JP2017172881A - Heat pump type heater - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve various problems a heat pump type heater has, the heat pump type heater using a low-order side refrigerant circuit and a high-order side refrigerant circuit.SOLUTION: A heat pump type heater has a low-order side refrigerant circuit 10, a high-order side refrigerant circuit 20 and a heat medium circuit 30. The heat medium circuit 30 has a heat medium pump 33 configured to circulate a heat medium. The heat medium pump 33 can switch between a state where the heat medium flown out from a heating terminal 31 is allowed to pass only any one of a low-order side heat medium/refrigerant heat exchanger 13 and a high-order side heat medium/refrigerant heat exchanger 23, and a state where it is allowed to pass both of them, and then feeds the passed heat medium to the heating terminal 31.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a heat pump type heating device, and more particularly to a heat pump type heating device using a dual heat pump cycle.

  Conventionally, this type of heat pump type heating device has a high-side refrigerant circuit, a low-side refrigerant circuit, and a load circuit, and the radiator is installed by water (hot water) circulating through the load circuit by operating these. It was configured to warm the surrounding space of the place. And the load circuit was comprised so that the water (warm water) heated by sequentially exchanging heat with the high original side refrigerant | coolant and the low original side refrigerant | coolant may be sent to a radiator with a circulation pump (for example, refer patent document 1). ).

JP 2012-52767 A

  As described above, in the conventional heat pump heating device, the water flowing through the load circuit is configured to be heated by sequentially exchanging heat with the high-side refrigerant and the low-side refrigerant. Since it becomes water after heat exchange with the high-side refrigerant, there is a problem that efficient operation is hindered.

  Moreover, in the heat pump type heating device of such a dual heat pump cycle, since two compressors of a high original side compressor and a low original side compressor which are relatively heavy are used, they are accommodated. If the arrangement in the main body case is not taken into account, the weight will be biased and stable installation will not be possible.

  Further, since the load circuit is configured to sequentially exchange water with the high-side refrigerant and the low-side refrigerant, heating by the high-side refrigerant and heating by the low-side refrigerant cannot be adjusted on the load circuit side.

  Further, there is a problem that the air that has entered the load circuit cannot be released.

  An object of the present invention is to solve various problems of a heat pump heating device using the low-source side refrigerant circuit and the high-source side refrigerant circuit as described above.

  In the heat pump heating device of the first aspect of the invention, the refrigerant circulates in the order of the low-side compressor, the low-side heat medium / refrigerant heat exchanger, the cascade heat exchanger, the low-side expansion valve, and the evaporator. A low-end side refrigerant circuit, a high-end side compressor, a high-end side heat medium / refrigerant heat exchanger, a high-end side expansion valve, and a high-end side refrigerant circuit in which the refrigerant circulates in the order of the cascade heat exchanger, and heating A heat medium circuit that circulates the heat medium via the terminal, and the heat medium circuit includes a heat medium pump that circulates the heat medium, and the heat medium pump reduces the heat medium flowing out from the heating terminal. It is possible to switch between a state where only one of the original heat medium / refrigerant heat exchanger and the high original heat medium / refrigerant heat exchanger is passed and a state where both are allowed to pass. The heated heat medium is sent out to the heating terminal.

  In the heat pump heating device according to the second aspect of the invention, the refrigerant circulates in the order of the low-side compressor, the low-side heat medium / refrigerant heat exchanger, the cascade heat exchanger, the low-side expansion valve, and the evaporator. A low-end side refrigerant circuit, a high-end side compressor, a high-end side heat medium / refrigerant heat exchanger, a high-end side expansion valve, and a high-end side refrigerant circuit in which the refrigerant circulates in the order of the cascade heat exchanger, and heating A heat medium circuit that circulates the heat medium via the terminal, and the heat medium circuit includes a heat medium pump that circulates the heat medium, and the heat medium pump reduces the heat medium flowing out from the heating terminal. It is configured to pass through at least one of the former side heat medium / refrigerant heat exchanger and the higher side heat medium / refrigerant heat exchanger, and to send the passed heat medium to the heating terminal, Main body case where the low-side compressor and the high-side compressor are installed Provided, the low-stage-side compressor, and a high-stage-side compressor, the lower portion of the main body case, characterized in that arranged in symmetrical positions.

  In the heat pump-type heating device of the invention of claim 3, the refrigerant circulates in the order of the low-side compressor, the low-side heat medium / refrigerant heat exchanger, the cascade heat exchanger, the low-side expansion valve, and the evaporator. A low-end side refrigerant circuit, a high-end side compressor, a high-end side heat medium / refrigerant heat exchanger, a high-end side expansion valve, and a high-end side refrigerant circuit in which the refrigerant circulates in the order of the cascade heat exchanger, and heating A heat medium circuit that circulates the heat medium via the terminal, and the heat medium circuit includes a heat medium pump that circulates the heat medium, and the heat medium pump reduces the heat medium flowing out from the heating terminal. It is configured to pass through at least one of the former side heat medium / refrigerant heat exchanger and the higher side heat medium / refrigerant heat exchanger, and to send the passed heat medium to the heating terminal, The heat medium circuit converts the heat medium that has flowed out of the heating terminal into the low heat medium. The refrigerant heat exchanger and the high-end side heat medium / refrigerant heat exchanger are diverted, and the diverted heat medium that has passed through the low-end side heat medium / refrigerant heat exchanger and the high-end side heat medium / refrigerant heat exchanger are passed through. It has the mixing tank which flows in after the divided heat-medium which merged or merged, and sends out a heat medium from this mixing tank to a heating terminal, It is characterized by the above-mentioned.

  In the heat pump heating device of the invention of claim 4, the refrigerant circulates in the order of the low-side compressor, the low-side heat medium / refrigerant heat exchanger, the cascade heat exchanger, the low-side expansion valve, and the evaporator. A low-end side refrigerant circuit, a high-end side compressor, a high-end side heat medium / refrigerant heat exchanger, a high-end side expansion valve, and a high-end side refrigerant circuit in which the refrigerant circulates in the order of the cascade heat exchanger, and heating A heat medium circuit that circulates the heat medium via the terminal, and the heat medium circuit includes a heat medium pump that circulates the heat medium, and the heat medium pump reduces the heat medium flowing out from the heating terminal. It is configured to pass through at least one of the former side heat medium / refrigerant heat exchanger and the higher side heat medium / refrigerant heat exchanger, and to send the passed heat medium to the heating terminal, The heat medium pump is arranged on the heat medium inlet side of the heating terminal. The heat medium circuit sucks the heat medium after passing through at least one of the low-source-side heat medium / refrigerant heat exchanger and the high-source-side heat medium / refrigerant heat exchanger into the heat medium pump. It is characterized by being discharged.

  In the heat pump-type heating device of the fifth aspect of the invention, the refrigerant circulates in the order of the low-side compressor, the low-side heat medium / refrigerant heat exchanger, the cascade heat exchanger, the low-side expansion valve, and the evaporator. A low-end side refrigerant circuit, a high-end side compressor, a high-end side heat medium / refrigerant heat exchanger, a high-end side expansion valve, and a high-end side refrigerant circuit in which the refrigerant circulates in the order of the cascade heat exchanger, and heating A heat medium circuit that circulates the heat medium via the terminal, and the heat medium circuit includes a heat medium pump that circulates the heat medium, and the heat medium pump reduces the heat medium flowing out from the heating terminal. It is configured to pass through at least one of the former side heat medium / refrigerant heat exchanger and the higher side heat medium / refrigerant heat exchanger, and to send the passed heat medium to the heating terminal, The heat medium circuit converts the heat medium that has flowed out of the heating terminal into the low heat medium. The refrigerant was divided into the refrigerant heat exchanger and the high-end side heat medium / refrigerant heat exchanger and passed through the low-end side heat medium / refrigerant heat exchanger and the divided heat medium and high-end side heat medium / refrigerant heat exchanger. After the diverted heat medium is merged, it is sent to the heating terminal, and the diverted flow adjustment that can adjust the diverted flow rate to the low heat source / refrigerant heat exchanger and the diverted flow rate to the high heat source / refrigerant heat exchanger It has a valve.

  In the heat pump heating device of the invention of claim 6, the refrigerant circulates in the order of the low-side compressor, the low-side heat medium / refrigerant heat exchanger, the cascade heat exchanger, the low-side expansion valve, and the evaporator. A low-end side refrigerant circuit, a high-end side compressor, a high-end side heat medium / refrigerant heat exchanger, a high-end side expansion valve, and a high-end side refrigerant circuit in which the refrigerant circulates in the order of the cascade heat exchanger, and heating A heat medium circuit that circulates the heat medium via the terminal, and the heat medium circuit includes a heat medium pump that circulates the heat medium, and the heat medium pump reduces the heat medium flowing out from the heating terminal. It is configured to pass through at least one of the former side heat medium / refrigerant heat exchanger and the higher side heat medium / refrigerant heat exchanger, and to send the passed heat medium to the heating terminal, The heat medium circuit is at the highest position in the heat medium circuit. Place in, characterized in that the relief valve is mounted.

  In the heat pump heating device of the first aspect of the invention, the refrigerant circulates in the order of the low-side compressor, the low-side heat medium / refrigerant heat exchanger, the cascade heat exchanger, the low-side expansion valve, and the evaporator. A low-end side refrigerant circuit, a high-end side compressor, a high-end side heat medium / refrigerant heat exchanger, a high-end side expansion valve, and a high-end side refrigerant circuit in which the refrigerant circulates in the order of the cascade heat exchanger, and heating A heat medium circuit that circulates the heat medium via the terminal, the heat medium circuit having a heat medium pump that circulates the heat medium, and the heat medium that has flowed out of the heating terminal by the heat medium pump. Can be switched between a state in which only one of the low-source-side heat medium / refrigerant heat exchanger and the high-source-side heat medium / refrigerant heat exchanger is passed, and a state in which both are passed. Is configured to send the heated heat medium to the heating terminal. Switching between a state in which the heat medium flowing out from the low-side heat medium / refrigerant heat exchanger and the high-side heat medium / refrigerant heat exchanger are allowed to pass through only one of them, Thus, an efficient and comfortable heating operation can be realized.

  According to the second aspect of the present invention, the low-side side in which the refrigerant circulates in the order of the low-side compressor, the low-side heat medium / refrigerant heat exchanger, the cascade heat exchanger, the low-side expansion valve, and the evaporator. Via the heating terminal, the refrigerant circuit, the high-side compressor, the high-side heat medium / refrigerant heat exchanger, the high-side expansion valve, and the cascade heat exchanger, in which the refrigerant circulates The heat medium circuit includes a heat medium circuit that circulates the heat medium, and the heat medium circuit includes a heat medium pump that circulates the heat medium. In a heat pump heating device configured to pass through at least one of a medium / refrigerant heat exchanger and a high-source side heat medium / refrigerant heat exchanger and to send the passed heat medium to a heating terminal, Main body case in which side compressor and high-end compressor are installed Since the low-side compressor and the high-side compressor are arranged at symmetrical positions in the lower part of the main body case, the low-side compressor and the high-side compressor that are heavy are installed. Proper placement makes it possible to stabilize the center of gravity of the body case.

  According to the invention of claim 3, the low-source side in which the refrigerant circulates in the order of the low-end compressor, the low-end heat medium / refrigerant heat exchanger, the cascade heat exchanger, the low-end expansion valve, and the evaporator. Via the heating terminal, the refrigerant circuit, the high-side compressor, the high-side heat medium / refrigerant heat exchanger, the high-side expansion valve, and the cascade heat exchanger, in which the refrigerant circulates The heat medium circuit includes a heat medium circuit that circulates the heat medium, and the heat medium circuit includes a heat medium pump that circulates the heat medium. In a heat pump heating apparatus configured to pass through at least one of a medium / refrigerant heat exchanger and a high-source side heat medium / refrigerant heat exchanger and to send the passed heat medium to a heating terminal, the heat medium The circuit transfers the heat medium that has flowed out of the heating terminal to the low heat source side. The refrigerant heat exchanger and the high-end side heat medium / refrigerant heat exchanger are diverted, and the diverted heat medium that has passed through the low-end side heat medium / refrigerant heat exchanger and the high-end side heat medium / refrigerant heat exchanger are passed through. Since the heat transfer medium is sent from the mixing tank to the heating terminal, the heat medium without temperature unevenness is sent to the heating terminal. It becomes possible to realize a comfortable heating effect.

  According to the invention of claim 4, the low-side side in which the refrigerant circulates in the order of the low-side compressor, the low-side heat medium / refrigerant heat exchanger, the cascade heat exchanger, the low-side expansion valve, and the evaporator. Via the heating terminal, the refrigerant circuit, the high-side compressor, the high-side heat medium / refrigerant heat exchanger, the high-side expansion valve, and the cascade heat exchanger, in which the refrigerant circulates The heat medium circuit includes a heat medium circuit that circulates the heat medium, and the heat medium circuit includes a heat medium pump that circulates the heat medium. In a heat pump heating apparatus configured to pass through at least one of a medium / refrigerant heat exchanger and a high-source side heat medium / refrigerant heat exchanger and to send the passed heat medium to a heating terminal, the heat medium Place the pump on the heating medium inlet side of the heating terminal, The heat medium after the passage has passed at least one of the low heat source / refrigerant heat exchanger and the high heat medium / refrigerant heat exchanger is sucked into the heat medium pump and discharged to the heating terminal. Since it did, it becomes possible to raise the discharge pressure of the heat medium to a heating terminal, and it becomes possible to improve the heating capability by a heating terminal.

  According to the invention of claim 5, the low-side side in which the refrigerant circulates in the order of the low-side compressor, the low-side heat medium / refrigerant heat exchanger, the cascade heat exchanger, the low-side expansion valve, and the evaporator. Via the heating terminal, the refrigerant circuit, the high-side compressor, the high-side heat medium / refrigerant heat exchanger, the high-side expansion valve, and the cascade heat exchanger, in which the refrigerant circulates The heat medium circuit includes a heat medium circuit that circulates the heat medium, and the heat medium circuit includes a heat medium pump that circulates the heat medium. In a heat pump heating apparatus configured to pass through at least one of a medium / refrigerant heat exchanger and a high-source side heat medium / refrigerant heat exchanger and to send the passed heat medium to a heating terminal, the heat medium The circuit transfers the heat medium that has flowed out of the heating terminal to the low heat source side. The refrigerant was divided into the refrigerant heat exchanger and the high-end side heat medium / refrigerant heat exchanger and passed through the low-end side heat medium / refrigerant heat exchanger and the divided heat medium and high-end side heat medium / refrigerant heat exchanger. After the diverted heat medium is merged, it is configured to be sent to the heating terminal, and the heat medium circuit has a diverted flow rate to the low heat source / refrigerant heat exchanger and the high heat source / refrigerant heat exchanger. Since the shunt flow control valve that can adjust the shunt flow rate is provided, the split flow control valve allows the distribution rate of the heat medium flowing through the low heat source / refrigerant heat exchanger and the high heat source / refrigerant heat exchanger to be adjusted. Can be adjusted. This makes it possible to realize a more efficient and comfortable heating operation.

  According to the sixth aspect of the present invention, the low-side compressor, the low-side heat medium / refrigerant heat exchanger, the cascade heat exchanger, the low-side expansion valve, and the evaporator are circulated in this order. Via the heating terminal, the refrigerant circuit, the high-side compressor, the high-side heat medium / refrigerant heat exchanger, the high-side expansion valve, and the cascade heat exchanger, in which the refrigerant circulates The heat medium circuit includes a heat medium circuit that circulates the heat medium, and the heat medium circuit includes a heat medium pump that circulates the heat medium. In a heat pump heating apparatus configured to pass through at least one of a medium / refrigerant heat exchanger and a high-source side heat medium / refrigerant heat exchanger and to send the passed heat medium to a heating terminal, the heat medium A relief valve is installed at the highest position in the circuit. Since Attach, escape of air generated in the heating medium circuit to the outside, it is possible to reliably remove. As a result, the heat medium can be smoothly circulated in the heat medium circuit.

It is a circuit diagram of the heat pump type heating device as one embodiment to which the present invention is applied. It is a schematic sectional drawing explaining the structure in the main body case of the heat pump type heating apparatus of FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
(1) Heat pump type heating device 1
The heat pump type heating device 1 of the embodiment uses a dual heat pump cycle, and as shown in FIG. 1, a low source side refrigerant circuit 10 through which a low temperature side refrigerant circulates and a high temperature side through which a high temperature side refrigerant circulates. The former side refrigerant circuit 20, the heat medium circuit 30 through which the heat medium circulates, and a control unit 40 that controls each component of the heat pump heating device 1 are provided.

In the embodiment, a CO ₂ (carbon dioxide) refrigerant is used as the refrigerant of the low-source side refrigerant circuit 10 and the refrigerant of the high-side refrigerant circuit 20, and an antifreeze liquid is used as the heat medium. However, the refrigerant is not limited to this, and a refrigerant other than the CO ₂ refrigerant may be used as the refrigerant in the low-side refrigerant circuit 10 and / or the refrigerant in the high-side refrigerant circuit 20. Moreover, water may be used as a heat medium. Further, the heating terminal 31 corresponds to a panel heater, a floor heating panel, or the like.

(2) Low-source side refrigerant circuit 10
The low-source side refrigerant circuit 10 has a refrigerant circulation path 11 through which low-side refrigerant circulates. A low-side compressor 12, a low-side heat medium / refrigerant heat exchanger 13, a cascade heat exchanger 14, a low-side expansion valve 15, and an evaporator 16 are connected to the refrigerant circuit 11 in this order. Has been. In the low-side refrigerant circuit 10, the refrigerant is supplied from the low-side compressor 12, the low-side heat medium / refrigerant heat exchanger 13, the cascade heat exchanger 14, the low-side expansion valve 15, and the evaporator 16. A heat pump cycle is performed by cycling in sequence.

  That is, the low-side refrigerant is compressed by the low-side compressor 12 to be in a high-temperature and high-pressure state, and exchanges heat with the heat medium circulating in the heat medium circuit 30 in the low-side heat medium / refrigerant heat exchanger 13. Thereafter, the cascade heat exchanger 14 exchanges heat with the high-side refrigerant circulating in the high-side refrigerant circuit 20. Next, the low-side refrigerant is expanded by the low-side expansion valve 15 to become a low-temperature and low-pressure state, absorbs heat from the outside air in the evaporator 16 and evaporates, and then enters the low-side compressor 12. Will be supplied again.

  Here, in the low-side refrigerant circuit 10 of the embodiment, the refrigerant that flows between the cascade heat exchanger 14 and the low-side expansion valve 15, and the refrigerant that flows between the evaporator 16 and the low-side compressor 12. And an internal heat exchanger 17 for exchanging heat with each other. Thereby, the temperature of the refrigerant | coolant supplied to the low original side compressor 12 can be raised, the increase in the compression ratio of the low original side compressor 12 and the fall of COP (coefficient of performance) accompanying this are suppressed. The An accumulator (gas-liquid separator) 18 is provided on the refrigerant inlet side of the low-side compressor 12, and a fan 19 for blowing air is provided on the evaporator 16.

(3) Higher-side refrigerant circuit 20
The high-side refrigerant circuit 20 has a refrigerant circulation path 21 through which high-side refrigerant circulates. The refrigerant circulation path 21 is connected to a high-side compressor 22, a high-side heat medium / refrigerant heat exchanger 23, a high-side expansion valve 24, and a cascade heat exchanger 14 in this order. In the high-side refrigerant circuit 20, the refrigerant circulates in the order of the high-side compressor 22, the high-side heat medium / refrigerant heat exchanger 23, the high-side expansion valve 24, and the cascade heat exchanger 14. A heat pump cycle is performed.

  That is, the high-side refrigerant is compressed by the high-side compressor 22 into a high-temperature and high-pressure state, and the heat medium and heat circulating in the heat exchanger circuit 30 in the high-side heat medium / refrigerant heat exchanger 23 are heated. Exchange. Next, the refrigerant is expanded by the high-side expansion valve 24 to become a low-temperature and low-pressure state, absorbs heat from the low-side refrigerant circulating in the low-side refrigerant circuit 10 in the cascade heat exchanger 14, and evaporates. The high-end compressor 22 is supplied again. Similar to the low-side refrigerant circuit 10, an accumulator (gas-liquid separator) 25 is provided on the refrigerant inlet side of the high-side compressor 22.

(4) Heat medium circuit 30
The heat medium circuit 30 includes a heat medium circulation path 32 that circulates the heat medium via the heating terminal 31. In the heat medium circulation path 32, a heat medium pump 33 for sending the heat medium to the heating terminal 31 is provided on the heat medium inlet side of the heating terminal 31, and on the heat medium outlet side of the heating terminal 31, A flow rate adjustment valve 34 capable of adjusting the flow rate of the heat medium flowing out from the heating terminal 31 is provided.

  In the heat medium circuit 30, the heat medium pump 33 sucks the heat medium from a mixing tank 36 described later and discharges the heat medium to the heating terminal 31, whereby the heat medium circulates through the heating terminal 31 and the circulation pump 33. The circulation flow rate of the heat medium is adjusted according to the rotation speed and / or the opening degree of the flow rate adjustment valve 34. Thus, since the heat medium pump 33 sucks the heat medium from the mixing tank 36 and discharges it to the heating terminal 31, the discharge pressure of the heat medium to the heating terminal 31 can be increased. The heating capability by the terminal 31 can be improved.

  Here, the heat medium sent out to the heating terminal 31 by the heat medium pump 33 is referred to as “outward heat medium”, and the heat medium flowing out through the heating terminal 31 is referred to as “return heat medium”. In the embodiment, it is assumed that the flow rate adjustment valve 34 is fully open in normal times.

  Further, the heat medium circulation path 32 is branched into two flow paths (a low flow path 32a and a high flow path 32b) on the downstream side of the flow rate adjustment valve 34 in the direction in which the return heat flow flows. The return heat medium that has passed through the flow rate adjustment valve 34 is used as the low heat source / refrigerant heat exchanger 13 of the low heat medium side refrigerant circuit 10 and the high heat source / refrigerant heat exchanger 23 of the high heat medium side refrigerant circuit 20. It is comprised so that it can be shunted.

  In the embodiment, a branch point where the heat medium circulation path 32 branches into the low-source side flow path 23a and the high-source side flow path 23b, that is, the return heat medium diverting portion that has passed through the flow rate adjusting valve 34, Depending on the opening, the flow rate of the diverted flow to the low-source side flow path 32a (ie, the low-source side heat medium / refrigerant heat exchanger 13) and the high-source side flow path 32b (ie, the high-source side heat medium / refrigerant heat) A three-way valve 35 is provided as a diversion control valve capable of adjusting the diversion flow rate to the exchanger 23).

  The low-source side flow path 32a and the high-source side flow path 32b are each connected to a mixing tank 36 disposed on the heat medium suction side of the heat medium pump 33, and the mixing tank 36 and the heat medium pump 33 are one. Are connected by a flow path 32c. Therefore, the flow is divided into the low flow channel 32a and divided into the high flow channel 32b after the heat is exchanged with the low flow medium / refrigerant heat exchanger 13 in the low flow solution / refrigerant heat exchanger 13. The separated heat medium having been heat-exchanged with the high-side refrigerant in the high-side heat medium / refrigerant heat exchanger 23 is merged in the mixing tank 36 and is sucked in by the heat medium pump 33 after the merge. 31 is discharged.

  In this way, the shunt heat medium after heat exchange with the low-side refrigerant in the low-side heat medium / refrigerant heat exchanger 13, and the high-side refrigerant in the high-side heat medium / refrigerant heat exchanger 23 The divided heat medium after the heat exchange is merged in the mixing tank 36, and the heat medium is sent from the mixing tank 36 to the heating terminal 31 by the heat medium pump 33. It becomes possible to send out to a room, and a comfortable heating effect can be realized.

  In the embodiment, the two divided heat mediums are merged in the mixing tank 36, but are merged before the mixing tank 36, that is, before reaching the mixing tank 36, and flow into the mixing tank 36 after the merge. It may be configured.

(5) Main body case 60
FIG. 2 shows an outline of the internal configuration of the main body case 60 of the heat pump heating device 1. The interior of the main body case 60 is partitioned up and down by a first partition wall 61, and the chamber above the first partition wall 61 is partitioned from side to side by a second partition wall 62. Thus, in the main body case 60, the first machine chamber 63 positioned at the lowermost part of the main body case 60 below the first partition wall 61 and the left side (above the second partition wall 62) A second machine chamber 64 located on one side and a third machine chamber 66 located on the right side (the other side) above the second partition wall 62 are configured.

  The high-side compressor 22 of the high-side refrigerant circuit 20 is installed at the left end (one side end) toward the inside of the first machine chamber 63, and the low-side refrigerant circuit 10 has a low-side compressor. The side compressor 12 is installed at the right end (the other end) toward the inside of the first machine chamber 63. Further, the high-source-side heat medium / refrigerant heat exchanger 23 of the high-source-side refrigerant circuit 20 is installed on the left side (one side of the central portion) toward the central portion in the first machine chamber 63, and the low-source-side refrigerant circuit Ten low-side heat medium / refrigerant heat exchangers 13 are installed on the right side (one side of the central part) toward the central part in the first machine chamber 63. The high-side compressor 22 and the low-side compressor 12 are disposed at symmetrical positions in the first machine chamber 63 of the main body case 60, and the high-side heat medium / refrigerant heat exchanger 23. The low heat source side / refrigerant heat exchanger 13 is also disposed in a symmetrical position in the first machine chamber 63 of the main body case 60.

  Thus, the center of gravity of the main body case 60 can be stabilized by appropriately arranging the heavy low-side compressor 12 and the high high-side compressor 13 at the lower left and right symmetrical positions in the main body case 60. Will be able to. The three-way valve 35 is also accommodated in the first machine chamber 63. Further, the evaporator 16 and the fan 19 for blowing are installed in the second machine room 64. Further, the mixing tank 36 and the heat medium pump 33 are accommodated in the third machine chamber 66. In this case, the mixing tank 36 is disposed at a higher position than the circulation pump 33, and thus the mixing tank 36 is heated. The medium circuit 30 is disposed at the highest position.

  Here, a relief valve 59 is attached to the upper end portion of the mixing tank 36, that is, the highest position in the heat medium circuit 30 so as to communicate with the inside of the mixing tank 36 (in the heat medium circuit 30). . In the case of the embodiment, the relief valve 59 is an automatic air vent valve. Thus, since the relief valve 59 is attached to the highest position in the heat medium circuit 30, the air generated in the heat medium circuit 30 is escaped to the outside from the valve 59 and can be reliably removed. It becomes like this. As a result, the heat medium can be smoothly circulated in the heat medium circuit 30 by the heat medium pump 33.

(6) Control unit 40
Next, output signals of various sensors are input to the control unit 40, and the control unit 40, based on the output signals of these various sensors, each component of the heat pump heating device 1, specifically, The low original side compressor 12 and the low original side expansion valve 15 of the low original side refrigerant circuit 10, the high original side compressor 22 of the high original side refrigerant circuit 20, the high original side expansion valve 24, and the heat medium circuit 30. The heat medium pump 33, the flow rate adjusting valve 34, and the three-way valve 35 are controlled.

  In the embodiment, the various sensors include an outside air temperature sensor 51 that detects the outside air temperature, a low-side discharge temperature sensor 52 that detects the discharge temperature of the low-side compressor 12, and a discharge temperature of the high-side compressor 22. The high-end side discharge temperature sensor 53 for detecting the low-end side heat medium / refrigerant heat exchanger 13, the low-end side heat medium temperature sensor 54 for detecting the temperature of the heat medium that has passed through the low-end side heat medium / refrigerant heat exchanger 13, and the high-end side heat medium / refrigerant heat exchange. The high-side heat medium temperature sensor 55 that detects the temperature of the heat medium that has passed through the vessel 23, the forward heat medium temperature sensor 56 that detects the temperature of the forward heat medium, and the return heat medium temperature sensor 57 that detects the temperature of the return heat medium. A rotation sensor 58 that detects the number of rotations of the heat medium pump 33 is provided.

  The control unit 40 is low so that, for example, the evaporation temperature of the refrigerant in the high-side refrigerant circuit 20 is higher than the evaporation temperature of the refrigerant in the low-side refrigerant circuit 10, and the heat pump heating device 1 achieves good COP. The number of revolutions of the former compressor 12 and / or the higher compressor 22 is controlled.

  The control unit 40 opens the low-side expansion valve 15 and / or the high-side expansion valve 24 in accordance with the rotational speed control of the low-side compressor 12 and / or the high-side compressor 22. The degree may be controlled.

  Further, the control unit 40 controls the opening degree of the three-way valve 35 according to the heating load and the variation thereof, and the return heat medium that has passed through the flow rate adjusting valve 34 is connected to the low-source side flow path 32a in the heat medium circuit 30 and the high flow rate. While flowing through both of the original flow paths 32b, the flow rate of the heat medium to the low flow path 32a and the flow volume of the heat medium to the high flow path 32b are adjusted. Such adjustment includes a case in which all of the return heat medium that has passed through the flow rate adjustment valve 34 is allowed to flow through only one of the low-source channel 32a and the high-source channel 32b.

  In this way, the low-side heat medium / refrigerant heat exchanger 13 and the high-side heat medium that cause both the low-side refrigerant circuit 10 and the high-side refrigerant circuit 20 to exchange heat between the heat medium of the heat medium circuit 30 and the refrigerant. / Refrigerant heat exchanger 23 is provided, and the heat medium flowing out from heating terminal 31 is only one of low-source-side heat medium / refrigerant heat exchanger 13 and high-source-side heat medium / refrigerant heat exchanger 23. Since it is possible to switch between the state of passing through and the state of passing through both, an efficient and comfortable heating operation can be realized.

  In this case, the control unit 40 controls the three-way valve 35 in accordance with the heating load and the variation thereof, so that the heat medium partial flow rate to the low-source-side heat medium / refrigerant heat exchanger 13 and the high-source-side heat are controlled. Since the heat medium flow rate to the medium / refrigerant heat exchanger 23 is adjusted, the distribution ratio of the heat medium to each of the heat medium / refrigerant heat exchangers 13 and 23 can be adjusted more appropriately. Thus, the heat pump heating device 1 can be operated more efficiently and comfortable heating can be realized.

  It should be noted that the heating load and its fluctuation are the target outgoing heat medium temperature (target hot water temperature) set based on the operation command of the heat pump heating device 1 by the user, the output value of the outside air temperature sensor 51, the low source It can be calculated based on the output value of the side heat medium temperature sensor 54, the output value of the high-source side heat medium temperature sensor 55, the output value of the forward heat medium temperature sensor 56, the output value of the return heat medium temperature sensor 57, and the like. .

  Further, the control unit 40 determines the rotational speed of the heat medium pump 33 of the heat medium circuit 30 based on the target forward heat medium temperature and the output value of the forward heat medium temperature sensor 56 (actual forward heat medium temperature). Control. For example, when the actual forward heat medium temperature is lower than the target forward heat medium temperature and the difference is larger than a predetermined value, the control unit 40 reduces the rotational speed of the heat medium pump 33 to reduce the heat in the heat medium circuit 30. The medium circulation flow rate is decreased, and the outgoing heat medium temperature is rapidly increased to the target outgoing heat medium temperature.

  Furthermore, although the above has been described in the preferred embodiment of the present invention, the present invention is not limited to the above-described embodiment, and further modifications and the like can be made based on the technical idea of the present invention. Not too long.

  For example, in the above-described embodiment, the three-way valve 35 is configured with the flow dividing control valve that adjusts the flow dividing flow rate of the heat medium to the low flow channel 32a and the high flow channel 32b. A flow rate adjusting valve capable of adjusting the diversion flow rate may be provided in both the path 32a and the high-end side flow channel 32b to form a diversion control valve. Furthermore, although the low-source-side refrigerant circuit 10 shown in the embodiment includes the internal heat exchanger 17, this may be omitted.

DESCRIPTION OF SYMBOLS 1 Heat pump type heating apparatus 10 Low low side refrigerant circuit 12 Low low side compressor 13 Low low side heat medium / refrigerant heat exchanger 14 Cascade heat exchanger 15 Low high side expansion valve 16 Evaporator 20 High high side refrigerant circuit 22 High Original compressor 23 High original heat medium / refrigerant heat exchanger 24 High original expansion valve 30 Heat medium circuit 31 Heating terminal 32a Low original flow path 32b High original flow path 33 Heat medium pump 35 Three-way valve (Branch control) valve)
36 Mixing tank 40 Control unit 59 Relief valve 60 Body case 63 First machine room 64 Second machine room 66 Third machine room

Claims (6)

A low-source side refrigerant circuit in which the refrigerant circulates in the order of a low-source side compressor, a low-side heat medium / refrigerant heat exchanger, a cascade heat exchanger, a low-side expansion valve, and an evaporator;
A high-end side refrigerant circuit in which refrigerant is circulated in the order of a high-end side compressor, a high-end side heat medium / refrigerant heat exchanger, a high-end side expansion valve, and the cascade heat exchanger;
A heat medium circuit in which the heat medium circulates via the heating terminal,
The heat medium circuit includes a heat medium pump that circulates the heat medium, and the heat medium pump causes the heat medium that has flowed out of the heating terminal to flow through the low-source side heat medium / refrigerant heat exchanger and the high-source circuit. It is possible to switch between a state of passing through only one of the side heat medium / refrigerant heat exchanger and a state of passing through both, and the passed heat medium is sent out to the heating terminal. Heat pump heating system. A low-source side refrigerant circuit in which the refrigerant circulates in the order of a low-source side compressor, a low-side heat medium / refrigerant heat exchanger, a cascade heat exchanger, a low-side expansion valve, and an evaporator;
A high-end side refrigerant circuit in which refrigerant is circulated in the order of a high-end side compressor, a high-end side heat medium / refrigerant heat exchanger, a high-end side expansion valve, and the cascade heat exchanger;
A heat medium circuit in which the heat medium circulates via the heating terminal,
The heat medium circuit includes a heat medium pump that circulates the heat medium, and the heat medium pump causes the heat medium that has flowed out of the heating terminal to flow through the low-source side heat medium / refrigerant heat exchanger and the high-source circuit. In the heat pump heating device configured to pass through at least one of the side heat medium / refrigerant heat exchanger and to send the passed heat medium to the heating terminal,
The low-side compressor, and a main body case on which the high-side compressor is installed,
The heat pump heating device, wherein the low-side compressor and the high-side compressor are arranged at symmetrical positions in the lower part of the main body case. A low-source side refrigerant circuit in which the refrigerant circulates in the order of a low-source side compressor, a low-side heat medium / refrigerant heat exchanger, a cascade heat exchanger, a low-side expansion valve, and an evaporator;
A high-end side refrigerant circuit in which refrigerant is circulated in the order of a high-end side compressor, a high-end side heat medium / refrigerant heat exchanger, a high-end side expansion valve, and the cascade heat exchanger;
A heat medium circuit in which the heat medium circulates via the heating terminal,
The heat medium circuit includes a heat medium pump that circulates the heat medium, and the heat medium pump causes the heat medium that has flowed out of the heating terminal to flow through the low heat source / refrigerant heat exchanger and the high heat In the heat pump heating device configured to pass through at least one of the side heat medium / refrigerant heat exchanger and to send the passed heat medium to the heating terminal,
The heat medium circuit divides the heat medium flowing out from the heating terminal into the low-source-side heat medium / refrigerant heat exchanger and the high-source-side heat medium / refrigerant heat exchanger, and the low-source-side heat medium A mixing tank in which the divided heat medium that has passed through the refrigerant heat exchanger and the divided heat medium that has passed through the high-source side heat medium / refrigerant heat exchanger merge or flow in after being merged, from the mixing tank A heat pump type heating apparatus, wherein a heat medium is sent to the heating terminal. A low-source side refrigerant circuit in which the refrigerant circulates in the order of a low-source side compressor, a low-side heat medium / refrigerant heat exchanger, a cascade heat exchanger, a low-side expansion valve, and an evaporator;
A high-end side refrigerant circuit in which refrigerant is circulated in the order of a high-end side compressor, a high-end side heat medium / refrigerant heat exchanger, a high-end side expansion valve, and the cascade heat exchanger;
A heat medium circuit in which the heat medium circulates via the heating terminal,
The heat medium circuit includes a heat medium pump that circulates the heat medium, and the heat medium pump causes the heat medium that has flowed out of the heating terminal to flow through the low heat source / refrigerant heat exchanger and the high heat In the heat pump heating device configured to pass through at least one of the side heat medium / refrigerant heat exchanger and to send the passed heat medium to the heating terminal,
The heat medium pump is disposed on a heat medium inlet side of the heating terminal, and the heat medium circuit includes the low-source-side heat medium / refrigerant heat exchanger and the high-source-side heat medium / refrigerant heat exchange. A heat pump heating apparatus, wherein the heat medium after passing through at least one of the units is sucked into the heat medium pump and discharged to the heating terminal. A low-source side refrigerant circuit in which the refrigerant circulates in the order of a low-source side compressor, a low-side heat medium / refrigerant heat exchanger, a cascade heat exchanger, a low-side expansion valve, and an evaporator;
A high-end side refrigerant circuit in which refrigerant is circulated in the order of a high-end side compressor, a high-end side heat medium / refrigerant heat exchanger, a high-end side expansion valve, and the cascade heat exchanger;
A heat medium circuit in which the heat medium circulates via the heating terminal,
The heat medium circuit includes a heat medium pump that circulates the heat medium, and the heat medium pump causes the heat medium that has flowed out of the heating terminal to flow through the low heat source / refrigerant heat exchanger and the high heat In the heat pump heating device configured to pass through at least one of the side heat medium / refrigerant heat exchanger and to send the passed heat medium to the heating terminal,
The heat medium circuit divides the heat medium flowing out from the heating terminal into the low-source-side heat medium / refrigerant heat exchanger and the high-source-side heat medium / refrigerant heat exchanger, The diverted heat medium that has passed through the refrigerant heat exchanger and the diverted heat medium that has passed through the high-source side heat medium / refrigerant heat exchanger are merged and then sent to the heating terminal and the low-source side heat medium / refrigerant heat A heat pump heating device comprising a diversion control valve capable of adjusting a diversion flow rate to the exchanger and a diversion flow rate to the high-source side heat medium / refrigerant heat exchanger. A low-source side refrigerant circuit in which the refrigerant circulates in the order of a low-source side compressor, a low-side heat medium / refrigerant heat exchanger, a cascade heat exchanger, a low-side expansion valve, and an evaporator;
A high-end side refrigerant circuit in which refrigerant is circulated in the order of a high-end side compressor, a high-end side heat medium / refrigerant heat exchanger, a high-end side expansion valve, and the cascade heat exchanger;
A heat medium circuit in which the heat medium circulates via the heating terminal,
The heat medium circuit includes a heat medium pump that circulates the heat medium, and the heat medium pump causes the heat medium that has flowed out of the heating terminal to flow through the low-source side heat medium / refrigerant heat exchanger and the high-source circuit. In the heat pump heating device configured to pass through at least one of the side heat medium / refrigerant heat exchanger and to send the passed heat medium to the heating terminal,
A heat pump heating apparatus, wherein the heat medium circuit is provided with a relief valve at the highest position in the heat medium circuit.

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