JP2017155160A - Film-shaped resin composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a film-shaped resin composition that satisfies requisite characteristics of NCF (Non Conductive Film), can suppress voids after packaging, and has improved moisture absorption reflow resistance.SOLUTION: A film-shaped resin composition includes (A) a (meth)acrylate compound, (B) a styrene-acrylic acid copolymer that has an acid value of 100 mgKOH/g or larger and is a solid at room temperature, (c) an aminophenol type epoxy resin, (D) an organic peroxide, (E) a silica filler, (F) a compound having a flux function, and (G) a silane coupling agent. The film-shaped resin composition in which the compound having the flux function of the (F) component is 8-quinolinol. Further, the film-shaped resin composition containing (H) a methyl acrylate macromer.SELECTED DRAWING: None

Description

  The present invention relates to a film-like resin composition used as NCF (Non Conductive Film) at the time of semiconductor mounting.

2. Description of the Related Art Conventionally, in semiconductor mounting, a surface on which an IC (Integrated Circuit) chip electrode (bump) is formed and a surface on which a substrate electrode (electrode pad) is formed face each other. A flip chip method is used in which the electrode pads are electrically connected to each other.
In this flip chip method, in order to protect the connection part between the electrodes from the outside and relieve the stress caused by the difference in the coefficient of linear expansion between the IC chip and the substrate, it is usually a liquid called an underfill agent after the electrodes are connected. The thermosetting adhesive is poured between the semiconductor chip and the substrate and cured.

In recent years, miniaturization of IC chips is rapidly progressing. As a result, the pitch between adjacent electrodes and the gap between the semiconductor chip and the substrate tend to become narrower. For this reason, when the underfill agent is poured between the IC chip and the substrate using the capillary phenomenon, problems such as generation of voids or a long time for pouring the underfill agent occur.
For this reason, a liquid adhesive called NCP (Non Conductive Paste) or a film-like adhesive called NCF (Non Conductive Film) is applied or pasted to the substrate in advance, and then by a Philip chip bonder, etc. A so-called first-in method has been attempted in which a resin is cured by thermal compression bonding (TCB) to connect the bumps of the IC chip and the electrode pads of the substrate (see Patent Document 1).

As the characteristics required for NCF, it is required to be void-free and have excellent electrical connectivity and reliability. In addition, since it is shipped in roll form, resistance to bending is required to ensure handling. In addition, if the resistance to bending is insufficient, there is a risk of chipping or burring in the NCF during the dicing process, resulting in poor mounting.
When positioning at the start of work, the recognition mark on the wafer or the substrate is confirmed via the NCF affixed on the wafer or the like, so that excellent transparency is required.
Furthermore, it is required to improve moisture absorption reflow resistance after mounting by the TCB process.

Japanese Patent Application Laid-Open No. 2015-503220

  The present invention provides a film-like resin composition that satisfies the above-mentioned required characteristics of NCF and has improved anti-moisture reflow resistance after mounting by the TCB process in order to solve the above-described problems in the prior art. With the goal.

In order to achieve the above object, the present invention provides (A) (meth) acrylate compound,
(B) a styrene acrylic acid copolymer that is solid at room temperature with an acid value of 100 mgKOH / g or more,
(C) aminophenol type epoxy resin,
(D) an organic peroxide,
(E) silica filler,
(F) a compound having a flux function, and
(G) A film-shaped resin composition containing a silane coupling agent is provided.

  The film-like resin composition of the present invention may contain 4 to 15 parts by mass of the aminophenol type epoxy resin of the component (C) with respect to 100 parts by mass of the styrene acrylic acid copolymer of the component (B). preferable.

  In the film-like resin composition of the present invention, the organic peroxide of the component (D) is contained in an amount of 0.5 to 4.0 parts by mass with respect to 100 parts by mass of the (meth) acrylate compound of the component (A). It is preferable to do.

  In the film-like resin composition of the present invention, it is preferable that the compound having the flux function of the component (F) is 8-quinolinol.

  The film-like resin composition of the present invention preferably further contains (H) methyl acrylate macromer.

  Moreover, this invention provides the semiconductor device using the film-form resin composition of this invention.

Since the film-like resin composition of the present invention is excellent in transparency, when used as an NCF, a recognition mark on a wafer or a substrate can be confirmed via the NCF attached on the wafer or the like.
Since the film-like resin composition of the present invention is excellent in bending resistance, it is excellent in handling properties when shipped in a roll shape. In addition, when used as an NCF, there is no risk of chipping or burring during the dicing process.
When used as NCF, the film-like resin composition of the present invention is excellent in mountability in the TCB process and has good moisture absorption reflow resistance.

FIG. 1 is a graph showing a TCB temperature profile in an example.

Hereinafter, the present invention will be described in detail.
The film-like resin composition of the present invention contains the following components (A) to (G) as essential components.
(A) (Meth) acrylate Compound The (A) component (meth) acrylate compound is a generic term for acrylate compounds and methacrylate compounds. The (A) component (meth) acrylate compound is a component that contributes to the curing performance of the film when the film-shaped resin composition of the present invention is used as NCF.

The (A) component (meth) acrylate compound is bifunctional or more, that is, an acrylate compound having two or more functional groups, or a methacrylate compound, fast curability, void suppression, crosslinkability, etc. It is preferable for the reason.
Examples of bifunctional or higher acrylate compounds and methacrylate compounds include bifunctional polyester acrylate compounds, polyester methacrylate compounds, polyurethane acrylate compounds, polyurethane methacrylate compounds, epoxy acrylate compounds, epoxy methacrylate compounds, EO adducts of bisphenol A, and bisphenol A. EO adducts methacrylates, 2-acryloyloxyethyl acid phosphate, 2-methacryloyloxyethyl acid phosphate, and other phosphorus (meth) acrylate compounds, neopentyl glycol acrylate, neopentyl glycol dimethacrylate, and other glycols (meth) Acrylate compounds, dimethylol tricyclodecane diacrylate, dimethyl Having a cyclic structure such as tricyclodecane (meth) acrylate compounds, and the like.
The above-mentioned bifunctional or higher acrylate compound and methacrylate compound may be used alone or in combination of two or more.
Among the above-described bifunctional or higher acrylate compounds and methacrylate compounds, a bifunctional polyester acrylate compound is preferable because of its high curing speed and high crosslinking ability.
In addition, the (meth) acrylate compound of the component (A) is monofunctional such as isobornyl (meth) acrylate, tetrahydrofurfill (meth) acrylate, phenoxypolyethylene glycol acrylate, nonylphenol EO adduct acrylate, glycidyl (meth) acrylate, ethyl methacrylate, etc. You may use together (meth) acrylate suitably.

  The content of the (A) component (meth) acrylate compound is preferably 60 to 150 parts by mass, and 70 to 130 parts by mass with respect to 100 parts by mass of the styrene acrylic acid copolymer of the (B) component. It is more preferable.

(B) Styrene acrylic acid copolymer The (B) component styrene acrylic acid copolymer acts as a film-forming agent.
Since the film-like resin composition of the present invention is required to have shape retention at normal temperature and pressure for handling, a film-forming agent that is solid at normal temperature is suitable for imparting the shape retention. Therefore, as the styrene acrylic acid copolymer as the component (B), a solid one at room temperature is used.
Moreover, as a styrene acrylic acid copolymer of (B) component, the moisture absorption reflow resistance of the film-form resin composition of this invention improves by using a thing with an acid value of 100 mgKOH / g or more. When the acid value is less than 100 mgKOH / g, the moisture absorption reflow resistance is insufficient.
As the (B) component styrene acrylic acid copolymer, an acid value of 105 mgKOH / g or more is preferably used.
Regarding the styrene acrylic acid copolymer of component (B), the upper limit of the acid value is not particularly limited, but it is preferable to use a 250 mg KOH / g or less one in terms of availability, and use a 240 mg KOH / g or less one. It is more preferable to use one having a concentration of 230 mgKOH / g or less.
The content of the (B) component styrene acrylic acid copolymer is 50 to 130 masses with respect to 100 mass parts of the (A) component (meth) acrylate compound and the (C) component aminophenol type epoxy resin. Parts, preferably 65 to 120 parts by mass.

(C) Aminophenol type epoxy resin The aminophenol type epoxy resin of component (C) contributes to the improvement of moisture absorption reflow resistance of the film-like resin composition of the present invention. As shown in the examples described later, when an epoxy resin other than the aminophenol type epoxy resin is used, the moisture absorption reflow resistance becomes insufficient.
However, an epoxy resin other than the aminophenol type epoxy resin may be used in combination as long as the properties of the film-like resin composition of the present invention are not impaired. The amount of addition when using an epoxy resin other than the aminophenol type epoxy resin will be described later.

The reason why the hygroscopic reflow resistance of the film-like resin composition of the present invention is improved by using an aminophenol type epoxy resin as the component (C) is as described below.
(B) It is thought that the reactivity with the styrene acrylic acid copolymer of a component is favorable compared with another epoxy compound, and can form a uniform state as hardened | cured material.

  As the aminophenol type epoxy resin of component (C), tetraglycidyldiaminodiphenylmethane, triglycidylaminophenol, triglycidylaminocresol, diglycidylaniline, diglycidyltoluidine are preferable, and triglycidylaminophenol, triglycidylaminocresol are more preferable. Triglycidylaminophenol is more preferable.

  The content of the (C) component aminophenol-type epoxy resin is preferably 4 to 15 parts by mass, and 5 to 12 parts by mass with respect to 100 parts by mass of the styrene acrylic acid copolymer of the (B) component. More preferably. It is preferable to contain.

(D) Organic peroxide The organic peroxide as the component (D) accelerates the reaction of the (meth) acrylate compound as the component (A) during the heat curing of the film-shaped resin composition of the present invention.

Examples of the organic peroxide of component (D) include dicumyl peroxide, di (2-t-butylperoxyisopropyl) benzene, t-butylcumyl peroxide, benzoyl peroxide, and the like.
The above-mentioned organic peroxide may be used alone or in combination of two or more.
Among these, dicumyl peroxide is preferable for reasons such as curability in the TCB process and life stability of the film-like resin composition.

  The content of the organic peroxide as the component (D) is preferably 0.5 to 4.0 parts by weight, and 1 to 3 parts by weight with respect to 100 parts by weight of the (meth) acrylate compound as the component (A). More preferably, it is a part.

(E) Silica filler The silica filler of component (E) is added for the purpose of improving the reliability of the mounted semiconductor package when the film-shaped resin composition of the present invention is used as NCF.

  The average particle diameter of the silica filler as the component (E) is preferably 0.01 to 1 μm for reasons of spreading into a narrow gap and transparency, and more preferably 0.05 to 0.3 μm. Here, the shape of the filler is not particularly limited, and may be any shape such as a spherical shape, an indeterminate shape, and a flake shape. When the shape of the filler is other than spherical, the average particle diameter of the filler means the average maximum diameter of the filler.

  (E) As a silica filler of a component, you may use what was surface-treated with the silane coupling agent etc. When a silica filler that has been subjected to surface treatment is used, an effect of preventing aggregation of the silica filler is expected.

  In the film-shaped resin composition of the present invention, the content of the component (E) is preferably 30 to 65 parts by mass with respect to 100 parts by mass of the total mass of each component of the film-shaped resin composition of the present invention. It is more preferable that it is 35-62 mass parts.

(F) Compound having flux function The compound (F) having the flux function is a component that forms a flux activator when the film-shaped resin composition of the present invention is used as NCF.
When the film-like resin composition of the present invention contains the component (F), it has high electrical connectivity and reliability when used as an NCF.

Examples of the compound (F) having a flux function include 8-quinolinol, malonic acid, succinic acid, maleic acid, glutaric acid, suberic acid, adipic acid, sebacic acid and other carboxylic acids, diphenylguanidine hydrobromic acid, and the like. Examples thereof include salts, cyclohexylamine hydrobromide, diethylamine hydrochloride, triethanolamine hydrobromide, and monoethanolamine hydrobromide.
Among these, 8-quinolinol is preferable for reasons such as flux activity and void suppression.

  In the film-like resin composition of the present invention, the content of the component (F) varies depending on the flux activity, but when 8-quinolinol is used as the component (F), the component (A) (meta) It is preferably 0.1 to 1 part by mass with respect to 100 parts by mass of the total mass of the acrylate compound, the (B) component styrene acrylic acid copolymer, and the (C) component aminophenol-type epoxy resin. More preferably, it is 1 to 0.5 parts by mass.

(G) Silane coupling agent The silane coupling agent of component (G) is added for the purpose of improving adhesion to an IC chip or a substrate when the film-like resin composition of the present invention is used as NCF.
As the silane coupling agent of component (G), various silane coupling agents such as epoxy, amino, vinyl, methacrylic, acrylic, mercapto and the like can be used. Among these, an epoxy silane coupling agent and a methacrylic silane coupling agent are preferable for reasons such as high adhesion.
Specific examples of the epoxy silane coupling agent include 3-glycidoxypropyltrimethoxysilane (trade name: KBM403, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-glycidoxypropyltriethoxysilane (trade name: KBE-403). , Manufactured by Shin-Etsu Chemical Co., Ltd.), 3-glycidoxypropylmethyldiethoxysilane (trade name: KBE-402, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-glycidoxypropylmethyldimethoxysilane (trade name: KBM402, Shin-Etsu Chemical) Etc.).
Specific examples of the methacrylic silane coupling agent include 3-methacryloxypropyltrimethoxysilane (trade name: KBM503, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-methacryloxypropylmethyldimethoxysilane (trade name: KBM502, Shin-Etsu Chemical Co., Ltd.) Company-made), 3-methacryloxypropylmethyldiethoxysilane (trade name: KBE502, manufactured by Shin-Etsu Chemical Co., Ltd.), 3-methacryloxypropyltriethoxysilane (trade name: KBE503, manufactured by Shin-Etsu Chemical Co., Ltd.), and the like. .

  In the film-shaped resin composition of the present invention, the content of the component (G) is 0.2 to 0.6 parts by mass with respect to 100 parts by mass of the total mass of each component of the film-shaped resin composition of the present invention. It is preferable that it is 0.2 to 0.5 part by mass.

  The film-shaped resin composition of this invention may contain the component described below as needed other than the said (A)-(G) component.

(H) Methyl acrylate macromer In the film-shaped resin composition of this invention, you may contain a methyl acrylate macromer as (H) component. By including methyl acrylate macromer as the component (H), the bending resistance of the film-like resin composition of the present invention is improved.
(H) When a methyl acrylate macromer is contained as a component, it is preferable that it is 5-10 mass parts with respect to 100 mass parts of total mass of each component of the film-form resin composition of this invention, 6-10 More preferably, it is part by mass.

(Other ingredients)
The film-shaped resin composition of this invention may further contain components other than the said (A)-(H) component as needed. Specific examples of such components include an epoxy resin curing agent, an epoxy resin curing accelerator, an antifoaming agent, a surface conditioner, a rheology conditioner, a colorant, a plasticizer, a dispersant, an antisettling agent and the like. In addition, elastomers may be included for the purpose of adjusting the elastic modulus and stress of the film-shaped resin composition of the present invention, and other solid resins for the purpose of adjusting the viscosity, toughness, etc. of the film-shaped resin composition of the present invention. May be included. The type and amount of each compounding agent are as usual.

(Production of film-like resin composition)
The film-like resin composition of the present invention can be produced by a conventional method. For example, in the presence or absence of a solvent, when the component (B) is included, the component (H) is further dissolved by stirring, heating and stirring, and then the component (A), the component (C) Add component (G) and other compounding agents to be blended as necessary, add a solvent as appropriate, and disperse and mix with a dispersing device such as a kneader, three rolls, or a ball mill.
The resin composition prepared by the above procedure is diluted with a solvent to form a varnish, which is applied to at least one side of the support and dried, and then from the film-shaped resin composition with the support, or from the support It can be provided as a peeled film-shaped resin composition.

  Examples of the solvent that can be used as the varnish include ketones such as methyl ethyl ketone and methyl isobutyl ketone; aromatic solvents such as toluene and xylene; high-boiling solvents such as dioctyl phthalate and dibutyl phthalate. Although the usage-amount of a solvent is not specifically limited, Although it can be set as the quantity conventionally used, Preferably, it is 20-90 mass% with respect to each component of a resin composition.

  Although a support body is suitably selected by the desired form in the manufacturing method of a film-form resin composition, and it does not specifically limit, For example, carrier films of resin, such as metal foil, such as copper and aluminum, polyester, polyethylene, etc. are mentioned. When the film-shaped resin composition of the present invention is provided in the form of a film peeled from the support, the support is preferably subjected to a release treatment with a release agent such as a silicone compound.

  Although the method of apply | coating a varnish is not specifically limited, For example, a slot die system, a gravure system, a doctor coater system etc. are mentioned, It selects suitably according to the thickness etc. of a desired film. Application | coating is performed so that the thickness of the film formed after drying may turn into desired thickness. Such a thickness can be derived from the solvent content by those skilled in the art.

  The drying conditions are appropriately designed according to the type and amount of the solvent used in the varnish, the amount of varnish used, the thickness of the coating, etc., and are not particularly limited, for example, 60 to 100 ° C., It can be performed under atmospheric pressure.

  Next, the characteristics of the film-like resin composition of the present invention will be described.

  Since the film-like resin composition of the present invention is excellent in transparency, the recognition mark can be confirmed when the visibility evaluation is performed according to the procedure described in Examples described later.

  Since the film-like resin composition of the present invention is excellent in bending resistance, the occurrence of cracks is not observed when the crack resistance evaluation is performed according to the procedure described in Examples described later.

  The film-like resin composition of the present invention is excellent in electrical connectivity and its reliability. Specifically, it is excellent in mountability in the TCB process and has good moisture absorption reflow resistance.

The film-like resin composition of the present invention can be mounted in a short time and has high productivity.
The film-like resin composition of the present invention has a flux effect and is excellent in solder connectivity.

  The film-like resin composition of the present invention is suitable as NCF due to the above-mentioned properties.

Next, the procedure for using the film-like resin composition of the present invention is shown below.
When a semiconductor package is mounted using the film-shaped resin composition of the present invention, the film-shaped resin composition is attached in a desired shape to a position where a semiconductor chip is mounted on a substrate with a laminator or the like.
In addition, after being attached to a wafer on which a semiconductor circuit is formed with a laminator or the like, it can be cut into individual chips with a dicer or the like. Lamination conditions are not particularly limited, but conditions such as heating, pressurization, and reduced pressure can be appropriately combined. In particular, in order to adhere to fine irregularities without defects such as voids, the heating temperature is preferably 40 to 120 ° C., the degree of vacuum is 5 hPa or less, and the pressure is preferably 0.5 MPa or more.
After the film-like resin composition is pasted by lamination or the like, a semiconductor chip is mounted on the chip mounting position on the substrate by heat pressure welding (TCB) using a flip chip bonder or the like. Although the TCB condition is not particularly limited, the TCB condition can be appropriately selected depending on the semiconductor chip size, bump material, number of bumps, and the like.
The heating temperature is preferably 50 to 300 ° C., the time is 1 to 20 seconds, and the pressure is preferably 5 to 450 N.

  The semiconductor device of the present invention is not particularly limited as long as the film-shaped resin composition of the present invention is used when the semiconductor device is manufactured. Specific examples of the semiconductor device of the present invention include a semiconductor device having a flip chip structure. The flip chip has a protruding electrode called a bump, and is connected to an electrode such as a substrate through the electrode. Examples of the bump material include solder, gold, and copper. As a substrate connected to the flip chip, there is a single layer such as FR-4, or a laminated organic substrate, silicon, glass, ceramic, or other inorganic substrate, and gold or tin plating on copper or copper, a solder layer, etc. The formed electrode is used. As a semiconductor device having a flip chip structure, a memory device such as a DRAM (Dynamic Random Access Memory), a processor device such as a CPU (Central Processing Unit) GPU, a light emitting diode (LED) such as a light emitting diode (LED). Examples include a driver IC used for (Liquid Crystal Display) and the like.

  EXAMPLES Hereinafter, although an Example demonstrates this invention in detail, this invention is not limited to these.

(Examples 1-13, Comparative Examples 1-14)
Each raw material was mixed so that it might become a mixture ratio shown in the following table | surface, and it dissolved and disperse | distributed in the solvent so that a mixture might become a 70 wt% density | concentration, and the coating varnish was prepared. As the solvent, a mixed solvent (mass ratio 1: 1) of methyl ethyl ketone and methanol (both manufactured by Wako Pure Chemical Industries, Ltd.) was used.
The coating varnish was applied on a PET (polyethylene terephthalate) film coated with a release agent to a dry thickness of about 35 μm. Thereafter, the release agent-treated PET (polyethylene terephthalate) film coated with the coating varnish was dried in a dryer at 80 ° C. for 10 minutes to remove the solvent, thereby producing a 35 μm thick film. In addition, the numerical value regarding each composition in a table | surface represents the mass part.

The components used when creating the film-shaped resin composition are as follows.
(A) (Meth) acrylate compound Bifunctional polyester acrylate, trade name M7100 (manufactured by Toagosei Co., Ltd.)
(B) Styrene acrylic acid copolymer (B1) Styrene acrylic acid copolymer, trade name UC3080, acid value: 230, Mw: 14000 (manufactured by Toagosei Co., Ltd.)
(B2) Styrene acrylic acid copolymer, trade name UC3920, acid value: 240, Mw: 15500 (manufactured by Toagosei Co., Ltd.)
(B3) Styrene acrylic acid copolymer, trade name UC3910, acid value: 200, Mw: 8500 (manufactured by Toagosei Co., Ltd.)
(B4) Styrene acrylic acid copolymer, trade name UC3900, acid value: 108, Mw: 4600 (manufactured by Toagosei Co., Ltd.)
Note that (B1) to (B4) are all solid at room temperature.
(B ′) Long chain alkyl group-containing styrene acrylic acid copolymer, trade name UF5022, acid value: 75, Mw: 14000 (manufactured by Toagosei Co., Ltd.)
(C) Aminophenol type epoxy resin, trade name 630 (manufactured by Mitsubishi Chemical Corporation)
(C'1) Naphthalene type epoxy resin, trade name HP4032D (manufactured by DIC Corporation)
(C'2) Bisphenol F type epoxy resin, trade name EXA-830CRP (manufactured by DIC Corporation)
(C'3) Bisphenol A type epoxy resin, trade name EXA-850CRP (manufactured by DIC Corporation)
(D) Organic peroxide dicumyl peroxide, trade name Percumyl D (manufactured by NOF Corporation)
(E) Silica filler Product name Sciqas (manufactured by Sakai Chemical Industry Co., Ltd.), average particle size 0.1 μm
(F) Compound having flux function 8-quinolinol, manufactured by Sigma-Aldrich Japan GK (G) silane coupling agent (G1) 3-glycidoxypropyltrimethoxysilane, trade name KBM403 (manufactured by Shin-Etsu Chemical Co., Ltd.)
(G2) 3-Methacryloxypropyltrimethoxysilane, trade name KBM503 (manufactured by Shin-Etsu Chemical Co., Ltd.)
(H) Methyl acrylate macromer Product name AA-6 (Negami Kogyo Co., Ltd.)

The following evaluation was implemented using the film produced in the above procedure.
(Film characteristics)
Visibility: A film formed on PET is cut with a film cutter at 7.5 mm □, and a vacuum pressure laminator (Co., Ltd.) is formed on a simulated substrate in which cross-shaped marks are formed at two diagonal corners. Lamination was performed using a trade name MLP500 / 600 manufactured by Meiki Seisakusho. The pasting conditions are described below.
Degree of vacuum: 1 hPa or less Temperature: 70 ° C
Pressurization: 0.8 MPa
Time: 300sec
Thereafter, the PET film was peeled off and observed using a flip chip bonder (trade name FCB3, manufactured by Panasonic Factory Solutions Co., Ltd.).
Flexibility: The film formed on PET was bent 180 degrees to check whether or not a crack was generated.

(Mountability evaluation (initial))
The film produced by the above procedure was used as NCF, and a test chip was mounted on the substrate by the following procedure.
The used substrate is an organic substrate having a size of 187.5 mm × 64.0 × 0.36 mm (t), and the surface is subjected to OSP (Organic Solderability Preservative) treatment using Cu as an electrode material (hereinafter referred to as Cu / OSP substrate). It is said).
The test chip has a size of 7.3 mm × 7.3 mm × 0.125 mm (t), and 544 bumps each having a solder layer formed on a 30 μm × 30 μm × 30 μm Cu pillar are provided.
The film produced by the above procedure is cut into 7.5 mm □, placed on the test chip mounting position, and laminated under the following conditions using a vacuum pressure laminator (trade name: MLP500 / 600, manufactured by Meiki Seisakusho Co., Ltd.). did.
Degree of vacuum: 1 hPa or less Temperature: 70 ° C
Pressurization: 0.8 MPa
Time: 300sec
After laminating, the test chip and the organic substrate were heated and pressed (TCB) using a flip chip bonder (trade name FCB3, manufactured by Panasonic Factory Solutions Co., Ltd.).
The stage temperature of the flip chip bonder was set to 80 ° C. and the load was set to 40 N, and the TCB temperature profile shown in FIG. 1 was set. For the TCB profile, a thermocouple (50 μmφ) was inserted between the test chip and the organic substrate, and the measured temperature history was used. After TCB, the test piece was heated at 165 ° C. for 2 hours to obtain a test piece. Thus, the test piece for mountability evaluation was produced 3 each, and the following evaluation was implemented.
SAT Observation The produced test piece was observed by a reflection method using an ultrasonic flaw detector (Scanning Acoustic Tomography, SAT). A product with a white shadow on the image was regarded as a defective product. The description in the table indicates the number of defective samples / number of measurement samples (the same applies hereinafter).
Resistance value The resistance value of the produced three test pieces was measured using a resistance value measuring pad provided on the substrate. If even one sample failed, the connection state was marked as x. It measured with the resistance value measurement pad. What showed the resistance value of 28-32 (ohm) was made into the pass, and what showed the resistance value outside said range was made into the inferior goods.

(Mountability evaluation (moisture absorption reflow))
The test piece prepared by the above procedure was left for 168 hours under the condition of 85 ° C./60% RH (JEDEC level 2 moisture absorption condition). After that, it was passed through a reflow furnace having a maximum temperature of 260 ° C. three times. After the moisture absorption reflow, the SAT observation and the resistance value were measured in the same procedure as described above.

Examples 1 to 12 all had good film properties (visibility and flexibility). Moreover, the evaluation of the mountability of the test piece produced by the above procedure was good both in the initial stage of production and after moisture absorption reflow. In addition, Examples 1-9, 11, and 12 are Examples which used the methyl acrylate macromer of (H) component. Example 10 is an example in which the (H) component methyl acrylate macromer was not used. Examples 2-4 are the examples which used the styrene acrylic acid copolymer from which an acid value differs as (B) component. Examples 5 and 6 are examples in which the silica coupling agent of the component (G) was changed. Examples 7 and 8 are examples in which an epoxy resin other than the aminophenol type epoxy resin of component (C) is used in combination. Example 9 is an example in which the content of the compound having the flux function of the component (F) was changed. Examples 11 and 12 are examples in which the blending ratio of each component was changed.
Comparative Example 1 is an example in which a styrene acrylic acid copolymer having an acid value of less than 100 mgKOH / g was used as the component (B ′), SAT observation after moisture absorption reflow, and resistance values of all three test pieces were defective. became. Comparative Example 2 is an example that does not contain the component (G) silane coupling agent, and among the three test pieces at the initial stage of mounting, SAT observation was defective with two test pieces. Therefore, evaluation after moisture absorption reflow was not carried out. Comparative Examples 3 to 5 are examples in which an epoxy resin other than the aminophenol type was used, and the SAT observation after the moisture absorption reflow and the resistance values were all inferior. The comparative example 6 is an example which does not contain the compound which has the flux function of (F) component, and resistance value became inferior goods by all the three test pieces of the mounting initial stage. Therefore, evaluation after moisture absorption reflow was not carried out. The comparative example 7 is an example which does not contain the styrene acrylic acid copolymer of the component (B), and the SAT observation after the moisture absorption reflow and the resistance value were all inferior products. The comparative example 8 is an example which does not contain the silica filler of the component (E), and the SAT observation was a defective product in all three test pieces at the initial stage of mounting. Therefore, evaluation after moisture absorption reflow was not carried out.

Claims (6)

(A) (meth) acrylate compound,
(B) a styrene acrylic acid copolymer that is solid at room temperature with an acid value of 100 mgKOH / g or more,
(C) aminophenol type epoxy resin,
(D) an organic peroxide,
(E) silica filler,
(F) a compound having a flux function, and
(G) A film-shaped resin composition containing a silane coupling agent.   The film-form resin composition of Claim 1 which contains 4-15 mass parts of aminophenol type epoxy resins of the said (C) component with respect to 100 mass parts of styrene-acrylic acid copolymers of the said (B) component. .   The organic peroxide of the said (D) component is contained 0.5-4.0 mass parts with respect to the (meth) acrylate compound of the said (A) component and 100 mass parts, The claim 1 or 2 Film-like resin composition.   The film-shaped resin composition in any one of Claims 1-3 whose compound which has the flux function of the said (F) component is 8-quinolinol.   Furthermore, the film-form resin composition in any one of Claims 1-4 containing (H) methyl acrylate macromer.   The semiconductor device using the film-form resin composition in any one of Claims 1-5.