JP2017132120A - Exposure device, image formation device, and exposure device manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an exposure device which can be easily manufactured in a simple configuration.SOLUTION: In an LED head 23, a plurality of fitting holes 66, 67 are provided at a flat plate part 61 of a holding plate 41, and under a condition in which positions of an LED substrate 42 and a rod lens array 43 are adjusted, an adhesive 60 is applied, for curing, from - Y side of the flat plate part 61 to the respective fitting holes 66, 67 by using an adhesive syringe. Thus, the LED head 23, since it is not required to apply an adhesive along a plurality of directions and it is not required to change a posture of each component such as the holding plate 41 at the time of manufacturing, can easily manufacture in a state in which position accuracy of the LED substrate 42 and the rod lens array 43 is kept.SELECTED DRAWING: Figure 4

Description

  The present invention relates to an exposure apparatus, an image forming apparatus, and an exposure apparatus manufacturing method, and is suitable for application to, for example, an exposure apparatus mounted on an electrophotographic image forming apparatus.

  Conventionally, as an image forming apparatus, an exposure apparatus that emits light for exposure irradiates light on the surface of the photosensitive drum to form an electrostatic latent image on the surface of the photosensitive drum. In general, a printer that prints an image by developing a toner image by adhering toner to the toner is widely used. As this exposure apparatus, for example, there is an LED head that uses light emitted from an LED (Light Emitting Diode) which is a light emitting element.

  The LED head includes, for example, an LED substrate on which an LED array chip in which a plurality of LEDs are arranged in a straight line is mounted, a lens array in which a plurality of lenses that collect light emitted from each LED are aligned, Some have an LED substrate and a holder for holding a lens array. The holder is formed, for example, by bending a steel plate so that the top plate and the two side plates are connected to each other so that the cross-section is a vertically inverted shape of the letter “U”. There is one in which a hole through which the lens array is inserted is formed (for example, see Patent Document 1).

  For example, the LED head has a lens array in which a lens array is inserted into a hole of a holder and an LED substrate is disposed so as to block between two side plates. The lens array and the LED substrate are fixed by an adhesive or the like in a state adjusted so as to match a predetermined position corresponding to the surface of the lens.

JP 2012-66499 A (FIGS. 5 and 9 etc.)

  In the LED head described above, when the lens array is bonded to the top plate of the holder, for example, an adhesive syringe that discharges the adhesive is brought close to the top plate side of the holder, and the adhesive is applied to the bonding location. On the other hand, in the LED head, when the LED substrate is bonded between the side plates in the holder, the adhesive syringe is brought close to the holder from the bottom side or the side surface, and the adhesive is applied to the bonding portion.

  That is, in the LED head, when the lens array and the LED substrate are bonded to the holder, it is necessary to bring the adhesive syringe close to each bonding location from a plurality of directions. For this reason, at the time of manufacturing the LED head, for example, a step of changing the posture of the holder for each bonding portion by manual operation of an operator, or an adhesive syringe is automatically brought close to the holder sequentially from a plurality of directions. A manufacturing apparatus having a complicated configuration is required.

  Thus, due to the structure of the LED head, a complicated process and a complicated manufacturing apparatus are required to bond the lens array and the LED substrate in the manufacturing process. As a result, a large manufacturing cost is required. There was a problem that.

  The present invention has been made in consideration of the above points, and intends to propose an exposure apparatus, an image forming apparatus, and an exposure apparatus manufacturing method that can be easily manufactured with a simple configuration.

  In order to solve such a problem, in the exposure apparatus of the present invention, a light emitting element substrate on which a plurality of light emitting elements are mounted, a lens array for converging light respectively emitted from the light emitting elements, and the lens array on one surface side And a plurality of substrate mounting holes, and a holding plate for holding the light emitting element substrate on one side by an adhesive applied to the substrate mounting holes.

  In the image forming apparatus of the present invention, the above-described exposure apparatus is provided.

  Furthermore, in the exposure apparatus manufacturing method of the present invention, on one side of the holding plate provided with a plurality of substrate mounting holes, a light emitting element substrate on which a plurality of light emitting elements are mounted and light emitted from the light emitting elements respectively. A position adjusting step for adjusting a relative position with the converging lens array; and an adhesion step for adhering the light emitting element substrate to the holding plate by applying an adhesive to the substrate mounting hole from the other surface side of the holding plate. And so on.

  According to the present invention, since the substrate mounting hole is provided in the holding plate, the position of the light emitting element substrate and the lens array is adjusted on the one surface side of the holding plate from the other surface side of the holding plate when the exposure apparatus is manufactured. Only by applying and curing the adhesive, the light emitting element substrate can be adhered while maintaining its position. For this reason, in the present invention, it is not necessary to apply adhesive from various directions to the holding plate or the like, and it is not necessary to apply adhesive while changing the posture or orientation of the holding plate, etc. Can be manufactured.

  According to the present invention, it is possible to realize an exposure apparatus, an image forming apparatus, and an exposure apparatus manufacturing method that can be easily manufactured with a simple configuration.

1 is a schematic diagram illustrating a configuration of an image forming apparatus. It is a basic diagram which shows the structure of an image forming unit. It is a rough-line top view which shows the structure of the LED head by 1st Embodiment. 1 is a schematic cross-sectional view showing a configuration of an LED head according to a first embodiment. It is a flowchart which shows a LED head manufacturing process procedure. It is a basic diagram which shows the structure of the adhesion | attachment apparatus. It is a basic diagram which shows the structure of a sealing device. It is a flowchart which shows the adhesion process procedure. It is a basic diagram which shows the set of each components. It is an approximate line figure showing adhesion of a LED board and a rod lens array. It is a basic diagram which shows adhesion | attachment of a cover. It is a basic diagram which shows the structure of the LED head for a comparison. It is a rough-line top view which shows the structure of the LED head by 2nd Embodiment. It is a rough sectional drawing which shows the structure of the LED head by 2nd Embodiment. It is an approximate line sectional view showing the composition of the LED head by a 3rd embodiment. It is a basic diagram which shows generation | occurrence | production of position shift by expansion | extension of components. It is a basic diagram which shows the structure of the holding | maintenance board by other embodiment.

  Hereinafter, modes for carrying out the invention (hereinafter referred to as embodiments) will be described with reference to the drawings.

[1. First Embodiment]
[1-1. Configuration of image forming apparatus]
As shown in FIG. 1, the image forming apparatus 1 according to the first embodiment is configured as an electrophotographic printer. For example, a desired size of paper P having a size such as an A3 size or an A4 size can be obtained. A color image is printed.

  In the image forming apparatus 1, various components are arranged inside a printer housing 2 formed in a substantially box shape. In the following description, the right end portion in FIG. 1 is defined as the front surface of the image forming apparatus 1, and the vertical direction, the horizontal direction, and the front-rear direction when viewed from the front are defined and described.

  The image forming apparatus 1 is configured to perform overall control by the control unit 3. The control unit 3 is connected to a host device (not shown) such as a personal computer by wireless or wired via a communication processing unit (not shown). When image data representing a color image to be printed is given from the host device and the printing of the color image is instructed, the control unit 3 executes a printing process for forming a print image on the surface of the paper P.

  At the bottom of the printer housing 2, a paper storage cassette 4 that stores the paper P and a paper feed that separates and feeds the paper P stored in a state of being stacked in the paper storage cassette 4 one by one. Part 5 is provided. The paper feeding unit 5 is located above the front end of the paper storage cassette 4 and advances the paper P along the conveyance path W indicated by the alternate long and short dash line. In addition to a plurality of rollers such as a hopping roller 6 provided on the upper front end of the sheet storage cassette 4 with the central axis directed in the left-right direction and a pair of conveying rollers 7 for conveying the sheet P, the sheet feeding unit 5 includes a sheet A conveyance guide 8 or the like for guiding P is provided.

  The paper feeding unit 5 rotates the hopping roller 6 and the like under the control of the control unit 3 to separate and take in the paper P stored in the paper storage cassette 4 one by one, and feed the taken paper P into the transport path W. , And then proceed so as to be folded back at a position that is substantially in the middle of the top and bottom in the vicinity of the front end in the printer casing 2.

  After passing through the paper supply unit 5, the paper P is conveyed rearward by the middle conveyance unit 10 formed so as to largely traverse the inside of the printer housing 2 from the rear side to the front side. Four image forming units 15C, 15M, 15Y, and 15K (hereinafter collectively referred to as the image forming unit 15) are located above the middle conveyance unit 10, that is, above the center of the printer housing 2. They are arranged in order from the rear side to the front side. That is, the image forming units 15 for each color are arranged in a so-called tandem system.

  Incidentally, the image forming units 15C, 15M, 15Y and 15K correspond to the respective colors of cyan (C), magenta (M), yellow (Y) and black (K). The image forming units 15C, 15M, 15Y, and 15K are configured in the same manner, and only the corresponding toner colors are different. The image forming unit 15 is formed in a substantially box shape that is relatively long in the left-right direction so as to correspond to the left-right width of the paper P.

  Each image forming unit 15 forms a toner image of each color based on the image data supplied from the control unit 3, and applies this toner image to the paper P conveyed from the front along the conveyance path W. While sequentially transferring and superimposing, it proceeds backward (details will be described later).

  A fixing unit 16 is provided near the rear end of the middle conveyance unit 10. The fixing unit 16 includes a heating roller 16A provided with a heater therein and a pressure roller 16B pressed against the heating roller 16A so as to sandwich the conveyance path W from above and below.

  The fixing unit 16 heats the heating roller 16A and rotates the heating roller 16A and the pressure roller 16B in predetermined directions based on the control of the control unit 3, respectively. As a result, the fixing unit 16 fixes the toner by applying heat and pressure to the paper P conveyed from the image forming unit 15, that is, the paper P on which the toner images of four colors are superimposed, and is further transferred backward. .

  A paper discharge unit 17 is disposed behind or above the fixing unit 16. The paper discharge unit 17 is configured by a combination of a plurality of conveyance roller pairs, conveyance guides, and the like, similar to the paper supply unit 5. The paper discharge unit 17 rotates the respective conveyance roller pairs as appropriate to convey the paper P rearward and upward along the conveyance guide, and then folds it forward to form a discharge tray formed on the upper surface of the printer housing 2. 18 is discharged.

  As described above, when executing the printing process, the image forming apparatus 1 forms toner images by the image forming units 15 of the respective colors and sequentially transfers the toner images onto the paper P.

[1-2. Configuration of image forming unit]
Next, the configuration of the image forming unit 15 as an image forming unit will be described. As shown in a schematic sectional view in FIG. 2, the image forming unit 15 is roughly composed of an image forming unit 21, a toner cartridge 22, an LED (Light Emitting Diode) head 23, and a transfer roller 25.

  The LED head 23 as an exposure apparatus has a plurality of LED elements arranged in the left-right direction, that is, in the main scanning direction, and each LED has a light emission pattern based on image data supplied from the control unit 3 (FIG. 1). The device emits light. The toner cartridge 22 contains toner as a developer, and is attached to the front upper side of the image forming unit 21. The toner cartridge 22 supplies the stored toner to a toner storage unit 31 formed in the upper front portion of the image forming unit 21.

  In the image forming unit 21, in addition to the toner containing unit 31, a supply roller 33, a developing roller 34, a regulation blade 35, a photosensitive drum 36, a charging roller 37, and the like are incorporated in an image forming frame 32. Each of the supply roller 33, the developing roller 34, and the charging roller 37 is formed in a cylindrical shape with the central axis extending in the left-right direction, and rotates in the direction of the arrow R2 around each central axis, and each peripheral side surface is charged. It has become possible to let you. The regulating blade 35 is made of a plate-like metal material that is long in the left-right direction, and its long side is in contact with the peripheral side surface of the developing roller 34.

  The photosensitive drum 36 is disposed directly below the LED head 23, is formed in a cylindrical shape with the central axis extending in the left-right direction, like the supply roller 33, and rotates around the central axis. The photosensitive drum 36 is coated with a photosensitive material on its peripheral side surface. The transfer roller 25 is located directly below the photosensitive drum 36, is formed in a cylindrical shape with the central axis extending in the left-right direction, rotates around the central axis, and can charge the peripheral side surface. It has become.

  When a driving force is supplied from a motor (not shown) based on the control of the control unit 3 (FIG. 1), the image forming unit 15 moves the supply roller 33, the developing roller 34, the charging roller 37, and the transfer roller 25 in the direction of arrow R2. And the photosensitive drum 36 is rotated in the direction of the arrow R1. For this reason, when the sheet P is conveyed from the front along the conveyance path W, the image forming unit 15 sandwiches the sheet P between the lower end of the photosensitive drum 36 and the upper end of the transfer roller 25 and conveys the sheet P to the rear. .

  The image forming unit 15 is charged by applying a predetermined bias voltage to the supply roller 33, the developing roller 34, the regulating blade 35, and the charging roller 37, respectively. The supply roller 33 adheres the toner in the toner containing portion 31 to the peripheral side surface by this charging, and causes the toner to adhere to the peripheral side surface of the developing roller 34 by rotation. The rotating developing roller 34 removes excess toner from the peripheral side surface by the regulating blade 35 so that the toner adheres in a uniform thin film, and then the peripheral side surface abuts on the peripheral side surface of the photosensitive drum 36. Make contact.

  On the other hand, the charging roller 37 is in contact with the photosensitive drum 36 in a charged state, thereby uniformly charging the contact portion on the peripheral side surface of the photosensitive drum 36, that is, the rear upper portion. The LED head 23 emits light with a light emission pattern based on the image data supplied from the control unit 3 (FIG. 1), thereby exposing the peripheral side surface of the photosensitive drum 36. Thus, an electrostatic latent image based on the image data is formed on the photosensitive drum 36 in the vicinity of the upper end on the peripheral side surface.

  Subsequently, as the photosensitive drum 36 rotates in the direction of the arrow R1, the portion where the electrostatic latent image is formed is sequentially brought into contact with the developing roller 34. As a result, the photosensitive drum 36 transfers toner from the peripheral side surface of the developing roller 34 and develops a toner image based on the electrostatic latent image on the peripheral side surface.

  Further, the photosensitive drum 36 rotates in the direction of the arrow R1 to advance the developed toner image to the lower end, that is, the contact portion with the transfer roller 25. At this time, if the sheet P is sandwiched between the photosensitive drum 36 and the transfer roller 25, the toner image is transferred from the peripheral side surface to the sheet P by charging of the transfer roller 25.

  As described above, the image forming unit 15 causes the LED head 23 to emit light based on the image data supplied from the control unit 3, thereby forming a toner image on the peripheral side surface of the photosensitive drum 36. It is supposed to be transferred to.

[1-3. Configuration of LED head]
Next, the configuration of the LED head 23 will be described. 3A shows a front view and the A1-A2 cross section and B1-B2 cross section thereof are shown in FIG. 4A and FIG. It is formed in a short rectangular parallelepiped shape.

  For convenience of explanation, in the following description, the left direction, the forward direction, and the downward direction are defined as an X direction, a Y direction, and a Z direction, respectively. In the following, for convenience, the X direction side and the opposite side are also referred to as + X side and −X side, respectively. The same applies to the Y direction and the Z direction. Incidentally, in FIG. 3A, for convenience of explanation, the upper side of the figure represents the downward direction (Z direction). 4A and 4B, the position of the photosensitive drum 36 when the LED head 23 is incorporated in the image forming unit 15 is indicated by a broken line.

  The LED head 23 is roughly composed of a holding plate 41, an LED substrate 42, a rod lens array 43, a cover 44, and a sealing material 45. As shown in FIGS. 4A and 4B, the LED head 23 has an LED substrate 42 and a rod lens array 43 attached to the holding plate 41 on the Y direction side, and the LED substrate 42 and the rod lens array. A cover 44 is attached so as to cover the Y direction side of 43. In the LED head 23, as shown in FIG. 3A, the gaps between the holding plate 41, the rod lens array 43, and the cover 44 are appropriately sealed with a sealing material 45.

  In FIG. 3B, the LED substrate 42 and the rod lens array 43 are attached to the holding plate 41 by omitting the cover 44 and the sealing material 45 from the state of FIG. 3A (ie, the completed LED head 23). It represents the state that was done. FIG. 3C shows a state in which only the holding plate 41 is viewed from the Y direction by further omitting the LED substrate 42 and the rod lens array 43 from the state of FIG. Further, FIG. 3D shows a state in which the holding plate 41 is viewed from the Z direction.

  The LED board 42 (FIG. 3B and FIG. 4) includes a circuit board 47, a plurality of LED chips 48, and a connector 49. The circuit board 47 is a so-called printed wiring board, and is formed in a plate shape that is long in the X direction (namely, left and right direction), short in the Z direction (up and down direction), and thin in the Y direction (front and back direction). The circuit board 47 has a wiring pattern made of a copper foil layer or the like formed on the surface of a base material made of glass epoxy resin or the like and is made of a resist material made of insulating resin. The surface is protected.

  Although the wiring pattern of the circuit board 47 is formed so as to electrically connect each LED chip 48, the connector 49, or other mounting parts not shown, it is arranged so as to avoid the flat area 47A. ing. In the flat region 47A, for example, a uniform copper foil layer is formed, or the copper foil layer is omitted and a resist layer is uniformly formed, so that the surface on the Y direction side is finished flat. Yes.

  Each LED chip 48 is formed in an elongated rectangular parallelepiped shape along the X direction as a whole, and a plurality of LED elements are aligned along the X direction. As shown in FIG. 4A, each LED element emits light L1 that is divergent light in the Z direction. When the LED head 23 is attached to the image forming unit 15 (FIG. 2) and assembled into the printer housing 2 (FIG. 1), the connector 49 is a wiring material (on the printer housing 2 side). (Not shown) are connected.

  The rod lens array 43 is formed in a rectangular parallelepiped shape that is long in the X direction, and a large number of minute cylindrical lenses (refractive index distribution type lenses) having a central axis directed in the Z direction are arranged along the X direction. . Incidentally, the length in the X direction of the rod lens array 43 is substantially equal to the total value of the lengths in the X direction of all the LED chips 48 mounted on the LED substrate 42, and the length in the X direction of the circuit board 47. It is shorter than that.

  As will be described later, the LED head 23 is attached to the holding plate 41 after the positions of the LED substrate 42 and the rod lens array 43 are appropriately adjusted at the time of manufacture. As a result, when the LED head 23 is incorporated in the image forming unit 15 as shown in FIG. 4A, the light L1 emitted from each LED element of the LED chip 48 is made minute in the rod lens array 43. The light can be condensed by the lens, and the focal point can be adjusted to the surface of the photosensitive drum 36.

  The cover 44 is manufactured, for example, by molding a predetermined resin material, and is roughly composed of a cover main body 51 and four cover legs 52. The cover body 51 is formed in a plate shape that is long in the X direction and short in the Z direction as a whole. The lengths of the cover main body 51 in the X direction and the Z direction are both shorter than the holding plate 41 and longer than the LED substrate 42. For this reason, when the cover main body 51 is attached to the holding plate 41, it can cover the Y side of the LED substrate 42 without protruding from the holding plate 41 in the X direction and the Z direction. The cover leg portion 52 is long in the Y direction and short in the Z direction and the X direction, that is, is formed in an elongated prismatic shape along the Y direction, and extends from the −Y side of the cover main body portion 51 to the −Y direction. Each is erected.

  As shown in FIGS. 3 (C) and 3 (D) and FIGS. 4 (A) and 4 (B), the holding plate 41 is roughly divided into a flat plate portion 61 and the Z direction side edge of the flat plate portion 61. And a positioning portion 62 erected in the Y direction from a part thereof. The holding plate 41 is manufactured, for example, by cutting a single steel plate into a predetermined shape and forming a hole or the like to be described later, and then bending the positioning portion 62 at an angle of about 90 degrees.

  The flat plate portion 61 is formed in a plate shape that is long in the X direction, short in the Z direction, and thin in the Y direction. The lengths in the X direction and the Z direction in the flat plate portion 61 are longer than the lengths in the X direction and the Z direction in the LED substrate 42, respectively (FIG. 3B). The length in the Y direction, that is, the thickness of the flat plate portion 61 is long (thick) to such an extent that the flat plate portion 61 has sufficient bending strength and does not bend easily. For convenience of explanation, hereinafter, the Y side and the −Y side of the flat plate portion 61 are also referred to as one surface side and the other surface side, respectively.

  The positioning portion 62 is erected on the Z side end side of the outer periphery of the flat plate portion 61 near the X side and −X side ends. Each positioning portion 62 is formed in a plate shape having a thickness equivalent to that of the flat plate portion 61. The positioning portion 62 has a cutout portion 62 </ b> C formed by cutting out one portion on each of the X side and the −X side.

  A rod lens array support portion 63 is provided between the positioning portions 62 provided near the X-side and −X-side end portions of the Z-side end sides of the flat plate portion 61. The rod lens array support portion 63 is formed in a flat shape continuous with the flat plate portion 61 by extending the Z side edge of the flat plate portion 61 further to the Z side than the standing position of the positioning portion 62. Has been. Further, the length in the X direction of the rod lens array support portion 63 is substantially equal to the length of the rod lens array 43 in the X direction.

  For this reason, the holding plate 41 can attach the rod lens array 43 to a position where the holding plate 41 approaches or contacts the rod lens array support portion 63 between the positioning portions 62 provided on the X side and the −X side, respectively. . Incidentally, as shown in FIGS. 4A and 4B, the rod lens array 43 has a portion near the Z-side end of the holding plate 41 from the Z-direction end of the rod lens array support 63 to the Z-side. Installed so that it protrudes.

  In addition to this configuration, the flat plate portion 61 is provided with a plurality of mounting holes such as an LED board mounting hole 66, a rod lens array mounting hole 67, and a cover mounting hole 68, as shown in FIG. Yes. Each mounting hole is a round hole having a relatively small diameter, and penetrates the flat plate portion 61 in the Y direction as shown in FIG.

  The LED board mounting holes 66 are arranged in a range in which the LED board 42 (FIG. 3B) is mounted on the flat plate portion 61. For example, two LED board mounting holes 66 are provided along the Z direction and 12 LED boards are provided along the X direction. In addition, they are arranged in a lattice shape in which a plurality of them are discretely arranged in the Z direction and the X direction. Incidentally, the row on the Z side of the LED board mounting holes 66 is located in the vicinity of the end portion on the Z side of the LED board 42, that is, on the Z side from the LED chip 48 (FIG. 4A).

  The rod lens array mounting hole 67 is arranged at a portion on the −Z side in a range in which the rod lens array 43 (FIGS. 3B and 4A) is mounted on the flat plate portion 61. For example, in the Z direction. 1 along the X direction, 8 along the X direction, and so on.

  The cover attaching hole 68 is in the vicinity of each vertex of the rectangle in the rectangular range to which the cover 44 (FIG. 3A) is attached in the flat plate portion 61, and the four cover leg portions 52 ( They are arranged at four locations corresponding to FIG.

  As will be described later, the holding plate 41 is placed in the LED board mounting hole 66, the rod lens array mounting hole 67, and the cover mounting hole 68 with the positions of the LED board 42, the rod lens array 43, and the cover 44 adjusted, respectively. When the applied adhesive 60 is cured, the LED substrate 42, the rod lens array 43, and the cover 44 can be held. Incidentally, the adhesive 60 is a UV curable resin that is cured by irradiation with UV (Ultra Violet) light.

[1-4. Production of LED head]
Next, manufacture of the LED head 23 will be described. The LED head 23 is manufactured by a procedure according to the LED head manufacturing process procedure RT1 shown in FIG. In this LED head manufacturing process procedure RT1, first, in step SP1, as a preparatory process, the components constituting the LED head 23, that is, the holding plate 41, the LED substrate 42, the rod lens array 43, and the cover 44 are prepared by an operator or the like. Is done. Incidentally, the LED substrate 42 is assumed to have the LED chip 48 and the connector 49 (FIG. 3) already mounted thereon.

  In the LED head manufacturing process procedure RT1, the LED substrate 42, the rod lens array 43, and the cover 44 (FIGS. 3 and 4) are bonded to the holding plate 41 by the bonding apparatus 70 shown in FIG. The Further, in the LED head manufacturing process procedure RT1, after the sealing material 90 is applied to the gap between the holding plate 41 and the cover 44 by the sealing device 90 shown in FIG. 7 in step SP3, the process proceeds to step SP4. As a result, the LED head 23 is completed.

[1-4-1. Structure of bonding device]
Next, the configuration of the bonding apparatus 70 (FIG. 6) will be described. The entire bonding device 70 is controlled by the bonding controller 71. The adhesion controller 71 includes storage units such as a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and a flash memory, and controls the entire adhesion apparatus 70 in an integrated manner. Incidentally, in the bonding apparatus 70, the lower side of the figure is the Y direction and the left side of the figure is the Z direction in accordance with the posture of the LED head 23 to be manufactured.

  The bonding apparatus 70 includes a position reference unit 72, an LED substrate moving unit 73, an LED driving unit 74, a rod lens array moving unit 75, a cover moving unit 76, a camera 77, a camera moving unit 78, an image processing unit 79, and an adhesive. A syringe 80 and a syringe moving unit 81 are provided.

  The position reference portion 72 is formed in a rectangular parallelepiped shape that is long in the X direction as a whole, and a reference surface 72S that is a side surface on the −Z side is formed flat. On the reference surface 72S, positioning protrusions 72P are erected on the −Z side at two locations separated by a predetermined interval in the X direction. Each positioning projection 72P is formed in a columnar shape with the central axis along the Z direction, and the diameter thereof is larger than the length in the X direction at the notch 62C provided in the positioning portion 62 of the holding plate 41 (FIG. 3). Is slightly shorter. Further, the position reference portion 72 incorporates a suction portion for sucking the holding plate 41 (FIGS. 3 and 4) on the reference surface 72S.

  The position reference portion 72 has a fixed mounting position with respect to the bonding apparatus 70. In particular, the reference plane 72S is aligned with a predetermined Z-direction position Z1 in the Z direction. Further, the position on the −Y side (that is, the upper end in FIG. 6) of the positioning protrusion 72P is aligned with the predetermined Y direction position Y1 in the Y direction.

  The LED board moving part 73 is formed long along the X direction as a whole, and an adsorption part 73A for adsorbing the LED board 42 is incorporated on the −Y side (that is, the upper side in FIG. 5). The LED substrate moving unit 73 can freely move in the Y direction and the Z direction based on the control of the adhesion control unit 71.

  The LED drive unit 74 is connected to the LED board 42 (FIGS. 3 and 4) and supplies a predetermined LED drive signal to the LED board 42, whereby the LED chip 48 (FIG. 4) of the LED board 42 is supplied. The light L1 is emitted with a predetermined light emission pattern and light quantity from (A).

  The rod lens array moving unit 75 is formed to be long along the X direction as a whole, and an adsorption unit 75A for adsorbing the rod lens array 43 is incorporated on the −Y side (that is, the upper side in FIG. 5). . The rod lens array moving unit 75 can move freely in the Y direction and the Z direction based on the control of the adhesion control unit 71, similarly to the LED substrate moving unit 73.

  The cover moving part 76 is formed to be long along the X direction as a whole, and an adsorption part 76A for adsorbing the cover 44 is incorporated on the −Y side (that is, the upper side in FIG. 5). The position of the cover moving unit 76 in the Z direction with respect to the position reference unit 72 is appropriately determined in advance. Based on the control of the adhesion control unit 71, the cover moving unit 76 is moved in the Y direction via the support unit 76S located on the Y side. It can move freely.

  The cover moving part 76 has a spring incorporated between the adsorption part 76A and the support part 76S. For this reason, the cover moving part 76 compresses the spring when a force in the Y direction is applied to the support part 76S in a state where the movement of the adsorption part 76A is restricted, and brings the adsorption part 76A closer to the support part 76S. When the force is released, the spring is extended to move the suction portion 76A away from the support portion 76S again.

  The camera 77 is attached to the −Z side of the camera moving unit 78, picks up an image on the −Z side with a built-in image sensor, and supplies the obtained image to the image processing unit 79. As will be described later, the camera 77 is assumed to image the light L1 emitted from the LED chip 48 of the LED substrate 42 (FIG. 4 and the like) and collected by the rod lens array 43.

  In the camera 77, the position of the imaging center in the Y direction is set to a Y direction position Y2 that is a predetermined distance LY away from the Y direction position Y1 (that is, the upper end of the positioning protrusion 72P) in the Y direction. The camera moving unit 78 can move freely in the Z direction integrally with the camera 77 based on the control of the adhesion control unit 71. That is, the camera 77 can move in the Z direction while keeping the position of the imaging center in the Y direction at the Y direction position Y1.

  The image processing unit 79 performs predetermined image processing on the image obtained from the camera 77, thereby calculating the size and contrast of the beam spot in the light L1, and supplies these to the adhesion control unit 71. In response to this, the adhesion controller 71 determines a position where the LED substrate 42 and the rod lens array 43 should be moved, and appropriately controls the LED substrate moving portion 73 and the rod lens array moving portion 75 and the like. .

  The adhesive syringe 80 includes a storage portion that stores the liquid adhesive 60 and a tubular portion that is connected to the storage portion and is formed in an elongated tubular shape. The adhesive syringe 80 discharges an appropriate amount of the adhesive 60 from the tip of the tubular portion under the control of the adhesion control unit 71. The adhesive syringe 80 is attached to the Y side of the syringe moving unit 81. The syringe moving unit 81 can move freely in the X direction, the Y direction, and the Z direction integrally with the adhesive syringe 80 based on the control of the adhesion control unit 71.

[1-4-2. Adhesion treatment]
Next, step SP2 of the LED head manufacturing process procedure RT1 (FIG. 5), that is, the bonding process will be described in detail. In this bonding process, the bonding control unit 71 of the bonding apparatus 70 (FIG. 6) sequentially performs a procedure according to the bonding processing procedure RT2 shown in FIG. Incidentally, as shown in FIG. 6, the bonding apparatus 70 in the initial state, from the position reference unit 72 to the LED substrate moving unit 73, the rod lens array moving unit 75, the cover moving unit 76, the camera 77 and the camera moving unit 78, and The adhesive syringe 80 and the syringe moving part 81 are kept away from each other.

  When the adhesion control procedure 71 of the adhesion apparatus 70 starts the adhesion processing procedure RT2, the process first proceeds to step SP11. In step SP11, as shown in FIG. 9, the adhesion control unit 71 performs the operation of a worker or the like, the holding plate 41 to the position reference unit 72, the LED substrate 42 to the LED substrate moving unit 73, and the rod lens array 43 to the rod. After the cover 44 is set on the cover moving unit 76 in the lens array moving unit 75, the process proceeds to the next step SP12.

  At this time, the holding plate 41 causes the side surface on the Z side of the positioning portion 62 to abut on the reference surface 72S of the position reference portion 72, causes the positioning protrusion 72P to enter the notch portion 62C (FIG. 3D), and flat plate. The Y-side surface of the portion 61 is set at a position where it abuts on the −Y-side end of the positioning protrusion 72P. At this position, the holding plate 41 is attracted to the positioning portion 62 by the attracting portion incorporated in the position reference portion 72. As a result, the holding plate 41 is held by the position reference portion 72 in a state where the Z-side surface of the positioning portion 62 is aligned with the Z-direction position Z1 and the Y-side surface of the flat plate portion 61 is aligned with the Y-direction position Y1. It becomes a state.

  The LED substrate 42 is integrated with the LED substrate moving unit 73 in the Y direction by adsorbing the flat region 47A (FIG. 3B) provided on the circuit substrate 47 to the adsorption unit 73A of the LED substrate moving unit 73. And it will be in the state which can move to a Z direction. The LED substrate 42 is electrically connected to the LED driving unit 74 by a predetermined wiring material.

  The rod lens array 43 is in a state where it can move in the Y direction and the Z direction integrally with the rod lens array moving unit 75 by adsorbing the surface on the Y side by the adsorbing unit 75A of the rod lens array moving unit 75. . The cover 44 is in a state where it can move in the Y direction integrally with the cover moving part 76 when the surface on the Y side is adsorbed by the adsorbing part 76A of the cover moving part 76.

  In step SP12, as shown in FIG. 10, the adhesion controller 71 causes the LED substrate moving unit 73, the rod lens array moving unit 75, and the camera moving unit 78 to move to predetermined positions, that is, close to the position reference unit 72, respectively. Move to next step SP13.

  Specifically, the adhesion control unit 71 moves the LED substrate moving unit 73 and the rod lens array moving unit 75 to move the LED substrate 42 and the rod lens array 43 on the Y side (that is, one surface side) of the flat plate unit 61. The LED head 23 (FIGS. 3 and 4) after completion is approximately aligned with each appropriate mounting position.

  Further, the adhesion control unit 71 moves the camera moving unit 78 to the −Z side by a predetermined distance, thereby moving the position of the image sensor incorporated in the camera 77 from the Z-direction position Z1 to the Z side by a predetermined distance LZ. Align with the Z direction position Z2 away. Incidentally, the position of the imaging element of the camera 77 with respect to the holding plate 41 at this time is equivalent to the position of the peripheral side surface of the photosensitive drum 36 with respect to the holding plate 41 in the LED head 23 shown in FIG. Further, the LED substrate 42 is moved to a position where a space having a sufficient length in the Y direction (hereinafter referred to as an adjustment space S) is formed between the LED substrate 42 and the flat plate portion 61 of the holding plate 41.

  In step SP13, the adhesion control unit 71 supplies a predetermined drive signal from the LED drive unit 74 to the LED substrate 42 to emit light L1 from each LED element of the LED chip 48, and proceeds to the next step SP14. . Thereby, the light L1 emitted from the LED chip 48 travels in the Z direction, is converged by the rod lens array 43, and is irradiated to the camera 77 in a state where a beam spot is formed. That is, a beam spot by the light L1 appears in the image captured by the camera 77. The image processing unit 79 calculates the size and contrast of the beam spot based on this image and supplies them to the adhesion control unit 71.

  In step SP14, the adhesion controller 71 adjusts the positions of the LED substrate 42 and the rod lens array 43 based on the size and contrast of the beam spot supplied from the image processor 79, and proceeds to the next step SP15.

  Specifically, the adhesion controller 71 first determines a position where the LED substrate 42 and the rod lens array 43 should be moved based on the size, contrast, and the like of the beam spot supplied from the image processor 79. Next, the adhesion control unit 71 controls the LED substrate moving unit 73 and the rod lens array moving unit 75 according to the determined positions, respectively, and moves the LED substrate 42 and the rod lens array 43, respectively. Accordingly, the camera 77 images the beam spot by the light L1 formed by the LED substrate 42 and the rod lens array 43 after the movement.

  Further, the adhesion controller 71 captures an image with the camera 77 in a state where the LED substrate 42 and the rod lens array 43 are moved to a plurality of positions according to a predetermined position adjustment algorithm. Then, the adhesion control unit 71 determines the optimum positions of the LED substrate 42 and the rod lens array 43 based on the size and contrast of the beam spot in each of the obtained plurality of images, and the LED at the determined position. The substrate 42 and the rod lens array 43 are moved. At this time, since the adjustment space S is formed between the LED substrate 42 and the flat plate portion 61, the LED substrate 42 is moved to the determined position without interfering with the flat plate portion 61.

  In step SP15, the adhesion controller 71 appropriately moves the adhesive syringe 80 and discharges the adhesive 60, thereby adhering the LED substrate 42 and the rod lens array 43 to the holding plate 41, and then proceeds to the next step SP16. Move.

  Specifically, the adhesion control unit 71 appropriately controls the syringe moving unit 81 so that the tip of the tubular portion of the adhesive syringe 80 is attached to each LED substrate in the flat plate portion 61 (FIG. 3C) of the holding plate 41. The adhesive 60 is sequentially moved in accordance with the holes 66 and the rod lens array mounting holes 67, and the adhesive 60 is discharged from the −Y side (that is, the other surface side). The adhesion controller 71 discharges the adhesive 60 while moving the tip of the tubular portion of the adhesive syringe 80 in the X direction along the Z-side end of the rod lens array support 63 of the holding plate 41.

  Subsequently, the adhesion controller 71 cures the liquid adhesive 60 by irradiating UV light from a UV light source (not shown) disposed on the −Y side of the holding plate 41. Thereby, the LED substrate 42 and the rod lens array 43 are fixed to the holding plate 41 while maintaining the adjusted position.

  In step SP16, the adhesion control unit 71 releases the suction by the suction units 73A and 75A, respectively, and then retracts the LED substrate moving unit 73, the rod lens array moving unit 75, and the camera moving unit 78 as shown in FIG. That is, it is moved away from the position reference unit 72, and the process proceeds to the next step SP17.

  In step SP17, the adhesion control unit 71 moves the cover moving unit 76 in the -Y direction, and proceeds to the next step SP18. As a result, as shown in FIG. 11, the cover 44 has four cover leg portions 52 arranged in four cover mounting holes 68 (see FIG. 3 (FIG. 3 ()) on the Y side (that is, one surface side) of the flat plate portion 61 of the holding plate 41. C)) is inserted.

  Incidentally, the cover moving unit 76 moves the support unit 76S by a predetermined distance in the Y direction in a state where the cover 44 is adsorbed to the adsorbing unit 76A. At this time, when the cover moving part 76 inserts each cover leg part 52 into the cover attachment hole 68 by a predetermined length, a part of the cover 44 is brought into contact with the Y side of the rod lens array 43. Compress the incorporated spring as appropriate. Accordingly, the cover moving unit 76 can maintain the cover 44 at a position where a part of the cover 44 is pressed against the rod lens array 43, that is, at an appropriate position with respect to the holding plate 41.

  In step SP18, as in step SP15, the adhesion controller 71 adheres the cover 44 to the holding plate 41 by appropriately moving the adhesive syringe 80 and discharging the adhesive 60, and proceeds to the next step SP19.

  Specifically, the adhesion control unit 71 controls the syringe moving unit 81 as appropriate so that the distal end of the tubular portion of the adhesive syringe 80 is connected to each cover mounting hole in the flat plate portion 61 (FIG. 3C) of the holding plate 41. 68, the adhesive 60 is discharged from the −Y side (that is, the other surface side), and then cured by being irradiated with UV light from the above-described UV light source (not shown). Accordingly, the cover 44 is fixed to the holding plate 41 while maintaining a position where a part of the cover 44 is pressed against the rod lens array 43.

  In step SP19, the adhesion controller 71 releases the suction by the suction part 76A and then retracts the cover moving part 76, that is, moves it away from the position reference part 72 in the Y direction to the position shown in FIG. Control goes to the next step SP20. In step SP20, the adhesion control unit 71 is the LED head 23 being manufactured, that is, the LED board 42, the rod lens array 43, and the cover 44 attached to the holding plate 41 (hereinafter referred to as “adhered”). The holding plate 41J) is removed from the position reference portion 72. Thereafter, the adhesion controller 71 moves to the next step SP21 and ends the adhesion processing procedure RT2.

[1-4-3. Configuration of sealing device and sealing process]
Next, the configuration of the sealing device 90 (FIG. 6) will be described. The sealing device 90 is configured to perform overall control by the sealing control unit 91. The sealing control unit 91 has a storage unit such as a CPU, ROM, RAM, flash memory, and the like, similarly to the adhesion control unit 71 (FIG. 5), and controls the entire sealing device 90 in an integrated manner. Incidentally, in the sealing device 90, the posture of the LED head 23 during manufacture is different from that of the bonding device 70 (details will be described later), the upper side of the figure is the Y direction, and the right side of the figure is the Z direction. It has become.

  The sealing device 90 is provided with a mounting table 92, a sealing material syringe 94, and a syringe moving unit 95. On the mounting table 92, the bonded holding plate 41J, which is the LED head 23 being manufactured, is mounted. The mounting table 92 is provided with a positioning portion 93 for aligning the position of the LED head 23.

  The sealing material syringe 94 has a configuration similar to that of the adhesive syringe 80 (FIG. 5), and includes a storage portion that stores the liquid or gel-like sealing material 45, and an elongated tubular shape that is connected to the storage portion. It is comprised by the made tubular part. The sealing material syringe 94 discharges an appropriate amount of the sealing material 45 from the distal end of the tubular portion under the control of the sealing control unit 91. The sealing material syringe 94 is attached to the mounting table 92 side of the syringe moving unit 95. The syringe moving unit 95 can move freely in the X direction, the Y direction, and the Z direction integrally with the sealing material syringe 94 based on the control of the sealing control unit 91.

  When the sealing process is performed by the sealing device 90, the bonded holding plate 41J is first mounted on the Y side of the mounting table 92 (that is, the upper side in FIG. 7). At this time, the holding plate 41 brings the flat plate portion 61 into contact with the Y side of the mounting table 92, and also brings the positioning unit 62 into contact with the −Z side of the positioning unit 93 of the mounting table 92, thereby The position of is determined.

  Next, the sealing device 90 controls the syringe moving part 95 so that the distal end of the tubular part of the sealing material syringe 94 is moved along the gap between the holding plate 41 and the cover 44 (FIGS. 3A and 4). The sealing material 45 is discharged while being moved, and the gap is sequentially filled. As a result, the gap between the holding plate 41 and the cover 44 in the bonded holding plate 41J is sealed with the sealing material 45, and the LED head 23 is completed.

[1-5. Effect]
In the above configuration, the LED head 23 according to the first embodiment is provided with a plurality of mounting holes such as the LED board mounting hole 66, the rod lens array mounting hole 67, and the cover mounting hole 68 in the flat plate portion 61 of the holding plate 41. It was. In addition, the LED head 23 applies the adhesive 60 to each mounting hole by the adhesive syringe 80 (FIG. 6, etc.) from the −Y side (that is, the other surface side) of the flat plate portion 61 of the holding plate 41 at the time of manufacture. Then, the LED substrate 42, the rod lens array 43, and the cover 44 are bonded (that is, fixed) to the holding plate 41 by being cured.

  Here, for comparison with the present embodiment, FIGS. 12A and 12B show LED heads 323 and 423 having other configurations. The LED head 323 uses a holding member 341 formed of aluminum die casting, resin, or the like instead of the holding plate 41, and uses an LED substrate 342 instead of the LED substrate 42. When the LED head 323 is manufactured, the adhesive 60 is applied and cured while the mounting member 345 to which the LED substrate 342 is mounted and the rod lens array 43 are in contact with predetermined positions on the holding member 341, respectively. . For this reason, in the LED head 323, it was necessary to apply the adhesive 60 from the Z side and the −Z side by the adhesive syringe 80 (FIG. 6) or the like at the time of manufacture.

  The LED head 423 uses a holding member 441 formed of a bent sheet metal or the like instead of the holding plate 41, and uses an LED substrate 442 instead of the LED substrate 42. When the LED head 423 is manufactured, the position of the mounting member 445 to which the LED substrate 442 is attached and the position of the rod lens array 43 are adjusted with respect to the holding member 441, and then the adhesive 60 is applied and cured. . For this reason, in the LED head 423, the adhesive 60 is applied from the Z side, the Y side, and the -Y side by the adhesive syringe 80 (FIG. 6) while maintaining the positions of the LED substrate 442 and the rod lens array 43 at the time of manufacture. It was necessary to apply.

  As described above, in the comparative LED heads 343 and 443, it is necessary to apply the adhesive 60 to the holding member 341 and the like from two or more directions at the time of manufacture. For this reason, in order to manufacture the LED heads 343 and 443 for comparison, for example, an adhesive 60 is applied while changing the posture of the holding member 341 or the like by an operator or the like, or the fixed holding member 341 or the like is applied. On the other hand, it was necessary to apply the adhesive 60 by bringing the adhesive syringe closer from a plurality of directions.

  However, when the posture of the holding member 341 or the like is changed by an operator or the like, it takes time and there is a possibility that the LED substrate 442 or the like is displaced from the adjusted position. Moreover, when the adhesive syringe 80 is made to approach from a plurality of directions, the configuration of the bonding apparatus becomes complicated. That is, the LED heads 343 and 443 require a relatively large amount of labor and cost for manufacturing.

  On the other hand, the LED head 23 according to the present embodiment applies the adhesive 60 only from the -Y side (the other surface side) of the flat plate portion 61 of the holding plate 41, that is, from one direction at the time of manufacture. The LED substrate 42, the rod lens array 43, and the cover 44 can all be bonded to the holding plate 41. For this reason, in the LED head 23, it is not necessary to change the posture of the holding plate 41 to an operator or the like at the time of manufacture, and it is not necessary to use a bonding apparatus having a complicated configuration that can apply an adhesive from a plurality of directions. The manufacturing cost can be reduced by suppressing the man-hours to a relatively low level and using a simple bonding apparatus.

  In other words, in general, when two objects are bonded using an adhesive, the adhesive is applied between the bonding surfaces or around the contact portion. If the adhesive is applied from the tip of the tubular portion as in the adhesive syringe 80 (FIG. 6), the direction or posture (angle) in which the adhesive syringe 80 is brought close to the object depending on the bonding surface or surrounding portion of the object. Need to be changed in various ways. In this case, there is a possibility that the mechanism for moving the adhesive syringe and changing its posture becomes extremely complicated.

  In this respect, in the LED head 23 according to the present embodiment, the purpose is to hold the LED substrate 42, the rod lens array 43, and the cover 44 at a predetermined relative position, and a holding plate that does not need to be provided with holes inherently. 41, the LED board mounting hole 66, the rod lens array mounting hole 67, and the cover mounting hole 68 are provided with respective mounting holes. As a result, the LED head 23 can apply an adhesive from the -Y side of the flat plate portion 61 between the flat plate portion 61 of the holding plate 41 and each component. Accordingly, in the bonding apparatus 70, the adhesive syringe 80 only needs to be brought close to the −Y side of the flat plate portion 61, and there is no need to change the posture thereof. Therefore, the syringe moving portion 81 is configured extremely simply. be able to.

  In addition, the LED head 23 is coated with the adhesive 60 by the adhesive syringe 80 from the −Y side (the other surface side) in a state where the position of the LED substrate 42 and the rod lens array 43 is adjusted with respect to the holding plate 41 at the time of manufacture. (Fig. 10). As a result, the LED head 23 can be bonded by the adhesive 60 without changing the positions and postures of the LED substrate 42 and the rod lens array 43 adjusted to appropriate positions with respect to the holding plate 41, respectively. Position accuracy can be secured.

  Further, in the bonding apparatus 70, the relative positions of the position reference unit 72 and the camera 77 are appropriately set in advance (FIG. 6). For this reason, the LED head 23 is adjusted not only to the relative positions of the LED substrate 42 and the rod lens array 43 but also to the positions of both components used as the holding plate 41 by a bonding apparatus 70 at an appropriate preset position. be able to. As a result, when the LED head 23 is attached to the image forming unit 15 (FIG. 2), the focus of the light L1 is adjusted to the peripheral side surface of the photosensitive drum 36 only by adjusting the attachment position of the holding plate 41 with respect to the image forming frame 32. Can be matched.

  According to the above configuration, the LED head 23 according to the first embodiment is provided with a plurality of mounting holes in the flat plate portion 61 of the holding plate 41 and with the positions of the LED substrate 42 and the rod lens array 43 adjusted. From the −Y side of the flat plate portion 61, the adhesive 60 was applied to the mounting holes by the adhesive syringe 80 and cured. As a result, the LED head 23 does not need to apply adhesive from a plurality of directions at the time of manufacture, and does not need to change the posture of each component such as the holding plate 41, so the positional accuracy of the LED substrate 42 and the rod lens array 43 is maintained. It can be easily manufactured as it is, and the manufacturing cost can be significantly reduced.

[2. Second Embodiment]
As shown in FIG. 13 corresponding to FIG. 3, the LED head 123 according to the second embodiment uses a holding plate 141 instead of the holding plate 41 as compared with the LED head 23 according to the first embodiment. Although different in point, the other points are configured similarly.

  As shown in FIGS. 13C and 13D, the holding plate 141 has side wall portions 162 toward the Y side at the −Z side end portion and the X side and −X side end portions of the flat plate portion 61, respectively. Although the point is different in that it is vertically provided, the other points are configured in the same manner. The holding plate 141 is manufactured, for example, by cutting a single steel plate into a predetermined shape and drilling each mounting hole, and then bending the positioning portion 62 and each side wall portion 162 at an angle of about 90 degrees. Is done.

  As in the first embodiment, the LED head 123 includes the sealing device 90 (FIG. 7) after the LED substrate 42, the rod lens array 43, and the cover 44 are bonded to the holding plate 141 by the bonding device 70 (FIG. 6). ) To apply the sealing material 45.

  By the way, in the LED head 23 (FIGS. 3 and 4) according to the first embodiment, nothing is provided at the −Z side end portion and the X side and −X side end portions of the flat plate portion 61 of the holding plate 41. Absent. For this reason, in the LED head 23, if the application position of the sealing material 45 is shifted in the direction away from the cover 44, the applied sealing material 45 adheres only on the holding plate 41, and the holding plate 41 and the cover 44. There was a possibility that the gaps of were not sealed.

  On the other hand, in the LED head 123 according to the second embodiment, as shown in FIG. 14 corresponding to FIG. 4A, a side wall portion 162 is formed at the −Z side end portion of the flat plate portion 61. For this reason, in the LED head 123, even if the application position of the sealing material 45 is shifted in the direction away from the cover 44, the applied sealing material 45 is dammed by the side wall portion 162, and a part thereof is adhered to the cover 44. Thus, the gap between the two can be sealed. Further, the LED head 123 can obtain the same effect by the side wall portion 162 on the X side and the −X side of the flat plate portion 61.

  In other respects, the LED head 123 according to the second embodiment can achieve the same effects as the LED head 23 according to the first embodiment.

  According to the above configuration, the LED head 123 according to the second embodiment has the side wall portions 162 at the −Z side end portion and the X side and −X side end portions of the flat plate portion 61 of the holding plate 141. Provided. Thereby, even if the sealing material 45 is applied to a place away from the cover 44, the LED head 123 blocks the sealing material 45 by the side wall portion 162 and attaches a part of the sealing material 45 to the cover 44 so that the gap Can be reliably sealed.

[3. Third Embodiment]
As shown in FIG. 15 corresponding to FIG. 4A, the LED head 223 according to the third embodiment is different from the LED head 23 according to the first embodiment in that the holding plate 241 instead of the holding plate 41 is used. However, the other points are configured in the same manner.

  The holding plate 241 is configured around a flat plate portion 261 that replaces the flat plate portion 61. Compared with the flat plate portion 61, the flat plate portion 261 is such that the row on the Z side (that is, the side closer to the rod lens array 43) of the LED board mounting holes 66 is positioned closer to the −Z side than the LED chip 48 of the LED board 42. However, the other points are configured in the same manner.

  By the way, it is known that the LED chip 48 of the LED substrate 42 incorporated in the LED head 223 generates heat due to the property as an LED element when emitting the light L1. Moreover, since the LED head 223 seals the space around the LED chip 48 with the sealing material 45 from the viewpoint of preventing entry of dust, dust, and the like, heat is easily trapped and the temperature is likely to rise.

  In the LED head 223, when the temperature rises, each component may expand or expand. For example, as shown in FIG. 16A, it is conceivable that the flat plate portion 261 of the holding plate 241 extends in the Z direction as indicated by an arrow T1. At this time, the holding plate 241 widens the distance between the row of the LED board mounting holes 66 located on the Z side and the rod lens array mounting hole 67, widens the distance between the LED chip 48 and the rod lens array 43, There is a possibility that the condensing position of the light L1 is deviated from the peripheral side surface of the photosensitive drum 36.

  Here, as shown in FIG. 16B, in the case of the LED head 23 according to the first embodiment, the Z-side row of the LED board mounting holes 66 is closer to the Z side than the LED chip 48 of the LED board 42. positioned. For this reason, in the LED head 23, when the LED substrate 42 is extended in the Z direction by heat, the LED chip 48 may be moved to the −Z side from the bonding position by the adhesive 60 as indicated by the arrow T2, that is, the rod lens array 43. There is a risk of widening the interval.

  In other words, in the LED head 23, when the rod lens array 43 is used as a reference, the space between the LED chip 48 is widened by the extension of the flat plate portion 61, and in addition, the LED chip 42 is extended by the extension of the LED substrate 42. There was a possibility that the interval of the would be further expanded.

  In this regard, in the LED head 223 according to the third embodiment, the Z-side row of the LED board mounting holes 66 is located on the −Z side with respect to the LED chip 48 of the LED board 42. For this reason, in the LED head 223, as shown in FIG. 16A, when the circuit board 47 of the LED board 42 is expanded in the Z direction by heat, the LED chip is removed from the bonding position by the adhesive 60 as indicated by an arrow T3. 48 can be moved to the Z side, and the space | interval with the rod lens array 43 can be narrowed.

  In other words, in the LED head 223, when the rod lens array 43 is used as a reference, the distance from the LED chip 48 is widened by the extension of the flat plate portion 61, but the distance from the LED chip 48 is increased by the extension of the circuit board 47. Narrowing, that is, the light condensing position of the light L1 can be brought closer to the peripheral side surface of the photosensitive drum 36 while the width of the interval is kept small.

  In other respects, the LED head 223 according to the third embodiment can achieve the same functions and effects as the LED head 23 according to the first embodiment.

  According to the above configuration, in the LED head 223 according to the third embodiment, the Z-side row of the LED board mounting holes 66 provided in the flat plate portion 261 of the holding plate 241 is arranged more than the LED chip 48 of the LED board 42. -Positioned on the Z side. As a result, the LED head 223 has a direction in which the extension of the flat plate portion 261 acts on the LED chip 48 and a direction in which the extension of the circuit board 47 acts on the LED chip 48 when each component is extended by heat generation. It can be in the opposite direction. As a result, the LED head 223 can keep the displacement width of the LED chip 48 relative to the rod lens array 43 small, and can bring the light L1 condensing position closer to the peripheral side surface of the photosensitive drum 36.

[4. Other Embodiments]
In the above-described first embodiment, the case where the LED substrate 42, the rod lens array 43, and the cover 44 are all bonded to the holding plate 41 by the bonding device 70 has been described. However, the present invention is not limited to this. For example, the rod lens array 43 may be attached to the holding plate 41 in advance by another manufacturing process, and the LED substrate 42 and the cover 44 may be attached by the bonding device 70. The same applies to the second and third embodiments.

  In the first embodiment described above, the rod lens array 43 is bonded to the flat plate portion 61 using the rod lens array mounting hole 67 (FIG. 3C) provided in the flat plate portion 61 of the holding plate 41. Said about the case. However, the present invention is not limited to this. For example, like the holding plate 541 shown in FIG. 17, the rod lens array mounting hole 67 is omitted, and a rectangular wave rod lens array support 63 is provided at the end on the Z side. The adhesive 60 may be applied and adhered along a rectangular wave shape. In short, the rod lens array 43 may be bonded to the flat plate portion 61 by applying the adhesive 60 from the −Y side at a plurality of locations different in the Z direction. The same applies to the second and third embodiments.

  Furthermore, in the above-described first embodiment, the case where the LED board mounting holes 66 are arranged in a two-row grid pattern in the Z direction in the flat plate portion 61 of the holding plate 41 has been described. However, the present invention is not limited to this. For example, the LED board mounting holes 66 may be arranged so that the positions in the X direction are different for each row in the Z direction, or only around the connector 49 so as to increase the density. Alternatively, they may be arranged at various positions such as randomly arranged. The same applies to the rod lens array mounting hole 67. The same applies to the second and third embodiments. However, in the third embodiment, the LED chip 48 may be arranged on the −Z side.

  Furthermore, in the above-described first embodiment, the case where each mounting hole is a round hole having substantially the same size has been described. However, the present invention is not limited to this. For example, holes having various shapes such as square holes and long holes may be used, and a plurality of types of holes may be mixed. The same applies to the second and third embodiments.

  Furthermore, in the above-described first embodiment, the case where the adjustment space S is formed between the flat plate portion 61 of the holding plate 41 and the LED substrate 42 has been described (FIG. 10). However, the present invention is not limited to this. For example, the adjustment space S may be omitted by bringing the LED board 42 into contact with the flat plate portion 61. In this case, for example, an adjustment space is formed between the flat plate portion 61 of the holding plate 41 and the rod lens array 43, so that the relative relationship between the LED substrate 42 and the rod lens array 43 is not obstructed by the flat plate portion 61. What is necessary is just to be able to adjust a correct position. The same applies to the second and third embodiments.

  Furthermore, in the first embodiment described above, a case where a uniformly flat region 47A is formed on the −Z side of the LED chip 48 in the circuit substrate 47 of the LED substrate 42 (FIG. 3B) will be described. It was. However, the present invention is not limited to this. For example, in the LED substrate moving unit 73 of the bonding apparatus 70 (FIG. 6), the suction unit 73A is provided at a plurality of discrete locations along the X direction. The flat region 47A may be formed only in the vicinity of the portion adsorbed by 73A. The same applies to the second and third embodiments.

  Furthermore, in the first embodiment described above, the notch 62C (FIG. 3D) is provided in the positioning portion 62 of the holding plate 41, and the holding plate 41 is attached to the position reference portion 72 of the bonding apparatus 70. The case where the position of the holding plate 41 with respect to the position reference portion 72 is adjusted by inserting the positioning protrusion 72P of the position reference portion 72 into the notch 62C has been described. However, the present invention is not limited to this. For example, a protrusion protruding in the Z direction or the Y direction is provided on the holding plate 41 side, and a hole or a notch is formed in the position reference portion 72 to engage them. By performing (fitting), the position of the holding plate 41 with respect to the position reference portion 72 may be adjusted. The same applies to the second and third embodiments.

  Further, in the above-described first embodiment, the holding plate 41 is provided with the positioning portion 62 (FIG. 3D), and the positioning portion 62 is sucked by the suction portion incorporated in the position reference portion 72 (FIG. 6). The case of letting it was described. However, the present invention is not limited to this. For example, the positioning portion 62 is omitted from the holding plate 41 and a part of the flat plate portion 61 is extended in the Z direction and is held in the position reference portion 72 by using the extended portion. The plate 41 may be attached. In this case, the position reference unit 72 holds the holding plate 41 using, for example, a magnetic force or an attractive force, or holds the holding plate 41 by holding it with a predetermined holding member from the Y side and the −Y side. The holding plate 41 can be held by various methods. In short, it is only necessary that the holding plate 41 can be easily held and released by the position reference portion 72 and the position when held can be adjusted with high accuracy. The same applies to the second and third embodiments.

  Furthermore, in the first embodiment described above, the cover 44 is held with the −Y side tip of the cover leg portion 52 of the cover 44 inserted into the cover mounting hole 68 in the flat plate portion 61 of the holding plate 41. The case of bonding to the plate 41 has been described (FIG. 11). However, the present invention is not limited to this, and for example, the −L side tip of the cover leg 52 may be bonded in a state where it is floated on the Y side of the cover mounting hole 68 or in contact with the flat plate portion 61. The same applies to the second and third embodiments.

  Furthermore, in the first embodiment described above, the case where the adhesive 60 is applied along the Z-side end of the rod lens array support 63 when the rod lens array 43 is bonded to the holding plate 41 has been described. (FIG. 4 (A)). However, the present invention is not limited to this. For example, the adhesive 60 is applied and bonded to a plurality of discrete locations at the Z side end of the rod lens array support 63, and then the Z side of the rod lens array support 63 is covered. The gap between the rod lens array support 63 and the rod lens array 43 may be sealed by applying the sealing material 45 along the end. The same applies to the second and third embodiments.

  Further, in the second embodiment described above, the case where the side wall portions 162 are provided at the −Z side end portion and the X side and −X side both end portions of the flat plate portion 61 of the holding plate 141 has been described (FIG. 13). (C)). However, the present invention is not limited to this, and the side wall portion 162 may be provided only on a part of the outer periphery of the flat plate portion 61, such as only the end portion on the −Z side of the flat plate portion 61.

  Furthermore, in the above-described first embodiment, the case where the gap between the holding plate 41 and the cover 44 is sealed with the sealing material 45 has been described. However, the present invention is not limited to this, and the sealing material 45 may be omitted when the cover 44 can be brought into close contact with the holding plate 41 by devising the shape of the cover 44, the nature of the material, or the like. The same applies to the second and third embodiments.

  Further, in the above-described first embodiment, the case where the cover 44 is provided on the LED head 23 has been described. However, the present invention is not limited to this. For example, the cover 44 and the sealing material 45 may be omitted from the LED head 23. In this case, for example, the shape on the image forming frame 32 side in the image forming unit 15 (FIG. 2) is devised, and the LED head 23 is attached to the image forming frame 32 so that the space around the LED chip 48 is sealed. May be. The same applies to the second and third embodiments.

  Furthermore, in the first embodiment described above, when the holding plate 41 is manufactured, one steel plate is cut into a predetermined shape and each mounting hole is formed, and then the positioning portion 62 is set at an angle of about 90 degrees. The case of bending is described. However, the present invention is not limited to this. For example, the holding plate 41 may be manufactured by cutting a rectangular parallelepiped metal material or molding a resin material. The same applies to the second and third embodiments.

  Further, in the above-described first embodiment, the case where the adhesive 60 is a UV curable resin has been described. However, the present invention is not limited to this, and adhesives having various properties such as an adhesive that cures in a short time may be used. The same applies to the second and third embodiments.

  Furthermore, in the above-described first embodiment, the case where the present invention is applied to the LED head 23 in the image forming unit 15 of the image forming apparatus 1 which is an electrophotographic printer has been described. However, the present invention is not limited to this, and may be applied to various apparatuses that form an image on a sheet using an LED head, such as a copying machine, a facsimile machine, or an MFP (Multi Function Printer) combining them.

  Furthermore, the present invention is not limited to the above-described embodiments and other embodiments. That is, the scope of the present invention extends to embodiments in which some or all of the above-described embodiments and other embodiments described above are arbitrarily combined, and embodiments in which some are extracted. It is.

  Further, in the above-described embodiment, a case where the LED head 42 as the exposure apparatus is configured by the LED substrate 42 as the light emitting element substrate, the rod lens array 43 as the lens array, and the holding plate 41 as the holding plate. Stated. However, the present invention is not limited to this, and the exposure apparatus may be configured by a light emitting element substrate having various configurations, a lens array, and a holding plate.

  The present invention can be used, for example, in an LED head of an exposure apparatus mounted on an electrophotographic printer.

  DESCRIPTION OF SYMBOLS 1 ... Image forming apparatus, 2 ... Printer housing, 3 ... Control part, 15 ... Image forming unit, 23, 123, 223 ... LED head, 32 ... Image forming frame, 36 ... Photoconductor drum 41, 141, 241 ... holding plate, 41J ... bonded holding plate, 42 ... LED substrate, 43 ... rod lens array, 44 ... cover, 45 ... sealing material, 47 ... circuit board, 47A: Flat region, 48 ... LED chip, 49 ... Connector, 51 ... Cover body, 52 ... Cover leg, 60 ... Adhesive, 61, 261 ... Flat plate, 62 ... Positioning part 62C: Notch, 63: Rod lens array support, 66: LED board mounting hole, 67: Rod lens array mounting hole, 68: Cover mounting hole, 70: Bonding device, 71: Bonding Control unit, 72 ... position Associate part, 72P ...... Positioning protrusion, 72S .... Reference plane, 73 ... LED substrate moving part, 74 ... LED driving part, 75 ... Rod lens array moving part, 76 ... Cover moving part, 77 ... Camera 78 ...... Camera moving unit, 79 ... Image processing unit, 80 ... Adhesive syringe, 81 ... Syringe moving unit, 90 ... Sealing device, 91 ... Sealing control unit, 92 ... Mounting table, 93: Positioning part, 94: Sealing material syringe, 95 ... Syringe moving part, 162 ... Side wall part, L1 ... Light, S ... Adjustment space, Y1, Y2 ... Y direction position, Z1, Z2 ... Z position.

Claims (13)

A light emitting element substrate on which a plurality of light emitting elements are mounted;
A lens array for converging light respectively emitted from the light emitting elements,
The lens array is held on one surface side, and a plurality of substrate mounting holes are provided, and a holding plate that holds the light emitting element substrate on the one surface side by an adhesive applied to the substrate mounting holes. A featured exposure apparatus. The exposure apparatus according to claim 1, wherein the holding plate holds the lens array with an adhesive. The exposure apparatus according to claim 2, wherein the holding plate is provided with a plurality of lens array mounting holes, and holds the lens array by an adhesive applied to the lens array mounting holes. A cover having a main body that covers the light-emitting element substrate, and a plurality of cover legs extending from the main body;
2. The exposure according to claim 1, wherein the holding plate further includes a plurality of cover mounting holes, and holds the cover via the cover legs by an adhesive applied to the cover mounting holes. apparatus. The said holding | maintenance board hold | maintains the said cover via this cover leg part with the said adhesive in the state in which a part of said cover leg part was inserted in the said cover attachment hole. Exposure device. The exposure apparatus according to claim 4, further comprising: a sealing material that seals a gap between the holding plate and the cover. The exposure apparatus according to claim 6, wherein the holding plate has a side wall portion extending toward the light emitting element substrate on at least a part of the outer periphery. The exposure apparatus according to claim 7, wherein the holding plate is made of a steel plate, and the side wall portion is formed by bending the steel plate. The exposure apparatus according to claim 1, wherein the holding plate forms an adjustment space for adjusting the position of the light emitting element substrate between the holding plate and the light emitting element substrate. The exposure apparatus according to claim 1, wherein the light emitting element substrate is a printed wiring board on which a circuit is formed by a wiring pattern, and a flat region where the wiring pattern is not disposed is provided. 2. The exposure apparatus according to claim 1, wherein the light emitting element substrate is held on the holding plate by the adhesive at a position opposite to the lens array with respect to the light emitting element. An image forming apparatus comprising the exposure apparatus according to claim 1. On one side of the holding plate provided with a plurality of substrate mounting holes, the relative position between the light emitting element substrate on which the plurality of light emitting elements are mounted and the lens array that converges the light emitted from each of the light emitting elements is adjusted. A position adjustment step;
An exposure apparatus manufacturing method comprising: an adhesion step of adhering the light emitting element substrate to the holding plate by applying an adhesive to the substrate mounting hole from the other surface side of the holding plate.

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