JP2017154901A5 - - Google Patents
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- JP2017154901A5 JP2017154901A5 JP2016036629A JP2016036629A JP2017154901A5 JP 2017154901 A5 JP2017154901 A5 JP 2017154901A5 JP 2016036629 A JP2016036629 A JP 2016036629A JP 2016036629 A JP2016036629 A JP 2016036629A JP 2017154901 A5 JP2017154901 A5 JP 2017154901A5
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- single crystal
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- 238000005259 measurement Methods 0.000 claims description 28
- 230000004927 fusion Effects 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 3
- 235000019557 luminance Nutrition 0.000 claims 13
- 238000004519 manufacturing process Methods 0.000 claims 7
- 239000000155 melt Substances 0.000 claims 5
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 description 2
Description
本発明において、前記カメラの撮影画像は、前記単結晶の引き上げ軸方向と直交する方向を行方向とし、前記引き上げ軸方向と平行な方向を列方向とする二次元画像であり、前記直径計測処理は、前記フュージョンリングと交差し且つ前記行方向に延びる少なくとも一本の測定ラインを前記直径計測領域に設定し、前記フュージョンリングと前記測定ラインとの交点の位置から前記単結晶の直径を求めることが好ましい。この方法によれば、撮影画像中のフュージョンリングから単結晶の直径を正確かつ容易に求めることができる。
In the present invention, the captured image of the camera is a two-dimensional image in which a direction orthogonal to the pulling axis direction of the single crystal is a row direction and a direction parallel to the pulling axis direction is a column direction, and the diameter measurement process Set at least one measurement line that intersects with the fusion ring and extends in the row direction in the diameter measurement region, and obtains the diameter of the single crystal from the position of the intersection of the fusion ring and the measurement line. Is preferred. According to this method, the diameter of the single crystal can be accurately and easily obtained from the fusion ring in the photographed image.
次に、測定ラインL1とフュージョンリング4との2つの交点D1、D1'を検出する。フュージョンリング4と第1の測定ラインL1との一方の交点D1の座標を(x1,y1)とし、他方の交点D1'の座標を(x 1 ',y 1 )とする。フュージョンリング4と測定ラインL1との交点D1、D1'の概略位置は、測定ラインL1上の輝度ピークの位置である。フュージョンリング4と測定ラインL1との交点D1、D1'の詳細位置については後述する。
Next, two intersections D 1 and D 1 ′ between the measurement line L 1 and the fusion ring 4 are detected. The coordinates of one intersection D 1 of the fusion ring 4 and the first measurement line L 1 are (x 1 , y 1 ), and the coordinates of the other intersection D 1 ′ are (x 1 ′, y 1 ) . The approximate positions of the intersections D 1 and D 1 ′ between the fusion ring 4 and the measurement line L 1 are the positions of the luminance peaks on the measurement line L 1 . Detailed positions of the intersection points D 1 and D 1 ′ between the fusion ring 4 and the measurement line L 1 will be described later.
図8に示すように、この設定方法では、最高輝度の列方向の分布101から閾値H以下の最高輝度を持つ行に測定ラインL1を設定する。具体的には、類似輝度がある範囲以上存在している画素の輝度を固液界面部の輝度Piとし、固液界面部の輝度Piを同一画素列内の最高輝度Pmと比較し、固液界面部の輝度Piと最高輝度Pmと輝度差が閾値H以下となるX軸方向の画素列を直径計測対象領域とする。図7のように最高輝度の最小値P1を持つ行に測定ラインを設定する場合にはその一行にしか測定ラインを設定することができないので、画像処理上の制約が大きく、また複数の測定ラインを設定することもできない。しかし閾値H以下であればどこでもよいとする場合には、測定ラインの設定範囲に多少の幅を持たせることができ、測定ラインの設定位置の自由度を高めることができる。また撮影画像中に2本以上の測定ラインを設定することも可能である。
As shown in FIG. 8, in this setting method, setting the measurement line L 1 from the column direction of the distributions 101 brightest in the row with the highest luminance than the threshold H. Specifically, the luminance of a pixel having similar luminance above a certain range is set as the luminance Pi of the solid-liquid interface, and the luminance Pi of the solid-liquid interface is compared with the maximum luminance Pm in the same pixel column. A pixel column in the X-axis direction in which the luminance difference between the luminance Pi of the interface portion, the maximum luminance Pm, and the luminance is equal to or less than the threshold value H is set as a diameter measurement target region. Because can only set the measurement line on the line when configuring the measurement line to the line having the minimum value P 1 of the highest luminance as shown in FIG. 7, the image processing constraints is large, a plurality of measurement The line cannot be set. However, if it can be anywhere as long as it is less than or equal to the threshold value H, the setting range of the measurement line can be given a little width, and the degree of freedom of the setting position of the measurement line can be increased. It is also possible to set two or more measurement lines in the captured image.
Claims (8)
前記直径計測処理は、
前記フュージョンリングと交差し且つ前記行方向に延びる少なくとも一本の測定ラインを前記直径計測領域に設定し、
前記フュージョンリングと前記測定ラインとの交点の位置から前記単結晶の直径を求める、請求項1に記載の単結晶の製造方法。 The photographed image of the camera is a two-dimensional image having a direction perpendicular to the pulling axis direction of the single crystal as a row direction and a direction parallel to the pulling axis direction as a column direction,
The diameter measurement process
Setting at least one measurement line intersecting the fusion ring and extending in the row direction in the diameter measurement region;
The method for producing a single crystal according to claim 1, wherein a diameter of the single crystal is obtained from a position of an intersection between the fusion ring and the measurement line.
前記融液を加熱するヒーターと、
前記融液から単結晶を引き上げる引き上げ軸と、
前記ルツボの上下方向の位置を制御するルツボ昇降機構と、
前記単結晶と前記融液との境界部の画像を撮影するカメラと、
前記カメラで撮影した画像を処理する画像処理部と、
前記ヒーター、前記引き上げ軸および前記ルツボ昇降機構を制御する制御部とを備え、
前記画像処理部は、
前記境界部に現れるフュージョンリングの周方向の最高輝度分布の少なくとも最大値よりも小さい値を閾値として設定し、前記最高輝度分布において最高輝度が閾値以下となる領域を直径計測領域として指定して、引き上げられている単結晶の直径計測処理を行うことを特徴とする単結晶製造装置。 A crucible supporting the melt,
A heater for heating the melt;
A pulling shaft for pulling up the single crystal from the melt;
A crucible lifting mechanism for controlling the vertical position of the crucible;
A camera that captures an image of the boundary between the single crystal and the melt;
An image processing unit for processing an image captured by the camera;
A control unit for controlling the heater, the lifting shaft and the crucible lifting mechanism;
The image processing unit
A value smaller than at least the maximum value of the maximum luminance distribution in the circumferential direction of the fusion ring appearing in the boundary portion is set as a threshold, and a region where the maximum luminance is equal to or less than the threshold in the maximum luminance distribution is designated as a diameter measurement region, An apparatus for producing a single crystal, which performs a diameter measuring process of the pulled single crystal.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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JP2016036629A JP6447537B2 (en) | 2016-02-29 | 2016-02-29 | Single crystal manufacturing method and manufacturing apparatus |
TW105136099A TWI615513B (en) | 2016-02-29 | 2016-11-07 | Single crystal manufacturing method and device |
CN201710111932.7A CN107130290B (en) | 2016-02-29 | 2017-02-28 | The manufacturing method and manufacturing device of monocrystalline |
Applications Claiming Priority (1)
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JP2016036629A JP6447537B2 (en) | 2016-02-29 | 2016-02-29 | Single crystal manufacturing method and manufacturing apparatus |
Publications (3)
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JP2017154901A JP2017154901A (en) | 2017-09-07 |
JP2017154901A5 true JP2017154901A5 (en) | 2018-05-10 |
JP6447537B2 JP6447537B2 (en) | 2019-01-09 |
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JP2016036629A Active JP6447537B2 (en) | 2016-02-29 | 2016-02-29 | Single crystal manufacturing method and manufacturing apparatus |
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JP (1) | JP6447537B2 (en) |
CN (1) | CN107130290B (en) |
TW (1) | TWI615513B (en) |
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CN107818559B (en) * | 2017-09-22 | 2021-08-20 | 太原理工大学 | Crystal inoculation state detection method and crystal inoculation state image acquisition device |
JP6885301B2 (en) * | 2017-11-07 | 2021-06-09 | 株式会社Sumco | Single crystal manufacturing method and equipment |
US20230023541A1 (en) * | 2019-12-18 | 2023-01-26 | Sumco Corporation | System and method for producing single crystal |
TWI770661B (en) * | 2020-04-20 | 2022-07-11 | 日商Sumco股份有限公司 | Single crystal manufacturing apparatus and single crystal manufacturing method |
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FI911856A (en) * | 1990-04-27 | 1991-10-28 | Nippon Kokan Kk | OVER APPARATUS FOR THE CONDITIONING OF A DIAMETER HOS EN ENSKILD SILIKONKRISTALL. |
JP3484758B2 (en) * | 1994-05-17 | 2004-01-06 | 三菱住友シリコン株式会社 | Crystal growth apparatus and crystal growth method |
US5922127A (en) * | 1997-09-30 | 1999-07-13 | Memc Electronic Materials, Inc. | Heat shield for crystal puller |
JP4089500B2 (en) * | 2003-05-06 | 2008-05-28 | 株式会社Sumco | Method for measuring the position of the melt in the single crystal pulling device |
JP4918897B2 (en) * | 2007-08-29 | 2012-04-18 | 株式会社Sumco | Silicon single crystal pulling method |
TWI411709B (en) * | 2009-03-27 | 2013-10-11 | Sumco Corp | Method for controlling diameter of single crystal |
JP5678635B2 (en) * | 2010-12-13 | 2015-03-04 | 株式会社Sumco | Silicon single crystal manufacturing apparatus and silicon single crystal manufacturing method |
JP5664573B2 (en) * | 2012-02-21 | 2015-02-04 | 信越半導体株式会社 | Method for calculating height position of silicon melt surface, method for pulling silicon single crystal, and silicon single crystal pulling apparatus |
JP6078974B2 (en) * | 2012-04-04 | 2017-02-15 | 株式会社Sumco | Method for producing silicon single crystal |
JP5924090B2 (en) * | 2012-04-12 | 2016-05-25 | 株式会社Sumco | Single crystal pulling method |
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2016
- 2016-02-29 JP JP2016036629A patent/JP6447537B2/en active Active
- 2016-11-07 TW TW105136099A patent/TWI615513B/en active
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2017
- 2017-02-28 CN CN201710111932.7A patent/CN107130290B/en active Active
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