JP2017126685A - Electronic circuit module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic circuit module causing no projection of a joint material from the bottom surface of a circuit board to enable stable fitting in subsequent processes.SOLUTION: An electronic circuit module 100 includes: a circuit board 20 on which an electronic component 31 is mounted; and a metal cover 10 that covers the circuit board 20. The metal cover 10 comprises: a top board 13 disposed so as to face the circuit board 20; and a plurality of fitting legs 11 that extend from the top board 13 to be joined to the circuit board 20. On the circuit board 20 are provided a plurality of electrode lands 21 to which the plurality of fitting legs 11 are joined respectively. A fitting leg 11 includes: a fixation part 11a fitted on the circuit board 20; and an insertion part 11b that extends from the fixation part 11a and protrudes. In an electrode land 21 and the circuit board 20 are provided insertion holes 25 into which the insertion part 11b is inserted. The insertion part 11b has a joint material housing part 17 extending from its bottom end surface 11e toward the fixation part 11a.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an electronic circuit module, and more particularly to an electronic circuit module to which a metal cover is attached.

  2. Description of the Related Art Conventionally, an electronic circuit module in which a plurality of electronic components are mounted on a circuit board and a metal cover is attached so as to cover the plurality of electronic components is known. Such an electronic circuit module is disclosed in Patent Document 1. An electronic circuit module 900 disclosed in Patent Document 1 is shown in FIGS.

  As shown in FIG. 11, the electronic circuit module 900 is an electronic circuit module having a circuit board 920 on which an electronic component 910 is mounted, and a metal cover 930 covering the circuit board 920. The metal cover 930 includes: A top plate 931 disposed opposite to the circuit board 920, a plurality of side plates 932, and a plurality of mounting legs 933 are provided. The circuit board 920 has a plurality of lands 921 to which a plurality of mounting legs 933 are joined, and the plurality of mounting legs 933 includes a bent portion 933a positioned on the outer periphery of the top plate 931 of the metal cover 930, and a mounting leg bent portion. 933b, a mounting leg fixing portion 933c contacting the plurality of lands 921 of the circuit board 920, and a mounting leg insertion portion 933d (see FIG. 12). In the electronic circuit module 900, when viewed from the top surface of the circuit board 920, the position of the bent portion 933a is inside the position of the mounting leg fixing portion 933c, and the width of the bending portion 933a is larger than the width of the mounting leg fixing portion 933c. .

  With such a configuration, even if the metal cover 930 is thinned, the metal cover 930 can be prevented from being deformed.

JP 2014-033025 A

  However, in the electronic circuit module 900, as shown in FIG. 12, since the bonding material 940 is applied onto the land 921, and then the mounting leg insertion portion 933d is inserted into the insertion hole 922, the bonding material 940 on the land 921 is Then, it is pushed into the insertion hole 922 by the mounting leg insertion portion 933d and accumulates in the lower part of the insertion hole 922. Therefore, a part of the bonding material 940 protrudes below the substrate 920, and in the subsequent bonding process, the bonding material 940 is produced as it is fixed to the lower side of the substrate 920, and the electron with poor flatness is produced. It was a circuit module. As a result, there has been a possibility that a problem of causing a circuit short circuit or poor contact may occur in the process of attaching the product incorporating the electronic circuit module 900 to the main board.

  The present invention has been made in view of such a state of the art, and it is an object of the present invention to provide an electronic circuit module that has no protrusion of the bonding material from the lower surface of the circuit board and can be stably mounted in the subsequent steps. And

  In order to solve the above problems, an electronic circuit module of the present invention is an electronic circuit module having a circuit board on which an electronic component is mounted and a metal cover covering the circuit board, wherein the metal cover is A top plate disposed opposite to the circuit board; and a plurality of mounting legs extending from the top board and joined to the circuit board, wherein the circuit board includes a plurality of mounting legs, respectively. A plurality of electrode lands bonded to each other, and the mounting leg has a fixing portion fixed to the circuit board, and an insertion portion extending from the fixing portion and protruding. The electrode land and the circuit board are provided with an insertion hole into which the insertion portion is inserted, and the insertion portion extends from the lower end surface of the insertion portion toward the fixing portion. Having Having the characteristics say.

  In the electronic circuit module configured as described above, since the insertion portion has a gap between the bonding material accommodation portions, the cross-sectional area in the circuit board surface direction on the lower end side of the insertion portion becomes small. Therefore, the amount of the bonding material that is pushed into the insertion hole when the insertion portion after application of the bonding material to the electrode land is inserted is suppressed. Further, since the extra joining material is accommodated in the joining material accommodating portion of the mounting leg during the joining process of the metal cover to the circuit board, the joining material does not protrude from the lower surface of the circuit board.

  Further, in the above configuration, the bonding material accommodating portion is inclined so that a separation distance from the inner wall surface of the insertion hole on the surface in the thickness direction of the insertion portion becomes smaller toward the root side of the insertion portion. It has the feature of having a surface.

  In the electronic circuit module configured in this way, when inserting the insertion portion of the mounting leg into the insertion hole, a force that pushes the bonding material laterally by the inclined surface acts, so that the bonding material is applied to the inner wall surface of the insertion hole. Can be moved. Therefore, the amount of the bonding material that moves to the lower side of the insertion hole can be reduced. Further, the space between the mounting leg and the inner wall surface of the insertion hole is easily filled with the bonding material, and the bonding strength is increased.

  In the above configuration, the bonding material accommodation portion has a V-shaped valley shape.

  In the electronic circuit module configured in this way, the gap formed between the inner wall surface of the insertion hole of the circuit board and the bonding material accommodating portion is increased by forming the bonding material accommodating portion into a V-shaped valley shape. Since it can be formed, the amount of the bonding material that moves to the lower side of the insertion hole can be further reduced.

  Further, in the above configuration, the bonding material accommodating portion has a notch surface, and a separation distance between the inner wall surface of the insertion hole and the notch surface becomes smaller toward the root side of the insertion portion. It has the characteristic of having a step.

  In the electronic circuit module configured in this way, when inserting the insertion portion of the mounting leg into the insertion hole, a force that pushes the bonding material laterally by the notch surface acts, so that the bonding material extends to the inner wall surface of the insertion hole. Can be moved. Therefore, the amount of the bonding material that moves to the lower side of the insertion hole can be reduced. Further, the space between the mounting leg and the inner wall surface of the insertion hole is easily filled with the bonding material, and the bonding strength is increased.

  In the above configuration, the circuit board and the metal cover each have a substantially rectangular shape, and the mounting legs are provided at the four corners of the metal cover, and one of the bases of the insertion portion. The metal cover is disposed on the circuit board so that the sides of the mounting legs having the constricted portions or the sides having no constricted portions face each other. It has the feature of being.

  The electronic circuit module configured as described above can stably press-fit the metal cover into the insertion hole when the metal cover is attached to the circuit board, and balances the strength of the entire metal cover in each direction. be able to.

  Further, the above configuration has a feature that the fixed portion has an escape portion.

  In the electronic circuit module configured in this way, by providing a relief portion in the fixing portion of the mounting leg, the joining material is moved to the relief portion during the joining process of the metal cover to the circuit board, and the metal cover is prevented from floating. be able to.

  In the electronic circuit module of the present invention, since the insertion portion has a gap between the bonding material accommodation portions, the cross-sectional area in the circuit board surface direction on the lower end side of the insertion portion is reduced. Therefore, the amount of the bonding material that is pushed into the insertion hole when the insertion portion after application of the bonding material to the electrode land is inserted is suppressed. Further, since the extra joining material is accommodated in the joining material accommodating portion of the mounting leg during the joining process of the metal cover to the circuit board, the joining material does not protrude from the lower surface of the circuit board.

It is a perspective view which shows the external appearance of the electronic circuit module in embodiment of this invention. It is a top view of the electronic circuit module in the embodiment of the present invention. It is an expansion schematic diagram of the electronic circuit module in embodiment of this invention. It is an expansion perspective view of an attachment leg. It is an expanded sectional view which shows a joining material accommodating part. It is an expansion schematic diagram after joining material application. It is an expansion schematic diagram which shows the state after mounting leg insertion It is an expansion schematic diagram of the electronic circuit module of a 1st modification. It is an expanded sectional view showing the joining material storage part of the 1st modification. It is an expansion schematic diagram of the electronic circuit module of a 2nd modification. It is a perspective view which shows the external appearance of the electronic circuit module in a prior art example. It is an expansion schematic diagram which shows the state after attachment leg insertion in a prior art example.

[Embodiment of electronic circuit module]
Hereinafter, embodiments of an electronic circuit module of the present invention will be described with reference to the drawings. The electronic circuit module is a small electronic circuit module that includes a high frequency circuit such as a wireless local area network (LAN) and has a metal cover attached thereto. In addition, about the use of the electronic circuit module of this invention, it is not limited to this, It can change suitably. In the present specification, unless otherwise specified, the Z1 side of each drawing is described as the upper side, and the Z2 side is described as the lower side.

  First, the configuration of the electronic circuit module 100 will be described with reference to FIGS. 1 to 5. FIG. 1 is a perspective view showing an external appearance of the electronic circuit module 100, and FIG. 2 is a plan view of the electronic circuit module 100. 3 is an enlarged schematic view of the electronic circuit module 100 when viewed from the Y2 side, and FIG. 4 is an enlarged perspective view of the mounting leg 11 in the metal cover 10. As shown in FIG. 5 is an enlarged cross-sectional view showing the bonding material accommodating portion 17 in a state where the mounting leg 11 is inserted into the insertion hole 25 of the circuit board 20 when viewed from the line AA in FIG. In FIG. 3, a state before the metal cover 10 is attached to the circuit board 20 is shown in order to clearly represent each component. Further, FIG. 8 and FIG. 10 to be described later are the same as FIG.

  As shown in FIGS. 1 and 2, the electronic circuit module 100 is an electronic circuit module including a circuit board 20 on which a plurality of electronic components 31 are mounted and a metal cover 10 covering the circuit board 20. On the circuit board 20, an electronic circuit 30 such as a high-frequency circuit constituted by an electronic component 31 and a wiring pattern (not shown) is formed.

  The metal cover 10 has a substantially rectangular shape having four sides in a plan view, and is extended from the four corners of the top plate 13 downward from the top plate 13 disposed to face the circuit board 20. A plurality of mounting legs 11 and a plurality of side plates 15 provided so as to extend downward from the top plate 13 and surround the four sides of the electronic circuit 30 are provided. The metal cover 10 is attached to shield unnecessary radio waves from the outside or prevent radio waves from the electronic circuit 30 from leaking outside.

  The circuit board 20 has a substantially rectangular shape having four sides, and the mounting legs 11 provided at the four corners of the metal cover 10 are joined to the four corners of the circuit board 20. As shown in FIG. 3, the circuit board 20 is provided with component lands 27 to which the electronic components 31 are bonded, and as shown in FIGS. 1 to 3, each of the plurality of mounting legs 11 of the metal cover 10. There are provided a plurality of electrode lands 21 to which are joined. Each of the plurality of electrode lands 21 is provided in the vicinity of the four corners of the circuit board 20 so that the four corners of the metal cover 10 are attached.

  As shown in FIGS. 3 and 4, the mounting leg 11 is a fixed portion 11 a fixed to the circuit board 20, and a contact portion that is a part of the fixed portion 11 a and contacts the electrode land 21 on the circuit board 20. 11d, an insertion portion 11b extending from the fixing portion 11a and projecting, and an escape portion 11c provided near the base of the insertion portion 11b.

  The insertion portion 11b has a lower end surface 11e that protrudes downward. The escape portions 11c are regions having an arc-shaped space below the fixed portion 11a, and two escape portions 11c are provided on one mounting leg 11. When the metal cover 10 is bonded to the circuit board 20 by the bonding material 41 (see FIG. 7B), the escape portion 11c moves the bonding material 41 from the abutting portion 11d to the escape portion 11c, and the metal cover 10 10 is provided to prevent the circuit board 20 from floating upward.

  The electrode land 21 and the circuit board 20 are provided with an insertion hole 25 into which the insertion portion 11b of the mounting leg 11 is inserted. The insertion hole 25 is formed in a circular shape in plan view. The diameter of the insertion hole 25 is set to be approximately the same as the width of the insertion portion 11 b of the mounting leg 11. The diameter of the insertion hole 25 is not limited as long as the insertion portion 11b of the mounting leg 11 can be inserted, but the diameter of the insertion hole 25 is set in order to press-fit the mounting leg 11 for mounting. The width of the insertion portion 11b of the mounting leg 11 may be set slightly smaller. Further, the insertion hole 25 may be formed in a polygonal shape in plan view.

  The insertion portion 11b of the mounting leg 11 has a bonding material accommodating portion 17 that extends from the lower end surface 11e of the insertion portion 11b toward the fixing portion 11a. As shown in FIG. 5, the bonding material accommodating portion 17 is separated from the inner wall surface 25 a of the insertion hole 25 of the circuit board 20 by a separation distance L1 on the surface in the thickness direction (Y1-Y2 direction) of the insertion portion 11 b of the mounting leg 11. However, it has the inclined surface 17a which becomes small as it goes to the base side of the insertion part 11b.

  Since the bonding material accommodating portion 17 has such an inclined surface 17a, a gap that becomes smaller in the upward direction is formed between the inner wall surface 25a of the insertion hole 25 of the circuit board 20 and the bonding material accommodating portion 17. The Although the electronic circuit module 100 has the inclined surface 17a on the Y2 side of the insertion portion 11b, it may be set to have the inclined surface 17a on both the Y1 side and the Y2 side of the insertion portion 11b. good.

  Moreover, in the electronic circuit module 100, as shown in FIG. 4, the shape of the joining material accommodating part 17 is made into the V-shaped valley shape. By making the shape of the bonding material accommodating portion 17 into a V-shaped valley shape, a large gap can be formed between the inner wall surface 25 a of the insertion hole 25 of the circuit board 20 and the bonding material accommodating portion 17. In addition, as long as the direction of the inclination with respect to the inner wall surface 25a is the same, the corner of the V-shaped valley shape of the bonding material accommodating portion 17 may be rounded.

  Next, a state when the mounting leg 11 of the metal cover 10 is inserted into the insertion hole 25 of the circuit board 20 in the manufacturing process of the electronic circuit module 100 will be described with reference to FIGS. FIG. 6 is an enlarged schematic view showing the mounting leg 11 and the circuit board 20 after the bonding material 41 is applied onto the electrode land 21 before the mounting leg 11 is inserted into the insertion hole 25 of the circuit board 20. FIG. 7 is an enlarged schematic view showing the relationship between the mounting leg 11 and the circuit board 20 after the mounting leg 11 is inserted on the electrode land 21, and FIG. 7A shows the mounting leg 11 of the circuit board 20. FIG. 7B is an enlarged schematic diagram showing a state immediately after being inserted into the insertion hole 25, and FIG. 7B is an enlarged schematic diagram showing a state after the mounting leg 11 is joined to the circuit board 20.

  When the metal cover 10 is attached to the circuit board 20, the bonding material 41 is first applied onto the electrode land 21 as shown in FIG. 6. The bonding material 41 is applied by screen printing. As the bonding material 41, for example, solder is used. The applied bonding material 41 has a shape such that the center of the bonding material 41 rises due to surface tension on the electrode land 21. The insertion portion 11 b of the mounting leg 11 to be inserted into the insertion hole 25 is positioned before insertion so that the bonding material accommodating portion 17 is located directly above the center of the insertion hole 25.

  Next, as shown in FIG. 7A, the insertion portion 11 b of the mounting leg 11 is inserted into the insertion hole 25 of the circuit board 20. When the insertion portion 11 b of the mounting leg 11 is inserted into the insertion hole 25 of the circuit board 20, the contact portion 11 d comes into contact with the surface of the electrode land 21, and the bonding material 41 is on the electrode land 21 and the escape portion of the mounting leg 11. It adheres to the fixing | fixed part 11a so that 11c may be covered.

  At this time, a part of the bonding material 41 is pushed downward in the insertion hole 25 by the lower end surface 11e of the insertion portion 11b, and a part of the bonding material 41 protrudes below the lower surface of the circuit board 20. Further, another part of the bonding material 41 pushed downward in the insertion hole 25 enters the bonding material accommodating portion 17. At the same time, when the insertion portion 11b of the mounting leg 11 is inserted into the insertion hole 25, a force that pushes the bonding material 41 in the lateral direction (Y2 direction) acts by the inclined surface 17a, so that the bonding material extends to the inner wall surface 25a of the insertion hole 25. 41 can be moved.

  Next, the insertion portion 11 b of the mounting leg 11 is joined to the circuit board 20 by a reflow process or the like. At this time, as shown in FIG. 7B, the bonding material 41 pushed downward in the insertion hole 25 by the lower end surface 11 e of the insertion portion 11 b melts and enters the inside of the bonding material accommodation portion 17. To do. The bonding material 41 that has entered the inside of the bonding material container 17 rises along the inclined surface 17a of the bonding material container 17 by capillary action, and easily penetrates to the upper end of the bonding material container 17. .

  As a result, the bonding material 41 that has been pushed downward in the insertion hole 25 is accommodated in the insertion hole 25 without protruding downward from the lower surface of the circuit board 20. As a result, the amount of the bonding material 41 moving to the lower side of the insertion hole 25 can be reduced, and the space between the mounting leg 11 and the inner wall surface 25a of the insertion hole 25 is easily filled with the bonding material, and the bonding strength is also increased. Become stronger. Such an effect works even more effectively when the mounting leg 11 is press-fitted into the insertion hole 25 of the circuit board 20.

  Further, as described above, the gap formed between the inner wall surface 25a of the insertion hole 25 of the circuit board 20 and the bonding material accommodating portion 17 is formed by forming the bonding material accommodating portion 17 in a V-shaped valley shape. Since it can be formed large, the amount of the bonding material moving to the lower side of the insertion hole can be further reduced. Furthermore, by making the shape of the bonding material accommodating portion 17 into a V-shaped valley shape, this gap can be set so as to become continuously narrower toward the base side of the insertion portion 11b. Capillary action can be exerted more strongly.

[First Modification of Electronic Circuit Module]
Next, the configuration of the electronic circuit module 110 will be described with reference to FIGS. 1, 2, 8, and 9. The electronic circuit module 110 is a first modification of the electronic circuit module 100 described above. FIG. 1 is a perspective view showing an external appearance of the electronic circuit module 110, and FIG. 2 is a plan view of the electronic circuit module 110. 8 is an enlarged schematic view of the electronic circuit module 110, and FIG. 9 is an enlarged cross-sectional view showing the bonding material accommodating portion 57 of the electronic circuit module 110 when viewed from the line AA in FIG. is there.

  The difference between the configuration of the electronic circuit module 110 and the configuration of the electronic circuit module 100 is that the structure of the mounting leg 51 of the metal cover 50 of the electronic circuit module 110 and the structure of the mounting leg 11 of the metal cover 10 of the electronic circuit module 100 are different. It is only different. Therefore, the description of portions other than those related to the mounting legs 51 is omitted. Moreover, the code | symbol with respect to each component other than the attachment leg 51 of the metal cover 50 uses the code | symbol with respect to each component of the electronic circuit module 100 as it is.

  As shown in FIGS. 1 and 2, the electronic circuit module 110 is an electronic circuit module including a circuit board 20 on which a plurality of electronic components 31 are mounted, and a metal cover 50 covering the circuit board 20. On the circuit board 20, an electronic circuit 30 such as a high-frequency circuit constituted by an electronic component 31 and a wiring pattern (not shown) is formed.

  The metal cover 50 has a substantially rectangular shape having four sides in a plan view, and extends from the four corners of the top plate 13 downward from the top plate 13 disposed facing the circuit board 20. A plurality of mounting legs 51 joined to the circuit board 20, and a plurality of side plates 15 that extend downward from the top plate 13 and surround the four sides of the electronic circuit 30. The metal cover 50 is attached to shield unnecessary radio waves from the outside and prevent radio waves from the electronic circuit 30 from leaking outside.

  As shown in FIG. 8, the mounting leg 51 is a fixed portion 51 a fixed to the circuit board 20, a part of the fixed portion 51 a, and a contact portion 51 d that contacts the electrode land 21 on the circuit board 20. The insertion portion 51b extends from the fixing portion 51a and protrudes, and the escape portion 51c is provided near the base of the insertion portion 51b. The insertion portion 51b has a lower end surface 51e that protrudes downward.

  The insertion portion 51b of the mounting leg 51 has a bonding material accommodation portion 57 extending from the lower end surface 51e of the insertion portion 51b toward the fixing portion 51a. As shown in FIG. 9, the bonding material accommodating portion 57 has a notch surface 57a, and the distance L2 between the inner wall surface 25a of the insertion hole 25 of the circuit board 20 and the notch surface 57a is such that the mounting leg 51 is inserted. There is a step 57b that becomes smaller toward the base side of the portion 51b.

  Since the bonding material accommodating portion 57 has such a structure, when the insertion portion 51b of the mounting leg 51 is inserted into the insertion hole 25, the bonding material 41 is moved in the lateral direction (notch surface 57a of the bonding material accommodating portion 57). Since the pushing force acts in the Y1 direction and the Y2 direction and the X1 direction and the X2 direction), the bonding material 41 can be moved to the inner wall surface 25a of the insertion hole 25. Therefore, the amount of the bonding material 41 that moves to the lower side of the insertion hole 25 can be reduced. Further, the space between the mounting leg 51 and the inner wall surface 25a of the insertion hole 25 is easily filled with the bonding material 41, and the bonding strength is increased.

  In the electronic circuit module 110, as shown in FIG. 8, the width direction side of the insertion portion 51b, that is, the X1 side and the X2 side, and as shown in FIG. 9, the thickness direction side of the insertion portion 51b, The bonding material accommodating portions 57 are respectively provided on the Y1 side and the Y2 side. However, a structure having the bonding material accommodating portion 57 only in the width direction of the insertion portion 51b or only in the plate thickness direction of the insertion portion 51b may be employed.

  Further, in the manufacturing process of the electronic circuit module 110, the state when the mounting leg 51 of the metal cover 50 is inserted into the insertion hole 25 of the circuit board 20 is the same as in the case of the electronic circuit module 100. Is omitted.

[Second Modification of Electronic Circuit Module]
Next, the configuration of the electronic circuit module 120 will be described with reference to FIGS. 1, 2, and 10. The electronic circuit module 120 is a second modification of the electronic circuit module 100 described above. FIG. 1 is a perspective view showing an appearance of the electronic circuit module 120, and FIG. 2 is a plan view of the electronic circuit module 120. FIG. 10 is an enlarged schematic diagram of the electronic circuit module 120.

  The difference between the configuration of the electronic circuit module 120 and the configuration of the electronic circuit module 100 is that the structure of the mounting leg 61 of the metal cover 60 of the electronic circuit module 120 and the structure of the mounting leg 11 of the metal cover 10 of the electronic circuit module 100 are different. It is only different. Therefore, the description of portions other than those related to the mounting legs 61 is omitted. Moreover, the code | symbol with respect to each component other than the attachment leg 61 of the metal cover 60 uses the code | symbol with respect to each component of the electronic circuit module 100 as it is.

  As shown in FIGS. 1 and 2, the electronic circuit module 120 is an electronic circuit module including a circuit board 20 on which a plurality of electronic components 31 are mounted, and a metal cover 60 covering the circuit board 20. On the circuit board 20, an electronic circuit 30 such as a high-frequency circuit constituted by an electronic component 31 and a wiring pattern (not shown) is formed.

  The metal cover 60 has a substantially rectangular shape having four sides in a plan view, and extends from the four corners of the top plate 13 downward from the top plate 13 disposed facing the circuit board 20. A plurality of mounting legs 61 joined to the circuit board 20, and a plurality of side plates 15 extending from the top plate 13 in a downward direction so as to surround four sides of the electronic circuit 30. The metal cover 60 is attached to shield unnecessary radio waves from the outside or prevent radio waves from the electronic circuit 30 from leaking outside.

  As shown in FIG. 10, the mounting leg 61 is a fixed portion 61a fixed to the circuit board 20, and a contact portion 61d that is a part of the fixed portion 61a and contacts the electrode land 21 on the circuit board 20. The insertion portion 61b extends from the fixing portion 61a and protrudes, and the escape portion 61c is provided near the base of the insertion portion 61b. The insertion portion 61b is formed such that its lower end surface 61e protrudes downward.

  The insertion portion 61b of the mounting leg 61 has a bonding material accommodating portion 67 that extends from the lower end surface 61e of the insertion portion 61b toward the fixing portion 61a. In addition, since the structure and the operation of the bonding material accommodating portion 67 are the same as those of the electronic circuit module 100, the description thereof is omitted.

  The attachment leg 61 is provided with a constricted portion 61f only on one side of the base of the insertion portion 61b. In other words, from the center of the insertion portion 61b, the width on the X1 side where the constricted portion 61f is provided is set larger than the width on the X2 side where the constricted portion 61f is not provided. And the metal cover 60 is arrange | positioned and joined to the circuit board 20 so that the side with the constriction part 61f of the attachment leg 61 or the side without the constriction part 61f may mutually face.

  By adopting such a structure, when the metal cover 60 is press-fit into the insertion hole 25 of the circuit board 20 when the metal cover 60 is attached to the circuit board 20, the metal cover 60 can be stably attached.

  In the electronic circuit module 120, as shown in FIG. 10, the constricted portion 61f is provided on the X1 side of the inserting portion 61b of the mounting leg 61, but the constricted portion 61f may be provided on the X2 side of the inserting portion 61b. .

  Further, in the manufacturing process of the electronic circuit module 120, the state when the mounting leg 61 of the metal cover 60 is inserted into the insertion hole 25 of the circuit board 20 is the same as that of the electronic circuit module 100, and thus the description thereof is omitted. To do.

  Hereinafter, the effect by having set it as embodiment of this invention is demonstrated.

  In the electronic circuit module 100 of the present invention, since the insertion portion 11b has a gap in the bonding material accommodating portion 17, the cross-sectional area in the surface direction of the circuit board 20 on the lower end side of the insertion portion 11b is reduced. Therefore, the amount of the bonding material 41 that is pushed into the insertion hole 25 when the insertion portion 11b after application of the bonding material 41 to the electrode land 21 is inserted is suppressed. Further, since the extra joining material 41 is accommodated in the joining material accommodating portion 17 of the mounting leg 11 during the joining process of the metal cover 10 to the circuit board 20, the joining material 41 does not protrude from the lower surface of the circuit board 20.

  Further, when the insertion portion 11 b of the mounting leg 11 is inserted into the insertion hole 25, a force that pushes the bonding material 41 in the lateral direction by the inclined surface 17 a works, so that the bonding material 41 is moved to the inner wall surface 25 a of the insertion hole 25. be able to. Therefore, the amount of the bonding material 41 that moves to the lower side of the insertion hole 25 can be reduced. Further, the space between the mounting leg 11 and the inner wall surface 25a of the insertion hole 25 is easily filled with the bonding material 41, and the bonding strength is increased.

  Further, by forming the bonding material accommodating portion 17 in a V-shaped valley shape, a gap formed between the inner wall surface 25a of the insertion hole 25 of the circuit board 20 and the bonding material accommodating portion 17 can be formed large. Therefore, the amount of the bonding material 41 that moves to the lower side of the insertion hole 25 can be further reduced.

  Further, in the electronic circuit module 110 according to the first modified example of the present invention, when the insertion portion 51b of the mounting leg 51 is inserted into the insertion hole 25, a force that pushes the bonding material 41 laterally by the notch surface 57a works. The bonding material 41 can be moved to the inner wall surface 25a of the insertion hole 25. Therefore, the amount of the bonding material 41 that moves to the lower side of the insertion hole 25 can be reduced. Further, the space between the mounting leg 51 and the inner wall surface 25a of the insertion hole 25 is easily filled with the bonding material 41, and the bonding strength is increased.

  In addition, the electronic circuit module 120 according to the second modified example of the present invention can stably press-fit the metal cover 60 into the insertion hole 25 when the metal cover 60 is attached to the circuit board 20, and the entire metal cover 60. It is possible to balance the strength in each direction.

  Further, the electronic circuit modules 100, 110, and 120 of the present invention are provided with the metal cover 10 by providing the relief portions 11c, 51c, or 61c in the fixing portions 11a, 51a, or 61a of the mounting legs 11, 51, or 61, respectively. , 50, or 60 can be moved to the relief portion 11c, 51c, or 61c during the bonding process to the circuit board 20, and the metal cover 10, 50, or 60 can be prevented from floating.

  As described above, in the electronic circuit module of the present invention, since the insertion portion has a gap between the bonding material accommodation portions, the cross-sectional area in the circuit board surface direction on the lower end side of the insertion portion is reduced. Therefore, the amount of the bonding material that is pushed into the insertion hole when the insertion portion after application of the bonding material to the electrode land is inserted is suppressed. Further, since the extra joining material is accommodated in the joining material accommodating portion of the mounting leg during the joining process of the metal cover to the circuit board, the joining material does not protrude from the lower surface of the circuit board.

  The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention.

DESCRIPTION OF SYMBOLS 10 Metal cover 11 Mounting leg 11a Fixed part 11b Insertion part 11c Escape part 11d Contact part 11e Lower end surface 13 Top plate 15 Side plate 17 Joining material accommodating part 17a Inclined surface 20 Circuit board 21 Electrode land 25 Insertion hole 25a Inner wall surface 27 Component land 30 Electronic circuit 31 Electronic component 41 Bonding material 50 Metal cover 51 Mounting leg 51a Fixing part 51b Insertion part 51c Relief part 51d Contact part 51e Lower end surface 57 Bonding material accommodating part 57a Notch surface 57b Step 60 Metal cover 61 Mounting leg 61a Fixing Part 61b Insertion part 61c Escape part 61d Contact part 61e Lower end surface 61f Neck part 67 Bonding material accommodation part 100 Electronic circuit module 110 Electronic circuit module 120 Electronic circuit module L1 Separation distance L2 Separation distance

Claims (6)

An electronic circuit module having a circuit board on which electronic components are mounted, and a metal cover covering the circuit board,
The metal cover includes a top plate disposed to face the circuit board, and a plurality of mounting legs that extend from the top board and are joined to the circuit board.
The circuit board is provided with a plurality of electrode lands to which the plurality of mounting legs are joined,
The mounting leg has a fixing portion fixed to the circuit board, and an insertion portion extending from the fixing portion and protruding.
The electrode land and the circuit board are provided with an insertion hole into which the insertion portion is inserted,
The insertion portion has a bonding material accommodating portion that extends from the lower end surface of the insertion portion toward the fixing portion.
An electronic circuit module characterized by that. The bonding material accommodating portion has an inclined surface such that a separation distance in a surface in a thickness direction of the insertion portion from the inner wall surface of the insertion hole decreases toward the root side of the insertion portion.
The electronic circuit module according to claim 1. The bonding material accommodating portion has a V-shaped valley shape.
The electronic circuit module according to claim 1 or 2, characterized in that The bonding material accommodating portion has a notch surface, and has a step such that the distance between the inner wall surface of the insertion hole and the notch surface becomes smaller toward the root side of the insertion portion,
The electronic circuit module according to claim 1. The circuit board and the metal cover each have a substantially rectangular shape, and the mounting legs are provided at four corners of the metal cover,
A constricted portion is provided only on one side of the base of the insertion portion,
The metal cover is disposed on the circuit board so that the sides of the mounting legs having the constricted portions or the sides having no constricted portions face each other.
The electronic circuit module according to any one of claims 1 to 4, wherein the electronic circuit module is provided. There is an escape portion in the fixed portion,
6. The electronic circuit module according to claim 1, wherein the electronic circuit module is characterized in that:

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