JP2017126739A - Package substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package substrate in which warp due to a difference in thermal expansion coefficient (CTE) during a reflow process in a substrate manufacturing process is improved.SOLUTION: The package substrate includes: a glass layer 110; a first groove formed on one surface of the glass layer 110; a second groove formed on the other surface of the glass layer; a metal portion 120 formed inside the first groove and the second groove; a third groove formed on one surface of the glass layer 110 so as to be connected to the first groove; a fourth groove formed on the other surface of the glass layer 110 so as to be connected to the second groove; and an insulating portion 130 formed inside the third groove and the fourth groove.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a package substrate.

  In recent years, as the thickness of portable devices has become increasingly thinner, the thickness of the internal components has been reduced, and the board on which a large number of electronic components are mounted has also been made into a thin plate. Studies are underway to reduce this.

  In particular, when a board on which a large number of electronic components are mounted is manufactured as a thin plate, it is exposed to high temperatures in the reflow process during the board manufacturing process or electronic component mounting, and a series of manufacturing processes are repeated while repeating high-temperature processing and cooling. There is a problem that the substrate is warped due to the characteristics of the material during the process.

  In order to prevent the warpage of the substrate, the rigidity of the raw material used during the manufacturing process of the substrate is increased, and the warpage due to the difference of the thermal expansion coefficient (CTE) is improved during the reflow process. Efforts are being made to reduce the difference.

JP 2004-193295 A

  According to one aspect of the present invention, a glass layer, a first groove formed on one surface of the glass layer, a second groove formed on the other surface of the glass layer, the first groove, and the second groove. A metal part formed inside the groove, a third groove formed on the one surface of the glass layer to be connected to the first groove, and a second groove on the other surface of the glass layer. There is provided a package substrate including a fourth groove formed to be connected, and the third groove and an insulating part formed in the fourth groove.

The first groove and the third groove are formed at an edge of the glass layer along a side surface of the glass layer, and the second groove and the fourth groove are formed along the side surface of the glass layer. Can be formed on the edges of
The first groove and the third groove may be alternately and continuously formed, and the second groove and the fourth groove may be alternately and continuously formed.
A part of the first groove overlaps a part of the second groove, a part of the third groove overlaps a part of the second groove, and a part of the fourth groove is the first groove. The package substrate can be configured to overlap a part of the groove.
The package substrate may further include a first insulating layer stacked on each of the one surface and the other surface of the glass layer, and a second insulating layer stacked on the first insulating layer.
The insulating part may be formed as a structure in which the first insulating layer is inserted into the third groove and the fourth groove. Alternatively, the insulating part can be formed as a structure in which the second insulating layer is inserted into the third groove and the fourth groove.
When forming the first groove, the second groove, the third groove, and the fourth groove, the cross-sectional areas of the first groove, the second groove, the third groove, and the fourth groove are as follows: You may make it become so small that it goes inside the said glass layer.
The glass layer is divided into an inner region and an outer region by the first groove, the second groove, the third groove, and the fourth groove.

It is a figure which shows the package board | substrate which concerns on 1st Example of this invention. It is a figure which shows the manufacturing method of the package board | substrate which concerns on 1st Example of this invention. It is a figure which shows the manufacturing method of the package board | substrate which concerns on 1st Example of this invention. It is a figure which shows the manufacturing method of the package board | substrate which concerns on 1st Example of this invention. It is a figure which shows the manufacturing method of the package board | substrate which concerns on 1st Example of this invention. It is a figure which shows the package board | substrate which concerns on 2nd Example of this invention. It is a figure which shows the method of manufacturing the package board | substrate which concerns on 2nd Example of this invention. It is a figure which shows the method of manufacturing the package board | substrate which concerns on 2nd Example of this invention. It is a figure which shows the method of manufacturing the package board | substrate which concerns on 2nd Example of this invention. It is a figure which shows the method of manufacturing the package board | substrate which concerns on 2nd Example of this invention. It is a figure which shows the package board | substrate which concerns on 3rd Example of this invention.

Hereinafter, embodiments of a package substrate according to the present invention will be described in detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, the same or corresponding components are denoted by the same reference numerals. The duplicate description for this will be omitted.
Further, in this specification, terms such as “first” and “second” are merely identification symbols for distinguishing the same or corresponding components, and the same or corresponding components are defined by terms such as “first” and “second”. It is not limited.
In addition, the term “coupled” does not mean that the components are in direct contact with each other in the contact relationship between the components, but other configurations are interposed between the components. It is used as a concept encompassing even when components are in contact with each other.

<Example>
First Embodiment FIG. 1 is a view showing a package substrate according to a first embodiment of the present invention, and FIGS. 2 to 5 are views showing a method of manufacturing the package substrate according to the first embodiment of the present invention. It is.

  1 to 5, the package substrate according to the first embodiment of the present invention may include a glass layer 110, a metal part 120, an insulating part 130, a first insulating layer 140 and a second insulating layer 150. . The glass layer 110 may have a first groove 111, a second groove 112, a third groove 113, and a fourth groove 114.

The glass layer 110 is a glass material layer and can serve as a core. The glass layer 110 is mainly composed of glass that is an amorphous solid. Examples of the glass material that can be used in the embodiment of the present invention include pure silicon dioxide (about 100% SiO ₂ ), soda lime glass, borosilicate glass, alumino-silicate glass, and the like. Various glass materials may be used. However, the glass material is not limited to a substance having the composition of the silicon-based glass, and for example, fluoro glass, phosphate glass, chalcogen glass, or the like can be used as an alternative glass material.

  In order to form a glass having specific physical properties, the glass material may further contain other additives. Such additives include not only calcium carbonate (eg, lime) and sodium carbonate (eg, soda), but also magnesium, calcium, manganese, aluminum, lead, boron, iron, chromium, potassium, sulfur and antimony, Carbonates and / or oxides of these elements and other elements can be included.

  A first insulating layer 140 can be stacked on one surface and the other surface of the glass layer 110. Here, the one surface and the other surface mean end surfaces other than the side surfaces of the end surface of the glass layer 110, and the one surface and the other surface may be end surfaces parallel to each other.

  A second insulating layer 150 can be stacked on the first insulating layer 140. Therefore, the package substrate includes a plurality of insulating layers from the top to the bottom or from the bottom to the top, the second insulating layer 150-the first insulating layer 140-the glass layer 110-the first insulating layer 140-the second. It can be a stacked body in which the insulating layers 150 are stacked in this order. In this case, the first insulating layer 140 and the second insulating layer 150 may be arranged symmetrically with respect to the glass layer 110 as a reference plane. Hereinafter, the glass layer 110 having the first insulating layer 140 laminated on both sides is referred to as a “core layer”. That is, it can be understood that the second insulating layer 150 is laminated on the core layer.

  The first insulating layer 140 and the second insulating layer 150 can be made of a resin material. The resin forming each of the first insulating layer 140 and the second insulating layer 150 may be a thermosetting resin or a thermoplastic resin. For example, as such a resin, an epoxy resin, a BT (Bismaleimide-Triazine) resin, or polyimide can be used.

  Examples of the epoxy resin include naphthalene epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, novolac epoxy resin, cresol novolac epoxy resin, rubber-modified epoxy resin, and cyclic aliphatic epoxy resin. Examples thereof include, but are not limited to, silicon-based epoxy resins, nitrogen-based epoxy resins, and phosphorus-based epoxy resins.

  On the other hand, the 1st insulating layer 140 and the 2nd insulating layer 150 may contain the reinforcing material in the above-mentioned resin. Here, the reinforcing material may be a fiber reinforcing material such as glass fiber, or may be an inorganic filler such as silica. A prepreg (PPG) may be used as a reinforcing material containing glass fibers in an epoxy resin.

  The glass fiber may have a cross-sectional thickness of 1 μm or less to several hundreds of μm. The glass fiber not only imparts rigidity to the insulating layer, but also imparts chemical resistance (resistance to corrosive chemical substances) to the insulating layer, thereby reducing the moisture absorption rate of the insulating layer. Glass fibers are classified into glass filaments, glass fibers, and glass fabrics according to thickness.

Examples of the inorganic filler contained in the first insulating layer 140 and the second insulating layer 150 include silica (SiO ₂ ), alumina (Al ₂ O ₃ ), silicon carbide (SiC), barium sulfate (BaSO ₄ ), talc, and clay. , Mica powder, aluminum hydroxide (AlOH ₃ ), magnesium hydroxide (Mg (OH) ₂ ), calcium carbonate (CaCO ₃ ), magnesium carbonate (MgCO ₃ ), magnesium oxide (MgO), boron nitride (BN), boric acid At least one or more substances selected from a group of substances including aluminum (AlBO ₃ ), barium titanate (BaTiO ₃ ), and calcium zirconate (CaZrO ₃ ) can be used.

  The compositions of the first insulating layer 140 and the second insulating layer 150 may be the same or different. That is, the resin and / or the reinforcing material of the first insulating layer 140 and the second insulating layer 150 may be different from each other.

  2 to 5, (a) shows a cross section when the package substrate manufactured according to the manufacturing process according to the present embodiment is cut along a cut surface along the line AA ′, and (b). Shows a cross section when the package substrate is seen by cutting along a cut surface along the line BB ′, and (c) is a cross section when seen through the cut surface along the line CC ′. Indicates. 2 to 5, the first groove 111 is formed on one surface of the glass layer 110, and the second groove 112 is formed on the other surface of the glass layer 110. A third groove 113 is further formed on one surface of the glass layer 110, and a fourth groove 114 is further formed on the other surface of the glass layer 110.

  The first groove 111, the second groove 112, the third groove 113, and the fourth groove 114 can all be formed so as to penetrate the first insulating layer 140. That is, the first groove 111, the second groove 112, the third groove 113, and the fourth groove 114 penetrate the first insulating layer 140 and the glass layer 110, and particularly penetrate the first insulating layer 140 in the thickness direction. be able to.

  As an alternative configuration of the package substrate, the first groove 111, the second groove 112, the third groove 113, and the fourth groove 114 do not penetrate the glass layer 110 in the thickness direction, and the thickness direction of the glass layer 110 The non-penetrating groove formed on the surface can be formed. According to this, each depth of the 1st groove | channel 111, the 2nd groove | channel 112, the 3rd groove | channel 113, and the 4th groove | channel 114 may be smaller than the thickness of a core layer. Further, the depth of each of the first groove 111, the second groove 112, the third groove 113, and the fourth groove 114 may be smaller than the thickness of the glass layer 110.

The first groove 111, the second groove 112, the third groove 113, and the fourth groove 114 can be formed by laser processing using a CO ₂ laser or the like. In addition, in order to form the first groove 111, the second groove 112, the third groove 113, and the fourth groove 114, first, the first insulating layer 140 was processed by a laser to expose the glass layer 110, which was exposed. The glass layer 110 can be processed by an etching process. However, the method for forming the groove is not limited to such a method, and a sawing process or a drilling process may be used.

  The horizontal and vertical cross sections of the first groove 111, the second groove 112, the third groove 113, and the fourth groove 114 may all be formed in a square shape, but are not limited to this shape.

  The sum of the depth of the first groove 111 and the depth of the second groove 112 may be equal to or greater than the thickness of the core layer, and the sum of the depth of the third groove 113 and the depth of the fourth groove 114 is the core layer. Or more.

Hereinafter, the first groove 111 and the second groove 112 will be described in more detail.
Referring to FIG. 2, a plurality of first grooves 111 and a plurality of second grooves 112 may be formed. The plurality of first grooves 111 may be discontinuously arranged, and the plurality of second grooves 112 may also be formed. It can be formed to be discontinuously arranged.

  Each of the first groove 111 and the second groove 112 may be arranged along the side surface of the glass layer 110. That is, each of the first groove 111 and the second groove 112 can be formed so as to be spaced apart from the side surface of the glass layer 110 by a predetermined distance.

  A part of the first groove 111 and a part of the second groove 112 may overlap each other. The size of the plurality of overlapping regions generated by overlapping the plurality of first grooves 111 and the plurality of second grooves 112 need not be the same. However, the size of each of the overlapping regions described above may be smaller than the area of one first groove 111 (or second groove 112).

Here, “overlap” can be interpreted as meaning that the end surface having the maximum area of the first groove 111 and the end surface having the maximum area of the second groove 112 overlap in the thickness direction of the glass layer 110.
If the depth of each of the first groove 111 and the second groove 112 is smaller than the thickness of the core layer, and the sum of the depth of the first groove 111 and the depth of the second groove 112 is equal to or greater than the thickness of the core layer, By overlapping the first groove 111 and the second groove 112 to form an overlapping region, the overlapping groove completely penetrates the core layer in the overlapping region.

  That is, as shown in FIG. 2, the glass layer 110 is exposed by the first groove 111 in the region where only the first groove 111 is formed. In the region where only the second groove 112 is formed, the glass layer 110 is exposed by the second groove 112. And in the area | region where the 1st groove | channel 111 and the 2nd groove | channel 112 mutually overlap, it will be in the state penetrated completely by the groove | channel where the glass layer 110 overlapped.

  Referring to FIG. 3, the metal part 120 is a portion of the metal material formed in the first groove 111 and the second groove 112, and the first groove 111 and the second groove 112 are formed in the core layer. Later, it can be formed by filling a metal material.

  The metal part 120 can be formed by electroless plating and / or electrolytic plating. For example, as a process of forming the metal portion 120, first, a thin layer of metal is formed on the inner wall and bottom of the first groove 111 and the second groove 112 by electroless plating, and then the electroplating layer is an electroless plating layer. It can be formed on top.

  The metal part 120 is made of a metal material such as copper (Cu), silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au), or platinum (Pt). be able to.

  The metal part 120 is formed so as to completely fill the first groove 111 and the second groove 112, or formed so as to fill only a part of the inside of each of the first groove 111 and the second groove 112. Can do. The metal part 120 can impart rigidity to the glass layer 110 by being embedded in the core layer.

  A plurality of metal parts 120 can be formed. When a part of the first groove 111 and a part of the second groove 112 overlap each other, the metal part 120 can be arranged in a zigzag manner with respect to one surface and the other surface of the glass layer 110. .

Referring to FIG. 4, the third groove 113 and the fourth groove 114 can be formed in the glass layer 110 as described above.
The third groove 113 is formed on one surface of the glass layer 110 so as to be connected to the first groove 111. A plurality of the first grooves 111 and the third grooves 113 can be formed, and the plurality of first grooves 111 and the plurality of third grooves 113 can be alternately and continuously arranged.

  Here, “continuously” means a state in which the first groove 111 and the third groove 113 are arranged without a gap. Therefore, the first groove 111 and the third groove 113 can constitute one continuous groove portion. The continuous groove portion may have a linear shape, and may have a quadrangular shape like the glass layer 110. However, the continuous groove portions are not limited to these shapes, and those skilled in the art can also form circular or polygonal shapes as necessary.

  If it demonstrates from the side surface of the continuous groove part formed in one surface of the glass layer 110, the 1st groove | channel 111 will be formed in a part of the said continuous groove part, and the 3rd groove | channel 113 will be formed in another part. Can do.

  One surface of the glass layer 110 can be divided into an inner region and an outer region by the continuous groove portion formed by the first groove 111 and the third groove 113. Moreover, such a continuous groove part can prevent the crack of the glass layer 110 generated in the outer region from spreading to the inner region.

  The fourth groove 114 is formed on the other surface of the glass layer 110 so as to be connected to the second groove 112. A plurality of the second grooves 112 and the fourth grooves 114 can be formed, and the plurality of second grooves 112 and the plurality of fourth grooves 114 can be alternately and continuously arranged.

  That is, the 2nd groove | channel 112 and the 4th groove | channel 114 can comprise one continuous groove part by arrange | positioning so that a space | interval may not be formed between both. The continuous groove portion may have a linear shape, and may have a quadrangular shape like the glass layer 110. However, the continuous groove portions are not limited to these shapes, and those skilled in the art can form circular or polygonal shapes as necessary.

If it demonstrates from the side surface of the continuous groove part formed in the other surface of the glass layer 110, the 2nd groove | channel 112 will be formed in a part of the said continuous groove part, and the 4th groove | channel 114 will be formed in others. Can.
Due to the continuous groove portion constituted by the second groove 112 and the fourth groove 114, one surface of the glass layer 110 can be divided into an inner region and an outer region. Moreover, such a continuous groove part can prevent the crack of the glass layer 110 generated in the outer region from spreading to the inner region.

  A part of the third groove 113 may overlap with a part of the second groove 112, and a part of the fourth groove 114 may overlap with a part of the first groove 111. In this case, the continuous groove portion formed by the first groove 111 and the third groove 113 and the continuous groove portion formed by the second groove 112 and the fourth groove 114 may overlap each other. Is possible.

  From the viewpoint of the glass layer 110, the first groove 111, the second groove 112, the third groove 113, and the fourth groove 114 allow the core layer to be separated into an inner region and an outer region. As described above, the first groove 111, the second groove 112, the third groove 113, and the fourth groove 114 indicate that cracks generated on one side of the glass layer 110 diffuse into the entire region of the glass layer 110. Can be prevented.

  In particular, in the manufacturing process of the package substrate, there is a possibility that the glass layer 110 may be damaged in the process of cutting the package substrate into a plurality of unit package substrates, but the first groove 111, the second groove 112, Damage to the glass layer 110 can be minimized by the third groove 113 and the fourth groove 114.

  On the other hand, referring to FIG. 5, the insulating part 130 is formed inside the third groove 113 and the fourth groove 114, and may be a resin material. The resin material for forming the insulating portion 130 may be the same resin material as that for forming the first insulating layer 140 and the second insulating layer 150 described above. The first insulating layer 140 and / or the second insulating layer may be used. 150 may be formed of the same resin material.

  In particular, in the insulating unit 130, the formation material of the second insulating layer 150 flows into the third groove 113 and the fourth groove 114 in a process in which the second insulating layer 150 is stacked on the first insulating layer 140. Can be formed. In this case, the insulating part 130 can be formed so as to be integrated with the second insulating layer 150.

  When the metal part 120 is formed in the first groove 111 and the second groove 112, and the insulating part 130 is formed in the third groove 113 and the fourth groove 114, the first groove 111 and the third groove 113 are formed. The continuous groove portion and the continuous groove portion formed by the second groove 112 and the fourth groove 114 are filled with the forming material of the metal portion 120 or the insulating portion 130.

  As described above, such a continuous groove portion has a function of preventing the diffusion of cracks, and in particular, realizes a characteristic structure that allows the glass layer 110 to have high rigidity by the metal portion 120. Can do. Since the glass layer 110 has high rigidity, the problem of warpage of the package substrate can be reduced. In addition, the insulating part 130 disposed between the metal parts 120 can increase the bonding force among the glass layer 110, the first insulating layer 140, and the second insulating layer 150.

  Referring to FIG. 1 again, the package substrate according to the embodiment of the present invention may further include a first circuit 141, a through via 142, a second circuit 151, a via 152, a solder resist layer 160, a connection portion 170, and the like. .

  The first circuit 141 is a signal transmission line formed on the first insulating layer 140 and may have a specific pattern. The first circuit 141 is a metal having excellent electrical characteristics, for example, copper (Cu), silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au). Further, it can be formed of a metal such as platinum (Pt).

  In addition, the first circuit 141 includes an additive method, a subtractive method, a semi-additive method, a tenting method, an MSAP (Modified Semi-Additive Process) method, and the like. However, it is not limited to these methods.

  On the other hand, the first circuit 141 is made of the same metal as the above-described metal part 120 and can be simultaneously formed by the same process. Here, “simultaneously” does not mean that they coincide completely in time but means that they are formed together through the same process.

  That is, the first circuit 141 and the metal part 120 can be formed by the same plating process. When the first circuit 141 and the metal part 120 are formed at the same time as described above, the lead time in the manufacturing process of the package substrate can be reduced as compared with the case where they are individually formed.

  The through via 142 penetrates the core layer and is electrically connected to the first via 152. That is, the through via 142 penetrates the glass layer 110 and the first insulating layer 140 and can electrically connect the two first vias 152 formed on both surfaces of the core layer.

  The through via 142 can be formed by forming a via hole for providing the first via 152 in the core layer and then forming a plating layer in the via hole. The through via 142 can be formed simultaneously with the first circuit 141. Further, the through via 142 and the first circuit 141 can be formed simultaneously with the metal part 120.

  The second circuit 151 is a signal transmission line formed on the second insulating layer 150 and may have a specific pattern. The second circuit 151 is a metal having excellent electrical characteristics, for example, copper (Cu), silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au). , And can be formed of a metal such as platinum (Pt). The second circuit 151 may be formed of the same metal as the first circuit 141.

  The second circuit 151 uses an additive method, a subtractive method, a semi-additive method, a tenting method, an MSAP (Modified Semi-Additive Process) method, and the like. However, the present invention is not limited to these methods.

  The via 152 penetrates through the second insulating layer 150 and electrically connects the first circuit 141 and the second circuit 151, and the plurality of first circuits 141 and the plurality of second circuits 151 are all connected to each other. A plurality can be provided for connection.

  The solder resist layer 160 is stacked on the second insulating layer 150 and can cover and protect the second circuit 151. A part of the solder resist is opened, and a part of the second circuit 151 can be exposed by the opening region.

  A connection part 170 such as a solder ball can be formed on the second circuit 151 exposed in the opening, and an electronic component 180 such as a chip is mounted on the connection part 170. Can do.

Second Embodiment FIG. 6 is a view showing a package substrate according to a second embodiment of the present invention, and FIGS. 7 to 10 are views showing a method of manufacturing the package substrate according to the second embodiment of the present invention. It is.

  6 to 10, the package substrate according to the second embodiment of the present invention may include a glass layer 110, a metal part 120, an insulating part 130, a first insulating layer 140 and a second insulating layer 150. . A first groove 111, a second groove 112, a third groove 113, and a fourth groove 114 can be formed in the glass layer 110.

  Referring to FIG. 6, in the second embodiment of the present invention, unlike the first embodiment, the first groove 111, the second groove 112, the third groove 113, and the fourth groove 114 are formed in the first insulating layer 140. It is not formed so as to penetrate. That is, the first groove 111, the second groove 112, the third groove 113, and the fourth groove 114 are formed so as to penetrate only the glass layer 110.

  Referring to FIG. 7, the first groove 111 is formed on one surface of the glass layer 110, and the second groove 112 is formed on the other surface of the glass layer 110. A plurality of first grooves 111 and a plurality of second grooves 112 can be formed. The plurality of first grooves 111 can be discontinuously arranged, and the plurality of second grooves 112 can also be discontinuously arranged. . Each of the first groove 111 and the second groove 112 may be arranged along the side surface of the glass layer 110. That is, each of the first groove 111 and the second groove 112 can be disposed so as to be separated from the side surface of the glass layer 110 by a predetermined distance.

  A part of the first groove 111 and a part of the second groove 112 may overlap each other. The sizes of the plurality of overlapping regions where the plurality of first grooves 111 and the plurality of second grooves 112 overlap each other need not be the same. However, the size of each overlapping region may be smaller than the area of one first groove 111 (or second groove 112).

  Each of the depths of the first groove 111 and the second groove 112 is smaller than the thickness of the glass layer 110, and the sum of the depth of the first groove 111 and the depth of the second groove 112 is not less than the thickness of the glass layer 110. For example, when the first groove 111 and the second groove 112 overlap, the glass layer 110 is completely penetrated in the overlapping region.

  Referring to FIG. 8, the metal part 120 is formed in the first groove 111 and the second groove 112. The metal part 120 is formed by completely filling the first groove 111 and the second groove 112 with metal or filling only a part of the inside of each of the first groove 111 and the second groove 112 with metal. Can do. Such a metal part 120 can give rigidity to the glass layer 110 by being embedded in the glass layer 110.

  A plurality of metal parts 120 can be formed. When a part of the first groove 111 and a part of the second groove 112 overlap each other, the metal part 120 can be arranged in a zigzag manner with respect to one surface and the other surface of the glass layer 110.

  Referring to FIG. 9, the third groove 113 may be formed on one surface of the glass layer 110, and the fourth groove 114 may be formed on the other surface of the glass layer 110. The third groove 113 is formed on one surface of the glass layer 110 so as to be connected to the first groove 111. A plurality of the first grooves 111 and the third grooves 113 can be formed, and the plurality of first grooves 111 and the plurality of third grooves 113 can be arranged alternately and continuously. The fourth groove 114 is formed on the other surface of the glass layer 110 so as to be connected to the second groove 112. A plurality of the second grooves 112 and the fourth grooves 114 can be formed, and the plurality of second grooves 112 and the plurality of fourth grooves 114 can be arranged alternately and continuously.

  A part of the third groove 113 may overlap with a part of the second groove 112, and a part of the fourth groove 114 may overlap with a part of the first groove 111. In this case, the continuous groove portion formed by the first groove 111 and the third groove 113 and the continuous groove portion formed by the second groove 112 and the fourth groove 114 may overlap each other. it can.

  From the viewpoint of the glass layer 110, the glass layer 110 is divided into an inner region and an outer region by the first groove 111, the second groove 112, the third groove 113, and the fourth groove 114. As described above, the first groove 111, the second groove 112, the third groove 113, and the fourth groove 114 prevent cracks generated on one side of the glass layer 110 from diffusing into the entire region of the glass layer 110. can do.

  Referring to FIG. 10, the insulating part 130 is formed in the third groove 113 and the fourth groove 114. As the resin material of the insulating part 130, the same resin material as that for forming the first insulating layer 140 and the second insulating layer 150 described above may be used, and the first insulating layer 140 and / or the second insulating layer 150 may be used. The same material may be used.

  In particular, the insulating part 130 is formed by the formation material of the insulating part 140 flowing into the third groove 113 and the fourth groove 114 in the process in which the first insulating layer 140 is laminated on the glass layer 110. You can make it. In this case, the insulating part 130 can be formed so as to be integrated with the first insulating layer 140.

  On the other hand, the second insulating layer 150 is laminated on the first insulating layer 140, and in this embodiment, the forming material of the second insulating layer 150 does not fill the grooves of the glass layer 110.

  When the metal part 120 is formed in the first groove 111 and the second groove 112, and the insulating part 130 is formed in the third groove 113 and the fourth groove 114, the first groove 111 and the third groove 113 are formed. The continuous groove portion and the continuous groove portion formed by the second groove 112 and the fourth groove 114 are filled with the metal portion 120 or the insulating portion 130.

  As described above, such a continuous groove portion has a function of preventing the diffusion of cracks, and in particular, realizes a characteristic structure that allows the glass layer 110 to have high rigidity by the metal portion 120. be able to. Since the glass layer 110 has high rigidity, the problem of warpage of the package substrate can be reduced.

  Referring to FIG. 6 again, the package substrate according to the embodiment of the present invention may further include a first circuit 141, a through via 142, a second circuit 151, a via 152, a solder resist layer 160, a connection portion 170, and the like. . Since the above configuration has been described in the first embodiment, description thereof is omitted here.

Third Embodiment FIG. 11 is a view showing a package substrate according to a third embodiment of the present invention.

  Referring to FIG. 11, the package substrate according to the third embodiment of the present invention may include a glass layer 110, a metal part 120, an insulating part 130, a first insulating layer 140 and a second insulating layer 150. The glass layer 110 may have a first groove 111, a second groove 112, a third groove 113, and a fourth groove 114.

  In the present embodiment, a package substrate configured such that each cross-sectional area of the first groove 111, the second groove 112, the third groove 113, and the fourth groove 114 decreases toward the inside of the glass layer 110, That is, the cross-sectional area of the first groove 111 and the third groove 113 becomes smaller toward the inner side of the glass layer 110, and the shape of the longitudinal section of the first groove 111 and the third groove 113 is similar to an inverted trapezoid or an inverted triangle. A structure has been disclosed that can result in a reduced shape. Further, the cross-sectional area of the second groove 112 and the fourth groove 114 becomes smaller toward the inner side of the glass layer 110, and the longitudinal sectional shape of the second groove 112 and the fourth groove 114 is similar to a regular trapezoid or an isosceles triangle. You may have the shape.

  The embodiments of the present invention have been described above. However, those who have ordinary knowledge in the technical field can add, change, and change the constituent elements without departing from the spirit of the present invention described in the claims. Various modifications and changes can be made to the present invention by deletion or addition, and the like, which are also included within the scope of the present invention.

DESCRIPTION OF SYMBOLS 110 Glass layer 111 1st groove | channel 112 2nd groove | channel 113 3rd groove | channel 114 4th groove | channel 120 Metal part 130 Insulating part 140 1st insulating layer 141 1st circuit 142 Through-via 150 2nd insulating layer 151 2nd circuit 152 Via 160 Solder Resist layer 170 Connection 180 Electronic component

Claims (15)

A glass layer,
A first groove formed on one surface of the glass layer;
A second groove formed on the other surface of the glass layer;
A metal part formed inside the first groove and the second groove;
A third groove formed on the one surface of the glass layer so as to be connected to the first groove;
A fourth groove formed on the other surface of the glass layer so as to be connected to the second groove;
An insulating portion formed inside the third groove and the fourth groove;
Including package substrate. The first groove and the third groove are formed at an edge of the glass layer along a side surface of the glass layer,
The package substrate according to claim 1, wherein the second groove and the fourth groove are formed at an edge of the glass layer along a side surface of the glass layer. The first groove and the third groove are alternately and continuously formed,
The package substrate according to claim 1, wherein the second groove and the fourth groove are alternately and continuously formed.   4. The package substrate according to claim 1, wherein a part of the first groove is provided so as to overlap a part of the second groove. 5. A part of the third groove is provided so as to overlap a part of the second groove;
4. The package substrate according to claim 1, wherein a part of the fourth groove is provided so as to overlap a part of the first groove. 5.   The package substrate according to any one of claims 1 to 5, further comprising a first insulating layer provided in a state of being laminated on each of the one surface and the other surface of the glass layer.   The package substrate according to claim 6, wherein the insulating portion is provided in a state where the first insulating layer is inserted into the third groove and the fourth groove.   The package substrate according to claim 6, further comprising a second insulating layer provided in a state of being stacked on the first insulating layer. The first groove, the second groove, the third groove, and the fourth groove are each formed in a state of penetrating the first insulating layer,
The package substrate according to claim 8, wherein the insulating portion is formed in a state where the second insulating layer is inserted into the third groove and the fourth groove. A first circuit formed on a surface of the first insulating layer;
The package substrate according to claim 8 or 9, wherein the first circuit is made of the same metal as the metal part.   The package substrate according to claim 10, further comprising a through via connected to the first circuit and formed through the glass layer and the first insulating layer. A second circuit formed on the surface of the second insulating layer;
The package substrate according to claim 10 or 11, further comprising a via for electrically connecting the first circuit and the second circuit.   The package substrate according to claim 12, further comprising a solder resist layer provided in a state of being stacked on the second insulating layer so as to cover the second circuit.   The cross-sectional area of each of the first groove, the second groove, the third groove, and the fourth groove is configured to become smaller toward the inner side of the glass layer. The package substrate according to any one of the above.   The said glass layer is comprised so that it may be divided into an internal area | region and an outer area | region by the said 1st groove | channel, the said 2nd groove | channel, the said 3rd groove | channel, and the said 4th groove | channel. The package substrate according to claim 1.

Images