JP2017159478A - Method for forming wiring pattern, method for producing electronic device, printing wiring, electronic device, and gravure plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the generation of printing failure caused by the remaining of a conductive ink onto a blanket.SOLUTION: Provided is a method for forming a wiring pattern where a conductive ink filled into the recessed part of a gravure plate is transferred to a blanket, and the conductive ink transferred to the blanket is transferred to a substrate, and curing is performed to form a wiring pattern on the base material, in which a projecting part 32 reducing the volume of the recessed part 31 is formed at the bottom face of the recessed part 31 of a gravure plate 30. Since the amount of the conductive ink is reduced by the degree of the projecting part 32, the remaining of the conductive ink onto the blanket generated by the high feed amount of the conductive ink can be dissolved.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a method for forming a wiring pattern by gravure offset printing, a printed wiring and a gravure plate on which a wiring pattern is formed, and further relates to an electronic device including a printed wiring and a method for producing an electronic device.

  In recent years, printing methods that are excellent in productivity and advantageous in terms of manufacturing cost have been used to form electrode patterns and wiring patterns of various electronic devices such as touch panels, membrane switches, and organic EL devices. In particular, gravure offset printing is attracting attention as being suitable for forming high-definition patterns.

  Patent Document 1 describes that a wiring pattern is formed by gravure offset printing as described above, and FIG. 11 shows a gravure offset printing machine described in Patent Document 1. Patent Document 1 describes that a gravure offset printer 10 is used to perform printing in the following steps (1) to (3).

  (1) First, after aligning the position of the base material 12 with the alignment camera 11, the conductive ink is doctored by the doctor 14 onto the first intaglio 13 which is a cylinder. A fine line pattern is engraved on the first intaglio 13 and the fine line pattern is filled with conductive ink.

  (2) Next, the conductive ink is transferred from the first intaglio 13 to the blanket 16 attached to the blanket cylinder 15 and printed on the substrate 12.

  (3) Next, the doctor ink is used to doctor the second intaglio plate 17 which is a cylinder, and the conductive ink is transferred from the second intaglio plate 17 to the blanket 16 and printed on the substrate 12. A thick line pattern thicker than the fine line pattern of the first intaglio 13 is engraved on the second intaglio 17 and the thick line pattern is filled with conductive ink. The fine line pattern of the first intaglio 13 and the thick line pattern of the second intaglio 17 are combined on the substrate 12 to form a pattern, and then cured by baking to complete a printed matter.

JP2013-70005A

By the way, when using conductive ink and forming a wiring pattern by gravure offset printing, if conductive ink remains on the blanket,
a) Since the predetermined conductive ink is not transferred onto the base material, for example, there is a defect in the transfer pattern. b) On the base material, the conductive ink remaining on the blanket is added to the conductive ink transferred from the gravure plate next time. Printing defects such as bleeding and shape defects occur in the transfer pattern.

  When the pattern width of the wiring pattern is increased, the amount of conductive ink supplied to the concave portion of the gravure plate is increased, so that the above-described printing failure is more likely to occur.

  In order to avoid such printing defects, for example, it is conceivable to control the printing conditions such as the state of the conductive ink according to the pattern width of the wiring pattern, and the gravure offset printing machine shown in FIG. If a configuration using a plurality of gravure plates (intaglio plates) is used as in FIG. 10, it is possible to control the printing conditions by using different gravure plates depending on the pattern width of the wiring pattern.

  However, in order to use a plurality of gravure plates, an apparatus configuration including a plurality of gravure cylinders to which the gravure plates are attached causes a complicated and large printing apparatus, and it is troublesome to control printing conditions. .

  In view of such circumstances, an object of the present invention is to provide a wiring pattern that can prevent the occurrence of printing defects due to the residual conductive ink on the blanket in gravure offset printing with a simple configuration and a simple method. It is to provide a forming method and a gravure plate, and to provide a printed wiring on which a wiring pattern is formed satisfactorily, an electronic device having the printed wiring, and a method for producing the electronic device.

  According to the first aspect of the present invention, the conductive ink filled in the concave portion of the gravure plate is transferred to the blanket, and the conductive ink transferred to the blanket is transferred to the substrate and cured to form a wiring pattern on the substrate. In the method of forming a wiring pattern to be formed, a convex portion that reduces the volume of the concave portion is formed on the bottom surface of the concave portion.

  According to a second aspect of the present invention, in the first aspect of the present invention, the top surface of the convex portion is located on the same plane as the upper surface of the gravure plate.

  According to a third aspect of the present invention, in the first aspect of the present invention, the convex portion has a height less than a height reaching the upper surface of the gravure plate.

  According to a fourth aspect of the present invention, in the invention according to any one of the first to third aspects, the convex portion is present in the width direction of the concave portion corresponding to the width direction of the wiring pattern, and corresponds to the longitudinal direction of the wiring pattern. A plurality of the recesses are formed in the longitudinal direction.

  According to a fifth aspect of the present invention, in any one of the first to fourth aspects of the present invention, the wiring pattern has a wavy line shape, and the convex portion is formed at the concave portion corresponding to the folded portion of the wavy line.

  According to the invention of claim 6, the method for producing an electronic device uses the wiring pattern forming method according to any one of claims 1 to 5.

  According to the invention of claim 7, in the printed wiring in which the wiring pattern made of the conductive ink film in a cured state is formed on the substrate, the space without the film is formed inside the wiring pattern. It is assumed that there is one in the width direction and one or more in the longitudinal direction of the wiring pattern.

  According to an eighth aspect of the present invention, in the seventh aspect of the present invention, the wiring pattern has a wavy line shape, and the space exists in the folded portion of the wavy line.

  According to the invention of claim 9, in the printed wiring in which the wiring pattern made of the conductive ink film in a cured state is formed on the base material, the depression is formed in the wiring pattern width direction on the upper surface of the wiring pattern. One is present, and a plurality of are formed in the longitudinal direction of the wiring pattern.

  According to a tenth aspect of the present invention, an electronic device includes the printed wiring according to any one of the seventh to ninth aspects.

  According to the eleventh aspect of the present invention, the gravure plate in which the concave portion defining the wiring pattern of the printed wiring is formed has a convex portion that reduces the volume of the concave portion on the bottom surface of the concave portion.

  In the invention of claim 12, in the invention of claim 11, the top surface of the convex part is located on the same plane as the upper surface of the gravure plate.

  According to a thirteenth aspect of the present invention, in the eleventh aspect of the present invention, the convex portion has a height less than a height reaching the upper surface of the gravure plate.

  According to a fourteenth aspect of the present invention, in the invention according to any one of the eleventh to thirteenth aspects, the convex portion is present in the width direction of the concave portion corresponding to the width direction of the wiring pattern and corresponds to the longitudinal direction of the wiring pattern. It is assumed that a plurality of the recesses are formed in the longitudinal direction.

  According to a fifteenth aspect of the invention, in any one of the eleventh to fourteenth aspects of the invention, the wiring pattern has a wavy shape, and the convex portion is formed at a portion of the concave portion corresponding to the folded portion of the wavy line. Is done.

  According to the present invention, it is possible to prevent the occurrence of printing defects due to the conductive ink remaining on the blanket with a simple configuration and a simple method, thereby improving the printing quality and continuous printability. Can be improved.

The schematic diagram for demonstrating the outline | summary of a roll-type gravure offset printing apparatus. A is a figure for demonstrating the 1st Example of the gravure plate by this invention, B is a figure which shows the wiring pattern formed using the gravure plate of A. 2A is a partially enlarged perspective view of the gravure plate shown in FIG. 2A, FIG. 2B is a partially enlarged sectional view of FIG. 2A, and C is a partially enlarged sectional view of FIG. A is a diagram for explaining a second embodiment of the gravure plate according to the present invention, B is a diagram for explaining a third embodiment of the gravure plate according to the present invention, and C is a fourth diagram of the gravure plate according to the present invention. The figure for demonstrating the Example of. The figure for demonstrating the structure outline | summary of the touchscreen as one Example of the electronic device by this invention. FIG. 6A is a partially enlarged view showing details of a first sensor electrode array of the touch panel shown in FIG. 5, and B is a partially enlarged view showing details of a second sensor electrode array of the touch panel shown in FIG. FIG. 6 is a partially enlarged view showing a first sensor electrode row and a lead wiring drawn from the first sensor electrode row of the touch panel shown in FIG. 5. FIG. 6 is a partially enlarged view showing a lead wiring drawn from the first sensor electrode array of the touch panel shown in FIG. 5. A is a figure which shows a wavy line-shaped wiring pattern, B is a figure for demonstrating the tailing and bleeding of conductive ink. A is a figure for demonstrating the 5th Example of the gravure plate by this invention, B is a figure for demonstrating the 6th Example of the gravure plate by this invention. The figure for demonstrating the formation method of the conventional wiring pattern by gravure offset printing.

  First, an outline of roll-type gravure offset printing targeted by the present invention will be described.

  FIG. 1 shows a configuration of a gravure offset printing apparatus. Ink 24 is supplied to a cylindrical gravure plate 22 attached to a gravure cylinder 21 by a dispenser 23. The ink 24 is filled by the doctor blade 25 into the recess 22a that defines the printing pattern formed on the gravure plate 22, and the excess ink 24 is scraped by the doctor blade 25 so that the ink 24 is uniformly contained in the recess 22a. Be accustomed to. The ink 24 filled in the recess 22 a of the gravure plate 22 is transferred to a blanket 27 attached to a blanket cylinder 26 that rotates while being pressed against the gravure plate 22. The ink 24 transferred to the blanket 27 is transferred to the substrate (printing substrate) 28 that has been flowed. Thereafter, the ink 24 is cured and printing is completed.

  In the present invention, in the formation of a wiring pattern by such gravure offset printing, the gravure offset printing apparatus shown in FIG. 1 shows the occurrence of printing defects due to the conductive ink not being transferred to the base material and remaining on the blanket. This can be prevented without changing the configuration, and will be specifically described below.

  As described above, the conductive ink residue on the blanket is likely to occur when a wiring pattern having a large pattern width and a large amount of conductive ink supplied to the concave portion of the gravure plate is printed. Accordingly, in this example, a convex portion that reduces the volume of the concave portion is formed on the bottom surface of the concave portion of the gravure plate that defines the thick wiring pattern, and the amount of the conductive ink is reduced by the amount of the convex portion.

  FIG. 2A shows a part of the gravure plate in which the convex portion is formed on the bottom surface of the concave portion that defines the thick wiring pattern, and FIG. 2B corresponds to the gravure plate shown in FIG. 2A. A part of the wiring pattern printed and formed thereon is shown. 3A shows a part of FIG. 2A, and FIGS. 3B and 3C show cross sections of the gravure plate and the wiring pattern shown in FIGS. 2A and B, respectively.

  In this example, convex portions 32 are formed so as to protrude from the bottom surface of the concave portion 31 that defines the thick wiring pattern of the gravure plate 30 at a predetermined pitch in the longitudinal direction of the concave portion 31, that is, in the longitudinal direction of the wiring pattern. In this example, the convex portions 32 are arranged on the center line of the concave portion 31 and are formed in a line. That is, one convex portion 32 is separated from both side surfaces of the concave portion 31 in the width direction of the concave portion 31 (width direction of the wiring pattern). A plurality of recesses 31 are formed in the longitudinal direction.

  In this example, the convex portion 32 has a square top surface 32 a, and the top surface 32 a is located on the same plane as the upper surface 30 a of the gravure plate 30.

  When such a gravure plate 30 is used and a wiring pattern is gravure offset printed with conductive ink, a space corresponding to the convex portion 32 is formed inside the wiring pattern, but on the conductive ink blanket. Due to the bleeding and bleeding on the base material, the space is eventually filled or reduced. FIG. 2B shows a state in which a wiring pattern 42 in which all spaces are filled is formed on the base material 41. As shown in FIG. 3C, the thickness of the conductive ink is reduced in the portion where the space is filled, and a recess 42 a is formed on the upper surface of the wiring pattern 42. One depression 42 a is formed in the width direction of the wiring pattern 42, and a plurality of depressions 42 a are formed in the longitudinal direction of the wiring pattern 42.

  When all the spaces are not filled and a space without a conductive ink film is formed inside the wiring pattern 42, there is one space without a film in the width direction of the wiring pattern 42. There will be one or more in the longitudinal direction.

  Thus, the convex part 32 is formed in the bottom face of the recessed part 31 which demarcates the thick wiring pattern 42 of the gravure plate 30, and the amount of the conductive ink transferred to the blanket is reduced by the amount of the convex part 32. By controlling, it is possible to eliminate the fact that the conductive ink remains on the blanket without being transferred to the base material, and thus prevents the occurrence of printing defects due to the conductive ink remaining on the blanket. Can do. It should be noted that reducing the amount of the conductive ink by forming the convex portions 32 in this way is also effective as a measure for blanket swelling.

  The convex portions 32 are formed on the concave portions 31 of the gravure plate 30 in FIG. 2A in which the convex portions 32 are arrayed on the center line in the width direction of the concave portions 31. For example, as shown in FIG. The convex portions 32 may be arranged on a line that is shifted from the center line in the direction. 2A and 4A, the convex portion 32 does not contact both side surfaces of the concave portion 31, but as shown in FIG. 4B, the convex portion 32 is arranged in contact with the side surface inside one side surface of the concave portion 31. Convex part 32 may be formed. Furthermore, the convex portions 32 may not be arranged in a straight line, but may be alternately arranged in the width direction of the concave portions 31 as shown in FIG.

  The arrangement of the convex portions 32 as shown in FIGS. 4A and 4B takes into consideration the squeezing direction of the doctor blade in gravure offset printing, and in FIGS. 4A and 4B, the arrow S indicates the squeezing direction of the doctor blade. As shown in FIGS. 4A and 4B, if the convex portions 32 are arranged in the concave portion 31 while being shifted in the squeezing direction, the space in the wiring pattern corresponding to the convex portions 32 is more easily filled, and the space is filled. Thus, the resistance value of the wiring pattern can be reduced.

  Next, a configuration of a capacitive touch panel will be described as an embodiment of the electronic device according to the present invention.

  FIG. 5 shows an outline of the configuration of a capacitive touch panel. In FIG. 5, 50 indicates a transparent substrate. The capacitive touch panel has a configuration in which, for example, a first conductor layer, an insulating layer, a second conductor layer, and a protective film are sequentially stacked on the transparent substrate 50.

  Although the detailed illustration of the sensor electrode array is omitted in FIG. 5, the sensor electrode array includes a plurality of first sensor electrode arrays and a plurality of second sensor electrode arrays, and the plurality of first sensor electrode arrays are the first conductors. The plurality of second sensor electrode arrays are formed by a second conductor layer that is insulated from the first conductor layer by an insulating layer. In FIG. 5, the part enclosed by the rectangular frame shows the sensor region 60 where the sensor electrode row is located.

  FIG. 6A shows details of the first sensor electrode array 71 formed by the first conductor layer, and FIG. 6B shows the second sensor electrode array 81 formed by the second conductor layer. Details are shown.

  The first sensor electrode array 71 includes a plurality of island-shaped electrodes 72 arranged in the X direction parallel to the long side 61 of the rectangular sensor region 60 and a connecting portion 73 that connects the adjacent island-shaped electrodes 72. . A plurality of first sensor electrode rows 71 are arranged in parallel in the Y direction parallel to the short side 62 of the rectangular sensor region 60. The second sensor electrode array 81 includes a plurality of island electrodes 82 arranged in the Y direction and a connecting portion 83 that connects adjacent island electrodes 82. A plurality of second sensor electrode rows 81 are arranged in parallel in the X direction. The first sensor electrode row 71 and the second sensor electrode row 81 intersect with each other while being insulated from each other, and the connecting portions 73 and 83 are positioned so as to overlap each other. As shown in FIGS. 6A and 6B, the first sensor electrode array 71 and the second sensor electrode array 81 are composed of line segments obliquely intersecting both the long side 61 and the short side 62 of the sensor region 60, and It is formed of a fine line mesh that forms a large number of cellular voids, and the outer shape of the island-shaped electrodes 72 and 82 is a rhombus shape.

  The lead wires 91 and 92 and the terminal portion 93 shown in FIG. 5 are formed by the first conductor layer, and the ground wire 94 is formed by both the first and second conductor layers. The lead wires 91 are drawn from both ends of each first sensor electrode row 71 in the X direction, and the lead wires 92 are drawn from one end of each second sensor electrode row 81 in the Y direction. In FIG. 5, a plurality of lead wires 91 and 92 arranged in a plurality and drawn from the sensor region 60 are shown only at both ends of the array, and illustration of those other than those located at both ends is omitted.

  The terminal portion 93 is arranged and formed at the center of one long side of the rectangular transparent substrate 50, and the lead wires 91 and 92 extend to the terminal portion 93 and are connected to the terminal portion 93. The ground wiring 94 is formed on the periphery of the transparent substrate 50 so as to surround the sensor region 60 and the lead wirings 91 and 92. The ground wiring 94 is also connected to the terminal portion 93.

  Although the detailed illustration of the thick terminal portion 93 and the ground wiring 94 is omitted, the long terminal portion 61 and the short side 62 of the sensor region 60 are obliquely crossed like the first and second sensor electrode rows 71 and 81. It is composed of a line segment and is formed of a fine line mesh including a large number of cellular voids in the extending direction and the width direction. The lead-out wirings 91 and 92 are linear (linear) wirings.

  The first and second conductor layers having the above-described configuration are printed and formed by the gravure offset printing apparatus shown in FIG. 1 using a conductive ink containing conductive particles such as silver. In this example, in the gravure offset printing of the first and second conductor layers, it is possible to prevent the occurrence of printing failure due to the conductive ink remaining on the blanket and to cause the doctor blade to fall into the concave portion of the gravure plate and to be caught. This prevents the occurrence of defective printing.

  First, a configuration for avoiding the drop of the doctor blade into the concave portion of the gravure plate will be described.

  The squeezing direction of the doctor blade with respect to the gravure plate that defines the pattern of the conductor layer is either the X direction parallel to the long side 61 of the sensor region 60 or the Y direction parallel to the short side 62 of the sensor region 60. In this example, the squeezing direction is the X direction. In FIG. 5, an arrow S indicates a squeezing direction.

  Since the first and second sensor electrode rows 71 and 81, the terminal portion 93, and the ground wiring 94 are formed of a mesh that obliquely crosses both in the X direction and the Y direction, these first and second sensor electrode rows. The doctor blade does not drop into the concave portion of the gravure plate that defines the patterns of 71 and 81, the terminal portion 93 and the ground wiring 94. On the other hand, since the lead wires 91 and 92 are each composed of line segments extending in the X direction and the Y direction, the doctor blade may fall into the concave portion of the gravure plate that defines the pattern of the lead wires 91 and 92. Can do.

  As shown in FIG. 5, the lead-out wiring 91 has a long side parallel portion 91 a, a short side parallel portion 91 b, and a long side parallel from the connection portion with the first sensor electrode array 71 toward the connection portion with the terminal portion 93. It has a portion 91c and a short side parallel portion 91d, and the lead-out wiring 92 has a short side parallel portion 92a and a long side parallel from the connecting portion with the second sensor electrode array 81 toward the connecting portion with the terminal portion 93. It has a portion 92b and a short side parallel portion 92c. In this example, in order to eliminate the drop of the doctor blade into the concave portion of the gravure plate, the long short side parallel portion 91b of the lead-out wiring 91 is configured by a wavy line.

  FIG. 7 shows a state in which the short side parallel portions 91b of the lead wires 91 arranged in a large number are formed by wavy lines, and FIG. 8 shows the short side parallel portions 91b to the long side parallel portions 91c of the lead wires 91. The transition part is shown. In this example, the short long side parallel portion 91a, which is the connection portion of the lead wire 91 with the first sensor electrode row 71, is a mesh that obliquely crosses both the X direction and the Y direction as shown in FIG. As a whole, it is formed wide.

  As described above, in this example, the long short side parallel portion 91b of the lead-out wiring 91 is constituted by a wavy line. The long side parallel portion 91c of the lead wiring 91 and the long side parallel portion 92b of the lead wiring 92 are configured by normal straight lines. Although the short side parallel portion 91d of the lead wiring 91 and the short short side parallel portions 92a and 92c of the lead wiring 92 are not shown in detail, in this example, like the long side parallel portion 91a of the lead wiring 91, a mesh is used. As a whole, it is formed wide.

  In this way, the long short side parallel portion 91b of the lead-out wiring 91 is constituted by wavy lines, and the conductive ink is filled by squeezing in a direction orthogonal to the extending direction of the wavy lines (X direction) by a doctor blade installed in the Y direction. Thereby, it is possible to prevent the doctor blade from dropping into the concave portion of the gravure plate, and it is possible to eliminate the occurrence of printing defects due to the doctor blade being dropped or caught.

  FIG. 9A shows a wavy line shape applied to a wiring pattern. A wiring pattern 100 forming a wavy line has a wavy line composed of a triangular wave.

  The short side parallel portion 91b of the lead wiring 91 constituted by wavy lines as shown in FIG. 9A, the long side parallel portion 91c of the lead wiring 91 constituted by straight lines, and the long side parallel portion 92b of the lead wiring 92 are, for example, mesh wiring and When the same line width is used, the resistance value of the wiring pattern becomes too high, and the risk of disconnection is great. Therefore, as described above, the conductive ink tends to remain on the blanket, and in order to prevent the occurrence of printing defects due to the conductive ink remaining on the blanket, the concave portion of the gravure plate that defines the short side parallel portion 91b of the lead-out wiring 91 And a convex part is formed in the recessed part of the gravure plate which demarcates the long side parallel parts 91c and 92b of the extraction wirings 91 and 92, respectively.

  FIG. 10A shows a state in which the convex portion 33 is formed in the concave portion 31 ′ having a triangular wave wavy shape of the gravure plate 30 ′, and the convex portion 33 is arranged on the center line in the width direction of the concave portion 31 ′. One line is formed. The convex portion 33 has a square top surface 33a like the convex portion 32 shown in FIG. 2A described above, and the top surface 33a is located on the same plane as the upper surface 30'a of the gravure plate 30 '.

  FIG. 10B shows a state in which the convex portion 33 is arranged while being shifted in the squeezing direction of the doctor blade. In the configuration shown in FIGS. 10A and 10B, the convex portion 33 is disposed so as to be separated from both side surfaces of the concave portion 31 '.

  When the wavy line of the wiring pattern forming the wavy line is a triangular wave as shown in FIG. 9A, the printed wiring pattern 100 is likely to have a shape defect as shown in FIG. 9B. That is, the tailing of the conductive ink marked with a may occur from the folded portion (corner) of the triangular wave located on the front side with respect to the squeezing direction, and the bleeding of the conductive ink marked with b may occur in the folded portion of the triangular wave. May occur.

  Reducing the amount of conductive ink by forming the convex portion 33 in the concave portion 31 ′ of the gravure plate 30 ′ is effective in preventing tailing a and bleeding b as shown in FIG. 9B. The convex portion 33 is preferably formed so as to be located at the folded portion of the wavy line, and is preferably formed so as to be shifted in the squeezing direction as shown in FIG. 10B.

  In addition, a convex portion 32 is formed in the concave portion of the gravure plate that defines the long side parallel portions 91c and 92b of the lead wires 91 and 92 constituted by straight lines, similarly to the concave portion 31 of the gravure plate 30 shown in FIG. To do.

  Although the embodiments of the present invention have been described above, the height of the convex portion formed on the bottom surface of the concave portion that defines the wiring pattern of the gravure plate may be less than the height reaching the upper surface of the gravure plate. Moreover, the shape (planar shape) of the top surface of the convex portion is not limited to a square, and may be any shape. Furthermore, when the wiring pattern is a wavy line shape, the wavy line shape is not limited to a triangular wave, and may be a wavy line shape made of a curve such as a sine wave, and if it is short enough to prevent the doctor blade from dropping, For example, a wavy line shape such as a trapezoidal wave including a line segment element parallel to the extending direction of the wavy line may be used.

DESCRIPTION OF SYMBOLS 10 Gravure offset printing machine 11 Alignment camera 12 Base material 13 1st intaglio 14 Doctor 15 Blanket cylinder 16 Blanket 17 2nd intaglio 18 Doctor 21 Gravure cylinder 22 Gravure plate 22a Concave 23 Dispenser 24 Ink 25 Doctor blade 26 Blanket cylinder 27 Blanket 28 Substrate 30, 30 ′ Gravure plate 30 a, 30 ′ Upper surface 31, 31 ′ Concavity 32 Convex portion 32 a Top surface 33 Convex portion 33 a Top surface 41 Base material 42 Wiring pattern 42 a Depression 50 Transparent substrate 60 Sensor region 61 Long side 62 Short side 71 First sensor electrode row 72 Island electrode 73 Connecting portion 81 Second sensor electrode row 82 Island electrode 83 Connecting portion 91 Lead wire 91a, 91c Long side parallel portion 91b, 91d Short side parallel portion 92 Lead wire 92a, 92c Short side flat Row portion 92b Long side parallel portion 93 Terminal portion 94 Ground wiring 100 Wiring pattern

Claims (15)

A wiring pattern forming method for forming a wiring pattern on the substrate by transferring the conductive ink filled in the concave portion of the gravure plate to a blanket, transferring the conductive ink transferred to the blanket to the substrate and curing the conductive ink Because
A method for forming a wiring pattern, wherein a convex portion for reducing the volume of the concave portion is formed on a bottom surface of the concave portion. In the formation method of the wiring pattern according to claim 1,
The method of forming a wiring pattern, wherein the top surface of the convex portion is located on the same plane as the top surface of the gravure plate. In the formation method of the wiring pattern according to claim 1,
The method for forming a wiring pattern, wherein the convex portion has a height less than a height reaching the upper surface of the gravure plate. In the formation method of the wiring pattern in any one of Claims 1 thru | or 3,
The convex portion is formed so that there is one in the width direction of the concave portion corresponding to the width direction of the wiring pattern, and there are a plurality in the longitudinal direction of the concave portion corresponding to the longitudinal direction of the wiring pattern. A method for forming a wiring pattern, wherein: In the formation method of the wiring pattern in any one of Claims 1 thru | or 4,
The wiring pattern has a wavy line shape, and the convex part is formed in the concave part corresponding to the folded part of the wavy line.   An electronic device production method using the wiring pattern forming method according to claim 1. A printed wiring in which a wiring pattern made of a conductive ink film cured on a substrate is formed,
The wiring pattern is formed so that one space without the film exists in the width direction of the wiring pattern and one or more spaces exist in the longitudinal direction of the wiring pattern. Printed wiring. The printed wiring according to claim 7, wherein
The printed wiring, wherein the wiring pattern has a wavy line shape, and the space exists at a folded portion of the wavy line. A printed wiring in which a wiring pattern made of a conductive ink film cured on a substrate is formed,
The printed wiring, wherein the upper surface of the wiring pattern is formed such that one depression exists in the width direction of the wiring pattern and a plurality of depressions exist in the longitudinal direction of the wiring pattern.   An electronic device comprising the printed wiring according to claim 7. A gravure plate in which a recess that defines a wiring pattern of printed wiring is formed,
A gravure plate, wherein a convex portion for reducing the volume of the concave portion is formed on the bottom surface of the concave portion. In the gravure plate according to claim 11,
The top surface of the convex part is located in the same plane as the top surface of the gravure plate. In the gravure plate according to claim 11,
The gravure plate, wherein the convex portion has a height less than a height reaching the upper surface of the gravure plate. The gravure plate according to any one of claims 11 to 13,
The convex portion is formed so that there is one in the width direction of the concave portion corresponding to the width direction of the wiring pattern, and there are a plurality in the longitudinal direction of the concave portion corresponding to the longitudinal direction of the wiring pattern. A gravure version characterized by The gravure plate according to any one of claims 11 to 14,
The gravure plate, wherein the wiring pattern has a wavy line shape, and the convex part is formed in a part of the concave part corresponding to the folded part of the wavy line.

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