JP2017126482A - Organic el unit, optical writing device, image forming apparatus and method for manufacturing organic el unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an organic EL unit suppressing degradation in an organic EL element by light, an optical writing device, an image forming apparatus, and a method for manufacturing an organic EL unit.SOLUTION: An organic EL unit 20 includes a transparent substrate 21, a plurality of organic EL elements disposed on the transparent substrate, an encapsulation member 24 encapsulating the plurality of organic EL elements, a support member 25 supporting the encapsulation member on an opposite side to the side where the transparent substrate is located, and an adhesion part 40 adhering the support member and the encapsulation member and constituted by a cured photocurable resin. In a plan view of the unit, the support member has a peripheral edge region R1 protruding outward from the encapsulation member. The adhesion part is provided on the peripheral edge region, bonds a part of an outer peripheral face 24b of the encapsulation member and the support member, and has a contact face 40a in contact with the peripheral edge region and a counter face 40b opposing to the contact face, in which the counter face is inclined to be farther from the contact face while the counter face is heading outward from the outer peripheral surface 24b.SELECTED DRAWING: Figure 6

Description

  The present invention relates to an organic EL (Electro Luminescence) unit, an optical writing device including the organic EL unit, an image forming apparatus including the optical writing device, and a method for manufacturing the organic EL unit.

  In recent years, organic EL elements have been used for display applications and illumination applications. An organic EL element is composed of an organic layer including at least an organic light emitting layer, and an anode and a cathode disposed so as to sandwich the organic layer, and an organic light emission is performed by applying a current or a voltage between the anode and the cathode. The layer emits light.

  On the other hand, in an image forming apparatus employing an electrophotographic method, conventionally, an LED (Light Emitting Diode) element, a semiconductor laser element, or the like is used as a light source as an optical writing apparatus for writing an electrostatic latent image on the surface of a photoreceptor. What has been used has been used. However, with the widespread use of the organic EL elements described above, in recent years, the use of an organic EL element as a light source of an optical writing device has been studied.

  An organic EL element is often configured as an organic EL panel by being formed on a substrate such as a glass substrate or a transparent film substrate. In that case, if a driver IC including a drive circuit for driving an organic EL element is mounted on the substrate by, for example, COG (Chip On Glass) mounting, an advantage that the apparatus can be reduced in size can be obtained. .

  When an organic EL panel is used for an optical writing device, an organic EL unit configured by sealing an organic EL element on a substrate with a sealing member and fixing the sealing member to a support member is optically written. Install in the device. In the case of fixing the sealing member to the support member, for example, after adjusting the positions of the organic EL panel and the sealing member on the support member, an adhesive may be applied and cured.

  By fixing the sealing member to the support member by bonding, fixing at normal temperature is possible, and fixing at low strain is possible. In particular, by using a photocurable adhesive, it is possible to fix in a shorter time than when using a two-component mixed adhesive or the like.

  However, the organic EL element deteriorates when irradiated with strong light such as that used to cure the photocurable adhesive. For this reason, when bonding a sealing member and a support member, it is requested | required that a photocurable adhesive agent should be hardened, without degrading an organic EL element.

  Although it is different from an organic EL element, JP 2005-135992 A (Patent Document 1) discloses a technique in which a unit provided with a solid-state imaging element is fixed to a light transmissive member using a photocurable resin. And JP-A-2014-36799 (Patent Document 2).

  Since the solid-state imaging device is also deteriorated by light such as ultraviolet rays, in Patent Documents 1 and 2, light is applied to the photocurable resin so that the solid-state imaging device is not irradiated with light.

  In Patent Document 1, when manufacturing an imaging device, a light-transmitting lid coated with a photocurable adhesive is brought into contact with a hollow package that houses a solid-state imaging device. In this state, the imaging surface of the solid-state imaging device is shielded by the light shielding means, and light is irradiated to the photocurable adhesive. By using the light shielding means in this way, it is possible to prevent light from being directly irradiated onto the solid-state imaging device.

  In Patent Document 2, when manufacturing an optical unit, first, a main surface of a cover glass located on the side opposite to the side on which the solid-state imaging device is provided, and a centering glass on the side on which the mask portion is provided. The photo-curable adhesive is sandwiched between the main surface of At this time, an adhesive having a refractive index larger than that of the cover glass is used.

  Subsequently, light is irradiated obliquely from the base end side of the solid-state imaging device to the side surface of the cover glass. Thereby, it is possible to control the refraction direction of the light entering the photocurable adhesive from the cover glass while preventing light from being reflected at the interface between the cover glass and the adhesive. As a result, it is possible to prevent light from entering the solid-state imaging device.

JP 2005-135992 A JP 2014-36799 A

  However, in Patent Document 1, when irradiating light to the photocurable adhesive in a state where the solid-state imaging device is covered with the light shielding unit, the photocurable resin is sandwiched between the light transmissive lid and the hollow package. In this state, the hollow package is pressed.

  When the printing pressure is not uniform, the photocurable resin does not have a flat shape. In such a case, even if the light shielding means is used, the refraction direction of the light entering the photocurable adhesive cannot be controlled, so that part of the light entering the photocurable adhesive is hollow. There is concern over repeated reflection between the package and the light-transmitting lid and entering the solid-state imaging device. Thereby, a solid-state image sensor will deteriorate.

  In Patent Document 2, there is a concern that part of the light that has entered the photocurable adhesive is reflected by the main surface of the centering glass and enters the solid-state imaging device. Thereby, a solid-state image sensor will deteriorate.

  The present invention has been made in view of the above problems, and an object of the present invention is an organic EL unit, an optical writing apparatus, an image forming apparatus, and an organic EL in which deterioration of an organic EL element due to light is suppressed. It is to provide a method for manufacturing a unit.

  An organic EL unit according to the first aspect of the present invention includes a transparent substrate, a plurality of organic EL elements provided on the transparent substrate, a sealing member for sealing the plurality of organic EL elements, and the transparent A support member that supports the sealing member from the side opposite to the side on which the substrate is located, and an adhesive portion that is made of a cured photocurable resin that bonds the support member and the sealing member together. The support member has a peripheral region protruding outward from the sealing member when seen in a plan view, and the adhesive portion is provided on the peripheral region, and a part of the outer peripheral surface of the sealing member And a contact surface that contacts the peripheral region and a relative surface that faces the contact surface, and the relative surface moves away from the contact surface toward the outside from the outer peripheral surface. So as to be inclined.

  An organic EL unit based on the second aspect of the present invention includes a transparent substrate, a plurality of organic EL elements provided on the transparent substrate, a sealing member for sealing the plurality of organic EL elements, and the transparent A support member that supports the sealing member from the side opposite to the side on which the substrate is located, and an adhesive portion that is made of a cured photocurable resin that bonds the support member and the sealing member together. The support member has a peripheral region protruding outward from the sealing member when seen in a plan view, and the adhesive portion is provided on the peripheral region, and a part of the outer peripheral surface of the sealing member And the support member are bonded together, and the peripheral region is inclined so as to move away from the transparent substrate toward the outside.

  In the organic EL unit according to the second aspect of the present invention, the support member has a support surface that supports the sealing member inside the peripheral region, and the adhesive portion is the peripheral region. And a relative surface opposite to the contact surface. In this case, it is preferable that the outer peripheral surface of the sealing member is substantially orthogonal to the support surface, and the relative surface of the adhesive portion is substantially orthogonal to the outer peripheral surface of the sealing member.

  The organic EL unit based on the first aspect and the second aspect of the present invention may further include a reinforcing portion that stabilizes the shape of the relative surface.

  In the organic EL unit based on the first aspect and the second aspect of the present invention, the adhesive portion has an outer side surface on the side opposite to the outer peripheral surface side of the sealing member. In this case, the reinforcing portion may be provided apart from the support member and may be in contact with one end side of the outer side surface located on the relative surface side.

  In the organic EL unit based on the first aspect and the second aspect of the present invention, the adhesive portion has an outer side surface on the side opposite to the outer peripheral surface side of the sealing member. The reinforcing part may be configured by a wall part standing from an outer peripheral part in the peripheral region. In this case, it is preferable that the inner surface of the wall portion is in contact with the other end side of the outer side surface located on the contact surface side from one end side of the outer side surface located on the relative surface side.

  In the organic EL unit based on the first aspect and the second aspect of the present invention, the reinforcing portion has a contact portion that contacts the outer side surface of the adhesive portion. In this case, a light absorbing part may be provided in the contact part.

  In the organic EL unit according to the first aspect and the second aspect of the present invention, the reinforcing portion includes a plate portion that extends along the relative surface and contacts the relative surface. Also good. In this case, the plate part preferably has translucency.

  In the organic EL unit based on the first aspect and the second aspect of the present invention, the reinforcing part is provided with a wettability improving part that improves the wettability of the adhesive part at a part in contact with the adhesive part. You may have.

  In the organic EL unit based on the first aspect and the second aspect of the present invention, the photocurable resin is preferably an ultraviolet curable resin that is cured by ultraviolet rays.

  An optical writing device according to the present invention writes an electrostatic latent image by irradiating light on the surface of a charged photoreceptor, and emits the organic EL unit described above and the organic EL unit. And an optical system that forms an image of the emitted light.

  An image forming apparatus according to the present invention includes the optical writing device described above for image formation.

  The organic EL unit manufacturing method according to the present invention includes a step of forming a plurality of organic EL elements on a transparent substrate, a step of sealing the plurality of organic EL elements with a sealing member, and the transparent substrate being positioned. A step of supporting the sealing member with a support member from the side opposite to the side to be performed, and a step of bonding the support member and the sealing member using a photocurable resin. The support member has a peripheral region that protrudes outward from the sealing member when viewed in plan, and has a support surface that is provided inside the peripheral region and supports the sealing member. The outer peripheral surface of the member is substantially orthogonal to the support surface. The step of bonding the support member and the sealing member includes a step of applying a photocurable resin to the peripheral region, a step of shaping the shape of the photocurable resin using a shaping member, and the shaping. Irradiating the photocurable resin with light along a direction substantially parallel to the outer peripheral surface of the sealing member in a state where the shape of the photocurable resin is shaped by the member. In the step of shaping the shape of the photocurable resin, the distance between the contact surface of the photocurable resin that contacts the peripheral region and the relative surface of the photocurable resin that faces the contact surface is determined by the sealing. Increasing from the outer peripheral surface of the member toward the outside.

  In the manufacturing method of the organic EL unit based on the present invention, the support member has a support surface that supports the sealing member inside the peripheral region, and is continuous with the support surface and the support surface. You may use a thing with the main surface of the said peripheral area | region parallel. In this case, in the step of shaping the shape of the photocurable resin, it is preferable that the relative surface is inclined so as to move away from the contact surface as it goes outward from the outer peripheral surface.

  In the manufacturing method of the organic EL unit based on the said invention, you may use as the said supporting member what the said peripheral area inclines so that it may move away from the said transparent substrate as it goes outside. In this case, in the step of shaping the shape of the photocurable resin, it is preferable that the relative surface is substantially orthogonal to the outer peripheral surface.

  The method for producing an organic EL unit according to the present invention includes a step of separating the shaping member from the photocurable resin cured by irradiating light after the step of bonding the support member and the sealing member. May be further provided.

  According to the present invention, there is provided an organic EL unit, an optical writing device, an image forming apparatus, and a method for manufacturing the organic EL unit in which deterioration of the organic EL element due to light is suppressed.

1 is a schematic diagram of an image forming apparatus according to Embodiment 1. FIG. It is a schematic diagram of the image forming station shown in FIG. FIG. 3 is a schematic cross-sectional view of the optical writing device shown in FIG. 2. FIG. 3 is a schematic bottom view of the optical writing device shown in FIG. 2. FIG. 5 is a schematic plan view showing the organic EL unit shown in FIG. 4. It is a schematic cross section along the VI-VI line shown in FIG. 3 is a flowchart showing a method for manufacturing the organic EL unit according to Embodiment 1. FIG. It is a figure which shows the back state of the process of apply | coating the photocurable resin shown in FIG. It is a figure which shows the process of shaping the shape of the photocurable resin shown in FIG. 5 is a schematic cross-sectional view of an organic EL unit according to Embodiment 2. FIG. It is a figure which shows the process of shaping the photocurable resin in the manufacturing method of the organic EL unit which concerns on Embodiment 2. FIG. It is a figure which shows the process of irradiating light to the photocurable resin in the manufacturing method of the organic EL unit which concerns on Embodiment 2. FIG. 6 is a schematic cross-sectional view showing an organic EL unit according to Embodiment 3. FIG. It is a figure which shows the process of shaping the photocurable resin in the manufacturing method of the organic EL unit which concerns on Embodiment 3. FIG. It is a figure which shows the process of irradiating light to the photocurable resin in the manufacturing method of the organic EL unit which concerns on Embodiment 3. FIG. 5 is a schematic cross-sectional view showing an organic EL unit according to Embodiment 4. FIG. 6 is a schematic cross-sectional view showing an organic EL unit according to Embodiment 5. FIG. It is a figure which shows the process of shaping the photocurable resin in the manufacturing method of the organic EL unit which concerns on Embodiment 5. FIG. It is a figure which shows the process of irradiating light to the photocurable resin in the manufacturing method of the organic EL unit which concerns on Embodiment 5. FIG. 10 is a schematic cross-sectional view showing an organic EL unit according to Embodiment 6. FIG.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the embodiments described below, an image forming apparatus to which the present invention is applied, an optical writing apparatus provided in the image forming apparatus, and a so-called tandem type color printer adopting an electrophotographic method as an organic EL unit provided in the image forming apparatus. An optical writing device provided in the device and an organic EL unit provided in the device will be described as an example. In the following embodiments, the same or common parts are denoted by the same reference numerals in the drawings, and description thereof will not be repeated.

(Embodiment 1)
(Image forming device)
FIG. 1 is a schematic diagram of an image forming apparatus according to Embodiment 1, and FIG. 2 is a schematic diagram of the image forming station shown in FIG. With reference to FIG. 1 and FIG. 2, a schematic configuration of the image forming apparatus 1 in the present embodiment will be described.

  As shown in FIG. 1, the image forming apparatus 1 mainly includes an apparatus main body 2 and a paper feed unit 9. The apparatus main body 2 includes an image forming unit 2A that is a part for forming an image on a sheet, and a sheet feeding unit 2B that is a part for supplying the sheet to the image forming unit 2A. The paper supply unit 9 stores paper to be supplied to the image forming unit 2A, and is detachably provided in the paper supply unit 2B.

  Various rollers 3 are installed inside the image forming apparatus 1 so as to straddle the image forming unit 2A and the paper feeding unit 2B described above, and thereby a conveyance path 4 through which the sheet is conveyed along a predetermined direction. Has been built. Further, as shown in the figure, the paper feed unit 2B may be separately provided with a manual feed tray 9a for supplying paper to the image forming unit 2A.

  The image forming unit 2A includes an image forming station 5 capable of forming a toner image of each color, an intermediate transfer belt 6 suspended from the image forming station 5, and a conveyance path 4 on the running path of the intermediate transfer belt 6. And a fixing unit 8 provided on the conveyance path 4 in a portion downstream of the transfer unit 7.

  As shown in FIG. 2, the image forming station 5 includes image forming units 5Y, 5M, 5C, and 5K that form toner images of yellow (Y), magenta (M), cyan (C), and black (K). have.

  The image forming units 5Y, 5M, 5C, and 5K are in order from the upstream side to the periphery along the rotation direction of the photosensitive drums 10Y, 10M, 10C, and 10K, and the photosensitive drums 10Y, 10M, 10C, and 10K, respectively. Arranged charging chargers 11Y, 11M, 11C, 11K, optical writing devices 12Y, 12M, 12C, 12K, developing devices 13Y, 13M, 13C, 13K, transfer chargers 14Y, 14M, 14C, 14K and cleaning devices 15Y, 15M, 15C and 15K.

  The above-described intermediate transfer belt 6 is inserted between the photosensitive drums 10Y, 10M, 10C, and 10K and the transfer chargers 14Y, 14M, 14C, and 14K. The intermediate transfer belt 6 is connected to the photosensitive drum 10Y. , 10M, 10C, and 10K are in contact with each other at that portion.

  In forming the toner image, first, the surfaces of the photosensitive drums 10Y, 10M, 10C, and 10K are charged by the charging chargers 11Y, 11M, 11C, and 11K, respectively.

  Next, exposure L (see FIG. 3) is irradiated onto the surfaces of the photosensitive drums 10Y, 10M, 10C, and 10K by the optical writing devices 12Y, 12M, 12C, and 12K, respectively, so that the photosensitive drums 10Y, 10M, 10C, and An electrostatic latent image is written on each 10K surface.

  Next, toners of colors corresponding to the surfaces of the photosensitive drums 10Y, 10M, 10C, and 10K are respectively supplied by the developing devices 13Y, 13M, 13C, and 13K, so that the surfaces of the photosensitive drums 10Y, 10M, 10C, and 10K are supplied. A toner image corresponding to the electrostatic latent image is formed respectively.

  The toner images formed on the surfaces of the photosensitive drums 10Y, 10M, 10C, and 10K are then transferred to the intermediate transfer belt 6 by the transfer chargers 14Y, 14M, 14C, and 14K (so-called primary transfer).

  Thereafter, the toner remaining on the surfaces of the photosensitive drums 10Y, 10M, 10C, and 10K is removed by the cleaning devices 15Y, 15M, 15C, and 15K, respectively.

  As a result, the toner images of the respective colors are overwritten on the surface of the intermediate transfer belt 6 by the image forming units 5Y, 5M, 5C, and 5K, and a color toner image is formed. When only the image forming unit 5K is used, a monochrome toner image is formed on the surface of the intermediate transfer belt 6.

  The intermediate transfer belt 6 transfers a color toner image or a monochrome toner image formed on the surface thereof to the transfer unit 7, and a pair of paper in the transfer unit 7 together with the paper conveyed from the paper supply unit 2 </ b> B to the transfer unit 7. It is pressed by the transfer roller. As a result, the color toner image or monochrome toner image formed on the surface of the intermediate transfer belt 6 is transferred onto a sheet (so-called secondary transfer).

  The sheet on which the color toner image or the monochrome toner image is transferred is then pressed and heated by the fixing unit 8. As a result, a color image or a monochrome image is formed on the sheet, and the sheet on which the color image or the monochrome image is formed is then discharged from the apparatus main body 2.

(Configuration of optical writing device and schematic configuration of organic EL unit)
FIG. 3 is a schematic cross-sectional view of the optical writing device shown in FIG. FIG. 4 is a schematic bottom view of the optical writing device shown in FIG. With reference to FIG. 3 and FIG. 4, the structure of the optical writing device 12 and the schematic structure of the organic EL unit 20 provided therein will be described.

  Here, in the image forming apparatus 1 in the present embodiment described above, a configuration in which the optical writing devices 12Y, 12M, 12C, and 12K are provided in the image forming units 5Y, 5M, 5C, and 5K, respectively, is employed. However, the configuration of these optical writing devices 12Y, 12M, 12C, and 12K is basically the same. Therefore, in the following description, they will be referred to as the optical writing device 12 without distinction.

  The schematic bottom view of the optical writing device 12 shown in FIG. 4 is when the optical writing device 12 is viewed from the direction of the arrow IV shown in FIG. 3, but in FIG. 4, the understanding is easy. Therefore, illustration of a casing 18 described later in the optical writing device 12 is omitted.

  As shown in FIGS. 3 and 4, the optical writing device 12 mainly includes a casing 18, a rod lens array 19 as an optical system, an organic EL unit 20, and a control unit 30. As shown in FIG. 3, the rod lens array 19 and the organic EL unit 20 are both held by the casing 18. On the other hand, the control unit 30 is installed at a position away from the casing 18.

  The casing 18 of the optical writing device 12 is disposed so as to face the photosensitive drum 10. The rod lens array 19 is assembled to the portion of the casing 18 on the photosensitive drum 10 side, and the organic EL unit 20 is assembled to the portion of the casing 18 opposite to the photosensitive drum 10 side. Yes. The organic EL unit 20 is disposed so that the exit surface from which the exposure L is emitted faces the rod lens array 19 side. The inside of the casing 18 is configured such that light emitted from the organic EL unit 20 enters the rod lens array 19. The light incident on the rod lens array 19 is collected and emitted to the photosensitive drum 10.

  As shown in FIGS. 3 and 4, the organic EL unit 20 includes a transparent substrate 21, a plurality of organic EL elements formed on the transparent substrate 21, a driver IC 23 mounted on the transparent substrate 21, and a sealing member. 24 and a support member 25 are mainly provided.

  The transparent substrate 21 is made of, for example, a glass substrate. Note that the transparent substrate 21 is not limited to a glass substrate, and may be formed of a transparent resin film or the like. On the transparent substrate 21, a functional unit 22 mainly formed with a plurality of organic EL elements is provided.

  The organic EL panel is mainly configured by the transparent substrate 21 and the functional unit 22. The organic EL panel is a so-called active matrix type organic EL panel, and a TFT (Thin Film Transistor) circuit is further formed in the functional unit 22 described above.

  The functional unit 22 includes a plurality of light emitting units 22 a arranged in a matrix arranged in a direction parallel to the main surface of the transparent substrate 21. The light emitting units 22a are not necessarily arranged in a matrix, and may be arranged in a line in a direction parallel to the axial direction of the photosensitive drum 10.

  An organic EL element is composed of an organic layer including at least an organic light emitting layer, and an anode and a cathode disposed so as to sandwich the organic layer, and an organic light emission is performed by applying a current or a voltage between the anode and the cathode. The layer emits light.

  On the other hand, the TFT circuit is composed of a TFT and a wiring part connected to the TFT, and the wiring part is connected to the anode and the cathode of the organic EL element, so that the TFT circuit is selectively organic as the TFT is turned on / off. The EL element is driven, thereby switching between light emission / non-light emission of the plurality of light emitting units 22a described above.

  The transparent substrate 21 includes a first main surface 21a on which the above-described functional unit 22 is formed, and a second main surface 21b (see FIG. 6) facing the first main surface 21a. The IC 23 is mounted on the first main surface 21a among them. More specifically, a mounting pattern 21c for mounting the driver IC 23 is provided on a portion of the first main surface 21a of the transparent substrate 21 other than the portion where the functional unit 22 is provided. It is mounted on the mounting pattern 21c by so-called COG mounting.

  The driver IC 23 drives the organic light emitting layer included in the organic EL element by selectively applying a current or voltage to the organic EL element constituting the light emitting portion 22a via the TFT circuit described above. Therefore, the first main surface 21a of the transparent substrate 21 is further provided with a wiring 21d made of a conductive pattern for electrically connecting the mounting pattern 21c and the TFT circuit.

  The control unit 30 described above controls the operation of the driver IC 23, and is configured by, for example, an ASIC (Application Specific Integrated Circuit). The control unit 30 is mounted on a controller board 31 installed at a position away from the casing 18, and is electrically connected to the driver IC 23 via, for example, a flexible wiring board 32.

  The sealing member 24 seals a plurality of organic EL elements. Specifically, the sealing member 24 seals the functional unit 22 on the transparent substrate 21. The detailed configuration of the sealing member 24 will be described with reference to FIG.

  The support member 25 supports the sealing member 24 from the side opposite to the side where the transparent substrate 21 is located. A detailed configuration of the support member 25 will be described with reference to FIGS. 5 and 6.

  In the optical writing device 12 described above, the exposure L emitted from the plurality of light emitting portions 22a of the organic EL unit 20 is imaged on the surface of the photosensitive drum 10 by the rod lens array 19 and is charged thereby. The electrostatic latent image is written on the surface of the photosensitive drum 10 in the state of being damaged.

  Note that due to the difference in the positional relationship between the optical axis of the emitted light from the light emitting section 22a and the central axis of the lens section of the rod lens array 19 corresponding to this, and the manufacturing variation of the rod lens array, the lens section of each light emitting section 22a Imaging efficiency will be different. For this reason, in order to prevent unevenness in the light amount of the exposure L, it is preferable to perform initial adjustment when the optical writing device 12 is assembled. Here, in the initial adjustment, for example, by finely adjusting the light emission amounts of the plurality of light emitting units 22a, the plurality of light emitting units 22a are driven so that all the light amounts of the exposure L reaching the surface of the photosensitive drum 10 are all equal. It is envisaged to adjust the current or drive voltage.

(Detailed configuration of organic EL unit)
FIG. 5 is a schematic plan view showing the organic EL unit shown in FIG. FIG. 6 is a schematic cross-sectional view taken along the line VI-VI shown in FIG. A detailed configuration of the organic EL unit 20 according to the present embodiment will be described with reference to FIGS. 5 and 6.

  As shown in FIGS. 5 and 6, the organic EL unit 20 includes an adhesive portion 40 in addition to the transparent substrate 21, the plurality of organic EL elements, the sealing member 24, and the support member 25 described above.

  The sealing member 24 has a rectangular parallelepiped shape. The sealing member 24 is made of glass, for example. The sealing member 24 has a recess 24a. The recess 24 a is closed by the transparent substrate 21. The functional part 22 is covered with the sealing member 24 when the functional part 22 is positioned in the recess 24 a.

  The sealing member 24 and the transparent substrate 21 are bonded by an adhesive (not shown) provided around the recess 24a. Thereby, the inside of the recessed part 24a is maintained airtight, and the organic EL element which comprises the function part 22 is sealed with the sealing member 24. FIG.

  The sealing member 24 is disposed on the support member 25. In addition, between the support member 25 and the sealing member 24, heat dissipation grease may be provided for the purpose of improving heat dissipation, and an auxiliary member such as a spacer is provided to suppress creep deformation of the bonding portion 40. It may be.

  The sealing member 24 has an outer peripheral surface 24b. The outer peripheral surface 24b is substantially orthogonal to a support surface 25a of a support member 25 described later. Here, being substantially orthogonal means that the crossing angle between the outer peripheral surface 24b and the support surface 25a is in the range of 85 degrees to 95 degrees. That is, the case where the crossing angle between the outer peripheral surface 24b and the support surface 25a varies from 90 degrees due to manufacturing variation or the like is included.

  The support member 25 supports the sealing member 24. The support member 25 has a peripheral region R1 that protrudes outward from the sealing member 24 when viewed in a plan view. The peripheral region R <b> 1 is provided so as to surround the sealing member 24 when viewed in a plan view.

  The support member 25 has a support surface 25a that supports the sealing member 24 and a main surface 25b of a peripheral region R1 described later. The support surface 25a is located inside the peripheral region R1. The support surface 25 a is a surface on which the sealing member 24 is placed, and is a surface in contact with the sealing member 24.

  In addition, when the heat radiation grease or the auxiliary member is provided between the support member 25 and the sealing member 24 as described above, the support surface 25a is the main surface of the support member 25 located on the sealing member 24 side. Of these, the surface overlaps the sealing member 24 when viewed in plan.

  The main surface 25b of the peripheral region R1 is continuous with the support surface 25a. The main surface 25b of the peripheral region R1 is provided on the same plane as the support surface 25a and is parallel to the support surface 25a.

  A plurality of wall portions 26 and a plurality of heat radiation portions 27 are provided on the outer periphery of the support member 25. The plurality of wall portions 26 are erected from the outer peripheral edge portion in the peripheral region R1. The plurality of wall portions 26 are provided at intervals.

  The plurality of heat radiation portions 27 are suspended from the outer peripheral edge portion in the peripheral region R1. The plurality of heat radiating portions 27 are provided at intervals. The plurality of heat radiating portions 27 are provided alternately with the plurality of wall portions 26. The plurality of heat dissipating parts 27 are provided so as to be able to dissipate heat generated by the function part 22 and the driver IC 23.

  The support member 25, the plurality of wall portions 26, and the plurality of heat radiating portions 27 are constituted by, for example, a single sheet metal member. A plurality of wall portions 26 are formed by bending a part of both ends of the sheet metal member to one side, and a plurality of heat dissipation is performed by bending another part of both ends of the sheet metal member to the other side. A portion 27 is formed. Further, the support member 25 is formed so as to connect the plurality of wall portions 26 and the heat radiating portion 27 provided on the one end side and the other end side.

  The adhesion part 40 is comprised by the hardened photocurable resin. The bonding portion 40 bonds the sealing member 24 and the support member 25 together. A plurality of adhesive portions 40 are provided. The plurality of bonding portions 40 are provided apart from each other on the peripheral region R1. The plurality of bonding portions 40 are provided between the plurality of wall portions 26 and the outer peripheral surface 24 b of the sealing member 24.

  The bonding portion 40 includes a contact surface 40a that contacts the peripheral region R1 of the support member 25, a relative surface 40b that faces the contact surface 40a, and an outer side surface 40c that is located on the opposite side of the outer peripheral surface 24b of the sealing member 24. And have.

  The contact surface 40a is provided along the main surface 25b of the peripheral region R1. The relative surface 40b is inclined so as to move away from the contact surface 40a as it goes outward from the outer peripheral surface 24b of the sealing member 24.

  The outer side surface 40c is in contact with the inner surface 26a of the wall portion 26 from one end side positioned on the relative surface 40b side to the other end side positioned on the contact surface 40a side. Thus, when the outer side surface 40c contacts the inner surface 26a of the wall portion 26, the shape of the relative surface 40b and the shape of the bonding portion 40 can be stabilized. The wall portion 26 functions as a reinforcing portion that stabilizes the shape of the relative surface 40b.

  As described above, in the organic EL unit 20 according to the present embodiment, since the relative surface 40b of the bonding portion 40 is inclined, in the manufacturing process described later, along the direction parallel to the outer peripheral surface 24b. When the irradiation light is irradiated onto the photocurable resin that is the precursor of the bonding portion 40, the irradiation light can be refracted in the direction away from the sealing member 24 side by the relative surface 40b.

  Thereby, it can suppress that irradiation light injects into the sealing member 24, and can suppress that the irradiation light which propagated the sealing member 24 injects into the organic EL element provided on the transparent substrate 21. FIG. As a result, the organic EL unit 20 according to the present embodiment is an organic EL unit in which deterioration of the organic EL element due to irradiation light is suppressed.

(Manufacturing method of organic EL unit)
FIG. 7 is a flowchart showing a method for manufacturing the organic EL unit according to the first embodiment. FIG. 8 is a diagram illustrating a state after the step of applying the photocurable resin illustrated in FIG. 7. FIG. 9 is a diagram showing a process of shaping the shape of the photocurable resin shown in FIG. A method for manufacturing the organic EL unit 20 will be described with reference to FIGS.

  In manufacturing the organic EL unit 20, a plurality of organic EL elements are formed on the transparent substrate 21 in the step (S1) as shown in FIG. Specifically, an anode, an organic layer, and a cathode are formed on the first main surface 21a of the transparent substrate 21 by using a sputtering method, a photolithography method, or the like. Thereby, a plurality of organic EL elements are formed on the transparent substrate 21. The plurality of organic EL elements are formed so as to be connected to a TFT circuit provided on the transparent substrate. By forming the TFT circuit and the plurality of organic EL elements on the first main surface 21a of the transparent substrate 21, the functional unit 22 is formed.

  Next, in the step (S2), the plurality of organic EL elements are sealed with the sealing member 24. Specifically, the sealing member 24 is disposed on the first main surface 21 a of the transparent substrate 21 so as to cover the functional unit 22. At this time, the first main surface 21a of the transparent substrate 21 and the sealing member 24 are bonded with an adhesive.

  Subsequently, the sealing member 24 is supported by the support member 25 in the step (S3). Specifically, the sealing member 24 to which the transparent substrate 21 is bonded is placed on the support member 25. More specifically, the main surface of the sealing member 24 located on the side opposite to the side where the transparent substrate 21 is located is brought into contact with the support surface 25 a of the support member 25.

  Next, in the step (S4), the support member 25 and the sealing member 24 are bonded. Step (S4) includes steps (S41) to (S43).

  When the support member 25 and the sealing member are bonded, first, the photocurable resin 40R is applied to the peripheral region R1 of the support member 25 in a step (S41). The photocurable resin 40R includes a curable compound (monomer or oligomer) that is reactively cured by irradiation with active energy rays (for example, ultraviolet rays and visible light), and forms a cured resin layer by curing the curable compound. It is. As the photocurable resin 40R, for example, an acrylate resin or the like can be employed.

  In the step (S41), it is preferable to apply the photocurable resin 40R in a state where the light shielding plate is placed on the second main surface 21b of the transparent substrate 21. The light shielding plate is placed so as to overlap the functional unit 22 in the vertical direction. The light shielding plate may be placed on the second main surface 21b of the transparent substrate 21 after the photocurable resin 40R is applied.

  The photocurable resin 40R is applied to the peripheral region R1 so as to contact the outer peripheral surface 24b of the sealing member 24. The photocurable resin 40R is applied at intervals in the peripheral region R1. Specifically, the photocurable resin 40 </ b> R is applied to the gaps between the plurality of wall portions 26 and the sealing member 24.

  As shown in FIG. 8, in the state after the step of applying the photocurable resin, the photocurable resin 40R has a contact surface 40a that contacts the peripheral region R1, and a relative surface 40b that faces the contact surface 40a. . When the wettability of the photocurable resin 40R on the wall portion 26 and the wettability of the photocurable resin 40R on the outer peripheral surface 24b of the sealing member 24 are approximately the same, the relative surface 40b of the photocurable resin 40R is upward. It has a substantially arc shape that is convex toward the side.

  Next, in the step (S42), the shape of the photocurable resin 40R is shaped. Specifically, the distance between the contact surface 40a of the photocurable resin 40R that contacts the peripheral region R1 and the relative surface 40b of the photocurable resin 40R that faces the contact surface 40a is defined as the outer peripheral surface 24b of the sealing member 24. Increase from outside to outside.

  More specifically, as shown in FIG. 9, the organic EL unit 20 is inclined so that the wall portion 26 is directed downward on one end side of the support member 25. As a result, the photocurable resin 40R is deformed by its own weight, and the relative surface 40b is inclined so as to move away from the contact surface 40a as it goes outward from the outer peripheral surface 24b of the sealing member 24. At this time, the shape of the photocurable resin 40 </ b> R can be stably maintained by the wall portion 26. In addition, the wall portion 26 can prevent the photocurable resin 40R from flowing out. The wall portion 26 functions as a shaping member that shapes the shape of the photocurable resin 40R.

  Subsequently, in the step (S43), the photocurable resin is irradiated with light (irradiation light). In this case, for example, the photocurable resin 40R is irradiated with ultraviolet rays. Specifically, in a state where the above-described light shielding plate is placed on the second main surface 21 b of the transparent substrate 21, along the direction substantially parallel to the outer peripheral surface 24 b of the sealing member 24 on one end side of the support member 25. Then, the photocurable resin 40R is irradiated with light. The light curable resin 40 </ b> R irradiated with the light is cured to become the adhesive portion 40.

  As shown by the arrows in FIG. 9, the irradiated light (irradiated light) is inclined by the relative surface 40b inclined so that the distance from the contact surface 40a increases from the outer peripheral surface 24b of the sealing member 24 toward the outside. The irradiation light is refracted in a direction away from the sealing member 24 side.

  Thereby, it can suppress that irradiation light injects into the sealing member 24, and can suppress that the irradiation light which propagated the sealing member 24 injects into the organic EL element provided on the transparent substrate 21. FIG. As a result, deterioration of the organic EL element due to irradiation light is suppressed.

  Note that the portion of the photocurable resin 40R located on the sealing member 24 side is a radical generated by scattering of irradiation light on the main surface 25b of the peripheral region R1 and in response to irradiation light in the vicinity of the sealing member 24. It can be sufficiently cured by diffusion or the like.

  In addition, on the other end side of the support member 25, after repeating the steps (S42) and (S43) in the same manner as described above, and shaping the photocurable resin 40R applied to the other end side of the support member 25, Light is irradiated to the photocurable resin 40R. Thereby, the adhesion part 40 is formed.

  In this case as well, the same reason as described above is provided by providing the relative surface 40b that is inclined so that the distance from the contact surface 40a increases from the outer peripheral surface 24b of the sealing member 24 toward the outer side, similarly to the one end side. Therefore, it is possible to suppress the irradiation light from being incident on the sealing member 24, and it is possible to suppress the irradiation light having propagated through the sealing member 24 from being incident on the organic EL element provided on the transparent substrate 21. As a result, deterioration of the organic EL element due to irradiation light is suppressed.

  As described above, by using the method for manufacturing an organic EL unit according to Embodiment 1, it is possible to manufacture an organic EL unit in which deterioration of the organic EL element due to irradiation light is suppressed.

(Embodiment 2)
(Organic EL unit)
FIG. 10 is a schematic cross-sectional view of the organic EL unit according to the second embodiment. With reference to FIG. 10, the organic EL unit 20A according to the second embodiment will be described.

  As shown in FIG. 10, when compared with the organic EL unit 20 according to the first embodiment, the organic EL unit 20A according to the second embodiment is provided with a wall portion 26 and a heat radiating portion 27 on the support member 25. The difference is that a columnar member 50 is provided as a reinforcing portion. Other configurations are almost the same.

  The columnar member 50 is made of a metal member such as a wire, for example. The columnar member 50 extends along the direction perpendicular to the paper surface in FIG. That is, the columnar member 50 extends along the direction in which the plurality of bonding portions 40 are arranged.

  The columnar member 50 is provided apart from the support member 25. The columnar member 50 is in contact with the plurality of bonding portions 40. Specifically, the columnar member 50 is in contact with one end side of the outer side surface 40 c located on the relative surface 40 b side of the bonding portion 40. Thereby, the shape of the relative surface 40b and the shape of the adhesion part 40 can be stabilized.

  The relative surface 40b is inclined so as to move away from the contact surface 40a that contacts the peripheral region R1 as it goes outward from the outer peripheral surface 24b of the sealing member 24.

  Also in the organic EL unit 20A according to the second embodiment, the relative surface 40b is inclined as described above, and therefore, in the manufacturing process described later, along the direction parallel to the outer peripheral surface 24b, as in the first embodiment. When the irradiation light is irradiated onto the photocurable resin that is the precursor of the bonding portion 40, the irradiation light can be refracted in the direction away from the sealing member 24 side by the relative surface 40b.

  Thereby, it can suppress that irradiation light injects into the sealing member 24, and can suppress that the irradiation light which propagated the sealing member 24 injects into the organic EL element provided on the transparent substrate 21. FIG. As a result, the organic EL unit 20A according to the present embodiment is an organic EL unit in which deterioration of the organic EL element due to irradiation light is suppressed.

(Manufacturing method of organic EL unit)
FIG. 11 is a diagram illustrating a process of shaping a photocurable resin in the method of manufacturing an organic EL unit according to the second embodiment. FIG. 12 is a diagram illustrating a process of irradiating light to the photocurable resin in the method of manufacturing the organic EL unit according to the second embodiment. With reference to FIG. 11 and FIG. 12, the manufacturing method of the organic EL unit 20A according to the second embodiment will be described.

  The manufacturing method of the organic EL unit 20A according to the second embodiment is basically based on the manufacturing method of the organic EL unit 20 according to the first embodiment. The method of manufacturing the organic EL unit 20A according to the second embodiment includes the step of forming the shape of the photocurable resin and the photocurable resin when compared with the method of manufacturing the organic EL unit 20 according to the first embodiment. The process of irradiating light is different.

  In manufacturing the organic EL unit 20A according to the second embodiment, the same processes as those in the steps (S1) to (S3) according to the first embodiment described above are performed. Next, in a step according to the step (S41) according to the first embodiment, the photocurable resin 40R is applied to the peripheral region R1 of the support member 25. Specifically, the photocurable resin 40R is applied to the peripheral region R1 so as to contact the outer peripheral surface 24b of the sealing member 24. The photocurable resin 40R is applied at intervals in the peripheral region R1.

  Subsequently, in the step according to the step (S42) according to Embodiment 1, the shape of the photocurable resin 40R is shaped. Specifically, as shown in FIG. 11, the columnar member 50 is brought into contact with one end of the outer side surface 40 c located on the relative surface 40 b side of the bonding portion 40 and moved in a direction away from the support member 25.

  As a result, the photocurable resin 40R is deformed so as to follow the movement of the support member 25 due to the surface tension, and the relative surface 40b moves away from the contact surface 40a toward the outside from the outer peripheral surface 24b of the sealing member 24. Inclined to. At this time, the shape of the photocurable resin 40R can be stably maintained by maintaining the state in which the columnar member 50 is in contact with the relative surface 40b. The columnar member 50 functions as a shaping member that shapes the shape of the photocurable resin 40R.

  Next, in a step according to the step (S43) according to the first embodiment, as shown in FIG. 12, the photocurable resin is irradiated with light (irradiation light). Specifically, the sealing member 24 in a state where the light shielding plate is placed on the second main surface 21b of the transparent substrate 21 and the columnar member 50 is in contact with the outer side surface 40c of the photocurable resin 40R. The photocurable resin 40R is irradiated with light along a direction substantially parallel to the outer peripheral surface 24b.

  As shown by the arrows in FIG. 12, the irradiated light (irradiated light) is inclined by the relative surface 40b that is inclined so that the distance from the contact surface 40a increases toward the outside from the outer peripheral surface 24b of the sealing member 24. The irradiation light is refracted in a direction away from the sealing member 24 side.

  Thereby, it can suppress that irradiation light injects into the sealing member 24, and can suppress that the irradiation light which propagated the sealing member 24 injects into the organic EL element provided on the transparent substrate 21. FIG. As a result, deterioration of the organic EL element due to irradiation light is suppressed.

  Thus, by using the method for manufacturing an organic EL unit according to Embodiment 2, it is possible to manufacture an organic EL unit 20A in which deterioration of the organic EL element due to irradiation light is suppressed.

(Embodiment 3)
(Organic EL unit)
FIG. 13 is a schematic cross-sectional view of an organic EL unit according to the third embodiment. With reference to FIG. 13, the organic EL unit 20B according to Embodiment 3 will be described.

  As shown in FIG. 13, the organic EL unit 20 </ b> B according to the third embodiment is provided with a wall portion 26 and a heat radiating portion 27 on the support member 25 when compared with the organic EL unit 20 according to the first embodiment. The difference is that a film member 60 is provided as a reinforcing portion. Other configurations are almost the same.

  The film member 60 has translucency. The film member 60 is made of, for example, a resin film. The film member 60 includes a first plate portion 61 and a second plate portion 62.

  The first plate portion 61 extends along the outer peripheral surface 24b of the sealing member 24 and contacts the outer peripheral surface 24b. The second plate portion 62 extends along the relative surface 40b of the bonding portion 40 and contacts the relative surface 40b. By providing the second plate portion 62, it is possible to stabilize the shape of the relative surface 40b and thus the shape of the bonding portion 40.

  Also in the organic EL unit 20B according to the third embodiment, since the relative surface 40b is inclined as described above, in the manufacturing process described later, along the direction parallel to the outer peripheral surface 24b, as in the first embodiment. When the irradiation light is irradiated onto the photocurable resin that is the precursor of the bonding portion 40, the irradiation light can be refracted in the direction away from the sealing member 24 side by the relative surface 40b.

  Thereby, it can suppress that irradiation light injects into the sealing member 24, and can suppress that the irradiation light which propagated the sealing member 24 injects into the organic EL element provided on the transparent substrate 21. FIG. As a result, the organic EL unit 20B according to the present embodiment is an organic EL unit in which deterioration of the organic EL element due to irradiation light is suppressed.

(Manufacturing method of organic EL unit)
FIG. 14 is a diagram illustrating a process of shaping a photocurable resin in the method of manufacturing an organic EL unit according to Embodiment 3. FIG. 15 is a diagram illustrating a process of irradiating light to the photocurable resin in the method of manufacturing the organic EL unit according to the third embodiment. With reference to FIG. 14 and FIG. 15, the manufacturing method of the organic EL unit 20B which concerns on Embodiment 3 is demonstrated.

  The manufacturing method of the organic EL unit 20B according to the third embodiment basically conforms to the manufacturing method of the organic EL unit 20 according to the first embodiment. The method of manufacturing the organic EL unit 20B according to the third embodiment includes a step of forming a shape of the photocurable resin and the photocurable resin when compared with the method of manufacturing the organic EL unit 20 according to the first embodiment. The process of irradiating light is different.

  In manufacturing the organic EL unit 20B according to the third embodiment, the same processes as those in the steps (S1) to (S3) according to the first embodiment described above are performed. Next, in a step according to the step (S41) according to the first embodiment, the photocurable resin 40R is applied to the peripheral region R1 of the support member 25. Specifically, the photocurable resin 40R is applied to the peripheral region R1 so as to contact the outer peripheral surface 24b of the sealing member 24. The photocurable resin 40R is applied at intervals in the peripheral region R1.

  Subsequently, in the step according to the step (S42) according to Embodiment 1, the shape of the photocurable resin 40R is shaped. Specifically, as shown in FIG. 14, a film member 60 having a substantially L shape in cross section is brought into contact with the photocurable resin 40R. The second plate portion 62 of the film member 60 extends substantially parallel to the main surface 25b of the peripheral region R1.

  While the first plate portion 61 of the film member 60 is in contact with the outer peripheral surface 24b of the sealing member 24, the second plate portion 62 is brought into contact with the relative surface 40b of the photocurable resin 40R. Thereby, the relative surface 40b of the photocurable resin 40R is made to follow the second plate portion 62.

  Subsequently, the second plate portion 62 is folded back in the direction of the arrow in FIG. 14 with the boundary portion between the first plate portion 61 and the second plate portion 62 as an axis. For example, the second plate portion 62 is folded back at an angle of about 15 degrees.

  As a result, the photocurable resin 40R is deformed so as to follow the movement of the second plate portion 62, and the relative surface 40b is inclined so as to move away from the contact surface 40a toward the outside from the outer peripheral surface 24b of the sealing member 24. To do. At this time, the shape of the photocurable resin 40R can be stably maintained by maintaining the state where the second plate portion 62 is in contact with the relative surface 40b. The film member 60 functions as a shaping member that shapes the shape of the photocurable resin 40R.

  Next, in a step according to the step (S43) according to the first embodiment, as shown in FIG. 15, the photocurable resin is irradiated with light (irradiation light). Specifically, the sealing is performed in a state where the light shielding plate is placed on the second main surface 21b of the transparent substrate 21 and the second plate portion 62 is in contact with the relative surface 40b of the photocurable resin 40R. Light is irradiated to the photocurable resin 40R along a direction substantially parallel to the outer peripheral surface 24b of the member 24.

  As shown by the arrows in FIG. 15, the irradiated light (irradiated light) passes through the second plate portion 62 and enters the photocurable resin 40 </ b> R from the outer peripheral surface 24 b of the sealing member 24. The radiated light is refracted in a direction away from the sealing member 24 side by the relative surface 40b that is inclined so that the distance from the contact surface 40a increases as the distance from the sealing member 24 increases.

  Thereby, it can suppress that irradiation light injects into the sealing member 24, and can suppress that the irradiation light which propagated the sealing member 24 injects into the organic EL element provided on the transparent substrate 21. FIG. As a result, deterioration of the organic EL element due to irradiation light is suppressed.

  Thus, by using the method for manufacturing an organic EL unit according to Embodiment 3, it is possible to manufacture an organic EL unit 20B in which deterioration of the organic EL element due to irradiation light is suppressed.

(Embodiment 4)
(Organic EL unit)
FIG. 16 is a schematic cross-sectional view showing an organic EL unit according to the fourth embodiment. With reference to FIG. 16, the organic EL unit 20C according to the fourth embodiment will be described.

  As shown in FIG. 16, the organic EL unit 20 </ b> C according to the fourth embodiment is different in that the columnar member 50 is not provided when compared with the organic EL unit 20 </ b> A according to the second embodiment. Other configurations are almost the same.

  Also in the organic EL unit 20C according to the fourth embodiment, the relative surface 40b is inclined so as to move away from the contact surface 40a that contacts the peripheral region R1 as it goes outward from the outer peripheral surface 24b of the sealing member 24.

  Thereby, also in Embodiment 4, similarly to Embodiment 1, irradiation light is irradiated to the photocurable resin which is a precursor of the adhesion part 40 along the direction parallel to the outer peripheral surface 24b in the manufacturing process described later. In this case, the irradiation light can be refracted in the direction away from the sealing member 24 side by the relative surface 40b.

  For this reason, it can suppress that irradiation light injects into the sealing member 24, and can suppress that the irradiation light which propagated the sealing member 24 injects into the organic EL element provided on the transparent substrate 21. FIG. As a result, the organic EL unit 20A according to the present embodiment is an organic EL unit in which deterioration of the organic EL element due to irradiation light is suppressed.

  Further, since the columnar member 50 is omitted, the organic EL unit 20C can be reduced in weight and size.

(Manufacturing method of organic EL unit)
A method for manufacturing the organic EL unit 20C according to Embodiment 4 will be described. The manufacturing method of the organic EL unit 20C according to the fifth embodiment is basically the same as the manufacturing method of the organic EL unit 20A according to the second embodiment.

  When the manufacturing method of the organic EL unit 20C according to the fourth embodiment is compared with the manufacturing method of the organic EL unit 20A according to the second embodiment, after the step of bonding the support member 25 and the sealing member 24, The difference is that the method further includes a step of separating the columnar member 50 as the shaping member from the photocurable resin cured by irradiating the photocurable resin with light.

  Even when the manufacturing method of the organic EL unit according to the fourth embodiment is used, substantially the same effect as that of the manufacturing method of the organic EL unit 20A according to the second embodiment is obtained.

  Moreover, the manufacturing cost of the organic EL unit 20E can be reduced by reusing the columnar member 50 separated from the cured photocurable resin.

(Embodiment 5)
(Organic EL unit)
FIG. 17 is a schematic cross-sectional view showing the organic EL unit according to the fifth embodiment. With reference to FIG. 17, an organic EL unit 20D according to the fifth embodiment will be described.

  As shown in FIG. 17, when compared with the organic EL unit 20A according to the second embodiment, the organic EL unit 20D according to the fifth embodiment has the shape of the peripheral region R1 of the support member 25 and the shape of the bonding portion 40. Is different. Other configurations are almost the same.

  The peripheral region R1 of the support member 25 is inclined so as to move away from the transparent substrate 21 toward the outside.

  The contact surface 40a of the bonding portion 40 is inclined along the main surface 25b of the peripheral region R1. The relative surface 40 b of the bonding portion 40 is substantially orthogonal to the outer peripheral surface 24 b of the sealing member 24. Here, being substantially orthogonal means that the crossing angle between the outer peripheral surface 24b and the relative surface 40b is in the range of 85 degrees to 95 degrees. That is, it includes the case where the crossing angle between the outer peripheral surface 24b and the relative surface 40b varies from 90 degrees due to manufacturing variations and the like.

  As described above, in the organic EL unit 20D according to the present embodiment, the peripheral region R1 is inclined as described above, and the relative surface 40b of the bonding portion 40 is substantially orthogonal to the outer peripheral surface 24b of the sealing member 24. doing. Thereby, in the manufacturing process to be described later, when the photocurable resin that is the precursor of the bonding portion 40 is irradiated with the irradiation light along the direction parallel to the outer peripheral surface 24b, the light incident on the photocurable resin is It can be reflected toward the direction away from the sealing member 24 by the main surface 25b of the region R1.

  For this reason, it can suppress that irradiation light injects into the sealing member 24, and can suppress that the irradiation light which propagated the sealing member 24 injects into the organic EL element provided on the transparent substrate 21. FIG. As a result, the organic EL unit 20D according to the present embodiment is an organic EL unit in which deterioration of the organic EL element due to irradiation light is suppressed.

  FIG. 18 is a diagram illustrating a process of shaping a photocurable resin in the method of manufacturing an organic EL unit according to the fifth embodiment. FIG. 19 is a diagram illustrating a process of irradiating light to the photocurable resin in the method of manufacturing the organic EL unit according to the fifth embodiment. With reference to FIG. 18 and FIG. 19, the manufacturing method of organic EL unit 20D which concerns on Embodiment 5 is demonstrated.

  The manufacturing method of the organic EL unit 20D according to the fifth embodiment is basically the same as the manufacturing method of the organic EL unit 20 according to the first embodiment. The method for manufacturing the organic EL unit 20D according to the fifth embodiment includes the step of forming the shape of the photocurable resin and the photocurable resin when compared with the method for manufacturing the organic EL unit 20 according to the first embodiment. The process of irradiating light is different.

  In manufacturing the organic EL unit 20D according to the fifth embodiment, the same processes as those in the steps (S1) to (S3) according to the first embodiment described above are performed. In this case, as the support member 25, a member in which the peripheral region R1 is inclined so as to move away from the transparent substrate 21 toward the outside is used.

  Next, in a step according to the step (S41) according to the first embodiment, the photocurable resin 40R is applied to the peripheral region R1 of the support member 25. Specifically, the photocurable resin 40R is applied to the peripheral region R1 so as to contact the outer peripheral surface 24b of the sealing member 24. The photocurable resin 40R is applied at intervals in the peripheral region R1. At this time, since the peripheral region R1 is inclined as described above, the relative surface 40b of the photocurable resin 40R is also inclined according to the inclination of the peripheral region R1.

  Subsequently, in the step according to the step (S42) according to Embodiment 1, the shape of the photocurable resin 40R is shaped. Specifically, as shown in FIG. 18, the columnar member 50 is brought into contact with one end side of the outer side surface 40 c located on the relative surface 40 b side of the bonding portion 40 and moved in a direction away from the support member 25.

  Thereby, the photocurable resin 40R is deformed so as to follow the movement of the support member 25 due to the surface tension, and the relative surface 40b is substantially orthogonal to the outer peripheral surface 24b of the sealing member 24. Since the contact surface 40a of the photocurable resin 40R is inclined along the inclination of the peripheral region R1, the distance between the contact surface 40a and the relative surface 40b increases from the outer peripheral surface 24b of the sealing member 24 toward the outside. growing.

  By maintaining the state in which the columnar member 50 is in contact with the outer side surface 40c, the shape of the photocurable resin 40R can be stably maintained. The columnar member 50 functions as a shaping member that shapes the shape of the photocurable resin 40R.

  Next, in a step according to the step (S43) according to Embodiment 1, as shown in FIG. 19, light (irradiation light) is irradiated to the photocurable resin. Specifically, the sealing member 24 in a state where the light shielding plate is placed on the second main surface 21b of the transparent substrate 21 and the columnar member 50 is in contact with the outer side surface 40c of the photocurable resin 40R. The photocurable resin 40R is irradiated with light along a direction substantially parallel to the outer peripheral surface 24b.

  As shown by the arrows in FIG. 19, the irradiated light (irradiated light) is reflected in a direction away from the sealing member 24 by the main surface 25b of the peripheral region R1 that is inclined away from the transparent substrate 21 toward the outside. To do.

  Thereby, it can suppress that irradiation light injects into the sealing member 24, and can suppress that the irradiation light which propagated the sealing member 24 injects into the organic EL element provided on the transparent substrate 21. FIG. As a result, deterioration of the organic EL element due to irradiation light is suppressed.

  Thus, by using the method for manufacturing an organic EL unit according to Embodiment 5, it is possible to manufacture an organic EL unit 20D in which deterioration of the organic EL element due to irradiation light is suppressed.

(Embodiment 6)
(Organic EL unit)
FIG. 20 is a schematic cross-sectional view showing an organic EL unit according to the sixth embodiment. With reference to FIG. 20, an organic EL unit 20E according to Embodiment 6 will be described.

  As shown in FIG. 20, the organic EL unit 20E according to the sixth embodiment is different from the organic EL unit 20D according to the fifth embodiment in that the columnar member 50 is not provided. Other configurations are almost the same.

  Also in the organic EL unit 20E according to Embodiment 6, the relative surface 40b is inclined so as to move away from the contact surface 40a that contacts the peripheral region R1 as it goes outward from the outer peripheral surface 24b of the sealing member 24.

  Thereby, also in Embodiment 6, similarly to Embodiment 5, irradiation light is irradiated to the photocurable resin which is the precursor of the adhesion part 40 along the direction parallel to the outer peripheral surface 24b in the manufacturing process described later. In this case, the irradiation light can be refracted in the direction away from the sealing member 24 side by the relative surface 40b.

  For this reason, it can suppress that irradiation light injects into the sealing member 24, and can suppress that the irradiation light which propagated the sealing member 24 injects into the organic EL element provided on the transparent substrate 21. FIG. As a result, the organic EL unit 20E according to the present embodiment is an organic EL unit in which deterioration of the organic EL element due to irradiation light is suppressed.

  Further, since the columnar member 50 is omitted, the organic EL unit 20E can be reduced in weight and size.

(Manufacturing method of organic EL unit)
A method for manufacturing the organic EL unit 20C according to Embodiment 6 will be described. The manufacturing method of the organic EL unit 20E according to Embodiment 6 is basically the same as the manufacturing method of the organic EL unit 20D according to Embodiment 5.

  When the manufacturing method of the organic EL unit 20E according to the sixth embodiment is compared with the manufacturing method of the organic EL unit 20D according to the fifth embodiment, after the step of bonding the support member 25 and the sealing member 24, The difference is that the method further includes a step of separating the columnar member 50 as the shaping member from the photocurable resin cured by irradiating the photocurable resin with light.

  Even when such a method for manufacturing an organic EL unit according to the sixth embodiment is used, substantially the same effect as that of the method for manufacturing the organic EL unit 20D according to the fifth embodiment can be obtained.

  Moreover, the manufacturing cost of the organic EL unit 20E can be reduced by reusing the columnar member 50 separated from the cured photocurable resin.

(Modification 1)
In Embodiment 1 mentioned above, the reflection suppression part may be provided in the inner surface 26a of the wall part 26 which contacts the adhesion part 40. FIG. Similarly, in Embodiment 2 and 5 mentioned above, the reflection suppression part may be provided in the surface of the columnar member 50 which contacts the adhesion part 40. FIG.

  In the step of irradiating light to the photocurable resin at the time of manufacture, a part of the light incident on the photocurable resin 40R is reflected by the main surface 25b of the peripheral region R1 of the support member 25, and the wall portion 26. Or the columnar member 50 is reached.

  The reflection suppressing portion suppresses the light that has reached the wall portion 26 or the columnar member 50 from being reflected toward the sealing member 24.

  The reflection suppressing portion is formed, for example, by applying black coating, galvanizing, or applying an antireflection material to the inner surface 26a of the wall portion 26 or the surface of the columnar member 50.

(Modification 2)
In Embodiment 1 mentioned above, the wettability improvement part which improves the wettability of photocurable resin may be provided in the inner surface 26a of the wall part 26 which contacts the adhesion part 40. FIG. Similarly, in Embodiments 2 and 5, a wettability improving unit that improves the wettability of the photocurable resin may be provided. In the third embodiment, a wettability improving portion that improves the wettability of the curable resin may be provided on the surface of the second plate portion 62 that contacts the adhesive portion 40.

  By providing the wettability improving portion, it becomes easy to attract the photocurable resin to the wall portion 26 side, the columnar member 50, or the second plate portion 62 side in the step of shaping the shape of the photocurable resin at the time of manufacture. .

  For example, in the first embodiment, the photocurable resin is attracted to the wall portion 26 side, so that the shape of the photocurable resin can be shaped without tilting the organic EL unit. In this case, it is possible to prevent the positional deviation of each component member that may occur by tilting the organic unit. As a result, highly accurate assembly can be performed.

  In the second and fifth embodiments, the photocurable resin is easily deformed following the movement of the columnar member 50, and the photocurable resin can be easily shaped. Similarly, in the third embodiment, the photocurable resin is easily deformed following the movement of the second plate portion 62, and the photocurable resin can be easily shaped.

  The wettability improving portion is formed, for example, by applying a primer or performing plasma treatment on the inner surface 26a of the wall portion 26, the surface of the columnar member 50, or the surface of the second plate portion 62.

  Although the embodiments of the present invention have been described above, the embodiments disclosed herein are illustrative and non-restrictive in every respect. The scope of the present invention is defined by the terms of the claims, and includes meanings equivalent to the terms of the claims and all modifications within the scope.

  DESCRIPTION OF SYMBOLS 1 Image forming apparatus, 2 apparatus main body, 2A image forming part, 2B paper feeding part, 3 roller, 4 conveyance path, 5 image forming station, 5C, 5K, 5M, 5Y image forming unit, 6 intermediate transfer belt, 7 transfer part , 8 fixing unit, 9 paper feeding unit, 9a manual feed tray, 10, 10C, 10K, 10M, 10Y photosensitive drum, 11C, 11K, 11M, 11Y charging charger, 12, 12C, 12K, 12M, 12Y optical writing device, 13C, 13K, 13M, 13Y Developing device, 14C, 14K, 14M, 14Y Transfer charger, 15C, 15K, 15M, 15Y Cleaning device, 18 Casing, 19 Rod lens array, 20, 20A, 20B, 20C, 20D, 20E Organic EL unit, 21 transparent substrate, 21a first main surface, 21 2nd main surface, 21c Mounting pattern, 21d Wiring, 22 Functional part, 22a Light emitting part, 24 Sealing member, 24a Recessed part, 24b Outer peripheral surface, 25 Support member, 25a Support surface, 25b Main surface, 26 Wall part, 26a Inner surface, 27 Heat radiation portion, 30 Control portion, 31 Controller substrate, 32 Flexible wiring substrate, 40 Adhesion portion, 40R Photo-curing resin, 40a Contact surface, 40b Relative surface, 40c Outer side surface, 50 Columnar member, 60 Film member, 61 1st plate part, 62 2nd plate part.

Claims (16)

A transparent substrate;
A plurality of organic EL elements provided on the transparent substrate;
A sealing member for sealing the plurality of organic EL elements;
A support member that supports the sealing member from the side opposite to the side on which the transparent substrate is located;
Adhering the support member and the sealing member, and comprising an adhesive portion made of a cured photocurable resin,
The support member has a peripheral region protruding outward from the sealing member when seen in a plan view,
The bonding portion is provided on the peripheral region, bonds a part of the outer peripheral surface of the sealing member and the support member, and contacts a contact surface that contacts the peripheral region, and a relative surface that faces the contact surface. And
The organic EL unit, wherein the relative surface is inclined so as to move away from the contact surface as it goes outward from the outer peripheral surface. A transparent substrate;
A plurality of organic EL elements provided on the transparent substrate;
A sealing member for sealing the plurality of organic EL elements;
A support member that supports the sealing member from the side opposite to the side on which the transparent substrate is located;
Adhering the support member and the sealing member, and comprising an adhesive portion made of a cured photocurable resin,
The support member has a peripheral region protruding outward from the sealing member when seen in a plan view,
The bonding portion is provided on the peripheral region, and bonds a part of the outer peripheral surface of the sealing member and the support member;
The organic EL unit, wherein the peripheral region is inclined so as to move away from the transparent substrate toward the outside. The support member has a support surface that supports the sealing member inside the peripheral region,
The adhesive portion has a contact surface that contacts the peripheral region, and a relative surface that faces the contact surface,
The outer peripheral surface of the sealing member is substantially orthogonal to the support surface,
The organic EL unit according to claim 2, wherein the relative surface of the adhesive portion is substantially orthogonal to the outer peripheral surface of the sealing member.   The organic EL unit according to claim 1, further comprising a reinforcing portion that stabilizes the shape of the relative surface. The adhesive portion has an outer side surface on the side opposite to the outer peripheral surface side of the sealing member,
The organic EL unit according to claim 4, wherein the reinforcing portion is provided apart from the support member and is in contact with one end side of the outer side surface located on the relative surface side. The adhesive portion has an outer side surface on the side opposite to the outer peripheral surface side of the sealing member,
The reinforcing portion is constituted by a wall portion erected from an outer peripheral edge portion in the peripheral edge region,
The organic EL unit according to claim 4, wherein an inner surface of the wall portion is in contact with the other end side of the outer side surface located on the contact surface side from one end side of the outer side surface located on the relative surface side. . The reinforcing portion has a contact portion that contacts the outer side surface of the adhesive portion,
The organic EL unit according to claim 5 or 6, wherein a reflection suppressing portion is provided in the contact portion. The reinforcing portion includes a plate portion that extends along the relative surface and contacts the relative surface,
The organic EL unit according to claim 4, wherein the plate portion has translucency.   The said reinforcement part has a wettability improvement part which improves the wettability of the said photocurable resin which comprises the said adhesive part in the part which contacts the said adhesive part, The any one of Claim 4 to 8 Organic EL unit.   The organic EL unit according to claim 1, wherein the photocurable resin is an ultraviolet curable resin that is cured by ultraviolet rays. An optical writing device that writes an electrostatic latent image by irradiating light on the surface of a charged photoreceptor,
The organic EL unit according to any one of claims 1 to 10,
And an optical system that forms an image of light emitted from the organic EL unit.   An image forming apparatus comprising the optical writing device according to claim 11 for image formation. Forming a plurality of organic EL elements on a transparent substrate;
Sealing the plurality of organic EL elements with a sealing member;
Supporting the sealing member with a support member from the side opposite to the side where the transparent substrate is located;
Adhering the support member and the sealing member using a photocurable resin,
The support member has a peripheral region protruding outward from the sealing member when viewed in plan, and has a support surface that is provided inside the peripheral region and supports the sealing member,
The outer peripheral surface of the sealing member is substantially orthogonal to the support surface,
The step of bonding the support member and the sealing member includes a step of applying a photocurable resin to the peripheral region, a step of shaping the shape of the photocurable resin using a shaping member, and the shaping. Irradiating the photocurable resin with light along a direction substantially parallel to the outer peripheral surface of the sealing member in a state where the shape of the photocurable resin is shaped by a member, and
In the step of shaping the shape of the photocurable resin, the distance between the contact surface of the photocurable resin that contacts the peripheral region and the relative surface of the photocurable resin that faces the contact surface is determined by the sealing. The manufacturing method of an organic EL unit which enlarges as it goes outside from the said outer peripheral surface of a member. The support member has a support surface that supports the sealing member inside the peripheral region, and the support surface and a main surface of the peripheral region that is continuous with the support surface are used in parallel.
The method of manufacturing an organic EL unit according to claim 13, wherein in the step of shaping the shape of the photocurable resin, the relative surface is inclined so as to move away from the contact surface as it goes outward from the outer peripheral surface. As the support member, the peripheral region is inclined so as to move away from the transparent substrate toward the outside,
The method of manufacturing an organic EL unit according to claim 13, wherein in the step of shaping the shape of the photocurable resin, the relative surface is substantially orthogonal to the outer peripheral surface.   16. The method according to claim 13, further comprising a step of separating the shaping member from the photocurable resin cured by irradiating light after the step of bonding the support member and the sealing member. The manufacturing method of the organic electroluminescent unit as described in an item.

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