JP2017082564A - Fixing method of inorganic plate and jig therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a fixing method of an inorganic plate capable of fixing the same to a building frame while preventing falling-off thereof, and a jig therefor.SOLUTION: After inserting a blind rivet into a non-through hole in an inorganic plate, a wire is connected thereto and the inorganic plate is fixed to the building frame. A mandrel of the blind rivet has a shape of cross section increasing toward the front end, and with this, the fixing strength of the blind rivet is increased. The inorganic plate is fixed to the building frame using an adhesive agent, and further fix means using a snap ring is employed. With this, for example, even when the fixing strength using the adhesive agent or the like gets insufficient due to deterioration over time etc., since there is fixing means using the blind rivet, the inorganic plate can be prevented from falling off and/or loss due to the falling off. That is, there is provided a dual fixing method of the inorganic plate to the building frame.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for fixing an inorganic plate, in particular, a thin and large ceramic plate to a housing such as a wall, and a jig therefor, and more specifically, in addition to a fixing means for adhering the inorganic plate with an adhesive or the like. The present invention relates to a method for preventing the drop-off and the like and a jig therefor.

  Inorganic plates such as tiles are widely used as interior or exterior materials. The construction of these inorganic plates on the casing is performed by attaching them with an adhesive or mortar. Furthermore, recently, large ceramic plates that can reduce joints, simplify construction and diversify designs have been put into practical use and are widely used for such large ceramic plates. Tensioning with is common.

  When such an inorganic plate, especially a large ceramic plate, is applied to a wall surface or the like, even if peeling or cracking occurs due to aging, it is necessary to suppress the drop and the damage caused by the drop. Many large ceramic plates are thin and light in weight, but in particular, when a large ceramic plate is used as an exterior material, a construction system capable of suppressing dropout and damage due to dropout is important.

  As such a construction system, in addition to sticking with an adhesive or the like, a hole is made in an inorganic plate and fixed with a tapping screw or the like. However, when it has a decorative surface as an interior / exterior material, the hole and screw head may damage the design of the decorative surface.

  As a construction method that does not impair the design of the decorative surface, for example, a non-through hole is provided on one surface of an inorganic plate, and the entire cylindrical coil-shaped portion is inserted into this hole so that the elasticity of the coil-shaped portion is expanded. A method of fixing to the hole by a friction force based on a force has been proposed (Japanese Patent Laid-Open No. 8-68183, Patent Document 1). In this method, since the coil is inserted into the hole, a hole with a certain depth is required. Moreover, although the proposal which fixes a building board using the locking piece of a specific structure to a non-through hole is also made (Unexamined-Japanese-Patent No. 11-159102, patent document 2), this locking piece is a non-through-hole inner wall. Since it is a structure which contacts at a point, it is considered that the locking force has a limit.

  Further, it has been proposed to form a concave portion on the back surface of the tile, insert a blind rivet into the concave portion, deform and fix the sleeve, and use the blind rivet for fixing the tile (Japanese Patent Laid-Open No. 2015-10380). Patent Document 3). However, the proposal in this document leaves room for optimization in using blind rivets for fixing inorganic plates. Therefore, it can be said that there is still a need for a construction method that does not impair the design of the decorative surface, particularly a thin and large-sized inorganic plate fixing method.

JP-A-8-68183 JP 11-159102 A Japanese Patent Laying-Open No. 2015-10380

  An object of this invention is to provide the fixing method which can fix an inorganic board to a housing | casing, and can prevent the dropping-off, and a jig | tool for it.

And the method of fixing the inorganic board by this invention to a housing is as follows.
(A) preparing an inorganic plate having non-through holes on one surface;
(B) a sleeve having a through-hole, a mandrel provided with a breakable portion that passes through the through-hole of the sleeve, and a mandrel head connected to the mandrel protruding from the end of the sleeve. A step of preparing a blind rivet, wherein the mandrel head has a cross-sectional shape that widens toward the tip from the connecting portion with the mandrel, and the maximum diameter is smaller than the diameter of the non-through hole. When,
(C) The mandrel head is inserted into the non-through hole, and the sleeve is deformed by pulling the mandrel while holding the sleeve, and the deformed sleeve fills a gap between the mandrel head and the non-through hole. And fixing the blind rivet to the non-through hole, further pulling the mandrel, and cutting the mandrel at the breakable portion;
(D) fixing the blind rivet to the housing;
(E) A method comprising a step of adhering a surface having a non-through hole and a housing with an adhesive, and fixing the inorganic plate to the housing.

  Further, the jig used in the method for fixing the mechanical plate according to the present invention to the housing is a blind rivet provided with a sleeve having a through hole and a breakable portion penetrating the through hole of the sleeve. A mandrel and a mandrel head connected to the mandrel protruding from the end of the sleeve, the mandrel head having a cross-sectional shape that extends from the connecting part with the mandrel toward the tip, and The maximum diameter is smaller than the diameter of the non-through hole.

It is a figure explaining the fixing method to the housing of the inorganic board by this invention. Fig.2 (a) is an enlarged view of the non-through-hole 2 provided in the inorganic board 1 of FIG. FIG. 2B is an enlarged cross-sectional view of the non-through hole 2, and FIG. 2C is a cross-sectional view of the non-through hole having a dovetail / reverse C shape in cross section. FIG. 4 shows an example of a blind rivet used in the method according to the invention. FIG. 3A is a side view, and FIG. 3B is a side view with a partially cutaway cross section. It is explanatory sectional drawing of the process of fixing a blind rivet to the non-through-hole of an inorganic board. FIG. 4A is a view showing a state in which the mandrel head 35 of the blind rivet 3 is inserted into the non-through hole 2, and FIG. 4B is a view of pressing the flange 36 and pulling the mandrel 33 upward. It is a figure of the state which deform | transformed and the deformed sleeve 31 fills up the clearance gap between the mandrel head 35 and the non-through-hole 2, (c) pulls the mandrel 33, and the flange 36 contacts the surface of the inorganic board 1 Or (d) is a diagram showing a state of the fixed blind rivet 3 after the mandrel 33 is cut. It is the figure of the blind rivet to which the connection material was connected by winding the wire 41 around the space | gap 37. FIG. The wire rod 41 is wound around the sleeve 31 before the sleeve 31 is deformed, and then the sleeve 31 is deformed so that the wire rod 41 is sandwiched between the sleeves 31 to be deformed, thereby connecting the connecting material. It is explanatory drawing of the state which fixed the inorganic board 1 by which the blind rivet 3 to which the wire 41 was connected shown by FIG. It is explanatory drawing of the state which stuck the some inorganic board 1 on the surface 52 of the housing 51. FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in each drawing, the same code | symbol is attached | subjected to the same component and detailed description is abbreviate | omitted suitably.

  FIG. 1 is a diagram illustrating a method for fixing an inorganic plate to a housing according to the present invention. In FIG. 1, a non-through hole 2 is provided in an inorganic plate 1, and a blind rivet 3 is fixed to the non-through hole. Normally, blind rivets are used to stop a plurality of plates with a single through-hole. However, in the present invention, a mandrel head of a blind rivet is inserted into a non-through-hole and the mandrel is held down. The sleeve is deformed by pulling, and the deformed sleeve fills the gap between the mandrel head and the non-through hole, thereby fixing the blind rivet to the non-through hole. Used for fixing. That is, the wire rod 4 as a fixing member is coupled to the fixed blind rivet 3, and the wire rod 4 is fixed to a housing such as a wall at the opposite end. In the embodiment shown in this figure, the wire 4 is a ring, and a fixing tool 5 such as a screw or an anchor bolt is driven into the ring (not shown), and the inorganic plate 1 is fixed. Apart from this fixing, the surface of the inorganic plate 1 provided with the non-through holes 2 is fixed to the housing by an adhesive. The fixing method according to the present invention may be applied as a method for fixing the inorganic plate to the housing alone, but the inorganic plate 1 fixed by such two means is fixed by an adhesive or the like due to deterioration over time or the like. Even if this is not sufficient, since there is another fixing means using blind rivets, it is possible to prevent the dropout and damage caused by the dropout. That is, according to the present invention, a double fixing method of the inorganic plate to the housing is provided.

The fixing method according to the present invention will be described below step by step.
(A) Step of preparing an inorganic plate The inorganic plate fixed by the method according to the present invention is made of, for example, ceramic, stone, or glass. According to one aspect of the present invention, in the present invention, the inorganic plate is preferably used as a flat plate as a finishing material for exterior or interior walls, floors, ceilings, cabinet face materials, and counter finishing materials. Although the size is not limited, the fixing method according to the present invention is preferably applied to a relatively large inorganic plate since it can be a double fixing method to the housing of the inorganic plate as described above. . According to one aspect of the present invention, the inorganic plate has a short side exceeding 300 mm and has an area exceeding 900 cm ² . The length of the short side of the inorganic plate is preferably 600 mm or more, more preferably 900 mm or more.

  Furthermore, according to the preferable aspect of this invention, the fixing method by this invention is applicable to a comparatively thin inorganic board. As described above, non-through holes are provided on the surface opposite to the decorative surface so as not to impair the design of the decorative surface. However, in the thin inorganic plate, the non-through holes must be shallow. In order to reduce the weight of a large ceramic plate, for example, the thickness is 3 mm to 15 mm, preferably 10 mm. In view of the influence on the strength and the like of the inorganic plate, it is desirable that the depth of the non-through hole is approximately half or less than the thinness. The fixing method according to the present invention can be applied even to a relatively shallow non-through hole in such a thin inorganic plate. Specifically, for example, the present invention can be applied to a case where the depth of the non-through hole is 6 mm or less. Further, the diameter of the non-through hole is preferably 6 mm or more and 80 mm or less, more preferably 8 mm or more and 60 mm or less, and further preferably 10 mm or more and 50 mm or less.

  Fig.2 (a) is an enlarged view of the non-through-hole 2 provided in the inorganic board 1 of FIG. Further, FIG. 2B is an enlarged cross-sectional view of the non-through hole 2. In the embodiment shown in the figure, the non-through hole 2 is substantially circular and has an inner wall surface 21 that is substantially perpendicular to the surface of the inorganic plate. According to one aspect of the present invention, the inner wall surface 21 of the non-through-hole 2 is not limited to a substantially vertical shape. For example, the cross section thereof has a shape of an ant hole / reverse C as shown in FIG. In this case, the inner wall surface 21 is not perpendicular to the surface of the inorganic plate. In the present invention, as will be described later, the blind rivet is fixed to the non-through hole by deforming the sleeve and filling the gap between the mandrel head and the non-through hole. In other words, the size of the non-through hole needs to be larger than the maximum diameter of the mandrel head of the blind rivet.

  The bottom surface 22 of the non-through hole 2 shown in FIGS. 2 (a) and 2 (b) may be a flat surface, but is not particularly limited as long as it does not significantly inhibit the fixing of the fed blind rivet.

  The inorganic board according to the present invention may have a glaze layer on its surface. The ingredient of the glaze is not particularly limited. The glaze layer may be formed by either glazing after molding and firing integrally with the molded body, or by firing after glazing the calcined body (calcined body). Furthermore, you may provide a drying process before and after glazing.

(B) Process for Preparing Blind Rivet FIG. 3 is a diagram showing an example of a blind rivet used in the method according to the present invention. FIG. 3A is a side view, and FIG. 3B is a side view with a partially cutaway cross section. In FIG. 3, the blind rivet 3 includes a sleeve 31 having a through-hole 32, a mandrel (shaft) 33 having a breakable portion 34 having a reduced diameter passing through the through-hole 32 of the sleeve 31, and an end of the sleeve 31. A mandrel head 35 connected to a mandrel 33 protruding from the section is provided as a basic configuration. In the blind rivet of FIG. 3, a flange 36 corresponding to the through hole 32 and through which the mandrel 33 passes is integrally or strongly fixed to the sleeve 31 on the side opposite to the mandrel head. It becomes. In the present invention, the mandrel head 35 has a cross-sectional shape that widens toward the tip from the connecting portion with the mandrel 33, and the maximum diameter is larger than the diameter of the non-through hole 2 provided in the inorganic plate 1. Is also considered to be small. Further, the height of the mandrel head 35 (that is, the distance from the connecting portion of the mandrel to the portion in contact with the bottom surface 22 of the non-through hole 2) is not limited as long as it is fixed to the non-through hole. According to one aspect, the height of the mandrel head 35 is the same as or lower than the depth of the non-through hole 2.

  According to another aspect of the present invention, it is also possible to previously provide a connecting material for connecting to a case described later on the blind rivet. For example, a portion to which the connecting material is connected may be provided at any location of the blind rivet, and the connecting material may be connected to the portion in advance.

(C) Step of fixing blind rivet to non-through hole The non-through hole of the inorganic plate of the blind rivet is divided into four procedures as follows. First, as shown in FIG. 4A, first, the mandrel head 35 of the blind rivet 3 is inserted into the non-through hole 2. FIG. 4 is a cross-sectional view.

  Next, when the mandrel 33 is pulled upward while pressing the flange 36 while simultaneously pressing the sleeve 31, the sleeve 31 is deformed accordingly, and the deformed sleeve 31 is formed between the mandrel head 35 and the non-through hole 2. Fill the gap. FIG. 4B shows this state.

  Further, the mandrel 33 is pulled so that the flange 36 is in contact with the surface of the inorganic plate 1 or a gap is formed just before the flange 36 as shown in FIG. As shown in FIG. 4C, the deformed sleeve 31 is pressed between the non-through hole 2 of the inorganic plate 1 and the mandrel head 35. As a result, the mandrel head 35 is not It will be fixed to the through hole 2.

  In the present invention, the mandrel head 35 has a cross-sectional shape that widens toward the tip from the connecting portion with the mandrel 33. That is, the mandrel head 35 has a trapezoidal shape spreading toward the end. The sleeve 31 is deformed and smoothly spreads in contact with the trapezoidal slope of the mandrel 35 and fills the gap between the mandrel head 35 and the non-through hole 2. That is, due to the cross-sectional shape of the mandrel head 35 that spreads toward the end, the sleeve 31 spreads evenly and can be expected to improve its fixing strength, and the blind rivet 3 is unlikely to come off the inorganic plate 1. In particular, with a mandrel head having a divergent cross-sectional shape, the gap between the non-through hole and the mandrel head can be reduced and stress is applied to the blind rivet as compared with a general mandrel head having a cylindrical shape. It is considered that it is possible to effectively prevent the material derived from the sleeve, which is deformed and filled, from deforming and forming a gap and the blind rivet from falling off the inorganic plate. Further, according to one aspect of the present invention, the sleeve 31 may be provided with slits so that the sleeve 31 spreads evenly. Furthermore, when the non-through hole 2 has a dovetail / reverse-shaped shape as shown in FIG. 2C, it can be fitted with the shape of the mandrel head 35 and a higher fixing strength can be expected.

  When the mandrel 33 is further pulled, the mandrel 33 is cut at the breakable portion 34 provided in advance. FIG. 4D is a diagram illustrating a state of the fixed blind rivet 3 after the mandrel 33 is cut. In the embodiment of FIG. 4, there is a gap 37 between the flange 36 and the inorganic plate 1, and the connecting material can be connected to the blind rivet using this gap 37 as will be described later.

  Although the cutting position of the mandrel 33 is not particularly limited, according to a preferred embodiment of the present invention, the cutting position of the mandrel 33 is outside the non-through hole, that is, above the surface of the inorganic plate. In the embodiment in which the flange 36 is provided as in the embodiment shown in FIG. 4, the flange 36 protrudes in the flange hole or out of the flange hole as shown in FIG. Also good. The presence of a mandrel at least in the non-through hole and also in the hole of the flange improves the strength of the flange as a connection point for connecting the connection material described later, and is not easily deformed against stress from the connection material It can be. Further, as shown in FIG. 4 (e), the mandrel itself, the upper end of which protrudes from the hole of the flange, can be used as a connection location for connecting the connection material. Therefore, according to another aspect of the present invention. The flange 36 may be closely attached to the surface of the inorganic plate 1 without providing the gap 37 as shown in the figure, and even a blind rivet without the flange 36 can be used.

  A series of operations for fixing the blind rivet to the non-through hole can be performed by a commercially available blind rivet fastening tool.

(D) Fixing the blind rivet to the chassis, and (e) Fixing the inorganic substrate to the chassis. The blind rivet is connected to the chassis according to one aspect of the present invention. This is done by connecting materials and using this connection material. According to one aspect of the present invention, the connecting material is connected to the blind rivet fixed to the inorganic plate after the blind rivet is fixed to the inorganic plate and then the gap 37 between the flange 36 and the inorganic plate 1 described above. It is done using. As shown in FIG. 5, the connecting material may be connected to the blind rivet by winding a wire 41 as a connecting material around the gap 37. Further, according to another aspect of the present invention, as described above, the mandrel itself whose upper end protrudes from the hole of the flange can also be used as a connection location for connecting the connection material. For example, the wire material is wound and connected. To do.

  Further, according to another aspect of the present invention, the above-described blind rivet to which a connecting material is connected in advance is prepared, and if the connecting material is used for fixing to the housing, the connecting material is connected. Can be omitted.

  Furthermore, according to another aspect of the present invention, the connection member may be connected before the blind rivet is fixed to the non-through hole, for example, a part where the connection member is connected to any part of the blind rivet. The blind rivet may be fixed after the connecting member is connected to the part. Further, without providing such a connection part of the connection material, for example, the wire material 41 is wound around the sleeve 31 before the sleeve 31 is deformed, and then the sleeve 31 is deformed to deform the wire material 41 as the connection material. It is also possible to connect the connecting material at the same time that the blind rivet 3 is fixed to the non-through hole 2 by being sandwiched by the sleeve 31 to be fixed. FIG. 6 is a cross-sectional view of a mode in which the wire 41 is wound around the sleeve 31 and then the sleeve 31 is deformed to fix the blind rivet 3 to the non-through hole 2. In the drawing, reference numeral 42 denotes a wire rod sandwiched between the non-through hole 2 and the mandrel head 35 in accordance with the deformation of the sleeve 31.

  As a result, the shape of the connecting material is not limited as long as it has a strength capable of locking the inorganic plate even when the first fixing means such as adhesion is lost as the double fixing means. For example, a wire material, a tape-shaped steel material, etc. are mentioned preferably.

  Next, the end of the connecting member connected to the blind rivet opposite to the end connected to the blind rivet is fixed to the housing. FIG. 7 is an explanatory diagram of a state in which the inorganic plate 1 shown in FIG. 5 or 6 and to which the blind rivet to which the wire 41 is connected is fixed is fixed to the casing 51. In the figure, the wire 41 is fixed to a fixing point 61 driven into the housing 51 at the end opposite to the end connected to the blind rivet. Then, the inorganic board 1 is stuck by the surface 52 of the housing 51, and an adhesive agent. As described above, the inorganic plate 1 is fixed by two means, that is, the fixing method according to the present invention and the attachment with the adhesive. Even if the inorganic plate 1 is not sufficiently fixed by an adhesive or the like due to deterioration over time, there is another fixing means using the blind rivet according to the present invention. Can be prevented.

  FIG. 8 is an explanatory diagram of a state in which a plurality of inorganic plates 1 are attached to the surface 52 of the casing 51. In the figure, the inorganic plate 1 is fixed by fixing a wire 41 connected to a blind rivet fixed to the non-through hole 2 to a fixing point 61. A plurality of non-through holes 2 are preferably provided and fixed to one inorganic plate 1. In FIG. 8, three non-through holes are provided and fixed per inorganic plate. Furthermore, the relationship between the wire and the fixed point is not only that the wire is suspended from the fixed point, but, for example, as shown in FIG. The inorganic plate 1 may be lifted and fixed by pulling in the direction of the arrow in the figure. In FIG. 8, the inorganic plate 1 is fixed in two steps, and the fixing point 61 for the lower inorganic plate is configured to be hidden by the upper inorganic plate. In FIG. 8, the fixing point 61 is provided above the upper end of the inorganic plate fixed thereby, but is provided below the upper end, that is, at a position hidden by the inorganic plate fixed thereby. May be.

  As long as the fixing point 61 provided on the casing 51 has a strength capable of locking the inorganic plate even when the first fixing means such as adhesion is lost as a doubled fixing means. Although it does not specifically limit, For example, a screw, a tapping screw, an anchor bolt, etc. are mentioned.

  The adhesive is not limited as long as it can adhere the inorganic plate to the casing, but a synthetic polymer adhesive is preferable. As the synthetic polymer adhesive, epoxy, silicon, urethane, acrylic and the like are preferably used. As these adhesives, any of a liquid adhesive at normal temperature, a hot melt adhesive, and a tape-shaped adhesive can be suitably used.

  In the present invention, the attachment of the back surface of the large-sized inorganic plate and the casing with the adhesive includes a mode in which a base material is interposed between the inorganic plate and the casing surface. In this case, for example, when the housing is a pillar such as a steel frame, a plate-like base material is fixed to the housing by a known method, and an inorganic plate is attached to the surface of the base material with an adhesive. For example, when the method of the present invention is applied when reforming an existing wall, the existing wall surface may be used as a base material, and an inorganic plate may be attached thereon using an adhesive. In any case, the screws and anchor bolts used for fixing are preferably fixed to the housing.

Blind rivet according to the present invention and inorganic plate fixed to the casing As is apparent from the above description, according to another aspect of the present invention, there is provided a blind rivet used in the above-described method for fixing an inorganic plate according to the present invention. Is done. This blind rivet comprises a sleeve having a through-hole, a mandrel provided with a breakable portion that passes through the through-hole of the sleeve, and a mandrel head connected to the mandrel protruding from the end of the sleeve. A rivet, in which the mandrel head has a cross-sectional shape that widens toward the tip from the connecting portion with the mandrel, and the maximum diameter is larger than the diameter of the non-through hole provided in the inorganic plate to which the mandrel is fixed Is also characterized by being small.

  Further, according to the present invention, there is provided an inorganic plate structure fixed by the above-described inorganic plate fixing method according to the present invention, and this structure has a non-through hole on one surface, and the non-through hole The blind rivet is fixed, and the mandrel head of the blind rivet has a cross-sectional shape that widens toward the tip from the connecting portion with the mandrel, and the maximum diameter is the diameter of the non-through hole. The blind rivet is fixed to the casing, and the surface having the through hole and the casing are fixed with an adhesive.

1 .... Inorganic plate 2 .... Non-through hole 3 .... Blind rivet 4 .... Wire material 5 .... Fixing tool 21 .... Inner wall surface 22 .... Bottom surface 31 ... Sleeve 32 ... Sleeve Through hole, 33 ... Mandrel, 34 ... Breakable part, 35 ... Mandrel head, 36 ... Flange, 37 ... Gap between flange and inorganic plate, 41, 43 ... Wire, 42 ... Wire fixing member , 51 .. Housing, 52 .. Housing surface, 61 .. Fixed point

Claims (17)

A method of fixing an inorganic board to a housing,
(A) preparing an inorganic plate having non-through holes on one surface;
(B) a sleeve having a through-hole, a mandrel provided with a breakable portion that passes through the through-hole of the sleeve, and a mandrel head connected to the mandrel protruding from the end of the sleeve. A step of preparing a blind rivet, wherein the mandrel head has a cross-sectional shape that widens toward the tip from the connecting portion with the mandrel, and the maximum diameter is smaller than the diameter of the non-through hole. When,
(C) The mandrel head is inserted into the non-through hole, and the sleeve is deformed by pulling the mandrel while holding the sleeve, and the deformed sleeve fills a gap between the mandrel head and the non-through hole. And fixing the blind rivet to the non-through hole, further pulling the mandrel, and cutting the mandrel at the breakable portion;
(D) fixing the blind rivet to the housing;
(E) A method comprising the steps of adhering a surface having a non-through hole and a housing with an adhesive and fixing the inorganic plate to the housing.   The said blind rivet has a flange at one end of the sleeve and has a hole corresponding to the through hole, and the sleeve is deformed by pulling the mandrel while holding the flange. The method described.   The method according to claim 1, wherein a height of the mandrel head is equal to or lower than a depth of the non-through hole.   The fixing of the blind rivet to the housing is performed by connecting a connecting material to the blind rivet and fixing the end of the connecting material opposite to the end connected to the blind rivet to the housing. The method as described in any one of Claims 1-3.   The method according to claim 1, wherein the connecting material is connected to the blind rivet after fixing the blind rivet to the non-through hole.   The method according to any one of claims 1 to 4, wherein the connecting material is connected to the blind rivet before the blind rivet is fixed to the non-through hole.   The method according to claim 1, wherein the connecting material is connected to the flange.   The method according to claim 1, wherein when the sleeve is deformed, the connecting material is sandwiched between the sleeve or the flange to be deformed.   In the step (b), a blind rivet to which a connecting material is connected in advance is prepared, and the blind rivet is fixed to the housing at an end opposite to the end connected to the blind rivet. The method according to claim 1, wherein the method is performed by fixing the end to the housing.   The method according to any one of claims 1 to 9, wherein the non-through hole has a shape of an ant hole (reverse c).   The method as described in any one of Claims 1-10 whose said connection material is a wire.   The method according to any one of claims 1 to 11, wherein the inorganic plate is made of ceramic, stone, or glass.   The method according to claim 1, wherein the inorganic plate has a side of 900 mm or more and a thickness of 10 mm.   The method according to any one of claims 1 to 13, wherein a depth of the non-through hole is not more than half of a thickness of the inorganic plate.   The method according to claim 14, wherein the depth of the non-through hole is 6 mm or less. A blind rivet used in a method for fixing an inorganic plate according to any one of claims 1 to 15 to a housing,
A sleeve having a through-hole; a mandrel provided with a breakable portion that passes through the through-hole of the sleeve; and a mandrel head connected to the mandrel protruding from an end of the sleeve, the mandrel A blind rivet characterized in that the head has a cross-sectional shape that widens toward the tip from the connecting portion with the mandrel, and the maximum diameter is smaller than the diameter of the non-through hole. An inorganic plate structure fixed to the housing,
Has a non-through hole on one side,
A blind rivet is fixed to the non-through hole, and the mandrel head of the blind rivet has a cross-sectional shape that widens toward the tip from the connecting portion with the mandrel, and the maximum diameter is the aforementioned diameter. It is smaller than the diameter of the non-through hole,
The blind rivet is fixed to a casing, and the surface having the non-through hole and the casing are fixed with an adhesive.

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