JP2017131815A - Electrospray device and pellicle formation method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electrospray device capable of inhibiting the thickness of a pellicle deposited on a substrate from being dispersed by electric charges that electrifies a pellicle of a solution material deposited on the substrate.SOLUTION: This electrospray device comprises a nozzle 1 that sprays the solution material in a state of being impressed with voltage and a control part 7 (switch part 4) that alternately switches a first operation for spraying the solution material electrified by impressing a first voltage 10a on the nozzle 1 to a substrate 3 and a second operation for spraying the solution material electrified in a polarity reverse to the polarity of the solution material sprayed in the first operation to the substrate 3.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an electrospray apparatus and a thin film forming method, and more particularly to an electrospray apparatus including a nozzle that sprays a solution material in a state where a voltage is applied to the solution material and a thin film forming method.

  Conventionally, an electrospray apparatus that deposits a solution material sprayed from a nozzle as a thin film on a substrate is known (see, for example, Patent Document 1).

  Patent Document 1 discloses an electrospray apparatus that includes a plate on which a substrate is placed and a nozzle that sprays a solution material in a state where a voltage is applied to the substrate. In this electrospray apparatus, the substrate is disposed on the surface of a metal plate (on the nozzle side surface). The metal plate is grounded. Accordingly, an electric field is generated between the nozzle and the metal plate, so that the solution material can be sprayed (applied) even when the substrate is non-conductive.

JP 2014-147891 A

  However, in the electrospray device described in Patent Document 1, since the solution material in a state where a voltage (positive voltage) is applied from the nozzle is sprayed (applied) to the substrate, the solution material deposited on the substrate and the substrate The thin film may be charged with a charge (positive charge). In this case, the charge charged on the thin film of the solution material deposited on the substrate (positive charge) and the solution material sprayed from the nozzle are repelled and charged with the charge sprayed from the nozzle (positive charge). There is a disadvantage that the material is difficult to deposit (attach) on the substrate. In addition, the electric field between the nozzle and the substrate (metal plate) is weakened due to the electric charge charged on the thin film of the solution material deposited on the substrate, and the solution material cannot be sprayed from the nozzle in a stable state. There is. For these reasons, there is a problem that the thickness of the thin film deposited on the substrate varies (is not uniform).

  The present invention has been made to solve the above-described problems, and one object of the present invention is to be deposited on a substrate due to an electric charge charged in a thin film of solution material deposited on the substrate. It is an object to provide an electrospray apparatus and a method for forming a thin film capable of suppressing variations in the thickness of the thin film.

  In order to achieve the above object, an electrospray apparatus according to a first aspect of the present invention is an electrospray apparatus for depositing a solution material sprayed from a nozzle as a thin film on a substrate, and applying a voltage to the solution material. A nozzle for spraying in a state, a first operation for spraying a solution material charged by applying a first voltage to the nozzle to the substrate, and a polarity of the solution material sprayed in the first operation by applying a second voltage to the nozzle And a switching unit that alternately switches the second operation of spraying the solution material charged to the opposite polarity onto the substrate.

  In the electrospray apparatus according to the first aspect, as described above, the first operation in which the solution material charged by applying the first voltage to the nozzle is sprayed on the substrate, and the second voltage is applied to the nozzle in the first operation. A switching unit that alternately switches between a second operation of spraying the solution material charged to a polarity opposite to the polarity of the solution material sprayed in the operation onto the substrate. As a result, the charge charged in the thin film of the solution material deposited on the substrate by the first operation can be eliminated by the solution material charged in the reverse polarity sprayed by the second operation (reducing the charge amount). In the second and subsequent first operations, repulsion of the charged solution material sprayed from the nozzle and weakening of the electric field between the nozzle and the substrate are suppressed. As a result, it is possible to suppress variation in the thickness of the thin film deposited on the substrate due to the electric charge charged on the thin film of the solution material deposited on the substrate.

  Further, since the charge charged on the thin film of the solution material deposited on the substrate by the first operation can be removed by the oppositely charged solution material sprayed by the second operation (charge amount is reduced), the charge A substrate having a large thickness that is relatively easily charged and a substrate made of a material that is relatively easily charged can be used. In the second operation, since the solution material charged in the opposite polarity to the electric charge charged on the thin film of the solution material deposited on the substrate by the first operation is sprayed, the solution material deposited on the substrate by the first operation is sprayed. The solution material can be sprayed onto the substrate without being repelled by the electric charge charged on the thin film.

  In the electrospray device according to the first aspect, preferably, the switching unit is configured such that a potential difference between the nozzle when switching between the first operation and the second operation and the thin film of the solution material deposited on the substrate is at the start of deposition of the thin film. The first operation and the second operation are alternately switched so as to be substantially equal to the potential difference between the nozzle and the substrate. If comprised in this way, when changing a 1st operation | movement and a 2nd operation | movement, it will suppress that the spray amount (application | coating speed) of a solution material changes due to the potential difference of a nozzle and a board | substrate changing. can do.

  In the electrospray device according to the first aspect, the switching unit preferably includes a switch unit that alternately switches a voltage applied to the nozzle between the first voltage and the second voltage. If comprised in this way, a 1st operation | movement and a 2nd operation | movement can be switched easily only by switching a switch part alternately.

  In the electrospray apparatus according to the first aspect, preferably, the nozzle includes a first nozzle to which the first voltage is applied and a second nozzle to which the second voltage is applied, and the switching unit performs the first operation. And spraying the charged solution material on the substrate by applying the first voltage to the first nozzle and applying the second voltage to the second nozzle in the second operation and the polarity of the solution material sprayed in the first operation Is configured to alternately switch between the first operation and the second operation so that the solution material charged in the reverse polarity is sprayed onto the substrate. If comprised in this way, unlike the case where the polarity of the voltage applied to the same nozzle is switched by applying a 1st voltage and a 2nd voltage to a separate 1st nozzle and a 2nd nozzle, respectively, the polarity of a voltage The first operation by the first nozzle and the second operation by the second nozzle can be switched without elapse of the time required for generating the tailor cone of the solution material after the switching. Thereby, switching between the first operation and the second operation can be performed quickly.

  A thin film forming method according to a second aspect of the present invention is a thin film forming method using an electrospray apparatus in which a solution material sprayed from a nozzle with a voltage applied is deposited as a thin film on a substrate. A first operation of spraying a charged solution material on the substrate by applying one voltage and a solution material charged to a polarity opposite to the polarity of the solution material sprayed in the first operation by applying a second voltage to the nozzle Alternately switching to the second operation of spraying on the substrate.

  In the method for forming a thin film according to the second aspect, as described above, the first operation of spraying the substrate with the solution material charged by applying the first voltage to the nozzle, and the second operation by applying the second voltage to the nozzle. The method includes alternately switching a second operation of spraying a solution material charged to a polarity opposite to the polarity of the solution material sprayed in one operation onto the substrate. As a result, the charge charged in the thin film of the solution material deposited on the substrate by the first operation can be eliminated by the solution material charged in the reverse polarity sprayed by the second operation (reducing the charge amount). In the second and subsequent first operations, repulsion of the charged solution material sprayed from the nozzle and weakening of the electric field between the nozzle and the substrate are suppressed. As a result, it is possible to provide a method for forming a thin film capable of suppressing variations in the thickness of the thin film deposited on the substrate due to the electric charge charged on the thin film of the solution material deposited on the substrate.

  Further, since the charge charged on the thin film of the solution material deposited on the substrate by the first operation can be removed by the oppositely charged solution material sprayed by the second operation (charge amount is reduced), the charge It is possible to provide a method for forming a thin film that can use a substrate having a large thickness that is relatively easily charged and a substrate made of a material that is relatively easily charged. In the second operation, since the solution material charged in the opposite polarity to the electric charge charged on the thin film of the solution material deposited on the substrate by the first operation is sprayed, the solution material deposited on the substrate by the first operation is sprayed. It is possible to provide a method for forming a thin film capable of spraying a solution material on a substrate without being repelled by electric charges charged in the thin film.

  In the method for forming a thin film according to the second aspect, preferably, alternately switching between the first operation and the second operation is substantially equal to a potential difference between the nozzle and the substrate at the start of thin film deposition. Including alternately switching between the first operation and the second operation. If comprised in this way, in the 1st operation | movement and 2nd operation | movement, it can suppress that the spray amount (application | coating speed) of a solution material changes due to the potential difference of a nozzle and a board | substrate changing. A method for forming a possible thin film can be provided.

  In the method for forming a thin film according to the second aspect, preferably, the first operation and the second operation are alternately switched in that the thin film of the solution material deposited on the substrate charged by the first operation is operated in the second operation. To alternately switch between the first operation and the second operation so as to be electrically neutral. With this configuration, in the first operation after the second time, since the electric charge is not substantially charged in the thin film of the solution material deposited on the substrate, the film thickness of the thin film deposited on the substrate varies. It can be suppressed more.

  According to the present invention, as described above, it is possible to suppress variation in the thickness of the thin film deposited on the substrate due to the electric charge charged on the thin film of the solution material deposited on the substrate.

1 is an overall view of an electrospray device according to a first embodiment of the present invention. It is a figure which shows the nozzle and switch part of the electrospray apparatus by 1st Embodiment of this invention. It is a figure for demonstrating the voltage (electric potential) of the thin film of the solution material deposited on the board | substrate. It is a figure for demonstrating the formation method of the thin film of the electrospray apparatus by 1st Embodiment of this invention. It is a general view of the electrospray apparatus by 2nd Embodiment of this invention. It is a side view of the electrospray apparatus by 2nd Embodiment of this invention. It is a general view of the electrospray apparatus by the modification of 2nd Embodiment of this invention.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments embodying the present invention will be described below with reference to the drawings.

[First Embodiment]
(Structure of electrospray device)
With reference to FIG. 1 and FIG. 2, the structure of the electrospray apparatus 100 by 1st Embodiment is demonstrated. The electrospray apparatus 100 is configured to deposit the solution material sprayed from the nozzle 1 as a thin film 8 on the substrate 3. In FIG. 2, one nozzle 1 of the plurality of nozzles 1 is shown. Other nozzles 1 not shown in FIG. 2 are configured in the same manner as the nozzle 1 shown in FIG.

  As shown in FIG. 1, the electrospray apparatus 100 according to the first embodiment includes a nozzle 1. The nozzle 1 is configured to spray while applying a voltage to the solution material. A plurality of nozzles 1 are provided. The plurality of nozzles 1 are arranged in a line along the X direction. The plurality of nozzles 1 are configured to spray the solution material upward (Z1 direction).

  In addition, the electrospray apparatus 100 includes a ground plate 2 provided to face the nozzle 1. The ground plate 2 is composed of a conductive member (metal or the like). A substrate 3 (see FIG. 2) is placed on the lower surface of the earth plate 2 (the surface on the Z2 direction side). The substrate 3 is placed on the earth plate 2 by, for example, vacuum suction.

  The substrate 3 is made of an insulating member such as glass or resin.

  Here, in the first embodiment, as shown in FIG. 2, the electrospray device 100 includes the switch unit 4. The switch unit 4 is configured to alternately switch the voltage applied to the nozzle 1 between a first voltage that is a positive voltage (for example, +10 kV) and a second voltage that is a negative voltage (for example, −8 kV). . Specifically, a power source 10a (high voltage power source) that applies a positive voltage to the nozzle 1 and a power source 10b (high voltage power source) that applies a negative voltage to the nozzle 1 are provided. The switch unit 4 includes a switch unit 4 a provided between the power source 10 a and the nozzle 1 and a switch unit 4 b provided between the power source 10 b and the nozzle 1. Note that the positive electrode of the power source 10 a is connected to the switch unit 4 a, and the negative electrode is connected to the earth plate 2. The negative electrode of the power supply 10b is connected to the switch unit 4b, and the positive electrode is connected to the earth plate 2. When the switch unit 4a is turned on and the switch unit 4b is turned off, a positive voltage is applied to the nozzle 1. Further, when the switch unit 4a is turned off and the switch unit 4b is turned on, a negative voltage is applied to the nozzle 1. The switch unit 4 (switch unit 4a, switch unit 4b) is an example of the “switching unit” in the claims.

  Further, the electrospray apparatus 100 includes an XY stage 5. The plurality of nozzles 1 are attached to the XY stage 5. Specifically, the XY stage 5 includes an X-axis frame 5a and a Y-axis frame 5b. The plurality of nozzles 1 are mounted on the X-axis frame 5a.

  A plurality of support columns 6 are provided so as to surround the XY stage 5. The ground plate 2 is supported by a plurality of support columns 6 so as to face the nozzle 1.

  In addition, the electrospray apparatus 100 includes a control unit 7. The control unit 7 is configured to control the spraying of the solution material from the nozzle 1 and the operations of the switch unit 4 and the XY stage 5. Here, in the first embodiment, the control unit 7 applies a first voltage to the nozzle 1 to spray the solution material charged by the first voltage onto the substrate 3, and applies a second voltage to the nozzle 1 to perform the first operation. The second operation in which the solution material charged in the opposite polarity to the polarity of the solution material sprayed in one operation is sprayed on the substrate 3 is alternately switched. Specifically, the control unit 7 is configured to alternately switch between turning on the switch unit 4a and turning off the switch unit 4b, and turning off the switch unit 4a and turning on the switch unit 4b. Yes. Further, in the switch unit 4a (switch unit 4b), the thin film 8 of the solution material deposited on the substrate 3 is substantially neutral from the state in which the electric charge is charged on the thin film 8 of the solution material deposited on the substrate 3. When switching between on and off. In addition, the first operation and the second operation are performed by measuring the time until the thin film 8 of the solution material deposited in advance on the substrate 3 becomes electrically neutral by experiments, and based on this time. Switch. In the first operation and the second operation, the amount of electric charge charged in the thin film 8 of the solution material deposited on the substrate 3 is detected by the detection device, and the thin film 8 of the solution material deposited on the substrate 3 is electrically substantially omitted. It may be switched when it becomes neutral. The control unit 7 is an example of the “switching unit” in the claims.

  Further, in the first embodiment, the control unit 7 (switch unit 4) determines that the potential difference between the nozzle 1 and the thin film 8 of the solution material deposited on the substrate 3 when switching between the first operation and the second operation is the thin film 8. The first operation and the second operation are alternately switched so as to be substantially equal to the potential difference between the nozzle 1 and the substrate 3 at the start of deposition. Specifically, as shown in FIG. 3, the first potential is V1, and the second potential is V2. Further, it is assumed that the potential difference between the nozzle 1 and the substrate 3 at the start of deposition of the thin film 8 (time t1) is ΔV1. Then, spraying (first operation) of the solution material is performed on the substrate 3. Note that the potential (voltage) of the deposited thin film 8 of the solution material changes with time. The potential difference ΔV2 between the nozzle 1 and the thin film 8 of the solution material deposited on the substrate 3 at the time of switching between the first operation and the second operation (time t2) is the nozzle 1 and the substrate 3 at the start of the deposition of the thin film 8. The first operation is switched to the second operation so as to be substantially equal to the potential difference ΔV1. At the time t3, when the second operation is switched to the first operation, the potential difference between the nozzle 1 and the thin film 8 of the solution material deposited on the substrate 3 is set to ΔV1.

  Further, as shown in FIG. 2, the electrospray apparatus 100 performs the thin film deposition operation (first operation or second operation) by dividing into a plurality of times until the film thickness of the thin film 8 reaches the target film thickness t. For example, the thin film deposition operation is performed four times, assuming that the thickness of the thin film 8 deposited by one thin film deposition operation is t / 4. The control unit 7 is configured to alternately switch between the first operation and the second operation until the film thickness of the thin film 8 reaches the target film thickness t. Hereinafter, a method for forming the thin film 8 will be specifically described.

(Thin film formation method)
Next, with reference to FIG. 4, the formation method of the thin film 8 by the electrospray apparatus 100 is demonstrated. Note that switching of the switch unit 4 described below is performed by the control unit 7.

  First, as shown in FIG. 4A, the switch unit 4a is turned on and the switch unit 4b is turned off, whereby a first voltage (for example, 10 kV) is applied to the nozzle 1. The substrate 3 is grounded. That is, the potential difference between the nozzle 1 and the substrate 3 at the start of the deposition of the thin film 8 is 10 kV (ΔV1 in FIG. 3). Then, a first operation is performed in which a solution material charged by applying a first voltage to the nozzle 1 is sprayed onto the substrate 3.

  As a result, as shown in FIG. 4B, the thin film 8 is deposited by a thickness of t / 4 by the first first operation. Further, the thin film 8 is deposited on the substrate 3 while moving the nozzle 1 in the X direction and the Y direction by the XY stage 5. At the end of the first operation of the first time (time t2 in FIG. 3), a charge having the same polarity (positive polarity) as the voltage applied to the nozzle 1 is charged on the thin film 8 of the solution material deposited on the substrate 3. . For example, a charge of +2 kV is charged on the thin film 8 of the solution material deposited on the substrate 3.

  Next, as illustrated in FIG. 4C, the switch unit 4 a is turned off and the switch unit 4 b is turned on, whereby a second voltage (for example, −8 kV) is applied to the nozzle 1. At the end of the first first operation (at the start of the first second operation, time t2), the thin film 8 of the solution material deposited on the substrate 3 is charged with +2 kV. Then, the second operation of applying the second voltage to the nozzle 1 and spraying the solution material charged to the polarity (negative polarity) opposite to the polarity (positive polarity) of the solution material sprayed in the first operation on the substrate 3 is performed. Done. That is, in the first embodiment, the first operation and the second operation are switched alternately.

  Here, in the first embodiment, the potential difference between the nozzle 1 when switching between the first operation and the second operation and the thin film 8 of the solution material deposited on the substrate 3 is the same as the nozzle 1 at the start of the deposition of the thin film 8. The first operation and the second operation are alternately switched so as to be substantially equal to the potential difference with the substrate 3. That is, as described above, the second voltage (−8 kV) is applied to the nozzle 1 so as to be substantially equal to the potential difference (10 kV, ΔV1 in FIG. 3) between the nozzle 1 and the substrate 3 at the start of deposition of the thin film 8. Is done. When switching between the first operation and the second operation (time t2 in FIG. 3), the thin film 8 of the solution material deposited on the substrate 3 is charged with +2 kV. That is, at the start of the second operation, the potential difference between the nozzle 1 and the substrate 3 (ΔV2 in FIG. 3) is the potential difference at the start of deposition of the thin film 8 (10 kV = + 2 − (− 8)) (ΔV1 in FIG. 3). ).

  Then, as shown in FIG. 4D, the thin film 8 is deposited by the thickness of t / 4 by the first second operation. That is, the thin film 8 having a total film thickness of t / 2 is deposited by the first first operation and the first second operation. In the first embodiment, the first operation is performed such that the thin film 8 of the solution material deposited on the substrate 3 charged (+2 kV) by the first operation becomes electrically neutral (0 kV) by the second operation. And the second operation are alternately switched. As described above, the first operation and the second operation are based on the time until the thin film 8 of the solution material deposited on the substrate 3 that has been measured in advance is electrically neutral, or the substrate. 3 is switched based on the detection that the thin film 8 of the solution material deposited on 3 becomes substantially neutral electrically.

  Thereafter, the thin film 8 having the film thickness t is formed by performing the second first operation and the second second operation. Finally, the thin film 8 having a film thickness t is dried, and the formation of the thin film 8 is completed.

(Effect of 1st Embodiment)
Next, effects of the first embodiment will be described.

  In the first embodiment, as described above, in the first operation in which the first voltage is applied to the nozzle 1 to spray the charged solution material onto the substrate 3, and in the first operation by applying the second voltage to the nozzle 1. A control unit 7 (switch unit 4) that alternately switches between a second operation of spraying the substrate 3 with the solution material charged to a polarity opposite to the polarity of the solution material to be sprayed is provided. As a result, the charge charged on the thin film 8 of the solution material deposited on the substrate 3 by the first operation can be neutralized (reduced charge amount) by the solution material charged to the reverse polarity sprayed by the second operation. Therefore, in the second and subsequent first operations, the repulsive solution material sprayed from the nozzle 1 and the weakening of the electric field between the nozzle 1 and the substrate 3 are suppressed. . As a result, it is possible to suppress variation in the film thickness of the thin film 8 deposited on the substrate 3 due to the electric charge charged on the thin film 8 of the solution material deposited on the substrate 3.

  Further, the charge charged on the thin film 8 of the solution material deposited on the substrate 3 by the first operation can be eliminated by the solution material charged to the reverse polarity sprayed by the second operation (the charge amount is reduced). Further, it is possible to use a substrate 3 having a large thickness that is relatively easily charged and a substrate 3 made of a material that is relatively easily charged. In the second operation, since the solution material charged in the opposite polarity to the electric charge charged on the thin film 8 of the solution material deposited on the substrate 3 by the first operation is sprayed, the solution material deposited on the substrate 3 by the first operation. The solution material can be sprayed onto the substrate 3 without being repelled by the electric charge charged on the thin film 8 of the solution material.

  Further, in the first embodiment, as described above, the control unit 7 (switch unit 4) uses the nozzle 1 when switching between the first operation and the second operation and the thin film 8 of the solution material deposited on the substrate 3. The first operation and the second operation are alternately switched so that the potential difference becomes substantially equal to the potential difference between the nozzle 1 and the substrate 3 at the start of deposition of the thin film 8. Thereby, in the 1st operation and the 2nd operation, it can control that the spray amount (application speed) of the solution material changes due to the change in potential difference between the nozzle 1 and the substrate 3.

  In the first embodiment, as described above, the switch unit 4 that switches the voltage applied to the nozzle 1 alternately between the first voltage and the second voltage is provided. Accordingly, the first operation and the second operation can be easily switched alternately by simply switching the switch unit 4 alternately.

  In the first embodiment, as described above, the first operation is performed so that the thin film 8 of the solution material deposited on the charged substrate 3 by the first operation becomes electrically neutral by the second operation. And the second operation are alternately switched. Thereby, in the first operation after the second time, since the electric charge is not substantially charged in the thin film 8 of the solution material deposited on the substrate 3, the film thickness of the thin film 8 deposited on the substrate 3 varies. It can be suppressed more.

[Second Embodiment]
(Structure of electrospray device)
With reference to FIG. 5 and FIG. 6, the structure of the electrospray apparatus 110 according to the second embodiment will be described. Unlike the first embodiment in which the voltage applied to the nozzle 1 is alternately switched between a positive voltage and a negative voltage, the electrospray apparatus 110 includes a nozzle 11a to which a positive voltage is applied and a nozzle 11b to which a negative voltage is applied. It has. The nozzle 11a and the nozzle 11b are examples of the “first nozzle” and the “second nozzle” in the claims, respectively.

  As shown in FIGS. 5 and 6, the electrospray apparatus 110 according to the second embodiment includes a nozzle 11. The nozzle 11 includes a nozzle 11a to which a first voltage (positive voltage) is applied and a nozzle 11b to which a second voltage (negative voltage) is applied. A plurality of nozzles 11a and nozzles 11b are provided.

  The electrospray apparatus 110 includes an XY stage 15. The nozzle 11 is attached to the XY stage 15. Specifically, the XY stage 15 includes an X-axis frame 15a, an X-axis frame 15b, and a Y-axis frame 15c. The nozzle 11a is mounted on the X-axis frame 15a. The nozzle 11b is mounted on the X-axis frame 15b.

  In addition, the electrospray apparatus 110 includes a control unit 17. In the second embodiment, the solution material charged (charged positively) by applying the first voltage to the nozzle 11a in the first operation is sprayed on the substrate 3. Further, the control unit 17 applies a second voltage to the nozzle 11b in the second operation, and sprays the solution material charged to a polarity (negative voltage) opposite to the polarity of the solution material sprayed in the first operation on the substrate 3. To do. In the first operation, the substrate 3 is grounded. In the second operation, a positive voltage is applied to the substrate 3. The control unit 17 is an example of the “switching unit” in the claims.

  Specifically, the first operation is performed by moving the nozzle 11a attached on the X-axis frame 15a in the X direction and the Y direction. In the first operation, the nozzle 11b is moved to a position separated from the substrate 3 (see FIG. 6). After the end of the first operation, the nozzle 11a is moved away from the substrate 3. Thereafter, the nozzle 11b attached on the X-axis frame 15b is moved in the X direction and the Y direction, and the second operation is performed. Then, the first operation and the second operation are alternately switched.

  Also in the second embodiment, as in the first embodiment, the first operation and the second operation are alternately performed so as to be approximately equal to the potential difference between the nozzle 11 and the substrate 3 at the start of deposition of the thin film 8. Can be switched to. That is, the potential difference between the nozzle 11a during the first operation and the thin film 8 of the solution material deposited on the substrate 3 and the potential difference between the nozzle 11b during the second operation and the thin film 8 of the solution material deposited on the substrate 3 are The potential difference between the nozzle 11 and the substrate 3 at the start of the deposition of the thin film 8 is substantially equal.

  Other configurations and operations of the second embodiment are the same as those of the first embodiment.

(Effect of 2nd Embodiment)
Next, effects of the second embodiment will be described.

  In the second embodiment, as described above, the nozzle 11 includes the nozzle 11a to which the first voltage is applied and the nozzle 11b to which the second voltage is applied. Then, a solution that is charged by applying a first voltage to the nozzle 11a in the first operation is sprayed on the substrate 3, and a solution sprayed in the first operation by applying the second voltage to the nozzle 11b in the second operation. The control unit 17 is configured to alternately switch between the first operation and the second operation so that the solution material charged to a polarity opposite to the polarity of the material is sprayed on the substrate 3. Thus, unlike the case where the polarity of the voltage applied to the same nozzle 11 is switched by applying the first voltage and the second voltage to the separate nozzle 11a and nozzle 11b, respectively, the solution after switching the polarity of the voltage The first operation by the nozzle 11a and the second operation by the nozzle 11b can be switched without passing the time required for generating the tailor cone of material. As a result, switching between the first operation and the second operation can be performed quickly.

  The remaining effects of the second embodiment are similar to those of the aforementioned first embodiment.

[Modification]
The embodiments and examples disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments and examples but by the scope of claims for patent, and includes all modifications (modifications) within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the first and second embodiments, the example in which the positive solution material is sprayed on the substrate at the start of the deposition of the thin film has been described, but the present invention is not limited to this. In the present invention, the negative electrode solution material may be sprayed onto the substrate at the start of thin film deposition.

  In the first and second embodiments, the example in which the first voltage that is a positive voltage and the second voltage that is a negative voltage are applied to the nozzles. However, the present invention is not limited to this. In the present invention, as long as solution materials having different polarities can be sprayed, a first voltage that is a positive voltage and a second voltage that is a positive voltage having a magnitude different from that of the first voltage may be applied to the nozzle. . Moreover, you may apply the 1st voltage which is a negative voltage to a nozzle, and the 2nd voltage which is a negative voltage from which a 1st voltage differs in magnitude | size.

  In the first and second embodiments, an example is shown in which the film thicknesses of the thin films deposited in each of the first operation and the second operation are substantially equal. However, the present invention is not limited to this. In the present invention, the thickness of the thin film deposited in each of the first operation and the second operation may be different.

  In the first embodiment, an example in which a plurality of nozzles are provided has been described. However, the present invention is not limited to this. For example, only one nozzle may be provided.

  In the second embodiment, an example in which the nozzle 11a and the nozzle 11b are attached to the X-axis frame 15a and the X-axis frame 15b, respectively, is shown, but the present invention is not limited to this. For example, the nozzle 11a and the nozzle 11b may be mounted on one (same) X-axis frame 25a of the XY stage 25 as in the electrospray apparatus 120 shown in FIG. Thereby, unlike the case where the nozzle 11a and the nozzle 11b are respectively provided on the two X-axis frames, the configuration of the electrospray device 120 can be simplified.

  In the first and second embodiments, the first operation and the second operation are performed so that the thin film of the solution material deposited on the substrate charged by the first operation becomes electrically neutral by the second operation. However, the present invention is not limited to this. For example, the first operation and the second operation may be switched so that a thin film of the solution material deposited on the substrate that is positively charged by the first operation is negatively charged by the second operation.

  In the first and second embodiments, an example in which a thin film is deposited on an insulating substrate has been described. However, the present invention is not limited to this. For example, a thin film may be deposited on a conductive substrate. When the substrate is made of an insulating member, the substrate itself may be charged. On the other hand, it is possible to suppress charging of the substrate according to the present invention.

  Moreover, in the said 1st and 2nd embodiment, although the solution material was sprayed from the downward toward the upper direction, this invention is not limited to this. For example, the solution material may be sprayed from above to below, or may be sprayed in the lateral direction.

  In the first and second embodiments, the example in which the potential difference between the nozzle and the substrate is 10 kV has been described. However, the present invention is not limited to this. In the present invention, the potential difference between the nozzle and the substrate may be a potential difference other than 10 kV.

1 Nozzle 3 Substrate 4, 4a, 4b Switch part (switching part)
7, 17 Control unit (switching unit)
8 Thin film 11 Nozzle 11a Nozzle (first nozzle)
11b Nozzle (second nozzle)
100, 110, 120 Electrospray device

Claims (7)

An electrospray apparatus for depositing a solution material sprayed from a nozzle as a thin film on a substrate,
The nozzle sprayed with a voltage applied to the solution material;
The first operation of spraying a solution material charged by applying a first voltage to the nozzle onto the substrate is opposite to the polarity of the solution material sprayed in the first operation by applying a second voltage to the nozzle. An electrospray apparatus comprising: a switching unit that alternately switches a second operation of spraying a polarly charged solution material onto the substrate.   The switching unit is configured such that a potential difference between the nozzle when switching between the first operation and the second operation and the thin film of the solution material deposited on the substrate is the nozzle and the substrate at the start of deposition of the thin film. The electrospray apparatus according to claim 1, wherein the first operation and the second operation are alternately switched so as to be substantially equal to a potential difference between the first operation and the second operation.   The electrospray apparatus according to claim 1, wherein the switching unit includes a switch unit that alternately switches a voltage applied to the nozzle between the first voltage and the second voltage. The nozzle includes a first nozzle to which the first voltage is applied, and a second nozzle to which the second voltage is applied,
The switching unit sprays the charged solution material onto the substrate by applying the first voltage to the first nozzle in the first operation, and applies the second voltage to the second nozzle in the second operation. The first operation and the second operation are alternately switched so that a solution material charged to a polarity opposite to the polarity of the solution material applied and sprayed in the first operation is sprayed on the substrate. The electrospray apparatus according to claim 1 or 2, wherein A method of forming a thin film by an electrospray apparatus in which a solution material sprayed from a nozzle in a state where a voltage is applied is deposited as a thin film on a substrate,
The first operation of spraying a solution material charged by applying a first voltage to the nozzle onto the substrate is opposite to the polarity of the solution material sprayed in the first operation by applying a second voltage to the nozzle. A method for forming a thin film, comprising alternately switching a second operation of spraying a polarly charged solution material onto the substrate.   The first operation and the second operation are alternately switched between the first operation and the second operation so that the potential difference between the nozzle and the substrate at the start of deposition of the thin film is substantially equal. The method for forming a thin film according to claim 5, comprising alternately switching the two.   By alternately switching between the first operation and the second operation, the thin film of the solution material deposited on the substrate charged by the first operation becomes electrically substantially neutral by the second operation. As described above, the method for forming a thin film according to claim 5, comprising alternately switching between the first operation and the second operation.

Images