JP2017135594A - Piezoelectric component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high-precision resonator that suppresses a ripple within a band of main vibration which may case precision of oscillation frequency to decrease.SOLUTION: The present invention comprises: a support substrate 1 having a first terminal electrode 11 and a second terminal electrode 12; a rectangular parallelepiped piezoelectric element 2 having a first excitation electrode 21 which extends from one end to the other end in a longer direction and a second excitation electrode 22 which extends from the other end to the one end in the longer direction; a first conductive joining material 31 electrically connecting the first terminal electrode 11 and first excitation electrode 21 to each other; and a second conductive joining material 32 electrically connecting the second terminal electrode 12 and second excitation electrode 22 to each other. The first conductive joining material 31 and second conductive joining material 32 are provided lower surfaces of the one end and the other end of the piezoelectric element 2 to upper surfaces through side faces, there being a region in which an interval between the first conductive joining material 31 and second conductive joining material 32 on an upper surface of the piezoelectric element 2 differ when viewed over the width direction.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a piezoelectric component that is suitably used as, for example, a resonator.

  A piezoelectric component as a resonator is generally composed of a support substrate, a piezoelectric element, a pair of support portions on which the piezoelectric element is mounted, a conductive bonding material, and a lid. The piezoelectric element is electrically connected to a support portion formed on one main surface of the support substrate via a conductive bonding material. In the resonator, it is important to suppress the ripple in order to stabilize the oscillation frequency, and it is known that, for example, the dimension of the piezoelectric element and the dimension of the electrode formed on the piezoelectric element are adjusted in order to suppress the ripple ( For example, see Patent Document 1).

Japanese Patent Laid-Open No. 7-226647

  However, ripple is a phenomenon in which high-order vibrations of various types of vibration such as length vibration, width vibration, and spread vibration existing in the low frequency region appear within the main vibration (thickness vibration) band used for oscillation characteristics. For this reason, ripples may occur even when the above design value is controlled.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a high-accuracy piezoelectric component that suppresses ripples in the main vibration band, which causes a decrease in the accuracy of the oscillation frequency.

  The piezoelectric component of the present invention includes a support substrate having a first electrode and a second electrode, a first excitation electrode provided on the upper surface and extending from one end to the other end in the longitudinal direction, and a lower surface. And a second excitation electrode extending from the other end in the longitudinal direction toward the one end, and a rectangular parallelepiped piezoelectric element having both ends in the longitudinal direction fixed to the support substrate, A first conductive bonding material that electrically connects the first electrode and the first excitation electrode; and a second conductive bonding material that electrically connects the second electrode and the second excitation electrode; The first conductive bonding material and the second conductive bonding material are provided from one lower end of the piezoelectric element and from the lower surface to the upper surface of the other end portion, and the first conductive bonding material and the second conductive bonding material on the upper surface of the piezoelectric element. Conductive bonding material and second conductive Distance between coupling member, characterized in that it has a different site when viewed over the width direction perpendicular to the longitudinal direction.

  According to the piezoelectric component of the present invention, the ripple can be shifted out of the main vibration band using the oscillation characteristics. Moreover, the peak valley of the ripple generated in the main vibration band can be reduced by the dispersion of resonance, and the phase distortion in the band can be suppressed. Therefore, the oscillation characteristics can be stabilized.

(A) is a schematic plan view which shows an example of the piezoelectric component of this embodiment, (b) is a schematic sectional drawing which cut | disconnected the piezoelectric component shown to (a) by the AA line. It is a schematic plan view which shows the other example of the piezoelectric component of this embodiment. It is a schematic side view which shows the other example of the piezoelectric component of this embodiment. (A) is a schematic left view which shows the other example of the piezoelectric component of this embodiment, (b) is a schematic right view of the piezoelectric component shown to (a).

  Hereinafter, an example of the piezoelectric component of the present embodiment will be described in detail with reference to the accompanying drawings. In addition, this invention is not limited by embodiment shown below.

  FIG. 1A is a schematic plan view showing an example of the piezoelectric component of the present embodiment, and FIG. 1B is a schematic cross-sectional view of the piezoelectric component shown in FIG. 1A taken along line AA. The piezoelectric component of the example shown in FIG. 1 is provided with a support substrate 1 having a first electrode 11 and a second electrode 12 and a first excitation provided on the upper surface and extending from one end to the other end in the longitudinal direction. A rectangular parallelepiped shape having an electrode 21 and a second excitation electrode 22 provided on the lower surface and extending from the other end portion to the one end portion in the longitudinal direction and having both end portions in the longitudinal direction fixed to the support substrate 1 The piezoelectric element 2, the first conductive bonding material 31 that electrically connects the first electrode 11 and the first excitation electrode 21, and the second conductivity that electrically connects the second electrode 12 and the second excitation electrode 22. The first conductive bonding material 31 and the second conductive bonding material 32 are provided from one end of the piezoelectric element 2 to the upper surface through the end surface from the lower surface of the other end portion. The first conductive joint on the upper surface of the piezoelectric element 2 31 and the interval between the second conductive bonding material 32 has a different site when viewed over the width direction perpendicular to the longitudinal direction.

  The support substrate 1 is, for example, a dielectric that serves as a substrate body formed as a rectangular flat plate having a length of 2.5 mm to 7.5 mm, a width of 1.0 mm to 3.0 mm, and a thickness of 0.1 mm to 1 mm. 13 is included. As the dielectric 13, a ceramic material such as alumina or barium titanate, and a resin-based material such as glass epoxy can be used.

  A first electrode 11 and a second electrode 12 are provided on the first surface (upper surface in this example) of the dielectric 13 constituting the support substrate 1. The first electrode 11 and the second electrode 12 have first regions 111 and 121 and second regions 112 and 122, respectively. The first regions 111 and 121 are excitation electrodes (first excitation electrodes) of the piezoelectric element 2. 21 and the second excitation electrode 22) and the second regions 112 and 122 form a capacitance with the ground electrode 15 described later. The first electrode 111 is disposed so that the first region 111 extends in the width direction (short direction) on one end side in the longitudinal direction of the first surface of the dielectric 13, and the second region 112 is the first region. It extends from 111 toward the longitudinal center of the dielectric 13. The second electrode 12 is arranged such that the first region 121 extends in the width direction (short direction) on the other end side in the longitudinal direction of the first surface of the dielectric 13, and the second region 122 is the second region 122. The first region 121 is disposed so as to extend toward the center of the dielectric 13 in the longitudinal direction. Note that the second region 112 of the first electrode 11 and the second region 122 of the second electrode 12 are arranged with a space in the center in the longitudinal direction of the first surface of the dielectric 13.

  An input / output electrode 14 for signal input / output and a second surface of the first electrode 11 across the dielectric 13 are provided on the second surface (the lower surface in this example) of the dielectric 13 constituting the support substrate 1. A ground electrode 15 for forming a capacitance between the region 112 and the second region 122 of the second electrode 12 is provided. The input / output electrode 14 extends in the width direction (short direction) at a position facing the first region 111 of the first electrode 11 and the first region 121 of the second electrode 12 on the second surface of the dielectric 13. It is electrically connected to an external circuit board or the like to serve as an input / output signal input / output port. In addition, the ground electrode 15 is arranged extending in the width direction (short direction) at the center of the second surface of the dielectric 13 in the longitudinal direction, and is electrically connected to the ground potential of an external circuit board or the like. The

Further, a side electrode 16 that electrically connects the first electrode 11 or the second electrode 12 and the input / output electrode 14 from one main surface to the other main surface is provided on the side surface of the dielectric 13 constituting the support substrate 1. Is provided. In addition, a side electrode 16 electrically connected to the ground electrode 15 is provided for the purpose of soldering to an external circuit board.

  As the material of the first electrode 11, the second electrode 12, the input / output electrode 14, the ground electrode 15 and the side electrode 16, a conductive resin in which metal powder such as gold, silver, copper, aluminum, tungsten or the like is dispersed in the resin. (Conductive paste), thick film conductors obtained by adding an additive such as glass to these metal powders, and the like can be used. If necessary, Ni / Au or Ni / Sn plating may be formed.

  In addition, when the 2nd area | region 112 of the 1st electrode 11, the 2nd area | region 122 of the 2nd electrode 12, and the ground electrode 15 oppose through the dielectric 13, the 2nd area | region 112 of the 1st electrode 11 and a ground electrode 15 and the area where the second area 122 of the second electrode 12 and the ground electrode 15 face each other can be increased, so that the capacitance can be increased. Here, the electrostatic capacitance obtained in each of the opposed regions is determined by the characteristics of the amplifier circuit element that is connected to the piezoelectric component and constitutes the oscillation circuit.

  The piezoelectric element 2 includes a rectangular parallelepiped piezoelectric body 23. The piezoelectric body 23 constituting the piezoelectric element 2 may have a flat plate shape having a length of 1.0 mm to 4.0 mm, a width of 0.2 mm to 2 mm, and a thickness of 40 μm to 1 mm, for example. The piezoelectric body 23 is formed using, for example, piezoelectric ceramics based on lead titanate, lead zirconate titanate, lithium tantalate, lithium niobate, sodium niobate, potassium niobate, a bismuth layered compound, or the like. Can do.

  In addition, the piezoelectric element 2 includes excitation electrodes (first excitation electrode 21 and second excitation electrode 22) disposed on the upper surface and the lower surface of the piezoelectric body 23 so as to have regions (crossing regions) facing each other. . Specifically, the piezoelectric element 2 includes a first excitation electrode 21 provided on the upper surface of the piezoelectric body 23 so as to extend from one end portion to the other end portion in the longitudinal direction, and a lower surface of the piezoelectric body 23. The second excitation electrode 22 is provided so as to extend from the other end portion to the one end portion in the longitudinal direction, and each has regions facing each other. The first excitation electrode 21 and the second excitation electrode 22 may be made of metal such as gold, silver, copper, aluminum, chromium, nickel, and the like. Deposited to a thickness of 1 μm to 3 μm. End face electrodes 24 are provided on both end faces of the piezoelectric element 2, and the first excitation electrode 21 is a first electrode through the end face electrode 24, a conductive bonding material 31 described later, and a first support portion 171. 11, and the second excitation electrode 22 is electrically connected to the second electrode 12 through the conductive bonding material 32 and the second support portion 172.

  In such a piezoelectric element 2, when a voltage is applied between the first excitation electrode 21 and the second excitation electrode 22, the region where the first excitation electrode 21 and the second excitation electrode 22 face each other (intersection region). The piezoelectric vibration of thickness longitudinal vibration or thickness shear vibration is generated at a specific frequency.

  If necessary, a first support portion 171 and a second support portion 172 are provided on the dielectric 13 constituting the support substrate 1, and the piezoelectric element 2 is mounted thereon so as to be able to vibrate. . Specifically, the first support portion 171 and the second support portion 172 support both end portions in the longitudinal direction of the piezoelectric element 2, and both end portions in the longitudinal direction of the piezoelectric element 2 are first conductivity described later. It is fixed to the support substrate 1 through the conductive bonding material 31 and the second conductive bonding material 32 so as to be capable of vibrating.

The first support portion 171 and the second support portion 172 have, for example, conductivity, and are columnar bodies formed by dispersing metal powders such as gold, silver, copper, aluminum, and tungsten in a resin. . For example, the length (diameter) in the vertical and horizontal directions is 0.1 mm to 1.0 mm, the thickness is 10 μm to 100 μm, and the columnar shape or the columnar shape is formed. In the example shown in the figure, a plurality of first support portions 171 and a plurality of second support portions 172 are provided.

  The first conductive bonding material 31 electrically connects the first electrode 11 and the first excitation electrode 21, and the second conductive bonding material 32 electrically connects the second electrode 12 and the second excitation electrode 22. Yes.

  The first conductive bonding material 31 is provided from the lower surface of one end portion of the piezoelectric element 2 to the upper surface through the end surface, and the first region 111 of the first electrode 11 and a plurality of first electrodes. Some of the support parts 171, the end face electrode 24, and the first excitation electrode 21 are joined and electrically connected. The second conductive bonding material 32 is provided from the lower surface of the other end of the piezoelectric element 2 to the upper surface through the end surface, and the first region 121 of the second electrode 12 and a plurality of second supports. It joins to some of the parts 172, the end surface electrode 24, and the 2nd excitation electrode 22, and these are electrically connected.

  As the first conductive bonding material 31 and the second conductive bonding material 32, for example, solder or a conductive adhesive is used. If the solder is used, for example, a lead-free material made of copper, tin, or silver is used. If it is a conductive adhesive, an epoxy-based conductive resin or a silicone-based resin containing 75 to 95% by mass of conductive particles such as silver, copper, and nickel can be used.

  And the space | interval of the 1st conductive bonding material 31 and the 2nd conductive bonding material 32 in the upper surface of the piezoelectric element 2 has a different site | part when it sees over the width direction perpendicular | vertical to the said longitudinal direction. In the example shown in FIG. 1, the shape of the boundary between the first conductive bonding material 31 and the piezoelectric element 2 is a straight line extending in parallel with the width direction, and the boundary between the second conductive bonding material 32 and the piezoelectric element 2 is The shape is a straight line extending obliquely from the width direction.

  According to such a configuration, the position of the fixed end fixed at the peripheral edge portion of the first conductive bonding material 31 at one end portion of the upper surface of the piezoelectric element 2 and the other end portion of the upper surface of the piezoelectric element 2. Since the distance from the position of the fixed end fixed at the peripheral edge portion of the second conductive bonding material 32 is different in the width direction perpendicular to the longitudinal direction, it exists in the low frequency region. Longitudinal resonance is distributed. Thereby, the ripple which is a harmonic of these resonances can be shifted from the main vibration band to the outside of the band. Further, the ripple peak valley generated in the main vibration band can be reduced by the damping effect due to the dispersion of resonance, and the phase distortion in the band can be suppressed. Therefore, the oscillation characteristics can be stabilized.

  Here, as shown in FIG. 2, at least one of the first conductive bonding material 31 and the second conductive bonding material 32 in a plan view has a curved shape at the boundary with the piezoelectric element 2 in the plan view. It is good. In the example shown in FIG. 2, the shape of any boundary is a curved shape and is different from each other. Here, when the shape of the boundary is curved, it means that the boundary is not linear, and for example, a convex curve, a concave curve, or a wavy shape (a shape with irregularities) in a plan view. Various shapes are mentioned. Of the convex curve shape, concave curve shape, and corrugated shape (shape with unevenness), the corrugated shape (shape with unevenness) is effective in that the resonance is dispersed and the ripple is further reduced. .

In addition, as shown in FIG. 2, the shape of the boundary between the first conductive bonding material 31 and the piezoelectric element 2 is asymmetric with the shape of the boundary between the second conductive bonding material 32 and the piezoelectric element 2 in plan view. It is good to be. The term “asymmetrical shape” as used herein means that the shape is not line-symmetrical with respect to an axis extending in the width direction in the vicinity of the center in the longitudinal direction of the piezoelectric element 2, but is a point with respect to a point near the center of the upper surface of the piezoelectric element 2. It means that it is not a symmetric shape. As such a form, for example, when one has a concave curve shape as shown in the figure, the other has a convex curve shape or a wavy shape.

  With such a configuration, the position of the fixed end fixed at the peripheral edge portion of the first conductive bonding material 31 at one end portion of the upper surface of the piezoelectric element 2 and the other end of the upper surface of the piezoelectric element 2. The distance from the position of the fixed end fixed at the peripheral edge portion of the second conductive bonding material 32 in the portion can be changed in a more complicated manner, and the degree of resonance dispersion existing in the low frequency region can be further increased. As a result, the amount of ripple shift can be improved, and in-band phase distortion can be further suppressed by improving the damping effect. Therefore, the oscillation characteristics can be further stabilized by these effects.

  Further, as shown in FIG. 3, the first conductive bonding material 31 and the second conductive bonding material 32 are also provided on one side of the piezoelectric element 2 and on both side surfaces of the other end. The distance between the first conductive bonding material 21 and the second conductive bonding material 32 when viewing one side surface of the element 2 has different portions when viewed over the thickness direction perpendicular to the longitudinal direction. It is good. With such a configuration, the position of the fixed end fixed at the peripheral edge portion of the first conductive bonding material 31 at one end portion of one side surface of the piezoelectric element 2, and one side surface of the piezoelectric element 2. Since the distance from the position of the fixed end fixed at the peripheral edge portion of the second conductive bonding material 32 at the other end portion of the second end portion differs when viewed in the thickness direction perpendicular to the longitudinal direction. Resonances of vibrations in the width direction and spread in the frequency domain are also dispersed, and ripples caused by these vibrations can be shifted or damped. Therefore, the oscillation characteristics can be further stabilized by these effects.

  As in the plan view, at least one of the first conductive bonding material 31 and the second conductive bonding material 32 may have a curved boundary shape with the piezoelectric element 2 in a side view.

  Further, as shown in FIG. 4, at least one of the first conductive bonding material 31 and the second conductive bonding material 32 has a shape of a boundary with one side surface of the piezoelectric element 2 and the other side of the piezoelectric element 2 in a side view. The shape of the boundary with the side surface may be different. 4A is a schematic left side view of the piezoelectric component, and FIG. 4B is a schematic right side view of the piezoelectric component on the opposite side to FIG. 4A. When the shape of the boundary with one side surface of the piezoelectric element 2 and the shape of the boundary with the other side surface of the piezoelectric element 2 are the same in a side view, the side surface of the piezoelectric element 2 is seen from the front and the piezoelectric body 23 is transmitted. This means that the boundaries of each match. Therefore, being different means that the respective boundaries do not coincide when passing through the piezoelectric body 23. In other words, the shape of the left boundary is different from the shape of the right boundary in at least one of the first conductive bonding material 31 and the second conductive bonding material 32 that wraps around both side surfaces of the piezoelectric element 2 in the width direction. Means that

  As such a form, for example, when the shape of the boundary when the first conductive bonding material 31 is viewed from one side is a convex curve, the first conductive bonding material 31 is viewed from the other side but is concave. And wavy shapes. By adopting such a configuration, the position of the fixed portion at one end or the other end of the side surface of the piezoelectric element 2 can be changed in a more complicated manner. The resonance can be more dispersed, and the ripple caused by these vibrations can be shifted or damped. Therefore, the oscillation characteristics can be further stabilized by these effects.

In addition, as shown in FIG. 3, the shape of the boundary between at least one side of the first conductive bonding material 31 and the piezoelectric element 2 is at least one of the second conductive bonding material 32 and the piezoelectric element 2 in a side view. The shape of the side boundary may be asymmetric. The term “asymmetrical shape” as used herein refers to a point that is not line-symmetrical with respect to an axis extending in the thickness direction near the center in the longitudinal direction of the piezoelectric element 2, but is a point with respect to a point near the center of the side surface of the piezoelectric element 2. It means that it is not a symmetric shape.

  By adopting such a configuration, the position of the fixed end fixed at the peripheral edge portion of the first conductive bonding material 31 at one end portion of one side surface of the piezoelectric element 2 and the other side of the one side surface of the piezoelectric element 2. The distance from the position of the fixed end fixed at the peripheral edge portion of the second conductive bonding material 32 at the end portion of the second end can be changed in a more complicated manner, and the degree of dispersion of resonance existing in the low frequency region can be increased. As a result, the amount of ripple shift can be improved, and in-band phase distortion can be further suppressed by improving the damping effect. Therefore, the oscillation characteristics can be further stabilized by these effects. In addition, it is more preferable that the shape of the boundary of both side surfaces is an asymmetrical shape.

  Although not shown, a lid may be provided on the support substrate 1 so as to cover the piezoelectric element 2. The lid is bonded to the peripheral edge of the upper surface of the support substrate 1 with an adhesive or the like, and causes the piezoelectric element 2 accommodated in the internal space formed together with the support substrate 1 to physically influence or chemically And a hermetic sealing function for preventing entry of foreign matters such as water into the space formed together with the support substrate 1. In addition, as a material of a cover body, metals, such as stainless steel, ceramics, such as an alumina, resin, glass, etc. can be used, for example. In addition, an insulating resin material such as an epoxy resin may contain an inorganic filler at a rate of 25 to 80% by mass to reduce the difference in thermal expansion coefficient from the support substrate.

  Next, an example of the manufacturing method of the piezoelectric component of this embodiment will be described.

  First, a multi-piece substrate for producing the support substrate 1 is produced. For example, after mixing raw material powders such as lead titanate, lead zirconate titanate, and barium titanate together with water and a dispersant using a ball mill, a binder, a plasticizer, and the like are added, followed by drying and sizing. The raw material thus obtained is press-molded and, if necessary, subjected to hole processing, degreased at a predetermined temperature, fired at a peak temperature of, for example, 900 ° C. to 1600 ° C., and polished to a predetermined thickness . Thereafter, for example, a conductive paste containing a metal powder such as silver or nickel and glass is printed and fired at a predetermined temperature to form the first electrode 11 and the second electrode 12 to obtain the support substrate 1.

  On the obtained support substrate 1, support portions (first support portion 171 and second support portion 172) made of conductive paste are formed to a thickness of about 1 μm to 100 μm using screen printing or the like. Specifically, for example, a bump-shaped first support portion 171 formed by dispersing and solidifying, for example, metal powder in a resin is provided on the first electrode 11, and for example, metal powder is provided on the second electrode 12. A bump-like second support portion 172 is provided which is dispersed and solidified in the resin.

  Next, the piezoelectric ceramic (piezoelectric body 23) that constitutes the piezoelectric element 2 is, for example, mixed with raw material powder together with water and a dispersant using a ball mill, and then added with a binder, a plasticizer, and the like, and dried and sized. The raw material thus obtained is press-molded and fired to obtain a piezoelectric ceramic. An electrode is formed on the end face of the obtained piezoelectric ceramic, and a polarization treatment is performed by applying a voltage of, for example, 0.4 kV / mm to 6 kV / mm in the end face direction at a temperature of 25 ° C. to 300 ° C., for example.

  Excitation electrodes (first excitation electrode 21 and second excitation electrode 22) formed on the upper and lower surfaces of the piezoelectric body 23 are obtained by using a vacuum deposition method, a PVD method, a sputtering method, or the like on the obtained piezoelectric body 23. A metal film is deposited on the upper and lower surfaces of the piezoelectric body, and a photoresist film having a thickness of about 1 μm to 10 μm is formed on each metal film by screen printing or the like, and then patterned by photoetching. be able to.

  The piezoelectric element 2 is manufactured by cutting the patterned piezoelectric body 23 into a predetermined size by dicing or the like.

  Then, using the conductive bonding material (the first conductive bonding material 31 and the second conductive bonding material 32), the piezoelectric element 2 is placed on the first support portion 171 and the second support portion 172 of the support substrate 1. Mount on and fix. Here, in the case where the conductive bonding material (the first conductive bonding material 31 and the second conductive bonding material 32) is a conductive adhesive in which metal powder is dispersed in a resin, the conductive bonding material is dispensed using a dispenser or the like. The adhesive is applied on the first support part 171 and the second support part 172, and the piezoelectric element 2 is placed on the first support part 171 and the second support part 172, and heated or heated. The conductive adhesive resin may be cured by ultraviolet irradiation.

  At this time, the shape of the boundary between the conductive bonding material (the first conductive bonding material 31 and the second conductive bonding material 32) and the piezoelectric element 2 is changed to, for example, a curved shape, so that the first conductive bonding material 31 is formed. In order to obtain a configuration in which the distance between the first conductive bonding material 32 and the second conductive bonding material 32 has different portions when viewed in the width direction or thickness direction perpendicular to the longitudinal direction, first, piezoelectric elements are used by screen printing or the like. The conductive bonding material (the first conductive bonding material 31 and the second conductive bonding material 32) may be printed and cured so that the boundary with 2 becomes a curve.

  Then, if necessary, the opening peripheral surface of the lid is joined to the peripheral portion of the upper surface of the support substrate 1 so as to cover the piezoelectric element 2. Using a multi-piece collective cover sheet having a plurality of recesses as the cover, place the collective cover sheet on the pick-up substrate so that the recesses cover the piezoelectric elements, and open the peripheral edge surface of the cover The convex portion of the collective cover sheet to be joined is joined to the peripheral portion of the upper surface of the support substrate 1. For example, a thermosetting insulating adhesive is applied to the convex portion of the collective lid sheet that forms the peripheral edge surface of the prepared lid, and the lid is placed on the upper surface of the support substrate 1. Thereafter, the lid or support substrate 1 is heated to cure the insulating adhesive by raising the temperature to 100 to 150 ° C., and the lid is bonded to the upper surface of the support substrate 1.

  Finally, after cutting by dicing or the like along the boundary of each piezoelectric component (piece), a conductive paste is printed on the side surface of the piezoelectric component that has become a piece using screen printing or the like, and the temperature is 100 to 150 ° C. A piezoelectric part can be obtained by raising the temperature and curing to form side electrodes.

  The piezoelectric component of this example is manufactured by the above method. According to the method as described above, a highly accurate resonator that suppresses ripples in the main vibration band that causes a decrease in the accuracy of the oscillation frequency can be manufactured with high productivity.

1: support substrate 11: first electrode 12: second electrode 111, 121: first region 112, 122: second region 13: dielectric 14: input / output electrode 15: ground electrode 16: side electrode 171: first electrode 1 support portion 172: second support portion 2: piezoelectric element 21: first excitation electrode 22: second excitation electrode 23: piezoelectric body 31: first conductive bonding material 32: second conductive bonding material

Claims (6)

A support substrate having a first electrode and a second electrode; a first excitation electrode provided on the upper surface and extending from one end in the longitudinal direction toward the other end; and the other in the longitudinal direction provided on the lower surface A rectangular-shaped piezoelectric element having both ends in the longitudinal direction fixed to the support substrate, the first electrode, and the first electrode. A first conductive bonding material that electrically connects the excitation electrode; and a second conductive bonding material that electrically connects the second electrode and the second excitation electrode;
The first conductive bonding material and the second conductive bonding material are provided from the lower surface of one end of the piezoelectric element and the other end to the upper surface through the end surface,
The gap between the first conductive bonding material and the second conductive bonding material on the upper surface of the piezoelectric element has different parts when viewed in the width direction perpendicular to the longitudinal direction. Piezoelectric parts.   2. The piezoelectric component according to claim 1, wherein at least one of the first conductive bonding material and the second conductive bonding material has a curved boundary shape with the piezoelectric element in plan view.   The planar shape of the boundary between the first conductive bonding material and the piezoelectric element is an asymmetric shape with respect to the boundary shape between the second conductive bonding material and the piezoelectric element. 2. The piezoelectric component according to 2.   The first conductive bonding material and the second conductive bonding material are also provided on both side surfaces of one end and the other end of the piezoelectric element, and one side surface of the piezoelectric element is seen. 2. The space between the first conductive bonding material and the second conductive bonding material is different when viewed in a thickness direction perpendicular to the longitudinal direction. The piezoelectric component according to claim 3.   At least one of the first conductive bonding material and the second conductive bonding material is different in a shape of a boundary with one side surface of the piezoelectric element and a shape of a boundary with the other side surface of the piezoelectric element in a side view. The piezoelectric component according to claim 4, wherein the piezoelectric component is provided.   In a side view, the shape of the boundary between at least one side of the first conductive bonding material and the piezoelectric element is asymmetric with the shape of the boundary between at least one side of the second conductive bonding material and the piezoelectric element. The piezoelectric component according to claim 4, which has a shape.

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