JP2017133342A5 - - Google Patents
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- Publication number
- JP2017133342A5 JP2017133342A5 JP2016051127A JP2016051127A JP2017133342A5 JP 2017133342 A5 JP2017133342 A5 JP 2017133342A5 JP 2016051127 A JP2016051127 A JP 2016051127A JP 2016051127 A JP2016051127 A JP 2016051127A JP 2017133342 A5 JP2017133342 A5 JP 2017133342A5
- Authority
- JP
- Japan
- Prior art keywords
- room temperature
- temperature moisture
- component room
- sealing material
- adherend
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000003566 sealing material Substances 0.000 claims 11
- 238000011068 load Methods 0.000 claims 6
- 239000000565 sealant Substances 0.000 claims 6
- 238000010438 heat treatment Methods 0.000 claims 4
- 239000000919 ceramic Substances 0.000 claims 3
- -1 ketimine compound Chemical class 0.000 claims 3
- 239000000463 material Substances 0.000 claims 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 3
- 150000001875 compounds Chemical class 0.000 claims 2
- 238000010276 construction Methods 0.000 claims 2
- 125000003700 epoxy group Chemical group 0.000 claims 2
- 238000007654 immersion Methods 0.000 claims 2
- 229920000620 organic polymer Polymers 0.000 claims 2
- 229920000647 polyepoxide Polymers 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
Claims (8)
第１の被着体と、
前記第１の被着体との間に間隙を挟んで隣り合う位置に配置される第２の被着体と、
前記間隙に充填され、モジュラスの変化率が低い一液常温湿気硬化型シーリング材と
を備え、
前記一液常温湿気硬化型シーリング材が、
（Ａ）数平均分子量が１５，０００以上の架橋性ケイ素基含有有機重合体と、
（Ｂ）分子中に２個以上のエポキシ基を有する化合物と、
（Ｃ）架橋性ケイ素基を有しないケチミン化合物と
を含有する一液常温湿気硬化型シーリング材組成物を硬化させて得られる目地構造を有する壁。 A wall having a joint structure of a structure,
A first adherend;
A second adherend disposed at a position adjacent to the first adherend with a gap between;
A one-component room temperature moisture-curing sealing material filled in the gap and having a low modulus change rate ,
The one-component room temperature moisture-curing sealing material is
(A) a crosslinkable silicon group-containing organic polymer having a number average molecular weight of 15,000 or more;
(B) a compound having two or more epoxy groups in the molecule;
(C) a ketimine compound having no crosslinkable silicon group;
A wall having a joint structure obtained by curing a one-component room temperature moisture-curing sealant composition containing
前記バックアップ材上の前記間隙を、モジュラスの変化率が低い一液常温湿気硬化型シーリング材組成物で充填する充填工程とA filling step of filling the gap on the backup material with a one-component room temperature moisture-curing sealing material composition having a low modulus change rate;
を備える目地施工方法。A joint construction method comprising:
ＪＴＣ Ｓ−０００１ 窯業系サイディング用シーリング材 ＪＴＣ規格に準拠して試験した引張接着性試験結果において、JTC S-0001 Sealing material for ceramics siding Judgment test results in accordance with JTC standards,
水浸漬後の最大荷重時の伸長率が１５０％以上であり、The elongation at maximum load after immersion in water is 150% or more,
水浸漬後の最大荷重時の伸長率の変化率が７５％以上であり、The rate of change in elongation at maximum load after water immersion is 75% or more,
加熱後の５０％伸長時モジュラスが０．４Ｎ／ｍｍThe modulus at 50% elongation after heating is 0.4 N / mm ２2 未満であり、Is less than
加熱後の５０％伸長時モジュラスの変化率が２００％以下であり、The rate of change in modulus at 50% elongation after heating is 200% or less,
加熱後の最大荷重時の伸長率が１５０％以上であり、The elongation rate at the maximum load after heating is 150% or more,
加熱後の最大荷重時の伸長率の変化率が７５％以上である請求項３に記載の目地施工方法。The joint construction method according to claim 3, wherein the rate of change of the elongation rate at the maximum load after heating is 75% or more.
（Ａ）数平均分子量１５，０００以上の架橋性ケイ素基含有有機重合体と、(A) a crosslinkable silicon group-containing organic polymer having a number average molecular weight of 15,000 or more;
（Ｂ）分子中に２個以上のエポキシ基を有する化合物と、(B) a compound having two or more epoxy groups in the molecule;
（Ｃ）ケチミン化合物と(C) with a ketimine compound
を含有し、Containing
前記一液常温湿気硬化型シーリング材組成物の硬化物が、The cured product of the one-component room temperature moisture curable sealing material composition is
ＪＴＣ Ｓ−０００１ 窯業系サイディング用シーリング材 ＪＴＣ規格に準拠して試験した引張接着性試験結果において、初期の５０％引張モジュラスが０．４Ｎ／ｍｍJTC S-0001 Sealing material for ceramic siding JTC S-0001 In the result of tensile adhesion test tested according to JTC standard, the initial 50% tensile modulus is 0.4 N / mm ２2 未満である一液常温湿気硬化型シーリング材組成物。A one-component room temperature moisture-curing sealant composition that is less than 1.
ＪＴＣ Ｓ−０００１ 窯業系サイディング用シーリング材 ＪＴＣ規格に準拠して試験した熱暴露促進試験後の５０％引張モジュラスが０．４Ｎ／ｍｍJTC S-0001 Ceramics siding sealant 50% tensile modulus after thermal exposure test tested in accordance with JTC standards is 0.4 N / mm ２2 未満である請求項５に記載の一液常温湿気硬化型シーリング材組成物。The one-component room temperature moisture-curable sealing material composition according to claim 5, wherein
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016011470 | 2016-01-25 | ||
| JP2016011470 | 2016-01-25 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017133342A JP2017133342A (en) | 2017-08-03 |
| JP2017133342A5 true JP2017133342A5 (en) | 2019-04-04 |
| JP6763160B2 JP6763160B2 (en) | 2020-09-30 |
Family
ID=59504258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016051127A Active JP6763160B2 (en) | 2016-01-25 | 2016-03-15 | Walls with joint structure, joint construction method, and one-component room temperature moisture-curable sealant composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6763160B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7382012B2 (en) * | 2018-04-20 | 2023-11-16 | セメダイン株式会社 | Building with wall structure and method for manufacturing wall structure |
| JP7373770B2 (en) * | 2019-08-07 | 2023-11-06 | パナソニックＩｐマネジメント株式会社 | curable composition |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3484169B2 (en) * | 2001-06-22 | 2004-01-06 | オート化学工業株式会社 | Curable composition and sealing material composition |
| JP3953995B2 (en) * | 2002-09-13 | 2007-08-08 | セメダイン株式会社 | One-component curable composition |
| JP2006131741A (en) * | 2004-11-05 | 2006-05-25 | Yokohama Rubber Co Ltd:The | Curable resin composition |
| JP4800728B2 (en) * | 2005-10-04 | 2011-10-26 | 清水建設株式会社 | Sealing method |
| JP2012092239A (en) * | 2010-10-27 | 2012-05-17 | Yokohama Rubber Co Ltd:The | Curable composition |
| US9273225B2 (en) * | 2012-09-12 | 2016-03-01 | Momentive Performance Materials Inc. | Siloxane organic hybrid materials providing flexibility to epoxy-based coating compositions |
| JP6282450B2 (en) * | 2013-11-29 | 2018-02-21 | 株式会社カネカ | Curable composition |
| JP6350962B2 (en) * | 2014-03-03 | 2018-07-04 | セメダイン株式会社 | Sealant composition |
| JP6350963B2 (en) * | 2014-03-20 | 2018-07-04 | セメダイン株式会社 | Sealing method |
-
2016
- 2016-03-15 JP JP2016051127A patent/JP6763160B2/en active Active
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