JP2017168791A - Electronic component mounting machine and production line - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a production line comprising: an electronic component mounting machine and a plurality of electronic component mounting machine which are capable of recognizing an operation status in mounting electronic components at a low cost.SOLUTION: An electronic component mounting machine (1) comprises: imaging devices (5,7) which image an electronic component (Ep) or a substrate (K); light irradiation devices (6, 8) which are capable of irradiating electronic component (Ep) or substrate (K) with light in imaging the electronic component (Ep) or the substrate (K) by the imaging devices (5, 7); and a control device (9) which controls a mounting action of the electronic component (Ep) to the substrate (K) based on an imaging result of the imaging devices (5, 7). Then, the control device (9) allows the light irradiation devices (6, 8) to generate light corresponding to an operation status of the electronic component mounting machine (1) at a given time other than a time when the electronic component (Ep) or the substrate (K) is imaged by the imaging devices (5, 7).SELECTED DRAWING: Figure 5

Description

  The present invention relates to an electronic component mounting machine for mounting electronic components and a production line including a plurality of electronic component mounting machines.

  Patent Document 1 has a configuration in which when a plurality of machines arranged in a factory have an abnormality, a local lighting device provided on the ceiling corresponding to each machine is lit to ensure illuminance for work. It is disclosed. Further, Patent Document 2 discloses a configuration in which the color of illumination light is changed or the illumination light is blinked in a machine tool having an illumination device that illuminates a machining area inside the machine tool in accordance with the operation status of the machine tool. ing.

JP-A-6-275383 JP 2013-193141 A

  In patent document 1, it is necessary to provide a local lighting device in each machine arrange | positioned in a factory, and it exists in the tendency for each cost, such as installation of a local lighting device, maintenance, and power consumption, to increase. On the other hand, since the machine tool described in Patent Document 2 uses the illumination device originally provided, the installation cost can be suppressed. However, in the electronic component mounting machine, an illumination device for illuminating the inside of the electronic component mounting machine is not provided because it hinders image recognition of the electronic component mounting device. It is necessary to provide an indicator light outside the machine. For this reason, in an electronic component mounting machine, each cost, such as installation of an indicator lamp, maintenance, and power consumption, tends to increase.

  The present invention has been made in view of the above-described problems of the background art, and includes an electronic component mounting machine and a plurality of electronic component mounting machines capable of recognizing the operation status when mounting electronic components at low cost. Provide production line.

  An electronic component mounting machine according to the present invention for solving the above-described problems is to collect an electronic component supplied to a component supply position, transfer the collected electronic component to a substrate transferred to a substrate transfer position, and transfer the transferred electronic component An electronic component mounting machine that mounts the electronic component on the substrate, an imaging device that images the electronic component or the substrate, and light that is applied to the electronic component or the substrate when the electronic component or the substrate is imaged by the imaging device A light irradiating device capable of irradiating, and a control device for controlling the mounting operation of the electronic component on the substrate based on an imaging result of the imaging device, wherein the control device includes the electronic component by the imaging device or Except when the substrate is imaged, the light irradiation device generates light according to the operating status of the electronic component mounting machine.

  According to this, since the change of irradiation light is performed except when imaging an electronic component or a board | substrate, it does not become a hindrance at the time of image recognition of an electronic component or a board | substrate. And since generation | occurrence | production of irradiation light is performed with the light irradiation apparatus with which it is originally provided, the recognition of the operation condition at the time of mounting | wearing the electronic component in an electronic component mounting machine is attained at low cost.

  The production line of the present invention that solves the above problems collects electronic components supplied to a component supply position, transfers the collected electronic components to a substrate transferred to a substrate transfer position, and transfers the transferred electronic components to the substrate transfer position. A production line including a plurality of electronic component mounting machines to be mounted on a board, provided in a number smaller than the number of the electronic component mounting machines constituting the production line, and the electronic component mounting machine constituting the production line On the other hand, a line light irradiation device that irradiates light according to the operating status of the electronic component mounting machine is provided.

  According to this, since it is not necessary to provide a light irradiation device for each electronic component mounting machine, it is possible to recognize the operation status when mounting the electronic component in the electronic component mounting machine at a low cost.

It is a top view which shows the whole structure of the electronic component mounting machine of embodiment. It is a figure which shows schematic structure of a component imaging device and a 1st light irradiation apparatus. It is a figure which shows schematic structure of a board | substrate imaging device and a 2nd light irradiation apparatus. It is a flowchart for demonstrating the component mounting operation | movement of a control apparatus. It is a flowchart for demonstrating the operation condition monitoring operation | movement of a control apparatus. It is a figure which shows the whole structure of a production line provided with two or more electronic component mounting machines of embodiment. It is a flowchart for demonstrating the operation condition monitoring operation | movement of a host control apparatus. It is a figure which shows the whole structure of another form of a production line. It is a flowchart for demonstrating the operation condition monitoring operation | movement of the host control apparatus of another form. FIG. 10 is a flowchart continued from FIG. 9 for explaining an operation status monitoring operation of the host control apparatus according to another embodiment. FIG.

<1. First embodiment>
(1-1. Overall configuration of electronic component mounting machine)
An overall configuration of an electronic component mounting machine according to an embodiment of the present invention will be described. As shown in FIG. 1, the electronic component mounting machine 1 includes a substrate transport device 2, a plurality of tape feeders 3, a component transfer device 4, a component imaging device 5, a first light irradiation device 6, a substrate imaging device 7, and a second. A light irradiation device 8 and a control device 9 are provided. The transport direction of the substrate K is the X-axis direction, the direction perpendicular to the X-axis direction in the horizontal plane is the Y-axis direction, and the direction perpendicular to the X-axis direction and the Y-axis direction is the Z-axis direction.

  The substrate transfer device 2 includes first and second guide rails 21 and 22, a pair of conveyor belts (not shown), a clamp device 23, and the like. The first and second guide rails 21, 22 extend in the X-axis direction across the center of the upper surface of the mounting machine body 10 and are assembled to the mounting machine body 10 in parallel with each other. A pair of endless annular conveyor belts are juxtaposed inside the first and second guide rails 21 and 22 facing each other.

  The pair of conveyor belts rotate in a state where both edges of the substrate K are placed on the conveyor conveyance surface, and carry the substrate K into and out of the substrate conveyance position Pk set at the center of the mounting machine body 10. . A clamp device 23 is provided below the conveyor belt at the substrate transfer position Pk. The clamp device 23 pushes up the substrate K and clamps it in a horizontal posture, and positions the substrate K at the substrate transport position Pk.

  The tape feeder 3 includes a flat feeder main body 31 having a small width direction dimension, a supply reel 32 attached to the rear portion of the feeder main body 31, and the like. The plurality of tape feeders 3 are loaded side by side in the X-axis direction on the upper surface of the pallet member 11 on the mounting machine body 10. Each supply reel 32 is wound and held with a carrier tape T for storing electronic components Ep (see FIG. 2) side by side. Each tape feeder 3 intermittently feeds the carrier tape T and sequentially supplies the electronic components Ep to the component supply position Pp provided in the upper part near the front end of the feeder main body 31.

  The component transfer device 4 is an XY robot type device that can move horizontally in the X-axis direction and the Y-axis direction. The component transfer device 4 includes a pair of Y-axis rails 41 and 42, a Y-axis slider 43, an X-axis slider 44, a mounting head 45, and the like. The pair of Y-axis rails 41 and 42 are arranged near both side surfaces of the mounting machine body 10 in the X-axis direction and extend in the Y-axis direction. On the Y-axis rails 41 and 42, a Y-axis slider 43 is mounted so as to be movable in the Y-axis direction by a ball screw mechanism.

  The X-axis slider 44 is mounted on the Y-axis slider 43 so as to be movable in the X-axis direction by a ball screw mechanism. The mounting head 45 is held by the X-axis slider 44 so as to be replaceable. The mounting head 45 includes a suction nozzle 46 that sucks and mounts the electronic component Ep on the substrate K. The component transfer device 4 sucks the electronic component Ep from each component supply position Pp of the plurality of tape feeders 3, and transfers and mounts the sucked electronic component Ep to the substrate K positioned at the substrate transport position Pk.

  As shown in FIGS. 1 and 2, the component imaging device 5 is a camera including a CCD image sensor, for example. The component imaging device 5 is provided on the upper surface of the mounting machine body 10 between the substrate transport device 2 and the tape feeder 3 so that the lens unit 51 faces upward. The controller 9 captures an image of the electronic component Ep with the component imaging device 5 while the mounting head 45 moves from the tape feeder 3 onto the substrate K in order to recognize the state of the electronic component Ep attracted by the suction nozzle 46. .

  The 1st light irradiation apparatus 6 is provided with LED61 of the three primary colors of light, for example. The LED 61 can emit and blink in a plurality of colors, and is provided on the inner peripheral surface of an inverted conical holder 62 attached to the outer periphery of the lens unit 51 of the component imaging device 5. The first light irradiation device 6 irradiates the electronic component Ep attracted by the suction nozzle 46 with light Le, and causes the light Le reflected by the electronic component Ep to enter the component imaging device 5.

  As illustrated in FIGS. 1 and 3, the board imaging device 7 is a camera including a CCD image sensor, for example. The board imaging device 7 is provided on the X-axis slider 44 along with the mounting head 45 so that the lens unit 71 faces downward. The control device 9 images the fiducial mark M attached to the substrate K with the substrate imaging device 7 in order to detect the accurate position of the substrate K.

  The 2nd light irradiation apparatus 8 is provided with LED81 of the three primary colors of light, for example. The LED 81 can emit and blink in a plurality of colors, and is provided on the inner peripheral surface of a conical holder 82 attached to the outer periphery of the lens unit 71 of the board imaging device 7. The second light irradiation device 8 irradiates the fiducial mark M attached to the substrate K with light Lm, and causes the light Lm reflected by the fiducial mark M to enter the substrate imaging device 7.

  The control device 9 stores the type and order of the electronic components Ep to be mounted on the substrate K, the mounting sequence instructed by the tape feeder 3 for supplying the electronic components Ep, and the like. Then, the control device 9 controls the component mounting operation according to the mounting sequence based on the imaging data of the component imaging device 5 and the board imaging device 7, the detection data of a sensor (not shown), and the like. The control device 9 sequentially collects and updates operation status data such as the number of substrates K that have been produced, the mounting time required for mounting the electronic component Ep, and the number of occurrences of suction errors of the electronic component Ep.

  In addition, the control device 9 monitors the operation status of the electronic component mounting machine 1 during component mounting, and applies one or both irradiation lights Le and Lm of the first light irradiation device 6 and the second light irradiation device 8 to the electronic component mounting. It is generated according to the operating status of the machine 1. The irradiation lights Le and Lm are generated except when the first light irradiation device 6 irradiates the electronic component Ep with the light Le and images the electronic component Ep with the component imaging device 5 and with the second light irradiation device 8. This is performed during the component mounting operation other than when the fiducial mark M of K is irradiated with the light Lm and the board imaging device 7 images the fiducial mark M.

  This is because the component imaging device 5 images the state of the electronic component Ep sucked by the suction nozzle 46, but it is necessary to change the color of the irradiation light Le of the first light irradiation device 6 depending on the type of the electronic component Ep. This is because if the irradiation lights Le and Lm are generated during the imaging, the state of the electronic component Ep attracted by the suction nozzle 46 may be mistaken. This is because the substrate imaging device 7 may misidentify the fiducial mark M if the irradiation lights Le and Lm are generated during imaging for the same reason.

  As the generation of the irradiation lights Le and Lm, for example, light is emitted in green during normal operation or is turned off, light is emitted in yellow during operation in a warning state, and light is emitted in red during an error state. In addition, as the generation of other irradiation lights Le and Lm, for example, the light is always emitted or turned off in any color during normal operation, and the period of a relatively long interval in any color during operation in a warning state. Blinks at an error state, and blinks in an arbitrary color at a relatively short interval.

  Here, an example of the warning state is, for example, when the component tape has run out and the electronic component Ep cannot be picked up by the suction nozzle 46. That is, it means a state in which no defective board is generated even if the operation of the electronic component mounting machine 1 (component mounting operation) is continued. An example of the error state is when the posture of the electronic component Ep picked up by the suction nozzle 46 cannot be corrected. That is, it means a state in which a defective board is generated when the operation (component mounting operation) of the electronic component mounting machine 1 is continued.

(1-2. Operation of control device)
Next, the component mounting operation and operation status monitoring operation of the control device 9 will be described with reference to the flowcharts of FIGS. It is assumed that a predetermined supply reel 32 is already set in the tape feeder 3 by the operator. Further, the substrate K is already loaded and positioned and fixed at the substrate transfer position Pk of the substrate transfer device 2, and the fiducial mark M attached to the substrate K is imaged by the substrate imaging device 7, so that the substrate K is accurately detected. Assume that the position has been detected. In addition, the irradiation light Le of the first light irradiation device 6 is generated according to the operation status of the electronic component mounting machine 1, and the first light irradiation device 6 emits green light during normal operation and is in a warning state. It is assumed that it emits yellow light during the operation of, and emits red light when stopped in an error state.

  First, the component mounting operation will be described. The control device 9 drives and controls the tape feeder 3 to feed the carrier tape T from the supply reel 32 (step S1 in FIG. 4), and supplies the electronic component Ep stored in the carrier tape T to the component supply position Pp ( Step S2 in FIG. The control device 9 drives and controls the component transfer device 4 to position the suction nozzle 46 above the component supply position Pp (step S3 in FIG. 4), and lowers the suction nozzle 46 to suck the electronic component Ep. Collect (step S4 in FIG. 4).

  Then, the control device 9 transfers the suction nozzle 46 that sucks and collects the electronic component Ep onto the component imaging device 5 (step S5 in FIG. 4), images the electronic component Ep with the component imaging device 5, and performs image processing. Then, the state of the electronic component Ep is recognized (step S6 in FIG. 4). Then, if there is no problem with the state of the electronic component Ep, the control device 9 moves the suction nozzle 46 that sucks and collects the electronic component Ep onto the substrate K (step S7 in FIG. 4), and lowers the suction nozzle 46 to perform the electronic operation. The component Ep is mounted at the component mounting position on the substrate K (step S8 in FIG. 6). Then, the control device 9 determines whether or not the component mounting on the board K is completed (step S9 in FIG. 6). If the component mounting on the board K is not completed, the control device 9 returns to step S1 and performs the above-described processing. When the component mounting on the board K is completed, the process is terminated.

  Next, the operation status monitoring operation will be described. The operation status monitoring operation is executed during the component mounting operation. The control device 9 determines whether or not the operation of the electronic component mounting machine 1 is normal (step S11 in FIG. 5), and when determining that the operation of the electronic component mounting machine 1 is normal, the first light The irradiation device 6 emits green light (step S12 in FIG. 5). Thereby, the operator can visually recognize the green light through the window for internal confirmation provided in the electronic component mounting machine 1, and can determine that the operation of the electronic component mounting machine 1 is normal.

  The control device 9 determines whether or not the electronic component Ep is imaged by the component imaging device 5 (step S13 in FIG. 5). When determining that the electronic component Ep is not imaged, the control device 9 returns to step S11 and performs the above processing. repeat. On the other hand, when determining in step S13 that the electronic device Ep is to be imaged, the control device 9 changes the first light irradiation device 6 to a color corresponding to the electronic component Ep to be imaged and emits light (step in FIG. 5). S14) The electronic component Ep is imaged, and the process returns to step S11 to repeat the above-described processing.

  On the other hand, when the control device 9 determines in step S11 that the operation of the electronic component mounting machine 1 is abnormal, it determines whether or not the generated operation abnormality is in a warning state (step S15 in FIG. 5). . When the controller 9 determines that the generated operation abnormality is a warning state, the controller 9 changes the first light irradiation device 6 from green to yellow (step S16 in FIG. 5), and at this time, as described above. Since no defective board is generated, the component mounting operation is continued. Accordingly, the operator can visually recognize the yellow light through the window for internal confirmation provided in the electronic component mounting machine 1 and can determine that the operation of the electronic component mounting machine 1 is in a warning state, which will be described below. Thus, it is possible to immediately start repairing an abnormal operation in a warning state.

  When the warning state generated at this time is, for example, a state in which the component tape has run out and the electronic component Ep cannot be picked up by the suction nozzle 46, the control device 9 can store another electronic component Ep stored therein. The operation of sucking and collecting the electronic component Ep from the carrier tape T by the suction nozzle 46 is performed to continue the component mounting operation. During the operation, the operator repairs the abnormal operation in the warning state, that is, replaces the tape feeder 3 or the reel 32 in which the parts are cut. In this way, in the warning state, the operator is notified and the component mounting operation is continued, so that it is possible to prevent a reduction in the production efficiency of the board.

  Then, the control device 9 determines whether or not the abnormal operation in the warning state has been repaired (step S17 in FIG. 5), and when it is determined that the abnormal operation in the warning state has not been repaired, the component mounting operation is continued. Therefore, it is determined whether or not the electronic component Ep is imaged by the component imaging device 5 (step S18 in FIG. 5). Then, when it is determined that the electronic component Ep is not imaged, the control device 9 returns to step S17 and repeats the above-described processing. When it is determined that the electronic component Ep is imaged, the control device 9 selects the first light irradiation device 6 as the imaging target. The color corresponding to the electronic component Ep is changed to emit light (step S19 in FIG. 5), the electronic component Ep is imaged, the process returns to step S17, and the above processing is repeated. On the other hand, when the control device 9 determines in step S17 that the abnormal operation in the warning state has been repaired, the control unit 9 turns off the first light irradiation device 6 (step S20 in FIG. 5), returns to step S11, and performs the above-described processing. repeat.

  On the other hand, in step S15, when the control device 9 determines that the generated operation abnormality is not a warning state, the control device 9 determines that the generated operation abnormality is an error state (step S21 in FIG. 5), and the first light irradiation. The device 6 is changed from green to red to emit light (step S22 in FIG. 5). At this time, a defective substrate is generated as described above, so that the operation of the mounting head 45 is stopped (step S23 in FIG. 5). Terminate the process. As a result, the operator can visually recognize the red light through the internal confirmation window provided in the electronic component mounting machine 1 and can determine that the operation of the electronic component mounting machine 1 is in an error state. Thus, it is possible to immediately start repairing an abnormal operation in an error state.

  If the error state generated at this time is, for example, a state in which the posture of the electronic component Ep picked up by the suction nozzle 46 cannot be corrected, the control device 9 will detect the defective substrate as soon as the electronic component Ep is mounted on the substrate K. Therefore, the operation of the mounting head 45 is stopped. Then, the operator performs the operation of repairing the abnormal operation in the error state, that is, the operation of removing the electronic component Ep picked up by the suction nozzle 46 from the suction nozzle 46. Thus, in the error state, the operator is notified and the component mounting is stopped, so that the generation of a defective board can be prevented.

  In the first embodiment described above, the generation of the irradiation light of the first light irradiation device 6 according to the operating status of the electronic component mounting machine 1 is performed when the electronic component Ep is imaged because the current substrate K is set. However, when the next substrate K is carried in after completion of component mounting of the current substrate K, the generation of irradiation light of the first light irradiation device 6 according to the operation status of the electronic component mounting machine 1 is as follows: This is performed not only when the electronic component Ep is imaged but also when the second light irradiation device 8 is not imaging the substrate K. Moreover, when generating the irradiation light of the 1st light irradiation apparatus 6 according to the operation condition of the electronic component mounting machine 1 with the 2nd light irradiation apparatus 8, except the time of imaging of the electronic component Ep and the time of imaging of the board | substrate K To do in.

<2. Second embodiment>
(2-1. Overall configuration of production line)
An overall configuration of a production line including a plurality of electronic component mounting machines according to an embodiment of the present invention will be described. As shown in FIG. 6, a production line 100 includes a plurality (9 in this example) of electronic component mounting machines 101, a plurality (3 in this example) of line light irradiation devices 102, and a host control device. 103 and the like.

  The electronic component mounting machine 101 constituting the production line 100 includes at least one of the first light irradiation device 6 and the second light irradiation device 8 according to the operating status of the electronic component mounting machine 1 included in the electronic component mounting machine 1 shown in FIG. Although the function to change one irradiation light is not provided, since it is the structure substantially the same as the structure of the electronic component mounting machine 1 except the said function, detailed description is abbreviate | omitted. The plurality of electronic component mounting machines 101 are arranged side by side in the substrate transport direction (X-axis direction).

  The line light irradiation device 102 is, for example, installed on the ceiling of a factory building, and includes LEDs of three primary colors that can emit and blink multiple colors. In this example, three line light irradiation devices 102 are provided, and each line light irradiation device 102 is arranged so that light can be irradiated to each group, with three electronic component mounting machines 101 as one group.

  The host control device 103 controls the control device 101a of each electronic component mounting machine 101, the light irradiation device 102 for each line, and the like. Then, the host control device 103 monitors the operation status of each electronic component mounting machine 101 and generates the irradiation light L of the line light irradiation device 102 according to the operation status of each electronic component mounting device 101. That is, the host control device 103 determines the group to which the electronic component mounting machine 101 that has malfunctioned belongs, and generates the irradiation light L of the line light irradiation device 102 that can emit light to the group.

  As the generation of the irradiation light L, for example, light is emitted in green during normal operation or is turned off, light is emitted in yellow during operation in a warning state, and light is emitted in red during an error state. In addition, as for the generation of other irradiation light, for example, the light is always emitted or turned off at any color during normal operation, and the light is blinked at a relatively long interval in any color during operation in a warning state. When stopped in an error state, it is blinked with an arbitrary color at a relatively short interval. In the electronic component mounting machine 1 shown in FIG. 1, the irradiation light is generated except when the electronic component Ep is imaged. However, the line light irradiation device 102 illuminates the exterior cover of the electronic component mounting machine 101. Such regulation is unnecessary, and the irradiation light L can be generated during the entire operation of component mounting.

(2-2. Operation of host controller)
Next, the operation status monitoring operation of the host control apparatus 103 will be described with reference to the flowchart of FIG. It is assumed that each electronic component mounting machine 101 is in a standby state for starting a component mounting operation. The line light irradiation device 102 emits green light when the electronic component mounting machine 101 is operating normally, emits yellow light during operation in a warning state, and emits red light when stopped in an error state. .

  The host control device 103 determines whether the operations of all the electronic component mounting machines 101 in each group are normal (step S31 in FIG. 7). When the host control apparatus 103 determines that the operations of all the electronic component mounting machines 101 in each group are normal, the line light irradiation apparatus 102 in each group emits light in green (step S32 in FIG. 7). . Thereby, the worker can visually recognize the green light even if the worker is away from the production line 100 in the factory building, and can determine that the operations of all the electronic component mounting machines 101 in each group are normal.

  On the other hand, when the host controller 103 determines in step S31 that the operation of a certain electronic component mounting machine 101 is abnormal, it identifies the group of the electronic component mounting machine 101 (step S33 in FIG. 7), and specifies It is determined whether or not there is an electronic component mounting machine 101 whose operation abnormality is in an error state in the group (step S34 in FIG. 7). When the host control apparatus 103 determines that there is no electronic component mounting machine 101 in which the operation abnormality is in an error state in the specified group, the host control apparatus 103 determines that the operation abnormality is in a warning state and identifies the line light irradiation device for the specified group. 102 is changed from green to yellow to emit light (step S35 in FIG. 7). Thereby, the worker can visually recognize the yellow light even when away from the production line 100 in the factory building, and can determine that the operation of the electronic component mounting machine 101 belonging to the group illuminated with the yellow light is in a warning state. Therefore, as described below, it is possible to immediately start repairing an abnormal operation in a warning state.

  If the warning state generated at this time is, for example, a state in which the component tape has run out and the electronic component Ep cannot be picked up by the suction nozzle 46, the host control device 103 stores the same electronic component Ep. The component mounting operation is continued by performing an operation of sucking and collecting the electronic component Ep from the carrier tape T by the suction nozzle 46. During the operation, the operator repairs the abnormal operation in the warning state, that is, replaces the tape feeder 3 or the reel 32 in which the parts are cut. In this way, in the warning state, the operator is notified and the component mounting operation is continued, so that it is possible to prevent a reduction in the production efficiency of the board.

  Then, the host control device 103 determines whether or not the abnormal operation in the warning state has been repaired (step S36 in FIG. 7), and when it is determined that the abnormal operation in the warning state has been repaired, The light irradiation device 102 is turned off (step S37 in FIG. 7), and the process returns to step S31 to repeat the above processing. On the other hand, when the host control apparatus 103 determines in step S34 that the electronic component mounting machine 101 whose operation abnormality is in an error state exists in the specified group, the line light irradiation apparatus 102 of the specified group is changed from green to red. The light is emitted (step S38 in FIG. 7), and the operation of the mounting head 45 of the electronic component mounting machine 101 whose operation abnormality is in an error state is stopped (step S39 in FIG. 7). Thereby, the worker can visually recognize the red light even when away from the production line 100 in the factory building, and can determine that the operation of the electronic component mounting machine 101 belonging to the group illuminated by the red light is in an error state. Therefore, as described below, it is possible to immediately start repairing an abnormal operation in an error state.

  If the error state generated at this time is, for example, a state in which the posture of the electronic component Ep picked up by the suction nozzle 46 cannot be corrected, the host control device 103 will mount the defective electronic component Ep on the substrate K as it is. Therefore, the operation of the mounting head 45 is stopped. Then, the operator performs the operation of repairing the abnormal operation in the error state, that is, the operation of removing the electronic component Ep picked up by the suction nozzle 46 from the suction nozzle 46. Thus, in the error state, the operator is notified and the component mounting is stopped, so that the generation of a defective board can be prevented.

<3. Another form of production line>
(3-1. Overall configuration of production line)
A schematic configuration of another form of the production line will be described with reference to FIG. 8 shown corresponding to FIG. In FIG. 8, the same components as those of the production line 100 shown in FIG. The line light irradiation apparatus 102 shown in FIG. 6 is configured to irradiate light to a group composed of a plurality of electronic component mounting machines 101. However, as shown in FIG. 104 may be provided so that a plurality of (9) electronic component mounting machines 101 can be irradiated with one line light irradiation device 102. Thus, since there is one line light irradiation device 102, there is also one electronic component mounting machine 101 capable of light irradiation. Therefore, for example, the operator sets in advance a priority order for repairing the operation abnormality of the electronic component mounting machine 101 in accordance with the degree of influence on the production stop and stores the priority order table in the host control apparatus 103 in advance. .

  In this example, the line light irradiation device 102 is turned off when the electronic component mounting machine 101 is operating normally, and only in the direction of the electronic component mounting machine 101 when the electronic component mounting machine 101 becomes abnormal in operation. Since it suffices to turn and irradiate the light L, it is possible to significantly reduce costs such as installation, maintenance and power consumption of the line light irradiation device 102. In this case, since the factory building is not illuminated, the exterior cover of the electronic component mounting machine 101 can be omitted, and the cost of the electronic component mounting machine 101 can be reduced.

(3-2. Operation of host control device)
Next, the operation status monitoring operation of the host control apparatus 103 will be described with reference to the flowcharts of FIGS. It is assumed that each electronic component mounting machine 101 is in a standby state for starting a component mounting operation. Further, the line light irradiation device 102 is turned off when the electronic component mounting machine 101 is operating normally, emits yellow light during operation in a warning state, and emits red light when stopped in an error state.

  The host control device 103 determines whether the operation of each electronic component mounting machine 101 is normal (step S41 in FIG. 9). When the host control device 103 determines that the operation of each electronic component mounting machine 101 is normal, the line light irradiation device 102 is turned off. Thereby, the operator can determine that the operation of each electronic component mounting machine 101 is normal because the line light irradiation device 102 does not emit light even if the worker is away from the production line 100 in the factory building.

  On the other hand, when the host control apparatus 103 determines in step S41 that the operation of the electronic component mounting machine 101 is abnormal, the host control apparatus 103 determines whether or not there is only one electronic component mounting machine 101 with an abnormal operation (FIG. 9 step S42). When the host control apparatus 103 determines that there are a plurality of electronic component mounting machines 101 with an abnormal operation, the electronic component mounting machine 101 with an abnormal operation state is among the plurality of electronic component mounting machines 101. It is determined whether or not there is (step S43 in FIG. 9). If the host control apparatus 103 determines that there is an electronic component mounting machine 101 whose operation abnormality is in an error state among the plurality of electronic component mounting machines 101, whether or not there are a plurality of electronic component mounting machines 101 in an error state. Is determined (step S44 in FIG. 9).

  When the host control apparatus 103 determines that there are a plurality of electronic component placement machines 101 in an error state, the host device 103 refers to the priority order table and has the highest priority electronic component placement machine among the plurality of electronic component placement machines 101. 101 is irradiated with red light by the line light irradiation device 102 (step S45 in FIG. 9). Then, the host control apparatus 103 stops the operation of the mounting head 45 of the electronic component mounting machine 101 that has emitted red light (step S46 in FIG. 9). As a result, the worker can visually recognize the red light even when away from the production line 100 in the factory building, and can determine that the operation of the electronic component mounting machine 101 illuminated with the red light is in an error state. As described above, it is possible to immediately start repairing an abnormal operation in an error state.

  The host control device 103 determines whether or not the operation of the mounting heads 45 of all the electronic component mounting machines 101 whose operation abnormality is in an error state has been stopped (step S47 in FIG. 9), and stops the operation of the mounting head 45. When it is determined that the electronic component mounting machine 101 that is not left remains, the process returns to step S45 and the above-described processing is repeated. On the other hand, when the host control apparatus 103 determines that there is no electronic component mounting machine 101 that has not stopped the operation of the mounting head 45, the host control device 103 determines that there is an error in the plurality of electronic component mounting machines 101 that are in an error state. On the other hand, the operation of sequentially irradiating red light with the line light irradiation device 102 is repeated (step S48 in FIG. 9). Thereby, the worker can visually recognize the position of the electronic component mounting machine 101 where the operation of the mounting head 45 is stopped.

  On the other hand, in step S44, when the host control apparatus 103 determines that there is one electronic component mounting machine 101 in an error state, the line light irradiation device 102 emits red light to the electronic component mounting machine 101. Irradiation is performed (step S49 in FIG. 9), and the operation of the mounting head 45 of the electronic component mounting machine 101 is stopped (step S50 in FIG. 9). As a result, the worker can visually recognize the red light even when away from the production line 100 in the factory building, and can determine that the operation of the electronic component mounting machine 101 illuminated with the red light is in an error state. Thus, it is possible to immediately start repairing an abnormal operation in an error state.

  On the other hand, in step S43, when the host control apparatus 103 determines that there is no electronic component mounting machine 101 whose operation abnormality is in an error state among the plurality of electronic component mounting machines 101, the electronic component mounting machine 101 in a warning state. It is determined whether or not there are a plurality of devices (step S51 in FIG. 9). When the host control apparatus 103 determines that there are a plurality of electronic component mounting machines 101 in a warning state, the electronic component mounting machine with the highest priority among the plurality of electronic component mounting machines 101 is referred to by referring to the priority order table. 101 is irradiated with yellow light by the line light irradiation device 102 (step S52 in FIG. 9). As a result, the worker can visually recognize the yellow light even when away from the production line 100 in the factory building, and can determine that the operation of the electronic component mounting machine 101 illuminated with the yellow light is in a warning state. In this way, it is possible to immediately start repairing an abnormal operation in a warning state.

  Then, the host control apparatus 103 determines whether or not all the electronic component mounting machines 101 whose operation abnormality is in the warning state have been repaired (step S53 in FIG. 9), and the electronic component mounting machines 101 that have not been repaired remain. If it is determined that there is, the process returns to step S52 and the above-described processing is repeated. On the other hand, when the host control apparatus 103 determines that the electronic component mounting machine 101 that has not been repaired remains, the line light irradiation apparatus 102 is turned off (step S54 in FIG. 9), and the process returns to step S41 and described above. Repeat the process.

  On the other hand, in step S51, when the host control apparatus 103 determines that there is one electronic component mounting machine 101 in a warning state, the line light irradiation device 102 emits yellow light to the electronic component mounting machine 101. Irradiate (step S55 in FIG. 9). As a result, the worker can visually recognize the yellow light even when away from the production line 100 in the factory building, and can determine that the operation of the electronic component mounting machine 101 illuminated with the yellow light is in a warning state. In this way, it is possible to immediately start repairing an abnormal operation in a warning state. Then, the host control device 103 determines whether or not the electronic component mounting machine 101 has been repaired (step S56 in FIG. 9), and when it is determined that the electronic component mounting machine 101 has been repaired, the line light irradiation is performed. The apparatus 102 is turned off (step S57 in FIG. 9), and the process returns to step S41 to repeat the above processing.

  On the other hand, in step S42, when the host control apparatus 103 determines that there is only one electronic component mounting machine 101 with an abnormal operation, the host control apparatus 103 determines whether the generated abnormal operation is in a warning state (FIG. 10). Step S58). When the host control apparatus 103 determines that the operation abnormality that has occurred is in a warning state, the host light irradiation apparatus 102 irradiates the electronic component mounting machine 101 with yellow light (step S59 in FIG. 10). Then, the host control device 103 determines whether or not the abnormal operation in the warning state has been repaired (step S60 in FIG. 10), and when it is determined that the abnormal operation in the warning state has been repaired, the line light irradiation device 102 Is turned off (step S61 in FIG. 10), the process returns to step S41 and the above-described processing is repeated.

  On the other hand, when the host control apparatus 103 determines in step S58 that the generated operation abnormality is not a warning state, the host operation apparatus 103 determines that the generated operation abnormality is in an error state (step S62 in FIG. 10), and the electronic component The line light irradiation device 102 irradiates the mounting machine 101 with red light (step S63 in FIG. 10). At this time, a defective substrate is generated as described above, and the operation of the mounting head 45 is stopped (FIG. 5). Step S64), all the processes are terminated.

  In another form of the production line 100 described above, a single line light irradiation device 102 is configured to be able to irradiate a plurality (9) of electronic component mounting machines 101 one by one. It is good also as a structure which can irradiate the electronic component mounting machine 101 of every group. Moreover, it is good also as a structure provided with two or more line light irradiation apparatuses 102 which have the turning mechanism 104. FIG.

<4. Effects of the embodiment>
The electronic component mounting machine 1 of the present embodiment collects the electronic component Ep supplied to the component supply position Pp, transfers the collected electronic component Ep to the substrate K transferred to the substrate transfer position Pk, and transfers the transferred electronic component Ep is mounted on the substrate K. And the imaging devices 5 and 7 which image the electronic component Ep or the board | substrate K, and the light irradiation apparatus 6 which can light-irradiate with respect to the electronic component Ep or the board | substrate K at the time of imaging of the electronic component Ep or the board | substrate K by the imaging devices 5 and 7. , 8 and a control device 9 for controlling the mounting operation of the electronic component Ep on the substrate K based on the imaging results of the imaging devices 5, 7. And the control apparatus 9 generates the light according to the operating condition of the electronic component mounting machine 1 by the light irradiation apparatuses 6 and 8 except the time of imaging of the electronic component Ep or the board | substrate K by the imaging devices 5 and 7. FIG.

  According to this, since the change of the irradiation light Le and Lm is performed except when the electronic component Ep or the substrate K is imaged, it does not hinder the image recognition of the electronic component Ep or the substrate K. And since the change of irradiation light Le and Lm is performed by the 1st light irradiation apparatus 6 or the 2nd light irradiation apparatus 8 with which it originally provided, the recognition of the operation condition at the time of mounting | wearing the electronic component Ep in the electronic component mounting machine 1 is recognized. This is possible at low cost.

  Further, the control device 9 varies the colors of the irradiation lights Le and Lm according to the operating status of the electronic component mounting machine 1 and blinks the irradiation lights Le and Lm according to the operating status of the electronic component mounting machine 1. The operator can easily visually recognize the operating status when the electronic component Ep is mounted in the electronic component mounting machine 1, and can quickly respond to abnormal operations.

  Production lines 100 including a plurality of electronic component mounting machines 101 according to the present embodiment are provided in a number smaller than the number of electronic component mounting machines 101 configuring the production line 100, and the electronic component mounting machines 101 configuring the production line 100 are provided in the electronic component mounting machines 101. On the other hand, a line light irradiation device 102 for irradiating light according to the operating status of the electronic component mounting machine 101 is provided. According to this, since it is not necessary to provide a light irradiation device for each electronic component mounting machine 101, it is possible to recognize the operation status when mounting the electronic component Ep in the electronic component mounting machine 101 at a low cost.

  Further, the plurality of electronic component mounting machines 101 constituting the production line 100 are grouped into at least two or more electronic component mounting machines 101 as one group, and the line light irradiation device 102 is provided so that light irradiation can be performed for each group. Thus, light corresponding to the operating status of a predetermined electronic component mounting machine among the electronic component mounting machines 101 constituting the group is generated. Thereby, the installation number of the light irradiation apparatus 102 for lines can be reduced.

  In addition, the line light irradiation device 102 is provided so as to be able to irradiate light by changing the light irradiation direction for each of the plurality of electronic component mounting machines 101 constituting the production line 100. Responsive light is generated. Thereby, the installation number of the light irradiation apparatus 102 for lines can further be reduced.

  Further, the line light irradiation device 102 changes the color of the irradiation light L according to the operating status of the electronic component mounting machine 101, and blinks the irradiation light L according to the operating status of the electronic component mounting machine 101. The operator can easily visually check the operation status when the electronic component Ep is mounted on the electronic component mounting machine 101, and can quickly respond to abnormal operation.

  DESCRIPTION OF SYMBOLS 1,101: Electronic component mounting machine 2: Board | substrate conveyance apparatus 3: Tape feeder 4: Component transfer apparatus 5: Component imaging device 6: 1st light irradiation apparatus 7: Board | substrate imaging device 8: 2nd light irradiation apparatus 9: Control Device 46: Adsorption nozzle 100: Production line 102: Light irradiation device for line 103: Host control device K: Substrate Ep: Electronic component Le, Lm, L: Irradiation light

Claims (8)

An electronic component mounting machine that collects an electronic component supplied to a component supply position, transfers the collected electronic component to a substrate transported to a substrate transport position, and mounts the transferred electronic component on the substrate,
An imaging device for imaging the electronic component or the substrate;
A light irradiation device capable of irradiating light to the electronic component or the substrate at the time of imaging the electronic component or the substrate by the imaging device;
A control device for controlling the mounting operation of the electronic component on the substrate based on the imaging result of the imaging device;
With
The said control apparatus is an electronic component mounting machine which produces | generates the light according to the operating condition of the said electronic component mounting machine by the said light irradiation apparatus except the time of imaging of the said electronic component or the said board | substrate by the said imaging device.   The electronic component mounting machine according to claim 1, wherein the control device changes a color of the light according to an operating state of the electronic component mounting machine.   The electronic component mounting machine according to claim 1, wherein the control device blinks the light according to an operating state of the electronic component mounting machine. Production including a plurality of electronic component mounting machines for collecting electronic components supplied to a component supply position, transferring the collected electronic components to a substrate conveyed to a substrate conveyance position, and mounting the transferred electronic components on the substrate Line,
A line that is provided in a number smaller than the number of the electronic component mounting machines constituting the production line, and irradiates the electronic component mounting machines constituting the production line with light according to the operating status of the electronic component mounting machines. A production line equipped with a light irradiation device. The plurality of electronic component mounting machines constituting the production line are grouped into at least two or more electronic component mounting machines as one group,
The line light irradiation device is provided so as to be capable of irradiating light for each group, and generates light according to an operating state of a predetermined electronic component mounting machine among the electronic component mounting machines constituting the group. Item 5. The production line according to item 4.   The line light irradiation device is provided so as to be capable of irradiating light by changing the light irradiation direction for each of the plurality of electronic component mounting machines constituting the production line, and according to the operating status of the electronic component mounting machine The production line according to claim 4, which generates light.   The said line light irradiation apparatus is a production line as described in any one of Claims 4-6 which changes the color of the said light according to the operating condition of the said electronic component mounting machine.   The said line light irradiation apparatus is a production line as described in any one of Claims 4-6 which blinks the said light according to the operating condition of the said electronic component mounting machine.

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