JP2017097362A - Patterning apparatus, method for controlling positioning device, and method for manufacturing article - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a patterning apparatus capable of improving a positioning accuracy more than before in a positioning device which switches a position measurement means.SOLUTION: The present invention is related to a patterning apparatus for forming a pattern to a first region and a second region of a substrate on a movable body. In a positioning device for positioning a movable body, a control means controls a driving means capable of driving the movable body in a first direction on the basis of a control deviation corresponding to position-commanding information in a first direction of the movable body and position information, and a control parameter having a predetermined value, and changes a value of the control parameter by a timing different from that for switching position information used for controlling a driving means after forming a pattern to the first region and before beginning to form a pattern to the second region when switching position information used for controlling the movable body to position information obtained by measurement of a second measurement means from position information obtained by measurement of a first measurement means.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a patterning device having a positioning device for positioning a moving body. The present invention also relates to a method for controlling a positioning device in such a patterning device or a method for manufacturing an article.

  2. Description of the Related Art Conventionally, in a lithography apparatus for manufacturing a semiconductor device, a liquid crystal device, etc., a positioning apparatus that positions a stage on which a substrate or an original plate is mounted has been used.

  Patent Document 1 describes that an interferometer is used as position measurement means for measuring the position of the stage in the Z-axis direction (direction along the optical axis of the projection optical system). The measurement light traveling in the Z-axis direction from the interferometer is reflected by a mirror disposed on the upper surface of the stage, and the interferometer measures the position from the interference fringes generated by the interference between the reflected light and the reference light.

  Patent Document 1 describes that a plurality of interferometers and a plurality of mirrors are switched and used in accordance with the XY direction position of the stage. Thus, by switching between a plurality of interferometers and a plurality of mirrors, even if the measurement light from one interferometer is shielded by the projection optical system, the position of the stage is measured using the measurement light from the other interferometer. Can be measured.

  The Z-axis direction position of the stage detected by the interferometer is used for stage position feedback control, but Patent Document 1 does not mention the details of the Z-axis direction position feedback control.

JP 2002-319541 A

  In recent years, it has been required for the lithography apparatus to further improve the resolution and overlay accuracy, and the positioning apparatus is required to have higher positioning performance.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a positioning apparatus that can improve positioning accuracy as compared with the conventional positioning apparatus that uses position measuring means by switching.

  A patterning device according to the present invention includes a positioning device that positions a moving body while measuring a position of the moving body in a first direction, and forms a pattern on a first region of a substrate disposed on the moving body. After the pattern is formed on the first region, the positioning device moves the moving body in the second direction intersecting the first direction, and then forms the pattern on the second region of the substrate. A patterning device, wherein the positioning device includes a first measuring unit and a second measuring unit capable of measuring a position of the moving body in a first direction, and a driving unit capable of driving the moving body in the first direction. Control means for controlling the driving means based on position information indicating the position of the movable body in the first direction measured by the first measuring means or the second measuring means. The control means controls the driving means based on a control deviation according to position command information in the first direction of the moving body and the position information, and a control parameter set to a predetermined value, When the position information used for controlling the driving means is switched from the position information obtained by the measurement of the first measuring means to the position information obtained by the measurement of the second measuring means, the pattern information for the first region is changed. The value of the control parameter is changed at a timing different from the switching of the position information used for controlling the driving unit after the formation is completed and before the formation of the pattern for the second region is started. .

  ADVANTAGE OF THE INVENTION According to this invention, in the patterning apparatus which has the positioning apparatus which switches and uses a position measurement means, the patterning apparatus which can raise the positioning accuracy of a positioning apparatus compared with the past can be provided.

It is the schematic which shows the structure of a semiconductor exposure apparatus. It is a perspective view which shows the structure of the periphery of a wafer stage. It is a figure which shows the control part of a semiconductor exposure apparatus. It is a figure which shows the control block of position control. It is a figure which shows the control deviation which arises by switching of a control parameter. It is a figure which shows the several shot area | region on a wafer. It is a figure which shows the timing of a change of a control parameter. It is a figure explaining the flow of the positioning method.

Example 1
FIG. 1 is a view showing a semiconductor exposure apparatus 100. FIG. 2 is a perspective view showing the periphery of the wafer stage 10 in FIG. In this embodiment, a step-and-scan type exposure apparatus (patterning apparatus) will be described.

  The semiconductor exposure apparatus 100 carries in a reticle (original) on which a pattern to be transferred is formed and a wafer (substrate) coated with a photosensitive agent. The illumination system 32 illuminates a reticle (not shown) mounted on the reticle stage 33 with slit light, and the projection system 34 places a pattern image of the reticle on a wafer (not shown) mounted on the wafer stage 10 (positioning device). Project. By moving the reticle stage 33 and the wafer stage 10 in synchronization with the scanning direction (Y-axis direction), the reticle pattern is transferred onto the wafer coated with the photosensitive agent. In this embodiment, patterning means for forming a pattern (including a latent image on the photosensitive agent) on the wafer by the illumination system 32 and the projection system 34 is configured.

  The wafer stage 10 includes an X stage 31 that can move with a long stroke in the X-axis direction with respect to the surface plate 41 and a Y stage 40 that can move with a long stroke in the Y direction with respect to the X stage. Further, it moves in a short stroke with respect to the Y stage 40 in the X-axis direction, Y-axis direction, Z-axis direction (projection optical axis direction), ωx direction, ωy direction, and ωz direction (hereinafter referred to as 6-axis direction). A possible top stage (moving body) 27 is provided.

  Here, the ωx direction indicates the rotation direction around the X axis, the ωy direction indicates the rotation direction around the Y axis, and the ωz direction indicates the rotation direction around the Z axis. A wafer chuck (holding means) 26 that holds the wafer is mounted on a top stage 27.

  The X stage 31 is driven by an X linear motor 42, and the X linear motor 42 includes a plurality of coils (stator) disposed on the surface plate 41, and a permanent magnet (movable element) provided on the X stage 31. Have The Y stage 40 is driven by a Y linear motor 35. The Y linear motor 35 includes a plurality of coils (stator) disposed on the X stage 31, and a permanent magnet (movable element) provided on the Y stage 40. Have. A bearing is formed between the X stage 31 and the Y stage 40, and the X stage 31 and the Y stage 40 move together in the X direction by driving the X linear motor 42. The Y stage 40 and the X stage 31 are supported on the surface plate 41 via a gas bearing.

  The top stage 27 is driven in six axial directions by a plurality of linear motors. In this embodiment, two X linear motors for the X axis direction, one Y linear motor for the Y axis direction, and three Z linear motors 44 (drive means) for the Z axis direction are provided (FIG. 1). Only the Z linear motor 44 is illustrated). Each linear motor has a coil (stator) disposed on the Y stage 40 and a permanent magnet (movable element) provided on the top stage 27. Further, the top stage 27 is supported in a state of floating on the Y stage 40 by a self-weight support mechanism (not shown).

  The projection system 34 includes a plurality of optical elements and a lens barrel that houses the plurality of optical elements, and is supported by a lens barrel support 35. The lens barrel support 35 is supported on the base member 38 via the air mount 36, and the surface plate 41 is supported on the base member 38 via the air mount 37. The air mounts 36 and 37 are, for example, known active vibration isolation devices. Such an active vibration isolator reduces vibrations transmitted from the floor via the base member 38, and vibrations generated by the movement of an object on the lens barrel support 35 and the surface plate 41 by the built-in actuator and sensor. Suppress.

  Further, the wafer stage 10 includes an interferometer (position measuring means) that measures the position of the top stage 27. The X interferometers 24a and 24b irradiate the mirror 29 on the top stage 27 with measurement light traveling in the X-axis direction, and the position of the top stage 27 in the X-axis direction from interference fringes caused by interference between the reflected light and the reference light. Is measured (detected). The Y interferometers 23a, 23b, and 23c irradiate the measurement light traveling in the Y-axis direction onto the mirror 28 on the top stage 27, and the Y-axis of the top stage 27 from the interference fringes generated by the interference between the reflected light and the reference light. Measure (detect) the direction position. Further, the ωy direction position of the top stage 27 is measured using the difference between the measurement values of the X interferometers 24a and 24b, and the ωx direction position of the top stage 27 is measured using the difference between the measurement values of the Y interferometers 23a and 23b. Measure. Further, the position of the top stage 27 in the ωz direction is measured using the difference between the measured values of the Y interferometers 23b and 23c.

  The Z interferometers 25a and 25b irradiate measurement light traveling in the Z-axis direction onto the mirrors 30a and 30b on the top stage 27, and the Z-axis of the top stage 27 from interference fringes generated by interference between the reflected light and the reference light. Measure (detect) the direction position. The measurement light from the Z interferometer 25a is irradiated onto the mirror 30a via the mirrors 21a and 22a fixed to the lens barrel support 35, and the measurement light reflected by the mirror 30a passes through the mirrors 21a and 22a. 25a. Similarly, the measurement light from the Z interferometer 25b is irradiated to the mirror 30b via the mirrors 21b and 22b fixed to the lens barrel support 35, and the measurement light reflected by the mirror 30b passes through the mirrors 21b and 22b. Is guided to the interferometer 25b. Further, the reference light from the interferometer 25a is applied to the mirror 22a via the mirror 21a, and the reference light reflected by the mirror 22a is guided to the interferometer 25a via the mirror 21a. Similarly, the reference light from the interferometer 25b is irradiated to the mirror 22b via the mirror 21b, and the reference light reflected by the mirror 22b is guided to the interferometer 25b via the mirror 21b.

  The mirrors 30a and 30b have a long shape along the Y-axis direction, the mirrors 21a, 21b, 22a and 22b have a long shape along the X-axis direction, and the Z interferometers 25a and 25b are disposed on the X stage 31. ing. With such a configuration, the mirror 30a or the mirror 30b can be irradiated with measurement light regardless of the position of the top stage 27 in the XY direction. A projection system 34 is disposed between the mirrors 22a and 22b. When the projection system 34 is positioned above one of the mirrors 30a and 30b, the position can be measured using the other mirror. Instead of providing the Z interferometers 25a and 25b on the X stage 31, mirrors and prisms are provided, and the measurement light and reference light from the Z interferometers 25a and 25b arranged outside are mirrored by these optical members to the mirrors 21a and 25b. You may guide to 22a.

  A position sensor (not shown) is provided between the top stage 27 and the Y stage 40. In this embodiment, a linear encoder is used as the position sensor. The positions of the top stage 27 with respect to the Y stage 40 in the Z-axis direction, the ωx direction, and the ωy direction can be measured by the linear encoders provided at three locations. This linear encoder is used in calibration for measuring and correcting the surface shapes of the mirrors 30a and 30b, and a capacitance sensor or the like can be used instead.

  The semiconductor exposure apparatus 100 includes a control unit 50 including a CPU, a memory, and the like. FIG. 3 is a diagram illustrating details of the control unit 50. In the following description, control of the position of the top stage 27 in the Z-axis direction will be described.

The control unit 50 includes a main control unit 51 and a stage control unit 52. The main control unit 51 controls the entire sequence of the semiconductor exposure apparatus and transmits position command information to the stage control unit 52. Instead of transmitting the position command information, information necessary for generating the position command information may be transmitted, and the stage control unit 52 may generate the position command information. The semiconductor exposure apparatus is provided with a focus detection unit for detecting the Z-axis direction position of the surface of the substrate, the position command information Z _r from the focus detecting unit may acquire the place of the main control unit 51.

  The stage control unit 52 (control unit) includes a PID control unit 53, a control parameter change unit (change unit) 54, and a switching unit (switching unit) 55. The stage control unit 52 acquires position command information from the main control unit 51, acquires position information (position measurement information) of the top stage 27 from the interferometers 25a and 25b, and acquires the acquired position command information and position information. First, the position of the top stage 27 is feedback controlled.

  FIG. 4 is a control block diagram showing the position control of the top stage 27. The position information Zm from the interferometer 25 a or 25 b is fed back to the position command information Zr, and the control deviation ez is input to the PID control unit 53. The PID control unit 53 generates a control input uz for driving the linear motor 44 based on the control parameter that can be set to a predetermined value and the control deviation ez. Control targets include a driver 43, a linear motor 44, and a top stage 27, and a control input is input to the driver 43. In the present embodiment, the control parameter indicates the sensitivity of the control input uz with respect to the control deviation ez, and is, for example, any one of the proportional gain Kp, the integral gain Ki, the differential gain Kd, or a combination of at least two. Note that the same feedback control is performed for position control in directions other than the Z-axis direction except that there is no interferometer switching.

Switching unit 55, an interferometer for use in the generation of the control input _{u z,} the interferometer 25b from the interferometer 25a, or switching to the interferometer 25a from the interferometer 25b.

  For example, when the projection system 34 is located above the mirror 30a, measurement light from the interferometer 25a may be blocked by the projection system 34, and measurement may not be possible. Therefore, the switching unit 55 switches the interferometer used for generating the control command based on the position information of the top stage 27 in the X-axis direction (or XY direction). The position information of the top stage 27 in the X-axis direction may be acquired from the interferometers 24 a and 24 b or may be position command information acquired from the main control unit 51. Further, the information used for switching may be information for specifying a shot area, and may be information having a correlation with the position of the top stage 27 in the X-axis direction.

  The interferometer is switched when the top stage 27 is located at a position where the interferometers 25a and 25b can simultaneously measure the other interferometer used after switching the measured value of the one interferometer used before the switching. It is done by handing over to.

  The control parameter changing unit 54 changes the control parameter set in the PID control unit 53. In the present embodiment, two values are stored in advance in a memory (storage means), and the two values are switched to be set values of the PID control unit 53 (first set value and second set value). Change the control parameters. The change of the control parameter is performed according to the switching of the interferometer. In this specification, “according to switching” is used not only in the case where the control parameter is changed after the interferometer is switched, but also in the case where the control parameter is changed before the switching. . By changing the control parameter, high control performance can be obtained even when the control characteristics of the feedback control system change due to the switching of the interferometer. That is, the positioning device can obtain high positioning accuracy. Also, in the configuration in which the mirror used together with the switching of the interferometer is switched as in the present embodiment, since the control characteristics change greatly with the switching, the effect of improving the positioning accuracy according to the present invention is great.

Next, the timing for changing the control parameters will be described. FIG. 5 is a diagram showing the control deviation when the control parameter is changed. The horizontal axis represents time, and the vertical axis represents position command information in the X-axis direction (upper figure) and control deviation in the Z-axis direction (lower figure). The control parameter is changed at the timing indicated by the dotted line in the figure. As can be seen, immediately after changing a control parameter, the control deviation becomes large, convergence over time T ₁ by the feedback control to within a predetermined range.

  In this embodiment, the timing for changing the control parameter is determined so as to reduce the influence of the increase in the control deviation on the positioning accuracy during exposure (while the substrate is irradiated with exposure light). .

FIG. 6 is a diagram showing a plurality of shot areas (processed areas exposed by one scan) on the wafer. FIG. 7 is a diagram illustrating the timing of changing the control parameter according to the present embodiment. The horizontal axis is time, and the vertical axis is the position of the top stage in the X-axis direction. As shown by the arrows in FIG. 6, to scan the slit light in the Y-axis direction (negative direction) with respect to the shot area S _A, followed by the Y-axis direction with respect to the shot area S _B (positive direction) to the slit light A case of scanning will be described. Between the exposure of the shot area S _A and a shot area S _B, step movement in the X-axis direction is performed. The scanning of the slit light and the step movement are performed by driving the wafer stage 10.

  When the interferometer is switched at the XA position during the step movement, if the control parameters are changed at the same time, the control deviation is sufficiently large at the start of exposure of the shot area SB (pattern formation on the second shot area). It may not be small. Therefore, in this embodiment, the control parameter is changed at a timing t3 that is earlier than the exposure start time tS by a time T1 or more (before a timing t2 that is T1 earlier than the exposure start time ts). That is, the control parameter changing unit 54 acquires (correlated) information related to the timing of the exposure start (pattern formation start) of the shot area SB, and changes the control parameter based on this information.

  Further, in this embodiment, since it is necessary to reduce the influence on the positioning accuracy when performing exposure of the shot area SA (pattern formation on the first shot area), it is later than the exposure end time te of the shot area SA. Change the parameters. That is, the control parameter changing unit 54 acquires (correlated) information related to the timing of the exposure end of the shot area SA, and changes the control parameter based on this information.

  As an example, the control parameter may be changed along with the start of the step movement at a timing earlier than the interferometer switching occurring at the XA position during the step movement. Since the time required for the step movement is longer than the time required until the control deviation becomes sufficiently small, it is possible to reduce the influence on the positioning accuracy when exposing both the shot area SA and the shot area SB. . In this case, the information related to the exposure start timing described above is a start signal for step movement toward the shot area SB. Note that time information, shot area information, information on the position of the moving body, and the like may be used as the timing information.

  In the above-described embodiment, an interferometer is used as a suitable example of the position measuring means, but the present invention is not limited to this, and other position measuring means may be used. Moreover, although the linear motor was used as a suitable example as a drive means, it is not limited to this, You may use another drive means. Further, the control means, the switching means, and the changing means may be constituted by a single circuit board having a CPU (processor), a memory, and a ROM, or may be constituted by a plurality of circuit boards.

  Further, in this embodiment, the PID control proportional gain Kp, integral gain Ki, and differential gain Kd are cited as preferred examples of the control parameters, but the control parameters to be changed are the notch filter frequency and the low-pass filter cutoff frequency. It is good. Moreover, although the example which switches the interferometer for Z-axis directions was given, it is applicable also when switching the interferometer for Y-axis directions or X-axis directions.

  In the above-described embodiment, the positioning apparatus used in the step-and-scan type semiconductor exposure apparatus is described as a preferred example, but the present invention is not limited to this. The present invention can be applied to lithography apparatuses such as step-and-repeat type semiconductor exposure apparatuses, imprint apparatuses, and maskless charged particle beam drawing apparatuses. In this case, the patterning means has a different configuration depending on each apparatus. In addition to the lithography apparatus, the present invention can also be applied to an apparatus (for example, a microscope or a processing apparatus) that requires high positioning accuracy.

  FIG. 8 is a diagram for explaining the flow of the positioning method described above (excerpted from the part related to the control parameter change). In the positioning method of this embodiment, the position of the top table 27 in the Z-axis direction is measured, and feedback control is performed based on the measured position information to position the top table 27. The positioning method includes a step (S10) of switching the position measuring means used for feedback control from the interferometer 25a to the interferometer 25b, and a step of changing the set value of the control parameter used for feedback control according to the switching (S20). ,including. A program stored in the memory of the control unit 50 described above may cause the computer to execute these processes.

[Product Manufacturing Method]
Next, a method for manufacturing an article using a lithography apparatus will be described. In this specification, the term “article” means a semiconductor device, a liquid crystal display device, a reticle (mask) used when manufacturing these devices, a microstructure, or the like that can be formed by lithographic patterning. .

  A semiconductor device will be described as an example. A semiconductor device is manufactured through a pre-process for producing an integrated circuit on a wafer and a post-process for completing an integrated circuit chip on the wafer produced in the pre-process as a product. The pre-process includes a step of exposing the wafer coated with the photosensitive agent using the semiconductor exposure apparatus described above, and a step of developing and etching the wafer. Note that a doping step may be performed instead of the etching step, and there are several processing forms after development. The post-process includes an assembly process (dicing and bonding) and a packaging process (encapsulation). A liquid crystal display device is manufactured through a process of forming a transparent electrode. The step of forming the transparent electrode includes a step of applying a photosensitive agent to a glass substrate on which a transparent conductive film is deposited, a step of exposing the glass substrate on which the photosensitive agent is applied using the above-described exposure apparatus, and a glass substrate. The process of developing is included. According to the device manufacturing method of the present embodiment, it is possible to manufacture a higher quality device than before.

Claims (20)

A positioning device configured to position the moving body while measuring a position of the moving body in the first direction; forming a pattern on the first area of the substrate disposed on the moving body; A patterning device for forming a pattern on a second region of the substrate after the positioning device moves the moving body in a second direction intersecting the first direction after the pattern is formed,
The positioning device includes:
First measuring means and second measuring means capable of measuring the position of the moving body in the first direction;
Driving means capable of driving the movable body in the first direction;
Control means for controlling the drive means based on position information indicating the position of the movable body in the first direction measured by the first measurement means or the second measurement means,
The control means controls the driving means based on a control deviation according to position command information in the first direction of the moving body and the position information, and a control parameter set to a predetermined value,
When the position information used for controlling the driving means is switched from the position information obtained by the measurement of the first measuring means to the position information obtained by the measurement of the second measuring means, the pattern information for the first region is changed. The value of the control parameter is changed at a timing different from the switching of the position information used for controlling the driving unit after the formation is completed and before the formation of the pattern for the second region is started. Patterning device.   After the formation of the pattern for the first region and before the start of the formation of the pattern for the second region, the position information used for controlling the driving unit is obtained by measurement of the first measuring unit. The patterning apparatus according to claim 1, wherein the pattern information is switched from position information to position information obtained by measurement by the second measurement unit.   The value of the control parameter after the change is determined when the moving body is positioned while the pattern is formed in the second region, compared to the case where the moving body is moved using the value of the control parameter before the change. The patterning apparatus according to claim 1, wherein the patterning apparatus is a value that reduces the deviation.   4. The control parameter according to claim 1, wherein the control parameter is at least one of a proportional gain Kp, an integral gain Ki, a differential gain Kd, a notch filter frequency, and a low-pass filter cutoff frequency. The patterning device according to item.   The patterning apparatus according to claim 1, wherein the control unit includes a PID control unit for controlling the driving unit.   The first direction is a height direction, and the first measurement unit and the second measurement unit are provided at different positions in the second direction. The patterning apparatus according to claim 1.   The control means, based on information on the position of the moving body in the second direction, from position information obtained by measurement of the first measurement means, to position information obtained by measurement of the second measurement means, The patterning apparatus according to claim 1, wherein position information used for controlling the driving unit is switched.   The moving body is stepwise moved in the second direction from a first position for forming a pattern for the first region to a second position for forming a pattern for the second region. The patterning apparatus according to claim 1.   The patterning apparatus according to claim 1, wherein each of the first measurement unit and the second measurement unit is an interferometer. Each of the first measuring means and the second measuring means is an interferometer,
The first measuring means obtains the position information by measuring the position of the first mirror provided in the moving body in the first direction,
The second measuring means obtains the position information by measuring the position of the second mirror provided in the moving body in the first direction,
2. The second mirror is disposed on a side opposite to the first mirror as viewed from a portion on which the substrate is disposed and spaced apart from the first mirror in the second direction. 9. The patterning device according to any one of items 1 to 8.   2. The patterning apparatus is selected from a step-and-scan exposure apparatus, a step-and-repeat exposure apparatus, an imprint apparatus, and a charged particle beam drawing apparatus. 11. The patterning device according to any one of 1 to 10. In a method for manufacturing an article,
Forming a pattern on a substrate using the patterning device according to claim 1;
Processing the substrate on which a pattern is formed, and
A method for producing an article, comprising producing the article using the treated substrate. While measuring the position of the moving body in the first direction, a pattern is formed on the first region of the substrate disposed on the moving body, and after forming the pattern on the first region, the moving body is moved to the first area. A positioning device for use in a patterning apparatus that forms a pattern on a second region of the substrate after moving in a second direction that intersects the direction, and is capable of measuring the position of the movable body in the first direction First measuring means and second measuring means, driving means capable of driving the moving body in the first direction, and the moving body measured in the first direction by the first measuring means or the second measuring means. In a control method for a positioning apparatus, the control means for controlling the drive means based on position information indicating a position,
Including a step of controlling the driving unit based on a control deviation according to the position command information in the first direction of the movable body and the position information, and a control parameter set to a predetermined value,
When switching the position information used for controlling the driving means from the position information obtained by the measurement of the first measuring means to the position information obtained by the measurement of the second measuring means, pattern formation for the first region is performed. The predetermined value of the control parameter is changed at a timing different from the switching of the position information used for the control of the driving means after finishing and before the start of pattern formation for the second region. Control method to do.   After the formation of the pattern for the first region and before the start of the formation of the pattern for the second region, the position information used for controlling the driving unit is obtained by measurement of the first measuring unit. The control method according to claim 13, wherein the position information is switched to position information obtained by measurement by the second measurement unit.   The value of the control parameter after the change is determined when the moving body is positioned while the pattern is formed in the second region, compared to the case where the moving body is moved using the value of the control parameter before the change. 15. The patterning device according to claim 13, wherein the patterning device is a value that reduces the deviation.   16. The control parameter according to claim 13, wherein the control parameter is at least one of a proportional gain Kp, an integral gain Ki, a differential gain Kd, a notch filter frequency, and a low-pass filter cutoff frequency. The control method according to item.   The control method according to claim 13, wherein the control unit performs PID control on the driving unit. The first direction is a height direction, and the first measuring means and the second measuring means are provided at different positions in the second direction,
Position information used for controlling the driving means from position information obtained from the first measuring means to position information obtained from the second measuring means based on information on the position of the moving body in the second direction The control method according to claim 13, wherein switching is performed. Each of the first measuring means and the second measuring means is an interferometer,
The first measuring means obtains the position information by measuring the position of the first mirror provided in the moving body in the first direction,
The second measuring means obtains the position information by measuring the position of the second mirror provided in the moving body in the first direction,
The said 2nd mirror is arrange | positioned away from the said 1st mirror and the said 2nd direction side away from the said 1st mirror seeing from the part by which the said board | substrate is arrange | positioned, It is characterized by the above-mentioned. The control method according to any one of 1 to 18. A positioning device for positioning the moving body, performing a process on a first area of the substrate disposed on the moving body, and the positioning apparatus moving the moving body after the processing on the first area; A processing apparatus for performing processing on the second region of the substrate,
The positioning device includes:
First measuring means and second measuring means capable of measuring the position of the moving body in the first direction;
Driving means capable of driving the movable body in the first direction;
Control means for controlling the drive means based on position information indicating the position of the movable body in the first direction measured by the first measurement means or the second measurement means, and the control means Controls the drive means based on a control deviation according to the position command information in the first direction of the moving body and the position information, and a control parameter set to a predetermined value,
After finishing the process for the first area and before starting the process for the second area,
The position information used for the control of the driving means is switched from the position information obtained by the measurement of the first measuring means to the position information obtained by the measurement of the second measuring means, and is used for the control of the driving means. Changing the predetermined value of the control parameter at a timing earlier than the switching of the position information.

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