase the sealing performance of the card housing 60 and measures to prevent the potting material 400 from flowing into the mounting gap formed between the card side substrate 64 and various electronic components mounted thereon. It is desirable to take.

  After the card casing 60 is filled with a predetermined amount of potting material 400, the nozzle 401c is removed from the card casing 60 as shown in FIG. 10D, and the card casing 60 is heat-treated by a heat treatment apparatus (not shown). To do. Here, the potting material 400 generally involves shrinkage when cured by heat treatment. Therefore, in the card case 60 heat treatment step filled with the potting material 400, the card surface 60 is warped inward by pulling the first surface card exterior 67 and the second surface card exterior 63 to the potting material 400. May occur. The occurrence of such warpage not only impairs the appearance quality and the sealing property of the card housing 60, but the first surface card exterior 67 and the second surface card exterior 63 are in contact with the top surface of the heat generating element, Since the contact part becomes a heat spot, it is not preferable. However, in the present embodiment, dummy components 430 a and 430 b as mounting components that are higher than the heat generating elements are mounted on the card-side substrate 64. Therefore, since the dummy parts 430a and 430b support the first surface card exterior 67 and the second surface card exterior 63, the occurrence of warpage can be suppressed.

  Finally, the first-side card label 68 and the second-side card label 57 are attached to the heat-treated card housing 60, whereby the card-type storage device 5 is completed. As described above, after assembling the card housing 60, the card-type storage device 5 injects the potting material 400 in two stages from the first surface 53 side. At this time, the dummy parts 430a and 430b mounted on the card side substrate 64 partially form an unfilled portion in the card housing 60 where the potting material 400 is not filled. Accordingly, it is possible to realize a structure filled with the potting material 400 while avoiding an increase in thickness without providing an uneven portion as described in Patent Document 2 described as the prior art. Then, while suppressing the generation of heat spots in the card housing 60, the heat generated by the heat-generating elements mounted on the card-side substrate 64 is transferred from the card housing 60 to the outside via the hardened potting material 400. Heat can be dissipated. When the potting material 400 comes into contact with the card thermal contact 59, the heat radiation efficiency to the slot 31 and the host side (for example, the camera body 1) can be enhanced via the card thermal contact 59 and the slot thermal contact 44.

  The gap between the inner peripheral surface of the first injection hole 67a provided in the first surface card exterior 67 and the outer peripheral surface of the nozzle 401c of the dispenser 401 is preferably narrow. This is because if the gap is large, the injected potting material 400 may swell on the spot due to its own viscosity and leak out of the gap before it spreads in the card housing 60. On the other hand, if the gap is too small, the first injection hole 67a and the nozzle 401c cannot be easily positioned, and the productivity of the card type storage device 5 is reduced.

  FIG. 12 is a cross-sectional view showing a configuration example for reducing the gap between the first injection hole 67a and the second injection hole 64a and the nozzle 401c. FIG. 12A shows a state before the nozzle 401c is inserted into the card housing 60, and FIG. 12B shows a state after the nozzle 401c is inserted into the card housing 60. The state of is shown. 12 is a cross-sectional view of the structure in the vicinity of the first injection hole 67a as viewed from the direction perpendicular to the thickness direction of the card housing 60. Here, the inner surface of the first surface card exterior 67 is shown on the inner surface. The configuration will be described in which the first sheet member 77 is attached.

  In the first surface sheet member 77, a sheet hole portion 77 a is formed at a position corresponding to the first injection hole 67 a of the first surface card exterior 67. In order to narrow the gap between the first injection hole 67a and the nozzle 401c, as shown in FIG. 12A, the sheet hole portion of the first surface sheet member 77 is provided after the first surface sheet member 77 is provided. It is desirable to make the diameter of 77a shorter than the diameter of the first injection hole 67a. More preferably, it is desirable to make the diameter of the sheet hole 77a shorter than the outer diameter of the nozzle 401c. Then, as shown in FIG. 12B, the nozzle 401c is inserted into the card housing 60 so that the sheet hole 77a of the first sheet member 77 is inserted and widened at the tip of the nozzle 401c. As a result, a sheet hole 77a having a minimum diameter substantially equal to the diameter of the nozzle 401c can be formed in the first surface sheet member 77, and leakage from the first injection hole 67a when the potting material 400 is injected can be prevented. Occurrence can be prevented. In addition, a relatively large value can be set for the diameter of the first injection hole 67a, and the positioning of the nozzle 401c can be easily performed in a short time.

  When the nozzle 401c is inserted into the first injection hole 67a without providing the sheet hole 77a in the first surface sheet member 77 in advance, the first injection hole 67a is blocked in the first surface sheet member 77 by the nozzle 401c. The structure which the part which was there may be perforated may be sufficient. At this time, if a very small number of holes are formed in advance in the region where the first injection hole 67a is closed in the first surface sheet member 77, drilling is facilitated. The tip of the nozzle 401c preferably has a sharp shape so that the sheet hole 77a provided in the first surface sheet member 77 can be smoothly inserted and widened (or drilled). For the first surface sheet member 77, for example, a material having a relatively high strength and hardly stretched (for example, a PET film or the like) can be used.

  FIG. 12 shows a configuration in which a cylindrical support component 443 is mounted on the card side substrate 64. The inner diameter of the support component 443 is longer than the outer diameter of the nozzle 401c, and an opening 443a for allowing the potting material 400 to flow out from the inside to the outside is provided on the side surface of the support component 443. The support component 443 plays a role of supporting the first surface sheet member 77 when the nozzle 401c is inserted. Since the support component 443 supports the first surface sheet member 77, the first surface sheet member 77 is held without being peeled from the first surface card exterior 67 even when receiving a force toward the inside of the card housing 60 from the nozzle 401 c. Therefore, the sheet hole 77a having a desired inner diameter can be formed.

  In the above description, one hole portion for injecting the potting material 400 is provided in each of the first surface card exterior 67 and the card side substrate 64. However, the present invention is not limited to this, and more hole portions are provided. The potting material 400 may be injected from a plurality of locations. However, in general, the card-side substrate 64 is not easy to be provided with a plurality of holes because circuit patterns are densely arranged. Therefore, when various electronic components are mounted on the card side substrate 64, the heat generating elements are arranged relatively densely on the first surface 53 side (so that the occupied area on the card side substrate 64 is increased). It is desirable to do. As a result, the area occupied by the electronic component on the second surface 54 side of the card side substrate 64 becomes relatively small and the potting material 400 can easily flow, so that even when the number of holes in the card side substrate 64 is small, A fixed amount of potting material 400 can be filled. Furthermore, on the first surface 53 side of the card side substrate 64, a hole for injecting the potting material 400 into the first surface card exterior 67 can be additionally provided immediately above the portion where the potting material 400 is difficult to be filled. Thereby, the potting material 400 can be filled in a desired region in the card housing 60.

  FIG. 13A is a plan view for explaining the display content of the first side card label 68, and FIG. 13B is a plan view for explaining the display content of the second side card label 57. Here, FIG. The top view of the card-type memory | storage device 5 whole is shown. The first surface card label 68 is an information display label on which the name, performance, vendor information, and the like of the card type storage device 5 are written. On the other hand, the second side card label 57 is a memo card label on which a user can freely enter various memos. The memo label receives high writing pressure from the pen tip when the memo content is written with various pens. Therefore, if there is a hole such as the first injection hole 67a or the air hole 67b under the memo label, the label material will be torn when it comes directly above the hole, and the appearance quality will be reduced. There is a risk that. From the viewpoint of avoiding such a problem, in the card-type storage device 5, an information display label (first surface card label 68) that is less likely to be written with a pen or the like is provided on the first surface 53 side with a memo label ( A second side card label 57) is affixed to the second side 54 side. Further, on the first side card label 68, important information such as name and capacity is arranged in the area corresponding to and directly above the first injection hole 67a and the air hole 67b, or three-dimensional characters and logos. It is desirable to arrange the design so that it is difficult to be filled in with a pen or the like.

  Next, a card type storage device according to a second embodiment of the present invention will be described. FIG. 14A is an exploded perspective view showing a schematic configuration of a card type storage device 5A according to the second embodiment. FIG. 14B is a perspective view showing a schematic configuration of the card type storage device 5A. FIG. 14C is a cross-sectional view taken along the line BB shown in FIG. 14B, and shows the thickness direction exaggerated with respect to other directions. Note that components having the same functions as those of the card-type storage device 5 according to the first embodiment, which are component parts of the card-type storage device 5A, are denoted by the same reference numerals, and redundant description is appropriately omitted. To do.

  The card-type storage device 5A includes a card side substrate 64, a first surface card exterior 67, a second surface card exterior 63, a plurality of flash memory ICs 65, a controller IC 69, and a first surface card label 68. The first surface card exterior 67 is provided with a first injection hole 67a and an air hole 67b, and the card side substrate 64 is provided with a card electrical contact 58, a card thermal contact 59, and a second injection hole 64a. Yes. A connector opening 460 is formed at one end of the card type storage device 5A in the insertion / extraction direction. A gap 461 is formed between the card side substrate 64 and the first surface card exterior 67, and a gap 462 is formed between the card side substrate 64 and the second surface card exterior 63.

  The first surface card exterior 67 is made by integrally molding a stainless steel sheet metal member 67c and a resin frame member 67d, and the second surface card exterior 63 is made of resin on the stainless steel sheet metal member 63c. A manufactured frame member 63d is produced by integral molding. Therefore, in the card-type storage device 5A, the card casing 60A is formed by combining the first-surface card exterior 67 and the second-surface card exterior 63, thereby eliminating the need for a card-side connector or a card frame. It has become a structure. As a method of fixing the first surface card exterior 67 and the second surface card exterior 63, a technique such as adhesion or welding is used.

  A card electrical contact 58 and a card thermal contact 59 formed as land portions on the card side substrate 64 correspond to the card interface 26 shown in FIG. Exposed outside of 60A. That is, a card-side electrical contact 58 and a card thermal contact 59 are formed by fitting a host-side connector having a connector pin with a convex shape provided on the slot side (not shown) into the connector opening 460 having a concave shape. The connector pin can be conducted. Note that the structure of the host-side connector is not directly related to the present invention, and thus the description thereof is omitted.

  Thus, in a configuration in which a part of the card side substrate 64 is exposed to the outside of the card housing 60A, an interface (between the card side substrate 64 and the frame members 67d and 63d constituting the card housing 60A is inevitably formed). Boundary) exists. Since the card side substrate 64 and the frame members 67d and 63d are not bonded at such an interface, gap portions 461 and 462 are formed in these portions. Therefore, the sealing degree of the card housing 60A is relatively lower than that of the card housing 60 of the card type storage device 5 described in the first embodiment. Therefore, it is necessary to pay attention so that the potting material does not leak from the card housing 60A in the potting material filling process for the card housing 60A. However, if each member is assembled with sufficient accuracy in the card housing 60A, the gap is generally small. Therefore, if the potting material does not leak between the potting material injection and the heat treatment, the potting material is used as it is. The filling process may be performed.

  FIG. 15 is a cross-sectional view showing an example of a structure that increases the sealing degree of the card housing 60A of the card type storage device 5A, and shows a structure in the vicinity of the connector opening 460 shown in FIG. In the gaps 461 and 462 shown in FIG. 14C, elastic members 461a and 462a are provided, thereby improving the sealing performance of the card housing 60A. The elastic members 461a and 462a can be disposed by performing a surface treatment, attaching a member, or the like on the surfaces facing each other at the gap portions 461 and 462. As the surface treatment, rubber coating or the like in which a resin or a rubber member is sprayed and adhered can be used. In addition, a thin sheet member made of resin or rubber can be used as a member when the member is attached. The surface treatment or the addition of members can be performed on one or both of the card side substrate 64 and the card housing 60A.

  In addition, when the potting material is injected into the card housing 60A, it is desirable to press the card housing 60 with the pusher 470, whereby the gaps 461 and 462 can be temporarily narrowed. Furthermore, since the remaining gap is eliminated by arranging the elastic members 461a and 462a, the degree of sealing of the card housing 60 can be increased. Therefore, even when a potting material having a low viscosity is injected into the card housing 60A, leakage can be prevented. Then, since the potting material is cured by a heat treatment process after the potting material is injected, the potting material does not leak even when the pusher 470 is released.

  Next, a card type storage device according to a third embodiment of the present invention will be described. The positions of the injection hole and the air hole provided for injecting the potting material into the card housing are not limited to the surfaces facing each other in the thickness direction. Therefore, in the present embodiment, a card type storage device in which an injection hole and an air hole are provided on one surface in the insertion / extraction direction (a surface corresponding to the terminal surface 51 of the card type storage device 5) will be described.

  FIG. 16 is a diagram showing a schematic configuration of a card-type storage device 5B according to the third embodiment. FIG. 16A is an exploded perspective view of the card-type storage device 5B, and shows a state during assembly. FIG. 16B is a front view of the card-type storage device 5B, and shows a state viewed from the terminal surface 51 side. FIG. 16C is a view for explaining the step of injecting the potting material 400 into the card housing 60B. FIG. 16D is a perspective view showing a state where the assembly of the card type storage device 5B is completed. FIG. 16E is a perspective view of a thermal contact member 480 that is one of the components of the card type storage device 5B. Note that components having the same functions as those of the card-type storage device 5B according to the first embodiment are denoted by the same reference numerals, and redundant description is appropriately omitted. To do.

  The card-type storage device 5B includes a card-side connector 61, a card frame 62, a card-side substrate 64, a first surface card exterior 67, a second surface card exterior 63, and a thermal contact member 480. Flash memory ICs 65c and 65d and dummy components 430 are mounted on the second surface 54 side of the card side substrate 64, and flash memory ICs, controller ICs and dummy components (not shown) are mounted on the first surface 53 side. ing. The card-side connector 61 has a recess 481 that engages with a host-side connector (not shown), and a card electrical contact 58 is provided in the recess 481. Further, the card side connector 61 is formed with an injection hole 61a and an air hole 61b penetrating the bottom surface of the recess 481 (the surface on the card side substrate 64 side) in the insertion / extraction direction. A cutout portion 482 is provided at a position corresponding to the injection hole 61 a and the air hole 61 b in the card side substrate 64.

  In the card type storage device 5B, the card housing 60B is formed by combining the card side connector 61, the card frame 62, the first surface card exterior 67, and the second surface card exterior 63. After assembling the card housing 60B, as shown in FIG. 16C, the nozzle 401c of the dispenser 401 (not shown) is inserted into the card housing 60B from the terminal surface 51 side through the injection hole 61a, and the potting material 400 is injected. To do. After the injection of the potting material 400 is completed, the hot contact member 480 is inserted into the injection hole 61a and the air hole 61b, and the injection hole 61a and the air hole 61b are sealed. Thereafter, the potting material 400 injected into the card housing 60B is cured to avoid leakage of the potting material 400 from the injection hole 61a and the air hole 61b. In this way, as shown in FIG. 16D, the card type storage device 5B in which the hot contact member 480 is disposed in the concave portion 481 of the card side connector 61 is completed.

  The hot contact member 480 is made of a copper alloy material in consideration of mass productivity such as workability as well as thermal conductivity, and one end of a solid cylindrical member is processed into a flat shape by press working. In addition, a step processed product is preferably used. As shown in FIG. 16 (e), the hot contact member 480 includes a non-processed part 483 that is not pressed and a processed part 484 that is pressed into a flat shape.

  The two hot contact members 480 are inserted into the recesses 481 so that the non-processed portion 483 closes the injection hole 61a and the air hole 61b, and the processed portion 484 aligns with the card electrical contact 58 in the width direction and the insertion / extraction direction. Thereby, the process part 484 plays a role as a card | curd thermal contact. On the other hand, the outer diameter of the non-processed part 483 is substantially equal to the diameters of the injection hole 61a and the air hole 61b provided in the card-side connector 61, and the non-processed part 483 closes the injection hole 61a and the air hole 61b. The thermal contact member 480 functions as a sealing member that prevents the potting material 400 from leaking out. The non-processed portion 483 is inserted to the card-side connector 61 to a certain depth within a range that does not interfere with the card-side substrate 64. Thus, in a state where the hot contact member 480 is mounted on the card-side connector 61, the non-processed portion 483 comes into contact with the potting material 400 filled in the card housing 60B. As a result, the heat generated by the various exothermic elements mounted on the card-side substrate 64 is transmitted to the thermal contact member 480 via the potting material 400, and to the outside via the slot thermal contact 44 (see FIG. 3). Heat is dissipated. Therefore, the hot contact member 480 can more efficiently perform the heat dissipation function, which is the original function.

  As described above, in the card-type storage device 5B, compared with the card-type storage device 5 described as the first embodiment, the configuration of the card-side connector 61 is complicated, but the first-side card exterior 67 and second It is not necessary to provide a hole in the face card exterior 63. This eliminates the need to affix the card label, which is effective when you want to emphasize the metal card exterior material as it is, and further enhance the quality by applying a design to the card exterior. become.

  Although the present invention has been described in detail based on preferred embodiments thereof, the present invention is not limited to these specific embodiments, and various forms within the scope of the present invention are also included in the present invention. included. Furthermore, each embodiment mentioned above shows only one embodiment of this invention, and it is also possible to combine each embodiment suitably. For example, in the above embodiment, a storage device that is one type of storage system has been described as the card-type electronic device. However, the present invention is not limited to this, and the card-type electronic device according to the present invention can be applied to devices that function as interfaces with external devices, devices that function as network devices, and devices that function as multimedia devices. An electronic device to which a card-type electronic device can be attached is not limited to an imaging device or a personal computer, and can be applied to, for example, a printer or an MFP (multifunction device).

DESCRIPTION OF SYMBOLS 1 Camera body 5,5A, 5B Card type memory | storage device 25 Host controller 57 2nd surface card label 60, 60A, 60B Card housing 61 Card side connector 61a Injection hole 62 Card frame body 64 Card side board | substrate 64a 2nd injection hole 65a ~ 65d Flash memory IC
67 First surface card exterior 67a First injection hole 67b Air hole 68 First surface card label 77 First surface sheet member 77a Sheet hole 400 Potting material 461a, 462a Elastic member 480 Thermal contact member

Claims (14)

Electronic components that generate heat;
A substrate on which the electronic component is mounted;
A mounting component mounted on the substrate;
A flat and substantially rectangular shape, comprising a card housing for accommodating the substrate,
The card casing is provided with a first hole for communicating the inside and the outside,
A card-type electronic device, wherein a potting material is filled in at least an area excluding the mounting component inside the card casing. The mounting component has a concave shape,
The card type electronic device according to claim 1, wherein the potting material is not fully filled in the mounting component.   The mounting component is higher than the electronic component in the thickness direction of the card casing in a state of being mounted on the substrate, and has a height that does not contact the inner surface of the opposing card casing. The card type electronic device according to claim 1 or 2. One surface orthogonal to the first surface and the second surface facing each other in the thickness direction of the card housing is a terminal surface electrically connected to an external device, and the direction orthogonal to the terminal surface is the A card-type electronic device is an insertion / extraction direction in which the external device is inserted / extracted,
When the direction perpendicular to both the thickness direction and the insertion / extraction direction is the width direction, in the first surface and the second surface, in the vicinity of the rear end surface facing the terminal surface in the insertion / extraction direction, and 4. The card type electronic device according to claim 1, wherein the mounting component is mounted on the substrate immediately under a region near the center in the width direction. 5. The first hole is formed in the first surface of the card housing,
The card-type electronic device according to claim 4, wherein a label is attached to the first surface so as to cover the first hole portion.   The card-type electronic device according to claim 5, wherein an air hole is further provided in the first surface of the card casing. The substrate is substantially parallel to the first surface of the card housing;
The card-type electronic device according to claim 5, wherein the substrate has a second hole portion located on the same axis substantially parallel to the thickness direction. An information display label for displaying information of the card-type electronic device;
A memo label that can be used to write a memo,
8. The information display label according to claim 5, wherein the information display label is affixed to the first surface as a label covering the first hole, and the memo label is affixed to the second surface. The card-type electronic device according to any one of the above. A sheet member that is attached to the inside of the first surface;
The sheet hole portion having a diameter smaller than the diameter of the first hole portion is located at a position corresponding to the first hole portion of the sheet member, according to any one of claims 5 to 8. Card type electronic device.   The occupied area of the electronic component on the surface of the substrate facing the second surface of the card housing is relatively larger than the occupied area of the electronic component on the surface of the substrate facing the first surface of the card housing. The card-type electronic device according to claim 4, wherein the card-type electronic device is small. The first hole is provided so as to penetrate the terminal surface of the card housing,
A heat contact member for sealing the first hole,
5. The card type electronic device according to claim 4, wherein the thermal contact member is in contact with the potting material inside the card casing. The card housing has an opening that exposes a part of the substrate to the outside,
11. The elastic member is provided on at least one surface of the substrate or the card casing at an interface between the substrate and the card casing in the vicinity of the opening. The card-type electronic device according to any one of the above. A non-filling portion that is not filled with the potting material between the inner surface of the card housing facing the inside of the card housing and the surface of the electronic component;
The inside surface of the card casing and the surface of the electronic component that are opposed to each other inside the card casing in the non-filling portion are relatively less wettable by the potting material than other surfaces. The card-type electronic device according to any one of claims 1 to 12. The card type electronic device according to any one of claims 1 to 13,
A slot into which the card-type electronic device is inserted and removed;
An electronic apparatus comprising: control means for controlling communication with the card type electronic device mounted in the slot.