JP2017100167A - Laser processing device, component manufacturing method, program and recording medium - Google Patents

Abstract

PROBLEM TO BE SOLVED: To quickly operate a processing plan when processing a plurality of workpieces simultaneously.SOLUTION: With regard to a plurality of processing points formed for each workpiece, a line segment connecting a processing point sequence is obtained (S100 and S101). An area including the plurality of the processing points formed for each workpiece is divided into a plurality of section ranges according to the size of a processing range (S102). The plurality of the section ranges divided in S102 are shifted to a plurality of shift positions, and an evaluation value is calculated for each shift position based on a position of the line segment (S103 and S104). The shift positions of the plurality of the section ranges are determined based on the evaluation value (S105). The processing points for processing are set in each section range shifted to the determined shift position. The processing range of each laser processing part is relatively moved with respect to each holding part by a moving mechanism, and each laser processing part performs processing in the section range with a laser beam.SELECTED DRAWING: Figure 11

Description

  The present invention relates to a laser processing apparatus that performs laser processing, a component manufacturing method, a program, and a recording medium.

  In the laser processing field, there is known a method of processing a whole surface of one workpiece by processing a minute range with a laser processing unit (for example, a galvano scanner) and combining this with a scanning movement of a moving mechanism (for example, a stage). .

  In recent years, as a method for improving the productivity of parts, there has been proposed a processing method for processing one workpiece using two galvano scanners (Patent Document 1). In Patent Document 1, a machining path in each machining area is determined so that a round path length of each machining area is minimized. Next, the machining tact time is minimized by a method of determining the starting point of the machining path in each machining area so that the total machining time of the machining areas to be simultaneously machined is minimized.

JP 2006-53951 A

  By the way, as another method for improving the productivity of parts, it is conceivable that a plurality of (for example, two) workpieces are simultaneously laser processed by a plurality of (for example, two) galvano scanners. In this case, in order to further improve the productivity of the parts, it is necessary to shorten the total machining time in the simultaneous machining.

  In the method of Patent Document 1, a total machining time is calculated so as to be minimized, and a machining plan is performed in consideration of the waiting time for simultaneous machining by two galvano scanners. However, it is not intended for machining multiple workpieces. Therefore, it is difficult to apply the method of Patent Document 1 as it is to a method of simultaneously processing a plurality of workpieces arranged at arbitrary positions and postures on each holding portion such as a workpiece chuck. Furthermore, it is necessary to calculate the machining plan at a high speed after the workpiece is transferred to when machining is started. To reduce the calculation time (that is, the waiting time of the laser machining apparatus) during that time, the calculation load is reduced. There was a need to do.

  Accordingly, an object of the present invention is to calculate a machining plan for simultaneously machining a plurality of workpieces at high speed.

  The laser processing apparatus of the present invention includes a plurality of holding units for holding a plurality of workpieces, a plurality of laser processing units for irradiating each of the plurality of workpieces with a laser beam and processing the respective processing ranges, A moving mechanism that relatively moves the plurality of holding units and the plurality of laser processing units; and a control unit that controls the plurality of laser processing units and the moving mechanism to simultaneously process the plurality of workpieces. The control unit includes a line segment calculation process for obtaining a line segment connecting machining point sequences for a plurality of machining points to be formed on each workpiece, and a region including the plurality of machining points to be formed on each workpiece. A partition process that divides into a plurality of partition ranges by the size of the processing range, and the plurality of partition ranges partitioned by the partition process are shifted to a plurality of shift positions, and the position of the line segment is relative to each shift position. An evaluation value calculation process for calculating an evaluation value based on the evaluation value, a determination process for determining a shift position of the plurality of partition ranges based on the evaluation value, and a shift position determined in the determination process within each partition range A setting process for setting a machining point to be machined, and the movement mechanism moves the machining range of each laser machining part relative to each holding part, and each laser machining part is irradiated with a laser beam. And processing for processing the section area.

  ADVANTAGE OF THE INVENTION According to this invention, the process plan at the time of processing a some workpiece | work simultaneously can be calculated at high speed.

It is a perspective view which shows the structure of the laser processing apparatus which concerns on 1st Embodiment. It is sectional drawing of the laser processing apparatus which concerns on 1st Embodiment. It is a top view of the laser processing apparatus concerning a 1st embodiment. (A) is a top view of the workpiece | work used as the process target by the laser processing apparatus which concerns on 1st Embodiment, (b) is a side view of a workpiece | work, (c) is a bottom view of a workpiece | work. It is a block diagram which shows the control apparatus of the laser processing apparatus which concerns on 1st Embodiment. It is a functional block diagram of the control system of the laser processing apparatus which concerns on 1st Embodiment. It is a flowchart which shows the laser processing method which is a part of manufacturing method of the components which concern on 1st Embodiment. It is explanatory drawing of a CAM file coordinate system. It is explanatory drawing of a work chuck coordinate system. (A) is explanatory drawing of notch measurement, (b) is explanatory drawing of alignment mark measurement. It is explanatory drawing of a process point cut-out calculation. (A) is explanatory drawing which shows the state which converted the process point sequence into the line segment in the CAM file coordinate system. (B) is explanatory drawing which shows the state which converted the process point sequence into the line segment in the workpiece chuck coordinate system. (C) is explanatory drawing which shows the state divided into the some division range in the workpiece chuck coordinate system. (D) is explanatory drawing which expanded the division range of (c). It is explanatory drawing which shows the state divided into the some division range. It is a time chart which shows an example when processing two workpiece | work simultaneously. It is explanatory drawing of the coordinate conversion process and setting process in process point cut-out calculation. (A) is an enlarged view of one division range. (B) is a diagram showing a list of area structures.

  Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings. FIG. 1 is a perspective view showing a configuration of a laser processing apparatus according to the embodiment. FIG. 2 is a cross-sectional view of the laser processing apparatus according to the embodiment. FIG. 3 is a plan view of the laser processing apparatus according to the embodiment. FIG. 4 is an explanatory diagram illustrating a workpiece to be processed by the laser processing apparatus according to the embodiment. Specifically, FIG. 4A is a plan view of the workpiece, FIG. 4B is a side view of the workpiece, and FIG. 4C is a bottom view of the workpiece.

  As shown in FIGS. 1 and 3, the laser processing apparatus 1000 controls the processing machine 100 covered with the apparatus cover 181, the transport machine 200 covered with the apparatus cover 220, the processing machine 100, and the transport machine 200. And a control device 500.

  1 and 2, a processing machine 100 processes a plurality of workpieces (two workpieces in this embodiment) simultaneously. Here, two directions that are horizontal with respect to the surface on which the workpiece is conveyed (surfaces of workpiece chucks 115L and 116R, which will be described later) and intersect (orthogonal) with each other are defined as the X-axis direction and the Y-axis direction. Is the Z-axis direction.

  The processing machine 100 is supported on a surface plate 101. The surface plate 101, that is, the processing machine 100 is supported by a vibration isolation table 102 that does not transmit vibration. The vibration isolation table 102, that is, the processing machine 100 is supported by the gantry 103.

  The processing machine 100 includes a frame 104 and an XY stage 110 that are mounted on a surface plate 101. The XY stage 110 is a moving mechanism that simultaneously moves a plurality of workpieces in the XY axis direction. The XY stage 110 includes a Y axis stage guide 111, a Y axis stage slider 112, an X axis stage guide 113, and an X axis stage slider 114.

  The X-axis stage slider 114 is mounted on the X-axis stage guide 113 and can move in the X-axis direction. The X axis stage guide 113 is mounted on the Y axis stage slider 112. The Y-axis stage slider 112 is mounted on the Y-axis stage guide 111 and can move in the Y-axis direction.

  The surface plate 101 is mounted with a drive mechanism (not shown) (for example, a rotary motor, a shaft coupling, and a ball screw) that moves the Y-axis stage slider 112 in the Y-axis direction. Further, the surface plate 101 incorporates a scale (not shown) for measuring the position of the Y-axis stage slider 112 in the Y-axis direction.

  The Y-axis stage slider 112 is mounted with a drive mechanism (not shown) (for example, a rotary motor, a shaft joint, and a ball screw) that moves the X-axis stage slider 114 in the X-axis direction. Further, the Y-axis stage slider 112 incorporates a scale (not shown) that measures the position of the X-axis stage slider 114 in the X-axis direction.

  On the X-axis stage slider 114, a plurality of work chucks (holding portions), in this embodiment, two work chucks, that is, a work chuck 115L and a work chuck 116R are mounted. Each of the work chuck 115L and the work chuck 116R is provided with a number of suction holes (not shown), communicated by an internal groove (not shown), and the workpiece is vacuum suctioned by negative pressure air generated by a vacuum generator (not shown). It is possible to hold by.

  A cooling jacket (not shown) is attached to the back surface of each work chuck 115L, 116R. The cooling jacket has an internal groove (not shown), and the work chuck 115L and the work chuck 116R can be cooled by passing the cooling liquid fed from a cooling device (not shown) through the internal groove.

  A work lifter (not shown) is attached to the back surface of each work chuck 115L, 116R. The work lifter has a drive mechanism such as an air cylinder. A work lift pin (not shown) is mounted on the movable tip of the work lifter. The work chuck 115L, the work chuck 116R, and the cooling jacket (not shown) are each provided with a through hole (not shown). Therefore, it is possible to raise and lower the work lift pins with respect to the work chuck surfaces of the work chuck 115L and the work chuck 116R by the work lifter. Further, the work lift pin is provided with a suction hole, and the work can be fixed by vacuum suction with negative pressure air generated by a vacuum generator (not shown).

  Further, the processing machine 100 includes an imaging unit 167 that images the workpieces held by the workpiece chucks 115L and 116R. The imaging unit 167 includes precision measurement cameras 122L, 123R, 138L, and 139R, and wide-area measurement cameras 158L and 159R.

  As shown in FIG. 2, a precision measurement camera 122L to which a telecentric lens 120L is attached and a precision measurement camera 123R to which a telecentric lens 121R is attached are arranged below the XY stage 110, corresponding to each workpiece. ing. These two precision measurement cameras 122L and 123R are fixed to the surface plate 101. The Y-axis stage slider 112, the X-axis stage slider 114, the work chuck 115L, and the work chuck 116R are formed with a plurality of through holes 124 for measuring alignment marks. For this reason, it is possible to measure the alignment mark 303 of the workpiece 300 shown in FIGS. 4A and 4C using the precision measurement cameras 122L and 123R.

  As shown in FIGS. 1 and 2, two calibration marks 125 </ b> L and 126 </ b> R are fixed to the upper portion of the X-axis stage slider 114 corresponding to the two work chucks 115 </ b> L and 116 </ b> R. The Y-axis stage slider 112 and the X-axis stage slider 114 are formed with two through holes 127 for measuring calibration marks shown in FIG. Therefore, it is possible to measure the calibration mark 125L and the calibration mark 126R using the precision measurement camera 122L and the precision measurement camera 123R.

  In correspondence with the two work chucks 115L and 116R, two Z stages 130L and 131R, two wide-area measurement cameras 158L and 159R, and two displacement meters 160L and 161R are fixed to the upper part of the frame 104. ing. A wide-area measurement lens 156L is attached to the wide-area measurement camera 158L, and a wide-area measurement lens 157R is attached to the wide-area measurement camera 159R.

  The Z stage 130L includes a Z axis stage guide 132L and a Z axis stage slider 134L. The Z-axis stage slider 134L is mounted on the Z-axis stage guide 132L and can move in the Z-axis direction. Mounted on the Z-axis stage slider 134L are a galvano scanner 140L as a laser processing unit to which an fθ lens 142L is attached and a precision measurement camera 138L to which a telecentric lens 136L is attached. The Z stage 130L is mounted with a drive mechanism (not shown) (for example, a rotary motor, a shaft coupling, and a ball screw) for moving the Z axis stage slider 134L in the Z axis direction. Further, the Z stage 130L incorporates a scale (not shown) for measuring the position of the Z axis stage slider 134L in the Z axis direction.

  The Z stage 131R includes a Z axis stage guide 133R and a Z axis stage slider 135R. The Z-axis stage slider 135R is mounted on the Z-axis stage guide 133R and can move in the Z-axis direction. The Z-axis stage slider 135R is equipped with a galvano scanner 141R as a laser processing unit to which an fθ lens 143R is attached and a precision measurement camera 139R to which a telecentric lens 137R is attached. The Z stage 131R is mounted with a drive mechanism (not shown) (for example, a rotary motor, a shaft coupling, and a ball screw) for moving the Z axis stage slider 135R in the Z axis direction. Further, the Z stage 131R incorporates a scale (not shown) for measuring the position of the Z axis stage slider 135R in the Z axis direction.

  Further, the processing machine 100 includes a laser oscillator 144L that is a laser oscillation unit, a fiber 148L, a collimator 146L, and a folding mirror 150L. The laser oscillator 144L that oscillates the laser light is fixed to the device cover 181 (FIG. 3). The pre-condensing laser beam LBL1 emitted from the laser oscillator 144L is introduced into the galvano scanner 140L via the collimator 146L, the fiber 148L, and the folding mirror 150L. The galvano scanner 140L adjusts the angle by two not-shown mirrors with an encoder disposed inside, and emits laser light to the fθ lens 142L. The focal length of the focused laser beam LBL2 that has been focused through the fθ lens 142L is adjusted by the Z stage 130L so that the workpiece machining surface installed on the workpiece chuck 115L is in the focal position. At that time, by measuring the distance to the workpiece processing surface with the displacement meter 160L, it is possible to adjust the focal length corresponding to the thickness variation for each workpiece.

  The processable range of the galvano scanner 140L, that is, the range in which the laser beam can be scanned is rectangular. The range in which the galvano scanner 140L actually performs processing (processing range), that is, the range in which the laser beam is scanned is equal to or less than the processable range, and is rectangular in this embodiment. The galvano scanner 140L performs processing by irradiating laser light within this processing range.

  Further, the processing machine 100 includes a laser oscillator 145R that is a laser oscillation unit, a fiber 149R, a collimator 147R, and a folding mirror 151R. The laser oscillator 145R that oscillates the laser light is fixed to the device cover 181 (FIG. 3). The pre-condensing laser beam LBR1 emitted from the laser oscillator 145R is introduced into the galvano scanner 141R through the collimator 147R, the fiber 149R, and the folding mirror 151R. The galvano scanner 141R adjusts the angle by two mirrors with an encoder (not shown) arranged inside, and emits laser light to the fθ lens 143R. The focal length of the focused laser beam LBR2 that has been focused through the fθ lens 143R is adjusted by the Z stage 131R so that the workpiece processing surface installed on the workpiece chuck 116R becomes a focal position. At that time, by measuring the distance to the workpiece processing surface with the displacement meter 161R, it is possible to adjust the focal length corresponding to the thickness variation for each workpiece.

  The processable range of the galvano scanner 141R, that is, the range in which the laser beam can be scanned is rectangular. The range where the galvano scanner 141R actually performs processing (processing range), that is, the range where the laser beam is scanned is less than the processable range, and is rectangular in this embodiment. The galvano scanner 141R performs processing by irradiating laser light within this processing range. The processing range of the galvano scanner 140L and the processing range of the galvano scanner 141R are the same size.

  With the above configuration, the XY stage 110 can move the work chucks 115L and 116R and the galvano scanners 140L and 141R relatively by moving the work chucks 115L and 116R with respect to the galvano scanners 140L and 141R. That is, the XY stage 110 can move the processing ranges of the galvano scanners 140L and 141R relative to the work chucks 115L and 116R (that is, each work) at the same time in the same direction and by the same amount.

  The work chucks 115L and 116R are moved with respect to the galvano scanners 140L and 141R. However, the work chucks 115L and 116R and the galvano scanners 140L and 141R may be moved relatively. Therefore, the galvano scanners 140L and 141R may be moved with respect to the work chucks 115L and 116R by the moving mechanism, or both may be moved. Further, the case where the laser light oscillated by the two laser oscillators 144L and 145R is guided to the galvano scanners 140L and 141R has been described. However, the laser light oscillated by one laser oscillator is guided to the galvano scanners 140L and 141R. It may be configured.

  Further, the processing machine 100 includes a debris collection duct 170L and a debris collection duct 171R. The debris collection duct 170L and the debris collection duct 171R are fixed to the device cover 181 (FIG. 3). The debris collection duct 170L and the debris collection duct 171R are connected to a dust collector 180 (FIG. 3).

  The processing machine 100 performs point processing with the laser beams LBL2 and LBR2 on the workpieces conveyed onto the workpiece chucks 115L and 116R. In addition, by repeating coarse positioning of the workpieces on the workpiece chucks 115L and 116R by the XY stage 110 and fine positioning of the laser beams LBL2 and LBR2 by the galvano scanners 140L and 141R, high-precision point machining is performed on a large-diameter workpiece. It is possible. In this embodiment, the case where two workpieces are machined simultaneously has been described, but it is also possible to machine a single workpiece.

  A workpiece 300 that is an object to be processed by the laser processing apparatus 1000 shown in FIGS. 4A to 4C is a plate-shaped workpiece having a processed surface 301 and a non-processed surface 302. Here, the workpiece 300 conveyed to the workpiece chuck 115L is referred to as a workpiece 300L, and the workpiece 300 conveyed to the workpiece chuck 116R is referred to as a workpiece 300R. The workpiece 300L conveyed to the workpiece chuck 115L has the processing surface 301 facing the galvano scanner 140L and the non-processing surface 302 is fixed to the workpiece chuck 115L by suction. Further, the workpiece 300R conveyed to the workpiece chuck 116R has the processing surface 301 facing the galvano scanner 141R and the non-processing surface 302 is fixed to the workpiece chuck 116R by suction. The workpiece 300 includes an alignment mark 303 and a notch 304 formed in the workpiece outer edge 305. In this embodiment, the alignment mark 303 is a through hole, and two alignment marks are formed. Of the two alignment marks 303, one is an alignment mark 303A and the other is an alignment mark 303B. The notch 304 is a notch formed on the outer periphery of the workpiece.

  Next, the conveyor 200 will be described. In FIG. 1, the transporter 200 is supported by a gantry 201. The transfer machine 200 includes a work transfer robot 202, a work carrier 207, and an aligner 208 that are arranged on a gantry 201.

  The workpiece transfer robot 202 includes a robot housing 203, a common arm 204, and two workpiece transfer hands 205L and 206R. The common arm 204 is mounted on the robot housing 203 and can be rotated about the Z axis and moved in the Z axis direction by a rotation mechanism (not shown) and a Z axis direction linear movement mechanism. The workpiece transfer hand 205L and the workpiece transfer hand 206R are both mounted on the common arm 204, and can be independently rotated about the Z axis by a drive mechanism (not shown). The workpiece transport hand 205L and the workpiece transport hand 206R are provided with suction holes (not shown), and the suction holes communicate with an internal groove (not shown), and the workpiece is caused by negative pressure air generated by a vacuum generator (not shown). Can be fixed by vacuum adsorption.

  The workpiece carrier 207 can store up to 25 workpieces. The aligner 208 includes an alignment stage 209 and a work alignment mechanism 210. The workpiece alignment mechanism 210 includes a not-shown detector that detects the notch 304 and the workpiece outer edge 305 of the workpiece 300, and the alignment stage 209 includes an XY-axis direction linear movement mechanism (not shown) and a Z-axis center rotation mechanism. Have The position of the workpiece 300 relative to the alignment stage 209 can be detected by detecting the workpiece outer edge 305 with a detector while the alignment stage 209 translates and rotates the workpiece 300. At the same time, the phase of the workpiece 300 relative to the alignment stage 209 can be detected by detecting the notch 304 with a detector.

  The workpiece 300 stored in the workpiece carrier 207 is taken out of the workpiece carrier 207 by the workpiece conveyance hand 205L or the workpiece conveyance hand 206R, and then conveyed to the aligner 208. The workpiece 300 whose position / phase is detected by the aligner 208 is transferred to the workpiece chuck 115L or the workpiece chuck 116R by the workpiece transfer hand 205L or the workpiece transfer hand 206R. At this time, the workpiece 300 can be delivered without interfering with the workpiece conveyance hand 205L and the workpiece conveyance hand 206R, the workpiece chuck 115L and the workpiece chuck 116R through a workpiece lifter (not shown). In the present embodiment, a case where two workpieces 300L and 300R are machined simultaneously will be described, but it is also possible to machine a single workpiece.

  FIG. 5 is a block diagram illustrating a control device of the laser processing apparatus according to the embodiment. The control device 500 is configured by a computer and includes a CPU (Central Processing Unit) 551 as a control unit (processing unit). The control device 500 includes a ROM (Read Only Memory) 552, a RAM (Random Access Memory) 553, and an HDD (Hard Disk Drive) 554 as storage units. The control device 500 includes a recording disk drive 555 and a plurality of interfaces 561 to 563.

  A ROM 552, a RAM 553, an HDD 554, a recording disk drive 555, and various interfaces 561 to 563 are connected to the CPU 551 via a bus 550. The ROM 552 stores basic programs such as BIOS. The RAM 553 is a storage device that temporarily stores various data such as arithmetic processing results of the CPU 551.

  The HDD 554 is a storage device that stores arithmetic processing results of the CPU 551, various data acquired from the outside, and the like, and records a program 570 for causing the CPU 551 to execute various arithmetic processes described later. The CPU 551 executes each step of the inspection method based on the program 570 recorded (stored) in the HDD 554.

  The recording disk drive 555 can read various data, programs, and the like recorded on the recording disk 571.

  The processing machine 100 is connected to the interface 561. The transport device 200 is connected to the interface 562. An external storage device 580 that is a computer-readable recording medium can be connected to the interface 563. In the present embodiment, the case where the program 570 is stored in the HDD 554 will be described, but the present invention is not limited to this. The program 570 may be recorded on any recording medium as long as it is a computer-readable recording medium. For example, as a recording medium for supplying the program 570, a RAM 553, an external storage device 580, a recording disk (not shown), or the like may be used. As a specific example, a flexible disk, a hard disk, an optical disk, a magneto-optical disk, a CD-ROM, a CD-R, a magnetic tape, a nonvolatile memory (for example, a USB memory), or the like can be used as a recording medium.

  FIG. 6 is a functional block diagram of a control system of the laser processing apparatus according to the embodiment. The CPU 551 of the control device 500 functions as a processing coordinate calculation unit 501, a correction data calculation unit 502, a processing machine control unit 503, an image processing unit 504, and a transport machine control unit 505 by executing the program 570. As a result, the CPU 551 controls the XY stage 110, the galvano scanners 140L and 141R, and the like to control the plurality of workpieces 300 simultaneously.

  The processing coordinate calculation unit 501 receives the CAM file 506 in which the alignment mark coordinates and processing point coordinates are described, calculates laser processing coordinate data, and transfers the data to the processing machine control unit 503. The CAM file 506 may be acquired from an external device of the control device 500, or may be acquired from a storage unit such as the HDD 554. The processing coordinate calculation unit 501 uses the workpiece position data calculated by the correction data calculation unit 502, various correction data, and the data of the stage correction file 507 to calculate laser processing coordinate data.

  The correction data calculation unit 502 has a function of calculating necessary correction data by the processing coordinate calculation unit 501 based on the image processing result calculated by the image processing unit 504. The processing machine control unit 503 controls the entire sequence including laser processing performed by the laser processing apparatus, various measurements performed before laser processing, workpiece transfer, etc., and functions for controlling each device of the processing machine 100 and capturing data. Have

  The image processing unit 504 receives an imaging command from the processing machine control unit 503, and performs imaging of various cameras and output of image processing results of various marks. The transport machine control unit 505 controls each device of the transport machine 200 based on the timing instructed by the processing machine control unit 503.

  FIG. 7 is a flowchart showing a laser processing method which is a part of the method for manufacturing a component according to the embodiment. Prior to the laser processing method of FIG. 7, the workpiece 300 is manufactured and transferred to the transfer machine 200.

  First, the transfer machine control unit 505 controls the workpiece transfer robot 202 to transfer the workpieces 300 to the workpiece chuck 115L and the workpiece chuck 116R one by one (S1). Hereinafter, the workpiece 300 mounted on the workpiece chuck 115L is referred to as a workpiece 300L, and the workpiece 300 mounted on the workpiece chuck 116R is referred to as a workpiece 300R. At this time, the workpiece 300L and the workpiece 300R have the same part number (that is, the workpiece having the same shape), and the installation surface of the alignment mark, the coordinates of the machining position, and the like are all the same. Two alignment marks are arranged on the lower side of the laser processing apparatus of the workpiece 300 (that is, the surface held by the workpiece chuck).

  Next, the processing machine control unit 503 performs height measurement for measuring the distances from the frame 104 to the workpiece 300L and the workpiece 300R by using the displacement meter 160L and the displacement meter 161R mounted on the frame 104 (S2). The positions of the Z stages 130L and 131R for laser processing are determined by this height measurement, and the distance between the Z axis and the workpiece surface is set to a predetermined constant value corresponding to the thickness variation for each workpiece 300L and 300R. Adjust the focal length of the laser.

  Next, the image processing unit 504 performs notch measurement for roughly detecting the installation positions (and postures) of the workpieces 300L and 300R with respect to the workpiece chucks 115L and 116R (S3). Specifically, in the notch measurement, the image processing unit 504 causes the wide-area measurement cameras 158L and 159R configuring the imaging unit 167 to capture images in which the notches 304 of the workpieces 300L and 300R are captured, and thereby each workpiece 300L. , 300R is calculated.

  Next, the image processing unit 504 and the correction data calculation unit 502 perform alignment mark measurement for accurately detecting the installation positions (and postures) of the workpieces 300L and 300R with respect to the workpiece chucks 115L and 116R (S4). Specifically, in the alignment mark measurement, the image processing unit 504 measures the positions of the two alignment marks arranged on the workpieces 300L and 300R on the precision measurement cameras 122L and 123R constituting the imaging unit 167. . The correction data calculation unit 502 calculates the installation positions of the workpieces 300L and 300R with higher accuracy than the notch measurement based on the positions of the two alignment marks.

  As described above, the image processing unit 504 (and the correction data calculation unit 502) measures the positions and orientations of the workpieces 300L and 300R with respect to the workpiece chucks 115L and 116R in steps S3 and S4 (measurement processing and measurement process). In the present embodiment, the image processing unit 504 (and the correction data calculation unit 502) determines the positions and orientations of the workpieces 300L and 300R with respect to the workpiece chucks 115L and 116R from the captured images obtained by the imaging operation of the imaging unit 167. measure.

  Next, the processing coordinate calculation unit 501 performs processing point cut-out calculation (S5). The processing ranges (scanning ranges) of the galvano scanners 140L and 141R are smaller than the entire work surface. For this reason, in the present embodiment, a method is employed in which the entire surfaces of the workpieces 300L and 300R are laser processed by a combination of step movement of the XY stage 110 and minute area driving of the galvano scanners 140L and 141R. That is, the machining coordinate calculation unit 501 performs a process of cutting out the laser machining coordinates on the entire surface of the workpiece into the machining range of the galvano scanner at the stage position as the machining point cutout calculation. Details of the processing in step S5 will be described later.

  In parallel with step S5, the processing machine control unit 503 activates debris blow that prepares for collecting debris scattered during laser processing (S6). Then, machining position correction measurement (S7) and camera correction measurement are performed (S8).

  The processing position correction measurement is performed for the purpose of correcting the positions of the galvano scanners 140L and 141R with respect to the precision measurement cameras 138L and 139R, and processing position correction marks are processed on the workpieces 300L and 300R by the galvano scanners 140L and 141R. A mark processed by the precision measurement camera 138L is imaged, image processing is performed by the image processing unit 504, and a correction value is calculated by the correction data calculation unit 502. Similar processing is performed on the workpiece 300R.

  The camera correction measurement is performed for the purpose of correcting the positions of the upper precision measurement cameras 138L and 139R with respect to the lower precision measurement cameras 122L and 123R that capture the alignment mark. The lower precision measurement camera 122L and the upper precision measurement camera 138L image the calibration mark 125L that can be simultaneously imaged, the image processing unit 504 performs image processing, and the correction data calculation unit 502 calculates a correction value. Similar processing is performed on the workpiece 300R.

  When the processing of step S5 and steps S6 to S8 is completed, the stage XYθ correction is reflected on the result of the machining point cutout calculation calculated in step S5 (S9). The correction values of the upper and lower camera correction measurements and machining position correction measurements calculated in steps S7 and S8 are also reflected (S10).

  Then, the processing machine control unit 503 calculates laser processing data necessary for processing the workpieces 300L and 300R, and performs laser processing on all processing points of the workpiece 300L and the workpiece 300R based on the generated laser processing data. (S11: Processing, processing step). That is, the processing machine control unit 503 moves the work chucks 115L and 116R by the XY stage 110, thereby moving the processing ranges of the galvano scanners 140L and 141R relative to the work chucks 115L and 116R. The processing machine control unit 503 moves the XY stage 110 to sequentially move the processing range of each galvano scanner 140L, 141R to each of the plurality of partition ranges partitioned in S5, and to each galvano scanner 140L, 141R. The inside of the division range is processed sequentially.

  The workpieces 300L and 300R that have been processed in this manner are subjected to processing such as cutting in a later manufacturing process, and finally a part is produced. The laser processing in step S11 may be the final process of the manufacturing process, or the final part may be produced by the processing in step S11.

  Hereinafter, in order to describe the processes in steps S3, S4, and S5 in detail, a CAM file coordinate system that is a coordinate system based on the workpiece 300 and a work chuck coordinate that is a coordinate system based on each of the work chucks 115L and 116R. The system will be described.

FIG. 8 is an explanatory diagram of a CAM file coordinate system. The CAM file 508, a plurality of machining points alignment marks and laser machining the design coordinate values of (machining spot) P W _[i], which represent any position on the workpiece 300 to the origin O _W. In the example of FIG. 8, reference origin _{O W} on CAM file 508 is the center point of the workpiece 300.

In CAM file 508 defined CAM file coordinate system sigma _W, the coordinate values of the machining point _{P W [i] (XD [} i] _CAM, YD [i] _CAM) and. i is a machining point number. Further, the coordinate value of the alignment mark 303A defined in CAM file coordinate system sigma _W in the CAM file 508 (XA_CAM, YA_CAM). The coordinate value of the alignment mark 303B is (XB_CAM, YB_CAM).

FIG. 9 is an explanatory diagram of the work chuck coordinate system. Workpiece chuck workpiece chuck coordinate system coordinate system based on the 115L sigma _CL, a coordinate system based on the workpiece chuck 116R and workpiece chuck coordinate system sigma _CR. Origin _{O L} in the workpiece chuck coordinate system _{sigma CL} is set to the center point of the workpiece chuck 115L. Origin _{O R} of the workpiece chuck coordinate system _{sigma CR} is set to the center point of the workpiece chuck 116R.

In the work chuck coordinate system Σ _CL, the coordinate value of the machining point P _CL [i] is (XD [i] _L, YD [i] _L), the coordinate value of the alignment mark 303A is (XA_L, YA_L), and the coordinate of the alignment mark 303B. Let the values be (XB_L, YB_L). Similarly, the coordinate values of the machining point _P CR in the workpiece chuck coordinate system _{Σ CR [i] (XD [} i] _R, YD [i] _R), the coordinate values of the alignment mark 303A (XA_R, YA_R), the alignment mark The coordinate value of 303B is set to (XB_R, YB_R).

  The notch measurement performed in step S3 in FIG. 7 and the alignment mark measurement performed in step S4 will be described. FIG. 10A is an explanatory diagram of notch measurement, and FIG. 10B is an explanatory diagram of alignment mark measurement.

First, notch measurement will be described. The XY stage 110 is moved to the notch measurement position, the viewing angle is wide wide area measuring camera 158L disposed on the frame 104, thereby imaging an area _{R NL} including a notch 304 of the workpiece 300L. The image processing unit 504 calculates from the outer periphery of the direction and the work 300L notch 304 in the captured image, the translation and rotation of the center point _{C L} of the workpiece 300L in the workpiece chuck coordinate system _{Σ CL (X_NM_L, Y_NM_L, ω_NM_L} ) a . (X_NM_L, Y_NM_L) is the translation amount, and ω_NM_L is the rotation amount.

Similarly, a wide viewing angle wide area measuring camera 159R disposed on the frame 104, thereby imaging an area _{R NR} including a notch 304 of the workpiece 300R. The image processing unit 504 calculates from the outer periphery of the direction and the work 300R notch 304 in the captured image, the translation and rotation of the center point _{C R} of the workpiece 300R in the workpiece chuck coordinate system _{Σ CR (X_NM_R, Y_NM_R, ω_NM_R} ) a . (X_NM_R, Y_NM_R) is the translation amount, and ω_NM_R is the rotation amount.

Next, alignment mark measurement will be described. Translation and rotation of the workpiece center point _{C L} in the workpiece chuck coordinate system _{sigma CL} is, (X_NM_L, Y_NM_L, ω_NM_L) is the coordinate value of the alignment mark 303A in the CAM file coordinate system sigma _W is a (XA_CAM, YA_CAM) is there. Translation and rotation amount (X_NM_L, Y_NM_L, ω_NM_L) based on the coordinate value (XA_CAM, YA_CAM), calculates the coordinate value of the alignment mark 303A in the workpiece chuck coordinate system _{sigma CL} to (XA_L, YA_L) by the following equation.

Also it applies to work 300R, translation and rotation amount (X_NM_L, Y_NM_L, ω_NM_L) is calculated and the coordinate values (XB_CAM, YB_CAM) the coordinates of the alignment marks 303B in the workpiece chuck coordinate system _{sigma CL} based (XB_L, YB_L).

The position of the alignment mark 303A that calculated, and the center of the field angle of the precision measuring camera 122L is, moves the XY stage 110 to the stage coordinates to be designed coaxially regions _{R AL} including alignment marks 303A to precise measurement camera 122L Let's take an image.

  The image processing unit 504 calculates the shift amount (ΔXA_L, ΔYA_L) of the alignment mark 303A from the image center, and transfers it to the correction data calculation unit 502.

Correction data calculating unit 502, the coordinates of the alignment marks 303A by adding the following formula to calculate the alignment marks 303A coordinates in workpiece chuck coordinate system _{Σ CL (XA_L ', YA_L'} ).

In a similar manner, by imaging the region _{R BL} including alignment marks 303B Precision measuring camera 122L, calculates the coordinate value of the alignment mark 303B and (XB_L ', YB_L').

  A vector a (→) from the coordinate value of the alignment mark 303B to the coordinate value of the alignment mark 303A and a vector b (→) from the CAM coordinate value of the alignment mark 303B to the CAM coordinate value of the alignment mark 303A are calculated. Then, the rotation amount ωA_L ′ of the workpiece 300L is calculated from the angle formed by the two vectors by the following equation.

  The translation amount is combined with the rotation amount of the alignment mark 303A and expressed as the translation / rotation amount (XA_L ′, YA_L ′, ωA_L ′) of the alignment mark 303A in the work chuck coordinate system of the alignment mark 303A. The above is the alignment mark measurement method for the workpiece 300L.

For the workpiece 300R, the precision measurement camera 122L is caused to image the region R _AR including the alignment mark 303A and the region R _BR including the alignment mark 303B in the same manner. Then, the translation / rotation amount (XA_R ′, YA_R ′, ωA_R ′) of the alignment mark 303A is calculated.

  The correction data calculation unit 502 completes the measurement by transferring the measurement results of the positions and orientations of the workpieces 300L and 300R to the machining coordinate calculation unit 501.

  Thus, in steps S3 and S4, the positions and orientations of the workpieces 300L and 300R, that is, the translation / rotation amounts (XA_L ′, YA_L ′, ωA_L ′), (XA_R ′, YA_R ′, ωA_R ′) of the alignment mark 303A. Measure.

Next, the processing point cut-out calculation performed in step S5 will be described in detail. The machining point cut-out calculation is performed by the machining coordinate calculation unit 501. FIG. 11 is an explanatory diagram of processing point cut-out calculation. The CAM file 506 describes coordinate values (XD [i] _CAM, YD [i] _CAM) of a plurality of machining points (machining locations) P _W [i] of the workpiece 300.

The machining coordinate calculation unit 501 obtains a line segment connecting the machining point sequences for a plurality of machining points P _W [i] of the workpiece 300 described in the CAM file 506 (S100, S101: line segment calculation processing, line segment calculation). Process). In the present embodiment, the processing coordinate calculation unit 501 obtains a line segment per line from the start point and the end point. For example, the processing point sequence is an aggregate of points arranged in the vertical direction by 100 to 200 points, and these point sequences are replaced with one line segment (straight line). In this embodiment, since the line segment is a straight line, it is only necessary to extract the start point and the end point as the line segment.

FIG. 12A is an explanatory diagram showing a state in which the machining point sequence is converted into a line segment in the CAM file coordinate system. In FIG. 12A, the coordinate value of the start point P _WS [n] of the line segment L _W [n] is (XS [n] _CAM, YS [n] _CAM), and the end point P _{WE of the} line segment L _W [n]. The coordinate value of [n] is represented by (XE [n] _CAM, YE [n] _CAM). As shown in FIG. 12 (a), replacing the working point sequence represented in CAM file coordinate system sigma _W to the line segment _{L W [n] (S100)} .

FIG. 12B is an explanatory diagram showing a state in which the machining point sequence is converted into a line segment in the work chuck coordinate system. As illustrated in FIG. 12B, the processing coordinate calculation unit 501 performs the start point P _WS [n] and the end point based on the translation / rotation amount (XA_L ′, YA_L ′, ωA_L ′) of the alignment mark 303A in the workpiece 300L. The coordinate value of P _WE [n] is coordinate-transformed (S101). Thus, the processing coordinate calculation unit 501, the coordinate values of the starting point _P LS [n] of the line segment _{L L [n] (XS [} n] _L, YS [n] _L) , and the line segment _L L [n] The coordinate values (XE [n] _L, YE [n] _L) of the end point P _LE [n] are calculated.

Similarly, the processing coordinate calculation unit 501 coordinates the start point P _WS [n] and the end point P _WE [n] based on the translation / rotation amount (XA_R ′, YA_R ′, ωA_R ′) of the alignment mark 303A in the workpiece 300R. The value is coordinate-transformed (S101). Thus, the processing coordinate calculation unit 501, the coordinate values of the starting point _P RS [n] of the line segment _{L R [n] (XS [} n] _R, YS [n] _R) , and the line segment _L R [n] The coordinate values (XE [n] _R, YE [n] _R) of the end point P _RE [n] are calculated.

The machining coordinate calculating unit 501 as is, in step S100, obtains the line segment connects a machining point sequence for a plurality of machining points defined by CAM file coordinate system sigma _W. In step S101, the machining coordinate calculation unit 501 determines the coordinate values of the line segments (specifically, the start point and the end point) based on the positions and orientations of the workpieces 300L and 300R, and sets the coordinate values of the workpiece chuck coordinate systems Σ _CL and Σ _CR. Perform an operation to convert to.

  Although the case where the line segment is a straight line has been described, the present invention is not limited to this, and the line segment can be set to an arbitrary line such as a curve depending on the arrangement state of the machining point sequence. In this case, the line segment may be expressed by a functional expression.

Further, in this embodiment, to replace the machining point sequence to segments in the CAM file coordinate system sigma _W, then, for converting the line segment workpiece chuck coordinate system sigma _CL, the sigma _CR, but calculation load is low, the line The order of obtaining the minutes is not limited to this. For example, workpiece chuck coordinate system processing point from the CAM file coordinate system sigma _W sigma _CL, after conversion to sigma _CR, may be substituted machining point sequence to segments.

Then, the processing coordinate calculation unit 501, the workpiece chuck coordinate system _{sigma CL,} defining a region encompassing the entire working point of the workpiece 300L, a plurality of section range by the magnitude of the working range of the optical scanner 140L (S102: Partition processing, partition process). Similarly, the processing coordinate calculation unit 501, the workpiece chuck coordinate system sigma _CR, defining a region encompassing the entire working point of the workpiece 300R, a plurality of section range by the magnitude of the working range of the optical scanner 141R.

A specific example will be described. FIG. 13 illustrates the work chuck coordinate systems Σ _CL and Σ _CR so that the center point of the work chuck 115L and the center point of the work chuck 116R coincide with each other, and is an explanatory diagram illustrating a state of being partitioned into a plurality of partition ranges. .

  The squares are arranged so that the centers of the squares of one side cd corresponding to the cut-out unit (compartment unit) coincide with each other, and the square-shaped divided areas are arranged in a lattice shape so as to cover the entire surface of the workpiece. At this time, the cut-out unit is set to be smaller than the processable range of the galvano scanners 140L and 141R. This is because when the correction value is updated in the correction processing after the processing point cut-out (steps S9 and S10), the processing point in each area is shifted by a small amount, out of the processing range of the galvano scanner, and cannot be processed. Therefore, in this embodiment, when laser processing is performed by each of the galvano scanners 140L and 141R, processing is performed by scanning the laser beam within a processing range that is smaller than the processing range.

  In FIG. 13, the area number (serial number assigned to each section range) j is determined in the order of the first line: from left to right, the second line: from right to left, and the third line: from left to right. To do.

FIG. 12 (c), the workpiece chuck coordinate system sigma _CL, it is an explanatory view showing a state where divided into a plurality of compartments ranges. As shown in FIG. 12C, the processing coordinate calculation unit 501 divides a line segment in a square section range with a side of cd, and calculates the start point and end point of the divided line segment belonging to each section range by interpolation calculation. (S103, S104).

FIG. 12D is an explanatory diagram enlarging the partition range of FIG. In the example of FIG. 12D, the line segment expressed by the coordinate value of the start point and the coordinate value of the end point is divided into three line segments belonging to each partition range. In step S103, the processing coordinate calculation unit 501 determines the coordinate values (EN [j] .XS [m] _L, EN [j] .YS [m] of the start point P _LNS [m] of the dividing line segment belonging to the area number j. _L) is calculated. Further, the processing coordinate calculation unit 501 has the coordinate values (EN [j] .XE [m] _L, EN [j] .YE [m] _L) of the end point P _LNE [m] of the segment line belonging to the area number j. Is calculated.

  Then, the processing coordinate calculation unit 501 generates the segment length EN [j]. LN [m] _L is calculated (S104). j is an area number, and m is a line number of a work 300L for each area. Further, in step S104, the processing coordinate calculation unit 501 sorts the data of the divided line segments belonging to the section range, and calculates the total of the divided line segment lengths EN [j]. LN_L is calculated.

  In the example of FIG. 12D, there are four dividing line segments in the area number j. Therefore, the processing coordinate calculation unit 501 has the line segment length EN [j]. LN [1] _L to EN [j]. LN [4] _L is added, and the line segment length EN [j]. LN_L is obtained.

The machining coordinate calculation unit 501 also applies the coordinate value (EN [j] .XS [m] _R, EN of the start point P _RNS [m] of the dividing line segment belonging to the area number j in step S103, similarly to the workpiece 300R. [J] .YS [m] _R) is calculated. Further, the processing coordinate calculation unit 501 has the coordinate values (EN [j] .XE [m] _R, EN [j] .YE [m] _R) of the end point P _RNE [m] of the dividing line segment belonging to the area number j. Is calculated.

  In step S104, the processing coordinate calculation unit 501 determines the segment length EN [j]. LN [m] _R is calculated. Further, in step S104, the processing coordinate calculation unit 501 sorts the data of the divided line segments belonging to the section range, and calculates the total of the divided line segment lengths EN [j]. LN_R is calculated.

  As described above, in step S104, the processing coordinate calculation unit 501 determines the line segment lengths of the portions included in each of the segment ranges of the two segment ranges (shift amount 0) divided in step S102. Calculation is performed for each of the workpieces 300L and 300R.

  Next, in step S104, the processing coordinate calculation unit 501 calculates an evaluation value (total processing time in this embodiment) at the position of the shift amount 0 from the calculation result of the line segment length.

  By the way, at the position where the section range is partitioned in step S102, the processing time in each section range varies depending on the conveyance state of each workpiece 300L, 300R, that is, the position and orientation of each workpiece 300L, 300R, so the total processing time is minimized. I don't know if it is.

  FIG. 14 is a time chart showing an example when two workpieces are machined simultaneously. The total machining time is defined as the time from the start of laser machining to the completion of the laser machining of the two workpieces 300L and 300R. As shown in FIG. 14, the sum of the total machining time obtained by adding up the machining times of the workpieces 300L and 300R with the larger number of machining points and the total movement time obtained by adding up the movement times of the XY stage 110 in each section range. Processing time is determined.

  In order to shorten the total machining time, the number of machining points of the workpiece 300L and the workpiece 300R in each division range may be made close, and the division range where the number of machining points of the workpiece 300L and the workpiece 300R exists may be reduced. However, these are not independent conditions, and it is difficult to calculate the shortest condition in one numerical calculation.

In the present embodiment, the processing coordinate calculation unit 501 shifts the plurality of division ranges divided in S102, that is, the center point P _O of the division range in FIG. 12C, by shift amounts ΔX _sft and ΔY _sft in the XY axis direction. Shift. Then, the processing coordinate calculation unit 501 executes the processes of steps S103 and S104 at each shift position, and calculates an evaluation value for each shift position. In addition, although the case where the partition range with respect to the work chuck 115L is shifted has been described, the partition range with respect to the work chuck 116R is also shifted by the same shift amount.

  As described above, in step S103, the plurality of division ranges divided in S102 are shifted to a plurality of shift positions, and for each shift position, the line segment length of the portion included in each division range is set to the workpiece 300L, Calculate for each 300R. In step S104, an evaluation value is calculated for each of a plurality of shift positions from the calculation result in step S103.

  Here, the evaluation value of this embodiment will be described in detail. EN [j]. LN_L and EN [j]. Comparison with LN_R is made, and the larger one is set to EN [j]. LN and the estimated total machining time Ptn [l]. LDT 'is calculated.

  j is the area number, ENum is the total number of areas where the laser processing coordinates of the wafer L or R are present, TLine is the processing time per unit line segment, Tstg is the stage moving time per scan, and in the workpiece part number to be processed Calculate from actual data.

Next, a method for searching for the shortest estimated total machining time will be described below. In the present embodiment, as shown in FIG. 12 (c), is partitioned into a plurality of sections range like squares arranged in a grid pattern, to shift the center point P _O compartment range XY axis direction, the shift amount ( Estimated total machining time Ptn [l]. LDT ′ is calculated. Then, a minimum value is obtained from a plurality of total machining times for each of a plurality of shift positions. Here, the shift amount (shift position) for shifting the section range is stored (set) in advance in a storage unit (for example, HDD 554).

  In steps S103 and S104, the processing coordinate calculation unit 501 shifts the plurality of division ranges divided in step S102 to a plurality of shift positions, and calculates an evaluation value based on the position of the line segment for each shift position (evaluation). Value calculation process, evaluation value calculation step).

  The machining coordinate calculation unit 501 first calculates, as an evaluation value, the line segment length EN [j]. LN_L, EN [j]. The longest segment length EN [j]. LN is extracted for each of a plurality of partition ranges. Then, the machining coordinate calculation unit 501 uses these longest line segment lengths EN [j]. A total machining time that is the sum of the total machining time that is the sum of the machining times required to machine the LN and the total movement time that is the sum of the movement times of the XY stage 110 is calculated. That is, in this embodiment, the processing coordinate calculation unit 501 calculates the total processing time as the evaluation value.

  If the total movement time of the XY stage 110 does not change at each shift position, the processing coordinate calculation unit 501 does not calculate the total processing time as an evaluation value, but instead calculates the longest line segment length EN [j]. You may calculate the total processing time which totaled the processing time required to process LN.

  Further, when the line segment length and the machining time are in a proportional relationship, the machining coordinate calculation unit 501 calculates the longest line segment length EN [j]. You may calculate the total line segment length which totaled LN.

  Next, the processing coordinate calculation unit 501 determines shift positions (shift amounts) of a plurality of section ranges based on the evaluation values calculated in steps S103 and S104 (S105: determination process, determination step). In step S105, it is preferable that the processing coordinate calculation unit 501 determines a shift position (shift amount) that minimizes the evaluation value (that is, the total processing time). As described above, when the calculation for all the patterns of the preset shift position (shift amount) is completed, the shift position (shift amount: ΔX_sftb, ΔY_sftb) is determined under the condition that the evaluation value is minimum. Thereby, the difference in the number of machining points between the workpiece 300L and the workpiece 300R in each division range is small, the division range where the machining points of the workpiece 300L and the workpiece 300R are present is reduced, and the total machining time is the shortest.

  Next, the processing coordinate calculation unit 501 sets processing points to be processed within a plurality of division ranges at the shift position determined in step S105.

FIG. 15 is an explanatory diagram of coordinate conversion processing and setting processing in the machining point cut-out calculation. First, the processing coordinate calculation unit 501, the processing point coordinate value of _P W [i] of the workpiece 300 (XD [i] _CAM, YD [i] _CAM) a processing point in the workpiece chuck coordinate system _{Σ CL P CL [i} ] Coordinate values (XD [i] _L, YD [i] _L) (S200). This coordinate conversion process (coordinate conversion process) is performed based on the translation / rotation amounts (XA_L ′, YA_L ′, ωA_L ′) of the alignment mark 303A.

That is, the coordinate value (XD [i] _CAM, YD [i] _CAM) of the processing point P _W [i] is coordinate-converted by the translation / rotation amount (XA_L ′, YA_L ′, ωA_L ′) of the alignment mark 303A. The coordinate value (XD [i] _L, YD [i] _L) of the machining point is calculated by the equation.

Similarly, the processing coordinate calculation unit 501, the processing point coordinate value of _P W [i] of the workpiece 300 (XD [i] _CAM, YD [i] _CAM), the machining point _{P CR} in the workpiece chuck coordinate system _{sigma CR} [ i] coordinate values (XD [i] _R, YD [i] _R). This coordinate conversion process (coordinate conversion process) is performed based on the translation / rotation amounts (XA_R ′, YA_R ′, ωA_R ′) of the alignment mark 303A.

Further, the processing coordinate calculation unit 501 processes the processing point P _DL [processing in the section range of the workpiece 300L based on the coordinate value of the processing point P _CL [i] of the workpiece 300L converted by the coordinate conversion process (S200). k] is set (S201: setting process, setting step). Similarly, the processing coordinate calculation unit 501, based on the coordinate values of the machining point _P CR [i] Conversion Work 300R by the coordinate transformation processing (S200), the processing point is processed in each section range for work 300R _{P DR} [L] is set (S201: setting process, setting step).

The process of step S201 will be described more specifically. In step S201, the coordinate values (EN [j] _XCenter, EN [j] _YCenter) of the center point of each partition range in the work chuck coordinate systems Σ _CL and Σ _CR are obtained for the partition range determined in step S105. Each workpiece chuck coordinate system sigma _CL, a plurality of compartments ranges partitioned in sigma _CR is arranged in the same coordinate position in each workpiece chuck coordinate system sigma _CL, sigma _CR.

Then, the coordinate values of the machining point _P CL [i] present in each section range for work 300L (XD [i] _L, YD [i] _L) the coordinates of the center point of each section range as the origin _{O D} coordinate system _{Σ D (EN [j] _XL} [k], EN [j] _YL [k]) into a. As a result, the machining point P _DL [k] to be machined within each section range in the workpiece 300L is set.

Similarly, the coordinate system of the coordinate values of the machining point _P CR [i] in each section range for work 300R (XD [i] _R, YD [i] _R) and the origin _{O D} the center point of each section range coordinate values of _{Σ D (EN [j] _XR} [l], EN [j] _YR [l]) to convert. As a result, the machining point P _DR [l] to be machined within each section range in the workpiece 300R is set.

In the present embodiment, for the workpiece 300L and the workpiece 300R, the partition ranges are similarly set in the respective work chuck coordinate systems Σ _CL and Σ _CR. Therefore, the coordinate system of the partition range is the same coordinate for the workpiece 300L and the workpiece 300R. expressed in the system Σ _D. Here, k and l are machining point numbers in each area.

More conversion coordinate system obtained by the process Σ working point expressed in _D P _{DL [k],} by writing the coordinate values of P DR _[l] in the area structure (text file), within each section range Processing points P _DL [k] and P _DR [l] to be processed are set. In the present embodiment, all the processing points P _CL [i] and P _CR [i] in each division range are set to the processing points P _DL [k] and P _DR [l] to be processed in each division range. .

That is, in step S201, it is determined to which area (partition range) each processing point P _CL [i], P _CR [i] belongs, and sorting is performed for each area number j. In the present embodiment, the machining coordinate calculation unit 501 sets each section range at a predetermined position in the work chuck coordinate systems Σ _CL and Σ _CR as the setting process in step S201.

  FIG. 16A is an enlarged view of one (area number j) section range. FIG. 16A illustrates a processing point that falls within the section range of area number j.

The machining coordinate calculation unit 501 extracts the coordinate values (XD [k] _L, YD [k] _L) of the machining point P _CL [k] belonging to the area number j. The processing coordinate calculation unit 501 includes the coordinate values (XD [k] _L, YD [k] _L) of the processing point P _CL [k] and the coordinate values (EN [j]) of the center point of the partition range of the area number j. _XCenter, EN [j] _YCenter). This difference (XD [k] _L−EN [j] _XCenter, YD [k] _L−EN [j] _YCenter) is the coordinate value (EN [EN] of the processing point P _DL [k] within the section range (in the area). j] _XL [k], EN [j] _YL [k]).

In the same manner, the machining coordinate calculation unit 501 obtains the coordinate values (EN [j] _XR [l], EN [j] _YR [l]) of the machining point P _DL [k] in the area of the workpiece 300R. calculate. FIG. 16B shows the coordinate value of the center point of the section range (area), the coordinate value of the machining point P _DL [k] (in the area) for the workpiece 300L, and the machining point P _DR [l in the area for the workpiece 300R. ] Is a diagram showing a list of area structures indicating coordinate values. As illustrated in FIG. 16B, the processing coordinate calculation unit 501 stores a list of area structures (coordinate value data of processing points in each partition range), for example, as text data in a storage unit (for example, HDD 554).

Then, in step S11, the processing machine control unit 503 controls the movement of the XY stage 110 to sequentially set the processing ranges of the galvano scanners 140L and 141R to the section ranges set for the work chucks 115L and 116R. Move relative. Then, the processing machine control unit 503 causes the galvano scanners 140L and 141R to process the processing points P _DL [k] and P _DR [l] set in each section range with laser light. In the example of FIG. 13, the processing machine control unit 503 simultaneously processes the processing points within the partition range of the same area number for both the left and right workpieces 300L and 300R in the order of the area numbers 1, 2, 3,.

As described above, the processing points P _DL [k] and P _DR [l] that are divided into a plurality of division ranges in each workpiece chuck coordinate system Σ _CL and Σ _{CR and} are processed in each division range for each workpiece 300L and 300R are set. Then, laser processing is performed in the unit of the division range. Thereby, even if the workpieces 300L and 300R are misaligned with respect to the workpiece chucks 115L and 116R, the plurality of workpieces 300L and 300R can be processed simultaneously without depending on the misalignment amount of the workpieces 300L and 300R. Is possible.

  Further, according to the present embodiment, instead of the machining points, the segment range shift calculation is performed by replacing the line segment connecting the machining point sequences, so that the calculation load is reduced and the two workpieces 300L and 300R are simultaneously machined. It is possible to calculate the machining plan at high speed.

  Further, the total machining time that occurs depending on the conveyance accuracy of the two workpieces 300L and 300R is obtained as the evaluation value. Since the shift position at which the total machining time is minimized is obtained and the section range is determined at this shift position, the variation in the total machining time can be minimized. Also, since the total machining time is minimized, the productivity of the parts is improved.

  Here, as a reference example, the following calculation formula for calculating the total machining time using the machining point data is defined. According to the calculation formula of this reference example, the estimated total machining time Ptn [l]. LDT can be calculated.

  j is an area number, ENum is the total number of areas in which machining points of the workpieces 300L and 300R exist, Tdrill is a machining time per point, and Tstg is a moving time of the XY stage 110 per scan. For example, when there are hundreds of thousands of laser machining points per workpiece, it takes about 20 seconds to calculate the estimated total machining time for the position of the section range for two workpieces using the calculation formula of the reference example. Cost.

  On the other hand, in this embodiment, since the calculation is performed by replacing the machining point sequence of 100 to 200 points with a straight line, the time required to calculate the total machining time (evaluation value) can be greatly reduced. It becomes. For example, when there are several hundred thousand laser processing points per workpiece, in this embodiment, the total processing time can be shortened to 5 seconds or less.

  The present invention is not limited to the embodiment described above, and many modifications are possible within the technical idea of the present invention. In addition, the effects described in the embodiments of the present invention only list the most preferable effects resulting from the present invention, and the effects of the present invention are not limited to those described in the embodiments of the present invention.

[Other Embodiments]
The present invention supplies a program that realizes one or more functions of the above-described embodiments to a system or apparatus via a network or a storage medium, and one or more processors in a computer of the system or apparatus read and execute the program This process can be realized. It can also be realized by a circuit (for example, ASIC) that realizes one or more functions.

110 ... XY stage (movement mechanism), 115L, 116R ... work chuck (holding part), 140L, 141R ... galvano scanner (laser processing part), 167 ... imaging part, 300L, 300R ... work, 551 ... CPU (control part) , 1000: Laser processing apparatus, Σ _CL , Σ _CR : Work chuck coordinate system, Σ _W : CAM file coordinate system

Claims (14)

A plurality of holding portions for holding a plurality of workpieces;
A plurality of laser processing parts for irradiating each of the plurality of workpieces with laser light and processing the respective processing ranges;
A moving mechanism for relatively moving the plurality of holding units and the plurality of laser processing units;
A control unit that controls the plurality of laser processing units and the moving mechanism so as to process the plurality of workpieces simultaneously;
The controller is
A line segment calculation process for obtaining a line segment connecting the machining point sequences for the plurality of machining points to be formed on each workpiece;
A partitioning process for partitioning a region including the plurality of processing points formed in each workpiece into a plurality of partitioning ranges with the size of the processing range;
An evaluation value calculation process that shifts the plurality of partition ranges partitioned by the partition processing to a plurality of shift positions, and calculates an evaluation value based on the position of the line segment for each shift position;
A determination process for determining shift positions of the plurality of section ranges based on the evaluation value;
A setting process for setting a processing point to be processed in each of the section ranges shifted to the shift position determined in the determination process;
The processing mechanism moves the processing range of each laser processing unit relative to each holding unit by the moving mechanism, and causes each laser processing unit to process the section range with laser light. Laser processing equipment.   In the evaluation value calculation process, the control unit calculates, for each shift position, a line segment length included in each section range from the line segment position, and calculates the evaluation value from the calculation result. The laser processing apparatus according to claim 1 to be obtained.   In the evaluation value calculation process, the control unit uses the plurality of line segment lengths determined as the evaluation value with respect to the range of the corresponding position between the plurality of workpieces as the plurality of line lengths. 3. The laser processing apparatus according to claim 2, wherein a total line segment length is calculated by extracting the entire line segment lengths and summing up the longest line segment lengths.   In the evaluation value calculation process, the control unit uses the plurality of line segment lengths determined as the evaluation value with respect to the range of the corresponding position between the plurality of workpieces as the plurality of line lengths. The laser processing apparatus according to claim 2, wherein a total processing time is calculated by adding the processing times required to process the longest line segment length.   In the evaluation value calculation process, the control unit uses the plurality of line segment lengths determined as the evaluation value with respect to the range of the corresponding position between the plurality of workpieces as the plurality of line lengths. The total machining time that is the sum of the total machining time that is extracted for each of the section ranges and totals the machining time required to machine these longest line segments and the total movement time that is the sum of the movement times of the moving mechanism. The laser processing apparatus of Claim 2 which calculates.   The laser processing apparatus according to claim 3, wherein the control unit determines a shift position at which the evaluation value is minimum in the determination process. The controller is
The laser processing apparatus according to claim 1, wherein the line segment calculation process, the partition process, and the evaluation value calculation process are performed in a coordinate system that uses each of the holding units as a reference. The controller is
In the line segment calculation process, a line segment is obtained by connecting a machining point sequence for a plurality of machining points of the workpiece defined in a coordinate system based on the workpiece, and the position and orientation of each workpiece with respect to each holding unit The laser processing apparatus according to claim 7, wherein a calculation for converting the coordinate value of the line segment into a coordinate system based on each holding unit is performed. The controller is
9. The laser processing apparatus according to claim 1, further comprising a measurement process for measuring the position and orientation of the workpiece with respect to the holding unit for each of the plurality of workpieces. 10. An imaging unit that images the plurality of workpieces;
The laser processing apparatus according to claim 9, wherein in the measurement process, the control unit measures the position and orientation of each workpiece from an image captured by the imaging unit. The controller is
A coordinate conversion process for converting the coordinate values of a plurality of machining points of the workpiece defined in a coordinate system based on the workpiece into a coordinate system based on each holding unit based on the position and orientation of each workpiece. , And
11. The process according to claim 1, wherein in the setting process, a machining point to be machined within each of the division ranges is set based on the coordinate value of the machining point of each workpiece that has undergone coordinate transformation in the coordinate transformation process. The laser processing apparatus as described. When manufacturing a plurality of parts, a moving mechanism that relatively moves a plurality of holding units that respectively hold a plurality of workpieces and a plurality of laser processing units that process each of the plurality of workpieces by irradiating laser light. By controlling the processing range of each laser processing unit by sequentially moving with respect to each workpiece, a method of manufacturing a part that simultaneously processes the plurality of workpieces by the plurality of laser processing unit,
A line segment calculation step for obtaining a line segment connecting the machining point sequences for the plurality of machining points to be formed on each workpiece;
A partitioning step for partitioning a region including the plurality of processing points formed in each workpiece into a plurality of partition ranges with the size of the processing range;
An evaluation value calculating step of shifting the plurality of partition ranges partitioned in the partitioning step to a plurality of shift positions, and calculating an evaluation value based on the position of the line segment for each shift position;
A determination step of determining a shift position of the plurality of section ranges based on the evaluation value;
A setting step for setting a processing point to be processed in each of the section ranges shifted to the shift position determined in the determination step;
A processing step of moving the processing range of each laser processing unit relative to each holding unit by the moving mechanism and processing each laser processing unit within the section range by laser light. Method of manufacturing parts.   The program for making a computer perform each process of the laser processing apparatus of any one of Claims 1 thru | or 11.   A computer-readable recording medium on which the program according to claim 13 is recorded.

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